JP7487391B2 - Display device - Google Patents

Description

This disclosure relates to a display device that displays images used in visual inspection of the mounting state of components on a board.

Various techniques have been proposed for mounting management devices that manage the mounting state of components on a board by visual inspection. For example, the following Patent Document 1 describes a method for finally determining whether each component is good or bad by displaying images used in an automatic visual inspection of a component-mounted board for components that have been determined to be defective in the automatic visual inspection and accepting an operation by an operator who judges whether the defective judgment is appropriate based on this display. The method describes a method for confirming the results of a component mounting inspection, which is characterized in that it creates an image list in which images used in the inspection of multiple components that have been determined to be defective by automatic visual inspection based on the same judgment criterion are arranged in order of the degree of deviation of feature values obtained from each image and compared with the judgment criterion, displays the image list, accepts an operation to specify the boundary position between a group of components that should be determined to be defective and a group of components that should not be determined to be defective on the display screen, and finally determines whether each component is good or bad based on the boundary position specified by the operation.

JP 2009-103648 A

According to the above-mentioned method for checking inspection results, the displayed parts list is arranged in order of the degree of defect, so it is easy to specify the boundary between parts that should be determined to be defective and parts that should not be determined to be defective. However, it is difficult to check the process by which defects change over time.

The present disclosure has been made in consideration of the above-mentioned points, and aims to provide a display device that makes it possible to visually check changes over time in the mounting state of components on a board using inspection images used in visual inspection.

This specification discloses a storage unit that stores inspection images used in visual inspection of the mounting state of components on a board, a designation unit that allows the user to select and designate one of the following as a predetermined condition: mounting position, type of component, slot for supplying the component, nozzle for mounting the component, and position where the component is mounted, a display unit that displays the image, and a display device that displays, on the display unit, portions of the inspection image that match the predetermined condition in chronological order.

According to the present disclosure, the mounting management device can visually check the changes over time in the mounting state of components on a board using inspection images used in visual inspection.

1 is a block diagram showing an example of the configuration of a mounting management device according to an embodiment of the present invention provided in a component mounting line; 13A and 13B are diagrams illustrating an example of an inspection image used in the mounting management device. 13 is a diagram showing a display example of the mounting management device. FIG. 13 is a diagram showing a display example of the mounting management device. FIG. 13 is a diagram showing a display example of the mounting management device. FIG.

Below, preferred embodiments of the present disclosure will be described in detail with reference to the drawings. However, in the drawings, some components are omitted, and the dimensional ratios of the various parts are not necessarily accurate.

In this embodiment, for example, a mounting management device 21 of this embodiment is provided in the component mounting line 1 shown in FIG. 1. In the component mounting line 1, a plurality of electronic component mounters 3 and one appearance inspection device 5 are arranged, and electronic components are mounted on each board 9 transported on the transport path 7.

Each electronic component mounter 3 includes an electronic component supply unit 11, a mounting head unit 13, and multiple suction nozzles 15. The electronic component supply unit 11 includes multiple slots, and supplies electronic components using feeders attached to each slot. The mounting head unit 13 picks up electronic components using the suction nozzles 15 and mounts them on the board 9. The mounting head unit 13 changes the suction nozzles 15 depending on the size and type of electronic component to be mounted. A mounting camera 17 is fixed to the mounting head unit 13 and is used when mounting electronic components.

The visual inspection device 5 uses a visual inspection camera 19 etc. to check whether the mounting condition of each electronic component mounted on the board 9 is good or bad.

Note that component mounting line 1 is equipped with solder printing equipment and reflow equipment (not shown), but as these devices are constructed using publicly known technology, detailed descriptions of them will be omitted.

The mounting management device 21 of this embodiment is connected to each electronic component mounter 3 and visual inspection device 5, etc., via a communication line L through an input/output interface (not shown), and includes a control unit 23, a memory unit 25, a display unit 27, an input unit 29, etc.

The control unit 23 is responsible for the overall control of the mounting management device 21, and is composed of, for example, a central processing unit (CPU), a read only memory (ROM), and a random access memory (RAM). The control unit 23 has functional units such as a management unit 23A and an extraction unit 23B. The control functions of the management unit 23A and the extraction unit 23B will be described later.

The storage unit 25 is configured, for example, by a hard disk drive (HDD) or the like, and is stored in the electronic component mounter 3.
The data transmitted from the appearance inspection device 5 is stored in the display unit 27 and the input unit 29. The display unit 27 and the input unit 29 are configured with a touch panel. However, the display unit 27 is, for example, an LCD (Liquid Crystal Display).
The input unit 29 may be composed of, for example, a keyboard or a mouse.

The data transmitted from the visual inspection device 5 and stored in the memory unit 25 includes, for example, the inspection image 31 shown in FIG. 2. The inspection image 31 is acquired by the visual inspection camera 19 in the visual inspection device 5, and is used when performing a visual inspection of the mounting state of the electronic components on the board 9. Note that the inspection image 31 may be acquired after the board 9 has been subjected to a reflow process by a reflow device (not shown).

In the inspection image 31, one board 9 is imaged. Four boards B1, B2, B3, and B4 of the same work size are imposed on the board 9. The same type of electronic components are mounted at the same mounting positions on each of the boards B1, B2, B3, and B4. Specifically, each of the boards B1, B2, B3, and B4 has three mounting positions R1, R2, and R3. An electronic component P1 is mounted at each of the mounting positions R1 and R2. In contrast, an electronic component P2 of a different type from the electronic component P1 is mounted at the mounting position R3.

The inspection image 31 is stored in the memory unit 25 of the mounting management device 21 with its specific information D associated with it. The specific information D includes information that identifies the inspection image 31 (substrate 9), as well as the time when the inspection image 31 was captured by the appearance inspection camera 19. In this way, multiple inspection images 31 are accumulated in the memory unit 25 of the mounting management device 21.

Hereinafter, when boards B1, B2, B3, and B4 are collectively referred to without distinction, they will be referred to as board B. This also applies to mounting positions R1, R2, and R3 and electronic components P1 and P2.

In the visual inspection performed by the visual inspection device 5, for example, one of the four corners of the board 9 is set as the reference point O in the inspection image 31, and the X-axis direction, Y-axis direction, and θ direction (rotation direction) are set, and the positional deviation in each direction of the electronic component P is calculated by pattern matching or the like. The calculated positional deviation data in each direction is transmitted to the mounting management device 21 in a state associated with data specifying the board 9, board B, and mounting position R on which the electronic component P of the data is mounted, and is stored in the memory unit 25 of the mounting management device 21 as data transmitted from the visual inspection device 5.

In the mounting management device 21, the display contents of the display unit 27 are controlled as shown in FIG. 3 to FIG. 5. The control is performed by the management unit 23A and the extraction unit 23B based on the multiple inspection images 31 and data stored in the memory unit 25. As shown in FIG. 3, a table 41 and a scroll bar 42 are displayed on the display unit 27. The display area of the table 41 is moved by the scroll bar 42. The table 41 is composed of multiple rows and multiple columns. The table 41 has multiple columns that constitute it, including a board number column 41A, a board number column 41B, a mounting position column 41C, a component type column 41D, an X-axis direction column 41E, a Y-axis direction column 41F, a θ-direction column 41G, a slot number column 41H, a nozzle number column 41I, and a mounting time column 41J.

The board number column 41A, the board number column 41B, and the mounting position column 41C display data identifying the board 9, the board B, and the mounting position R. The component type column 41D displays data identifying the type of electronic component P. The X-axis direction column 41E, the Y-axis direction column 41F, and the θ-direction column 41G display data indicating the positional deviations in the X-axis direction, the Y-axis direction, and the θ-direction for the electronic component P at the mounting position R associated with the row of table 41. These data are data transmitted from the appearance inspection device 5 and stored in the memory unit 25 of the mounting management device 21.

In addition, in table 41 shown in Figures 3 to 5, the codes for board B, mounting position R, and electronic component P are listed as the above-mentioned identifying data in the board number column 41B, mounting position column 41C, and component type column 41D.

The slot number column 41H, nozzle number column 41I, and mounting time column 41J display data for an electronic component P at a mounting position R associated with a row in table 41, specifying the feeder slot in the electronic component supply unit 11 to which it was supplied, the suction nozzle 15 used in mounting, and the time of mounting. These data are data transmitted from each electronic component mounter 3 and stored in the memory unit 25 of the mounting management device 21.

When one of the multiple rows constituting table 41 is designated by a tap operation or the like on input unit 29, a list box 43 is displayed on display unit 27 in addition to the above-described table 41, as shown in Fig. 4. List box 43 is provided with items 43A, 43B, 43C, and 43D for mounting position, component type, slot number, and nozzle number.

When the mounting position item 43A in the list box 43 is specified by tapping the input unit 29 or the like, the mounting position R displayed in the mounting position column 41C of the row specified by the input unit 29 in the table 41 is identified. When the component type item 43B is specified by tapping the input unit 29 or the like, the type of electronic component P displayed in the component type column 41D of the row specified by the input unit 29 in the table 41 is identified. When the slot number item 43C is specified by tapping the input unit 29 or the like, the slot displayed in the slot number column 41H of the row specified by the input unit 29 in the table 41 is identified. When the nozzle number item 43D is specified by tapping the input unit 29 or the like, the nozzle displayed in the nozzle number column 41I of the row specified by the input unit 29 in the table 41 is identified.

In this way, when one of the items 43A, 43B, 43C, 43D, mounting position, component type, slot number, or nozzle number, is specified in the list box 43, as shown in FIG. 5, in addition to the above-mentioned table 41 and list box 43, multiple extracted images 45 are displayed on the display unit 27 along with arrows 47.

The multiple extracted images 45 are portions cut out from the multiple inspection images 31 stored in the memory unit 25. For example, the multiple extracted images 45 shown in FIG. 5 are created when the mounting position R1 is specified by tapping the table 41 and the list box 43 on the input unit 29, and are portions cut out from the multiple inspection images 31 stored in the memory unit 25 that include the electronic component P mounted at the specified mounting position R1. Such creation is performed by the extraction unit 23B.

Furthermore, the multiple extracted images 45 are displayed in chronological order such that the mounting times of the electronic components P contained in each of the multiple extracted images 45 become more recent as the image progresses in the direction of the arrow 47. Here, when a swap operation in the input unit 29 is performed in the direction of the arrow 47, the multiple extracted images 45 are scrolled and displayed in chronological order such that the mounting times of the electronic components P become older in succession. In contrast, when a swap operation in the input unit 29 is performed in the opposite direction to the direction of the arrow 47, the multiple extracted images 45 are scrolled and displayed in chronological order such that the mounting times of the electronic components P become newer in succession. Such display is performed by the management unit 23A.

In other words, when a mounting position R is specified by tapping the table 41 and the list box 43 on the input unit 29, the multiple extracted images 45 are created by cutting out portions including the electronic component P mounted at the specified mounting position R from the multiple inspection images 31 stored in the memory unit 25. Also, when a type of electronic component P is specified by tapping the table 41 and the list box 43 on the input unit 29, the multiple extracted images 45 are created by cutting out portions including the same type of electronic component P as the specified type from the multiple inspection images 31 stored in the memory unit 25.

When a slot is specified by tapping the table 41 and the list box 43 on the input unit 29, the multiple extracted images 45 are created by cutting out a portion including the electronic component P supplied to the specified slot from the multiple inspection images 31 stored in the memory unit 25. When a suction nozzle 15 is specified by tapping the table 41 and the list box 43 on the input unit 29, the multiple extracted images 45 are created by cutting out a portion including the electronic component P mounted by the specified suction nozzle 15 from the multiple inspection images 31 stored in the memory unit 25.

The multiple extracted images 45 created in this way are displayed in chronological order on the display unit 27, as described above, and are scrolled.

In addition, in the table 41 of the display unit 27, the row corresponding to each extracted image 45 being displayed on the display unit 27 may be displayed inverted. In addition, the multiple extracted images 45 may be displayed together with the mounting time of the electronic component P contained in each of them.

As described above in detail, the mounting management device 21 of this embodiment makes it possible to visually check the change over time in the mounting state of the electronic component P on the board 9 using the inspection image 31 used in the visual inspection.

In this embodiment, electronic component P is an example of a component. Each type of electronic component P1, P2 is an example of a type of component. Mounting position R is an example of a position where a component is mounted. The feeder slot in electronic component supply unit 11 is an example of a slot that supplies components. Suction nozzle 15 is an example of a nozzle that mounts components. The data displayed in slot number column 41H, nozzle number column 41I, and mounting time column 41J of table 41 are examples of mounting information. Each of items 43A, 43B, 43C, and 43D of mounting position, component type, slot number, and nozzle number provided in list box 43 are examples of predetermined conditions.

The present disclosure is not limited to the above-described embodiment, and various modifications are possible without departing from the spirit of the present disclosure.
For example, the inspection image 31 may be acquired by the mounting camera 17 of the electronic component mounter 3 and then transmitted to the mounting management device 21 and the appearance inspection device 5 .

In addition, the test images 31 may be displayed in chronological order instead of the extracted images 45. In such a case, there is no need to tap the extraction unit 23B or the input unit 29 on the table 41 and list box 43.

The mounting management device 21 may also be used as the electronic component mounter 3, the appearance inspection device 5, or a device (not shown) that manages the component mounting line 1.

9 Board 11 Electronic component supply section 15 Suction nozzle 21 Mounting management device 23A Management section 23B Extraction section 25 Memory section 27 Display section 31 Inspection image 41 Table 41H Slot number column 41I Nozzle number column 41J Mounting time column 43 List box 43A Mounting position item 43B Component type item 43C Slot number item 43D Nozzle number item 45 Extracted image P Electronic component R Mounting position

Claims (3)

a storage unit that stores an inspection image used in visual inspection of the mounting state of components on a board;
a designation unit that can select and designate, as the predetermined condition, one of a mounting position, a type of component, a slot to supply a component, a nozzle to mount a component, and a position to mount a component;
A display unit for displaying an image;
A display device that displays, on the display unit, portions of the inspection image that match the predetermined conditions in a chronological order. The display device according to claim 1, in which the display unit scrolls through the parts of the inspection image that match the specified conditions in chronological order, making it possible to confirm the process of change over time. The display device according to claim 1 or 2, wherein the display unit displays the mounting time of the component together with the portion of the inspection image that matches the specified condition.

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