JP6550817B2 - Identification device, identification method and traceability system - Google Patents

Description

  The present invention relates to a substrate identification device, an identification method, and a traceability system.

  When manufacturing and selling a circuit board such as a printed wiring board, traceability (traceability) for a circuit board as a product is required for the purpose of manufacturing process management, quality inspection, shipping inspection, sales management, and the like. Generally, individual identification information such as a product name, product number, and date of manufacture is set in a circuit board, and tracking of the circuit board is performed based on the set individual identification information.

  A method for setting individual identification information includes a method of attaching a label such as a barcode or QR code (registered trademark) on which individual identification information is printed, an RFID (Radio Frequency Identifier) storing individual identification information, or the like to a circuit board. is there. In addition, there is also a method of printing individual identification information directly on a circuit board by a laser marker, an ink jet, or the like. In these methods, in order to identify individual circuit boards, individual identification information for identifying circuit boards is given to the circuit boards.

  However, in order to obtain the traceability of the circuit board by the method of assigning the individual identification information to the circuit board, a label to be attached to the board, a printing facility for printing on the board, and the like are required, and the manufacturing cost increases. Further, in the method of providing the individual identification information to the circuit board, it is necessary to attach the individual identification information to the substrate or print the individual identification information on the substrate.

  Patent Document 1 discloses an individual identification device that can obtain traceability of a circuit board without giving individual identification information for identifying individual circuit boards to the circuit board. The device of Patent Document 1 is a combination of the difference between the measured values of the positions of a plurality of measurement objects (through holes, land patterns, wiring patterns, etc.) previously set on the circuit board and the design values of those measurement objects. It registers in association with the board identification code. And the apparatus of patent document 1 can identify each circuit board by the registered board | substrate identification code | symbol.

JP, 2013-69838, A

  Generally, a circuit board is manufactured by manufacturing the board itself, forming through holes, land patterns, and wiring patterns on the manufactured board, then mounting circuit parts on the board, and mounting these circuit parts on the board by soldering or the like. Manufactured by fixing.

  The apparatus of Patent Document 1 uses a portion formed after manufacturing a substrate itself such as a through hole, a land pattern, and a wiring pattern to create a substrate identification code. For this reason, the method of Patent Document 1 can be applied after forming measurement objects such as through holes, land patterns, and wiring patterns on the substrate, but cannot be applied before the measurement objects are formed on the substrate. In addition, after the circuit component is mounted on the substrate, the measurement target such as a through hole or a land pattern is hidden by the circuit component, so that it is difficult to accurately measure the position of the measurement target. In addition, after fixing circuit components to the board with solder, the shape of the measurement target itself, such as through holes, land patterns, and wiring patterns, is deformed or soiled by the solder. It becomes difficult to measure.

  An object of the present invention is to provide an identification device, an identification method, and a traceability system that can identify individual substrates at any stage of an SMT (Surface Mount Technology) process without giving individual identification information for identifying the substrate to the substrate. It is to be.

  The identification apparatus according to the present invention comprises: storage means for storing feature quantities based on an internal pattern of a predetermined substrate; imaging means for imaging a transmission image including information on the internal pattern of a target substrate; If the feature quantity extraction means for extracting the feature quantity of the target board from the information related to the internal pattern included in the storage and the feature quantity extracted by the feature quantity extraction means are stored in the storage means, the target board is a predetermined board. And verification determination means for determining.

  The identification apparatus of the present invention comprises: an imaging unit configured to capture a transmission image including information related to an internal pattern of a substrate; a feature extraction unit configured to extract a feature from information related to the internal pattern included in the transmission image captured by the imaging unit; An identification device comprising: storage means for storing the feature amount extracted by the feature amount extraction means in association with the substrate information of the front substrate.

  The identification method of the present invention stores feature quantities based on the internal pattern of a predetermined substrate, captures a transmission image including information on the internal pattern of the target substrate, and uses information on the internal pattern included in the captured transmission image When the feature quantity of the target board is extracted and the extracted feature quantity is stored, it is determined that the target board is a predetermined board.

  The traceability system of the present invention is installed in each process of a circuit board production line, outputs a detection signal when a target board is detected in each process, and collects the results of process work on the target board in each process A plurality of information collecting means for outputting and a detection signal outputted by the information collecting means, and extracting a feature quantity of the target substrate according to the inputted detection signal, and using the extracted feature quantity An identification device that performs registration or verification and outputs substrate information including the time when the target substrate has passed the process, and a process work content output by the information collecting means, and output by the identification device A production history server for registering board information, and the identification device includes storage means for storing feature quantities based on an internal pattern of a predetermined board; The target substrate is provided in each step of the production line, the imaging unit configured to capture a transmission image including information on the internal pattern of the target substrate, and the imaging unit installed in the information collecting unit that outputs the detection signal according to the detection signal. A control unit that performs control for capturing a transparent image of the image, a feature amount extraction unit that extracts a feature amount of the target substrate from information related to an internal pattern included in the transparent image captured by the imaging unit, and a feature extracted by the feature amount extraction unit When the amount is stored in the storage means, the verification determination means that determines that the target substrate is a predetermined substrate, the detection signal is received from the plurality of information collection devices, and the substrate information of the target substrate is sent to the production history server Communication means for transmitting.

  According to the present invention, it is possible to provide an identification device, an identification method, and a traceability system that can identify individual substrates at any stage of the SMT process without giving individual identification information for identifying the substrates to the substrate. Become.

It is a block diagram which shows the structure of the identification device which concerns on the 1st Embodiment of this invention. It is a conceptual diagram which shows an example of the manufacturing process of the circuit board made into object by embodiment of this invention. It is a conceptual diagram regarding the etching process of the circuit board made into object by embodiment of this invention. It is a conceptual diagram for demonstrating the process of the etching process of the circuit board made into object by embodiment of this invention. It is a flowchart which shows operation | movement of the identification device which concerns on the 1st Embodiment of this invention. It is a block diagram which shows the structure of the identification device which concerns on the 2nd Embodiment of this invention. It is an example of the feature-value table which the identification apparatus which concerns on the 2nd Embodiment of this invention stores. It is a conceptual diagram which shows an example of the feature-value extraction area | region which shows the area | region which the identification device based on the 2nd Embodiment of this invention extracts a feature-value. It is a conceptual diagram which shows an example of the X-ray image obtained when the identification apparatus which concerns on the 2nd Embodiment of this invention images a feature-value extraction area | region. It is a conceptual diagram which shows an example which extracted the edge of the X-ray image obtained when the identification device which concerns on the 2nd Embodiment of this invention imaged the feature-value extraction area | region. It is a conceptual diagram which shows an example which binarized the X-ray image obtained when the identification device which concerns on the 2nd Embodiment of this invention images the feature-value extraction area | region. It is a graph which shows the waveform of the binary information obtained from the X-ray image extracted by the identification device which concerns on the 2nd Embodiment of this invention. It is a flowchart which shows operation | movement of the identification device which concerns on the 2nd Embodiment of this invention. It is a block diagram which shows the structure of the modification of the identification apparatus which concerns on the 2nd Embodiment of this invention. It is a block diagram showing composition of a traceability system concerning a 3rd embodiment of the present invention. It is a block diagram which shows the structure of the identification device which concerns on the 3rd Embodiment of this invention. It is a flowchart which shows an example of operation | movement of the traceability system which concerns on the 3rd Embodiment of this invention.

  EMBODIMENT OF THE INVENTION Below, the form for implementing this invention is demonstrated using drawing. However, the embodiments described below are technically preferable limitations for carrying out the present invention, but the scope of the invention is not limited to the following. In all the drawings used in the description of the embodiments below, the same reference numerals are given to the same parts unless there is a specific reason. In the following embodiments, the same configuration and operation may not be repeatedly described.

First Embodiment
〔Constitution〕
FIG. 1 is a block diagram showing a configuration of an identification device 1 according to a first embodiment of the present invention. As shown in FIG. 1, the identification device 1 according to the present embodiment includes a storage unit 12, an X-ray imaging unit 13, a feature amount extraction unit 14, and a collation determination unit 15. For example, in the SMT (Surface Mount Technology) process, the identification device 1 according to the present embodiment captures a board constituting a circuit board with an X-ray camera, and extracts a feature amount using an internal pattern in the captured X-ray image. Do.

  The storage unit 12 stores the feature quantity based on the internal pattern of the target board as individual identification information for uniquely specifying the board. The feature value based on the internal pattern of the substrate is solid identification information unique to each substrate. In the following, the substrate may be simply referred to as a substrate.

  The X-ray imaging unit 13 (also referred to as an imaging unit) captures an X-ray image including information of the internal pattern of the target substrate. That is, the imaging unit according to the present embodiment captures a transmission image including information on the internal pattern of the target substrate. Note that the X-ray imaging unit 13 may be replaced with another imaging unit that can transmit images inside the substrate such as gamma rays. In the following, an example in which the imaging unit obtains a transmission image (X-ray image) by X-rays is described. However, when gamma rays are used, the X-ray imaging unit may be replaced with a gamma ray imaging unit.

  The X-ray imaging means 13 has a resolution and a magnification that can sufficiently acquire the internal pattern of the target substrate. The X-ray imaging means 13 installs the X-ray imaging means 13 at a position of an appropriate focal length matched to the position of the substrate, or the X-ray imaging means 13 appropriately. Place the substrate at the focal length position. The number of X-ray imaging means 13 is not limited to one, and a plurality of X-ray imaging means 13 may be installed.

  The feature amount extraction unit 14 extracts the feature amount of the substrate from the information on the internal pattern of the target substrate included in the X-ray image captured by the X-ray imaging unit 13. The feature quantity extraction unit 14 may register the feature quantity extracted from the internal pattern in the storage unit 12 in association with the substrate information of the substrate.

  The collation determination means 15 compares the feature quantity extracted by the feature quantity extraction means 14 with the feature quantity stored in the storage means 12. When the feature amount extracted by the feature amount extraction unit 14 is stored in the storage unit 12, the matching determination unit 15 determines that the target substrate is a substrate corresponding to the feature amount. The identification device 1 may perform the operation until the feature amount extracted from the information on the internal pattern of the substrate is registered, and the collation determination unit 15 may be omitted when the collation of the target substrate is not performed.

  The above is the description of the configuration of the identification device 1 according to the present embodiment.

  Here, the board | substrate made into object by this embodiment is demonstrated. In the embodiment of the present invention, the internal identification of the substrate is performed using the internal pattern of the substrate as the feature value.

  FIG. 2 is a conceptual view showing an example of a manufacturing process of a substrate targeted in the present embodiment.

  As shown in FIG. 2, each layer of the substrate is manufactured through steps such as resist coating treatment, exposure treatment, development treatment, etching treatment and resist peeling treatment.

  In the resist coating process, the resist 103 is applied on the base material 101 to which the copper foil 102 is attached. In the exposure process, the resist pattern 103 is exposed to form the etching pattern 104 in order to form the circuit pattern 105. In the development process, the resist 103 other than the etching pattern 104 is removed. In the etching process, the circuit pattern 105 is formed by etching the copper foil 102 not covered with the etching pattern 104. In the resist stripping process, the etching pattern 104 is removed. A substrate can be obtained by applying pressure on the layer on which the circuit pattern 105 is formed in a procedure as shown in FIG.

  When a circuit board is manufactured by the process as shown in FIG. 2, even if the circuit board is manufactured in the same manner, a subtle difference appears in the circuit pattern for each circuit board.

  For example, in the etching process, as shown in FIG. 3, the substrate 100 is placed in a chemical bath 200 containing a chemical solution 201 that dissolves the uncured resist 103 and the copper foil 102, and a jet of the chemical solution 201 is applied to the substrate 100. Etching is performed.

  At this time, as shown in FIG. 4, the amount of the copper foil 102 to be melted changes depending on the state of the chemical solution 201 and the strength with which the jet flows against the substrate 100, and the circuit pattern slightly changes. Therefore, even if products of the same specifications are manufactured in the same process, the circuit pattern differs from product to product.

  In the embodiment of the present invention, the characteristics of such a circuit board are utilized, and individual identification of the board is performed without using a new identifier such as a bar code. Specifically, a circuit pattern inside the substrate is imaged by X-rays, and individual identification of the substrate is performed based on the feature amount related to the circuit pattern.

[Operation]
Next, the operation of the identification device 1 according to the present embodiment will be described with reference to FIG. However, in the example of FIG. 5, it is assumed that a feature amount (solid identification information) based on an internal pattern of a predetermined substrate is stored in the storage unit 12.

  In the flowchart of FIG. 5, first, the X-ray imaging unit 13 captures an X-ray image including the internal pattern of the target substrate (step S11). In addition, when installing a target board | substrate in the position imaged by the X-ray imaging means 13, you may make it install by a user, for example, and you may make it convey automatically.

  The feature quantity extraction unit 14 extracts the feature quantity (individual identification information) of the target substrate from information about the internal pattern included in the X-ray image captured by the X-ray imaging unit 13 (step S12).

  Then, the matching determination means 15 checks whether the feature quantity extracted by the feature quantity extraction means 14 is stored in the storage means 12 (step S13). That is, the collation determination unit 15 checks whether or not the feature amount (individual identification information) of the target substrate imaged by the X-ray imaging unit 13 matches the feature amount (individual identification information) stored in the storage unit 12. .

  When the feature amount of the symmetric board matches the feature amount stored in the storage unit 12 (Yes in step S13), the collation determination unit 15 determines that the target substrate is a substrate having the feature amount stored in the storage unit 12. Determination is made (step S14). That is, the collation determination unit 15 determines that the substrate corresponding to the feature amount stored in the storage unit 12 and the target substrate are the same substrate, and specifies the target substrate.

  On the other hand, when the feature quantity of the symmetric substrate does not match the feature quantity stored in the storage unit 12 (No in step S13), the collation determination unit 15 determines that the target board has a feature quantity stored in the storage unit 12. Judge that there is no. Therefore, the collation determination unit 15 determines that the substrate corresponding to the feature quantity stored in the storage unit 12 and the target substrate are not the same substrate, and the target substrate is not specified.

  The above is description about operation | movement of the identification device 1 which concerns on this embodiment.

  As described above, in this embodiment, the characteristic amount (individual identification information) of a specific substrate is stored. And in this embodiment, the image containing the information regarding the internal pattern of a board | substrate is imaged, and the feature-value (individual identification information) of a target board | substrate is extracted from the information regarding the internal pattern contained in the imaged image. Then, in the present embodiment, when the extracted feature amount is stored, it is determined that the target substrate is a substrate corresponding to the feature amount.

  Since the internal pattern of the substrate does not change in any step in the SMT process, the feature amount (individual identification information) extracted from the internal pattern of the substrate does not change. Therefore, according to the present embodiment, individual substrates can be identified at any step in the SMT process without providing individual identification information for identifying the substrate to the substrate.

Second Embodiment
〔Constitution〕
FIG. 6 is a diagram showing an example of the identification device 2 according to the second embodiment of the present invention. As shown in FIG. 6, the identification device 2 according to the present embodiment has a configuration in which a control unit 16 is added to the identification device 1 according to the first embodiment. In the following, the description of the same parts as those of the first embodiment will be omitted, and the different parts will be described.

  The identification device 2 according to this embodiment includes a storage unit 12, an X-ray imaging unit 13, a feature amount extraction unit 14, a collation determination unit 15, and a control unit 16.

  The control unit 16 controls the X-ray imaging unit 13 in accordance with an imaging instruction signal (also referred to as an instruction signal). The imaging instruction signal includes a board registration instruction signal for newly registering a feature quantity of the target board and a known feature quantity stored in the storage means 12 with respect to the target board imaged by the X-ray imaging means 13. And a board collation instruction signal to be collated.

  For example, the control unit 16 detects a shooting instruction signal generated by pressing a board shooting switch of an operation unit (not shown), and stores the type of the detected shooting instruction signal in the temporary holding area of the storage unit 12. For example, the type of the imaging instruction signal includes a board registration instruction signal for registering the target board in the storage unit 12 and a board verification instruction signal for checking the board registered in the storage unit 12 and the target board.

  When the control unit 16 registers the target substrate in the storage unit 12, the control unit 16 causes the X-ray imaging unit 13 to image the target substrate. At this time, the control means 16 receives the information on the target substrate from the operation unit and the external system (for example, the upper system), and stores the received information on the target substrate (hereinafter referred to as substrate information) in the temporary holding area of the storage means 12 To do. For example, the board information is a product name or product number of the board. The product number can also be regarded as an identifier (Identifier) uniquely assigned to the product.

  The control means 16 combines the new board information obtained by adding the registration date and time (current date and time) to the board information stored in the temporary holding area of the storage means 12 and the feature quantity extracted by the feature quantity extraction means 14. It is stored in the data storage area of the storage means 12. FIG. 7 shows a feature amount table 21 as an example of a combination of substrate information and feature amounts.

  Hereinafter, a method of combining the substrate information of the target substrate and the feature amount and storing the information in the storage unit 12 will be described. When the control unit 16 receives a substrate registration signal as an imaging instruction signal, the control unit 16 stores the substrate information of the target substrate and the feature amount in the storage unit 12.

  First, the control unit 16 controls the X-ray imaging unit 13 to image the target substrate in accordance with the imaging instruction signal. Under the control of the control means 16, the X-ray imaging means 13 captures an X-ray image including information on the internal pattern of the target substrate.

  The feature amount extraction unit 14 extracts the feature amount of the substrate from the information on the internal pattern included in the X-ray image captured by the X-ray imaging unit 13.

  Then, the feature quantity extraction unit 14 stores the feature quantity extracted by the feature quantity extraction unit 14 in the primary holding area of the storage unit 12 when the board registration instruction signal is received. At this time, the control unit 16 combines the substrate information of the target substrate stored in the primary holding area and the feature amount and stores the combined information in the data storage area of the storage unit 12.

  The above is the description of the configuration of the identification device 2 according to the present embodiment.

[Operation]
Next, the operation of the identification device 2 according to the present embodiment will be described with reference to FIGS.

  As shown in FIG. 8, in the present embodiment, the feature amount is obtained from at least one predetermined region on the target substrate 100 (also referred to as a feature amount extraction region 110). The feature amount extraction region 110 is preferably, for example, a location where no part is mounted or a location including a through hole where many wires overlap. In the example of FIG. 8, an example in which three regions are used as the feature value extraction region 110 is shown.

  The feature amount in the present embodiment is information on the internal pattern of the target substrate, and may be information including at least one of outer shape (contour) information, luminance information, and binary information of the X-ray image.

  FIG. 9 is an example of an X-ray image obtained when one of the feature quantity extraction areas 110 of the target substrate is imaged. When luminance information is used as a feature amount, the X-ray image 131 of FIG. 9 is used as a feature amount as it is.

  When external shape (contour) information is used as a feature, as shown in FIG. 10, an image 132 obtained by extracting an edge of the X-ray image 131 of FIG. 9 is used as a feature. The edge-extracted image 132 can be obtained by first-order differentiation (difference) of the X-ray image 131 of the feature amount extraction region 110. For example, an edge can be detected from the X-ray image 131 by calculating (spatial first-order differentiation) on nine pixel values in the vertical and horizontal directions centered on the pixel of interest using a known Sobel filter. .

  When binary information is used as a feature amount, the X-ray image 131 of FIG. 10 is binarized as an image of FIG. 11 (hereinafter, a binarized image 133). For example, using a threshold obtained in advance, binarization is performed with a value less than the threshold being 0 and a value greater than or equal to the threshold being 1. In the example of FIG. 11, a region with a value of 0 is shown in black and a region with a value of 1 is shown in white. The binary information obtained as the binarized image 133 in FIG. 11 can be used as a feature amount as it is.

  In addition, regarding the binarized image 133 in FIG. 11, changes in values (0, 1) when the position at a distance L from the lower side of the binarized image 133 is scanned in the x-axis direction are plotted as shown in FIG. 12. The overall shape of the waveform as shown in FIG. 12 may be used as the feature amount.

  In the case where luminance information, outer shape information, and binary information itself are used as feature amounts, the collation determination unit 15 may perform the substrate collation using pattern matching. In addition, when using the waveform of the binary information as the feature amount, the collation determination unit 15 may search for the same waveform.

  Here, the operation of the identification device 2 according to the present embodiment will be described using the flowchart of FIG. In the flowchart of FIG. 13, a target board is set in the imaging range of the X-ray imaging unit 13 by a user operation, a board imaging switch of an operation unit (not shown) is pressed, and an imaging instruction signal is generated. The operation is shown.

  The board photographing switch includes, for example, a board photographing switch for board registration and a board photographing switch for board verification. The board photographing switch for board registration generates a board registration instruction signal. The board verification switch for board verification generates a board verification instruction signal. That is, the imaging instruction signal includes the substrate registration instruction signal and the substrate matching instruction signal.

  In FIG. 13, the control means 16 first issues an imaging instruction to the X-ray imaging means 13 when receiving an imaging instruction signal indicating depression of the board imaging switch (Yes in step S201). Note that if an imaging instruction signal indicating depression of the board imaging switch has not been received (No in step S201), the process waits.

  At this time, the control means 16 detects any one of the substrate registration instruction signal and the substrate collation instruction signal from the photographing instruction signal, and stores the detected instruction signal type in the temporary storage area of the storage means 12. Further, when the type of the detected instruction signal is a board registration instruction signal, the control means 16 receives the board information of the target board placed in the imaging range of the X-ray imaging means 13 from an operation unit (not shown) or an external host system. The received board information is stored in the temporary storage area of the storage means 12. The board information includes the product name and product number (ID) of the board.

  Next, the X-ray imaging unit 13 receives an imaging instruction from the control unit 16 and captures an X-ray image including the internal pattern of the target substrate placed in the imaging range of the X-ray imaging unit 13 (step S202).

  Next, the feature quantity extraction unit 14 extracts the feature quantity (individual identification information) of the target board from the information related to the internal pattern of the board included in the X-ray image captured by the X-ray imaging unit 13 (step S203).

  Next, the control means 16 checks whether the type of signal detected in step S201 and stored in the temporary storage area of the storage means 12 is either a board registration instruction signal or a board verification instruction signal (step S204). . In FIG. 13, it is checked in step S204 whether the type of the signal stored in the temporary storage area of the storage unit 12 is a substrate registration instruction signal.

  In step S204, if the type of signal stored in the temporary storage area of the storage unit 12 is a board registration instruction signal (Yes in step S204), the process proceeds to step S205, and if it is not a board registration instruction signal (in step S204). No) The process proceeds to step S206.

  When the type of the signal stored in the temporary storage area of the storage unit 12 is the board registration instruction signal (Yes in step S204), the feature amount extraction unit 14 stores the feature amount extracted in step S203 in the data storage of the storage unit 12. It stores in the area (step S205). At this time, the control unit 16 extracts the new board information obtained by adding the registration date and time (current date and time) to the board information stored in the temporary storage area of the storage unit 12 in step S201. And stored in the data storage area of the storage means 12. After step S205, the process returns to step S201.

  On the other hand, when the type of the signal stored in the temporary storage area of the storage unit 12 is not the board registration instruction signal (No in step S204), the collation determination unit 15 stores the feature amount extracted by the feature amount extraction unit 14 as the storage unit. 12 is checked (step S206). That is, the collation determination unit 15 is installed in the imaging region of the X-ray imaging unit 13, and the feature amount (individual identification information) of the target substrate imaged by the X-ray imaging unit 13 is stored in the storage unit 12 ( (Individual identification information).

  In step S206, when the feature quantity of the target board imaged by the X-ray imaging unit 13 matches the feature quantity stored in the storage unit 12 (Yes in step S206), the process proceeds to step S207. The process proceeds to step S209.

  When the feature quantity of the target board imaged by the X-ray imaging means 13 matches the feature quantity stored in the storage means 12 (Yes in step S206), the collation determination means 15 stores the target board in the storage means 12. It is determined that the board is the same as the board having the feature amount (step S207). And the collation determination means 15 acquires the board | substrate information corresponding to this feature-value from the data storage area of the storage means 12. FIG.

  And the collation determination means 15 respond | corresponds to the board | substrate with the display which shows that the board | substrate installed in the imaging area of the X-ray imaging means 13 is the same as the board | substrate provided with the feature-value stored in the storage means 12. The board information is displayed on a display unit (not shown) (step S208). After step S208, when the process is continued (Yes in step S211), the process returns to step S201. When the process is not continued (No in step S211), the process according to the flowchart of FIG.

  On the other hand, when the feature quantity of the target board imaged by the X-ray imaging unit 13 does not match the feature quantity stored in the storage unit 12 (No in step S208), the collation determination unit 15 sets the target board in the storage unit 12. It is determined that the board does not have the stored feature amount (step S209).

  And the collation determination means 15 displays a display (not shown) indicating that the board installed in front of the X-ray imaging means 13 is not the same board as the board having the feature quantity stored in the storage means 12. (Step S210). If the process is continued after step S210 (Yes in step S211), the process returns to step S201. If the process is not continued (No in step S211), the process according to the flowchart of FIG.

  The above is description about operation | movement of the identification device 2 which concerns on this embodiment.

  As described above, according to the present embodiment, the feature quantity of the target board is registered in association with the board information, and the target board is identified by collating the feature quantity extracted from the target board with the registered feature quantity. Can be identified.

  Further, in the present embodiment, information on the internal pattern of the substrate (one or more of the outer shape information, the luminance information, and the binary information) is used as the feature amount of the target substrate. Therefore, according to the present embodiment, an appropriate feature amount can be selected in accordance with the ease of feature amount extraction and the like.

(Modification)
Here, FIG. 14 shows a configuration of a modification (identification device 2-2) of the identification device 2 according to the present embodiment. The identification device 2-2 includes a display unit 17 that receives the determination result of the matching determination unit 15 and displays the determination result. The display unit 17 is realized by, for example, a display display or a printer. The display unit 17 may be provided outside the identification device 2.

  The display unit 17 displays the determination result and the substrate information in association with each other in response to the process in step S208 in the flowchart of FIG. 13, and displays the determination result in association with the process in step S210.

Third Embodiment
〔Constitution〕
FIG. 15 is a view showing the configuration of a substrate traceability system 30 according to the third embodiment of the present invention. The traceability system 30 according to the present embodiment includes an identification device 3, an information collection device 31 (31-1, 31-2, ..., 31-n), and a production history server 32 (n is a natural number). .

  The identification device 3 has a configuration in which the communication unit 18 is added to the identification device 2 according to the second embodiment as shown in FIG. The communication unit 18 is a unit for communicating with the production history server 31, and is a general communication device. In the following, description of the same parts as those of the first and second embodiments will be omitted, and different parts will be described.

  The information collecting device 31 is installed in each process (n process) in manufacturing a circuit board. Each information collection device 31 is connected in series, and collects the results of the process work contents in a plurality of processes (n processes) for performing processing such as assembly and inspection of the substrate to the product. The information collection device 31 in each process has a detector that detects that the substrate has arrived, and transmits a detection signal indicating that the substrate has been detected by the detector to the identification device 3. The information collection device 41 is realized by, for example, a general computer or server.

  The production history server 32 includes a plurality of processes such as substrate processing, assembly, inspection, and incorporation into a product, a substrate passage history acquired from a plurality of information collecting apparatuses 31 according to the plurality of processes, and an operation history of the apparatus. And register. The production history server 32 is a general server connected to the plurality of information collection devices 31 and the identification device 3 by a network such as a LAN (Local Area Network) or the Internet, for example.

  The identification device 3 includes at least one X-ray imaging unit 13 corresponding to the information collection device 31 installed in each process. The identification device 3 may be provided with a plurality of X-ray imaging devices 13 in association with the respective information collection devices 31.

  In the first step, when the feature amount of the target substrate is extracted, the identification device 3 registers the substrate corresponding to the extracted feature amount. When the identification device 3 receives the detection signal (first detection signal) from the information collection device 31-1 in the first step, the X-ray imaging unit 13 (first X-ray) installed in the information collection device 31-1. An X-ray image including information on the internal pattern of the target substrate is taken by the line imaging means).

  Then, the identification device 3 extracts the feature amount of the substrate from the information regarding the internal pattern included in the image captured by the X-ray imaging unit 13 (first X-ray imaging unit), and stores the extracted feature amount in the storage unit 12. Store.

  Then, the identification device 3 registers substrate information (the product name of the substrate, the ID, the passage date and time) including the processing date and time of the first step of the target substrate in the storage unit 12. Further, the identification device 3 transmits substrate information including the processing date and time of the first step of the target substrate to the production history server 32.

  In the kth step after the second step, when the feature amount of the target substrate is extracted, the identification device 3 collates the substrate using the extracted feature amount (k = 2 to n). When the identification device 3 receives the detection signal (kth detection signal) from the information collection device 31-k in the kth process, the X-ray imaging means 13 installed in the information collection device 31-k in the kth process. The (k-th X-ray imaging unit) captures an image including information on the internal pattern of the target substrate.

  The identification device 3 extracts the feature amount of the substrate from the information on the internal pattern included in the image captured by the X-ray imaging unit 13 (k-th imaging unit). Then, when the extracted feature value is stored in the storage unit 12, the identification device 3 determines that the target board has been verified, and sends the board information including the passage date and time of the kth process to the production history server 32. sign up. The substrate information is information including a product name of the substrate, an ID, a passing date and time, and the like.

  The above is the description of the configuration of the traceability system 30 according to the present embodiment.

[Operation]
Next, the operation of the traceability system 30 according to the present embodiment will be described with reference to FIG. FIG. 17 is a flowchart showing the operation of the traceability system 30 according to this embodiment.

  In the example of FIG. 17, the traceability system of a substrate in an assembly line is assumed and explained. As for the assembly line, the process of assembling hand-manufactured parts to the board on which the parts are mounted in the SMT process (first process), the process of assembling the board and other components in the product (second process), and various inspections A line including a process (third process) to be performed is assumed. At the entrance of each process, three X-ray imaging means 13 (first X-ray imaging means, second X-ray imaging means, third X-ray imaging means) corresponding to each information collecting apparatus 31 is set up. In the following example, it is assumed that the feature amount is not given to the target substrate before the first step.

  When the target board is sent to the first process, parts that cannot be mounted in the SMT process are handed by an operator.

  First, when the target substrate is sent, the first detector of the information collecting device 31-1 detects the target substrate and outputs a first detection signal (step S301). The first detector corresponds to a board photographing switch for board registration. That is, the first detection signal output by the first detector corresponds to a substrate registration instruction signal. In this example, it is assumed that the feature amount of the target substrate has not been registered before the first step. However, if the feature amount of the target substrate has already been registered before the first step, the first detector Outputs a substrate matching instruction signal.

  Next, upon receiving the first detection signal, the identification device 3 images the mounting state of the component on the target substrate by the first X-ray imaging means, and acquires an image including the internal pattern in the target substrate ((1) Step S302).

  The identification device 3 extracts the feature amount of the target substrate from the information regarding the internal pattern included in the acquired image, and stores the extracted feature amount in the storage unit 12 (step S303). And board | substrate information is input into the identification device 3 based on a worker's operation. The board information is the product name, product number, etc. of the board. The identification device 3 stores the input board information in the storage unit 12. Further, the identification device 3 registers the substrate information (the product name of the substrate, the product number, the passage date and time) to which the passage date and time of the first step is added in the production history server 32 as a substrate passage history. The passage date may be regarded as the registration date or the current time. If the feature amount of the target substrate is already registered before the first step, the new substrate information including the passing date and time of the first step is added to the substrate information of the target substrate corresponding to the extracted feature amount. What is necessary is just to store in the storage means 12.

  When the operation of the first process is completed, the target substrate is sent to the second process. At this time, the information collection device 31-1 transmits the information on the handed part to the production history server 32 (step S304). The production history server 32 stores the received information regarding the parts as a work history. Here, the work history is work content information including, for example, a part type, a manufacturing number, and a worker ID.

  When the target substrate is sent to the second step, the substrate and other components are incorporated into the product by, for example, a worker. The incorporation of the substrate and other components into the product may be automated by a robot, an apparatus, or the like.

  When the target substrate is sent, the second detector of the information collecting device 31-2 detects the target substrate and outputs a second detection signal (step S305). The second detector corresponds to a board photographing switch for board verification. That is, the second detection signal output by the second detector corresponds to the substrate matching instruction signal.

  When receiving the second detection signal, the identification device 3 images the internal pattern of the target substrate by the second X-ray imaging unit, and acquires an X-ray image including the internal pattern (step S306).

  The identification device 3 extracts the feature amount of the target substrate from the information regarding the internal pattern included in the acquired X-ray image (step S307). Then, the identification device 3 stores, in the storage unit 12, new board information including the passage date and time of the second step in the board information of the target board stored in step S301 in association with the extracted feature amount. Further, the identification device 3 registers the new substrate information (substrate product name, product number, passage date and time) in the production history server 32 as a substrate passage history.

  When the operation of the second step is completed, the target substrate is sent to the third step. At this time, the information collection device 31-2 transmits information on the work in which the substrate and the other parts are incorporated in the product to the production history server 32 (step S308). The production history server 32 stores information regarding the received work as a work history. Here, the work information is work content information including, for example, the type and manufacturing number of other parts assembled, a worker ID, and the like.

  When a product including the target substrate is sent to the third step, various inspections such as an appearance inspection and an electrical inspection of the product including the target substrate are performed by an operator, for example. Note that various inspections such as an appearance inspection and an electric inspection of a product including a target substrate may be automated by a robot, an inspection apparatus, or the like.

  When a product including the target substrate is sent, the third detector of the information collection device 31-3 detects the target substrate and outputs a third detection signal (step S309). The third detector corresponds to a board photographing switch for board verification. That is, the third detection signal output by the third detector corresponds to the substrate matching instruction signal.

  When receiving the third detection signal, the identification device 3 images the internal pattern of the target substrate by the third X-ray imaging unit, and acquires an X-ray image including the internal pattern (step S310).

  The identification device 3 extracts the feature amount of the target substrate from the information on the internal pattern included in the acquired X-ray image (step S311). Then, the identification device 3 stores, in the storage unit 12, new board information including the passage date and time of the third step in the board information of the target board stored in Step S <b> 301 in association with the extracted feature amount. Further, the identification device 3 registers the new substrate information (substrate product name, product number, passage date and time) in the production history server 32 as a substrate passage history.

  When the work of the third step is completed, the product including the target substrate is shipped. At this time, the information collection device 31-3 transmits information on various inspections to the production history server 32 (step S312). The production history server 32 stores the received information regarding the inspection as a work history. Here, the work information is work content information including, for example, inspection contents, inspection results, worker IDs, and the like.

  According to the process according to the flowchart of FIG. 17, for example, the following can be understood based on the substrate passing history and the work history registered in the production history server 32.

  In step S304, “November 11, 10:00, Substrate A” is recorded in the board passage history of the first process, and “Assembly of Q type parts” is recorded in the work history of the first process. It shall be done. Further, in step S308, it is assumed that "substrate A" at 10: 00:30 on November 11 is recorded in the substrate passage history of the second step. At this time, on the basis of the substrate passing history of the first and second steps and the operation history of the first step, the processing time of the operation in the first step is 10:00:00 on November 11. It is understood that it is 30 seconds from. In addition, based on the substrate passage history and work history in the first step, it can be seen that the Q-type parts are assembled on the substrate A in the work in the first step.

  As described above, according to the present embodiment, the production history server 32 combines the substrate passage history transmitted by the identification device 3 and the work history transmitted by the information collection device 31 of each step, thereby allowing the post-SMT process. Traceability of the substrate can be obtained at any stage.

  According to the above first to third embodiments, an identification device, an identification method and a traceability system capable of identifying a substrate in any process without providing individual identification information for identifying the substrate to the substrate are provided. can do.

  Moreover, according to the first to third embodiments, it is possible to provide an identification device, an identification method, and a traceability system capable of accurate solid identification over a long period of time. This is because, in a normal product, the substrate is in the product housing and is resistant to external forces and changes over time. Moreover, since the resist process for preventing oxidation and corrosion is given to the surface of a board | substrate, the feature-value based on the layer shift contained in the inside of the board | substrate is more resistant to a time-dependent change.

Although the present invention has been described above with reference to the embodiments, the present invention is not limited to the above embodiments. Various modifications that can be understood by those skilled in the art can be made to the configuration and details of the present invention within the scope of the present invention.
[Appendix]
Some or all of the above embodiments may be described as in the following appendices, but is not limited to the following.
(Supplementary Note 1)
Storage means for storing a feature quantity based on an internal pattern of a predetermined substrate;
Imaging means for capturing a transmission image including information on the internal pattern of the target substrate;
Feature quantity extraction means for extracting the feature quantity of the target substrate from the information on the internal pattern included in the transmission image picked up by the image pickup means;
An identification apparatus comprising: a collation determination unit that determines that the target substrate is the predetermined substrate when the feature amount extracted by the feature amount extraction unit is stored in the storage unit.
(Supplementary Note 2)
The identification apparatus according to claim 1, further comprising a control unit configured to control the imaging unit to capture a transmission image of the target substrate in response to an instruction signal for imaging the target substrate.
(Supplementary Note 3)
The instruction signal includes a substrate registration instruction signal instructing substrate registration, and a substrate matching instruction signal instructing substrate matching.
When the instruction signal is the substrate registration instruction signal,
The control means
Controlling the imaging unit to capture a transmission image including information on an internal pattern of the target substrate;
The imaging means is
Capturing a transmission image including information on the internal pattern of the target substrate according to the control of the control means;
The feature quantity extraction unit
The identification according to appendix 2, wherein a feature amount of the target board is extracted from information regarding an internal pattern included in a transmission image captured by the imaging unit, and the extracted feature amount is stored in the storage unit as a feature amount of the target substrate. apparatus.
(Supplementary Note 4)
When the type of the instruction signal stored in the temporary storage area of the storage means indicates the substrate registration instruction signal:
The control means
Acquiring substrate information of the target substrate from a host system, and storing the acquired substrate information in a temporary storage area of the storage unit;
The feature quantity extraction unit
The identification apparatus according to appendix 3, wherein a feature amount extracted from information related to an internal pattern of the target substrate is registered in a data storage area of the storage unit in association with the substrate information of the target substrate.
(Supplementary Note 5)
When the type of the instruction signal stored in the temporary storage area of the storage means indicates the substrate matching instruction signal:
The collation judging means
The identification device according to appendix 3 or 4, wherein the feature quantity of the target substrate extracted by the feature quantity extraction unit is collated with the predetermined feature quantity stored in the storage unit.
(Supplementary Note 6)
The feature quantity extraction unit
The identification device according to any one of supplementary notes 1 to 5, wherein feature information based on an internal pattern is extracted using outline information of a transmission image including information on the internal pattern of the target substrate.
(Appendix 7)
The feature quantity extraction unit
7. The identification device according to any one of appendices 1 to 6, wherein an arbitrary edge is extracted from a transmission image captured by the imaging unit, and a feature amount relating to an internal pattern with the extracted edge as a reference is extracted.
(Supplementary Note 8)
The feature quantity extraction unit
The identification device according to any one of appendices 1 to 7, wherein luminance information of a transmission image including information related to the internal pattern of the target substrate is used to extract a feature amount based on the internal pattern.
(Appendix 9)
The feature quantity extraction unit
The supplementary information according to any one of appendices 1 to 8, wherein a feature amount based on an internal pattern is extracted using binary information obtained by binarizing a transmission image including information on the internal pattern of the target substrate. Identification device.
(Supplementary Note 10)
The imaging means is
The identification device according to any one of supplementary notes 1 to 9, wherein a transmission image including information on an internal pattern of the target substrate is captured by X-rays.
(Supplementary Note 11)
The imaging means is
The identification device according to any one of supplementary notes 1 to 9, wherein a transmission image including information on an internal pattern of the target substrate is captured by gamma rays.
(Supplementary Note 12)
The identification device according to any one of appendices 1 to 11, comprising a plurality of the imaging means.
(Supplementary Note 13)
The identification device according to any one of appendices 1 to 12, further comprising display means for displaying the determination result of the comparison determination means.
(Supplementary Note 14)
An imaging means for imaging a transmission image including information on an internal pattern of the substrate;
Feature amount extraction means for extracting a feature amount from information on an internal pattern included in the transmission image picked up by the image pickup means;
An identification device comprising: storage means for storing the feature amount extracted by the feature amount extraction means in association with the substrate information of the front substrate.
(Supplementary Note 15)
Stores feature quantities based on the internal pattern of a given board,
Capture a transmission image containing information about the internal pattern of the target substrate,
Extracting the feature quantity of the target substrate from the information about the internal pattern included in the captured transmission image;
The identification method which determines that the said object board | substrate is the said predetermined board | substrate, when the extracted feature-value is stored.
(Supplementary Note 16)
Installed in each process of the circuit board manufacturing line, and outputs a detection signal when the target board is detected in each process, and collects and outputs the results of the process work contents for the target board in each process Information collection means,
Either the detection signal output by the information collecting means is input, the feature amount of the target substrate is extracted according to the input detection signal, and either the registration or collation of the target substrate is performed using the extracted feature amount An identification device for outputting substrate information including the time when the target substrate has passed through the process, and
Along with the results of the process work contents output by the information collecting means, a production history server for registering the substrate information output by the identification device,
The identification device
Storage means for storing a feature quantity based on an internal pattern of a predetermined substrate;
An imaging unit configured to capture a transmission image provided in each process of the manufacturing line and including information on an internal pattern of the target substrate;
In accordance with the detection signal, a control unit that performs control to cause the imaging unit installed in the information collecting unit that has output the detection signal to capture a transmission image of the target substrate;
Feature quantity extraction means for extracting the feature quantity of the target substrate from the information on the internal pattern included in the transmission image picked up by the image pickup means;
When the feature quantity extracted by the feature quantity extraction unit is stored in the storage unit, a collation determination unit that determines that the target board is the predetermined board;
A traceability system comprising: communication means for receiving the detection signals from the plurality of information collecting apparatuses and transmitting board information of the target board to the production history server.

1, 2, 3 Identification device 12 Storage means 13 X-ray imaging means 14 Feature quantity extraction means 15 Collation determination means 16 Control means 17 Display means 18 Communication means 30 Traceability system 31 Information collection device 32 Production history server 100 Target substrate 101 Base material DESCRIPTION OF SYMBOLS 102 Copper foil 103 Resist 104 Etching pattern 110 Feature-value extraction area | region 131 X-ray image 132 Image 133 Binary image 200 Chemical solution bowl 201 Chemical solution

Claims (10)

Storage means for storing a feature based on the internal pattern of the substrate as solid identification information uniquely identifying the substrate;
Imaging means for capturing a transmission image including information on the internal pattern of the target substrate;
Feature quantity extraction means for extracting a feature quantity based on the internal pattern of the target substrate from information on the internal pattern included in the transmission image captured by the imaging means;
If the characteristic amount based on the internal pattern of the target substrate to the feature amount extracting means has extracted feature amount and based on the internal pattern of the substrate which is stored in the storage unit match, the target substrate before identification apparatus and a determining match determination means that the Kimoto plate. In response to an instruction signal for imaging the target substrate, the imaging unit includes a control unit that performs control for capturing a transmission image of the target substrate.
The instruction signal includes either one of a board registration instruction signal for instructing board registration and a board verification instruction signal for instructing board verification,
When the instruction signal is the substrate registration instruction signal,
The control means
Control the imaging means to capture a transmission image including information on the internal pattern of the target substrate;
The imaging means is
In accordance with the control of the control means, capture a transmission image including information on the internal pattern of the target substrate,
The feature quantity extraction unit
The feature amount of the target board is extracted from information about an internal pattern included in a transmission image captured by the imaging unit, and the extracted feature amount is stored in the storage unit as a feature amount of the target board. Identification device. The feature quantity extraction unit
The identification apparatus according to claim 1, wherein a feature amount based on the internal pattern is extracted using outer shape information of a transmission image including information on the internal pattern of the target substrate. The feature quantity extraction unit
4. The identification device according to claim 1, wherein a feature amount based on an internal pattern is extracted using luminance information of a transmission image including information on the internal pattern of the target substrate. The feature quantity extraction unit
The feature amount based on the internal pattern is extracted using binary information obtained by binarizing a transmission image including information on the internal pattern of the target substrate. Identification device. The imaging means is
The identification device according to claim 1, wherein a transmission image including information on an internal pattern of the target substrate is captured by X-rays. The imaging means is
Identification device according to any one of claims 1 to 5 for imaging by gamma transparent image containing information about the internal pattern of the target substrate. An imaging means for imaging a transmission image including information on an internal pattern of the substrate;
Feature quantity extraction means for extracting a feature quantity based on the internal pattern of the substrate from information on the internal pattern included in the transmission image captured by the imaging means;
As individual identification information that uniquely identifies the substrate, identification device and a storage means for storing in association with substrate information before Symbol substrate feature amounts based on the internal pattern of the substrate that has been extracted by the feature extraction means . Storing a feature based on the internal pattern of the substrate as solid identification information uniquely identifying the substrate;
Capture a transmission image containing information about the internal pattern of the target substrate,
Extracting a feature based on the internal pattern of the target substrate from the information on the internal pattern included in the captured transmission image;
If the characteristic amount based on the internal pattern of the extracted the target substrate, a feature amount based on the internal pattern of the substrate that contains the matches, identification is determined that the target substrate is before Kimoto plate Method. Installed in each process of the circuit board manufacturing line, and outputs a detection signal when the target board is detected in each process, and collects and outputs the results of the process work contents for the target board in each process Information collection means,
Either the detection signal output by the information collecting means is input, the feature amount of the target substrate is extracted according to the input detection signal, and either the registration or collation of the target substrate is performed using the extracted feature amount An identification device for outputting substrate information including the time when the target substrate has passed through the process, and
Along with the results of the process work contents output by the information collecting means, a production history server for registering the substrate information output by the identification device,
The identification device
Storage means for storing a feature based on the internal pattern of the substrate as solid identification information uniquely identifying the substrate;
An imaging unit configured to capture a transmission image provided in each process of the manufacturing line and including information on an internal pattern of the target substrate;
In accordance with the detection signal, a control unit that performs control to cause the imaging unit installed in the information collecting unit that has output the detection signal to capture a transmission image of the target substrate;
Feature quantity extraction means for extracting a feature quantity based on the internal pattern of the target substrate from information on the internal pattern included in the transmission image captured by the imaging means;
If the characteristic amount based on the internal pattern of the target substrate to the feature amount extracting means has extracted feature amount and based on the internal pattern of the substrate which is stored in the storage unit match, the target substrate before and determining the match determination means that the Kimoto plate,
A traceability system comprising: communication means for receiving the detection signals from the plurality of information collecting apparatuses and transmitting board information of the target board to the production history server.