JP2021012979A - Mounting substrate manufacturing system and mounting substrate manufacturing method - Google Patents

Abstract

To provide a mounting substrate manufacturing system and a mounting substrate manufacturing method that can effectively utilize trace information, and also predict change in manufacturing quality and facility state to properly set parameters of mounting facilities so as to obtain excellent manufacturing quality.SOLUTION: A mounting substrate manufacturing system 1 that manufacture a mounting substrate having components mounted on a substrate comprises: a mounting substrate manufacturing line L in which a plurality of mounting facilities, including a screen printing device M2 for printing solder parts on a substrate and component mounting devices M4, M5 and M6 for mounting the components on the substrate, are arranged; trace information gathering means 7 which gathers and stores trace information, including information on the substrate and components used to manufacture the mounting substrate in the mounting substrate manufacturing line L, from the mounting facilities; and an artificial intelligence part 11 which utilizes part or the whole of the gathered trace information to perform at least one of analysis associated with manufacturing quality of the mounting substrate in the mounting substrate manufacturing line L and analysis associated with the mounting facilities.SELECTED DRAWING: Figure 1

Description

The present invention relates to a mounting board manufacturing system and a mounting board manufacturing method for manufacturing a mounting board in which components are mounted on the board.

In a mounting board manufacturing system that manufactures a mounting board in which components are mounted on a board, a printing process in which solder paste for joining parts is printed on the land of the board, a component mounting process in which components are mounted on the board after the printing process, and a component mounting process after component mounting A mounting work process such as a reflow process in which the substrate is heated to melt the solder and the components are soldered to the land of the substrate is executed. Production data related to parts, boards, equipment used in these mounting work processes, machine parameters applied in each work process, etc. are collected for each produced board and used as trace information indicating the production history of the board. These stored trace information are referred to when a problem such as a quality defect occurs in the produced product (see, for example, Patent Document 1).

Japanese Unexamined Patent Publication No. 2013-168539

In these mounting work processes, it is required to execute fine movements with high accuracy and high efficiency for fine parts, so the parameters for executing each work movement in a good operation mode are the types of parts. It is set in advance according to. Since setting these parameters is a task that requires expertise such as proficiency based on experience, attempts to have artificial intelligence perform this task have been studied in recent years. In order to make the artificial intelligence function effectively, set the parameters of the mounting equipment in the mounting board manufacturing field appropriately, and obtain good manufacturing quality, it is possible to predict fluctuations in manufacturing quality and equipment status and take appropriate measures. As described above, it is necessary to create high-precision learning data in advance.

Since it is necessary to acquire as much data as possible in order to create high-precision learning data, it is conceivable to use the above-mentioned trace information as a data source for creating learning data. However, in the prior art including the above-mentioned patent document examples, the trace information is often referred to for the purpose of investigating the cause when a problem such as a quality defect occurs in the produced product, and the trace information is effectively used. It was hard to say that it was done.

Therefore, the present invention provides a mounting board manufacturing system capable of effectively utilizing trace information, predicting fluctuations in manufacturing quality and equipment status, appropriately setting parameters of mounting equipment, and obtaining good manufacturing quality. It is an object of the present invention to provide a method for manufacturing a mounting board.

In the mounting board manufacturing system of the present invention, a plurality of mounting equipment including a solder portion forming device for forming a solder portion on a land of a substrate and a component mounting device for mounting a component on a substrate on which the solder portion is formed are arranged. A mounting board manufacturing line, a trace information collecting means for collecting and accumulating trace information including information on boards and components used for manufacturing the mounting board in the mounting board manufacturing line from the mounting equipment, and the trace information. An artificial intelligence unit that uses a part or all of the trace information collected by the collecting means to perform at least one analysis on the manufacturing quality of the mounting board in the mounting board manufacturing line or the analysis on the mounting equipment. Prepared.

In the mounting substrate manufacturing method of the present invention, a plurality of mounting equipments including a solder portion forming device for forming a solder portion on a land of a substrate and a component mounting device for mounting a component on a substrate on which the solder portion is formed are arranged. A mounting board manufacturing method for manufacturing a mounting board in which components are mounted on a board by a mounting board manufacturing line, wherein trace information including information on the board and components used in manufacturing the mounting board in the mounting board manufacturing line is obtained. Using the trace information collection process collected and accumulated from the mounting equipment and part or all of the trace information collected in the trace information collection process, analysis or analysis of the manufacturing quality of the mounting board in the mounting board manufacturing line It includes an analysis step in which at least one of the analyzes relating to the mounting equipment is performed by the artificial intelligence unit.

According to the present invention, it is possible to obtain good manufacturing quality by effectively using trace information, predicting fluctuations in manufacturing quality and equipment status, and appropriately setting parameters of mounting equipment.

Configuration explanatory view of the mounting board manufacturing system of one embodiment of the present invention Configuration explanatory view of the mounting board produced by the mounting board manufacturing system of one embodiment of the present invention. Explanatory drawing of component supply in mounting board manufacturing system of one Embodiment of this invention Explanatory drawing of parameters set in the screen printing process of the mounting board manufacturing system of one Embodiment of this invention Explanatory drawing of parameters set in component mounting process of mounting board manufacturing system of one Embodiment of this invention

Next, the configuration of the mounting board manufacturing system 1 of the present embodiment will be described with reference to FIG. The mounting board manufacturing system 1 has a function of manufacturing a mounting board in which components are mounted on the board, and includes a mounting board manufacturing line L in which a plurality of mounting facilities are connected and arranged. Further, the mounting board manufacturing system 1 includes a host system 2 and a mounting process support device 3.

The host system 2 includes production data, which is library data for workpieces such as boards and parts used in production work, and component information such as boards and parts actually used in manufacturing on the mounting board manufacturing line L. It has a function to manage various information such as equipment used information regarding equipment used, inspection information showing the result of inspection performed in each work process, and process conditions applied to manufacturing of mounting board. The mounting process support device 3 has a function of performing processing for the purpose of supporting mounting quality analysis and parameter setting by a learning model constructed by a deep learning method based on these various information.

The mounting board manufacturing line L will be described. From the upstream side (left side in FIG. 1), the mounting board manufacturing line L includes a board supply device M1, a screen printing device M2, a solder part inspection device M3, a component mounting device M4, M5, M6, a mounted component inspection device M7, and a reflow device. Each device of M8, a post-reflow inspection device M9, and a substrate recovery device M10 is arranged in series. The board transfer conveyors provided in each device are connected to each other so that the board to be worked can be transported from the upstream device to the downstream device or from the downstream device to the upstream device in the reverse order. That is, the mounting board manufacturing line L has a configuration in which a plurality of mounting equipment including a screen printing device M2 which is a solder portion forming device and component mounting devices M4, M5, and M6 are arranged.

The board supply device M1 stores a plurality of boards before the component mounting work and supplies them to the downstream device. Board identification information for individually identifying each board is given to these plurality of boards, and the board supplied from the board supply device M1 is read by the board identification information reading device 14. As a result, each substrate supplied to the mounting substrate manufacturing line L can be individually specified.

The screen printing apparatus M2 is a solder portion forming apparatus, and executes a printing process of printing a solder paste on a land of a substrate set on a printing stage to form a solder portion. These lands are formed at the mounting points of the board, and the parts are soldered in a later process. The solder portion inspection device M3 inspects the state of the solder portion formed by printing by the screen printing device M2.

The component mounting devices M4, M5, and M6 receive the board for which the solder section has been inspected by the solder section inspection device M3, and execute the component mounting step of mounting the component on the board on which the solder portion is formed. In these component mounting devices M4, M5, and M6, the substrate on which the solder portion is formed is supported by the support member, and the component is mounted on the substrate on which the solder portion is formed in that state.

The mounted component inspection device M7 inspects the state of the components mounted on the board. The reflow device M8 executes a reflow step of heating the substrate on which the components are mounted to melt the solder components contained in the solder portion. The post-reflow inspection device M9 inspects the soldered state of the parts on the substrate after the reflow process. As the post-reflow inspection device M9, one having a measuring means capable of acquiring two-dimensional information and three-dimensional information, one having a measuring means by X-ray, and the like can be used. The substrate recovery device M10 collects the inspected substrate after the reflow.

Each of these devices is connected to each other by a communication network 4, and the communication network 4 is further connected to an information storage unit 5 provided in the host system 2 via an information management device 6. Further, the host system 2 can take in the board design information 9a and the component specification information 9b from the production data storage unit 9 that stores the above-mentioned production data.

The board design information 9a is design data for manufacturing a mounting board. FIG. 2 shows an example of a mounting board 20 in which the component 22 is mounted on the board 21. A recognition mark 21a as a reference mark as a reference mark for a position and a two-dimensional bar code 23 for identification are formed on the substrate 21. In the board design information 9a regarding the mounting board 20, the CAD data of the board 21 constituting the mounting board 20, the coordinates of the mounting points of the parts 22 mounted on the board 21, the arrangement, dimensions, and shape of the lands for joining the parts, and the board. Information about the recognition mark 21a formed on the 21 is included.

The component specification information 9b is library data that collects individual information of the components 22 necessary for producing a plurality of types of mounting boards 20. That is, it includes information showing details of the component 22 mounted on the mounting board 20, such as the shape and dimensions of the component 22, and information on the number and arrangement of joining leads and electrodes formed on the component 22.

The information storage unit 5 is provided with a component information storage unit 5a, a facility used information storage unit 5b, an inspection information storage unit 5c, and a process information storage unit 5d. The component information storage unit 5a stores component information, which is the most basic information for traceability. The component information includes at least information for identifying the board (board ID), information for specifying the parts mounted on the board (part ID, part name, lot number, manufacturer name, etc.), and the board. Contains information about the date and time when the component was mounted. In the example shown in FIG. 2, the substrate ID for identifying the substrate is indicated by the two-dimensional barcode 23.

FIG. 3 shows a supply form of the component 22 included in the component component information. In the example shown here, the component 22 is supplied to the component mounting devices M4, M5, and M6 while being held by the component supply tape 30. As shown in FIG. 3A, the component supply tape 30 has a configuration in which the cover tape 32 is attached to the upper surface of the base tape 31 that holds the component 22.

The base tape 31 is formed with a component pocket 31a for accommodating the component 22 and a feed hole 31b for feeding the base tape 31 with a sprocket. In the component mounting devices M4, M5, and M6, the component supply tape 30 is fed by the tape feeder in the tape feed direction (Y direction --- arrow a). Then, at the component take-out position by the mounting head, the exposed component 22 by peeling the cover tape 32 from the base tape 31 is taken out from the component pocket 31a.

3 (b) and 3 (c) show the supply form of the component supply tape 30, respectively. In the example shown in FIG. 3B, the component supply tape 30 is wound around a supply reel 33 having two discs facing each other and stored, and is identified by a two-dimensional bar code 34 attached to the supply reel 33. Reel. By pulling out the component supply tape 30 from the supply reel 33 (arrow b) with the supply reel 33 mounted on the tape feeder, the component 22 held by the component supply tape 30 is supplied to the component mounting devices M4, M5, and M6. Will be done.

In the example shown in FIG. 3C, the component supply tape 30 is housed inside the rectangular supply cassette 35 in a state of the tape winding body 30a wound concentrically, and is attached to the supply cassette 35 in two dimensions. Identified by barcode 34. By pulling out the component supply tape 30 from the supply cassette 35 (arrow c) with the supply cassette 35 mounted on the tape feeder, the component 22 held by the component supply tape 30 is supplied to the component mounting devices M4, M5, and M6. Will be done.

The used equipment information storage unit 5b stores the used equipment information, that is, information for identifying the production equipment or unit used when manufacturing the mounting board. The equipment used information includes the serial number of the production equipment used, the serial number given by the equipment manufacturer, the identification information in the factory, and the like. These used equipment information is stored in association with the board ID and the component ID.

FIG. 4 shows an example in which the equipment used is the screen printing apparatus M2 that prints the solder S on the land 21b of the substrate 21 to form the solder portion. In the screen printing apparatus M2, the pattern hole 40a is formed in accordance with the land 21b, and the substrate 21 is aligned with the lower surface of the screen mask 40 to which the solder S is supplied to the upper surface. Then, in this state, a squeezing operation is executed in which the squeegee 41 is slidably contacted with the upper surface of the screen mask 40 and moved in the printing direction. As a result, the solder S is printed on the land 21b through the pattern hole 40a. In the example of the screen printing device M2, information for identifying the main body of the screen printing device M2, the screen mask 40, the squeegee 41, and the like is stored as the equipment used information.

FIG. 5 shows an example in which the equipment used is the component mounting devices M4, M5, and M6 in which the component 22 is mounted on the land 21b of the substrate 21 on which the solder S is printed. As shown in FIG. 5A, the component mounting devices M4, M5, and M6 include a component holding nozzle 50 that can attract and hold the component 22 and move. By aligning the component holding nozzle 50 holding the component 22 with respect to the land 21b on which the solder S is printed and lowering the component holding nozzle 50, the component 22 is mounted on the substrate 21 as shown in FIG. 5 (b). .. In this example, as the equipment used information, information for specifying the main body of the component mounting devices M4, M5, M6, the component supply unit such as the tape feeder, the component holding nozzle 50, the mounting head on which the component holding nozzle 50 is mounted, and the like are provided. Be remembered.

The equipment used information can include the date and time when the equipment was used, the type and date and time of the event that occurred in the equipment. Events of the component mounting devices M4, M5, and M6 include parts shortage, switching timing of the component supply tape 30, component pickup mistakes that occur in component replacement and component supply, and various errors. The events of the screen printing device M2 include mask cleaning for cleaning the lower surface of the screen mask 40, solder replenishment operation for supplying the solder S to the screen mask 40, and the like.

The inspection information storage unit 5c stores information related to inspection results by inspection devices (solder section inspection device M3, mounted component inspection device M7, post-reflow inspection device M9, etc.). The inspection result is stored in association with the board ID and the component ID. This makes it possible to individually refer to the inspection results of specific substrates and parts.

The process information storage unit 5d stores the process conditions applied when manufacturing the mounting board, that is, the parameters for operating the equipment and the like. As the process condition to be stored, either a preset set value or a measured value obtained by measurement during actual operation may be used. Examples of process conditions are as follows.

First, in the case of the screen printing apparatus M2 shown in FIG. 4, the printing pressure F, which is the pressure for pressing the squeegee 41 against the screen mask 40 and the solder S into the pattern hole 40a, and the angle formed by the squeegee 41 with the screen mask 40 are used as parameters. There is a certain attack angle θ, a squeegee speed VS which is a speed at which the squeegee 41 slides, and the like. In addition, parameters related to the plate release operation for separating the substrate 21 from the screen mask 40 after squeezing may be included.

Further, in the case of the component mounting devices M4, M5, and M6 shown in FIG. 5, first, parameters related to the ascending / descending operation of the component holding nozzle 50 are included. That is, there are a descending parameter DP (descending speed v, descending acceleration α) when the component holding nozzle 50 shown in FIG. 5A is descending, a descending stop height H shown in FIG. 5B, a pressing load W, and the like.

Further, as parameters related to the stop position [P] of the component holding nozzle 50, there are a correction value ΔP1 and an offset value ΔP2 of the component mounting operation added to the mounting point coordinate MP indicated by the mounting data. Further, image information such as an image of the component recognition camera and a component recognition result indicating the position and state of the component 22 held by the component holding nozzle 50 may be included.

The above-mentioned component component information, equipment used information, inspection information, and process information are collected from each device of the mounting board manufacturing line L via the communication network 4 by the information management device 6. The collected information is transmitted to and stored in each storage unit of the information storage unit 5. In the above configuration, the information storage unit 5 and the information management device 6 provide trace information including information on the boards and components used for manufacturing the mounting board in the mounting board manufacturing line L, and the mounting board manufacturing line L which is a mounting facility. Configure the trace information collection means that collects and accumulates from each device.

In the trace information collecting means shown in the present embodiment, the information stored in the component information storage unit 5a is indispensable, but the others are not necessarily indispensable. That is, the information stored in the equipment used information storage unit 5b, the inspection information storage unit 5c, and the process information storage unit 5d can be set by the user whether or not the information is collected. This makes it possible to collect the level of trace information required by the user.

The host system 2 is provided with a search terminal device 8, and it is possible to search for the board ID to be traced by inputting conditions for the collected trace information. For example, when there is a manufacturing defect in a certain component, it is possible to execute a search by the component ID and acquire the substrate ID of the mounting board 20 on which the component is mounted. On the contrary, it is also possible to identify the component used for the mounting board 20 by inputting and searching the board ID of the mounting board 20 in which a defect or the like is detected.

Next, the configuration and functions of the mounting process support device 3 will be described. The mounting process support device 3 has a learning function of having an artificial intelligence unit 11 composed of a plurality of AIs (Artificial intelligence) and an AI of the artificial intelligence unit 11 perform learning using the information accumulated in the information storage unit 5. It consists of part 12. In the mounting board manufacturing system 1 of the present embodiment, the artificial intelligence unit 11 has been learned to have the following three types of functions (manufacturing quality fluctuation prediction unit 11a, equipment state fluctuation prediction unit 11b, and equipment parameter management unit 11c). It is configured with the AI of.

The learning unit 12 prepares and trains a learning data set suitable for each AI. In the learning by the learning unit 12, the trace information collected by the trace information collecting means 7 is taken in and included in the data set. Further, if necessary, the dimensions and shapes of the lands included in the production data imported from the production data storage unit 9 can be included in the data set. This enables analysis that reflects the tendency peculiar to the work actually used and the mounting equipment. As each AI constituting the artificial intelligence unit 11, not only the AI learned by the learning unit 12 but also the AI previously learned by another learning unit may be used.

The manufacturing quality fluctuation prediction unit 11a inputs information useful for predicting quality fluctuation from the information stored in the information storage unit 5 as an input value, and predicts how it will change in the future. Examples of information useful for predicting quality fluctuations include inspection results by inspection devices (solder part inspection device M3, mounted parts inspection device M7, post-reflow inspection device M9), correction values for component mounting operation, and component mounting operation. It is also possible to input data related to the dimensions of the board and parts from production data such as event information such as suction mistakes.

The equipment state change prediction unit 11b inputs information useful for predicting equipment fluctuation from the information stored in the information storage unit 5 as an input value, and predicts how it will change in the future. Examples of information useful for predicting equipment fluctuations include inspection results by inspection devices (solder part inspection device M3, mounted parts inspection device M7, post-reflow inspection device M9), correction values for component mounting operation, and component mounting operation. Event information such as adsorption mistakes can be mentioned.

The equipment parameter management unit 11c inputs information useful for setting the equipment parameter from the information stored in the information storage unit 5 as an input value, and calculates the equipment parameter considered to be optimum. It also evaluates the equipment parameters in use in current production to determine if adjustments are needed. Examples of information useful for setting equipment parameters include inspection results by inspection devices (solder part inspection device M3, mounted parts inspection device M7, post-reflow inspection device M9), correction values for component mounting operation, and component mounting operation. Event information such as adsorption mistakes can be mentioned.

The mounting process support device 3 includes an administrator terminal 13, and the analysis results acquired by the manufacturing quality fluctuation prediction unit 11a, the equipment state fluctuation prediction unit 11b, and the equipment parameter management unit 11c are displayed on the administrator terminal 13. Will be done. Based on this display, the administrator determines the suitability of the analysis result by the artificial intelligence unit 11. As a result, human experience can be added to the analysis result by the artificial intelligence unit 11, and more accurate prediction and evaluation can be performed.

Next, in the mounting board manufacturing system 1 having the above-described configuration, a mounting board manufacturing method for manufacturing a mounting board in which components are mounted on the board by the mounting board manufacturing line L will be described. In this mounting board manufacturing method, prior to the production of executing the manufacturing of the mounting board, the mounting equipment provides trace information including the information of the boards and components used for manufacturing the mounting board in the mounting board manufacturing line L in advance. It is collected and accumulated from the screen printing device M2 to the post-reflow inspection device M9 (trace information collecting step).

Next, using a part or all of the trace information collected in the trace information collection process, the screen printing device M2 to the post-reflow inspection device M9, which is a facility for analyzing or mounting the manufacturing quality of the mounting board in the mounting board manufacturing line L. At least one of the analyzes related to is performed by the artificial intelligence unit 11 (analysis step). In this analysis step, a data set for learning of the artificial intelligence unit 11 is created by using a part or all of the trace information collected in the trace information collecting step (learning step).

In the present embodiment, in the above-mentioned analysis step, the manufacturing quality fluctuation prediction unit 11a and the equipment state fluctuation prediction unit 11b provided in the artificial intelligence unit 11 respectively change the manufacturing quality of the mounting substrate and the state of the mounting equipment. Predict. Further, the equipment parameter management unit 11c provided in the artificial intelligence unit 11 analyzes the equipment parameters used in the mounting equipment or manages the equipment parameters for obtaining the equipment parameters. As a result, it is possible to predict fluctuations in manufacturing quality and equipment conditions, set parameters of mounting equipment appropriately, and obtain good manufacturing quality.

As described above, in the mounting board manufacturing system and the mounting board manufacturing method shown in the present embodiment, in the mounting board manufacturing in which the mounting board in which the components are mounted on the board is manufactured by the mounting board manufacturing line L having the above-described configuration, the mounting board is manufactured. An information storage unit as a trace information collecting means that collects and accumulates trace information including information on the board 21 and the component 22 used for manufacturing the mounting board in the manufacturing line L from the mounting equipment constituting the mounting board manufacturing line L. At least one of the analysis on the manufacturing quality of the mounting board or the analysis on the mounting equipment in the mounting board manufacturing line L by using a part or all of the trace information collected by the 5 and the information management device 6 and the trace information collecting means. It is configured to include an artificial intelligence unit 11 for performing the above.

With this configuration, the information collected by the trace information collecting means can be used for analysis of manufacturing quality and mounting equipment for purposes other than tracing. As a result, it is possible to effectively use the trace information, predict fluctuations in manufacturing quality and equipment status, and appropriately set parameters of mounting equipment to obtain good manufacturing quality. Further, since the trace information collecting means can collect data for analysis of manufacturing quality and mounting equipment, it is possible to reduce the capital investment by that amount.

The mounting board manufacturing system and mounting board manufacturing method of the present invention make effective use of trace information, predict fluctuations in manufacturing quality and equipment status, and appropriately set parameters of mounting equipment to achieve good manufacturing quality. It has the effect of being able to be obtained, and is useful in the field of manufacturing a mounting board in which components are mounted on the board.

1 Mounting board manufacturing system 2 High-level system 3 Mounting process support device 7 Trace information collecting means 9 Production data storage unit 11 Artificial intelligence unit 20 Mounting board 21 Board 22 Parts 30 Parts supply tape M2 Screen printing device M4, M5, M6 Parts mounting apparatus

Claims (12)

A mounting board manufacturing line in which a plurality of mounting equipment including a solder portion forming device for forming a solder portion on a land of a board and a component mounting device for mounting a component on a board on which the solder portion is formed is arranged.
A trace information collecting means for collecting and accumulating trace information including information on the board and components used for manufacturing the mounting board in the mounting board manufacturing line from the mounting equipment.
An artificial intelligence unit that uses a part or all of the trace information collected by the trace information collecting means to perform at least one analysis on the manufacturing quality of the mounting board in the mounting board manufacturing line or the analysis on the mounting equipment. And, equipped with a mounting board manufacturing system. The mounting board manufacturing system according to claim 1, further comprising a learning unit that creates a data set for learning of the artificial intelligence unit by using a part or all of the trace information collected by the trace information collecting means. .. The mounting board manufacturing system according to claim 2, wherein the learning unit creates the data set by combining the information included in the production data used in the mounting equipment of the mounting board manufacturing line with the trace information. .. The mounting board manufacturing system according to any one of claims 1 to 3, wherein the artificial intelligence unit is a manufacturing quality fluctuation prediction unit that predicts fluctuations in the manufacturing quality of the mounting board. The mounting board manufacturing system according to any one of claims 1 to 3, wherein the artificial intelligence unit is an equipment state fluctuation prediction unit that predicts changes in the state of the mounting equipment. The mounting board manufacturing system according to any one of claims 1 to 3, wherein the artificial intelligence unit is an equipment parameter management unit that analyzes equipment parameters used in the mounting equipment or obtains equipment parameters. A component is mounted on a board by a mounting board manufacturing line in which a plurality of mounting devices including a solder portion forming device for forming a solder portion on a land of a board and a component mounting device for mounting a component on the board on which the solder portion is formed are arranged. It is a mounting board manufacturing method for manufacturing a mounting board on which
A trace information collection process that collects and accumulates trace information including information on boards and components used for manufacturing a mounting board in the mounting board manufacturing line from the mounting equipment.
Using a part or all of the trace information collected in the trace information collection process, at least one of the analysis on the manufacturing quality of the mounting board in the mounting board manufacturing line or the analysis on the mounting equipment is performed by the artificial intelligence unit. A mounting substrate manufacturing method, including an analysis process to be performed. The mounting substrate manufacturing method according to claim 7, further comprising a learning step of creating a data set for learning of the artificial intelligence unit by using a part or all of the trace information collected in the trace information collecting step. The mounting board manufacturing method according to claim 8, wherein in the learning step, the data set is created by combining the information included in the production data used in the mounting equipment of the mounting board manufacturing line with the trace information. .. The mounting substrate manufacturing method according to any one of claims 7 to 9, wherein in the analysis step, the artificial intelligence unit predicts fluctuations in manufacturing quality of the mounting substrate. The mounting substrate manufacturing method according to any one of claims 7 to 9, wherein in the analysis step, the artificial intelligence unit predicts fluctuations in the state of the mounting equipment. The mounting substrate manufacturing method according to any one of claims 7 to 9, wherein in the analysis step, the artificial intelligence unit analyzes the equipment parameters used in the mounting equipment or manages the equipment parameters for obtaining the equipment parameters.

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