WO2013121967A1 - Substrate inspection system and data storage method - Google Patents

Substrate inspection system and data storage method Download PDF

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Publication number
WO2013121967A1
WO2013121967A1 PCT/JP2013/052852 JP2013052852W WO2013121967A1 WO 2013121967 A1 WO2013121967 A1 WO 2013121967A1 JP 2013052852 W JP2013052852 W JP 2013052852W WO 2013121967 A1 WO2013121967 A1 WO 2013121967A1
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WO
WIPO (PCT)
Prior art keywords
substrate
variation factor
image
solder
inspection system
Prior art date
Application number
PCT/JP2013/052852
Other languages
French (fr)
Japanese (ja)
Inventor
郁夫 鈴木
雅史 天野
博史 大池
Original Assignee
富士機械製造株式会社
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Filing date
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Application filed by 富士機械製造株式会社 filed Critical 富士機械製造株式会社
Publication of WO2013121967A1 publication Critical patent/WO2013121967A1/en

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
    • H05K3/1233—Methods or means for supplying the conductive material and for forcing it through the screen or stencil
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
    • H05K13/0815—Controlling of component placement on the substrate during or after manufacturing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
    • H05K13/0817—Monitoring of soldering processes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/083—Quality monitoring using results from monitoring devices, e.g. feedback loops
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/163—Monitoring a manufacturing process
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3485—Applying solder paste, slurry or powder
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
    • Y02P90/02—Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]

Definitions

  • a substrate inspection system of the present invention is a substrate inspection system for inspecting a substrate in a production line having a processing apparatus that performs a predetermined process on the substrate.
  • a variation factor that may cause a substrate defect occurs, the variation factor and an image of the substrate that has been processed from the processing apparatus at least one time point immediately before and immediately after the occurrence of the variation factor, A storage unit that stores the information in association is provided.
  • the “substrate image” not only the image of the substrate itself but also the arrangement on the substrate (for example, the wiring pattern, the land portion, the solder portion, the electronic component, the reference mark for positioning the electronic component, the substrate identifying pin ID images) are also included.
  • the variation factor and the image of the substrate are stored in the storage unit in a state of being associated with each other. For this reason, when a defect of an arbitrary substrate is detected, it is easy to identify a variation factor that may cause the detected defect by referring to data in the storage unit. Thus, according to the substrate inspection system of the present invention, the traceability of the cause of the substrate failure is enhanced.
  • the storage unit may store the image of the substrate only when the variation factor occurs.
  • storage part selectively memorize
  • the storage unit stores it. For this reason, the capacity
  • the storage unit stores the images of all the substrates, and the variation factor and the variation factor only when the variation factor occurs. It is preferable that the image of the substrate that has undergone processing from the processing apparatus is stored in association with at least one of the time immediately before the occurrence and immediately after the occurrence.
  • the storage unit stores images of all the boards that are produced. Then, when a variation factor occurs in an arbitrary processing apparatus, an image of a substrate that has been processed from the processing apparatus at least one time immediately before and after the occurrence of the variation factor is associated with the variation factor, The storage unit stores it. For this reason, it is possible to store the image of the substrate regardless of the occurrence of the variation factor.
  • any one of the configurations (1) to (3) at least one of the variation factor stored in the storage unit and immediately before and immediately after the occurrence of the variation factor is stored. It is better to have a configuration that includes a display unit that displays the image of the substrate that has been processed from the processing apparatus at a point in time. According to this configuration, the operator can compare the variation factor with the image of the substrate using the display unit. For this reason, it becomes easy to visually recognize the fluctuation factors that may cause the detected defect.
  • the data storage method of the present invention is a case where a variation factor that may cause a defect of the substrate occurs in the processing apparatus of a production line having a processing apparatus that performs predetermined processing on the substrate. And executing an association storing step of associating and storing the variation factor and the image of the substrate that has been processed from the processing apparatus at least one time point immediately before and after the occurrence of the variation factor. And Similar to the configuration (1) above, according to the data storage method of the present invention, the traceability of the cause of the substrate failure is enhanced.
  • the association storage step is executed by interrupting the storage step being executed. That is, in the storage step, the association storage step is executed when a variation factor occurs in an arbitrary processing apparatus while the image of the produced substrate is being stored. Specifically, an image of the substrate that has been processed from the processing apparatus at least one time point immediately before and after the occurrence of the variation factor is stored in association with the variation factor. For this reason, it is possible to store the image of the substrate regardless of the occurrence of the variation factor.
  • the present invention it is possible to provide a substrate inspection system and a data storage method that have high traceability as a cause of substrate failure.
  • FIG. 1 is a block diagram of a production line including a substrate visual inspection machine that is an embodiment of the substrate inspection system of the present invention.
  • FIG. 2 is a top view of the substrate appearance inspection machine.
  • FIG. 3 is a top view of an electronic component mounting machine including a tape-type component supply device.
  • FIG. 4 is a top view of an electronic component mounting machine including a tray-type component supply device.
  • FIG. 5 is a right side view of the solder printer.
  • FIG. 6A is a top view of the substrate before solder printing.
  • FIG. 6B is a top view of the substrate after solder printing.
  • FIG. 6C shows a top view of the substrate after mounting the components.
  • FIG. 7A is a schematic diagram of the first page of the screen.
  • FIG. 7B is a schematic diagram of the second page of the screen.
  • FIG. 8 is a schematic diagram of the first page of the screen of the substrate appearance inspection machine according to another embodiment.
  • 200 communication control circuit 201: input / output interface 202: computer 202a: arithmetic unit 202b: storage unit 203: image processing device 204: imaging device 205: screen (display unit) 205a: first page 205b: second page, 220: conveyor belt, 300: communication control circuit, 301: input / output interface, 302: computer, 305: screen, 320: cylinder, 321: squeegee, 330: frame, 331: mesh, 332: Screen mask, 332a: through hole, 340: backup table, 341: backup pin, 350: conveyor belt, 351: wall, 352: clamp piece, 400: communication control circuit, 401: input / output interface, 402: computer, 403 : Image processing apparatus 404 Imaging device, 405: Screen, 500: Communication control circuit, 501: Input / output interface, 502: Computer, 503: Image processing device, 504: Imaging device, 505: Screen, 520: Base, 521: Substrate transfer device,
  • the substrate inspection system of the present invention is embodied as a substrate appearance inspection machine.
  • FIG. 1 the block diagram of a production line provided with the board
  • the production line 1 includes a solder printing machine 3, a solder printing inspection machine 4, five electronic component mounting machines 5, a board appearance inspection machine 2, from the upstream side toward the downstream side. And a reflow furnace (not shown).
  • the solder printer 3 and the electronic component mounting machine 5 are each included in the concept of the “processing device” of the present invention.
  • the production line 1 also includes a line management device 6 that manages these devices. These devices are communicably connected.
  • FIG. 2 shows a top view of the substrate appearance inspection machine.
  • the substrate 8 is hatched.
  • the board appearance inspection machine 2 includes a control unit 20, a base 21, a board transport device 22, a pair of front and rear X-axis guide rails 23, an X-axis slide 24, and a pair of upper and lower sides.
  • the pair of front and rear X-axis guide rails 23 are arranged on the upper surface of the base 21 so as to sandwich the substrate transfer device 22 from the front and rear direction.
  • the X-axis slide 24 is attached to a pair of front and rear X-axis guide rails 23 so as to be slidable in the left-right direction.
  • the pair of upper and lower Y-axis guide rails 25 are disposed on the X-axis slide 24.
  • the Y-axis slide 26 is attached to a pair of upper and lower Y-axis guide rails 25 so as to be slidable in the front-rear direction.
  • the inspection head 27 is detachably attached to the Y-axis slide 26.
  • the inspection head 27 is movable in the front-rear and left-right directions.
  • the control unit 20 includes a communication control circuit 200, an input / output interface 201, a computer 202, an image processing device 203, an imaging device 204, and a screen 205.
  • the screen 205 is included in the concept of the “display unit” of the present invention.
  • the input / output interface 201 is connected to the communication control circuit 200, the computer 202, the image processing device 203, and the screen 205.
  • the communication control circuit 200 is connected to other devices constituting the production line 1.
  • the computer 202 includes a calculation unit 202a and a storage unit 202b.
  • the image processing device 203 is connected to the imaging device 204.
  • the imaging device 204 is disposed on the lower surface of the inspection head 27.
  • the imaging device 204 is a CCD (Charge-Coupled Device) camera.
  • the imaging device 204 can image the upper surface of the substrate 8.
  • a touch-type button (input device) can be displayed on the screen 205.
  • Electrode mounting machine 5 Of the five electronic component mounting machines 5, three electronic component mounting machines 5 are provided with tape-type component supply devices. The two electronic component mounters 5 are provided with tray type component supply devices.
  • FIG. 3 shows a top view of an electronic component mounting machine equipped with a tape-type component supply device.
  • the substrate 8 is hatched.
  • the electronic component mounting machine 5 includes a control unit 50, a base 51, a module 52, a component supply device 53, and a component imaging device 54.
  • the module 52 includes a base 520, a substrate transfer device 521, a pair of upper and lower X-axis guide rails 522, an X-axis slide 523, a pair of left and right Y-axis guide rails 524, a Y-axis slide 525, and a mounting head 526. It is equipped with.
  • the module 52 is detachably attached to the base 51.
  • the pair of left and right Y-axis guide rails 524 are disposed on the lower surface of the upper wall of the housing (not shown) of the module 52.
  • the Y-axis slide 525 is attached to a pair of left and right Y-axis guide rails 524 so as to be slidable in the front-rear direction.
  • the pair of upper and lower X-axis guide rails 522 is disposed on the Y-axis slide 525.
  • the X-axis slide 523 is attached to a pair of upper and lower X-axis guide rails 522 so as to be slidable in the left-right direction.
  • the mounting head 526 is detachably attached to the X-axis slide 523.
  • the mounting head 526 is movable in the front-rear and left-right directions.
  • the mounting head 526 includes a suction nozzle 526a.
  • the suction nozzle 526a is detachably attached to the lower surface of the mounting head 5
  • the control unit 50 includes a communication control circuit 500, an input / output interface 501, a computer 502, an image processing device 503, an imaging device 504, and a screen 505.
  • the configuration of the control unit 50 is the same as the configuration of the control unit 20 of the board appearance inspection machine 2.
  • the imaging device 504 is disposed on the mounting head 526.
  • the imaging device 504 is a CCD camera.
  • the imaging device 504 can image the upper surface of the substrate 8.
  • a touch-type button can be displayed on the screen 505.
  • the component supply device 53 includes a tray 531, a conveyor 532, and a case 533. A plurality of trays 531 are accommodated in the case 533.
  • the conveyor 532 carries out the tray 531 necessary for supplying components from the case 533 to the outside of the case 533.
  • the components of the tray 531 that have been carried out are taken out of the tray 531 by the suction nozzle 526a and mounted at predetermined mounting coordinates of the substrate 8. At this time, the component sucked by the suction nozzle 526a passes above the component imaging device 54 (imaging area).
  • solder printing inspection machine 4 The configuration of the solder printing inspection machine 4 is the same as that of the board appearance inspection machine 2 shown in FIG. As shown in FIG. 1, the solder printing inspection machine 4 includes a control unit 40.
  • the control unit 40 includes a communication control circuit 400, an input / output interface 401, a computer 402, an image processing device 403, an imaging device 404, and a screen 405.
  • the imaging device 404 is a CCD camera.
  • the imaging device 404 can image the upper surface of the substrate 8.
  • FIG. 5 shows a right side view of the solder printer.
  • the solder printer 3 includes a control unit 30, a Y-axis guide rail 31, a squeegee device 32, a mask device 33, a backup device 34, and a substrate transport device 35. I have.
  • the backup device 34 includes a backup table 340 and a plurality of backup pins 341.
  • the backup table 340 is movable in the vertical direction.
  • the plurality of backup pins 341 are arranged on the upper surface of the backup table 340.
  • the substrate transfer device 35 includes a pair of front and rear conveyor belts 350, a pair of front and rear walls 351, and a pair of front and rear clamp pieces 352.
  • the pair of front and rear conveyor belts 350 are disposed on the pair of front and rear wall portions 351 so as to face each other.
  • the substrate 8 is conveyed from the left side to the right side by a pair of front and rear conveyor belts 350.
  • the pair of front and rear clamp pieces 352 are disposed at the upper ends of the pair of front and rear wall portions 351. At the time of solder printing, the substrate 8 is sandwiched by the pair of front and rear clamp pieces 352 from the front-rear direction.
  • the substrate 8 is supported from below by backup pins 341.
  • the control unit 30 includes a communication control circuit 300, an input / output interface 301, a computer 302, and a screen 305.
  • the computer 602 includes a calculation unit 602a and a storage unit 602b.
  • the storage unit 602b stores various fluctuation factors that occur in the solder printer 3 and the electronic component mounter 5. The occurrence of these fluctuation factors triggers the start of an association storage step described later.
  • the board appearance inspection machine 2 shown in FIG. 1 stores images of all the boards 8 flowing through the production line 1 in the storage unit 202b.
  • the imaging device 204 of the board appearance inspection machine 2 takes images of all the mounting coordinates of the board 8 in order.
  • the captured image is subjected to image processing by the image processing device 203 and stored in the storage unit 202b.
  • the imaging device 204 of the board appearance inspection machine 2 takes images of all the mounting coordinates of the association board 8 in order.
  • the captured image is subjected to image processing by the image processing device 203 and stored in the storage unit 202b.
  • ⁇ Defect trace method for substrate> a method for tracing defects in the substrate 8 will be described. Even if the substrate 8 passes the appearance inspection in the substrate appearance inspection machine 2, a defect of the substrate 8 may be detected in a subsequent inspection (for example, a continuity inspection performed on the substrate 8 that has passed through the reflow furnace). is there.
  • FIG. 7A shows a schematic diagram of the first page of the screen.
  • FIG. 7B shows a schematic diagram of the second page of the screen.
  • the screen 205 displays six frames WA to WC and Wa to Wc in two upper and lower stages.
  • the lower three frames Wa to Wc and the upper three frames WA to WC correspond to the vertical direction, respectively.
  • the image of the mounting coordinates selected by the worker on the first page 205a is displayed in the lower right frame Wc.
  • the variation factor is displayed in the upper right frame WC.
  • “mounting coordinates” horizontal position on the substrate 8
  • “lot ID” slot number of the component 84c
  • “mounting time” time when the component 84c is mounted at the mounting coordinates
  • a circular reference mark Ma is arranged on the part 84a.
  • strip-shaped reference marks Mb and Mc are arranged on the parts 84b and 84c.
  • the board appearance inspection machine 2 mistakenly recognized the outlines of the parts 84b and 84c as the outlines Lb and Lc, and made a pass judgment for the parts 84b and 84c. That is, although the actual mounting position of the components 84b and 84c is shifted to the left with respect to the predetermined mounting coordinates, the board appearance inspection machine 2 performs the predetermined mounting based on the external lines Lb and Lc. It can be seen that it was erroneously determined that the components 84b and 84c were correctly mounted at the coordinates.
  • the actual outline and the outline La of the component 84a coincide with each other, and the actual outline and the outlines Lb and Lc of the components 84b and 84c are misaligned.
  • the marks Ma, Mb, and Mc are in the shape.
  • the shape of the reference marks Ma, Mb, and Mc was changed from a circular shape to a belt shape because the lot number is “Rot B-1” (part 84a). Rot D-3 "(parts 84b and 84c) is found to have been changed.
  • substrate visual inspection machine 2 and data storage method of this embodiment is demonstrated.
  • the variation factor and the image of the substrate 8 (mounting coordinates) are stored in the storage unit 202b in a state of being associated with each other. For this reason, when a defect of an arbitrary substrate 8 is detected, it is easy to identify a variation factor that can cause the detected defect by referring to the data in the storage unit 202b.
  • the traceability of the cause of the defect of the substrate 8 is enhanced.
  • the storage unit 202b stores images of all the substrates 8 to be produced.
  • the processing device has received processing from at least one time point immediately before and after the occurrence of the fluctuation factor.
  • the image of the substrate 8 is stored in the storage unit 202b in association with the variation factor. For this reason, the image of the board
  • the board appearance inspection machine 2 of this embodiment includes a screen 205.
  • the screen 205 receives processing from the processing device (solder printer 3, electronic component mounting machine 5) at least at one of the fluctuation factor stored in the storage unit 202b and immediately before and after the occurrence of the fluctuation factor.
  • the image of the substrate 8 is displayed in an associated state. For this reason, the operator can compare the variation factor with the image of the substrate 8. Therefore, it becomes easy to visually recognize the fluctuation factors that may cause the detected defect.
  • the screen 205 not only an image of the mounting coordinates of the board 8 in which a defect is detected but also an image of the same mounting coordinates of another board 8 can be displayed. That is, the time series change of the same mounting coordinates on different substrates 8 can be visually recognized. For this reason, it is possible to recognize from which point the probability that a defect occurs in the substrate 8 has increased.
  • FIG. 8 the schematic diagram of the 1st page of the screen of the board
  • part corresponding to Fig.7 (a) and FIG.7 (b) it shows with the same code
  • the image of the substrate 8 and the selection list frame w are displayed side by side on the first page 205a of the screen 205. .
  • the selection list frame w the mounting coordinates that are rejected in the board appearance inspection machine 2 are displayed.
  • the frames wc and wd of the image of the substrate 8 correspond to the frames wc and wd of the selection list frame w.
  • the actual outline of the component 84c in the frame wc matches the outline Lc of the component 84c recognized by the board appearance inspection machine 2.
  • the outline Lc (actual outline of the component 84c) is shifted to the left side with respect to the normal outline lc (dotted line) indicating the correct mounting coordinates.
  • the actual outline of the component 84d is inclined with respect to the normal outline.
  • an image of the substrate 8 was acquired by the substrate appearance inspection machine 2.
  • an image of the substrate 8 may be acquired by the solder printing inspection machine 4 and the electronic component mounting machine 5.
  • an image acquired for purposes other than inspection for example, an image acquired by the electronic component mounting machine 5 for mounting the component 84 on the substrate 8) may be diverted to a substrate inspection system and a data storage method. .
  • the image of the substrate 8 is stored in the storage unit 202b of the substrate appearance inspection machine 2.
  • the image of the substrate 8 may be stored in the storage unit of the solder printer 3, the storage unit of the solder printing inspection machine 4, the storage unit of the electronic component mounting machine 5, and the storage unit 602b of the line management device 6.
  • the image of the substrate 8 may be stored in a storage unit outside the production line 1.
  • the variation factor is stored in the storage unit 602b of the line management device 6.
  • the variation factor may be stored in another storage unit as listed above.
  • the screen 205 is switched between the first page 205a and the second page 205b.
  • the page 205a and the second page 205b may be displayed side by side.
  • the board appearance inspection machine 2 is the board inspection system of the present invention, but the solder printing inspection machine 4 may be the board inspection system of the present invention. Further, the substrate inspection system may be arranged outside the production line 1.
  • CMOS Complementary Metal-Oxide Semiconductor
  • ⁇ ⁇ Immediately before the occurrence of a fluctuation factor refers to any point in time, for example, one hour before the occurrence of the fluctuation factor.
  • “immediately after the occurrence of a variation factor” refers to any point in time that is included, for example, one hour after the occurrence of the variation factor.
  • variable factors There are no particular limitations on the type of variable factor. All of the factors that can cause defects in the substrate 8 are fluctuation factors. A plurality of variation factors may occur with respect to arbitrary mounting coordinates of the substrate 8. In this case, a plurality of variation factors may be stored in association with the mounting coordinates. Further, the plurality of variation factors may be generated by a single processing apparatus or may be generated by a plurality of processing apparatuses.
  • the variation factor may be an event name such as “supplement of solder S” or “supplement of part 84”, for example. Further, a numerical value such as “amount of deviation of the reference mark 83” or “amount of deviation of the solder portion 82” may be used.
  • typical variation factors will be exemplified.
  • solder printer 3 (Variation factors related to solder printer 3) As shown in FIG. 5, when the solder printer 3 is replenished with solder S, the permeability of the solder S to the through-hole 332a of the screen mask 332 may change before and after replenishment. For this reason, “supplement of solder S” is included in the fluctuation factors.
  • the mounting of the component 84 on the substrate 8 may be performed based on the position of the solder portion 82.
  • the position of the solder part 82 usually coincides with the position of the land part 800. For this reason, when the solder part 82 is printed out of alignment with the land part 800, there is a possibility that the component 84 cannot be mounted on the solder part 82. Therefore, the “deviation amount of the solder part 82 (lateral deviation amount, longitudinal deviation amount)” is included in the variation factor.
  • the deviation amount of the solder part 82 is confirmed for each solder part 82 by the imaging device 404 imaging each solder part 82.
  • the mounting of the component 84 on the substrate 8 may be performed based on the position of the solder portion 82, specifically, the position of the graphic center of gravity of the solder portion 82.
  • the position of the graphic centroid of the solder portion 82 usually coincides with the position of the graphic centroid of the land portion 800. For this reason, if there is a defect in the printed shape of the solder portion 82 (for example, “chip”, “smudge”, etc.), there is a possibility that the component 84 cannot be mounted on the solder portion 82. Therefore, “a defect in the printed shape of the solder portion 82” is included in the variation factor. The defect of the printing shape of the solder part 82 is confirmed for each solder part 82 by the imaging device 404 imaging each solder part 82.
  • variable factors related to the electronic component mounting machine 5 When the electronic component mounting machine 5 is replenished with parts, the appearance may change before and after replenishment even though the parts have the same electrical characteristics. For this reason, “supplement of components 84” (in the case of the electronic component mounting machine 5 shown in FIG. 3, replacement of the tape 530 and connection (splicing) of the tape 530, and in the case of the electronic component mounting machine 5 shown in FIG. Exchange) is included in the variable factors.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Operations Research (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • General Factory Administration (AREA)

Abstract

The invention addresses the problem of providing a substrate inspection system and a data storage method that have a high ability to trace a cause of a substrate defect. The substrate inspection system (2) inspects a substrate (8) in a production line (1) that has a processing device (3, 5) that performs a specified process on the substrate (8). Said substrate inspection system (2) is provided with a storage unit (202b) that, if a variation factor occurs that could be a cause of a defect in the substrate (8) in the processing device (3, 5), stores the variation factor in association with an image of the substrate (8), which has undergone a process from the processing device, said variation factor and image being stored directly before and/or directly after the occurrence of the variation factor.

Description

基板検査システムおよびデータ記憶方法Substrate inspection system and data storage method
　本発明は、基板を検査する基板検査システムおよび基板の画像を記憶する際に用いられるデータ記憶方法に関する。 The present invention relates to a substrate inspection system for inspecting a substrate and a data storage method used for storing an image of the substrate.
　特許文献１には、基板の不良の発生原因を特定するために用いられる不良要因分析システムが開示されている。例えば、リフロー後の基板において浮き不良（部品の電極がはんだ部から浮いてしまい、電極とはんだ部との電気的接合に、不具合が生じる不良）が検知されると、不良要因分析システムの原因分析機能は、当該基板の部品実装工程における画像を、照合画像情報から読み込む。原因分析機能は、はんだにじみ判定機能を用いて、基板の画像からはんだにじみの有無を判別する。はんだにじみ有りの場合、原因分析機能は、浮き不良の原因を、はんだ印刷工程における、はんだペースト量の過多であると判別する。 Patent Document 1 discloses a failure factor analysis system that is used to identify the cause of a substrate failure. For example, if a floating defect is detected in the substrate after reflow (a defect in which the electrode of the component floats from the solder part and a failure occurs in the electrical connection between the electrode and the solder part), the cause analysis of the failure factor analysis system The function reads an image in the component mounting process of the board from the collation image information. The cause analysis function uses the solder blur determination function to determine the presence or absence of solder blur from the board image. When there is solder bleeding, the cause analysis function determines that the cause of the floating defect is an excessive amount of solder paste in the solder printing process.
２００６－３２４４２４号公報2006-324424
　しかしながら、同文献記載の不良要因分析システムの場合、不良が発覚した時点において、不良が発生した時点における基板の状況を、確認することができない。このため、不良が発覚した基板の外観だけを頼りに、不良原因を追跡しなければならない。したがって、不良原因を特定するのに時間がかかる。 However, in the case of the failure factor analysis system described in the same document, when the failure is detected, the state of the substrate when the failure occurs cannot be confirmed. For this reason, it is necessary to trace the cause of the failure by relying only on the appearance of the substrate on which the failure is detected. Therefore, it takes time to identify the cause of the failure.
　本発明の基板検査システムおよびデータ記憶方法は、上記課題に鑑みて完成されたものである。本発明は、基板の不良原因のトレース性が高い基板検査システムおよびデータ記憶方法を提供することを目的とする。 The substrate inspection system and data storage method of the present invention have been completed in view of the above problems. It is an object of the present invention to provide a substrate inspection system and a data storage method that have high traceability as a cause of substrate defects.
　（１）上記課題を解決するため、本発明の基板検査システムは、基板に所定の処理を行う処理装置を有する生産ラインの、該基板を検査する基板検査システムであって、前記処理装置において前記基板の不良の原因となりうる変動要因が発生した場合、該変動要因と、該変動要因の発生直前および発生直後のうち少なくとも一方の時点に該処理装置から処理を受けた該基板の画像と、を関連付けて記憶する記憶部を備えることを特徴とする。 (1) In order to solve the above-mentioned problems, a substrate inspection system of the present invention is a substrate inspection system for inspecting a substrate in a production line having a processing apparatus that performs a predetermined process on the substrate. When a variation factor that may cause a substrate defect occurs, the variation factor and an image of the substrate that has been processed from the processing apparatus at least one time point immediately before and immediately after the occurrence of the variation factor, A storage unit that stores the information in association is provided.
　ここで、「基板の画像」には、基板自体の画像は勿論、基板上の配置物（例えば、配線パターン、ランド部、はんだ部、電子部品、電子部品位置決め用の基準マーク、基板特定用のＩＤ部など）の画像も含まれる。 Here, in the “substrate image”, not only the image of the substrate itself but also the arrangement on the substrate (for example, the wiring pattern, the land portion, the solder portion, the electronic component, the reference mark for positioning the electronic component, the substrate identifying pin ID images) are also included.
　本発明の基板検査システムによると、変動要因と、基板の画像と、が関連付けられた状態で、記憶部に蓄積される。このため、任意の基板の不良が発覚した場合、記憶部のデータを参照することにより、発覚した不良の原因になりうる変動要因を特定しやすくなる。このように、本発明の基板検査システムによると、基板の不良原因のトレース性が高くなる。 According to the substrate inspection system of the present invention, the variation factor and the image of the substrate are stored in the storage unit in a state of being associated with each other. For this reason, when a defect of an arbitrary substrate is detected, it is easy to identify a variation factor that may cause the detected defect by referring to data in the storage unit. Thus, according to the substrate inspection system of the present invention, the traceability of the cause of the substrate failure is enhanced.
　（２）好ましくは、上記（１）の構成において、前記記憶部は、前記変動要因が発生した場合に限って、前記基板の前記画像を記憶する構成とする方がよい。本構成によると、記憶部は、生産される全基板の画像のうち、一部の基板の画像だけを、選択的に記憶する。すなわち、任意の処理装置に変動要因が発生した場合、当該変動要因の発生直前および発生直後のうち少なくとも一方の時点に当該処理装置から処理を受けた基板の画像だけを、当該変動要因と関連付けて、記憶部が記憶する。このため、記憶部に蓄積されるデータの容量が小さくなる。また、データの容量が小さいため、基板の不良が発覚した場合、変動要因を特定しやすくなる。 (2) Preferably, in the configuration of (1) above, the storage unit may store the image of the substrate only when the variation factor occurs. According to this structure, a memory | storage part selectively memorize | stores only the image of a one part board | substrate among the images of all the boards produced. That is, when a variation factor occurs in an arbitrary processing apparatus, only an image of a substrate that has been processed from the processing apparatus at least one time immediately before and after the occurrence of the variation factor is associated with the variation factor. The storage unit stores it. For this reason, the capacity | capacitance of the data accumulate | stored in a memory | storage part becomes small. In addition, since the data volume is small, it is easy to identify the variation factor when a substrate defect is detected.
　（３）好ましくは、上記（１）の構成において、前記記憶部は、全ての前記基板の前記画像を記憶し、前記変動要因が発生した場合に限って、該変動要因と、該変動要因の発生直前および発生直後のうち少なくとも一方の時点に前記処理装置から処理を受けた該基板の該画像と、を関連付けて記憶する構成とする方がよい。 (3) Preferably, in the configuration of (1) above, the storage unit stores the images of all the substrates, and the variation factor and the variation factor only when the variation factor occurs. It is preferable that the image of the substrate that has undergone processing from the processing apparatus is stored in association with at least one of the time immediately before the occurrence and immediately after the occurrence.
　本構成によると、記憶部は、生産される全基板の画像を記憶する。そして、任意の処理装置に変動要因が発生した場合、当該変動要因の発生直前および発生直後のうち少なくとも一方の時点に当該処理装置から処理を受けた基板の画像を、当該変動要因と関連付けて、記憶部が記憶する。このため、変動要因の発生の有無によらず、基板の画像を蓄積することができる。 に よ る According to this configuration, the storage unit stores images of all the boards that are produced. Then, when a variation factor occurs in an arbitrary processing apparatus, an image of a substrate that has been processed from the processing apparatus at least one time immediately before and after the occurrence of the variation factor is associated with the variation factor, The storage unit stores it. For this reason, it is possible to store the image of the substrate regardless of the occurrence of the variation factor.
　（４）好ましくは、上記（１）ないし（３）のいずれかの構成において、さらに、前記記憶部に記憶された、前記変動要因と、該変動要因の発生直前および発生直後のうち少なくとも一方の時点に前記処理装置から処理を受けた前記基板の前記画像と、を関連付けて表示する表示部を備える構成とする方がよい。本構成によると、表示部を用いて、作業者が、変動要因と基板の画像とを見比べることができる。このため、発覚した不良の原因になりうる変動要因を視認しやすくなる。 (4) Preferably, in any one of the configurations (1) to (3), at least one of the variation factor stored in the storage unit and immediately before and immediately after the occurrence of the variation factor is stored. It is better to have a configuration that includes a display unit that displays the image of the substrate that has been processed from the processing apparatus at a point in time. According to this configuration, the operator can compare the variation factor with the image of the substrate using the display unit. For this reason, it becomes easy to visually recognize the fluctuation factors that may cause the detected defect.
　（５）上記課題を解決するため、本発明のデータ記憶方法は、基板に所定の処理を行う処理装置を有する生産ラインの該処理装置において該基板の不良の原因となりうる変動要因が発生した場合、該変動要因と、該変動要因の発生直前および発生直後のうち少なくとも一方の時点に該処理装置から処理を受けた該基板の画像と、を関連付けて記憶する関連付け記憶ステップを実行することを特徴とする。上記（１）の構成と同様に、本発明のデータ記憶方法によると、基板の不良原因のトレース性が高くなる。 (5) In order to solve the above-described problem, the data storage method of the present invention is a case where a variation factor that may cause a defect of the substrate occurs in the processing apparatus of a production line having a processing apparatus that performs predetermined processing on the substrate. And executing an association storing step of associating and storing the variation factor and the image of the substrate that has been processed from the processing apparatus at least one time point immediately before and after the occurrence of the variation factor. And Similar to the configuration (1) above, according to the data storage method of the present invention, the traceability of the cause of the substrate failure is enhanced.
　（６）好ましくは、上記（５）の構成において、前記変動要因が発生した場合に限って、前記基板の前記画像を記憶する構成とする方がよい。上記（２）の構成と同様に、本構成によると、記憶されるデータの容量が小さくなる。また、データの容量が小さいため、基板の不良が発覚した場合、変動要因を特定しやすくなる。 (6) Preferably, in the configuration of (5) above, it is better to store the image of the substrate only when the variation factor occurs. Similar to the configuration (2), according to this configuration, the capacity of stored data is reduced. In addition, since the data volume is small, it is easy to identify the variation factor when a substrate defect is detected.
　（７）好ましくは、上記（５）の構成において、全ての前記基板の前記画像を記憶する記憶ステップを有し、前記変動要因が発生した場合に限って、該記憶ステップに割り込んで、前記関連付け記憶ステップを実行する構成とする方がよい。 (7) Preferably, in the configuration of (5), a storage step for storing the images of all the substrates is provided, and the storage step is interrupted only when the variation factor occurs and the association is performed. It is better to have a configuration for executing the storing step.
　本構成によると、実行中の記憶ステップに対して、関連付け記憶ステップが、割り込んで実行される。すなわち、記憶ステップにおいて、生産される基板の画像を記憶している途中で、任意の処理装置に変動要因が発生した場合に、関連付け記憶ステップが実行される。具体的には、当該変動要因の発生直前および発生直後のうち少なくとも一方の時点に当該処理装置から処理を受けた基板の画像が、当該変動要因と関連付けて、記憶される。このため、変動要因の発生の有無によらず、基板の画像を蓄積することができる。 According to this configuration, the association storage step is executed by interrupting the storage step being executed. That is, in the storage step, the association storage step is executed when a variation factor occurs in an arbitrary processing apparatus while the image of the produced substrate is being stored. Specifically, an image of the substrate that has been processed from the processing apparatus at least one time point immediately before and after the occurrence of the variation factor is stored in association with the variation factor. For this reason, it is possible to store the image of the substrate regardless of the occurrence of the variation factor.
　本発明によると、基板の不良原因のトレース性が高い基板検査システムおよびデータ記憶方法を提供することができる。 According to the present invention, it is possible to provide a substrate inspection system and a data storage method that have high traceability as a cause of substrate failure.
図１は、本発明の基板検査システムの一実施形態である基板外観検査機を備える生産ラインのブロック図である。FIG. 1 is a block diagram of a production line including a substrate visual inspection machine that is an embodiment of the substrate inspection system of the present invention. 図２は、同基板外観検査機の上面図である。FIG. 2 is a top view of the substrate appearance inspection machine. 図３は、テープタイプの部品供給装置を備える電子部品実装機の上面図である。FIG. 3 is a top view of an electronic component mounting machine including a tape-type component supply device. 図４は、トレイタイプの部品供給装置を備える電子部品実装機の上面図である。FIG. 4 is a top view of an electronic component mounting machine including a tray-type component supply device. 図５は、はんだ印刷機の右側面図である。FIG. 5 is a right side view of the solder printer. 図６（ａ）は、はんだ印刷前の基板の上面図である。図６（ｂ）は、はんだ印刷後の基板の上面図である。図６（ｃ）は、部品装着後の基板の上面図を示す。FIG. 6A is a top view of the substrate before solder printing. FIG. 6B is a top view of the substrate after solder printing. FIG. 6C shows a top view of the substrate after mounting the components. 図７（ａ）は、画面の第一ページの模式図である。図７（ｂ）は、画面の第二ページの模式図である。FIG. 7A is a schematic diagram of the first page of the screen. FIG. 7B is a schematic diagram of the second page of the screen. 図８は、その他の実施形態の基板外観検査機の画面の第一ページの模式図である。FIG. 8 is a schematic diagram of the first page of the screen of the substrate appearance inspection machine according to another embodiment.
　１：生産ライン、２：基板外観検査機（基板検査システム）、３：はんだ印刷機（処理装置）、４：はんだ印刷検査機、５：電子部品実装機（処理装置）、６：ライン管理装置、８：基板。
　２０：制御部、２１：ベース、２２：基板搬送装置、２３：軸ガイドレール、２４：Ｘ軸スライド、２５：Ｙ軸ガイドレール、２６：Ｙ軸スライド、２７：検査ヘッド、３０：制御部、３１：Ｙ軸ガイドレール、３２：スキージ装置、３３：マスク装置、３４：バックアップ装置、３５：基板搬送装置、４０：制御部、５０：制御部、５１：ベース、５２：モジュール、５３：部品供給装置、５４：部品撮像装置、６０：制御部、８０：配線パターン、８１：ＩＤ部、８２：はんだ部、８３：基準マーク、８４：部品、８４ａ～８４ｄ：部品。
　２００：通信制御回路、２０１：入出力インターフェイス、２０２：コンピュータ、２０２ａ：演算部、２０２ｂ：記憶部、２０３：画像処理装置、２０４：撮像装置、２０５：画面（表示部）、２０５ａ：第一ページ、２０５ｂ：第二ページ、２２０：コンベアベルト、３００：通信制御回路、３０１：入出力インターフェイス、３０２：コンピュータ、３０５：画面、３２０：シリンダ、３２１：スキージ、３３０：フレーム、３３１：メッシュ、３３２：スクリーンマスク、３３２ａ：通孔、３４０：バックアップテーブル、３４１：バックアップピン、３５０：コンベアベルト、３５１：壁部、３５２：クランプ片、４００：通信制御回路、４０１：入出力インターフェイス、４０２：コンピュータ、４０３：画像処理装置、４０４：撮像装置、４０５：画面、５００：通信制御回路、５０１：入出力インターフェイス、５０２：コンピュータ、５０３：画像処理装置、５０４：撮像装置、５０５：画面、５２０：基部、５２１：基板搬送装置、５２１ａ：コンベアベルト、５２２：Ｘ軸ガイドレール、５２３：Ｘ軸スライド、５２４：Ｙ軸ガイドレール、５２５：Ｙ軸スライド、５２６：装着ヘッド、５２６ａ：吸着ノズル、５３０：テープ、５３１：トレイ、５３２：コンベア、５３３：ケース、６００：通信制御回路、６０１：入出力インターフェイス、６０２：コンピュータ、６０２ａ：演算部、６０２ｂ：記憶部、６０５：画面、８００：ランド部。 1: production line, 2: substrate appearance inspection machine (board inspection system), 3: solder printing machine (processing device), 4: solder printing inspection machine, 5: electronic component mounting machine (processing device), 6: line management device , 8: substrate.
20: control unit, 21: base, 22: substrate transfer device, 23: axis guide rail, 24: X axis slide, 25: Y axis guide rail, 26: Y axis slide, 27: inspection head, 30: control unit, 31: Y-axis guide rail, 32: Squeegee device, 33: Mask device, 34: Backup device, 35: Substrate transport device, 40: Control unit, 50: Control unit, 51: Base, 52: Module, 53: Component supply Device: 54: component imaging device, 60: control unit, 80: wiring pattern, 81: ID unit, 82: solder unit, 83: reference mark, 84: component, 84a to 84d: component.
200: communication control circuit 201: input / output interface 202: computer 202a: arithmetic unit 202b: storage unit 203: image processing device 204: imaging device 205: screen (display unit) 205a: first page 205b: second page, 220: conveyor belt, 300: communication control circuit, 301: input / output interface, 302: computer, 305: screen, 320: cylinder, 321: squeegee, 330: frame, 331: mesh, 332: Screen mask, 332a: through hole, 340: backup table, 341: backup pin, 350: conveyor belt, 351: wall, 352: clamp piece, 400: communication control circuit, 401: input / output interface, 402: computer, 403 : Image processing apparatus 404 Imaging device, 405: Screen, 500: Communication control circuit, 501: Input / output interface, 502: Computer, 503: Image processing device, 504: Imaging device, 505: Screen, 520: Base, 521: Substrate transfer device, 521a: Conveyor belt, 522: X axis guide rail, 523: X axis slide, 524: Y axis guide rail, 525: Y axis slide, 526: Mounting head, 526a: Suction nozzle, 530: Tape, 531: Tray, 532: Conveyor 533: Case, 600: Communication control circuit, 601: Input / output interface, 602: Computer, 602a: Calculation unit, 602b: Storage unit, 605: Screen, 800: Land unit.
　以下、本発明の基板検査システムおよびデータ記憶方法の実施の形態について説明する。なお、以下に示す実施形態においては、本発明の基板検査システムを、基板外観検査機として具現化している。 Hereinafter, embodiments of the substrate inspection system and the data storage method of the present invention will be described. In the embodiment described below, the substrate inspection system of the present invention is embodied as a substrate appearance inspection machine.
　＜生産ラインの構成＞
　まず、本実施形態の基板外観検査機を備える生産ラインの構成について説明する。図１に、本実施形態の基板外観検査機を備える生産ラインのブロック図を示す。図１に示すように、生産ライン１は、上流側から下流側に向かって、はんだ印刷機３と、はんだ印刷検査機４と、五台の電子部品実装機５と、基板外観検査機２と、リフロー炉（図略）と、を備えている。はんだ印刷機３、電子部品実装機５は、各々、本発明の「処理装置」の概念に含まれる。また、生産ライン１は、これらの装置を管理するライン管理装置６を備えている。これらの装置は、通信可能に接続されている。 <Production line configuration>
First, the structure of a production line provided with the board | substrate visual inspection machine of this embodiment is demonstrated. In FIG. 1, the block diagram of a production line provided with the board | substrate external appearance inspection machine of this embodiment is shown. As shown in FIG. 1, the production line 1 includes a solder printing machine 3, a solder printing inspection machine 4, five electronic component mounting machines 5, a board appearance inspection machine 2, from the upstream side toward the downstream side. And a reflow furnace (not shown). The solder printer 3 and the electronic component mounting machine 5 are each included in the concept of the “processing device” of the present invention. The production line 1 also includes a line management device 6 that manages these devices. These devices are communicably connected.
　［基板外観検査機２］
　図２に、基板外観検査機の上面図を示す。なお、説明の便宜上、基板８にハッチングを施す。図１、図２に示すように、基板外観検査機２は、制御部２０と、ベース２１と、基板搬送装置２２と、前後一対のＸ軸ガイドレール２３と、Ｘ軸スライド２４と、上下一対のＹ軸ガイドレール２５と、Ｙ軸スライド２６と、検査ヘッド２７と、を備えている。 [Substrate visual inspection machine 2]
FIG. 2 shows a top view of the substrate appearance inspection machine. For convenience of explanation, the substrate 8 is hatched. As shown in FIGS. 1 and 2, the board appearance inspection machine 2 includes a control unit 20, a base 21, a board transport device 22, a pair of front and rear X-axis guide rails 23, an X-axis slide 24, and a pair of upper and lower sides. Y-axis guide rail 25, Y-axis slide 26, and inspection head 27.
　基板搬送装置２２は、ベース２１の上面に配置されている。基板搬送装置２２は、前後一対のコンベアベルト２２０を備えている。基板８は、前後一対のコンベアベルト２２０により、左側（上流側）から右側（下流側）に向かって搬送される。 The substrate transfer device 22 is disposed on the upper surface of the base 21. The substrate transfer device 22 includes a pair of front and rear conveyor belts 220. The substrate 8 is conveyed from the left side (upstream side) to the right side (downstream side) by a pair of front and rear conveyor belts 220.
　前後一対のＸ軸ガイドレール２３は、基板搬送装置２２を前後方向から挟むように、ベース２１の上面に配置されている。Ｘ軸スライド２４は、前後一対のＸ軸ガイドレール２３に、左右方向に摺動可能に取り付けられている。上下一対のＹ軸ガイドレール２５は、Ｘ軸スライド２４に配置されている。Ｙ軸スライド２６は、上下一対のＹ軸ガイドレール２５に、前後方向に摺動可能に取り付けられている。検査ヘッド２７は、Ｙ軸スライド２６に、着脱可能に取り付けられている。検査ヘッド２７は、前後左右方向に移動可能である。 The pair of front and rear X-axis guide rails 23 are arranged on the upper surface of the base 21 so as to sandwich the substrate transfer device 22 from the front and rear direction. The X-axis slide 24 is attached to a pair of front and rear X-axis guide rails 23 so as to be slidable in the left-right direction. The pair of upper and lower Y-axis guide rails 25 are disposed on the X-axis slide 24. The Y-axis slide 26 is attached to a pair of upper and lower Y-axis guide rails 25 so as to be slidable in the front-rear direction. The inspection head 27 is detachably attached to the Y-axis slide 26. The inspection head 27 is movable in the front-rear and left-right directions.
　制御部２０は、通信制御回路２００と、入出力インターフェイス２０１と、コンピュータ２０２と、画像処理装置２０３と、撮像装置２０４と、画面２０５と、を備えている。画面２０５は、本発明の「表示部」の概念に含まれる。入出力インターフェイス２０１は、通信制御回路２００、コンピュータ２０２、画像処理装置２０３、画面２０５に接続されている。通信制御回路２００は、生産ライン１を構成する他の装置に接続されている。コンピュータ２０２は、演算部２０２ａと、記憶部２０２ｂと、を備えている。画像処理装置２０３は、撮像装置２０４に接続されている。撮像装置２０４は、検査ヘッド２７の下面に配置されている。撮像装置２０４は、ＣＣＤ（Ｃｈａｒｇｅ－Ｃｏｕｐｌｅｄ　Ｄｅｖｉｃｅ）カメラである。撮像装置２０４は、基板８の上面を撮像可能である。画面２０５には、タッチ式のボタン（入力装置）を表示することができる。 The control unit 20 includes a communication control circuit 200, an input / output interface 201, a computer 202, an image processing device 203, an imaging device 204, and a screen 205. The screen 205 is included in the concept of the “display unit” of the present invention. The input / output interface 201 is connected to the communication control circuit 200, the computer 202, the image processing device 203, and the screen 205. The communication control circuit 200 is connected to other devices constituting the production line 1. The computer 202 includes a calculation unit 202a and a storage unit 202b. The image processing device 203 is connected to the imaging device 204. The imaging device 204 is disposed on the lower surface of the inspection head 27. The imaging device 204 is a CCD (Charge-Coupled Device) camera. The imaging device 204 can image the upper surface of the substrate 8. A touch-type button (input device) can be displayed on the screen 205.
　［電子部品実装機５］
　五台の電子部品実装機５のうち、三台の電子部品実装機５には、テープタイプの部品供給装置が配置されている。また、二台の電子部品実装機５には、トレイタイプの部品供給装置が配置されている。 [Electronic component mounting machine 5]
Of the five electronic component mounting machines 5, three electronic component mounting machines 5 are provided with tape-type component supply devices. The two electronic component mounters 5 are provided with tray type component supply devices.
　図３に、テープタイプの部品供給装置を備える電子部品実装機の上面図を示す。なお、説明の便宜上、基板８にハッチングを施す。図１、図３に示すように、電子部品実装機５は、制御部５０と、ベース５１と、モジュール５２と、部品供給装置５３と、部品撮像装置５４と、を備えている。 FIG. 3 shows a top view of an electronic component mounting machine equipped with a tape-type component supply device. For convenience of explanation, the substrate 8 is hatched. As shown in FIGS. 1 and 3, the electronic component mounting machine 5 includes a control unit 50, a base 51, a module 52, a component supply device 53, and a component imaging device 54.
　モジュール５２は、基部５２０と、基板搬送装置５２１と、上下一対のＸ軸ガイドレール５２２と、Ｘ軸スライド５２３と、左右一対のＹ軸ガイドレール５２４と、Ｙ軸スライド５２５と、装着ヘッド５２６と、を備えている。モジュール５２は、ベース５１に、着脱可能に取り付けられている。 The module 52 includes a base 520, a substrate transfer device 521, a pair of upper and lower X-axis guide rails 522, an X-axis slide 523, a pair of left and right Y-axis guide rails 524, a Y-axis slide 525, and a mounting head 526. It is equipped with. The module 52 is detachably attached to the base 51.
　基部５２０は、ベース５１の上面に配置されている。基板搬送装置５２１は、基部５２０の上面に配置されている。基板搬送装置５２１は、前後一対のコンベアベルト５２１ａを備えている。基板８は、前後一対のコンベアベルト５２１ａにより、左側から右側に向かって搬送される。 The base 520 is disposed on the upper surface of the base 51. The substrate transfer device 521 is disposed on the upper surface of the base 520. The substrate transfer device 521 includes a pair of front and rear conveyor belts 521a. The substrate 8 is conveyed from the left side to the right side by a pair of front and rear conveyor belts 521a.
　左右一対のＹ軸ガイドレール５２４は、モジュール５２のハウジング（図略）の上壁下面に配置されている。Ｙ軸スライド５２５は、左右一対のＹ軸ガイドレール５２４に、前後方向に摺動可能に取り付けられている。上下一対のＸ軸ガイドレール５２２は、Ｙ軸スライド５２５に配置されている。Ｘ軸スライド５２３は、上下一対のＸ軸ガイドレール５２２に、左右方向に摺動可能に取り付けられている。装着ヘッド５２６は、Ｘ軸スライド５２３に、着脱可能に取り付けられている。装着ヘッド５２６は、前後左右方向に移動可能である。装着ヘッド５２６は、吸着ノズル５２６ａを備えている。吸着ノズル５２６ａは、装着ヘッド５２６の下面に、着脱可能に取り付けられている。 The pair of left and right Y-axis guide rails 524 are disposed on the lower surface of the upper wall of the housing (not shown) of the module 52. The Y-axis slide 525 is attached to a pair of left and right Y-axis guide rails 524 so as to be slidable in the front-rear direction. The pair of upper and lower X-axis guide rails 522 is disposed on the Y-axis slide 525. The X-axis slide 523 is attached to a pair of upper and lower X-axis guide rails 522 so as to be slidable in the left-right direction. The mounting head 526 is detachably attached to the X-axis slide 523. The mounting head 526 is movable in the front-rear and left-right directions. The mounting head 526 includes a suction nozzle 526a. The suction nozzle 526a is detachably attached to the lower surface of the mounting head 526.
　部品供給装置５３は、モジュール５２の前方に配置されている。部品供給装置５３は、多数のテープ５３０を備えている。任意の単一のテープ５３０には、同じ種類の複数の部品が収容されている。 The component supply device 53 is disposed in front of the module 52. The component supply device 53 includes a large number of tapes 530. An arbitrary single tape 530 contains a plurality of parts of the same type.
　部品撮像装置５４は、モジュール５２と部品供給装置５３との間に配置されている。部品撮像装置５４は、ＣＣＤカメラである。部品は、吸着ノズル５２６ａにより、テープ５３０から取り出され、基板８の所定の装着座標に装着される。この際、吸着ノズル５２６ａに吸着された部品は、部品撮像装置５４の上方（撮像エリア）を通過する。 The component imaging device 54 is disposed between the module 52 and the component supply device 53. The component imaging device 54 is a CCD camera. The component is taken out from the tape 530 by the suction nozzle 526a and mounted at predetermined mounting coordinates of the substrate 8. At this time, the component sucked by the suction nozzle 526a passes above the component imaging device 54 (imaging area).
　制御部５０は、通信制御回路５００と、入出力インターフェイス５０１と、コンピュータ５０２と、画像処理装置５０３と、撮像装置５０４と、画面５０５と、を備えている。制御部５０の構成は、基板外観検査機２の制御部２０の構成と、同様である。撮像装置５０４は、装着ヘッド５２６に配置されている。撮像装置５０４は、ＣＣＤカメラである。撮像装置５０４は、基板８の上面を撮像可能である。画面５０５には、タッチ式のボタンを表示することができる。 The control unit 50 includes a communication control circuit 500, an input / output interface 501, a computer 502, an image processing device 503, an imaging device 504, and a screen 505. The configuration of the control unit 50 is the same as the configuration of the control unit 20 of the board appearance inspection machine 2. The imaging device 504 is disposed on the mounting head 526. The imaging device 504 is a CCD camera. The imaging device 504 can image the upper surface of the substrate 8. A touch-type button can be displayed on the screen 505.
　図４に、トレイタイプの部品供給装置を備える電子部品実装機の上面図を示す。なお、図３と対応する部位については同じ符号で示す。図３に示す電子部品実装機５がテープタイプの部品供給装置５３を備えているのに対して、図４に示す電子部品実装機５はトレイタイプの部品供給装置５３を備えている。 FIG. 4 shows a top view of an electronic component mounter equipped with a tray-type component supply device. In addition, about the site | part corresponding to FIG. 3, it shows with the same code | symbol. The electronic component mounting machine 5 shown in FIG. 3 includes a tape-type component supply device 53, whereas the electronic component mounting machine 5 illustrated in FIG. 4 includes a tray-type component supply device 53.
　部品供給装置５３は、トレイ５３１と、コンベア５３２と、ケース５３３と、を備えている。ケース５３３には、複数のトレイ５３１が収容されている。コンベア５３２は、ケース５３３内からケース５３３外に、部品の供給に必要なトレイ５３１を搬出する。搬出されたトレイ５３１の部品は、吸着ノズル５２６ａにより、トレイ５３１から取り出され、基板８の所定の装着座標に装着される。この際、吸着ノズル５２６ａに吸着された部品は、部品撮像装置５４の上方（撮像エリア）を通過する。 The component supply device 53 includes a tray 531, a conveyor 532, and a case 533. A plurality of trays 531 are accommodated in the case 533. The conveyor 532 carries out the tray 531 necessary for supplying components from the case 533 to the outside of the case 533. The components of the tray 531 that have been carried out are taken out of the tray 531 by the suction nozzle 526a and mounted at predetermined mounting coordinates of the substrate 8. At this time, the component sucked by the suction nozzle 526a passes above the component imaging device 54 (imaging area).
　［はんだ印刷検査機４］
　はんだ印刷検査機４の構成は、図２に示す基板外観検査機２と同様である。図１に示すように、はんだ印刷検査機４は、制御部４０を備えている。制御部４０は、通信制御回路４００と、入出力インターフェイス４０１と、コンピュータ４０２と、画像処理装置４０３と、撮像装置４０４と、画面４０５と、を備えている。撮像装置４０４は、ＣＣＤカメラである。撮像装置４０４は、基板８の上面を撮像可能である。 [Solder printing inspection machine 4]
The configuration of the solder printing inspection machine 4 is the same as that of the board appearance inspection machine 2 shown in FIG. As shown in FIG. 1, the solder printing inspection machine 4 includes a control unit 40. The control unit 40 includes a communication control circuit 400, an input / output interface 401, a computer 402, an image processing device 403, an imaging device 404, and a screen 405. The imaging device 404 is a CCD camera. The imaging device 404 can image the upper surface of the substrate 8.
　［はんだ印刷機３］
　図５に、はんだ印刷機の右側面図を示す。図１、図５に示すように、はんだ印刷機３は、制御部３０と、Ｙ軸ガイドレール３１と、スキージ装置３２と、マスク装置３３と、バックアップ装置３４と、基板搬送装置３５と、を備えている。 [Solder printer 3]
FIG. 5 shows a right side view of the solder printer. As shown in FIGS. 1 and 5, the solder printer 3 includes a control unit 30, a Y-axis guide rail 31, a squeegee device 32, a mask device 33, a backup device 34, and a substrate transport device 35. I have.
　バックアップ装置３４は、バックアップテーブル３４０と、複数のバックアップピン３４１と、を備えている。バックアップテーブル３４０は、上下方向に移動可能である。複数のバックアップピン３４１は、バックアップテーブル３４０の上面に配置されている。 The backup device 34 includes a backup table 340 and a plurality of backup pins 341. The backup table 340 is movable in the vertical direction. The plurality of backup pins 341 are arranged on the upper surface of the backup table 340.
　基板搬送装置３５は、前後一対のコンベアベルト３５０と、前後一対の壁部３５１と、前後一対のクランプ片３５２と、を備えている。前後一対のコンベアベルト３５０は、前後一対の壁部３５１に、互いに対向して配置されている。基板８は、前後一対のコンベアベルト３５０により、左側から右側に向かって搬送される。前後一対のクランプ片３５２は、前後一対の壁部３５１の上端に配置されている。はんだ印刷の際、基板８は、前後一対のクランプ片３５２により、前後方向から挟持される。また、基板８は、バックアップピン３４１により、下方から支持される。 The substrate transfer device 35 includes a pair of front and rear conveyor belts 350, a pair of front and rear walls 351, and a pair of front and rear clamp pieces 352. The pair of front and rear conveyor belts 350 are disposed on the pair of front and rear wall portions 351 so as to face each other. The substrate 8 is conveyed from the left side to the right side by a pair of front and rear conveyor belts 350. The pair of front and rear clamp pieces 352 are disposed at the upper ends of the pair of front and rear wall portions 351. At the time of solder printing, the substrate 8 is sandwiched by the pair of front and rear clamp pieces 352 from the front-rear direction. The substrate 8 is supported from below by backup pins 341.
　マスク装置３３は、フレーム３３０と、メッシュ３３１と、スクリーンマスク３３２と、を備えている。メッシュ３３１は、フレーム３３０の枠内に配置されている。スクリーンマスク３３２は、メッシュ３３１の枠内に張設されている。スクリーンマスク３３２には、はんだ印刷用の通孔３３２ａが穿設されている。はんだ印刷の際、スクリーンマスク３３２の下面は、基板８の上面に当接している。 The mask device 33 includes a frame 330, a mesh 331, and a screen mask 332. The mesh 331 is disposed within the frame 330. The screen mask 332 is stretched within the frame of the mesh 331. The screen mask 332 has a through hole 332a for solder printing. During solder printing, the lower surface of the screen mask 332 is in contact with the upper surface of the substrate 8.
　スキージ装置３２は、Ｙ軸ガイドレール３１に、前後方向に摺動可能に取り付けられている。スキージ装置３２は、シリンダ３２０と、前後一対のスキージ３２１と、を備えている。前後一対のスキージ３２１は、シリンダ３２０に対して、各々独立して、下降可能である。スキージ３２１がスクリーンマスク３３２の上面を摺動することにより、スクリーンマスク３３２の上面のはんだＳが、通孔３３２ａを介して、基板８の上面に転写される。 The squeegee device 32 is attached to the Y-axis guide rail 31 so as to be slidable in the front-rear direction. The squeegee device 32 includes a cylinder 320 and a pair of front and rear squeegees 321. The pair of front and rear squeegees 321 can be lowered with respect to the cylinder 320 independently. As the squeegee 321 slides on the upper surface of the screen mask 332, the solder S on the upper surface of the screen mask 332 is transferred to the upper surface of the substrate 8 through the through holes 332a.
　制御部３０は、通信制御回路３００と、入出力インターフェイス３０１と、コンピュータ３０２と、画面３０５と、を備えている。 The control unit 30 includes a communication control circuit 300, an input / output interface 301, a computer 302, and a screen 305.
　［ライン管理装置６］
　図１に示すように、ライン管理装置６は、制御部６０を備えている。制御部６０は、通信制御回路６００と、入出力インターフェイス６０１と、コンピュータ６０２と、画面６０５と、を備えている。 [Line management device 6]
As shown in FIG. 1, the line management device 6 includes a control unit 60. The control unit 60 includes a communication control circuit 600, an input / output interface 601, a computer 602, and a screen 605.
　コンピュータ６０２は、演算部６０２ａと記憶部６０２ｂとを備えている。記憶部６０２ｂには、はんだ印刷機３、電子部品実装機５において発生する種々の変動要因が格納されている。これらの変動要因の発生は、後述する関連付け記憶ステップの開始のトリガーになる。 The computer 602 includes a calculation unit 602a and a storage unit 602b. The storage unit 602b stores various fluctuation factors that occur in the solder printer 3 and the electronic component mounter 5. The occurrence of these fluctuation factors triggers the start of an association storage step described later.
　＜データ記憶方法＞
　次に、本実施形態のデータ記憶方法について説明する。図６（ａ）に、はんだ印刷前の基板の上面図を示す。図６（ｂ）に、はんだ印刷後の基板の上面図を示す。図６（ｃ）に、部品装着後の基板の上面図を示す。 <Data storage method>
Next, the data storage method of this embodiment will be described. FIG. 6A shows a top view of the substrate before solder printing. FIG. 6B shows a top view of the substrate after solder printing. FIG. 6C shows a top view of the substrate after mounting the components.
　図６（ａ）に示すように、はんだ印刷前の基板８には、配線パターン８０とＩＤ部８１とが配置されている。基板８の生産においては、まず、図６（ｂ）に示すように、図５に示すはんだ印刷機３により、基板８にはんだＳが転写される。すなわち、配線パターン８０のランド部８００に、はんだ部８２が形成される。また、基板８の対角位置に、一対の基準マーク８３が形成される。次に、図６（ｃ）に示すように、図３、図４に示す五台の電子部品実装機５により、はんだ部８２に部品８４が装着される。 As shown in FIG. 6A, a wiring pattern 80 and an ID portion 81 are arranged on the substrate 8 before solder printing. In the production of the board 8, first, as shown in FIG. 6B, the solder S is transferred to the board 8 by the solder printer 3 shown in FIG. That is, the solder portion 82 is formed on the land portion 800 of the wiring pattern 80. In addition, a pair of reference marks 83 are formed at diagonal positions on the substrate 8. Next, as shown in FIG. 6C, the component 84 is mounted on the solder portion 82 by the five electronic component mounting machines 5 shown in FIGS. 3 and 4.
　これらの生産過程においては、基板８の不良の原因となりうる、種々の変動要因が発生する。以下、図３に示す電子部品実装機５において、変動要因として、「部品のロット変更」が確認された場合について例示する。具体的には、部品供給装置５３において、装着により部品が無くなったテープを、当該テープとロットナンバーが異なる新しいテープに、交換する場合について例示する。本実施形態のデータ記憶方法は、記憶ステップと、関連付け記憶ステップと、を有している。 In these production processes, various fluctuating factors that may cause defects in the substrate 8 occur. Hereinafter, in the electronic component mounting machine 5 shown in FIG. 3, a case where “part lot change” is confirmed as a variation factor will be exemplified. Specifically, an example will be described in which, in the component supply device 53, a tape whose components have been removed due to mounting is replaced with a new tape having a lot number different from that of the tape. The data storage method of this embodiment has a storage step and an association storage step.
　［記憶ステップ］
　本ステップにおいては、図１に示す基板外観検査機２が、生産ライン１を流れる全ての基板８の画像を、記憶部２０２ｂに格納する。任意の基板８が基板外観検査機２に搬入されると、基板外観検査機２の撮像装置２０４が、基板８の全ての装着座標の画像を、順番に撮像する。撮像された画像は、画像処理装置２０３により画像処理され、記憶部２０２ｂに格納される。 [Memory step]
In this step, the board appearance inspection machine 2 shown in FIG. 1 stores images of all the boards 8 flowing through the production line 1 in the storage unit 202b. When an arbitrary board 8 is carried into the board appearance inspection machine 2, the imaging device 204 of the board appearance inspection machine 2 takes images of all the mounting coordinates of the board 8 in order. The captured image is subjected to image processing by the image processing device 203 and stored in the storage unit 202b.
　図３に示す電子部品実装機５において、装着により部品が無くなったテープが、新しいテープに、交換されると（ロット変更が行われると）、図１に示すライン管理装置６の演算部６０２ａは、記憶部６０２ｂに格納されている変動要因の一つである、「部品のロット変更」が行われたと判別する。ライン管理装置６は、基板外観検査機２に、関連付け記憶ステップの実行を指示する。 In the electronic component mounting machine 5 shown in FIG. 3, when a tape whose components have been removed by mounting is replaced with a new tape (when a lot change is performed), the arithmetic unit 602 a of the line management device 6 shown in FIG. Then, it is determined that “part lot change”, which is one of the fluctuation factors stored in the storage unit 602b, has been performed. The line management device 6 instructs the board appearance inspection machine 2 to execute the association storage step.
　［関連付け記憶ステップ］
　本ステップは、記憶ステップにおいて変動要因が発生した場合に限って、実行される。本ステップにおいては、図１に示す基板外観検査機２が、ロット変更という変動要因と、基板８の画像と、を関連付けて記憶部２０２ｂに格納する。 [Association storage step]
This step is executed only when a variation factor occurs in the storing step. In this step, the board appearance inspection machine 2 shown in FIG. 1 associates the fluctuation factor of lot change with the image of the board 8 and stores them in the storage unit 202b.
　以下、ロット変更直前（例えば、ロット変更から５分前まで）およびロット変更直後（例えば、ロット変更から５分後まで）に当該ロット変更が行われた電子部品実装機５により部品８４が装着された基板８を、適宜、「関連付け基板８」と称する。 Hereinafter, the component 84 is mounted by the electronic component mounting machine 5 in which the lot change is performed immediately before the lot change (for example, up to 5 minutes before the lot change) and immediately after the lot change (for example, after 5 minutes after the lot change). The substrate 8 is appropriately referred to as an “association substrate 8”.
　関連付け基板８が基板外観検査機２に搬入されると、基板外観検査機２の撮像装置２０４が、関連付け基板８の全ての装着座標の画像を、順番に撮像する。撮像された画像は、画像処理装置２０３により画像処理され、記憶部２０２ｂに格納される。 When the association board 8 is carried into the board appearance inspection machine 2, the imaging device 204 of the board appearance inspection machine 2 takes images of all the mounting coordinates of the association board 8 in order. The captured image is subjected to image processing by the image processing device 203 and stored in the storage unit 202b.
　この際、関連付け基板８の装着座標の画像（具体的には、関連付け基板８の装着座標のうち、ロット変更直前およびロット変更直後にロット変更が行われた電子部品実装機５により部品８４が装着された装着座標の画像）は、当該ロット変更という変動要因と関連付けられた状態で、記憶部２０２ｂに格納される。なお、関連付け基板８が基板外観検査機２から搬出されると、ライン管理装置６は、基板外観検査機２に、再び上記記憶ステップの実行を指示する。基板外観検査機２は、記憶ステップに復帰する。 At this time, an image of mounting coordinates of the association substrate 8 (specifically, among the mounting coordinates of the association substrate 8, the component 84 is mounted by the electronic component mounting machine 5 in which the lot change is performed immediately before the lot change and immediately after the lot change. The image of the mounted coordinates) is stored in the storage unit 202b in a state associated with the variation factor of the lot change. When the associated board 8 is unloaded from the board appearance inspection machine 2, the line management device 6 instructs the board appearance inspection machine 2 to execute the storage step again. The board appearance inspection machine 2 returns to the storage step.
　＜基板の不良のトレース方法＞
　次に、基板８の不良のトレース方法について説明する。基板８が、基板外観検査機２における外観検査に合格しても、その後の検査（例えば、リフロー炉を通過した基板８に対して行われる導通検査）において、基板８の不良が発覚する場合がある。 <Defect trace method for substrate>
Next, a method for tracing defects in the substrate 8 will be described. Even if the substrate 8 passes the appearance inspection in the substrate appearance inspection machine 2, a defect of the substrate 8 may be detected in a subsequent inspection (for example, a continuity inspection performed on the substrate 8 that has passed through the reflow furnace). is there.
　この場合、作業者は、図１に示す基板外観検査機２の画面２０５のタッチ式のボタンに、当該基板８のＩＤを入力する。図７（ａ）に画面の第一ページの模式図を示す。図７（ｂ）に画面の第二ページの模式図を示す。 In this case, the operator inputs the ID of the board 8 to the touch button on the screen 205 of the board appearance inspection machine 2 shown in FIG. FIG. 7A shows a schematic diagram of the first page of the screen. FIG. 7B shows a schematic diagram of the second page of the screen.
　図７（ａ）に示すように、画面２０５には、まず、当該ＩＤに対応するＩＤ部８１を有する、基板８の画像が表示される。作業者は、基板８の画像の中から、不良が発覚した装着座標を、図７（ａ）に白抜き矢印で示すように、マウス（図略）でクリックする。すると、画面２０５が、図７（ａ）に示す第一ページ２０５ａから、図７（ｂ）に示す第二ページ２０５ｂに、切り替わる。 7A, first, an image of the substrate 8 having an ID portion 81 corresponding to the ID is displayed on the screen 205. The operator clicks the mounting coordinates where a defect is detected from the image of the substrate 8 with a mouse (not shown) as indicated by a white arrow in FIG. Then, the screen 205 is switched from the first page 205a shown in FIG. 7 (a) to the second page 205b shown in FIG. 7 (b).
　図７（ｂ）に示すように、画面２０５には、上下二段に六つの枠ＷＡ～ＷＣ、Ｗａ～Ｗｃが表示される。下段の三つの枠Ｗａ～Ｗｃと上段の三つの枠ＷＡ～ＷＣとは、各々、上下方向に対応している。 As shown in FIG. 7B, the screen 205 displays six frames WA to WC and Wa to Wc in two upper and lower stages. The lower three frames Wa to Wc and the upper three frames WA to WC correspond to the vertical direction, respectively.
　前述したように、ロット変更直前および直後に、ロット変更が行われた電子部品実装機５から部品８４が装着された基板８（装着座標）の画像は、当該ロット変更という変動要因と関連付けられた状態で、記憶部２０２ｂに格納されている。 As described above, the image of the substrate 8 (mounting coordinates) on which the component 84 is mounted from the electronic component mounter 5 on which the lot change was performed immediately before and after the lot change was associated with a variation factor of the lot change. And stored in the storage unit 202b.
　作業者が第一ページ２０５ａで選択した装着座標の画像は、下段右側の枠Ｗｃに表示される。表示された装着座標の画像に対して、関連付けられた変動要因がある場合、当該変動要因は上段右側の枠ＷＣに表示される。枠ＷＣには、「装着座標」（基板８における水平方向位置）と、「ロットＩＤ」（部品８４ｃのロットナンバー）と、「装着時間」（部品８４ｃが装着座標に装着された時間）と、が表示される。 The image of the mounting coordinates selected by the worker on the first page 205a is displayed in the lower right frame Wc. When there is a variation factor associated with the displayed image of the mounting coordinates, the variation factor is displayed in the upper right frame WC. In the frame WC, “mounting coordinates” (horizontal position on the substrate 8), “lot ID” (lot number of the component 84c), “mounting time” (time when the component 84c is mounted at the mounting coordinates), Is displayed.
　下段の枠Ｗａ、Ｗｂには、不良が発覚した基板８よりも時系列的に先に生産された別の基板８の、枠Ｗｃの装着座標と同じ装着座標の画像が表示される。枠Ｗｃの場合と同様に、枠Ｗａ、Ｗｂに表示された装着座標の画像に対して、関連付けられた変動要因がある場合、当該変動要因は枠ＷＡ、ＷＢに表示される。 In the lower frames Wa and Wb, images of the same mounting coordinates as the mounting coordinates of the frame Wc of another substrate 8 produced earlier in time series than the substrate 8 where the defect is detected are displayed. As in the case of the frame Wc, when there is a variation factor associated with the image of the mounting coordinates displayed in the frames Wa and Wb, the variation factor is displayed in the frames WA and WB.
　枠Ｗａの部品８４ａの画像と、枠Ｗｂの部品８４ｂの画像と、枠Ｗｃの部品８４ｃの画像と、を比較すると、部品８４ａには、円形の基準マークＭａが配置されている。一方、部品８４ｂ、８４ｃには、帯状の基準マークＭｂ、Ｍｃが配置されている。 When the image of the part 84a of the frame Wa, the image of the part 84b of the frame Wb, and the image of the part 84c of the frame Wc are compared, a circular reference mark Ma is arranged on the part 84a. On the other hand, strip-shaped reference marks Mb and Mc are arranged on the parts 84b and 84c.
　枠Ｗａに示すように、部品８４ａの実際の外形線と、基板外観検査機２が認識した部品８４ａの外形線Ｌａ（図７（ｂ）に太線で示す。）と、は一致している。一方、枠Ｗｂ、Ｗｃに示すように、部品８４ｂ、８４ｃの実際の外形線と、基板外観検査機２が認識した部品８４ｂ、８４ｃの外形線Ｌｂ、Ｌｃ（図７（ｂ）に太線で示す。）と、は異なっている。すなわち、実際の外形線に対して、基板外観検査機２が認識した外形線Ｌｂ、Ｌｃは、右側にずれている。 As shown in the frame Wa, the actual outline of the component 84a matches the outline La of the component 84a recognized by the board visual inspection machine 2 (indicated by a thick line in FIG. 7B). On the other hand, as shown by the frames Wb and Wc, the actual outlines of the components 84b and 84c and the outlines Lb and Lc of the components 84b and 84c recognized by the board appearance inspection machine 2 (shown by bold lines in FIG. 7B). .) Is different. That is, the outlines Lb and Lc recognized by the board appearance inspection machine 2 are shifted to the right with respect to the actual outline.
　このことから、基板外観検査機２が、部品８４ｂ、８４ｃの外形線を、外形線Ｌｂ、Ｌｃと誤認して、部品８４ｂ、８４ｃに対して、合格判定を出していたことが判る。すなわち、所定の装着座標に対して、部品８４ｂ、８４ｃの実際の装着位置が、左側にずれているにもかかわらず、基板外観検査機２が、外形線Ｌｂ、Ｌｃを基に、所定の装着座標に部品８４ｂ、８４ｃが正しく装着されていると誤判別していたことが判る。 From this, it can be seen that the board appearance inspection machine 2 mistakenly recognized the outlines of the parts 84b and 84c as the outlines Lb and Lc, and made a pass judgment for the parts 84b and 84c. That is, although the actual mounting position of the components 84b and 84c is shifted to the left with respect to the predetermined mounting coordinates, the board appearance inspection machine 2 performs the predetermined mounting based on the external lines Lb and Lc. It can be seen that it was erroneously determined that the components 84b and 84c were correctly mounted at the coordinates.
　また、部品８４ａにおいては実際の外形線と外形線Ｌａとが一致しており、部品８４ｂ、８４ｃにおいては実際の外形線と外形線Ｌｂ、Ｌｃとがずれていることから、ずれの原因が基準マークＭａ、Ｍｂ、Ｍｃの形状にあることが判る。さらに、枠ＷＡ～ＷＣの変動要因の記載事項から、基準マークＭａ、Ｍｂ、Ｍｃの形状が円形から帯状に切り替わったのは、ロットナンバーが、「Ｒｏｔ　Ｂ－１」（部品８４ａ）から、「Ｒｏｔ　Ｄ－３」（部品８４ｂ、８４ｃ）に、変更されたからだということが判る。 In addition, the actual outline and the outline La of the component 84a coincide with each other, and the actual outline and the outlines Lb and Lc of the components 84b and 84c are misaligned. It can be seen that the marks Ma, Mb, and Mc are in the shape. Furthermore, from the description of the variation factors in the frames WA to WC, the shape of the reference marks Ma, Mb, and Mc was changed from a circular shape to a belt shape because the lot number is “Rot B-1” (part 84a). Rot D-3 "(parts 84b and 84c) is found to have been changed.
　このように、本実施形態のデータ記憶方法により基板８の画像を蓄積しておくと、基板８の不良が発覚した場合に、当該基板８のＩＤから、不良の直接的な原因（部品の外形線の誤認）と、間接的な原因（ロットの変更による基準マークの変更）と、を簡単にトレースすることができる。 As described above, when the image of the substrate 8 is accumulated by the data storage method according to the present embodiment, when a defect of the substrate 8 is detected, the direct cause of the defect (external shape of the component) is determined from the ID of the substrate 8. Line misidentification) and indirect causes (changes in fiducial marks due to lot changes) can be easily traced.
　＜作用効果＞
　次に、本実施形態の基板外観検査機２およびデータ記憶方法の作用効果について説明する。本実施形態の基板外観検査機２およびデータ記憶方法によると、変動要因と、基板８（装着座標）の画像と、が関連付けられた状態で、記憶部２０２ｂに蓄積される。このため、任意の基板８の不良が発覚した場合、記憶部２０２ｂのデータを参照することにより、発覚した不良の原因になりうる変動要因を特定しやすくなる。このように、本実施形態の基板外観検査機２およびデータ記憶方法によると、基板８の不良原因のトレース性が高くなる。 <Effect>
Next, the effect of the board | substrate visual inspection machine 2 and data storage method of this embodiment is demonstrated. According to the substrate appearance inspection machine 2 and the data storage method of the present embodiment, the variation factor and the image of the substrate 8 (mounting coordinates) are stored in the storage unit 202b in a state of being associated with each other. For this reason, when a defect of an arbitrary substrate 8 is detected, it is easy to identify a variation factor that can cause the detected defect by referring to the data in the storage unit 202b. Thus, according to the substrate appearance inspection machine 2 and the data storage method of the present embodiment, the traceability of the cause of the defect of the substrate 8 is enhanced.
　また、本実施形態の基板外観検査機２およびデータ記憶方法によると、記憶部２０２ｂは、生産される全基板８の画像を記憶する。そして、任意の処理装置（はんだ印刷機３、電子部品実装機５）に変動要因が発生した場合、当該変動要因の発生直前および発生直後のうち少なくとも一方の時点に当該処理装置から処理を受けた基板８の画像を、当該変動要因と関連付けて、記憶部２０２ｂが記憶する。このため、変動要因の発生の有無によらず、基板８の画像を蓄積することができる。また、変動要因の発生直前および発生直後の基板８の画像は、当該変動要因と関連付けて蓄積される。このため、データ容量が大きいにもかかわらず、基板８の不良原因のトレース性を確保することができる。 Further, according to the substrate appearance inspection machine 2 and the data storage method of the present embodiment, the storage unit 202b stores images of all the substrates 8 to be produced. When a fluctuation factor occurs in any processing device (solder printer 3, electronic component mounting machine 5), the processing device has received processing from at least one time point immediately before and after the occurrence of the fluctuation factor. The image of the substrate 8 is stored in the storage unit 202b in association with the variation factor. For this reason, the image of the board | substrate 8 can be accumulate | stored irrespective of the presence or absence of generation | occurrence | production of a fluctuation factor. Further, the images of the substrate 8 immediately before and after the occurrence of the variation factor are accumulated in association with the variation factor. For this reason, despite the large data capacity, it is possible to ensure the traceability of the cause of the failure of the substrate 8.
　また、本実施形態の基板外観検査機２は、画面２０５を備えている。画面２０５には、記憶部２０２ｂに記憶された変動要因と、当該変動要因の発生直前および発生直後のうち少なくとも一方の時点に処理装置（はんだ印刷機３、電子部品実装機５）から処理を受けた基板８の画像と、が関連付けられた状態で、表示される。このため、作業者は、変動要因と基板８の画像とを見比べることができる。したがって、発覚した不良の原因になりうる変動要因を視認しやすくなる。 Further, the board appearance inspection machine 2 of this embodiment includes a screen 205. The screen 205 receives processing from the processing device (solder printer 3, electronic component mounting machine 5) at least at one of the fluctuation factor stored in the storage unit 202b and immediately before and after the occurrence of the fluctuation factor. The image of the substrate 8 is displayed in an associated state. For this reason, the operator can compare the variation factor with the image of the substrate 8. Therefore, it becomes easy to visually recognize the fluctuation factors that may cause the detected defect.
　また、画面２０５には、不良が発覚した基板８の装着座標の画像のみならず、別の基板８の同じ装着座標の画像も表示することができる。つまり、異なる基板８における同じ装着座標の時系列変化を視認することができる。このため、基板８に不良が発生する確率が、どの時点から高くなったのかを、認識することができる。 Further, on the screen 205, not only an image of the mounting coordinates of the board 8 in which a defect is detected but also an image of the same mounting coordinates of another board 8 can be displayed. That is, the time series change of the same mounting coordinates on different substrates 8 can be visually recognized. For this reason, it is possible to recognize from which point the probability that a defect occurs in the substrate 8 has increased.
　＜その他＞
　以上、本発明の基板検査システムおよびデータ記憶方法の実施の形態について説明した。しかしながら、実施の形態は上記形態に特に限定されるものではない。当業者が行いうる種々の変形的形態、改良的形態で実施することも可能である。 <Others>
The embodiments of the substrate inspection system and the data storage method of the present invention have been described above. However, the embodiment is not particularly limited to the above embodiment. Various modifications and improvements that can be made by those skilled in the art are also possible.
　上記実施形態においては、基板外観検査機２通過後に、基板８の不良が発覚した場合について説明した。しかしながら、基板外観検査機２通過中に、基板８の不良が発覚する場合であっても、本発明の基板検査システムおよびデータ記憶方法は有効である。図８に、その他の実施形態の基板外観検査機の画面の第一ページの模式図を示す。なお、図７（ａ）、図７（ｂ）と対応する部位については、同じ符号で示す。 In the above embodiment, the case where a defect of the substrate 8 is detected after passing through the substrate appearance inspection machine 2 has been described. However, the substrate inspection system and the data storage method of the present invention are effective even when a defect of the substrate 8 is detected while passing through the substrate appearance inspection machine 2. In FIG. 8, the schematic diagram of the 1st page of the screen of the board | substrate visual inspection machine of other embodiment is shown. In addition, about the site | part corresponding to Fig.7 (a) and FIG.7 (b), it shows with the same code | symbol.
　図８に示すように、基板外観検査機２において基板８の不良が発覚した場合、画面２０５の第一ページ２０５ａには、基板８の画像と、選択リスト枠ｗと、が並んで表示される。選択リスト枠ｗには、基板外観検査機２において不合格になった装着座標が表示される。なお、基板８の画像の枠ｗｃ、ｗｄと、選択リスト枠ｗの枠ｗｃ、ｗｄと、は対応している。枠ｗｃ内の部品８４ｃの実際の外形線と、基板外観検査機２が認識した部品８４ｃの外形線Ｌｃと、は一致している。ただし、正しい装着座標を示す正規外形線ｌｃ（点線）に対して、外形線Ｌｃ（部品８４ｃの実際の外形線）は、左側にずれている。同様に、枠ｗｄ内の部品８４ｄの場合も、正規外形線に対して、部品８４ｄの実際の外形線は、傾斜している。作業者が、枠ｗｃの部品８４ｃを選択すると、前出図７（ｂ）の画面が表示される。このように、基板外観検査機２における外観検査に、本発明のデータ記憶方法を用いてもよい。 As shown in FIG. 8, when a defect of the substrate 8 is detected in the substrate appearance inspection machine 2, the image of the substrate 8 and the selection list frame w are displayed side by side on the first page 205a of the screen 205. . In the selection list frame w, the mounting coordinates that are rejected in the board appearance inspection machine 2 are displayed. Note that the frames wc and wd of the image of the substrate 8 correspond to the frames wc and wd of the selection list frame w. The actual outline of the component 84c in the frame wc matches the outline Lc of the component 84c recognized by the board appearance inspection machine 2. However, the outline Lc (actual outline of the component 84c) is shifted to the left side with respect to the normal outline lc (dotted line) indicating the correct mounting coordinates. Similarly, in the case of the component 84d in the frame wd, the actual outline of the component 84d is inclined with respect to the normal outline. When the worker selects the part 84c of the frame wc, the screen shown in FIG. 7B is displayed. As described above, the data storage method of the present invention may be used for appearance inspection in the substrate appearance inspection machine 2.
　上記実施形態においては、基板外観検査機２で基板８の画像を取得した。しかしながら、はんだ印刷検査機４、電子部品実装機５で基板８の画像を取得してもよい。また、検査以外の目的で取得された画像（例えば、部品８４を基板８に装着するために電子部品実装機５で取得された画像）を、基板検査システム、データ記憶方法に転用してもよい。 In the above embodiment, an image of the substrate 8 was acquired by the substrate appearance inspection machine 2. However, an image of the substrate 8 may be acquired by the solder printing inspection machine 4 and the electronic component mounting machine 5. Further, an image acquired for purposes other than inspection (for example, an image acquired by the electronic component mounting machine 5 for mounting the component 84 on the substrate 8) may be diverted to a substrate inspection system and a data storage method. .
　上記実施形態においては、基板外観検査機２の記憶部２０２ｂで基板８の画像を記憶した。しかしながら、はんだ印刷機３の記憶部、はんだ印刷検査機４の記憶部、電子部品実装機５の記憶部、ライン管理装置６の記憶部６０２ｂで、基板８の画像を記憶してもよい。また、生産ライン１外の記憶部で、基板８の画像を記憶してもよい。また、上記実施形態においては、ライン管理装置６の記憶部６０２ｂに変動要因を格納したが、上に列挙したような他の記憶部に変動要因を格納してもよい。 In the above embodiment, the image of the substrate 8 is stored in the storage unit 202b of the substrate appearance inspection machine 2. However, the image of the substrate 8 may be stored in the storage unit of the solder printer 3, the storage unit of the solder printing inspection machine 4, the storage unit of the electronic component mounting machine 5, and the storage unit 602b of the line management device 6. Further, the image of the substrate 8 may be stored in a storage unit outside the production line 1. In the above embodiment, the variation factor is stored in the storage unit 602b of the line management device 6. However, the variation factor may be stored in another storage unit as listed above.
　上記実施形態においては、図７（ａ）、図７（ｂ）に示すように、画面２０５を、第一ページ２０５ａと第二ページ２０５ｂとで切り替えて用いたが、同じ画面２０５に、第一ページ２０５ａと第二ページ２０５ｂとを並べて表示してもよい。 In the above embodiment, as shown in FIGS. 7A and 7B, the screen 205 is switched between the first page 205a and the second page 205b. The page 205a and the second page 205b may be displayed side by side.
　上記実施形態においては、基板外観検査機２を本発明の基板検査システムとしたが、はんだ印刷検査機４を本発明の基板検査システムとしてもよい。また、基板検査システムは、生産ライン１外に配置されていてもよい。 In the above embodiment, the board appearance inspection machine 2 is the board inspection system of the present invention, but the solder printing inspection machine 4 may be the board inspection system of the present invention. Further, the substrate inspection system may be arranged outside the production line 1.
　また、図１に示す撮像装置２０４、４０４、５０４、図３、図４に示す部品撮像装置５４の種類は特に限定しない。ＣＭＯＳ（Ｃｏｍｐｌｅｍｅｎｔａｒｙ　Ｍｅｔａｌ－Ｏｘｉｄｅ　Ｓｅｍｉｃｏｎｄｕｃｔｏｒ）カメラなどであってもよい。 Further, the types of the imaging devices 204, 404, and 504 shown in FIG. 1 and the component imaging device 54 shown in FIGS. 3 and 4 are not particularly limited. A CMOS (Complementary Metal-Oxide Semiconductor) camera may be used.
　変動要因の発生直前とは、変動要因発生から、例えば１時間前までに含まれるいずれかの時点をいう。同様に、変動要因の発生直後とは、変動要因発生から、例えば１時間後までに含まれるいずれかの時点をいう。 直 前 Immediately before the occurrence of a fluctuation factor refers to any point in time, for example, one hour before the occurrence of the fluctuation factor. Similarly, “immediately after the occurrence of a variation factor” refers to any point in time that is included, for example, one hour after the occurrence of the variation factor.
　［変動要因について］
　変動要因の種類は特に限定しない。基板８の不良の原因となりうる要因の全てが変動要因である。基板８の任意の装着座標に対して、複数の変動要因が発生してもよい。この場合、複数の変動要因を、当該装着座標に関連付けて記憶すればよい。また、複数の変動要因は、単一の処理装置で発生しても、複数の処理装置で発生してもよい。 [Variation factors]
There are no particular limitations on the type of variable factor. All of the factors that can cause defects in the substrate 8 are fluctuation factors. A plurality of variation factors may occur with respect to arbitrary mounting coordinates of the substrate 8. In this case, a plurality of variation factors may be stored in association with the mounting coordinates. Further, the plurality of variation factors may be generated by a single processing apparatus or may be generated by a plurality of processing apparatuses.
　変動要因は、例えば、「はんだＳの補充」や「部品８４の補給」など、事象名であってもよい。また、「基準マーク８３のずれ量」や「はんだ部８２のずれ量」など、数値であってもよい。以下、代表的な変動要因を例示する。 The variation factor may be an event name such as “supplement of solder S” or “supplement of part 84”, for example. Further, a numerical value such as “amount of deviation of the reference mark 83” or “amount of deviation of the solder portion 82” may be used. Hereinafter, typical variation factors will be exemplified.
　（はんだ印刷機３に関する変動要因）
　図５に示すように、はんだ印刷機３にはんだＳを補充すると、補充前と補充後とで、スクリーンマスク３３２の通孔３３２ａに対するはんだＳの通過性が変化する可能性がある。このため、「はんだＳの補充」は、変動要因に含まれる。 (Variation factors related to solder printer 3)
As shown in FIG. 5, when the solder printer 3 is replenished with solder S, the permeability of the solder S to the through-hole 332a of the screen mask 332 may change before and after replenishment. For this reason, “supplement of solder S” is included in the fluctuation factors.
　また、スクリーンマスク３３２をクリーニングすると、クリーニング前とクリーニング後とで、スクリーンマスク３３２の通孔３３２ａに対するはんだＳの通過性が変化する可能性がある。このため、「スクリーンマスク３３２のクリーニング」は、変動要因に含まれる。 Further, when the screen mask 332 is cleaned, the passability of the solder S to the through hole 332a of the screen mask 332 may change before and after the cleaning. For this reason, “cleaning of the screen mask 332” is included in the variation factors.
　（はんだ印刷検査機４に関する変動要因）
　基板８のロットが変更されると、変更前と変更後とで基板８の形状や熱変形率（熱膨張率、熱収縮率）などが変化する可能性がある。このため、「基板８のロット変更」は、変動要因に含まれる。図１、図６（ａ）～図６（ｃ）に示すように、基板８のロット変更は、撮像装置４０４が基板８のＩＤ部８１を撮像することにより、確認される。 (Variation factors related to solder printing inspection machine 4)
When the lot of the substrate 8 is changed, there is a possibility that the shape, thermal deformation rate (thermal expansion rate, thermal contraction rate), etc. of the substrate 8 change before and after the change. For this reason, “lot change of substrate 8” is included in the variation factor. As shown in FIGS. 1 and 6A to 6C, the lot change of the substrate 8 is confirmed when the imaging device 404 images the ID portion 81 of the substrate 8.
　図６（ａ）～図６（ｃ）に示すように、基板８に対する部品８４の装着は、一対の基準マーク８３の位置を基準に行われる場合がある。このため、一対の基準マーク８３の正規の位置に対して、一対の基準マーク８３の実際の印刷位置がずれると、基板８の正規の装着座標に、部品８４を装着できない可能性がある。このため、「基準マーク８３のずれ量（左右方向ずれ量、前後方向ずれ量）」は、変動要因に含まれる。基準マーク８３のずれ量は、撮像装置４０４が基板８の一対の基準マーク８３を撮像することにより、確認される。 As shown in FIGS. 6A to 6C, the mounting of the component 84 on the substrate 8 may be performed based on the position of the pair of reference marks 83. For this reason, if the actual printing position of the pair of reference marks 83 is deviated from the normal position of the pair of reference marks 83, there is a possibility that the component 84 cannot be mounted at the normal mounting coordinates of the substrate 8. Therefore, the “shift amount of the reference mark 83 (left-right direction shift amount, front-back direction shift amount)” is included in the variation factor. The shift amount of the reference mark 83 is confirmed by the imaging device 404 imaging the pair of reference marks 83 on the substrate 8.
　基板８に対する部品８４の装着は、はんだ部８２の位置を基準に行われる場合がある。はんだ部８２の位置は、通常、ランド部８００の位置と一致している。このため、ランド部８００に対して、はんだ部８２がずれて印刷されると、はんだ部８２に部品８４を装着できない可能性がある。したがって、「はんだ部８２のずれ量（左右方向ずれ量、前後方向ずれ量）」は、変動要因に含まれる。はんだ部８２のずれ量は、撮像装置４０４が各はんだ部８２を撮像することにより、はんだ部８２ごとに確認される。 The mounting of the component 84 on the substrate 8 may be performed based on the position of the solder portion 82. The position of the solder part 82 usually coincides with the position of the land part 800. For this reason, when the solder part 82 is printed out of alignment with the land part 800, there is a possibility that the component 84 cannot be mounted on the solder part 82. Therefore, the “deviation amount of the solder part 82 (lateral deviation amount, longitudinal deviation amount)” is included in the variation factor. The deviation amount of the solder part 82 is confirmed for each solder part 82 by the imaging device 404 imaging each solder part 82.
　基板８に対する部品８４の装着は、はんだ部８２の位置、具体的には、はんだ部８２の図形重心の位置を基準に行われる場合がある。はんだ部８２の図形重心の位置は、通常、ランド部８００の図形重心の位置と一致している。このため、はんだ部８２の印刷形状に不具合（例えば「欠け」、「にじみ」など）があると、はんだ部８２に部品８４を装着できない可能性がある。したがって、「はんだ部８２の印刷形状の不具合」は、変動要因に含まれる。はんだ部８２の印刷形状の不具合は、撮像装置４０４が各はんだ部８２を撮像することにより、はんだ部８２ごとに確認される。 The mounting of the component 84 on the substrate 8 may be performed based on the position of the solder portion 82, specifically, the position of the graphic center of gravity of the solder portion 82. The position of the graphic centroid of the solder portion 82 usually coincides with the position of the graphic centroid of the land portion 800. For this reason, if there is a defect in the printed shape of the solder portion 82 (for example, “chip”, “smudge”, etc.), there is a possibility that the component 84 cannot be mounted on the solder portion 82. Therefore, “a defect in the printed shape of the solder portion 82” is included in the variation factor. The defect of the printing shape of the solder part 82 is confirmed for each solder part 82 by the imaging device 404 imaging each solder part 82.
　（電子部品実装機５に関する変動要因）
　電子部品実装機５に部品を補充すると、同じ電気的特性を有する部品であるにもかかわらず、補充前と補充後とで外観が変化する可能性がある。このため、「部品８４の補給」（図３に示す電子部品実装機５の場合はテープ５３０の交換やテープ５３０の連結（スプライシング）、図４に示す電子部品実装機５の場合はトレイ５３１の交換）は、変動要因に含まれる。 (Variation factors related to the electronic component mounting machine 5)
When the electronic component mounting machine 5 is replenished with parts, the appearance may change before and after replenishment even though the parts have the same electrical characteristics. For this reason, “supplement of components 84” (in the case of the electronic component mounting machine 5 shown in FIG. 3, replacement of the tape 530 and connection (splicing) of the tape 530, and in the case of the electronic component mounting machine 5 shown in FIG. Exchange) is included in the variable factors.
　また、部品補充の際に、補充前と補充後とで部品のベンダーが異なる場合、同じ電気的特性を有する部品であるにもかかわらず、部品の外観が変化する可能性がある。このため、「部品８４のベンダーの変更」は、変動要因に含まれる。 Also, when parts are replenished, if the parts vendors are different before and after replenishment, the appearance of the parts may change even though the parts have the same electrical characteristics. For this reason, “change of the vendor of the part 84” is included in the variation factor.
　また、吸着ノズル５２６ａを交換する場合、交換前と交換後とで部品に対する吸着精度が変化する可能性がある。このため、「吸着ノズル５２６ａの交換」は、変動要因に含まれる。同様に、「装着ヘッド５２６の交換」も、変動要因に含まれる。 In addition, when replacing the suction nozzle 526a, there is a possibility that the suction accuracy with respect to the parts may change before and after the replacement. For this reason, “replacement of the suction nozzle 526a” is included in the variation factor. Similarly, “replacement of the mounting head 526” is also included in the variation factor.
　また、部品の生産データを変更する場合、変更前と変更後とで部品の形状データ、装着座標データが変化する可能性がある。このため、「部品８４の生産データの変更」は、変動要因に含まれる。 In addition, when changing the production data of a part, there is a possibility that the shape data and mounting coordinate data of the part will change before and after the change. For this reason, “change of production data of the part 84” is included in the variation factor.
　また、吸着ノズル５２６ａに対する部品８４の吸着状態が悪いと、装着座標に対する部品８４の装着精度が低下する可能性がある。このため、「部品８４の吸着状態」は、変動要因に含まれる。部品８４の吸着状態は、吸着ノズル５２６ａに吸着された部品８４を部品撮像装置５４が撮像することにより、部品８４ごとに確認される。 Also, if the suction state of the component 84 with respect to the suction nozzle 526a is poor, the mounting accuracy of the component 84 with respect to the mounting coordinates may be reduced. For this reason, the “adsorption state of the component 84” is included in the variation factors. The suction state of the component 84 is confirmed for each component 84 when the component imaging device 54 images the component 84 sucked by the suction nozzle 526a.
　（その他の変動要因）
　生産ライン１に配置される各装置の運転停止は、変動要因に含まれる。また、はんだ印刷後から基板外観検査までの経過時間（具体的には、任意の基板８に対する、はんだ印刷機３搬出時から基板外観検査機２搬入時までの経過時間）は、変動要因に含まれる。このように、複数の装置に起因する変動要因が発生してもよい。 (Other variable factors)
The shutdown of each device arranged on the production line 1 is included in the fluctuation factor. Further, the elapsed time from the solder printing to the board appearance inspection (specifically, the elapsed time from the time when the solder printing machine 3 is carried out to the time when the board appearance inspection machine 2 is carried in any board 8) is included in the variation factor. It is. In this way, a variation factor due to a plurality of devices may occur.

Claims (7)

  1. 　基板に所定の処理を行う処理装置を有する生産ラインの、該基板を検査する基板検査システムであって、
    　前記処理装置において前記基板の不良の原因となりうる変動要因が発生した場合、該変動要因と、該変動要因の発生直前および発生直後のうち少なくとも一方の時点に該処理装置から処理を受けた該基板の画像と、を関連付けて記憶する記憶部を備えることを特徴とする基板検査システム。     A substrate inspection system for inspecting a substrate of a production line having a processing apparatus for performing predetermined processing on the substrate,
    When a variation factor that may cause a defect of the substrate occurs in the processing apparatus, the substrate subjected to processing from the processing device at least one time point immediately before and immediately after the occurrence of the variation factor A board inspection system comprising: a storage unit that stores the images in association with each other.
  2. 　前記記憶部は、前記変動要因が発生した場合に限って、前記基板の前記画像を記憶する請求項１に記載の基板検査システム。 The substrate inspection system according to claim 1, wherein the storage unit stores the image of the substrate only when the variation factor occurs.
  3. 　前記記憶部は、全ての前記基板の前記画像を記憶し、
    　前記変動要因が発生した場合に限って、該変動要因と、該変動要因の発生直前および発生直後のうち少なくとも一方の時点に前記処理装置から処理を受けた該基板の該画像と、を関連付けて記憶する請求項１に記載の基板検査システム。     The storage unit stores the images of all the substrates,
    Only when the variation factor occurs, the variation factor is associated with the image of the substrate that has been processed from the processing apparatus at least one time point immediately before and immediately after the occurrence of the variation factor. The substrate inspection system according to claim 1 for storing.
  4. 　さらに、前記記憶部に記憶された、前記変動要因と、該変動要因の発生直前および発生直後のうち少なくとも一方の時点に前記処理装置から処理を受けた前記基板の前記画像と、を関連付けて表示する表示部を備える請求項１ないし請求項３のいずれかに記載の基板検査システム。 Further, the variation factor stored in the storage unit and the image of the substrate that has been processed from the processing apparatus at least one time point immediately before and immediately after the occurrence of the variation factor are displayed in association with each other. The board | substrate inspection system in any one of Claim 1 thru | or 3 provided with the display part to perform.
  5. 　基板に所定の処理を行う処理装置を有する生産ラインの該処理装置において該基板の不良の原因となりうる変動要因が発生した場合、該変動要因と、該変動要因の発生直前および発生直後のうち少なくとも一方の時点に該処理装置から処理を受けた該基板の画像と、を関連付けて記憶する関連付け記憶ステップを実行するデータ記憶方法。 When a variation factor that may cause a defect in the substrate occurs in the processing apparatus of a production line having a processing device that performs a predetermined process on the substrate, the variation factor and at least one of the variation factor immediately before and immediately after the occurrence of the variation factor A data storage method for executing an association storage step of associating and storing an image of the substrate that has been processed from the processing apparatus at one time point.
  6. 　前記変動要因が発生した場合に限って、前記基板の前記画像を記憶する請求項５に記載のデータ記憶方法。 6. The data storage method according to claim 5, wherein the image of the substrate is stored only when the variation factor occurs.
  7. 　全ての前記基板の前記画像を記憶する記憶ステップを有し、
    　前記変動要因が発生した場合に限って、該記憶ステップに割り込んで、前記関連付け記憶ステップを実行する請求項５に記載のデータ記憶方法。     A storage step for storing the images of all the substrates;
    6. The data storage method according to claim 5, wherein the association storage step is executed by interrupting the storage step only when the variation factor occurs.
PCT/JP2013/052852 2012-02-16 2013-02-07 Substrate inspection system and data storage method WO2013121967A1 (en)

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