WO2013135082A1 - 一种多层印制电路板及其制造方法 - Google Patents

一种多层印制电路板及其制造方法 Download PDF

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Publication number
WO2013135082A1
WO2013135082A1 PCT/CN2012/086516 CN2012086516W WO2013135082A1 WO 2013135082 A1 WO2013135082 A1 WO 2013135082A1 CN 2012086516 W CN2012086516 W CN 2012086516W WO 2013135082 A1 WO2013135082 A1 WO 2013135082A1
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WO
WIPO (PCT)
Prior art keywords
layer
metal
core
hole
printed circuit
Prior art date
Application number
PCT/CN2012/086516
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English (en)
French (fr)
Inventor
黄明利
丰涛
李松林
Original Assignee
华为技术有限公司
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Publication date
Application filed by 华为技术有限公司 filed Critical 华为技术有限公司
Priority to EP12871458.1A priority Critical patent/EP2790476B1/en
Publication of WO2013135082A1 publication Critical patent/WO2013135082A1/zh
Priority to US14/457,433 priority patent/US9510449B2/en

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/144—Stacked arrangements of planar printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4046—Through-connections; Vertical interconnect access [VIA] connections using auxiliary conductive elements, e.g. metallic spheres, eyelets, pieces of wire
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4623—Manufacturing multilayer circuits by laminating two or more circuit boards the circuit boards having internal via connections between two or more circuit layers before lamination, e.g. double-sided circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/025—Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance
    • H05K1/0251—Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance related to vias or transitions between vias and transmission lines
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10242—Metallic cylinders
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4614—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination
    • H05K3/4617—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination characterized by laminating only or mainly similar single-sided circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4647—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits by applying an insulating layer around previously made via studs

Definitions

  • Multilayer printed circuit board and manufacturing method thereof are Multilayer printed circuit board and manufacturing method thereof
  • the present invention relates to the field of electronics, and in particular, to a multilayer printed circuit board and a method of fabricating the same.
  • a conventional printed circuit board manufacturing process is generally used for manufacturing a printed circuit board (PCB), in particular, a conventional polytetrafluoroethylene (polytetrafluoroethylene ptfe) is used.
  • PCB printed circuit board
  • a conventional polytetrafluoroethylene polytetrafluoroethylene ptfe
  • the conductor roughness of the transmission path in the antenna circuit is one of the main factors affecting the Passive Inter-Modulation (PIM) of the antenna. Therefore, the inner and outer transmission lines are made of low-roughness copper foil to enhance PIM.
  • the inner PTFE multilayer board inner layer transmission line is connected to the surface layer through the metallized hole, and the current is transmitted along the inner side of the metallized hole wall, but the roughness of the metallized hole wall wall affects the PIM performance of the antenna feeder circuit.
  • Embodiments of the present invention provide a multilayer printed circuit board and a method of fabricating the same, which can avoid problems affecting signal transmission performance caused by metallized holes.
  • a multilayer printed circuit board comprising:
  • the core board is provided with at least two layers, and the core board is provided with a line structure member, and the core board is further provided with a through hole, and the multilayer printed circuit board further comprises:
  • a metal column is embedded in the through hole of the core board
  • One end of the metal post is connected to a corresponding position of the first line structural member disposed on the core layer of the layer, and the other end of the metal post is connected to a corresponding position of the second line structural member disposed on the adjacent layer core.
  • a method of fabricating a multilayer printed circuit board including:
  • each layer core plate prepared with the line structure member such that one end of the metal column is connected to a corresponding position of the first line structure member disposed on the core layer of the layer, and the other end of the metal column and the adjacent layer Corresponding positions of the second line structural members disposed on the core board are connected.
  • a method of fabricating a multilayer printed circuit board including:
  • a through hole is provided at a corresponding position on the core layer of the layer; and/or, if there is a metal pillar in the metal pillar, Providing a through hole at a corresponding position on the adjacent layer core board;
  • each layer core plate prepared with the line structure member such that one end of the metal column is connected to a corresponding position of the first line structure member disposed on the core layer of the layer, and the other end of the metal column and the adjacent layer Corresponding positions of the second line structural members disposed on the core board are connected.
  • the multilayer printed circuit board and the manufacturing method thereof provided by the embodiments of the present invention connect the circuit structure on the adjacent core board by using the metal pillars, and connect the circuit structure on the adjacent core board by setting the metallization holes with the prior art. Compared with the case, the problem of affecting the signal transmission performance due to the roughening of the metallized hole wall or the like is avoided.
  • BRIEF DESCRIPTION OF THE DRAWINGS In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the embodiments or the description of the prior art will be briefly described below, obviously, the following The drawings in the description are only some of the embodiments of the present invention, and those skilled in the art can obtain other drawings based on these drawings without any creative work.
  • FIG. 1 is a schematic structural diagram of an antenna feed printed circuit board according to an embodiment of the present invention.
  • FIG. 2 to FIG. 4 are schematic structural diagrams showing a method of manufacturing an antenna feed printed circuit board according to an embodiment of the present invention
  • FIG. 5 to FIG. 8 are schematic diagrams showing the structure of another method for manufacturing an antenna-fed printed circuit board according to an embodiment of the present invention.
  • the technical solutions in the embodiments of the present invention are clearly and completely described in the following with reference to the accompanying drawings in the embodiments of the present invention. It is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. example. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without creative efforts are within the scope of the present invention.
  • the multi-layer printed circuit board 10 provided by the embodiment of the present invention, as shown in FIG. 1, includes: at least two layers of laminated core boards, in this embodiment, a core board 101 and a core board 102;
  • the first circuit structure member 103 is provided with a second circuit structure member 104; and the core plate 101, 102 is further provided with a through hole 106.
  • the printed circuit board 10 further includes:
  • a metal post 105 is embedded in the through hole 106, and one end of the metal post 105 is connected to a corresponding position of the first line structure member 103 disposed on the core layer 101 of the layer, and the other end of the metal post 105 is adjacent to the core layer.
  • the respective positions of the second line structure members 104 disposed on the board 102 are connected.
  • the metal column is used to connect the inner layer transmission line of the multi-layer board, and the metallized hole is connected compared with the prior art, thereby avoiding the problem that the metallized hole wall is rough and affecting the signal transmission performance, and also avoiding the existence of the metallized hole. Excessive hole walls affect the problem of signal matching.
  • the material of the metal pillar 105 may be copper or aluminum or other metal materials.
  • the surface of the metal pillar 105 is provided with a non-magnetic metal layer.
  • the non-magnetic metal refers to steel, nickel metal, and some stainless steel (marcin or ferritic type: 404B, 430, 420, 410, etc.)
  • Other metals other than metal are non-magnetic metals.
  • metal pillars 105 may be surface-treated with materials such as gold, silver or tin, which can effectively improve the conductive contact resistance and enhance signal transmission, thereby ensuring The reliability of signal transmission.
  • the surface side of the metal post 105 contacting the through hole may also be provided with a medium protection
  • the layer, specifically, the dielectric protective layer is plastic, paint, etc., so that the more effective protection metal column will not be oxidized or corroded during long-term use, thereby ensuring the reliability of signal transmission.
  • the multi-layer printed circuit board provided by the embodiment of the present invention is connected to the line structural member on the adjacent core board by using the metal post, compared with the prior art by connecting the metallized hole to connect the line structural member on the adjacent core board.
  • the problem of affecting signal transmission performance due to roughening of the metallized hole wall or the like is avoided.
  • a method for manufacturing a multilayer printed circuit board according to an embodiment of the present invention includes
  • a through hole is formed in the prepared core plate.
  • the connection between the first line structure member 103 on the core board 101 and the second line structure member 104 on the adjacent layer core board 102 is obtained in the embodiment of the present invention.
  • a through hole 106 is disposed at a position, as shown in FIG. 2, wherein (a) is a core layer of the layer and a through hole 106 is disposed on the core plate, (b) is an adjacent layer core plate and is in the phase Two through holes 106 are provided on the adjacent core plate.
  • the core plate may be a thermoplastic resin core plate, and the through holes may be formed by drilling or milling.
  • the material of the metal pillar 105 may be copper or aluminum or other metal materials, and the metal pillar 105 may be formed by a die casting or machining process, and the die casting process is a casting liquid die forging process.
  • the method, the die-casting forging process is a process completed on a special die-casting die forging machine.
  • the basic process is: the metal liquid is first filled into the cavity of the mold by low-speed or high-speed casting, and the mold has a movable cavity. The surface is pressed and forged with the cooling process of the molten metal to eliminate the shrinkage and shrinkage defects of the blank, and also to make the internal structure of the blank reach the forged broken crystal grains.
  • the integrated mechanical properties of the blank are significantly improved.
  • the machining is a machined cylinder scale, which refers to the processing technology for accurately removing materials by processing machinery.
  • the surface of the metal pillar 105 is provided with a non-magnetic metal layer.
  • the non-magnetic metal refers to steel, nickel metal, and part of stainless steel (marcin or ferritic type: 404B, 430, 420, 410, etc.)
  • Other metals other than metal are non-magnetic metals.
  • metal pillars 105 may be surface-treated with materials such as gold, silver or tin, which can effectively improve the conductive contact resistance and enhance signal transmission, thereby ensuring The reliability of the signal transmission, the non-magnetic metal layer is disposed on the surface of the metal pillar 105.
  • the prior art can be used, and details are not described herein.
  • the surface of the metal post 105 contacting the through hole is provided with a dielectric protective layer, which may be plastic, paint or the like.
  • a dielectric protective layer which may be plastic, paint or the like.
  • the structure of the metal post is similar to a coaxial line. It should be noted that the metal post 105 can be pressed into the through hole 106 by a manual or automatic placement machine, and after the metal post 105 is pressed into the through hole 106, the metal post 105 needs to have the through hole 106. A certain holding force to prevent the metal column 105 from falling.
  • the adjacent core plates 101, 102 are pressed together to form a multilayer printed circuit board as shown in FIG. 1, wherein the first layer on the core board 101 is A line structure member 103, and a second line structure member 104 on the adjacent layer core board 102 are connected by a metal post 105.
  • circuit structure formed by etching on the core board may be formed before being pressed into the metal post, or may be formed after pressing the metal post.
  • the line structure component may be an antenna feeder circuit structure, and the adjacent antenna feeder structure is connected by embedding a metal pillar on the core board, so that the current between the adjacent antenna feeder circuit components is along the metal pillar direction. Transmission, compared with the prior art, the current is transmitted through the metallized hole direction, which avoids the problem of signal matching due to the roughening of the metallized hole wall, and also improves the PIM performance of the antenna feeder circuit.
  • the plurality of core boards may be typeset first, and the alignment of each core board is performed by pin or the like, and then pressed. This prevents the occurrence of misalignment at the connection position between the metal post and the line structural member due to the multiple lamination, and specifically, the plurality of core plates after the layout can be pressed by the high temperature press, the metal post and the other layer lines Direct connection, the outer layer of the copper column can be directly welded, or connected to other lines by electroplating.
  • the manufacturing method of the multilayer printed circuit board provided by the embodiment of the invention connects the circuit structural members on the adjacent core boards by using the metal pillars, and connects the circuit structural members on the adjacent core boards by setting the metallized holes with the prior art. In contrast, the problem of affecting the signal transmission performance due to the roughening of the metallized hole wall or the like is avoided, and the manufacturing method is simple, which is very suitable for mass production.
  • FIG. 5 to FIG. 5 A method for manufacturing a multilayer printed circuit board according to an embodiment of the present invention, as shown in FIG. 5 to FIG.
  • the line knot with the metal post can be obtained by die stamping or laser cutting.
  • the component, the material of the circuit structural member and the metal pillar is other metal such as copper or aluminum.
  • the top view of the structure of the first circuit structural member 103 on the core layer 101 of the present layer is as shown in FIG. 5.
  • the side view is shown in Fig. 5(b), in which the metal column is 105.
  • the surface of the metal pillar 105 is provided with a non-magnetic metal layer.
  • the non-magnetic metal refers to steel, nickel metal, and part of stainless steel (marcin or ferritic type: 404B, 430, 420, 410, etc.)
  • Other metals other than metal are non-magnetic metals.
  • metal pillars 105 may be surface-treated with materials such as gold, silver or tin, which can effectively improve the conductive contact resistance and enhance signal transmission, thereby ensuring The reliability of the signal transmission, the non-magnetic metal layer is disposed on the surface of the metal pillar 105.
  • the prior art can be used, and details are not described herein.
  • the surface of the metal post that is in contact with the through hole is provided with a dielectric protective layer, which may be plastic, paint or the like.
  • a dielectric protective layer which may be plastic, paint or the like.
  • the structure of the metal post is similar to a coaxial line.
  • a through hole is disposed at a corresponding position on the core layer of the layer; and/or, if the metal pillar has a core layer adjacent to the adjacent layer, A through hole is provided at a corresponding position on the adjacent core board.
  • the through hole 106 is disposed at a corresponding position on the core layer of the layer, as shown in FIG. 6;
  • the through hole 106 is disposed at a corresponding position on the adjacent layer core board, as shown in FIG. 7;
  • metal pillars 105 on the first circuit structural member 103 have both the adjacent core layer 102 and the core layer 101, the corresponding positions on the adjacent core board and the core board.
  • Through holes 106 are provided at all, as shown in FIG. 8;
  • the core plate may be a thermoplastic resin core plate, and the through hole may be formed by drilling or milling.
  • each layer core plate prepared with the circuit structural member such that one end of the metal column is connected to a corresponding position of the first circuit structural member disposed on the core layer of the layer, and the other end of the metal column and the adjacent layer Corresponding positions of the second line structural members disposed on the core board are connected.
  • the core boards of each layer are pressed to form a multilayer printed circuit board as shown in FIG. 1, wherein the metal column is correspondingly pressed into the board.
  • the line structure component may be an antenna feeder circuit structure
  • the adjacent antenna feeder structure is connected by embedding a metal pillar on the core board, so that the current between the adjacent antenna feeder circuit components is along the metal pillar direction. Transmission, compared with the prior art, the current is transmitted through the metallized hole direction, avoiding the problem of signal matching due to the roughening of the metallized hole wall, and also improving the antenna feeder circuit.
  • the plurality of core boards may be typeset first, and the alignment of each core board is performed by pin or the like, and then pressed. This prevents the occurrence of misalignment at the connection position between the metal post and the line structural member due to the multiple lamination, and specifically, the plurality of core plates after the layout can be pressed by the high temperature press, the metal post and the other layer lines Direct connection, the outer layer of the copper column can be directly welded, or connected to other lines by electroplating.
  • the height of the circuit structural member may be filled with a thin core plate or a prepreg, so that the metal post is connected to the corresponding position of the circuit structural member, and the resin can also be used to fill the metal column and the through hole. The gap is thus avoided to avoid misalignment at the connection position of the metal post and the line structural member in the subsequent manufacturing process.
  • the manufacturing method of the multilayer printed circuit board provided by the embodiment of the invention connects the circuit structural members on the adjacent core boards by using the metal pillars, and connects the circuit structural members on the adjacent core boards by setting the metallized holes with the prior art. In contrast, the problem of affecting the signal transmission performance due to the roughening of the metallized hole wall or the like is avoided, and the manufacturing method is simple, which is very suitable for mass production.
  • the storage medium may be a magnetic disk, an optical disk, a read-only memory (ROM), or a random access memory (RAM).

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)

Abstract

本发明实施例提供的多层印制电路板及其制造方法，涉及电子领域，能够避免因金属化孔所导致的影响信号传输性能的问题，该天馈印制电路板包括，至少两个贴合的芯板，所述芯板上方设置有天馈电路结构件，并且所述芯板上还设置有通孔，其特征在于，在所述通孔中嵌有金属柱，其中，所述金属柱的一端与所述芯板上方设置的天馈电路结构件的相应位置连接，另一端与所述芯板的相邻芯板上方设置的天馈电路结构件的相应位置连接，用于制造多层印制电路板。

Description

一种多层印制电路板及其制造方法
本申请要求于 2012 年 3 月 13 日提交中国专利局、 申请号为 201210064742.1、 发明名称为"一种多层印制电路板及其制造方法"， 其 全部内容通过引用结合在本申请中。
技术领域 本发明涉及电子领域， 尤其涉及一种多层印制电路板及其制造方法。 背景技术 现在， 制作天馈 PCB ( Printed Circuit Board, 印制电路板 )普遍采用传统 的印制电路板制作工艺， 尤其是采用传统的聚四氟乙烯 （Poly tetra fluoro ethylene ptfe , 筒写为 PTFE ) 印制电路板。
天馈 PCB 电路中传输路径的导体粗糙度是影响天线无源交调 （Passive Inter-Modulation, 筒写为 PIM )的主要因素之一， 所以内外层传输线均采用低 粗糙度铜箔以提升 PIM。传统 PTFE多层板内层传输线通过金属化孔连接到表 层， 电流沿金属化孔壁内侧方向传输， 但金属化孔孔壁的粗糙度会影响到天 馈电路的 PIM性能。
一方面， 由于金属化孔制作工艺不可避免会带来孔粗及渗铜问题对 PIM 性能有较大影响； 另一方面， 金属化孔存在多余孔壁也会影响信号匹配。 为 解决上述问题， 现有技术提供了一种采用焊接方式连通内层与外层线路的方 法， 但该方法所使用的焊锡会占用较大空间， 并且由于焊接效率低， 不适合 批量生产。 发明内容 本发明的实施例提供一种多层印制电路板及其制造方法， 能够避免因金 属化孔所导致的影响信号传输性能的问题。
为达到上述目的， 本发明的实施例采用如下技术方案： 一方面， 提供一种多层印制电路板， 包括：
至少两层贴合的芯板， 所述芯板上设置有线路结构件， 且所述芯板上还 设置有通孔， 该多层印制电路板还包括：
所述芯板的通孔中嵌有金属柱；
所述金属柱的一端与本层芯板上设置的第一线路结构件的相应位置连 接， 所述金属柱的另一端与相邻层芯板上设置的第二线路结构件的相应位置 连接。
一方面， 提供一种多层印制电路板的制造方法， 包括：
在制得的芯板上设置通孔；
将制得的金属柱压入所述通孔中；
将制备有线路结构件的各层芯板压合， 使得所述金属柱的一端与本层芯 板上设置的第一线路结构件的相应位置连接， 所述金属柱的另一端与相邻层 芯板上设置的第二线路结构件的相应位置连接。
一方面， 提供一种多层印制电路板的制造方法， 包括：
在本层芯板的第一线线路结构件上， 形成用于与相邻层芯板的第二线路 结构件相连接的垂直于所述第一线路结构件的金属柱；
若所述金属柱中有指向本层芯板的， 则在本层芯板上的对应位置处设置 通孔； 和 /或， 若所述金属柱中有指向相邻层芯板的， 则在相邻层芯板上的对 应位置处设置通孔；
将制备有线路结构件的各层芯板压合， 使得所述金属柱的一端与本层芯 板上设置的第一线路结构件的相应位置连接， 所述金属柱的另一端与相邻层 芯板上设置的第二线路结构件的相应位置连接。
本发明实施例提供的多层印制电路板及其制造方法， 通过使用金属柱连 接相邻芯板上的线路结构件， 与现有技术通过设置金属化孔连接相邻芯板上 的线路结构件相比， 避免了由于金属化孔孔壁粗糙等导致的影响信号传输性 能的问题。 附图说明 为了更清楚地说明本发明实施例或现有技术中的技术方案，下面将对实 施例或现有技术描述中所需要使用的附图作筒单地介绍， 显而易见地， 下面 描述中的附图仅仅是本发明的一些实施例， 对于本领域普通技术人员来讲， 在不付出创造性劳动的前提下， 还可以根据这些附图获得其他的附图。
图 1为本发明实施例提供的天馈印制电路板的结构示意图；
图 2~图 4为本发明实施例提供的一种天馈印制电路板的制造方法过程 中的结构示意图；
图 5~图 8为本发明实施例提供的另一种天馈印制电路板的制造方法过程 中的结构示意图。 具体实施方式 下面将结合本发明实施例中的附图，对本发明实施例中的技术方案进行 清楚、 完整地描述， 显然， 所描述的实施例仅仅是本发明一部分实施例， 而 不是全部的实施例。基于本发明中的实施例， 本领域普通技术人员在没有做 出创造性劳动前提下所获得的所有其他实施例， 都属于本发明保护的范围。
本发明实施例提供的多层印制电路板 10, 如图 1所示， 包括： 至少两 层贴合的芯板， 本实施例中为芯板 101和芯板 102; 芯板 101上设置有第一 线路结构件 103; 芯板 102上设置有第二线路结构件 104; 且该芯板 101、 102上还设置有通孔 106, 该印制电路板 10还包括：
在该通孔 106中嵌有金属柱 105, 该金属柱 105的一端与本层芯板 101 上设置的第一线路结构件 103的相应位置连接，该金属柱 105的另一端与相 邻层芯板 102上设置的第二线路结构件 104的相应位置连接。 这样， 采用金 属柱连接多层板内层传输线相较现有技术通过金属化孔连接，避免了金属化 孔孔壁粗糙而带来影响信号传输性能的问题， 同时也避免了由于金属化孔存 在多余孔壁而影响信号匹配的问题。
具体的， 该金属柱 105的材料可以是铜或者铝或者其他金属材料。
优选的， 该金属柱 105的表面设有一层非磁性金属层， 具体的， 所谓非 磁性金属是指除了钢铁，镍金属，部分不锈钢（马氏体或铁素体型：如 404B, 430、 420、 410等）金属外的其他金属均为非磁性金属， 示例性的， 可以采 用金、银或锡等材料对金属柱 105进行表面处理， 这样可以有效改善导电接 触阻抗， 增进信号传输， 从而可以保证信号传输的可靠性。
优选的， 该金属柱 105 与该通孔接触的表面侧还可以设置有介质保护 层， 具体的， 该介质保护层为塑料， 油漆等， 这样更有效的保护金属柱在长 期使用过程中不会被氧化或腐蚀， 进而， 保证信号传输的可靠性。
本发明实施例提供的多层印制电路板，通过使用金属柱连接相邻芯板上 的线路结构件，与现有技术通过设置金属化孔连接相邻芯板上的线路结构件 相比， 避免了由于金属化孔孔壁粗糙等导致的影响信号传输性能的问题。
本发明实施例提供的多层印制电路板的制造方法， 如图 2~图 4所示， 包括，
5201、 在制得的芯板上设置通孔。
具体的，本发明实施例中在制得的芯板 101、 102上，对应本层芯板 101 上的第一线路结构件 103与相邻层芯板 102上的第二线路结构件 104的连接 位置处设置通孔 106, 如图 2所示， 其中， （a ) 为本层芯板并在该层芯板上 设置了一个通孔 106, ( b )为相邻层芯板并在该相邻层芯板上设置了两个通 孔 106, 示例性的， 该芯板可以是热塑性树脂芯板， 该通孔可以采用钻孔或 铣孔的方法制作。
5202、 将制得的金属柱压入该通孔中。
具体的， 如图 3所示， 该金属柱 105的材料可以是铜或者铝或者其他金 属材料， 并且该金属柱 105可以通过压铸或机加工工艺形成， 该压铸工艺为 是铸造液态模锻的一种方法， 压铸模锻工艺是一种在专用的压铸模锻机上 完成的工艺， 它的基本工艺过程是： 金属液先低速或高速铸造充型进模具的 型腔内， 模具有活动的型腔面， 它随着金属液的冷却过程加压锻造， 既消除 毛坯的缩孔缩松缺陷， 也使毛坯的内部组织达到锻态的破碎晶粒。 毛坯的综 合机械性能得到显著的提高。 该机加工是机械加工的筒称， 是指通过加工机 械精确去除材料的加工工艺。
优选的， 该金属柱 105的表面设有一层非磁性金属层， 具体的， 所谓非 磁性金属是指除了钢铁，镍金属，部分不锈钢（马氏体或铁素体型：如 404B , 430、 420、 410等）金属外的其他金属均为非磁性金属， 示例性的， 可以采 用金、银或锡等材料对金属柱 105进行表面处理， 这样可以有效改善导电接 触阻抗， 增进信号传输， 从而可以保证信号传输的可靠性， 在该金属柱 105 表面设置非磁性金属层可以采用现有技术， 在此不再赘述。
优选的， 该金属柱 105与该通孔接触的表面设置有介质保护层， 该介质 保护层具体可以是塑料，油漆等，示例性的，该金属柱的结构类似于同轴线。 需要说明的是，可以通过手动或者自动贴片机的方式将金属柱 105压入 通孔 106中， 并且在金属柱 105压入通孔 106中后， 该金属柱 105需要和该 通孔 106有一定的保持力， 以避免金属柱 105掉落。
S203、将制备有线路结构件的各层芯板压合，使得该金属柱的一端与本 层芯板上设置的第一线路结构件的相应位置连接，该金属柱的另一端与相邻 芯板上设置的第二线路结构件的相应位置连接。
具体的， 在本实施例中如图 4所示， 将相邻芯板 101、 102进行压合， 以形成如图 1所示的多层印制电路板，其中本层芯板 101上的第一线路结构 件 103、 相邻层芯板 102上的第二线路结构件 104通过金属柱 105连接。
进一步的，在芯板上通过刻蚀形成该线路结构件可以是在压入金属柱之 前形成， 也可以是在压入金属柱之后形成。
示例性的， 该线路结构件可以是天馈线路结构件， 通过在芯板上嵌入金 属柱连接相邻天馈线路结构件， 这样， 相邻天馈线路结构件之间的电流沿金 属柱方向传输， 相较于现有技术中电流通过金属化孔方向传输， 避免了由于 金属化孔孔壁粗糙而带来的影响信号匹配的问题， 同时还提高了天馈电路的 PIM性能。
优选的，依照本实施例提供的方法制作后，对于多层芯板需要进行压合， 可以先对多个芯板进行排版，通过销釘等方式实现各个芯板的对位后再进行 压合，这样防止了由于多层压合导致金属柱与线路结构件连接位置处出现错 位的现象， 具体的， 对排版后的多个芯板可以利用高温压机进行压合， 金属 柱与其它层线路直接连接，铜柱外层可直接焊接， 或者通过电镀与其它线路 相连。
本发明实施例提供的多层印制电路板的制造方法，通过使用金属柱连接 相邻芯板上的线路结构件，与现有技术通过设置金属化孔连接相邻芯板上的 线路结构件相比，避免了由于金属化孔孔壁粗糙等导致的影响信号传输性能 的问题， 并且制造方法筒单， 非常适合批量生产。
本发明实施例提供的多层印制电路板的制造方法， 如图 5~图 8所示， 包括，
S501、在本层芯板的第一线路结构件上， 形成用于与相邻芯板的第二线 路结构件相连的垂直于该第一线路结构件的金属柱。
具体的，可以通过模具沖压或激光切割等方式制得带有金属柱的线路结 构件， 该线路结构件和金属柱的材料为铜或者铝等其他金属， 示例性的， 如 图 5所示， 该在本层芯板 101上的第一线路结构件 103的结构俯视图如图 5 ( a )所示， 侧视图如图 5 ( b )所示， 其中， 金属柱为 105。
优选的， 该金属柱 105的表面设有一层非磁性金属层， 具体的， 所谓非 磁性金属是指除了钢铁，镍金属，部分不锈钢（马氏体或铁素体型：如 404B , 430、 420、 410等）金属外的其他金属均为非磁性金属， 示例性的， 可以采 用金、银或锡等材料对金属柱 105进行表面处理， 这样可以有效改善导电接 触阻抗， 增进信号传输， 从而可以保证信号传输的可靠性， 在该金属柱 105 表面设置非磁性金属层可以采用现有技术， 在此不再赘述。
优选的， 该金属柱与该通孔接触的表面设置有介质保护层， 该介质保护 层具体可以是塑料， 油漆等， 示例性的， 该金属柱的结构类似于同轴线。
5502、若该金属柱中有指向本层芯板的， 则在本层芯板上的对应位置处 设置通孔； 和 /或， 若该金属柱中有指向相邻层芯板的， 则在相邻层芯板上 的对应位置处设置通孔。
具体的， 若在第一线路结构件 103上的金属柱 105 中有指向本层芯板 101的， 则在本层芯板上对应位置处设置通孔 106, 如图 6;
若在第一线路结构件 103上的金属柱 105中有指向相邻层芯板的，则在 相邻层芯板上的对应位置处设置通孔 106, 如图 7;
若在第一线路结构件 103上的金属柱 105中既有指向相邻层芯板 102的 又有指向本层芯板 101的，则在相邻层芯板和本层芯板上的对应位置都处设 置通孔 106, 如图 8所示；
示例性的， 该芯板可以是热塑性树脂芯板， 该通孔可以采用钻孔或铣孔 的方法制作。
5503、将制备有线路结构件的各层芯板压合，使得该金属柱的一端与本 层芯板上设置的第一线路结构件的相应位置连接，该金属柱的另一端与相邻 层芯板上设置的第二线路结构件的相应位置连接。
具体的， 将制得的线路结构件设置在芯板上后， 对各层芯板进行压合， 以形成如图 1所示的多层印制电路板， 其中， 该金属柱对应压入通孔中， 以 实现该金属柱的一端与本层上设置的第一线路结构件的相应位置连接，该金 属柱的另一端与相邻层芯板上设置的第二线路结构件的相应位置连接。 示例性的， 该线路结构件可以是天馈线路结构件， 通过在芯板上嵌入金 属柱连接相邻天馈线路结构件， 这样， 相邻天馈线路结构件之间的电流沿金 属柱方向传输， 相较于现有技术中电流通过金属化孔方向传输， 避免了由于 金属化孔孔壁粗糙而带来的影响信号匹配的问题， 同时还提高了天馈电路的
PIM性能。
优选的，依照本实施例提供的方法制作后，对于多层芯板需要进行压合， 可以先对多个芯板进行排版，通过销釘等方式实现各个芯板的对位后再进行 压合，这样防止了由于多层压合导致金属柱与线路结构件连接位置处出现错 位的现象， 具体的， 对排版后的多个芯板可以利用高温压机进行压合， 金属 柱与其它层线路直接连接，铜柱外层可直接焊接， 或者通过电镀与其它线路 相连。
需要说明的是， 在排版过程中， 可以使用薄芯板或半固化片填充线路结 构件的高度， 以使得金属柱与线路结构件的相应位置连接， 并且还可以用树 脂填充金属柱与通孔之间的间隙，从而避免在后续制造过程中金属柱与线路 结构件连接位置处出现错位现象。
本发明实施例提供的多层印制电路板的制造方法，通过使用金属柱连接 相邻芯板上的线路结构件，与现有技术通过设置金属化孔连接相邻芯板上的 线路结构件相比，避免了由于金属化孔孔壁粗糙等导致的影响信号传输性能 的问题， 并且制造方法筒单， 非常适合批量生产。
本领域普通技术人员可以理解实现上述实施例方法中的全部或部分流 程， 是可以通过计算机程序来指令相关的硬件来完成， 所述的程序可存储于 一计算机可读取存储介质中， 该程序在执行时， 可包括如上述各方法的实施 例的流程。其中，所述的存储介质可为磁碟、光盘、只读存储记忆体（ Read-Only Memory, ROM )或随机存^ ^己忆体 ( Random Access Memory, RAM )等。
以上所述， 仅为本发明的具体实施方式， 但本发明的保护范围并不局限 于此， 任何熟悉本技术领域的技术人员在本发明揭露的技术范围内， 可轻易 想到变化或替换， 都应涵盖在本发明的保护范围之内。 因此， 本发明的保护 范围应以所述权利要求的保护范围为准。

Claims

权利要求 书
1、 一种多层印制电路板， 包括至少两层贴合的芯板， 所述芯板上设 置有线路结构件， 且所述芯板上还设置有通孔， 其特征在于：
所述芯板的通孔中嵌有金属柱；
所述金属柱的一端与本层芯板上设置的第一线路结构件的相应位置 连接，所述金属柱的另一端与相邻层芯板上设置的第二线路结构件的相应 位置连接。
2、 根据权利要求 1 所述的多层印制电路板， 其特征在于， 所述金属 柱表面具有非磁性金属层。
3、 根据权利要求 1或 2所述的多层印制电路板， 其特征在于， 所述 金属柱与所述通孔接触的表面侧设置有介质保护层。
4、 一种多层印制电路板的制造方法， 其特征在于， 包括：
在制得的芯板上设置通孔；
将制得的金属柱压入所述通孔中；
将制备有线路结构件的各层芯板压合，使得所述金属柱的一端与本层 芯板上设置的第一线路结构件的相应位置连接，所述金属柱的另一端与相 邻层芯板上设置的第二线路结构件的相应位置连接。
5、 根据权利要求 4所述的方法， 其特征在于， 所述金属柱表面具有 非磁性金属层。
6、 根据权利要求 4或 5所述的方法， 其特征在于， 所述金属柱与所 述通孔接触的表面侧设置有介质保护层。
7、 根据权利要求 4~6任一所述的方法， 其特征在于， 所述金属柱的 材料为铜或者铝。
8、 一种多层印制电路板的制造方法， 其特征在于， 包括，
在本层芯板的第一线路结构件上，形成用于与相邻层芯板的第二线路 结构件相连接的垂直于所述第一线路结构件的金属柱； 若所述金属柱中有指向本层芯板的，则在本层芯板上的对应位置处设 置通孔； 和 /或， 若所述金属柱中有指向相邻层芯板的， 则在相邻层芯板 上的对应位置处设置通孔；
将制备有线路结构件的各层芯板压合，使得所述金属柱的一端与本层 芯板上设置的第一线路结构件的相应位置连接，所述金属柱的另一端与相 邻层芯板上设置的第二线路结构件的相应位置连接。
9、 根据权利要求 8所述的方法， 其特征在于， 所述金属柱表面具有 非磁性金属层。
10、 根据权利要求 8或 9所述的方法， 其特征在于， 所述金属柱与所 述通孔接触的表面侧设置有介质保护层。
11、 根据权利要求 8~10任一所述的方法， 其特征在于， 所述金属柱 的材料为铜或者铝。
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