JP6734017B2 - Identification device, identification method, and traceability system - Google Patents

Description

The present invention relates to a board identification device, an identification method, and a traceability system.

When manufacturing and selling a circuit board such as a printed wiring board, traceability of the circuit board to be a product is required for the purpose of manufacturing process control, quality inspection, shipping inspection, sales management and the like. Generally, individual identification information such as a product name, a product number, and a manufacturing date is set on a circuit board, and the circuit board is traced based on the set individual identification information.

As a method of setting the individual identification information, there is a method of sticking a label such as a bar code or a QR code (registered trademark) on which the individual identification information is printed, or an RFID (Radio Frequency Identifier) storing the individual identification information to a circuit board. is there. There is also a method of directly printing individual identification information on a circuit board by using a laser marker, an inkjet or the like. These methods are methods of giving individual identification information for identifying a circuit board to the circuit board in order to identify each circuit board.

However, in order to obtain the traceability of the circuit board by the method of giving the individual identification information to the circuit board, a label attached to the board, a printing facility for printing on the board, and the like are required, which increases the manufacturing cost. Further, in the method of providing the individual identification information to the circuit board, it is necessary to attach the individual identification information to the board or print the board.

Patent Document 1 discloses an individual identification device capable of obtaining traceability of a circuit board without adding individual identification information for identifying each circuit board to the circuit board. The device of Patent Document 1 uses a combination of the difference between the measured values of the positions of a plurality of measurement targets (through holes, land patterns, wiring patterns, etc.) previously installed on the circuit board and the design values of these measurement targets. It is registered in association with the board identification code. And the apparatus of patent document 1 can identify each circuit board by the registered board identification code.

JP, 2013-69838, A

Generally, a circuit board is manufactured by manufacturing the board itself, forming through holes, land patterns, and wiring patterns on the manufactured board, then mounting circuit components on the board, and then soldering these circuit components onto the board. Manufactured by fixing.

The device of Patent Document 1 creates a board identification code by using a portion such as a through hole, a land pattern, or a wiring pattern formed after manufacturing the board itself. Therefore, the method of Patent Document 1 can be applied after forming measurement objects such as through holes, land patterns, and wiring patterns on the substrate, but cannot be applied before forming those measurement objects on the substrate. Further, after the circuit component is mounted on the substrate, the measurement target such as the through hole and the land pattern is hidden by the circuit component, which makes it difficult to accurately measure the position of the measurement target. In addition, after fixing the circuit components to the board with solder, the shapes of the measurement objects such as through holes, land patterns, and wiring patterns themselves may be deformed or soiled by the solder, so the positions of these measurement objects should be accurately measured. It becomes difficult to measure.

An object of the present invention is to provide an identification device, an identification method, and a traceability system that can identify individual boards at any stage after components are mounted on the board without giving individual identification information for identifying the board to the board. It is to be.

The identification device of the present invention includes a storage unit that stores a feature amount based on a soldering state of a predetermined board, an image capturing unit that captures an image including information about a soldering state of a target substrate, and an image captured by the image capturing unit. If the characteristic amount extraction unit that extracts the characteristic amount of the target substrate from the information about the solder state and the characteristic amount extracted by the characteristic amount extraction unit are stored in the storage unit, it is determined that the target substrate is the predetermined substrate. Collation determination means.

The identification device of the present invention is an image pickup unit that picks up an image including information about a solder state of a board, a feature amount extraction unit that extracts a feature amount from information about a solder state included in an image picked up by the image pickup unit, and a feature amount. And a storage unit that stores the feature amount extracted by the extraction unit in association with the board information of the previous board.

The identification method of the present invention stores a feature amount based on the solder state of a predetermined board, captures an image including information about the solder state of the target board, and determines the target board from the information about the solder state included in the captured image. When the extracted characteristic amount is stored and the extracted characteristic amount is stored, it is determined that the target substrate is a predetermined substrate.

The traceability system of the present invention is installed in each step of the manufacturing process of a product including a circuit board, outputs a detection signal when the target board is detected in each step, and the work content of the target board in each step. Of a plurality of information collecting means for collecting and outputting the results of the above, and the detection signal output by the information collecting means are input, the characteristic amount of the target substrate is extracted according to the input detection signal, and the extracted characteristic amount is used. The identification device that performs either registration or verification of the target substrate and outputs the substrate information including the time when the target substrate passed the process, and the identification result together with the track record of the process work content output by the information collecting means. The identification device includes a production history server that registers the board information output by the storage device, the storage device that stores the characteristic amount based on the solder state of a predetermined board, and the identification device that is provided in each step of the manufacturing process. A plurality of image pickup means for picking up an image including information about the solder state, a control means for controlling the image pickup means installed in the information collecting means that has output the detection signal to pick up the target substrate according to the detection signal, and an image pickup means When the feature amount extraction unit that extracts the feature amount of the target substrate from the information about the solder state included in the image captured by the unit and the feature amount extracted by the feature amount extraction unit are stored in the storage unit, the target substrate is a predetermined And a communication unit for receiving the detection signals from the plurality of information collecting devices and transmitting the board information of the target board to the production history server.

According to the present invention, there is provided an identification device, an identification method, and a traceability system that can identify individual boards at any stage after components are mounted on the boards without giving individual identification information for identifying the boards to the boards. It becomes possible to do.

It is a block diagram which shows the structure of the identification device which concerns on the 1st Embodiment of this invention. It is a flow chart which shows an example of operation of the discernment device concerning a 1st embodiment of the present invention. It is a top view which shows the example which the identification device which concerns on the 1st Embodiment of this invention imaged the soldering state on a board|substrate from the mounting surface side. It is a side view which shows the example which the identification device which concerns on the 1st Embodiment of this invention imaged the soldering state on a board|substrate from the board|substrate side. It is a block diagram which shows the structure of the identification device which concerns on the 2nd Embodiment of this invention. It is an example of a feature amount table indicating a combination of board information and a feature amount. It is a perspective view which shows an example of the feature-value extraction area which the identification device which concerns on the 2nd Embodiment of this invention makes an imaging target. It is a figure which shows an example which imaged the feature-value extraction area which the identification device which concerns on the 2nd Embodiment of this invention makes an imaging target from the mounting surface side of a board|substrate. It is a figure which shows the example which the identification apparatus which concerns on the 2nd Embodiment of this invention extracts the edge of the soldering state of the feature-value extraction area imaged from the mounting surface side of a board|substrate. It is a figure which shows an example which imaged the feature-value extraction area used as the imaging target by the identification device which concerns on the 2nd Embodiment of this invention from the board|substrate side. It is a figure which shows the example which the identification apparatus which concerns on the 2nd Embodiment of this invention extracts the edge of the soldering state of the feature-value extraction area imaged from the board|substrate side. It is a figure which shows the correspondence of the site|part containing the solder state imaged by the identification device which concerns on the 2nd Embodiment of this invention, and the graph of the hue value at the time of scanning the site|part containing the solder state. It is a figure which shows the correspondence of the site|part containing the solder state imaged by the identification device which concerns on the 2nd Embodiment of this invention, and the graph of the brightness value at the time of scanning the site|part containing the solder state. It is a flowchart which shows an example of operation|movement of the identification device which concerns on the 2nd Embodiment of this invention. It is a block diagram which shows the structure of the modification of the identification device which concerns on the 2nd Embodiment of this invention. It is a block diagram which shows the structure of the traceability system which concerns on the 3rd Embodiment of this invention. It is a block diagram which shows the structure of the identification device of the traceability system which concerns on the 3rd Embodiment of this invention. It is a flowchart which shows an example of operation|movement of the traceability system which concerns on the 3rd Embodiment of this invention.

Hereinafter, embodiments for carrying out the present invention will be described with reference to the drawings. However, the embodiments described below have technically preferable limitations for carrying out the present invention, but the scope of the invention is not limited to the following. In all the drawings used in the description of the embodiments below, like parts are designated by like reference numerals unless otherwise specified. Further, in the following embodiments, repeated description of similar configurations and operations may be omitted.

(First embodiment)
〔Constitution〕
FIG. 1 is a block diagram showing the configuration of an identification device 1 according to the first embodiment of the present invention. As shown in FIG. 1, the identification device 1 according to the present embodiment includes a storage unit 12, an imaging unit 13, a feature amount extraction unit 14, and a collation determination unit 15.

The storage unit 12 stores the characteristic amount based on the solder state on the board as individual identification information that uniquely identifies the board. The feature amount based on the solder state of the board includes information according to the solder shape such as the wetting/spreading state of the solder (outer contour, surface area), the height of the creep of the solder to the component, and the like. The hue information and the brightness information of the solder may be included in the feature amount based on the solder state.

When an electronic board is manufactured by mounting a component on a circuit board such as a printed wiring board, solder is used to electrically connect and fix the component to the wiring. Even if the soldering state is manufactured by the same process and conditions, the state of the soldering differs depending on the individual substrate such as a human fingerprint, depending on the melting and hardening. Such individual differences in the solder state are caused by slight changes in various processes such as changes in the solder amount and position during solder printing, changes in the mounting position of mounted components, and changes in temperature during reflow.

3 and 4 are conceptual diagrams showing the component 101 connected to the electrode 103 on the substrate 100 by the solder 102 and its periphery. 3 is a top view of the mounting surface of the substrate 100 viewed from above, and FIG. 4 is a side view of the mounting surface of the substrate 100 viewed from the side. In the present embodiment, attention is paid to the state of the solder 102 on both sides of the component 101.

The top view of FIG. 3 shows how the spread shape of the solder 102 and the state of the solder 102 on the electrodes 103 are different on both sides of the component 101. The side view of FIG. 4 shows that the fillet shape (outer shape) of the solder 102 is different on both sides of the component 101. Due to the characteristics of the final product, the mounting surface on which the solder 102 is present is in a state of being protected so as not to be damaged even after the manufacturing process after reflow or after the outflow to the market, so that the state of the solder 102 on the mounting surface changes little with time. Therefore, it is possible to identify each substrate 100 by the state of the solder 102 on the substrate 100.

The imaging unit 13 captures an image including the solder state on the target substrate. For example, the imaging unit 13 is a camera having an image sensor such as a CCD (Charge-Coupled Device) or a CMOS (Complementary Metal-Oxide-Semiconductor). The imaging unit 13 has a resolution and a magnification that can sufficiently acquire the solder state of the board. The image pickup means 13 is installed at a position having an appropriate focal length that matches the position of the board or the board is installed at a position having an appropriate focal length of the image pickup means 13 so that the solder state on the board can be sufficiently acquired.

The characteristic amount extraction unit 14 extracts the characteristic amount of the board from the information on the solder state on the board included in the image captured by the imaging unit 13. The feature quantity extraction unit 14 may register the feature quantity extracted from the solder state in the storage unit 12 in association with the board information of the board.

The matching determination means 15 compares the feature quantity extracted by the feature quantity extraction means 14 with the feature quantity stored in the storage means 12. When the feature amount extracted by the feature amount extracting unit 14 is stored in the storage unit 12, the matching determination unit 15 determines that the target substrate is the substrate corresponding to the feature amount. It should be noted that in the identification device 1, when the operation until the characteristic amount extracted from the information regarding the solder state of the board is registered and the target board is not verified, the verification determination means 15 may be omitted.

〔motion〕
Next, the operation of the identification device 1 according to the present embodiment will be described with reference to FIG. However, in the example of FIG. 2, it is assumed that the characteristic amount (solid identification information) based on the soldering state of a predetermined substrate is stored in the storage means.

In the flowchart of FIG. 2, first, the imaging unit 13 captures an image including the solder state on the target substrate (step S11). When the target substrate is installed at a position where the image is captured by the image capturing unit 13, for example, it may be installed by the user or may be automatically transported.

The feature amount extraction unit 14 extracts the feature amount (individual identification information) of the target board from the information regarding the solder state included in the image captured by the image capturing unit 13 (step S12).

Then, the collation judging means 15 checks whether or not the feature quantity extracted by the feature quantity extracting means 14 is stored in the storage means 12 (step S13). That is, the matching determination unit 15 checks whether or not the characteristic amount (individual identification information) of the target substrate imaged by the imaging unit 13 matches the characteristic amount (individual identification information) stored in the storage unit 12.

When the characteristic amount of the symmetrical substrate matches the characteristic amount stored in the storage unit 12 (Yes in step S13), the matching determination unit 15 determines that the target substrate is the substrate having the characteristic amount stored in the storage unit 12. The determination is made (step S14). That is, the matching determination unit 15 determines that the substrate corresponding to the characteristic amount stored in the storage unit 12 and the target substrate are the same substrate, and specifies the target substrate.

On the other hand, when the feature amount of the symmetrical substrate does not match the feature amount stored in the storage unit 12 (No in step S13), the matching determination unit 15 determines that the target substrate is a substrate having the feature amount stored in the storage unit 12. It is determined not to. Therefore, the collation determination unit 15 determines that the substrate corresponding to the characteristic amount stored in the storage unit 12 and the target substrate are not the same substrate, and the target substrate is not specified.

The above is the description of the operation of the identification device 1 according to the present embodiment.

As described above, in this embodiment, the characteristic amount (individual identification information) of a specific substrate is stored. Then, in the present embodiment, an image including information regarding the solder state on the target substrate is captured, and the feature amount (individual identification information) of the target substrate is extracted from the information regarding the solder state included in the captured image. Then, in the present embodiment, when the extracted characteristic amount is stored, it is determined that the target substrate is a substrate corresponding to the characteristic amount.

The solder state on the board does not change continuously during the manufacturing process after reflow in the SMT (Surface Mount Technology) process or after the market distribution, so the feature quantity (individual identification information) extracted from the solder state on the board changes. do not do. Therefore, according to the present embodiment, it is possible to identify each board without mounting individual identification information for identifying the board on the board, even if a component is mounted on the board.

(Second embodiment)
〔Constitution〕
FIG. 5: is a figure which shows an example of the identification device 2 which concerns on the 2nd Embodiment of this invention. As shown in FIG. 5, the identification device 2 according to the present embodiment has a configuration in which a control unit 16 is added to the identification device 1 according to the first embodiment. In the following, description of the same parts as those of the first embodiment will be omitted, and different parts will be described.

The identification device 2 according to the present embodiment includes a storage unit 12, an imaging unit 13, a feature amount extraction unit 14, a collation determination unit 15, and a control unit 16.

The control unit 16 controls the image pickup unit 13 in accordance with a shooting instruction signal (also referred to as an instruction signal). The imaging instruction signal is matched with the board registration instruction signal for newly registering the feature amount of the target substrate with respect to the target substrate imaged by the imaging unit 13, and the known feature amount stored in the storage unit 12 for the feature amount of the target substrate. And a board collation instruction signal to be executed.

The control unit 16 detects a shooting instruction signal generated by, for example, pressing a substrate shooting switch of an operation unit (not shown), and stores the type of the detected shooting instruction signal in the temporary holding area of the storage unit 12. For example, the type of the imaging instruction signal includes a board registration instruction signal for registering the target board in the storage unit 12, and a board verification instruction signal for matching the board registered in the storage unit 12 with the target board.

When registering the target substrate in the storage unit 12, the control unit 16 causes the image capturing unit 13 to capture an image of the target substrate. At this time, the control unit 16 receives the information of the target substrate from the operation unit or an external system (for example, a host system), and stores the received information of the target substrate (hereinafter, substrate information) in the temporary holding area of the storage unit 12. To do. For example, the board information includes a board product name, a product number, and the like. The product number can also be regarded as an ID (Identifier) uniquely given to the product.

The control unit 16 combines new board information obtained by adding the registration date and time (current date and time) to the board information stored in the temporary holding area of the storage unit 12 and the feature amount extracted by the feature amount extraction unit 14. The data is stored in the data storage area of the storage unit 12. FIG. 6 shows a feature amount table 21 as an example of a combination of board information and feature amounts.

A method of combining the board information of the target board and the feature quantity and storing them in the storage means 12 will be described below. The control unit 16 stores the board information and the feature amount of the target board in the storage unit 12 when the board registration signal is received as the imaging instruction signal.

First, the control unit 16 controls the image pickup unit 13 so as to pick up an image of the target substrate according to the image pickup instruction signal. Under the control of the control unit 16, the image pickup unit 13 picks up an image including information on the solder state on the target substrate.

The feature amount extraction unit 14 extracts the feature amount of the board from the information on the solder state included in the image captured by the image capturing unit 13. The feature amount extracted from the information on the solder state includes information about the shape of the solder, such as the surface area of the solder that has spread wet and the height of the creep of the solder onto the component.

Then, when the feature quantity extraction unit 14 receives the board registration instruction signal, the feature quantity extraction unit 14 stores the feature quantity extracted by the feature quantity extraction unit 14 in the primary holding area of the storage unit 12. At this time, the control means 16 stores the board information of the target board stored in the primary holding area and the feature amount in the data storage area of the storage means 12 in combination.

The above is the description of the method of storing the combination of the board information and the feature amount in the storage unit 12.

The soldering state of the substrate included in the image captured by the image capturing unit 13 is the state of the upper surface of the substrate, which is captured from above, or the state of the side surface of the substrate, which is captured from the side.

The image pickup means 13 may be installed at a predetermined place so as to pick up an image of the target substrate from above or from the side based on a user's operation. In addition, the imaging unit 13 may be set to image the mounting surface of the substrate or to image the side surface of the substrate based on the user's operation when capturing the image of the target substrate. .. Note that the image pickup means 13 is not limited to one, and a plurality of image pickup means 13 may be installed.

As shown in FIG. 7, in the present embodiment, the characteristic amount is obtained from at least one predetermined area on the substrate (also referred to as the characteristic amount extraction area 110). The feature amount extraction area 110 is preferably a location including an area where components are mounted, for example. In the example of FIG. 7, an area including the three mounted components (inside the one-dot chain line) is set as the feature amount extraction area 110. The feature amount extraction area 110 is designated as an area in which the state of the solder 102 can be determined.

The feature amount extraction unit 14 extracts the edge (outer shape) of the solder from the image captured by the image capturing unit 13, and extracts the feature amount related to the solder state based on this edge. Note that the feature amount is information about the solder state in a specific area on the board, and if the information includes at least one of solder position information, outer shape (outline) information, hue information, and brightness information on the board. Good.

Further, when the value of the hue information indicated by the solder state information is different from the value of the position around the position indicating this value by a predetermined threshold value or more, the feature amount extraction unit 14 determines the value indicated by the hue information. The relationship information between the indicated positions may be used as the feature amount. When the value indicated by the brightness information indicated by the solder state information is different from the value of the position around the position indicating this value by a predetermined threshold value or more, the feature amount extraction unit 14 indicates the value indicated by the brightness information. The relational information between the positions indicating is the feature amount.

The above is the description of the configuration of the identification device 2 according to the present embodiment.

〔motion〕
Next, the operation of the identification device 2 according to this embodiment will be described with reference to FIGS. 8 to 13.

FIG. 8 is a diagram showing an example of a soldering state when an image of a board on which components are mounted is imaged from above the mounting surface. FIG. 9 is an example in which the outer shape (contour) of the solder of FIG. 8 is extracted. In the present embodiment, the outer shape (contour) of the solder 102 spread to the left and right of the component 101 shown in FIG. 8 is extracted as shown in FIG. In the example of FIG. 9, the contour 102-1 and the contour 102-2 are extracted. L1 in FIG. 8 indicates the distance from one end (right side) of the electrode 103 to the end point (right end) of the solder 102. The end point (right end) of the solder 102 is also called a solder position.

FIG. 10 is a diagram showing an example of a solder state when viewed from the side of the board mounting surface. FIG. 11 is an example in which the creeping-up shape (contour) of the solder of FIG. 10 is extracted. In the present embodiment, the outline of the creeping shape (fillet shape) of the solder 102 on the left and right of the component 101 shown in FIG. 10 is extracted as shown in FIG. In the example of FIG. 11, the contour 102-3 and the contour 102-4 are extracted. The distance from one end (right end) of the electrode 103 to the end point of the solder 102 is L1, and the end point (right end) of the solder 102 indicates the solder position.

Since the contour and position (solder position) of the solder 102 are fixed during reflow, they do not change at any stage of the manufacturing process after reflow or after market outflow. Therefore, by using the information including the outline of the solder 102 and the solder position, each board can be identified.

FIG. 12 is an image (lower side) obtained by capturing the board from the mounting surface side, and a graph (upper side) showing the hue value when a portion of the electrode 103 at a distance L5 from the upper side is scanned parallel to the upper side. That is, the upper graph of FIG. 12 shows the hue value when scanning is performed in the x direction from the origin on the component 101 along the x axis parallel to the upper side of the electrode 103. In FIG. 12, one point on the component 101 is set as the origin.

As the hue value, any one or more of RGB including red (Red), green (Green) and blue (Blue) may be used. Further, the hue value may be obtained by converting into another color space such as a color space including three components of HSV including color (Hue), saturation (Saturation), and lightness (Value). The value in the hue value direction changes depending on the image pickup environment such as the installation location of the image pickup means 13, but if the parts are the same, the values in the hue value direction are normalized so that the overall shape of the graph waveform in FIG. 12 is the same. become. That is, the entire shape of the graph waveform in FIG. 12 can be used as the feature amount. The scanning direction of the hue value is not limited to the direction parallel to the upper side of the electrode 103 (x direction), but may be the direction parallel to the electrode side end point (side), or set to an arbitrary direction. You may.

FIG. 13 is an image (lower side) obtained by capturing the board from the mounting surface side, and a graph (upper side) showing the luminance value when a portion at a distance L5 from the upper side of the electrode 103 is scanned in parallel to the upper side. That is, the graph on the upper side of FIG. 13 shows luminance values when scanning is performed in the x direction from the origin on the component 101 along the x axis parallel to the upper side of the electrode 103.

The brightness value may be acquired by setting the image pickup unit 13 to a monochrome mode or the like. Alternatively, the luminance value may be obtained by converting to another color space such as YUV. It should be noted that YUV indicates a set of luminance (Y) and color difference (difference between luminance and blue=U, difference between luminance and red=V). Although the value in the luminance value direction changes depending on the image pickup environment such as the installation location of the image pickup unit 13, if the same component is used, the values in the luminance value direction are normalized to give the same overall shape of the waveform shown in FIG. become. That is, the entire shape of the graph waveform in FIG. 13 can be used as the feature amount. The scanning direction of the brightness value is not limited to the direction parallel to the upper side of the electrode 103 (x direction), and may be the direction parallel to the electrode side end point (side), or set to an arbitrary direction. You may.

Here, the operation of the identification device 2 according to the present embodiment will be described with reference to the flowchart of FIG. The flowchart of FIG. 14 shows an operation after the target substrate is set in the image capturing range of the image capturing unit 13 by the user's operation or the like, the substrate image capturing switch of the operation unit (not shown) is pressed, and the image capturing instruction signal is generated. Show.

The board photographing switch includes, for example, a board photographing switch for registering a board and a board photographing switch for checking a board. The board photographing switch for board registration generates a board registration instruction signal. The board photographing switch for board matching generates a board matching instruction signal. That is, the shooting instruction signal includes the board registration instruction signal and the board matching instruction signal.

In FIG. 14, first, when the control unit 16 receives the image capturing instruction signal indicating that the board image capturing switch is pressed (Yes in step S201), the control unit 16 issues an image capturing instruction to the image capturing unit 13. It should be noted that, if the photographing instruction signal indicating the pressing of the substrate photographing switch is not received (No in step S201), the process waits.

At this time, the control means 16 detects either the board registration instruction signal or the board verification instruction signal from the shooting instruction signal, and stores the type of the detected instruction signal in the temporary storage area of the storage means 12. Further, when the type of the detected instruction signal is the board registration instruction signal, the control means 16 receives the board information of the target board from the operation unit (not shown) or an external host system, and stores the received board information. It is stored in the temporary storage area of the means 12. The board information includes a board product name, a product number (ID), and the like.

Next, the image pickup unit 13 receives an image pickup instruction from the control unit 16, and picks up an image including the soldering state of the target substrate installed in the image pickup range of the image pickup unit 13 (step S202). For example, when an image of the target substrate is picked up from above the mounting surface, the solder state shows a solder shape spread on both sides of the component 101 as shown in FIG. Further, when an image is taken from the side of the target substrate, the solder state shows a solder shape that has crawled to the left and right of the component 101 as shown in FIG.

Next, the feature amount extraction unit 14 extracts the feature amount (individual identification information) of the target substrate from the information regarding the solder state of the substrate included in the image captured by the image capturing unit 13 (step S203).

For example, in the case of the solder state included in the image captured from above the mounting surface of the target substrate, the feature amount extraction unit 14 determines the solder edge (see FIG. 8) from the image (FIG. 8) of the feature amount extraction region captured by the image capturing unit 13. 9) is extracted, and the feature amount is extracted from the solder state based on the extracted edge. In the case of FIG. 9, the positional relationship information extracted with respect to the solder edge with the right edge of the electrode as a reference is used as the feature amount. Further, as shown in FIGS. 12 and 13, the feature amount extraction unit 14 may check the solder included in the image captured by the image capturing unit 13 and the hue information or the brightness information around the solder.

For example, in the case of the solder state included in the image captured from the side of the target substrate, the feature amount extraction unit 14 determines the solder edge (FIG. 11) from the image (FIG. 10) of the feature amount extraction region imaged by the image capturing unit 13. Is extracted, and the feature amount is extracted from the solder state based on the extracted edge. In the case of FIG. 11, the feature amount is the creeping outer shape (contour) of the left and right solder shapes centering on the mounted component.

Next, the control means 16 checks whether the type of the signal detected in step S201 and stored in the temporary storage area of the storage means 12 is a board registration instruction signal or a board matching instruction signal (step S204). .. In FIG. 14, it is checked in step S204 whether the type of the signal stored in the temporary storage area of the storage unit 12 is the board registration instruction signal.

In step S204, if the type of the signal stored in the temporary storage area of the storage unit 12 is the board registration instruction signal (Yes in step S204), the process proceeds to step S205, and if it is not the board registration instruction signal (step S204). If No, the process proceeds to step S206.

When the type of the signal stored in the temporary storage area of the storage unit 12 is the board registration instruction signal (Yes in step S204), the feature amount extraction unit 14 stores the feature amount extracted in step S203 in the storage unit 12 as data. It is stored in the area (step S205). At this time, the control means 16 extracts the new board information obtained by adding the registration date and time (current date and time) to the board information stored in the temporary storage area of the storage means 12 in step S201 by the feature quantity extracting means 14. It is stored in the data storage area of the storage means 12 in combination with. After step S205, the process returns to step S201.

On the other hand, when the type of the signal stored in the temporary storage area of the storage unit 12 is not the board registration instruction signal (No in step S204), the matching determination unit 15 determines that the feature amount extracted by the feature amount extraction unit 14 is the storage unit. It is checked whether the data is stored in 12 (step S206). That is, the matching determination unit 15 is installed in the image capturing area of the image capturing unit 13, and the characteristic amount (individual identification information) of the target substrate imaged by the image capturing unit 13 is stored in the storage unit 12 (individual identification). Information)).

In step S206, if the feature amount of the target substrate imaged by the image pickup unit 13 matches the feature amount stored in the storage unit 12 (Yes in step S206), the process proceeds to step S207. If they do not match, , And proceeds to step S209.

When the feature amount of the target substrate captured by the image capturing unit 13 matches the feature amount stored in the storage unit 12 (Yes in step S206), the matching determination unit 15 determines that the target substrate is the feature stored in the storage unit 12. It is determined that it is the same as the substrate provided with the amount (step S207). Then, the collation determination means 15 acquires the board information corresponding to this feature amount from the data storage area of the storage means 12.

Then, the matching determination unit 15 determines the substrate installed in the image capturing area of the image capturing unit 13 is the same as the substrate having the characteristic amount stored in the storage unit 12, and the substrate corresponding to the substrate. The information is displayed on the display unit (not shown) (step S208). After step S208, if the process is to be continued (Yes in step S211), the process returns to step S201. If the process is not to be continued (No in step S211), the process according to the flowchart of FIG. 14 is ended.

On the other hand, when the feature amount of the target substrate imaged by the image pickup unit 13 does not match the feature amount stored in the storage unit 12 (No in step S206), the matching determination unit 15 stores the target substrate in the storage unit 12. It is determined that the board does not have the specified feature amount (step S209).

Then, the collation determination unit 15 displays on the display unit (not shown) a determination result indicating that the substrate installed in front of the imaging unit 13 is not the same substrate as the substrate having the characteristic amount stored in the storage unit 12. It is displayed (step S210). After step S210, if the process is to be continued (Yes in step S211), the process returns to step S201. If the process is not to be continued (No in step S211), the process according to the flowchart of FIG. 14 is ended.

The above is the description of the operation of the identification device 2 according to the present embodiment.

As described above, in the present embodiment, the characteristic amount of the target substrate is used as the information of the solder state on the substrate (any one or more of the position information of the component, the outer shape information, the hue information, and the luminance information). Therefore, according to the present embodiment, an appropriate feature amount according to the installation environment of the device such as a dark environment of illumination, an environment where the lighting condition is not uniform, the ease of extracting the feature amount obtained from the solder state, etc. Can be selected.

Further, in the present embodiment, it has been shown that the soldering state of the target substrate imaged by the image pickup means is verified by the state of the mounting surface of the substrate and the state of the two sides of the side surface of the substrate. Practically, at least one of the mounting surface and the side surface of the substrate may be selected and photographed according to the installation environment of the photographing device.

(Modification)
Here, FIG. 15 shows a configuration of a modified example (identification device 2-2) of the identification device 2 according to the present embodiment. The identification device 2-2 includes a display unit 17 that displays the determination result of the collation determination unit 15. The display unit 17 is realized by, for example, a display or a printer. The display means 17 may be provided outside the identification device 2.

The display unit 17 receives the processing of step S208 in the flowchart of FIG. 14 to display the determination result and the board information in association with each other, and receives the processing of step S210 to display the determination result in association with each other.

(Third Embodiment)
〔Constitution〕
FIG. 16 is a diagram showing a configuration of a substrate traceability system 30 according to a third embodiment of the present invention. The traceability system 30 according to the present embodiment includes an identification device 3, an information collection device 31 (31-1, 31-2,..., 31-n) and a production history server 32 (n is a natural number). ..

As shown in FIG. 17, the identification device 3 has a configuration in which a communication means 18 is added to the identification device 2 according to the second embodiment. The communication means 18 is a means for communicating with the plurality of information collecting devices 31 and the production history server 31, and is a general communication device. In the following, description of the same parts as those of the first and second embodiments will be omitted, and different parts will be described.

The information collecting device 31 is installed in each process (n process) in the manufacturing process of the product including the circuit board. Each information collecting device 31 is connected in series and collects the results of the process work contents in a plurality of processes (n processes) that perform processing such as assembling of a product to a board and inspection. The information collecting device 31 in each step has a detector that detects that the substrate has arrived, and transmits a detection signal indicating that the substrate has been detected by the detector to the identification device 3. The information collecting device 31 is realized by, for example, a general computer or a server.

The production history server 32 includes a plurality of processes such as substrate processing, assembly, inspection, and incorporation into a product, a board passage history acquired from a plurality of information collecting devices 31 according to the plurality of processes, and an operation history of the device. And register. The production history server 32 is a general server that is connected to the plurality of information collection devices 31 and the identification device 3 by a network such as a LAN (Local Area Network) or the Internet.

The identification device 3 includes at least one image pickup unit 13 corresponding to the information collection device 31 installed in each process. The identification device 3 may include a plurality of imaging devices 13 in each information collecting device 31.

In the first step, when the identification device 3 extracts the characteristic amount of the target substrate, the identification device 3 registers the target substrate in association with the extracted characteristic amount. When the identification device 3 receives the detection signal (first detection signal) from the information collecting device 31-1 of the first process, the image capturing means 13 (first device) installed in the information collecting device 31-1 of the first process. The image capturing means 1) captures an image including information about the solder state on the target substrate.

Then, the identification device 3 extracts the characteristic amount of the target substrate from the information of the solder state included in the image captured by the image capturing unit 13 (first image capturing unit), and stores the extracted feature amount in the storage unit 12.

Then, the identification device 3 registers the board information (the board product name, the ID, the passage date and time) including the processing date and time of the first step of the target substrate in the storage unit 12. Further, the identification device 3 transmits the board information including the processing date and time of the first step of the target board to the production history server 32.

In the k-th step after the second step, when the identification device 3 extracts the characteristic amount of the target substrate, the identification device 3 collates the substrate using the extracted characteristic amount (k=2 to n). When the target substrate receives the detection signal (the kth detection signal) from the information collecting device 31-k of the kth process, the identifying device 3 is installed in the information collecting device 31-k of the kth process. An image including information on the solder state of the target substrate is picked up by 13 (kth image pickup means).

The identification device 3 extracts the characteristic amount of the board from the information of the solder state included in the image captured by the image capturing unit 13 (kth image capturing unit). Then, when the extracted feature amount is stored in the storage unit 12, the identification device 3 determines that the target substrate is collated, and outputs the substrate information including the passing date and time of the k-th step of the target substrate to the production history server 32. sign up. The board information is information including the board's product name, ID, passing date and time, etc.

The above is the description of the configuration of the traceability system 30 according to the present embodiment.

〔motion〕
Next, the operation of the traceability system 30 according to this embodiment will be described with reference to FIG. FIG. 18 is a flowchart showing the operation of the traceability system 30 according to this embodiment.

In the example of FIG. 18, a traceability system for a board on an assembly line will be assumed and described. The assembly line includes a step of assembling a hand-mounted component (first step), a step of assembling a substrate and other components in a product (second step), and various inspections on a substrate on which components are mounted in the SMT process. A line including a step (third step) to be performed is assumed. At the entrance of each process, three image pickup means 13 (first image pickup means, second image pickup means, third image pickup means) corresponding to each information collecting device 31 are installed. In the following example, it is assumed that the characteristic amount is not given to the target substrate before the first step.

When the target substrate is sent to the first step, the operator hands on the components that cannot be mounted in the SMT step.

First, when the target substrate is sent, the first detector of the information collecting apparatus 31-1 detects the target substrate and outputs the first detection signal (step S301). The first detector corresponds to a board photographing switch for board registration. That is, the first detection signal output by the first detector corresponds to the board registration instruction signal. In this example, it is assumed that the characteristic amount of the target substrate has not been registered before the first step, but if the characteristic amount of the target substrate has already been registered before the first step, the first detector Outputs a board matching instruction signal.

Next, when the identification device 3 receives the first detection signal, the identification device 3 captures an image of the solder state of the target substrate by the first imaging unit, and acquires an image including the solder state of the target substrate (step S302).

The identification device 3 extracts the characteristic amount of the target substrate from the information on the solder state included in the acquired image, and stores the extracted characteristic amount in the storage unit 12 (step S303). Then, the board information is input to the identification device 3 based on the operation of the operator. The board information is a product name, a product number, etc. of the board. The identification device 3 stores the input board information in the storage unit 12. Further, the identification device 3 registers the board information (the product name of the board, the product number, the passing date and time) including the passing date and time of the first step in the production history server 32 as the substrate passing history. The passing date and time may be regarded as the registration date and time or the current time. If the characteristic amount of the target substrate has already been registered before the first step, new substrate information including the passing date and time of the first step is added to the substrate information of the target substrate in correspondence with the extracted characteristic amount. It may be stored in the storage means 12.

When the work of the first step is completed, the target substrate is sent to the second step. At this time, the information collecting device 31-1 transmits the information on the handed parts to the production history server 32 (step S304). The production history server 32 stores the received information on the parts as a work history. Here, the work history is work content information including, for example, the type and manufacturing number of parts, the worker ID, and the like.

When the target substrate is sent to the second step, the substrate and other components are incorporated into the product by, for example, an operator. It should be noted that the incorporation of the board and other components into the product may be automated by a robot or a device.

When the target substrate is sent, the second detector of the information collecting device 31-2 detects the target substrate and outputs the second detection signal (step S305). The second detector corresponds to a board photographing switch for board matching. That is, the second detection signal output by the second detector corresponds to the board matching instruction signal.

When the identification device 3 receives the second detection signal, the identification device 3 captures an image of the solder state of the target substrate by the second image capturing unit and acquires an image including the solder state of the target substrate (step S306).

The identification device 3 extracts the characteristic amount of the target substrate from the information on the solder state included in the acquired image (step S307). Then, the identification device 3 stores new board information in which the board information of the target board stored in step S301 includes the passing date and time of the second step in the storage unit 12 in association with the extracted feature amount. Further, the identification device 3 registers the new board information (board product name, product number, passage date and time) in the production history server 32 as a board passage history.

When the work of the second step is completed, the product including the target substrate is sent to the third step. At this time, the information collection device 31-2 transmits information about the work in which the board and other parts are incorporated in the product to the production history server 32 (step S308). The production history server 32 stores information about the received work as a work history. Here, the work information is work content information including, for example, the type and manufacturing number of the other parts assembled, the worker ID, and the like.

When the product including the target substrate is sent to the third step, various inspections such as visual inspection and electrical inspection of the product including the target substrate are performed by an operator, for example. Various inspections such as visual inspection and electrical inspection of the product including the target substrate may be automated by a robot, an inspection device, or the like.

When the product including the target substrate is sent, the third detector of the information collecting device 31-3 detects the target substrate and outputs the third detection signal (step S309). The third detector corresponds to a board photographing switch for board matching. That is, the third detection signal output by the third detector corresponds to the board matching instruction signal.

When the identification device 3 receives the third detection signal, the identification device 3 captures an image of the solder state of the target substrate by the third imaging unit and acquires an image including the solder state of the target substrate (step S310).

The identification device 3 extracts the characteristic amount of the target substrate from the information on the solder state included in the acquired image (step S311). Then, the identification device 3 stores new board information in which the board information of the target board stored in step S301 includes the passage date and time of the third step in the storage unit 12 in association with the extracted feature amount. Further, the identification device 3 registers the new board information (board product name, product number, passage date and time) in the production history server 32 as a board passage history.

When the work of the third step is completed, the product including the target substrate is shipped. At this time, the information collection device 31-3 transmits information about various inspections to the production history server 32 (step S312). The production history server 32 stores the received information about the inspection as a work history. Here, the work information is, for example, work content information including a test content, a test result, a worker ID, and the like.

According to the processing according to the flowchart of FIG. 18, the following can be understood based on the board passage history and work history registered in the production history server 32, for example.

In step S304, "1st November, 10:00:00, board A" is recorded in the board passage history of the first step, and "assembly of parts of Q type" is recorded in the work history of the first step. It has been done. Further, in step S308, it is assumed that “November 11, 10:00:30, substrate A” is recorded in the substrate passage history of the second process. At this time, based on the substrate passage history of the first and second steps and the work history of the first step, the processing time of the work in the first step is 10:00:00 on November 11th. It can be seen that it is 30 seconds from. Further, based on the board passage history and the work history of the first step, it can be seen that in the work of the first step, the Q type parts are assembled to the board A.

As described above, according to the present embodiment, by combining the board passage history transmitted by the identification device and the work history transmitted by the information collecting apparatus 31 of each process in the production history server 32, it is possible to determine which one after the SMT process. The traceability of the substrate can be obtained even at the stage.

According to the above first to third embodiments, an identification device and an identification device that can identify a substrate at any stage after the reflow process in SMT without providing the substrate with individual identification information for identifying the substrate. A method and traceability system can be provided.

Further, according to the first to third embodiments, it is possible to provide an identification device, an identification method, and a traceability system capable of accurately identifying an individual over a long period of time. This is because, in a normal product, the substrate is inside the housing of the product, and is resistant to external forces and changes over time.
[Appendix]
The whole or part of the exemplary embodiments disclosed above can be described as, but not limited to, the following supplementary notes.
(Appendix 1)
Storage means for storing a characteristic amount based on the solder state of a predetermined board,
An image pickup means for picking up an image including information on the soldering state of the target board;
A feature amount extracting unit that extracts a feature amount of the target substrate from information about a solder state included in an image captured by the image capturing unit,
An identification device, comprising: collation determination means for determining that the target substrate is the predetermined substrate when the feature amount extracted by the feature amount extraction means is stored in the storage means.
(Appendix 2)
The identification device according to appendix 1, further comprising a control unit that controls the image capturing unit to capture an image of the target substrate in response to an instruction signal for capturing the target substrate.
(Appendix 3)
The instruction signal includes a board registration instruction signal for instructing board registration and a board verification instruction signal for instructing board verification,
When the instruction signal is the board registration instruction signal,
The control means is
Control the image capturing means to capture an image including information about the soldering state of the target substrate,
The imaging means is
Taking an image including information about the solder state of the target substrate according to the control of the control means,
The feature amount extraction means,
The identification device according to appendix 2, wherein the characteristic amount of the target substrate is extracted from the information regarding the solder state included in the image captured by the imaging unit, and the extracted characteristic amount is stored in the storage unit as the characteristic amount of the target substrate. ..
(Appendix 4)
When the type of the instruction signal stored in the temporary storage area of the storage means indicates the board registration instruction signal,
The control means is
Obtaining the board information of the target board from the host system, storing the board information obtained in the temporary storage area of the storage means,
The feature amount extraction means,
4. The identification device according to appendix 3, wherein the feature amount extracted from the information on the solder state of the target substrate is registered in the data storage area of the storage unit in association with the board information of the target substrate.
(Appendix 5)
When the type of the instruction signal stored in the temporary storage area of the storage means indicates the board matching instruction signal,
The collation determination means,
5. The identification device according to appendix 3 or 4, wherein the feature amount of the target substrate extracted by the feature amount extraction unit is compared with the predetermined feature amount stored in the storage unit.
(Appendix 6)
The collation determination means,
Any one of appendices 1 to 5 for determining whether or not the target substrate is the predetermined substrate by using a characteristic amount based on a solder state viewed from at least one of a mounting surface direction and a side surface direction of the substrate. The identification device according to claim 1.
(Appendix 7)
The collation determination means,
The identification device according to any one of appendices 1 to 5, which determines whether or not the target substrate is the predetermined substrate by using a characteristic amount based on a solder state viewed from a mounting surface direction of the substrate.
(Appendix 8)
The collation determination means,
The identification device according to any one of appendices 1 to 5, which determines whether or not the target substrate is the predetermined substrate by using a feature amount based on a solder state viewed from a side surface direction of the substrate.
(Appendix 9)
The feature amount extraction means,
9. The identification device according to any one of appendices 1 to 8, wherein the feature amount based on the solder state is extracted using at least one of the position information and the outer shape information of the solder on the target substrate.
(Appendix 10)
The feature amount extraction means,
10. The identification device according to any one of appendices 1 to 9, wherein the feature amount based on the solder state is extracted using the position information of the solder on the target substrate.
(Appendix 11)
The feature amount extraction means,
10. The identification device according to any one of appendices 1 to 9, wherein the feature amount based on the solder state is extracted using the outer shape information of the solder on the target substrate.
(Appendix 12)
The feature amount extraction means,
11. The identification device according to appendix 9 or 10, wherein an arbitrary edge is extracted from the image captured by the image capturing unit, and a feature amount regarding the position of the solder based on the extracted edge is extracted.
(Appendix 13)
The feature amount extraction means,
13. The identification device according to any one of appendices 1 to 12, wherein the feature amount based on the solder state is extracted using at least one of the hue information and the luminance information of the solder on the target substrate.
(Appendix 14)
The feature amount extraction means,
13. The identification device according to any one of appendices 1 to 12, which extracts a feature amount based on a solder state by using hue information of solder on a target substrate.
(Appendix 15)
The feature amount extraction means,
13. The identification device according to any one of appendices 1 to 12, which extracts the feature amount based on the solder state by using the brightness information of the solder on the target substrate.
(Appendix 16)
The feature amount extraction means,
When the value of the hue information of the solder is different from the value of the hue information at the surrounding position by a predetermined threshold value or more, the relational information between the positions indicating the value indicated by the hue information is extracted as a feature amount 13 or 14. Identification device according to.
(Appendix 17)
17. The identification device according to any one of appendices 1 to 16, which includes a plurality of the imaging units.
(Appendix 18)
The identification device according to any one of appendices 1 to 17, further comprising a display unit that displays a determination result of the collation determination unit.
(Appendix 19)
An image pickup means for picking up an image including information on the soldering state of the board;
A feature amount extraction unit that extracts the feature amount from information regarding the solder state included in the image captured by the image capturing unit;
An identification device, comprising: a storage unit that stores the feature amount extracted by the feature amount extraction unit in association with the substrate information of the previous substrate.
(Appendix 20)
Stores the feature quantity based on the soldering status of a given board,
Take an image containing information about the solder status of the target board,
Extracting the characteristic amount of the target substrate from the information about the solder state included in the captured image,
An identification method for determining that the target substrate is the predetermined substrate when the extracted feature amount is stored.
(Appendix 21)
It is installed in each process of the manufacturing process of products that have a built-in circuit board, outputs a detection signal when the target board is detected in each process, and collects the results of the process work contents for the target board in each process. A plurality of information collection means to output,
The detection signal output by the information collecting means is input, the feature amount of the target substrate is extracted according to the input detection signal, and either the registration or the verification of the target substrate is performed using the extracted feature amount. And an identification device that outputs board information including the time when the target board has passed the step,
A production history server for registering the board information output by the identification device together with the record of the process work content output by the information collecting means,
The identification device is
Storage means for storing a characteristic amount based on the solder state of a predetermined board,
A plurality of image pickup means provided in each step of the manufacturing step, for picking up an image including information about the soldering state of the target substrate;
A control unit that controls the image capturing unit installed in the information collecting unit that outputs the detection signal to capture an image of the target substrate according to the detection signal;
A feature amount extracting unit that extracts a feature amount of the target substrate from information about a solder state included in an image captured by the image capturing unit,
When the feature quantity extracted by the feature quantity extraction means is stored in the storage means, collation determination means for determining that the target substrate is the predetermined substrate,
A traceability system comprising: a communication unit that receives the detection signals from the plurality of information collecting devices and transmits the board information of the target board to the production history server.

1, 2 and 3 Identification device 12 Storage means 13 Imaging means 14 Feature amount extraction means 15 Collation determination means 16 Control means 18 Communication means 30 Traceability system 31 Information collection device 32 Production history server 100 Board 101 Parts 102 Solder 103 Electrode

Claims (10)

Storage means for storing a characteristic amount based on the solder state of the board as solid identification information for uniquely identifying the board,
An image pickup means for picking up an image including information on the soldering state of the target board;
A feature amount extraction unit that extracts a feature amount based on the solder state of the target substrate from information about the solder state included in the image captured by the image capturing unit;
When the feature amount based on the solder state of the target substrate extracted by the feature amount extraction unit and the feature amount based on the solder state of the substrate stored in the storage unit match, the target substrate is the An identification device, comprising: collation determination means for determining a substrate. In response to an instruction signal for imaging the front Kimoto plate, provided with a control means for performing control to image the front Kimoto plate to said imaging means,
The instruction signal includes any one of a board registration instruction signal for instructing board registration and a board verification instruction signal for instructing board verification,
When the instruction signal is the board registration instruction signal,
The control means is
The control for the image shooting an image including information about the solder condition before Kimoto plate,
The imaging captures an image containing information about the solder condition before Kimoto plate in accordance with the control of said control means,
The storage means is
Identification device according to feature amounts of substrates information or we extracted relates solder states included before Symbol shooting image image to claim 1 store. The collation determination means,
The method according to claim 1, wherein whether or not the target substrate is the substrate is determined by using a feature amount based on a solder state viewed from at least one of a mounting surface direction and a side surface direction of the substrate. Identification device. The feature amount extraction means,
The identification device according to claim 1, wherein the feature amount based on the solder state is extracted using at least one of the position information and the outer shape information of the solder on the target substrate. The feature amount extraction means,
The identification device according to claim 4, wherein an arbitrary edge is extracted from the image captured by the image capturing unit, and the feature amount regarding the position of the solder is extracted with the extracted edge as a reference. The feature amount extraction means,
The identification device according to claim 1, wherein the feature amount based on the solder state is extracted using at least one of the hue information and the luminance information of the solder on the target substrate. The feature amount extraction means,
When the value of the hue information of the solder is different from the value of the hue information at the surrounding position by a predetermined threshold value or more, the relationship information between the positions indicating the value indicated by the hue information is extracted as the feature amount. The identification device described. An image pickup means for picking up an image including information on the soldering state of the board;
A feature amount extraction unit that extracts a feature amount based on the solder state of the board from information about the solder state included in the image captured by the image capturing unit;
A storage device that stores, as solid identification information for uniquely identifying the substrate, a feature amount based on the solder state of the substrate extracted by the feature amount extracting device in association with the substrate information of the substrate. Stores a feature amount based on the solder state of the board as solid identification information for uniquely identifying the board,
Take an image containing information about the solder status of the target board,
Extracting a feature amount based on the solder state of the target substrate from the information about the solder state included in the captured image,
An identification method for determining that the target substrate is the substrate when the extracted feature amount based on the solder state of the target substrate matches the stored feature amount based on the solder state of the substrate. It is installed in each step of the manufacturing process of products that have a built-in circuit board, outputs a detection signal when the target board is detected in each step, and collects the results of process work contents for the target board in each step. A plurality of information collection means to output,
The detection signal output by the information collecting unit is input, the feature amount of the target substrate is extracted according to the input detection signal, and the target substrate is collated using the extracted feature amount, and An identification device that outputs board information including the time when the target board has passed the process,
A production history server for registering the board information output by the identification device together with the record of the process work content output by the information collecting means,
The identification device is
Storage means for storing a characteristic amount based on the solder state of the board as solid identification information for uniquely identifying the board,
A plurality of image pickup means provided in each step of the manufacturing step, for picking up an image including information about the soldering state of the target substrate;
A control unit that controls the image capturing unit installed in the information collecting unit that outputs the detection signal to capture an image of the target substrate according to the detection signal;
A feature amount extraction unit that extracts a feature amount based on the solder state of the target substrate from information about the solder state included in the image captured by the image capturing unit;
When the feature amount based on the solder state of the target substrate extracted by the feature amount extraction unit and the feature amount based on the solder state of the substrate stored in the storage unit match, the target substrate is the Collation determining means for determining that the board is;
A traceability system comprising: a communication unit that receives the detection signals from the plurality of information collecting devices and transmits the board information of the target board to the production history server.