JP7369905B2 - Mounted board manufacturing system and mounted board manufacturing method - Google Patents

Description

The present invention relates to a mounting board manufacturing system and a mounting board manufacturing method for manufacturing a mounting board in which components are mounted on a board.

A mounted board manufacturing system that manufactures a mounted board with components mounted on a board includes a printing process in which solder paste for joining the components is printed on the land of the board, a component mounting process in which the components are mounted on the board after the printing process, and a post-component mounting process. A mounting work process such as a reflow process is performed in which the board is heated to melt the solder and the components are soldered to the lands of the board. Production data regarding the parts, boards, equipment used in these mounting work processes, and machine parameters applied in each work process is collected for each board produced and is used as trace information indicating the production history of that board. This stored trace information is referred to when a problem such as poor quality occurs in a manufactured product (for example, see Patent Document 1).

Japanese Patent Application Publication No. 2013-168539

In these mounting work processes, it is required to perform fine movements with high precision and high efficiency for minute parts, so the parameters for performing each work movement in a good manner are determined by the type of part. It is set in advance according to. Setting these parameters is a task that requires expertise such as skill based on experience, so in recent years attempts to have artificial intelligence perform this task have been considered. In order to effectively use artificial intelligence to appropriately set the parameters of mounting equipment in the field of mounting board manufacturing and obtain good manufacturing quality, it is possible to predict changes in manufacturing quality and equipment status and take appropriate measures. As such, it is necessary to create highly accurate learning data in advance.

Since it is required to acquire as much data as possible in order to create highly accurate learning data, it is conceivable to use the above-mentioned trace information as a data source for creating learning data. However, in conventional technologies, including the above-mentioned patent document examples, trace information is mostly referred to for the purpose of investigating the cause when problems such as quality defects occur in manufactured products, and trace information is used effectively. It is difficult to say that this was done.

SUMMARY OF THE INVENTION Therefore, the present invention provides a mounting board manufacturing system and a mounting board manufacturing system that can effectively utilize trace information, predict changes in manufacturing quality and equipment status, and appropriately set parameters of mounting equipment to obtain good manufacturing quality. The purpose is to provide a mounting board manufacturing method.

In the mounted board manufacturing system of the present invention, a plurality of mounting equipment are arranged, including a solder part forming device that forms solder parts on the lands of the board, and a component mounting device that mounts components on the board on which the solder parts are formed. Collecting trace information from the mounting equipment, including information on the mounted board manufacturing line, information on the boards and parts used in the mounting board manufacturing line, and information on errors that occurred in the mounting equipment. Using the accumulated trace information collecting means and part or all of the trace information including the error information collected by the trace information collecting means, it is possible to determine how the manufacturing quality of mounted boards in the mounted board manufacturing line will be in the future. and an artificial intelligence unit that performs at least one of predicting how the state of the mounting equipment will change in the future or predicting how the state of the mounting equipment will change in the future .

In the mounting board manufacturing method of the present invention, a plurality of mounting equipment are arranged, including a solder part forming apparatus that forms solder parts on the lands of the board, and a component mounting apparatus that mounts components on the board on which the solder parts are formed. A mounting board manufacturing method for manufacturing a mounting board with components mounted on a board using a mounting board manufacturing line, the method comprising: information on the board and components used to manufacture the mounting board in the mounting board manufacturing line ; and information on the mounting equipment. A trace information collection step of collecting and accumulating trace information including information on the error that has occurred from the mounting equipment, and utilizing part or all of the trace information including the error information collected in the trace information collection step. The artificial intelligence unit predicts at least one of how the manufacturing quality of the mounting board in the mounting board manufacturing line will change in the future or how the state of the mounting equipment will change in the future. and an analysis step performed by.

According to the present invention, it is possible to effectively utilize trace information, predict changes in manufacturing quality and equipment status, appropriately set parameters for mounting equipment, and obtain good manufacturing quality.

Configuration explanatory diagram of a mounting board manufacturing system according to an embodiment of the present invention A configuration explanatory diagram of a mounted board produced by a mounted board manufacturing system according to an embodiment of the present invention An explanatory diagram of component supply in a mounted board manufacturing system according to an embodiment of the present invention An explanatory diagram of parameters set in the screen printing process of the mounting board manufacturing system according to an embodiment of the present invention An explanatory diagram of parameters set in the component mounting process of the mounting board manufacturing system according to an embodiment of the present invention

Next, with reference to FIG. 1, the configuration of the mounting board manufacturing system 1 of this embodiment will be described. The mounted board manufacturing system 1 has a function of manufacturing a mounted board in which components are mounted on a board, and includes a mounted board manufacturing line L in which a plurality of mounting equipment is connected and arranged. Furthermore, the mounting board manufacturing system 1 includes a host system 2 and a mounting process support device 3.

The upper system 2 includes production data that is library data about workpieces such as boards and parts used in production work, component information such as boards and parts actually used in manufacturing on the mounted board manufacturing line L, It has a function to manage various information such as information on the equipment used, inspection information showing the results of inspections executed in each work process, and process conditions applied to manufacturing the mounting board. The implementation process support device 3 has a function of performing processing based on these various pieces of information for the purpose of supporting analysis of implementation quality, parameter setting, etc. using a learning model constructed using a deep learning method.

The mounting board manufacturing line L will be explained. The mounted board manufacturing line L includes, from the upstream side (left side in FIG. 1), a board supply device M1, a screen printing device M2, a solder part inspection device M3, component mounting devices M4, M5, M6, a mounted component inspection device M7, and a reflow device. It has a configuration in which each device, M8, post-reflow inspection device M9, and substrate recovery device M10 are arranged in series. The substrate transport conveyors provided in each device are interconnected so that substrates to be worked on can be transported from the upstream device to the downstream device, or from the downstream device to the upstream device in reverse order. That is, the mounting board manufacturing line L has a configuration in which a plurality of mounting equipment including a screen printing device M2, which is a solder portion forming device, and component mounting devices M4, M5, and M6 are arranged.

The board supply device M1 stores a plurality of boards before component mounting work and supplies them to a downstream device. These plurality of boards are given board identification information that individually identifies each board, and the boards supplied from the board supply device M1 are read by the board identification information reading device 14. Thereby, each board supplied to the mounted board manufacturing line L can be individually specified.

The screen printing device M2 is a solder portion forming device, and executes a printing process of printing solder paste on lands of a substrate set on a printing stage to form solder portions. These lands are formed at mounting points on the board, and components are soldered in a later process. The solder portion inspection device M3 inspects the state of the solder portion printed by the screen printing device M2.

The component mounting devices M4, M5, and M6 receive the board whose solder portions have been inspected by the solder portion inspection device M3, and perform a component mounting step of mounting the components onto the board on which the solder portions are formed. In these component mounting apparatuses M4, M5, and M6, a substrate on which a solder portion is formed is supported by a support member, and in this state, a component is mounted on the substrate on which a solder portion is formed.

The mounted component inspection device M7 inspects the state of components mounted on the board. The reflow device M8 performs a reflow process in which the board on which the component is mounted is heated to melt the solder component contained in the solder portion. The post-reflow inspection device M9 inspects the soldered state of components on the board after the reflow process. As the post-reflow inspection device M9, one having a measuring means capable of acquiring two-dimensional information or three-dimensional information, one having a measuring means using X-rays, etc. can be used. The substrate recovery device M10 recovers the inspected substrate after reflow.

These devices are interconnected by a communication network 4, and the communication network 4 is further connected to an information storage unit 5 included in the host system 2 via an information management device 6. Further, the host system 2 is capable of taking in board design information 9a and component specification information 9b from the production data storage section 9 that stores the above-mentioned production data.

The board design information 9a is design data for manufacturing a mounting board. FIG. 2 shows an example of a mounting board 20 in which a component 22 is mounted on a board 21. As shown in FIG. On the substrate 21, a recognition mark 21a as a reference mark serving as a reference for positioning and a two-dimensional barcode 23 for identification are formed. The board design information 9a regarding this mounting board 20 includes CAD data of the board 21 constituting the mounting board 20, the coordinates of the mounting point of the component 22 to be mounted on the board 21, the arrangement, dimensions, and shape of lands for bonding the components, and the board design information 9a. It includes information regarding the recognition mark 21a formed on the 21, etc.

The component specification information 9b is library data that collects individual information on the components 22 necessary for producing multiple types of mounting boards 20. That is, it includes information indicating details of the component 22 mounted on the mounting board 20, such as the shape and dimensions of the component 22, and information regarding the number and arrangement of bonding leads and electrodes formed on the component 22.

The information storage section 5 is provided with a component information storage section 5a, a used equipment information storage section 5b, an inspection information storage section 5c, and a process information storage section 5d. The component information storage unit 5a stores component information, which is the most basic information for traceability. The component information includes at least information for identifying the board (board ID), information for identifying the components mounted on the board (part ID, part name, lot number, manufacturer name, etc.), and the board. Contains information about the date and time the part was installed. In the example shown in FIG. 2, the two-dimensional barcode 23 indicates a board ID for identifying the board.

FIG. 3 shows the supply form of the component 22 included in the component information. In the example shown here, the component 22 is supplied to the component mounting devices M4, M5, and M6 while being held on a component supply tape 30. As shown in FIG. 3A, the component supply tape 30 has a structure in which a cover tape 32 is attached to the upper surface of a base tape 31 that holds the components 22.

The base tape 31 is formed with a component pocket 31a for storing the component 22 and a feed hole 31b for feeding the base tape 31 with a sprocket. In the component mounting devices M4, M5, and M6, the component supply tape 30 is fed by a tape feeder in the tape feeding direction (Y direction--arrow a). Then, at the component extraction position by the mounting head, the component 22 exposed by peeling off the cover tape 32 from the base tape 31 is extracted from the component pocket 31a.

FIG. 3(b) and FIG. 3(c) each show a supply form of the component supply tape 30. In the example shown in FIG. 3(b), the component supply tape 30 is wound and stored on a supply reel 33 having two disks facing each other, and is identified by a two-dimensional barcode 34 attached to the supply reel 33. Ru. By pulling out the component supply tape 30 from the supply reel 33 (arrow b) with the supply reel 33 attached to the tape feeder, the components 22 held on the component supply tape 30 are supplied to the component mounting devices M4, M5, and M6. be done.

In the example shown in FIG. 3(c), the component supply tape 30 is stored in a rectangular supply cassette 35 in the form of a concentrically wound tape roll 30a, and a two-dimensional Identified by barcode 34. By pulling out the component supply tape 30 from the supply cassette 35 (arrow c) with the supply cassette 35 attached to the tape feeder, the components 22 held on the component supply tape 30 are supplied to the component mounting devices M4, M5, and M6. be done.

The used equipment information storage unit 5b stores used equipment information, that is, information for specifying production equipment and units used when manufacturing the mounting board. The used equipment information includes the serial number of the used production equipment, the manufacturing number given by the equipment manufacturer, identification information at the factory, and the like. The used equipment information is stored in association with the board ID and component ID.

FIG. 4 shows an example in which the equipment used is a screen printing apparatus M2 that prints solder S on the lands 21b of the substrate 21 to form solder parts. In the screen printing apparatus M2, the substrate 21 is positioned on the lower surface of the screen mask 40, in which pattern holes 40a are formed to match the lands 21b, and the upper surface is supplied with solder S. In this state, a squeegeeing operation is performed in which the squeegee 41 is brought into sliding contact with the upper surface of the screen mask 40 and moved in the printing direction. Thereby, the solder S is printed on the land 21b through the pattern hole 40a. In the example of the screen printing apparatus M2, information for specifying the main body of the screen printing apparatus M2, the screen mask 40, the squeegee 41, etc. is stored as equipment information used.

FIG. 5 shows an example in which the equipment used is component mounting devices M4, M5, and M6 that mount components 22 on lands 21b of a board 21 on which solder S is printed. As shown in FIG. 5A, the component mounting devices M4, M5, and M6 each include a component holding nozzle 50 that is movable while holding the component 22 by suction. By aligning the component holding nozzle 50 holding the component 22 with respect to the land 21b on which the solder S is printed and lowering it, the component 22 is mounted on the board 21 as shown in FIG. 5(b). . In this example, information for identifying the main bodies of the component mounting devices M4, M5, M6, component supply units such as tape feeders, the component holding nozzle 50, the mounting head to which the component holding nozzle 50 is attached, etc. is used as equipment information. be remembered.

The used equipment information can include the date and time when the equipment was used, and the type and date of the event that occurred in the equipment. Events of the component mounting devices M4, M5, and M6 include component shortages, switching timing of the component supply tape 30, component pickup mistakes that occur during component replacement or component supply, and various errors. Events of the screen printing device M2 include mask cleaning for cleaning the lower surface of the screen mask 40, solder replenishment operation for supplying solder S to the screen mask 40, and the like.

The inspection information storage unit 5c stores information regarding inspection results by inspection devices (solder part inspection device M3, mounted component inspection device M7, post-reflow inspection device M9, etc.). The inspection results are stored in association with the board ID and component ID. This makes it possible to individually refer to inspection results for specific boards and components.

The process information storage unit 5d stores process conditions applied when manufacturing the mounting board, ie, parameters for operating the equipment. As the process conditions to be stored, either preset values or measured values obtained by measurement during actual operation may be used. Examples of process conditions are as follows.

First, in the case of the screen printing apparatus M2 shown in FIG. 4, the parameters are printing pressure F, which is the pressure to press the squeegee 41 against the screen mask 40 and push the solder S into the pattern holes 40a, and the angle the squeegee 41 makes with the screen mask 40. There is a certain attack angle θ, a squeegee speed VS which is the speed at which the squeegee 41 slides, etc. In addition, parameters related to a plate separation operation for separating the substrate 21 from the screen mask 40 after squeezing may be included.

In the case of the component mounting apparatuses M4, M5, and M6 shown in FIG. 5, parameters related to the vertical movement of the component holding nozzle 50 are first included. That is, there are descending parameters DP (descending speed v, descending acceleration α) when the component holding nozzle 50 is descended as shown in FIG. 5(a), descending stop height H as shown in FIG. 5(b), pressing load W, etc.

Further, as parameters regarding the stop position [P] of the component holding nozzle 50, there are a correction value ΔP1 and an offset value ΔP2 of the component mounting operation, which are added to the mounting point coordinates MP indicated by the mounting data. Furthermore, image information such as an image of a component recognition camera and a component recognition result indicating the position and state of the component 22 held by the component holding nozzle 50 may be included.

The above-mentioned component information, used equipment information, inspection information, and process information are collected from each device of the mounted board manufacturing line L by the information management device 6 via the communication network 4. The collected information is transmitted to each storage section of the information storage section 5 and stored therein. In the above configuration, the information storage unit 5 and the information management device 6 store trace information including information on boards and components used in the production of mounted substrates on the mounted substrate production line L, which is mounting equipment. A trace information collecting means is configured to collect and accumulate trace information from each device.

Note that in the trace information collecting means shown in this embodiment, the information stored in the component information storage section 5a is essential, but the other information is not necessarily essential. That is, the user can set whether or not to collect information regarding the information stored in the used equipment information storage section 5b, the inspection information storage section 5c, and the process information storage section 5d. This makes it possible to collect trace information at the level desired by the user.

The host system 2 is provided with a search terminal device 8, and it is possible to search for a board ID to be traced by inputting conditions for the collected trace information. For example, if a certain component has a manufacturing defect, it is possible to perform a search using the component ID and obtain the board ID of the mounting board 20 on which the component is mounted. Conversely, by inputting and searching the board ID of the mounting board 20 in which a defect or the like has been detected, the components used in the mounting board 20 can also be specified.

Next, the configuration and functions of the mounting process support device 3 will be explained. The implementation process support device 3 includes an artificial intelligence section 11 consisting of a plurality of AIs (Artificial Intelligence), and a learning device having a function of causing the AI of the artificial intelligence section 11 to perform learning using information stored in the information storage section 5. Consists of part 12. In the mounted board manufacturing system 1 of the present embodiment, the artificial intelligence section 11 has been trained to have the following three types of functions (manufacturing quality variation prediction section 11a, equipment state variation prediction section 11b, and equipment parameter management section 11c). It is configured with AI.

The learning unit 12 prepares a learning data set suitable for each AI and causes the AI to learn. In learning by the learning unit 12, the trace information collected by the trace information collecting means 7 is taken in and included in the data set. Furthermore, the dimensions and shapes of lands included in the production data imported from the production data storage section 9 can also be included in the data set, if necessary. This enables analysis that reflects trends specific to the workpieces and mounting equipment actually used. Note that each AI that constitutes the artificial intelligence section 11 is not necessarily one that has been learned by the learning section 12, but may be one that has been learned in advance by another learning section.

The manufacturing quality variation prediction unit 11a inputs information useful for predicting quality variation from the information stored in the information storage unit 5 as an input value, and predicts how the quality will change in the future. Examples of information useful for predicting quality fluctuations include inspection results from inspection devices (solder part inspection device M3, mounted component inspection device M7, and post-reflow inspection device M9), correction values for component mounting operations, and information on errors that occur during component mounting operations. Input values may include event information such as suction errors, and even data regarding dimensions of boards and components from production data.

The equipment state change prediction unit 11b inputs information useful for predicting equipment changes from the information stored in the information storage unit 5 as an input value, and predicts how the equipment will change in the future. Examples of information useful for predicting equipment fluctuations include inspection results from inspection devices (solder part inspection device M3, mounted component inspection device M7, and post-reflow inspection device M9), correction values for component mounting operations, and information on errors that occur during component mounting operations. Examples include event information such as a suction error.

The equipment parameter management unit 11c inputs information useful for setting equipment parameters as input values from the information stored in the information storage unit 5, and calculates equipment parameters considered to be optimal. It also evaluates the equipment parameters currently in use in production and determines whether adjustments are necessary. Examples of information useful for setting equipment parameters include inspection results by inspection devices (solder part inspection device M3, mounted component inspection device M7, post-reflow inspection device M9), correction values for component mounting operations, and information on errors that occur during component mounting operations. Examples include event information such as a suction error.

The mounting process support device 3 is equipped with an administrator terminal 13, and the analysis results obtained by the manufacturing quality variation prediction unit 11a, the equipment state variation prediction unit 11b, and the equipment parameter management unit 11c are displayed on the administrator terminal 13. be done. Based on this display, the administrator determines whether the analysis result by the artificial intelligence unit 11 is appropriate. Thereby, human experience knowledge can be added to the analysis results by the artificial intelligence unit 11, making it possible to perform more accurate predictions and evaluations.

Next, a mounting board manufacturing method for manufacturing a mounting board in which components are mounted on a board using the mounting board manufacturing line L in the mounting board manufacturing system 1 having the above-described configuration will be described. In this mounting board manufacturing method, prior to production for manufacturing the mounting board, trace information including information on the board and components used for manufacturing the mounting board in the mounting board manufacturing line L is transmitted in advance to the mounting equipment. The information is collected and accumulated from the screen printing device M2 to the post-reflow inspection device M9 (trace information collection step).

Next, using part or all of the trace information collected in the trace information collection step, the screen printing device M2 to the post-reflow inspection device M9, which are equipment for analyzing or mounting the manufacturing quality of the mounting board in the mounting board manufacturing line L, are used. The artificial intelligence unit 11 performs at least one analysis regarding the above (analysis step). In this analysis step, a data set for learning by the artificial intelligence unit 11 is created using part or all of the trace information collected in the trace information collection step (learning step).

In the present embodiment, in the above-mentioned analysis step, the manufacturing quality variation prediction unit 11a and the equipment condition variation prediction unit 11b included in the artificial intelligence unit 11 detect variations in the manufacturing quality of the mounting board and changes in the state of the mounting equipment, respectively. Predict. Furthermore, the equipment parameter management unit 11c provided in the artificial intelligence unit 11 performs equipment parameter management for analyzing equipment parameters used in the mounting equipment or obtaining equipment parameters. This makes it possible to predict changes in manufacturing quality and equipment conditions and appropriately set the parameters of the mounting equipment to obtain good manufacturing quality.

As explained above, in the mounted board manufacturing system and the mounted board manufacturing method shown in this embodiment, in the mounted board manufacturing in which the mounted board manufacturing line L having the above-mentioned configuration manufactures the mounted board with components mounted on the board, the mounted board An information storage section serving as a trace information collection means for collecting and accumulating trace information including information on the board 21 and components 22 used in manufacturing the mounted board on the manufacturing line L from the mounting equipment constituting the mounted board manufacturing line L. 5 and the information management device 6, and at least one of the analysis regarding the manufacturing quality of the mounting board in the mounting board manufacturing line L or the analysis regarding the mounting equipment, using part or all of the trace information collected by the trace information collecting means. The configuration includes an artificial intelligence section 11 that performs two functions.

With this configuration, the information collected by the trace information collection means can be used for purposes other than tracing, such as analysis of manufacturing quality and mounting equipment. As a result, it is possible to effectively utilize the trace information, and also to predict changes in manufacturing quality and equipment conditions, appropriately setting parameters of mounting equipment, and obtain good manufacturing quality. Furthermore, since the trace information collection means can also collect data for analysis of manufacturing quality and mounting equipment, an effect can be obtained in that equipment investment can be reduced accordingly.

The mounted board manufacturing system and the mounted board manufacturing method of the present invention aim to effectively utilize trace information, predict changes in manufacturing quality and equipment status, and appropriately set parameters of mounting equipment to ensure good manufacturing quality. It is useful in the field of manufacturing a mounting board in which components are mounted on a board.

1 Mounting board manufacturing system 2 Host system 3 Mounting process support device 7 Trace information collection means 9 Production data storage unit 11 Artificial intelligence unit 20 Mounting board 21 Board 22 Components 30 Component supply tape M2 Screen printing device M4, M5, M6 Component mounting Device

Claims (12)

A mounting board production line in which a plurality of mounting equipment is arranged, including a solder part forming device that forms solder parts on lands of the board, and a component mounting device that mounts components on the board on which the solder parts are formed;
trace information collection means for collecting and accumulating trace information from the mounting equipment, including information on boards and components used in the production of mounted boards in the mounting board manufacturing line, and information on errors occurring in the mounting equipment; ,
Predicting how the manufacturing quality of mounted boards in the mounted board manufacturing line will change in the future by using part or all of the trace information including the error information collected by the trace information collecting means, or A mounting board manufacturing system comprising: an artificial intelligence unit that performs at least one of predictions of how the state of mounting equipment will change in the future . The mounted board manufacturing system according to claim 1, further comprising a learning section that creates a data set for learning of the artificial intelligence section using part or all of the trace information collected by the trace information collecting means. . The mounted board manufacturing system according to claim 2, wherein the learning unit creates the data set by combining information included in production data used in mounting equipment of the mounted board manufacturing line and the trace information. . 4. The mounted board manufacturing system according to claim 1, wherein the artificial intelligence unit is a manufacturing quality variation prediction unit that predicts variations in manufacturing quality of the mounted board. 4. The mounting board manufacturing system according to claim 1, wherein the artificial intelligence section is an equipment state change prediction section that predicts changes in the state of the mounting equipment. 4. The mounting board manufacturing system according to claim 1, wherein the artificial intelligence unit is an equipment parameter management unit that analyzes equipment parameters used in the mounting equipment or obtains equipment parameters. Components are mounted on a board by a mounting board production line equipped with a plurality of mounting equipment, including a solder part forming device that forms solder parts on the lands of the board, and a component mounting device that mounts components on the board on which the solder parts are formed. A mounting board manufacturing method for manufacturing a mounting board mounted with
a trace information collection step of collecting and accumulating trace information from the mounting equipment, including information on boards and components used in the production of mounted boards in the mounting board production line, and information on errors occurring in the mounting equipment; ,
Predicting how the manufacturing quality of mounted boards in the mounted board production line will change in the future by using part or all of the trace information including the error information collected in the trace information collection step, or A mounting board manufacturing method comprising: an analysis step in which an artificial intelligence unit performs at least one of predictions of how the state of mounting equipment will change in the future . 8. The mounting board manufacturing method according to claim 7, further comprising a learning step of creating a data set for learning by the artificial intelligence unit using part or all of the trace information collected in the trace information collecting step. 9. The mounting board manufacturing method according to claim 8, wherein in the learning step, the data set is created by combining information included in production data used in mounting equipment of the mounting board manufacturing line and the trace information. . 10. The mounting board manufacturing method according to claim 7, wherein in the analysis step, the artificial intelligence unit predicts fluctuations in manufacturing quality of the mounting board. 10. The mounting board manufacturing method according to claim 7, wherein in the analysis step, the artificial intelligence unit predicts changes in the state of the mounting equipment. 10. The mounting board manufacturing method according to claim 7, wherein in the analysis step, the artificial intelligence section performs analysis regarding equipment parameters used in the mounting equipment or equipment parameter management for determining equipment parameters.

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