WO2012065376A1 - 印刷电路板基板及其制作方法 - Google Patents

印刷电路板基板及其制作方法 Download PDF

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Publication number
WO2012065376A1
WO2012065376A1 PCT/CN2011/071205 CN2011071205W WO2012065376A1 WO 2012065376 A1 WO2012065376 A1 WO 2012065376A1 CN 2011071205 W CN2011071205 W CN 2011071205W WO 2012065376 A1 WO2012065376 A1 WO 2012065376A1
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WIPO (PCT)
Prior art keywords
substrate
circuit board
printed circuit
pcb
base substrate
Prior art date
Application number
PCT/CN2011/071205
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English (en)
French (fr)
Inventor
葛虎
吕飞
Original Assignee
中兴通讯股份有限公司
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Publication of WO2012065376A1 publication Critical patent/WO2012065376A1/zh

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4602—Manufacturing multilayer circuits characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0275—Fibers and reinforcement materials
    • H05K2201/029—Woven fibrous reinforcement or textile
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
    • H05K3/0032—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material
    • H05K3/0035—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material of blind holes, i.e. having a metal layer at the bottom

Definitions

  • the present invention relates to printed circuit board substrate technology, and more particularly to a printed circuit board substrate and a method of fabricating the same. Background technique
  • PCB printed circuit board
  • vias are an important part of multi-layer PCBs, and drilling costs typically range from 30% to 40% of PCB board costs.
  • the designer always wants the smaller the via, the better, so that more wiring space can be left on the PCB.
  • the smaller the via the smaller the parasitic capacitance of the transistor. , more suitable for high speed circuits.
  • the reduction in the size of the hole also brings about an increase in cost.
  • the size of the via hole cannot be reduced indefinitely, and the smaller the aperture, the drill The longer the hole takes, the easier it is to deviate from the center position; and when the depth of the hole exceeds 6 times the diameter of the hole, uniform copper plating to the hole wall cannot be guaranteed.
  • the laser drilling technology has the advantage that mechanical drilling technology can't match: Laser drilling is non-contact machining, no direct impact on the workpiece, no workpiece In addition, the laser drilling process is faster, the production efficiency is high, and the processing quality is stable and reliable. Due to these features of laser drilling, this technique is often used in HID (High Density Interconnection) structural design. Laser technology allows the vias to be placed directly on the pads, which greatly improves circuit performance and saves wiring space.
  • FIG. 1 shows the structure of a conventional PCB (4-layer HDI) substrate.
  • the middle two layers are made of FR4 with a thickness of 100 micron.
  • the substrate core (2-3 layers) of the copper clad laminate is subjected to rolling, cutting, etching, oxidizing plating, punching, etc., and then copper is coated on the surface of the substrate, and the first to second layers of the FR4 copper clad plate and the third to fourth layers are further Layer FR4 copper clad laminates are respectively disposed on both sides of the substrate core, and are pressed together to form a PCB main board, which is formed into a HDI 4-layer first-order board.
  • the common substrate core thickness is 0.7 mm
  • the thickness of the 3rd to 4th layers is 0.07mm.
  • the aperture is generally 0.2 mm or 0.25 mm.
  • Laser drilling is formed on other FR4 copper-clad substrates (1st to 2nd, 3rd to 4th layers), and the aperture is generally 0.1mm.
  • FIG. 2 is a schematic structural view of a conventional PCB (HDI layer 6 or more) substrate.
  • the manufacturing process is basically the same as that of the 4-layer PCB substrate, that is, first The substrate core is fabricated, and the substrate core is formed by pressing two to five layers of FR4 copper clad laminates, and then copper is coated on the substrate core, and FR4 copper clad laminates of 1 to 2, 5-6 layers are placed on both sides of the substrate core. , together with the PCB motherboard; for the second-order multi-layer board, relative to the first-order, just one more press-fit process.
  • the thickness of the load-bearing substrate of the PCB substrate shown in FIG. 1 and FIG. 2 is on the order of 100 micrometers, and for the multilayer PCB substrate, the inner layer is a buried hole of mechanical drilling, which causes mechanical deformation caused by mechanical drilling, The disadvantage of low processing efficiency.
  • a printed circuit board substrate comprising at least two layers of a base substrate.
  • the base substrate is a substrate of a ten micron order.
  • the base substrate is a substrate of 0.07 mm.
  • the base substrate is an FR4 copper clad substrate.
  • the printed circuit board substrate is further provided with a blind hole.
  • the printed circuit board substrate is further provided with a load bearing substrate.
  • a method of manufacturing a printed circuit board substrate comprising:
  • a laser hole is drilled on the pressed base substrate to form a blind hole.
  • the method further includes:
  • the base substrate after pressing is subjected to surface treatment.
  • the outer layer of the pressed base substrate is specifically:
  • the copper plating on the base substrate after pressing is subjected to a film removal treatment to form an outer layer wiring.
  • the copper plating of the pressed base substrate is specifically:
  • Copper plating is performed on the pressed base substrate after drilling, and gold is formed after the interlayer holes are formed Belongs to the copper layer, complete the conduction of the interlayer circuit;
  • the surface treatment of the pressed base substrate is specifically performed by: gold plating, tin-spraying, pre-welding, and carbon ink treatment on the joint of the base substrate after pressing.
  • the above basic substrate is a substrate of a ten micron order.
  • the base substrate was a 0.07 mm substrate.
  • the base substrate is an FR4 copper clad substrate.
  • the FR4 copper-clad substrate can be directly pressed into the required number of layers, and it is not necessary to first press the core of the PCB substrate, and then press the layers laminated with the core of the PCB substrate, and then Each layer is laminated on both sides of the PCB substrate core. Further, since the present invention does not need to manufacture the PCB substrate core, all of the laser drilling is performed when drilling the PCB substrate, so that not only the processing is easy to process, but also the precision of the drilling can be improved.
  • FIG. 1 is a schematic structural view of a conventional PCB (4-layer HDI) substrate
  • FIG. 2 is a schematic structural view of a conventional PCB (HDI layer 6 or more) substrate
  • FIG. 3 is a schematic structural view of a PCB (4-layer HDI) substrate according to the present invention.
  • PCB HDI layer of 6 or more layers
  • the basic idea of the present invention is that for a multi-layer PCB substrate, the method of manufacturing a conventional PCB is not used, that is, without the fabrication of the substrate core, the FR4 copper clad plate is directly used as a multi-layer PCB substrate, and the popular point is that there is no core for bearing.
  • the board directly uses the FR4 copper-clad substrate of 0.07mm class, and the PCB substrate combined with the original blind hole and the buried hole (set on the substrate core) becomes a single-sided laser blind hole plate, thereby greatly improving the PCB production speed. It also increases the density of the PCB substrate.
  • FIG. 1 and 2 are schematic structural views of a conventional PCB substrate, as can be seen from the figure,
  • the thickness of the load-bearing substrate (substrate core) of the PCB substrate is on the order of a hundred micron, and is generally 0.7 mm. More importantly, since the thickness of the load-bearing substrate (substrate core) of the PCB substrate is thick, and the circuit design needs, it is generally required to provide a through hole on the load-bearing substrate of the PCB substrate, so as to realize the load-bearing substrate of the PCB substrate.
  • the thickness of the load-bearing substrate (substrate core) is generally thick, and mechanical drilling is generally used, which inevitably results in a low quality of the drilled hole, which is liable to cause damage to the load-bearing substrate of the PCB substrate, and the processing efficiency is low.
  • the multi-layer FR4 copper clad laminate that is pressed against the load-bearing substrate of the PCB substrate is required to be bonded to the load-bearing substrate of the PCB substrate, and is usually processed in advance, and then pressed against the load-bearing substrate of the PCB substrate.
  • This inevitably leads to a low processing efficiency, and since the load-bearing substrate of the PCB substrate requires mechanical drilling, the processing efficiency of the load-bearing substrate of the PCB substrate is inevitably lowered and easily damaged.
  • the present invention is directed to this processing defect in the prior art, and proposes a new idea of PCB substrate fabrication. That is, instead of setting the load-bearing substrate of the PCB substrate, the multi-layer FR4 copper clad laminate is directly used to laminate the PCB substrate, and then laser drilling is performed on the pressed PCB substrate to realize electrical connection between the layers; In this way, since it is no longer necessary to separately process the load-bearing substrate of the PCB substrate and the multi-layer FR4 copper clad laminate, the processing efficiency of the PCB substrate can be greatly improved.
  • laser drilling can also ensure the processing accuracy of the hole, such as ensuring the depth of the hole, to ensure that the layers can pass through the conductive layer coated on the hole wall to make the connection between the layers to be electrically connected, to ensure the PCB
  • the circuits on the substrate are coupled to each other.
  • Step 1 Cutting, making a multilayer PCB double-sided substrate (FR4 copper clad laminate) with thickness, and establishing wiring for connecting between parts; this step is mainly Laying a thin layer of copper foil on the surface of the PCB substrate
  • Step 2 According to each single-piece marking serial number, the circuit boards are superimposed and riveted in pairs by a rivet machine.
  • the plate is placed neatly between the mirror steel plates and sent to the vacuum laminator to harden and bond the film at an appropriate temperature and pressure.
  • the pressed circuit board is properly cut and cut to facilitate subsequent follow-up. Processing;
  • the appropriate number of FR4 copper clad laminates are selected, and the FR4 copper clad laminates are stacked in an appropriate order and pressed into a unitary structure;
  • Step 3 The pressed circuit board is sent to the laser drilling machine for punching.
  • the laser hole puncher can machine the laser holes of each layer;
  • the FR4 copper clad laminate after pressing is subjected to blind hole processing.
  • the purpose of providing the blind holes is to interconnect the FR4 copper clad layers to realize mutual electrical connection between the circuits.
  • the corresponding blind holes can be set to realize the mutual connection between the layers of FR4 copper clad layers; FIG.
  • FIG. 3 is a schematic structural view of the PCB (4-layer HDI) substrate of the present invention, as shown in FIG.
  • Two blind holes can realize the mutual connection of the three-layer FR4 copper clad layer shown in the figure, thereby ensuring the mutual connection of corresponding circuits in the PCB substrate;
  • Step 4 Copper plating, copper plating is performed on the hole-punched circuit board, mainly for copper plating, and a metal copper layer is formed on the hole (hole wall) after the interlayer conduction hole is formed to complete the interlayer Conduction of the circuit;
  • Step 5 The outer layer is made; the copper plating is mainly used for the outer layer to form the corresponding circuit; Step 6: the solder resist printing; the solder resist is covered on the outermost wiring, so that the wiring will not be In contact with the plating part;
  • Step 7 Text printing; that is, silk screen printing on the surface of the PCB substrate, printing the screen printing surface to indicate the position of each part, text printing can not cover any wiring or gold finger, otherwise it may reduce the solderability or Stability of electrical connections;
  • Step 8 Surface treatment; mainly refers to joint processing, such as gold plating, spray tin. Pre-weld, carbon Ink, etc.
  • Step 9 Shape processing; mainly to cut the circuit board into a CNC (Computer Numerical Control) molding machine (or die punch) into the size of the customer's requirements.
  • CNC Computer Numerical Control
  • FIG. 4 is a schematic structural view of a PCB (HDI layer of 6 layers or more) according to the present invention.
  • a PCB substrate of a multi-layer FR4 copper clad board needs to be processed, a corresponding number of FR4 copper clad plates are selected for integral pressing. And laser drilling after pressing.
  • the thickness of the PCB substrate of the present invention is thinner than that of the conventional PCB substrate, and at the same time, a higher density PCB substrate can be processed by laser drilling.
  • the processing of the present invention is similar to the conventional processing process from the viewpoint of the processing flow, in practice, the processing of the present invention is very different from the conventional PCB substrate processing process: the conventional PCB is laminated one by one in order. Perforated, each layer of the board must be drilled and plated before pressing, and the PCB substrate of the present invention is integrally formed by pressing the FR4 copper clad plate, and then punching the layers. This saves a process flow from the manufacturing process, and the process savings for multi-level PCB substrates are more obvious.
  • the advantages of the present invention are also obvious.
  • the FR4 copper-clad substrate can be made relatively thin, generally about 0.07 mm, and the load-bearing substrate core of the PCB substrate is generally a thickness of a hundred micrometers, so that the thickness of the entire PCB substrate is relatively thin. It is suitable for the current thin processing of PCB substrates.
  • the buried hole of the load-bearing substrate core of the PCB substrate is mechanically drilled, and the mechanical drilling is slower than the laser drilling.
  • the mechanical drilling machine of 200,000 rpm drills about 300 ⁇ 0.25 ⁇ per minute.
  • all FR4 copper clad laminates are used to process PCB substrates, which can reduce the occurrence of laser drilling.
  • the hole type is incorrect. Because of the traditional PCB processing, the outer layer and the layer are drilled and pressed; the new structure of the FR4 copper clad plate is obtained by pressing the whole plate and then drilling the whole plate, so that only one outer part is processed. In this way, for the conventional multiple layer processing of the outer layer, the number of times of drilling the outer layer separately is reduced, which is equivalent to reducing the hole shape of the plurality of outer layers due to uneven thickness.
  • the invention makes the thickness of the PCB substrate thin, and the bearing capacity is relatively weak.
  • the present invention can also improve the deficiencies by using a support plate, and the support plate can be a metal support plate, or Use a relatively low cost plastic support plate and other ways to improve the load bearing capacity of the PCB.
  • it is sufficient to provide a support plate directly on the processed PCB substrate, and also to directly place the PCB substrate on the single board or devices to be used, and these single boards or devices themselves serve as support plates for the PCB substrate of the present invention.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Laser Beam Processing (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Drilling And Boring (AREA)

Description

印刷电路板 及其制作方法 技术领域
本发明涉及印刷电路板基板技术， 尤其涉及一种印刷电路板基板及其 制作方法。 背景技术
在印刷电路板 ( PCB, Printed Circuit Board )设计中， 过孔（ via )是多 层 PCB的重要组成部分之一， 而钻孔的费用通常占 PCB制板费用的 30% 到 40%。 在对高速高密度的 PCB进行设计时， 设计者总是希望过孔越小越 好， 这样 PCB上可以留有更多的布线空间， 此外， 过孔越小， 其自身的寄 生电容也越小， 更适于高速电路。 但孔尺寸的减小同时也带来了成本的增 加， 由于受到钻孔（drill )和电镀（plating )等工艺技术的限制， 过孔的尺 寸不可能无限制地减小， 孔径越小， 钻孔需花费的时间越长， 也越容易偏 离中心位置； 且孔的深度超过钻孔直径的 6倍时， 就无法保证对孔壁的均 匀镀铜。
随着激光钻孔技术的发展， 钻孔的尺寸可以越来越小， 激光钻孔技术 有着机械钻孔技术无法比拟的优势： 激光钻孔属于无接触加工， 对工件无 直接冲击， 不存在工件的机械变形问题； 另外， 激光钻孔的加工速度较快， 生产效率很高， 加工质量稳定可靠。 由于激光钻孔的这些特征， 因此在高 密度互连 ( HDI, High Density Interconnection )结构设计中经常使用到该技 术。 激光技术可以允许过孔直接打在焊盘上， 这大大提高了电路性能， 节 约了布线空间。
传统 PCB的制造过程是， 首先由玻璃环氧树脂 （ Glass Epoxy )或 FR4 覆铜板等类似材质制成 PCB基板，然后在 PCB基板上光绘出零件间联机的 线路板的线路底片印刷在金属导体上。 以 4层 PCB主板为例， 图 1为传统 PCB ( 4层 HDI )基板的结构示意图， 如图 1所示， 制造 PCB主板时先将 中间两层（基板 core )材质厚度为百微米级别的 FR4覆铜板的基板 core( 2-3 层）， 经过碾压、 裁剪、 蚀刻、 氧化电镀、 打孔等处理后， 在基板表面覆铜， 再将第 1~2层 FR4覆铜板以及第 3~4层 FR4覆铜板分别设于基板 core的两 侧面上， 一起压合成 PCB主板， 即形成为 HDI 4层一阶板， 常见基板 core 厚度为 0.7mm,而其他 FR4覆铜基板（第 1~2层、第 3~4层）厚度为 0.07mm。 其中， 在基板 core上形成机械钻孔， 孔径一般为 0.2mm或 0.25mm, 其他 FR4覆铜基板（第 1~2层、第 3~4层）上形成激光钻孔，孔径一般为 0.1mm。
图 2为传统 PCB ( 6层以上 HDI )基板的结构示意图， 如图 2所示， 对于其他多层的 PCB结构如 6层一阶板，制作过程基本与 4层 PCB基板制 作方式相同， 即首先制作基板 core, 基板 core由 2~5层的 FR4覆铜板压合 而成，再在基板 core上覆铜，再将 1~2、 5~6层的 FR4覆铜板设于基板 core 的两侧面上， 一起压合成 PCB主板； 对于二阶的多层板， 相对与一阶， 只 是多了一次压合过程。
图 1及图 2所示的 PCB基板的承重基板厚度为百微米级别， 同时对于 多层 PCB基板， 内层级别为机械钻孔的埋孔， 这样就会产生机械钻孔所导 致的机械变形、 加工效率低的缺点。
其中， 在对 FR4覆铜板进行激光打孔过程中， 最容易出现的故障主要 是孔形不正确， 其主要原因是所釆用的基材成型存在的质量问题一一涂树 脂铜箔经压贴后介质层的厚度难免有差异， 在相同钻孔的能量下， 对介质 层较薄的部分的底垫不但要承受较多的能量， 也会反射较多的能量， 因而 将孔壁打成向外扩张的壶形， 这将对积层多层板层间的电气互连品质产生 较大的影响。 这也是目前 PCB基板制造中存在的主要问题。 发明内容
有鉴于此， 本发明的主要目的在于提供一种印刷电路板基板及印刷电 路板基板的制作方法， 能提供加工工艺较少更容易加工的印刷电路板基板 及其制作方法。
为达到上述目的， 本发明的技术方案是这样实现的：
一种印刷电路板基板， 所述印刷电路板基板由至少两层的基本基板构 成。
优选地， 所述基本基板为十微米级别的基板。
优选地， 所述基本基板为 0.07mm的基板。
优选地， 所述基本基板为 FR4覆铜基板。
优选地， 所述印刷电路板基板上还设有盲孔。
优选地， 所述印刷电路板基板上还设有承重基板。
一种印刷电路板基板的制作方法， 包括：
将至少两层的基本基板压合为一体；
对压合后的基本基板进行激光钻孔， 制作盲孔。
优选地， 制作盲孔之后， 所述方法还包括：
对压合后的基本基板镀铜；
对压合后的基本基板进行外层制作；
对压合后的基本基板进行防焊漆印刷；
对压合后的基本基板进行文字印刷；
对压合后的基本基板进行表面处理。
优选地， 所述对压合后的基本基板进行外层制作具体为：
为压合后的基本基板上的镀铜进行去膜处理， 形成外层线路。
优选地， 所述对压合后的基本基板镀铜具体为：
对钻孔后的压合后的基本基板进行镀铜， 在层间的孔道成型后布建金 属铜层， 完成层间电路的导通；
所述对压合后的基本基板进行表面处理具体为： 对压合后的基本基板 的接点进行镀金、 喷锡、 预焊、 碳墨处理。
上述基本基板为十微米级别的基板。 所述基本基板为 0.07mm的基板。 所述基本基板为 FR4覆铜基板。
本发明在制作 PCB基板时，直接使用 FR4覆铜基板压合为所需要的层 数即可， 不必再首先压合为 PCB基板 core, 然后压合与 PCB基板 core压 合的各多层， 再将各多层压合于 PCB基板 core两侧。 并且， 由于本发明不 必制作 PCB基板 core, 因此在 PCB基板进行钻孔时， 全部使用激光钻孔， 这样， 不仅加工方便加工效率高， 而且能提高钻孔的精度。 附图说明
图 1为传统 PCB ( 4层 HDI )基板的结构示意图；
图 2为传统 PCB ( 6层以上 HDI )基板的结构示意图；
图 3为本发明 PCB ( 4层 HDI )基板的结构示意图；
图 4为本发明 PCB ( 6层以上 HDI )基板的结构示意图。 具体实施方式
本发明的基本思想为，对于多层 PCB基板， 不釆用传统 PCB的制造的 方法， 即没有基板 core的制作， 直接用 FR4覆铜板做多层 PCB基板， 通俗 的点说， 没有承重的 core板， 直接釆用 0.07mm级的 FR4覆铜基板， 由原 来的盲孔和埋孔（基板 core上设置 )相结合的 PCB基板， 变成单面激光盲 孔板， 从而大大提高 PCB生产速度， 同时也提高了 PCB基板密度。
为使本发明的目的、 技术方案和优点更加清楚明白， 以下举实施例并 参照附图， 对本发明进一步详细说明。
图 1以及图 2是传统的 PCB基板的结构示意图， 从图中可以看出， 传 统 PCB基板的承重基板（基板 core )厚度是百微米级别的， 一般是 0.7mm。 更最重要的是， 由于 PCB基板的承重基板（基板 core ) 的厚度较厚， 而由 于电路设计的需要， 一般需要在 PCB基板的承重基板上设置通孔， 以实现 PCB基板的承重基板上下多层 FR4覆铜基板的连通；而又由于 PCB基板的 承重基板设于 PCB基板的中间，因此需要首先对 PCB基板的承重基板进行 事先加工， 即压合后再进行钻孔， 而由于 PCB基板的承重基板（基板 core ) 的厚度较厚， 一般都釆用机械钻孔， 这必然导致钻孔的质量不高， 又容易 造成 PCB基板的承重基板的受损， 加工效率低下。 同样地， 与 PCB基板的 承重基板压合的多层 FR4覆铜板， 由于需要与 PCB基板的承重基板压合， 因此一般也是事先加工， 再与 PCB基板的承重基板进行压合。 这必然导致 加工效率的低下， 以及， 由于 PCB基板的承重基板需要机械钻孔的处理， 必然会导致 PCB基板的承重基板加工效率的低下且容易被损坏。
本发明正是针对现有技术中的这一加工缺陷， 提出了一种 PCB基板制 作的新思路。 即， 不必再设置 PCB基板的承重基板， 而是直接使用多层的 FR4覆铜板压合成 PCB基板，然后再在压合后的 PCB基板上进行激光钻孔， 实现各层之间的电连接； 这样， 由于不必再分别加工 PCB基板的承重基板 以及多层 FR4覆铜板， 因此能大大提升 PCB基板的加工效率。 另外， 激光 钻孔也能保证孔的加工精度， 如保证孔的深度， 以保证各层之间能通过孔 壁上涂覆的导电层而使需电连接的各层之间实现联接， 保证 PCB基板上的 电路相互联接。
现详细说明本发明 PCB基板的制作流程， 具体包括以下步骤： 步骤一： 下料， 制作厚度均勾多层 PCB双面基板（FR4覆铜板）， 建立 出零件间联接的布线； 本步骤主要是在 PCB基板表面铺上一层薄薄的铜箔
(如釆用镀膜技术进行涂覆）， 并把多余部分消除；
步骤二： 按各单片标记序号线路板叠合， 用铆钉机成对进行铆合， 再 用盛盘将其整齐叠放于镜面钢板之间， 送入真空压合机中以适当的温度及 压力使胶片硬化黏合， 压合后的电路板板边做适当的细裁切割， 以方便后 续加工； 本步骤中， 主要是根据 PCB基板加工层数以及电路设计要求， 选 用合适数量的 FR4覆铜板， 将这些 FR4覆铜板按适当的顺序叠放后， 压合 成一体结构；
步骤三： 将压合后的电路板送入激光打孔机器进行打孔， 激光钻孔的 关键控制点有三个： （1 )参数的选择与优化； （2 )材料的选用 （有无玻璃 纤维）； ( 3 )压板厚度的控制 （介厚的控制）， 该步骤只要设计好仪器 （激 光打孔机）的相关参数， 激光打孔机即可加工出各层的激光孔； 本步骤中， 对压合后的 FR4覆铜板进行盲孔加工，具体的，设置盲孔的目的是使各 FR4 覆铜板层之间相互联接， 以实现电路之间的相互电联接， 这样， 本发明中， 通过设置相应的盲孔， 即可实现各层 FR4覆铜板层之间的相互联接； 图 3 为本发明 PCB ( 4层 HDI )基板的结构示意图， 如图 3所示， 通过设置如 图所示的两个盲孔， 即可实现图中所示的三层 FR4覆铜板层的相互联接， 从而保证 PCB基板中对应电路的相互联接；
步骤四： 镀铜， 对打完孔的电路板进行镀铜， 主要是对孔进行镀铜， 在层间导通孔道成型后于其上 （孔壁） 布建金属铜层， 以完成层间电路的 导通；
步骤五： 外层制作； 主要为外层线路的镀铜去膜， 形成相应的线路； 步骤六： 防焊漆印刷； 阻焊漆覆盖在最外层的布线上， 这样一来布线 就不会接触到电镀部分之外；
步骤七： 文字印刷； 即在 PCB基板表面进行丝印， 印刷网版印刷面， 以标示各零件的位置， 文字印刷不能够覆盖在任何布线或是金手指上， 不 然可能会降低可焊性或是电连接的稳定性；
步骤八： 表面处理； 主要指接点加工， 如进行镀金， 喷锡。 预焊， 碳 墨等；
步骤九：外形加工；主要为将电路板以计算机数字控制（ CNC, Computer Numerical Control )成型机（或模具冲床）切割成客户需求的外型尺寸。
至此， 即实现了本发明的 PCB基板的加工。
图 4为本发明 PCB ( 6层以上 HDI )基板的结构示意图， 如图 4所示， 当需要加工多层 FR4覆铜板的 PCB基板时，选用相应数量的 FR4覆铜板进 行一体压合即可， 并在压合后进行激光钻孔即可。 从图 3以及图 4中可以 看出，本发明的 PCB基板厚度比传统 PCB基板更薄， 同时，通过激光钻孔， 可以加工更高密度的 PCB基板。
虽然从加工流程上看， 本发明的加工过程与传统加工过程类似， 但实 际上， 本发明的加工过程与传统的 PCB基板加工过程区别很大： 传统 PCB 是按阶数一层一层压合打孔而成， 压合前每一层板子在都必须要先钻孔与 电镀， 而本发明的 PCB基板是一体对 FR4覆铜板进行压合而成 , 然后对各 层进行打孔。 这样从制作工艺上来说， 节省了一道工艺流程， 对多阶 PCB 基板该工艺的节省更加明显。
本发明的优点也显而易见， FR4 覆铜基板可以做的比较薄， 一般在 0.07mm左右， 而 PCB基板的承重基板 core, —般是百微米级别的厚度， 这样整个 PCB基板的厚度就会比较薄，适合现在对 PCB基板薄加工的要求。 同时 PCB基板的承重基板 core的埋孔为机械钻孔，机械钻孔相比激光钻孔， 速度慢，一般地， 20万转 /分的机械钻机每分钟约钻 300个左右的 Φ0.25ιηιη 的孔， 而 30万转 /分的钻机每分钟约钻 400个左右的 Φ0.15ιηιη的孔， 而激 光钻孔， 如波长为 9.4弘米， 1个盲孔分 3次钻成， 每分钟可钻 3万个孔， 由此数据可以看出， 机械钻孔加工时间相对较慢， PCB 生产速度低， 同时 机械钻孔容易出现机械变形， 增加了 PCB不良率。
另外， 全部釆用 FR4覆铜板加工 PCB基板， 可以减少激光钻孔出现的 孔型不正确率。 因为传统 PCB加工， 对于外层， 分层进行钻孔， 进行压合； 新结构的 FR4覆铜板釆取的是整板压合后， 再对整板进行钻孔， 这样相当 只加工了一个外层； 这样， 对于传统的多个外层分层加工， 降低了外层分 别钻孔的次数， 也就相当于降低了多个外层由于厚度不均勾带来的孔型不 正确。
当然， 本发明使 PCB基板厚度变薄， 承重能力会相对较弱， 为预防断 板， 本发明也可釆用支撑板的方式改善这一不足之处， 支撑板可以用金属 支持板， 也可以釆用成本相对较低的塑料支撑板， 还有其他改善 PCB承重 能力的方式。 例如， 直接在加工好的 PCB基板上设置支撑板即可， 也通过 直接将 PCB基板设置于待使用的单板或各器件上， 由这些单板或器件本身 作为本发明 PCB基板的支撑板。
以上所述， 仅为本发明的较佳实施例而已， 并非用于限定本发明的保 护范围。

Claims

权利要求书
1、 一种印刷电路板基板， 其特征在于， 所述印刷电路板基板由至少两 层的基本基板构成。
2、 根据权利要求 1所述的印刷电路板基板， 其特征在于， 所述基本基 板为十微米级别的基板。
3、 根据权利要求 1所述的印刷电路板基板， 其特征在于， 所述基本基 板为 0.07mm的基板。
4、 根据权利要求 1至 3任一项所述的印刷电路板基板， 其特征在于， 所述基本基板为 FR4覆铜基板。
5、 根据权利要求 4所述的印刷电路板基板， 其特征在于， 所述印刷电 路板基板上还设有盲孔。
6、 根据权利要求 4所述的印刷电路板基板， 其特征在于， 所述印刷电 路板基板上还设有承重基板。
7、 一种印刷电路板基板的制作方法， 其特征在于， 所述方法包括： 将至少两层的基本基板压合为一体；
对压合后的基本基板进行激光钻孔， 制作盲孔。
8、 根据权利要求 7所述的制作方法， 其特征在于， 制作盲孔之后， 所 述方法还包括：
对压合后的基本基板镀铜；
对压合后的基本基板进行外层制作；
对压合后的基本基板进行防焊漆印刷；
对压合后的基本基板进行文字印刷；
对压合后的基本基板进行表面处理。
9、 根据权利要求 7所述的制作方法， 其特征在于， 所述对压合后的基 本基板进行外层制作具体为： 为压合后的基本基板上的镀铜进行去膜处理， 形成外层线路。
10、 根据权利要求 7所述的制作方法， 其特征在于， 所述对压合后的 基本基板镀铜具体为：
对钻孔后的压合后的基本基板进行镀铜， 在层间的孔道成型后布建金 属铜层， 完成层间电路的导通；
所述对压合后的基本基板进行表面处理具体为： 对压合后的基本基板 的接点进行镀金、 喷锡、 预焊、 碳墨处理。
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