JP2004200224A - Defective recognition solving method and electronic-part loading device using it - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a defective recognition solving method by which the status of a defective recognition is reproduced completely by a status information at a time when the defective recognition is generated and the cause of the defective recognition can be elucidated, and to provide an electronic-part loading device using the method. <P>SOLUTION: A CPU 40 for the electronic-part loading device copies a library information in the case of the defective recognition, a device information and an image data, every time the defective recognition of a part by a camera 44 or the defective recognition of a substrate mark by a camera 47 is generated to a recognition error-information region 59 from the work region of a memory 42; transfers them to the recognition-error information recording region 54 of a recorder 43 from the recognition error-information region 59 by a data conservation indication from an operator; and transmits them to an electronic-part loading device maker by the indication from the operator. An environment in the case of the generation of a recognition error on the basis of a transmitted recognition-error information, the problem is analyzed and a method for solving the problem is discovered and made to inform to an electronic-part loading device user. <P>COPYRIGHT: (C)2004,JPO&NCIPI

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a method for quickly resolving a recognition failure that occurs in image recognition of a circuit board or an electronic component generated at a production site where a board unit is produced by the electronic component mounting apparatus, and an electronic component mounting apparatus using the method.
[0002]
[Prior art]
2. Description of the Related Art Conventionally, there is an electronic component mounting apparatus that mounts electronic components (hereinafter simply referred to as components) on a circuit board (hereinafter simply referred to as a substrate) carried into a main body device.
FIG. 9 (a) is an external perspective view of such an electronic component mounting apparatus, and FIG. 9 (b) is a perspective view schematically showing the internal configuration by removing upper and lower protective covers.
[0003]
As shown in FIG. 1 (a), the electronic component mounting apparatus 1 includes a monitor device 2 comprising a CRT display before and after on a ceiling cover, and an alarm lamp for notifying the operating state on the left and right on the ceiling cover, respectively. 3 is provided. On the front and rear surfaces of the upper protective cover 4, there are provided small display input panels 5 each comprising a liquid crystal display and a touch-type input device and capable of inputting various instructions by an external operation. (The display input panel 5 at the rear, which is obliquely upward in the figure, is shaded and cannot be seen).
[0004]
On the lower base 6, a pair of fixed and movable parallel board guide rails 7 are provided at the center in the transport direction (X) of a printed circuit board (hereinafter simply referred to as a board) 8 shown in FIG. It is disposed to extend horizontally in the axial direction (from the lower right to the upper left). A loop-shaped conveyor belt (conveyor belt), which cannot be seen in the drawing, is movably disposed in contact with the lower portions of these board guide rails 7.
[0005]
The conveyor belt is driven by a belt drive motor (not shown) to move the belt side portions each having a width of several millimeters from below the substrate guide rail 7 to the substrate transport path, travels in the substrate transport direction, and moves on both sides of the rear surface of the substrate 8. The substrate 8 before mounting components is loaded into the apparatus main body from the upstream side of the line while supporting the components from below, and the substrate 8 on which components are mounted is sequentially transported to the downstream side of the line. Two substrates 8 are always loaded into the electronic component mounting apparatus 1, are positioned, and are fixed until component mounting is completed.
[0006]
An electronic component supply table 9 is formed before and after the base 6, respectively (in FIG. 3A, the rear electronic component supply table 9 which is obliquely upward and rightward in the figure is not visible. The electronic component supply table 9 at the rear is not shown in FIG. On the electronic component supply table 9, a large number of tape cassette type electronic component supply devices 11 are arranged.
[0007]
Above the base 6, four X-axis rails 12 and these two X-axis rails 12 are respectively placed on the two X-axis rails 12 in the X-axis direction (from the lower right to the lower left in the drawing). A total of two Y-axis rails 13, each of which is slidably supported diagonally upward), are arranged on the left and right. Each Y-axis rail 13 supports the X-axis rail 12 slidably in the Y-axis direction (from diagonally lower left to upper diagonally right in the figure).
[0008]
On each of the four X-axis rails 12, one work head support tower 14 is suspended so as to be slidable in the X-axis direction. That is, the electronic component mounting apparatus 1 shown here is provided with a total of four working head support towers 14.
In the example shown in the figure, two work heads 15 are arranged on each work head support tower 14 so as to be able to move up and down vertically (Z direction) and to be rotatable in a 360 degree direction (referred to as θ direction). That is, a total of eight working heads 15 are arranged in the electronic component mounting apparatus 1. Each of the work heads 15 is moved by the Y-axis rail 13 in the X-axis direction in the Y-axis direction, the work head support tower 14 is moved in the X-axis direction by the X-axis, and moved in the Z-axis direction by the work head 15 itself. By rotating in the θ direction, the position in the front, rear, left, right, up, and down directions and in the 360 ° direction can be freely controlled.
[0009]
These work heads 15 suction a predetermined component supplied to the suction unit by the tape feeder 11 or the tray-type electronic component supply device by a suction nozzle, and mount the suctioned component at a predetermined mounting position on the substrate 8. .
Although not shown, the base 6 includes a substrate positioning device, a substrate fixing mechanism for fixing the substrate between the two substrate guide rails 7, a control device for controlling each part, and the like. ing.
[0010]
FIG. 10 is a block diagram showing a system configuration of the electronic component mounting apparatus. As shown in FIG. 1, the electronic component mounting apparatus 1 includes a CPU 16 and a control unit including an i / o (input / output) control unit 18 and an image processing unit 19 connected to the CPU 16 via a bus 17. Further, a memory 21 is connected to the CPU 16. The memory 21 includes a program area and a data area (not shown).
[0011]
Further, the i / o control unit 18 includes an illumination device 23 for illuminating a substrate mark and a component mounting position of the substrate 8 and an illumination device for illuminating a component 25 sucked by a component suction nozzle 24 of a mounting head. 26 are connected.
Further, an X-axis motor 27, a Y-axis motor 28, a Z-axis motor 29, and a θ-axis motor 31 are connected to the i / o control unit 18 via respective amplifiers (AMP). The X-axis motor 27 drives the work head left and right, the Y-axis motor 28 drives the X-axis rail back and forth, the Z-axis motor 29 drives the work head up and down, and the θ-axis motor 31 Is rotated 360 degrees.
[0012]
Although not particularly shown, each of the above-mentioned amplifiers is provided with an encoder, and these encoders are used to control each motor (X-axis motor 27, Y-axis motor 28, Z-axis motor 29, θ-axis motor 31). An encoder value corresponding to the rotation is input to the CPU 16 via the i / o control unit 18. Thereby, the CPU 16 can recognize the current position of the component suction nozzle 24 according to the time axis.
[0013]
Further, a vacuum unit 32 is connected to the i / o control unit 18. The vacuum unit 32 is pneumatically connected to the component suction nozzle 24 via the vacuum tube 33 and the work head support tower 14 and the work head 15 shown in FIG. An air pressure sensor 34 is provided in the vacuum tube 33. The vacuum unit 32 causes the component suction nozzle 24 to suck the component 25 by vacuum, or releases the suction by vacuum release, air blow, and vacuum break (vacuum break). At this time, air pressure data in the vacuum tube 33 is output from the air pressure sensor 34 to the CPU 16 via the i / o control unit 18 as an electric signal. Accordingly, the CPU 16 can recognize the state of the air pressure in the vacuum tube 33, and the current state of the component suction nozzle 24 according to the time axis of the air pressure.
[0014]
Further, a positioning device, a belt drive motor, a substrate sensor, an abnormality display lamp, and the like are connected to the i / o control unit 18 via respective drivers. The positioning device is arranged below the board guide rail inside the base of the component mounting device, and performs positioning of the board 8 guided into the device. The belt drive motor circulates and drives the substrate transport belt integrally provided on the guide rail. The substrate sensor detects the loading and unloading of the substrate 8. The abnormality display lamp is lit or flashes when an abnormality occurs, such as an operation abnormality of the component mounting apparatus or a foreign object entering the work area, to notify the operator of the occurrence of the abnormality.
[0015]
Further, a communication i / o interface 35, the display input panel 5 shown in FIG. 9, and a recording device 36 are connected to the i / o control unit 18. The communication i / o interface 35 can communicate with the CPU 16 by connecting to these processing devices by wire or wirelessly, for example, when teaching or other processing is performed by another processing device such as a personal computer. It is configured as follows.
[0016]
Further, the display input panel 5 displays the image of the board 8 captured by the image processing unit 19 with the camera 38 on the working head side and the image processing unit 19 with the camera 39 on the main body device side when the component mounting work is executed. The captured image of the component 25 is displayed on the display device. When the teaching process is executed, a graph image and a parameter input window are displayed on the screen.
[0017]
The recording device 36 mounts various recording media such as an HD (Hard Disk), an FD (Floppy (registered trademark) Disk), an MO (Magnet Optical Disk), a CD-ROM / RW, a card or a stick-type flash memory. It is possible to record and hold various programs such as a component mounting process of the component mounting device, a component mounting teaching process performed in advance, a component library data, NC data from CAD, and the like. These programs are loaded into the program area of the memory 21 by the CPU 16 and used for control processing of each unit. Data is also read out to the data area of the memory 21 and predetermined processing is performed. The processed and updated data is stored and stored in a predetermined data area of a predetermined recording medium.
[0018]
In the electronic component mounting apparatus having such a configuration, in the production of a board unit, two boards may be carried in, or a parent board in which a plurality of small boards (child boards) are connected may be carried in. However, one substrate is usually handled as a minimum unit. Then, first, the board imaging camera 38 is moved to the board mark position of the board 8 which is hard-positioned by the positioning mechanism, and the board mark is imaged. The board mark is usually formed of a copper pattern having an outer shape of about 1 mm and a shape such as a square, an equilateral triangle, a circle, or a rhombus.
[0019]
The captured image of the board mark is taken into a frame grabber, converted from an analog signal to digital data, and information of the board mark registered in advance with respect to the board mark image obtained by the conversion. Image recognition is performed by using the apparatus information of the main body apparatus for recognition. When the image recognition for the two board marks is completed, the displacement and the inclination of the board 8 are recognized, and the correction amount of the mounting coordinates registered in advance is determined.
[0020]
Thereafter, the component 25 mounted on the substrate 8 is taken out of the component supply device, the component 25 is moved to a component recognition point above the component recognition camera 39, and the component 25 is imaged from below. The shape of the component is usually, for example, 1 mm to 40 mm in size, the shape is often a rectangle or a square, and the arrangement of the electrodes is extended or bent type lead wire or bump, etc. The characteristics of the image recognition with respect to the camera are various, for example, the light reflectance for the illumination for imaging differs depending on the company.
[0021]
The captured image of the component is taken into a frame grabber, converted from an analog signal to digital data, and the component image information obtained by this conversion is compared with library information of the component registered in advance and recognition for the component. Image recognition is performed using the device information of the main device. By this image recognition, the displacement and inclination of the component 25 are recognized, and the mounting coordinate position registered in advance is corrected by the correction amount obtained from the component image recognition by the mounting position correction amount obtained from the board mark image recognition. The correction is made in consideration of the amount, and the component is mounted at the corrected mounting position.
[0022]
Such a work of mounting the component 25 on the substrate 8 is repeated by the number of components 25 mounted on the substrate 8.
[0023]
[Problems to be solved by the invention]
By the way, in the above-described board mark image recognition and component image recognition, recognition failure often occurs. When such a recognition failure occurs, the operation of the electronic component mounting apparatus stops, the entire board unit production line stops, and the production efficiency decreases. Therefore, the cause of the recognition failure must be clarified as soon as possible so that the production can be resumed by the correct image recognition operation.
[0024]
However, there are various factors in the above-described recognition failure in image recognition. In some cases, the factors can be easily determined at the production site of the substrate unit, and in other cases, it cannot be easily determined.
If the cause of the recognition failure as described above cannot be easily determined at the board unit production site, an inquiry is made from the board unit production site to the manufacturer of the electronic component mounting apparatus. At the manufacturer who received the inquiry, a specialized technician collected as much information as possible using telephone, FAX or e-mail to indicate the situation at the time of the recognition failure, and based on the collected information, We have constructed a test environment under conditions as close as possible to the unit production site, performed wiping tests to reproduce recognition errors, and analyzed the factors that cause recognition errors.
[0025]
However, it is sufficient if the cause of the recognition failure can be clarified by this analysis. However, the method of reproducing the recognition failure is based on indirect information received from the board unit production site at the time of the recognition failure of the electronic component mounting apparatus as described above. The conditions of the test environment are created based on the information, so that the information received is incorrect, the information is insufficient, or the information changes while the information is transmitted through multiple people. Inconsistencies in information will inevitably occur.
[0026]
If such a discrepancy in information exists between the situation at the time of recognition failure of the board unit production site and the creation of the test environment conditions, the conditions set in the test environment are set in the actual electronic component mounting apparatus. Since the condition is different from the condition, the occurrence of the recognition failure cannot be completely reproduced, so that the problem is not easily clarified. In particular, when the problem is complicated, there are many cases in which even if there is no inconsistency in information, it cannot be clarified only by the information indicating the situation as described above.
[0027]
In such a case, the parts and boards that caused the recognition failure are mailed from the board unit production site, and the manufacturer creates a production environment under almost the same conditions as the board unit production site and performs a reproduction test. I've been.
However, this method has a problem that it takes a very long time to elucidate the cause of the recognition failure because the recognition target such as a board or a component is mailed.
[0028]
An object of the present invention is to provide a method of recognizing a recognition failure that can completely reproduce the situation of the recognition failure by using reliable situation information when the recognition failure occurs and elucidate the cause of the recognition failure, and to use the same. Electronic component mounting apparatus.
[0029]
[Means for Solving the Problems]
First, the recognition failure solving method according to the first aspect of the present invention is a mark image pickup means for picking up a recognition board mark of a board carried and positioned in a main body device, and taken out from a component supply device to a component mounting head. Component imaging means for imaging a component, mark recognition means for image-recognizing the recognition board mark based on an image of the recognition board mark of the substrate imaged by the mark imaging means, and imaging by the component imaging means And a component recognizing device for recognizing the component based on the image image of the component. A method of solving the recognition failure by analyzing a cause of occurrence of the recognition failure, wherein the mark information of the recognition board mark; Information holding step of holding the library information of the main body device and the recognition information of the main body device, an image image of the board recognition mark of the board taken by the mark imaging means, and an image of the component taken by the component imaging means An image holding step of holding an image, and when recognition failure occurs by the mark recognizing means or the component recognizing means, mark information of the recognition board mark held by the information holding means, library information of the part, And recognition information of the main body device, and an image of the recognition board mark held by the image holding means, and an image of the component, and a recognition failure information saving step of saving as recognition failure information, The recognition failure information stored in the recognition failure information storing step. Failure to reproduce the recognition environment generated, build analysis environment of the recognition failure, by the constructed analysis environment analyzes the recognized defective configured to solve the recognition failure.
[0030]
Next, the electronic component mounting apparatus according to the second aspect of the present invention is a mark image pick-up means for picking up a recognition board mark of a board carried and positioned in the main body apparatus, and taken out from the component supply apparatus to the component mounting head. Component imaging means for imaging the component, a mark recognition means for recognizing the recognition board mark based on an image of the recognition board mark of the board imaged by the mark imaging means, A component recognizing device for recognizing the component based on a captured image of the component, comprising: a mark information of the recognition board mark; a library information of the component; and a main body. An information holding unit for holding information for recognition of the device, an image image of a board mark for recognition of the board taken by the mark imaging unit, and An image holding unit that holds an image of the component imaged by the component imaging unit; and an image recognition unit that is held by the information holding unit when a recognition failure occurs by the mark recognition unit or the component recognition unit. When the mark information of the board mark, the library information of the component, the information for recognition of the main body device, and the image image of the board mark for recognition and the image image of the component held by the image holding means are not recognized properly. A recognition failure information storage means for storing information as information, and a failure for transmitting the recognition failure information stored in the recognition failure information storage means to a recognition failure analysis department by wire or wireless to request a solution of the recognition failure. And solution request means.
[0031]
The defect resolution requesting means further includes a medium recording means for recording the recognition failure time information on a portable recording medium so as to deliver the recognition failure time information to the recognition failure analysis section, as claimed in claim 3. It is composed.
[0032]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, embodiments of the present invention will be described with reference to the drawings.
The electronic component mounting apparatus according to the embodiment of the present invention is the same electronic component mounting apparatus as shown in FIGS. 9 (a), (b) and FIG. However, in this example, the processing operation of the control unit shown in FIG. 10 disposed inside the base is different.
[0033]
FIG. 1 is a diagram showing only a CPU and a memory of a control unit of an electronic component mounting apparatus and a recording device of a peripheral device and an image recognition camera according to an embodiment. As shown in the drawing, a memory 42 and a recording device 43 are connected to a CPU 40 via a bus 41, and a component recognition camera 44 is further connected via an image capturing device 45 and an image storage device 46. A recognition camera 47 is connected via another image capturing device 48 and another image storage device 49.
[0034]
Although not shown in the figure, the recording device 43 shown in the figure is, as in the case of FIG. 10, similar to the case of FIG. 10, such as an HD, FD, MO, CD-ROM / RW, card or stick type flash memory, etc. Various recording media can be mounted, and data can be freely transferred to these recording media as needed. The example shown in FIG. 1 shows the configuration of a main data area in the HD among those recording media (hereinafter, the HD is typically referred to as the recording device 43).
[0035]
As shown in FIG. 1, the recording device 43 includes an image recognition program recording area 51, a library information recording area 52, a device information recording area 53, and a recognition error information recording area 54.
An image recognition program is stored in the image recognition program recording area 51 in advance. This image recognition program allows the CPU 40 to recognize the actual position and state of the component indicated by the image data of the component captured by the component recognition camera 44 and stored in the image storage device 46 in the component library information. The analysis is performed based on the use position information to recognize the difference between the reference position and the actual position, and the processing of the board indicated by the image data of the board captured by the board recognition camera 47 and stored in the image storage device 49. This is a program for executing a process of analyzing an actual position or state based on recognition position information in the substrate library information and recognizing a difference between the reference position and the actual position.
[0036]
In the library information recording area 52, component library information and board library information are stored in advance. The part library information includes data indicating a part name or a part number, dimension data of the height and width of the part, data indicating the number and shape of electrodes, data indicating a reference position or a center position of the part, and the like. At the time of image recognition, data corresponding to a component to be image-recognized is read out from these data, transferred to a predetermined storage area of the memory 42 described later, and used for image recognition.
[0037]
The board library information includes data indicating the name, number, or model of the board, data indicating the vertical and horizontal dimensions of the board, data indicating the position and shape of the board mark, and the like. At the time of image recognition, the data corresponding to the substrate to be subjected to image recognition is also read out and transferred to a predetermined storage area of the memory 42 to be used for image recognition.
[0038]
In the device information recording area 53, device information is stored in advance. The device information includes data indicating the name, number, or model of the electronic component mounting device, number data of the work head, data indicating the range of the moving area, the switching state of the illumination angle and illuminance of the illuminator for imaging the board. , The data indicating the switching state of the illumination angle and illuminance of the illuminator for imaging the component, the data indicating the switching range of the field of view and the imaging time of the imaging camera for imaging the board or the component, and the like. These data include data relating to the quality of image recognition.
[0039]
In the recognition error information recording area 54, when an error occurs in image recognition, information of library information, device information, and image data when the error occurs in the image recognition forms The error information is transferred from the memory 42 and recorded for storage. Although not particularly shown, the set of recognition error information includes at least flag information indicating an error occurrence time, presence or absence of an inquiry to a manufacturer, and presence or absence of a response to the inquiry.
[0040]
The above-mentioned image data is the image data of the component transferred from the image storage device 46 to the memory 42 and the image data of the substrate transferred from the image storage device 49 to the memory 42.
The memory 42 has a work area of an image recognition program area 55, a library information area 56, a device information area 57, an image area 58, and a recognition error information area 59.
[0041]
When executing the image recognition, the CPU 40 sequentially reads the image recognition programs from the image recognition program recording area 51 of the recording device 43 into the image recognition program area 55 of the memory 42, according to the read image recognition program. Library information and device information necessary for image recognition processing are read from the library information recording region 52 and the device information recording region 53 of the recording device 43 into the library information region 56 and the device information region 57 of the memory 42, respectively. The image image data of the component captured by the image storage device 46 and stored in the image storage device 46 or the image data of the substrate captured by the substrate recognition camera 47 and stored in the image storage device 49 is read into the image area 58. , And performs image recognition processing.
[0042]
Each time a defect (also called a recognition failure or recognition error) occurs in the image recognition processing, the CPU 40 temporarily stores the library information area 56, the device information area 57, and the image area 58 of the memory 42 at that time. The stored library information, device information, and image data are sequentially copied to the recognition error information area 59 as recognition error information.
[0043]
Then, when the operator gives an instruction to save information at the time of recognition error, the recognition designated by the worker in the above recognition error information accumulated and stored in the recognition error information area 59 is performed. The error information is transferred and stored in the recognition error information recording area 54 of the recording device 43.
[0044]
Alternatively, if the information automatic storage at the time of the recognition error is specified by the operator in advance, at the time of the recognition error, the information is automatically stored without waiting for the instruction of the information storage from the operator as described above. The recognition error information is transferred to the recognition error information recording area 54 of the recording device 43 and stored.
[0045]
Various kinds of information indicating the processing operation by the CPU 40 during the production of the board unit are always displayed on the display input panel of the electronic component mounting apparatus in the present example similar to the display input panel 5 shown in FIG. 9A. .
FIG. 2 is a diagram illustrating an example of a display screen displayed on the display input panel when an image recognition error occurs in this example. In the example of the display screen shown in the figure, an image recognition error window screen 61 is displayed so as to overlap the normal display screen 60 which is displayed in a normal state.
[0046]
On the image recognition error window screen 61, an error message display section 62 is displayed in a display area showing various information and input buttons, and a teaching button 63 and an image reference button 64 are displayed immediately above the error message display section 62. I have. In the error message display section 62, an error code for reference by a professional engineer is displayed, and below the error code, a specific error message, such as "image recognition / parts cannot be detected", which can be referred to by a worker at the site. Is displayed.
[0047]
FIG. 3 is a diagram showing an example of a display screen displayed when the image reference button 64 is pressed on the image recognition error window screen 61. As shown in the figure, an image reference window screen 65 is further overlapped on the above-described image recognition error window screen 61 which is overlapped and displayed on the normal display screen 60.
[0048]
The image reference window screen 65 shown in FIG. 6 is provided on the left side with a large image display section 66 for referring to a captured image, on the right side of which various component information is displayed, and below it, In addition to the “close” button 68, a “save image” button 67 unique to this example is displayed.
[0049]
Here, when the close button 68 is pressed, the display screen returns to the display screen of FIG. 2, but when the save image button 67 is pressed, the processing when a recognition error occurs in the image recognition processing described in FIG. The library information, device information, and image data currently stored in the library information area 56, the device information area 57, and the image area 58 of the memory 42 are copied to the recognition error information area 59 as recognition error information, and further copied. The recognition error information is transferred to the recognition error information recording area 54 of the recording device 43 and stored.
[0050]
In the example of FIG. 2, an example of an image recognition error of a component such as “image recognition / component not detected” is shown in the error message display unit 62, but an image recognition error of a board is also particularly illustrated. However, an error message is displayed on a substantially similar window screen, for example, "Image recognition / board mark cannot be detected".
[0051]
As described above, when a component or board recognition failure occurs during the production of a board unit, an image image when the recognition failure occurs, library information required for recognition, and device information required for recognition are stored. Even in the case of poor recognition that cannot be clarified at the board unit production site, by transmitting the stored information to the manufacturer of the electronic component mounting equipment, human errors and information shortage in information transmission can be avoided. Without causing this, the situation of occurrence of recognition failure can be completely reproduced by the technician of the manufacturer, thereby greatly reducing the labor of the test for reproducing the recognition failure, and identifying the cause of the recognition failure and solving it. Can be performed promptly.
[0052]
FIG. 4 is a flowchart showing the operation of processing for saving an image image, library information, and device information when a recognition failure occurs, which is executed by the CPU 40 when the recognition failure of the component or the board occurs as described above. It is.
In the figure, first, the presence / absence setting of automatic recording of recognition failure information is performed (step S401). This process is a process for checking whether or not an operator has set whether or not automatic recording of recognition failure information is performed on an initial screen displayed on the display input panel. If the setting has been performed, a flag of “the recognition failure information is automatically recorded” is set in a predetermined area of the memory, and if the setting is not performed, the flag is set without the flag.
[0053]
Subsequently, a normal production operation is performed (Step S402). In this process, the mounting position is corrected by recognizing the image of the substrate mark on the substrate that has been carried into the main unit and mechanically positioned by the positioning device, and then corrects the mounting position to a predetermined position on the substrate. This is a process of mounting the part while recognizing the image and correcting the position.
[0054]
Then, it is determined whether or not there is a defect in the result of the image recognition processing (step S403). In this process, the image recognition is performed correctly. As a result, when there is a defect such as no board mark on the substrate or the component is not suctioned at the tip of the suction nozzle, the recognition result of the image recognition is incorrect and incorrect. There are cases where it cannot be recognized.
[0055]
In this determination, if there is no defect in the result of the image recognition processing (N in S403), the processing of mounting a predetermined component at a predetermined position on the board while performing image recognition and position correction is continued.
On the other hand, if there is a defect in the result of the image recognition processing in the above determination (Y in S403), in that case, subsequently, it is determined whether or not the defect is an image recognition failure (step S404). . Then, if the recognition of the image is not defective (N in S404), the processing of mounting a predetermined component at a predetermined position on the board while recognizing the image and correcting the position is continued.
[0056]
This is a case where the failure mode is not the image recognition failure in the determination in step S404, that is, the failure mode determined in the processing in step S403 is a failure of the board itself or the component itself. The board or the defective component is discarded in the discarding section in accordance with the instruction of the program, a new board is carried in, or a new component is taken out from the component supply device. Therefore, normal production operation is continued.
[0057]
If the mode of the failure is the image recognition failure in the determination in step S404 (Y in S404), first, the image is temporarily stored in the work area of the memory 42 under the situation that caused the image recognition failure described with reference to FIG. The image data, the library information, and the device information are transferred to the recognition error information area 59 as recognition error information.
[0058]
Then, it is determined whether or not “there is automatic recording of recognition failure information” is set (step S405). This process is a process for determining whether or not “automatic recording of recognition failure information” is set by referring to the flag setting of presence of automatic recognition of recognition failure information confirmed in step S401.
[0059]
If “the presence of automatic recording of recognition failure information” is set (Y in S405), the recognition failure image transcribed in the recognition failure information area 59 is saved (step S406), and the recognition failure library information is stored. Is stored (step S407), and the recognition failure device information is stored (step S408), and the process returns to step S402.
[0060]
The processing in steps S406 to S408 is performed by recognizing the image data of the recognition failure, the library information of the recognition failure, and the device information of the recognition failure transferred to the recognition error information area 59 into the recognition error information recording area 54 of the recording device 43. This is the process of transferring to and saving it. In this process, it is also possible to specify in advance whether to immediately transfer the data to the external storage device, or to transfer the data to the external storage device after storing the data up to the specified memory capacity.
[0061]
In the processing up to this point, the display screen 60 shown in FIG. 2 is always displayed on the display input panel, and a display for notifying the processing content is displayed on a predetermined display portion as the processing proceeds. ing.
In the determination processing of step S405 in FIG. 4, when “there is automatic recording of recognition failure information” is not set (N in S405), it is determined whether or not manual recording of recognition failure information is performed (step S409). .
[0062]
This processing is performed by pressing the image reference button 64 on the image recognition error window screen 61 shown in FIG. 2 automatically displayed on the display input panel when an image recognition error occurs, and displaying the image reference window screen 65 shown in FIG. Is displayed, here is a process of determining whether or not the image save button 67 has been further pressed.
[0063]
Then, when manual recording of the recognition failure information is not performed, that is, when the image save button 67 is not pressed (N in S409), the process returns to the normal production operation of step S402 without recording anything, and returns to step S402. S402 to S405 and S409 are repeated.
[0064]
On the other hand, when manual recording of recognition failure information is performed, that is, when the image save button 67 is pressed (Y in S409), the process proceeds to the above-described steps S406 to S408, and the recognition error information area in the memory 42 is stored. After performing the process of transferring and storing the recognition error information 59 in the recognition error information recording area 54 of the recording device 43, the process returns to step S402.
[0065]
As described above, when an image recognition error occurs, the recognition error information is automatically or manually recorded and stored in the recognition error information recording area 54 of the recording device 43 except when recording is not performed (data up to the specified capacity). Is stored in advance unless data has not yet reached the specified capacity).
[0066]
Then, every time an image recognition error occurs, the recognition error information including the image data, the library information, and the device information is recorded and stored in the recording device 43. By transmitting the information to the maker of the component mounting apparatus, it is possible to correctly notify the technician of the maker of the recognition error information without causing a human error or insufficient information at the time of information transmission.
[0067]
FIG. 5 is a flowchart of a process of transmitting the recognition error information stored as described above to a manufacturer of the electronic component mounting apparatus to investigate the cause of the recognition error. In this process, the communication i / o interface in the electronic component mounting apparatus of the present example having the same function as the communication i / o interface 35 shown in FIG. 10 is used, and the communication with the manufacturer of the electronic component mounting apparatus is performed. Communication takes place.
[0068]
In FIG. 5, first, production is started (step S501). In this process, when a switch for starting production of the main body device is pressed by an operator, the CPU 40 is activated and various initial settings are performed.
Thereafter, a normal production operation is performed (Step S502). This process is the same as the process of step S402 in FIG. Then, the processing of step S503 and subsequent steps following step S502 in FIG. 5 is performed in parallel with the processing of step S403 and subsequent steps following step S402 in FIG.
[0069]
In FIG. 5, it is next determined whether or not the production has been completed (step S503). This process is a process for determining whether or not the production of one type of board unit has been completed.
If the production has not been completed yet (N in S503), in this case, it is determined whether or not there is an image recognition failure (step S504). This processing refers to the recognition error information stored in the recognition error information recording area 54 of the recording device 43, and the inquiry to the manufacturer has not been made in the recognition error information, that is, the latest recognition error This is a process of determining whether there is information.
[0070]
If there is no latest image recognition failure (N in S504), the process returns to step S502 and repeats the processes in steps S502 to S504. Thereby, the normal production operation is continued.
On the other hand, if there is a recognition failure of the latest image in the above determination (Y in S504), in that case, the referenced recognition error information is read from the recognition error information recording area 54 of the recording device 43 (Step S505), The read recognition error information is transmitted to the manufacturer of the electronic component mounting apparatus via the communication i / o interface, and an inquiry about the cause of the recognition error is made (step S506). Then, the process returns to step S502.
[0071]
If it is determined in step S503 that the production has been completed (Y in S503), a process of terminating the production is performed (step S507). This process is a process of notifying the operator that the production of one type of board unit has been completed, for example, by displaying on a display input panel or turning on an alarm lamp.
[0072]
Subsequently, it is determined whether or not there is an image recognition failure in the past production including the currently completed production (step S508). This process is a batch process that is effective when the processes performed in real time in steps S504 to S506 are not performed.
[0073]
In other words, although not shown in FIG. 5, before starting the process of step S504, there is a determination process of checking whether or not there is a recognition failure. If the setting has not been made, the processing of steps S504 to S506 is omitted. Then, instead of this, it is determined in batch at step S508 whether or not there is a recognition failure by batch processing.
[0074]
If there is no recognition failure (N in S508), the process returns to step S501 to start production of the next type of board unit.
On the other hand, if there is a recognition failure (Y in S508), all the recognition error information corresponding to all the recognition failures is read (step S509), and the read recognition error information is loaded via the communication i / o interface into the electronic component. After transmitting to the manufacturer of the apparatus and inquiring about the cause of the recognition error (step S510), the process returns to step S501.
[0075]
As described above, the recognition error information recorded in the recognition error information recording process in FIG. 4 is acquired in real time or batch processing in the recognition error information acquisition process in FIG. 5, and is transmitted to the manufacturer of the electronic component mounting apparatus. In the processing of steps S509 and S510, the display screens of FIGS. 2 and 3 may be displayed on the display input panel, and may be manually performed.
[0076]
As described above, the cause of the recognition error is quickly determined by the recognition error information recorded in the recognition error information recording process, acquired in the recognition error information acquisition process, and transmitted to the manufacturer of the electronic component mounting apparatus, and A solution is achieved, and the solution is returned to the user of the electronic component mounting apparatus, that is, the production site of the board unit.
[0077]
FIG. 6 is a flowchart of a process in which the problem of the recognition error is automatically solved by transmitting the recognition error information to the electronic component mounting apparatus maker.
In the figure, first, the presence or absence of the automatic problem solving setting is set (step S601). In this process, although not particularly shown, on the initial screen displayed on the input display monitor, the operator sets a check in an input box for setting whether or not automatic problem solving is set, and sets "automatic problem solving is set". This is a process of setting whether or not there is an automatic problem solving setting in a flag area of the process, depending on whether the input frame is unchecked and “no automatic problem solving setting” is set.
[0078]
Subsequently, it is determined whether or not automatic problem solving setting is set (step S602). This process is a process for confirming whether or not the automatic problem solving setting set in step S601 exists before starting the actual production operation.
If the automatic problem solving setting is set (Y in S602), it is then determined whether or not a problem solving method from a manufacturer (a manufacturer of the electronic component mounting apparatus, the same applies hereinafter) has been received (step S602). S603).
[0079]
Then, if the problem solving method is received from the maker (Y in S603), the problem solving method from the maker is received (Step S604), and as a result of the execution, the recognition failure is solved. It is determined whether or not this is the case (step S605). Then, when the recognition failure is not solved, first, the recognition failure information is stored (step S606). This processing is the same as the processing in steps S406 to S408 shown in FIG. Next, in FIG. 6, the stored recognition failure information is acquired (step S607). This process is the same as the process in step S505 or S509 shown in FIG. Subsequently, after transmitting the problem solving request to the maker together with the acquired recognition failure information (step S608), a preparation operation for starting production of the substrate unit is performed (step S609). In this process, an initial screen or the like for starting production is displayed on the input display panel.
[0080]
On the other hand, when the recognition failure is resolved in the above-described step S605, the manufacturer wants to know that the problem has been resolved, so that the fact that the problem has been resolved is automatically transmitted to the manufacturer (step S001), and then the above-described step S609 is performed. Move to the processing of. If it is determined in step S603 that the problem solving method has not been received from the maker (S603: N), the process immediately proceeds to step S609 in this case.
[0081]
Thereafter, a normal production operation is performed (step S610), and every time the production of one substrate unit is completed, it is determined whether or not the production of the substrate unit of the current model has been completed (step S611), and the production is still completed. If not (N in S611), then, it is determined whether or not a recognition failure has occurred in the current production of the board unit (step S612).
[0082]
If no recognition failure has occurred (N in S612), the process returns to step S610 to produce the next substrate unit, and repeats steps S611 and S612.
On the other hand, if it is determined in step S612 that a recognition failure has occurred (Y in S612), subsequently, it is determined whether the automatic problem solving setting is set (step S613). This process is a process for confirming whether or not the automatic problem solving setting set in the process in step S601 is the same as the process in step S602.
[0083]
If the automatic problem solving setting is not set (N in S613), the processing at the time of occurrence of the recognition failure shown in FIG. 4 is performed, and the process returns to step S610 to start the production of the next board unit. If the automatic problem solving setting is set (Y in S613), subsequently, it is determined whether or not a problem solving method has been received from a maker corresponding to the board unit currently being produced (step S614). ).
[0084]
Then, if the problem solving method is received from the maker (S614: Y), the problem solving method from the maker is received (step S615), and as a result of the execution, the recognition failure is solved. It is determined whether or not this is the case (step S616). Then, when the recognition failure is solved (Y in S616), the manufacturer wants to know that the problem has been solved. Therefore, the fact that the problem has been solved is automatically transmitted to the manufacturer (step S002), and then the processing in step S610 is performed. The process returns to start production of the next board unit. If the recognition failure is not solved (N in S616), the processes in steps S617, S618, and S619 are performed, and then the process returns to step S610. The processing in steps S617, S618, and S619 is the same as steps S606, S607, and S608 described above.
[0085]
As described above, steps S610 to S619 are repeated, and when the production of the board unit of the current model is completed (Y in S611) in the determination in step S611, the production termination such as notification of the production termination to the worker is performed. After performing the processing (S620), it is determined whether there is an unresolved recognition failure in the past production (step S621).
[0086]
If there is no recognition failure that has not been solved in the past production (N in S621), the process returns to step S601 to perform the setting process for the next type of board unit, but has not been resolved in the past production. If there is a recognition failure (Y in S621), subsequently, it is determined whether or not automatic problem solving setting is set (step S622). This process is also a process for confirming the presence or absence of the automatic problem solving setting set in the process in step S601, similarly to the processes in steps S602 and S613.
[0087]
If the automatic problem solving setting is not set (N in S622), the process returns to step S601, ignoring the recognition failure problem that has occurred, and starts production of the next type of board unit.
On the other hand, when the automatic problem solving setting is set (Y in S622), subsequently, it is determined whether a problem solving method from a manufacturer corresponding to a recognition failure occurring in past production has been received. It is determined (step S623). If the problem solving method is received from the maker (S623: Y), the problem solving method from the maker is received (step S624), and as a result of the execution, It is determined whether or not the recognition failure has been resolved (step S625).
[0088]
Then, when the recognition failure is resolved (Y in S625), the manufacturer wants to know that the problem has been resolved, so that the fact that the problem has been resolved is automatically transmitted to the manufacturer (step S003), and the processing in step S601 is performed. The process returns to start production of the next type of board unit. If the recognition failure is not resolved (N in S625), the processes in steps S626, S627, and S628 are performed, and then the process returns to step S601. The processing in steps S626, S627, and S628 is the same as steps S606, S607, and S608 described above.
[0089]
As described above, when the automatic problem solving setting is set, when the production is started, during the production, and when the production is finished, the problem solving method is received from the maker or the recognition error is not received. Automatically detect whether a problem has occurred, implement the problem solution if a problem solution has been received from the manufacturer, and if recognition failure occurs in either actual production or implementation of the problem solution, , A problem resolution request is automatically sent to the maker together with the detailed recognition failure information, so the manufacturer can use the recognition failure information to generate recognition failure without causing human error or lack of information during information transmission. The situation can be completely reproduced. Then, by recognizing the cause of the recognition failure, searching for a solution to the problem, and transmitting the solution to the production factory of the board unit, the recognition failure can be quickly resolved.
[0090]
By the way, even if recognition failure occurs in image recognition, it may be possible to continue production by handling a new board or component, so even if recognition failure occurs in image recognition, it is not always necessary to solve the problem on the production line. Does not stop.
However, even if the problem can be solved at the board unit production site without relying on the technical department of the manufacturer of electronic component mounting equipment as described above, the recognition failure is reproduced on the production line to clarify the cause of the recognition failure. During the operation, production of the production line is stopped during that time. Therefore, regardless of the yield point, the number of products is drastically reduced and the production efficiency is reduced.
[0091]
Therefore, a recognition failure resolution department similar to the technical department of the manufacturer of electronic component mounting equipment is set up in the board unit production factory, and recognition error information is sent to the recognition failure resolution department to solve the problem. Is also good.
Alternatively, a company specializing in recognizing poor recognition, which is entrusted to the manufacturer of the electronic component mounting apparatus, may be established, and the recognition error information may be received there to solve the problem for a fee.
[0092]
Further, the above description relates to the recognition failure in the actual production of the board unit, but the recognition failure also occurs during the teaching. Even in the case of such recognition failure during teaching, by saving detailed recognition failure information as described above, the problem of recognition failure can be quickly solved.
[0093]
FIG. 7 is a diagram illustrating an example of a teaching display screen displayed on the input display panel. The teaching display screen 70 shown in the figure is divided into an upper task button display area 71 and a lower teaching data display area 72. In the teaching data display area 72, a large image of the part currently being taught is displayed in the center, teaching data is displayed on the left and right thereof, and various instruction buttons are displayed below.
[0094]
FIG. 8 is a diagram showing an example of a display screen for inspection / analysis of recognition failure, which is selected and displayed on the input display panel when a recognition failure occurs in the above teaching. In the display screen for inspection / analysis for recognition failure shown in FIG. 7, the display of the teaching data display area 72 of the display screen 70 for teaching shown in FIG. 7 is switched to the display for error analysis. In the display for error analysis, various operation-related data at the time of occurrence of recognition failure is displayed at the top, an “image save” button 73 and other buttons are displayed, and an error message display area 74 at the bottom is displayed. Although not shown in the figure, a recognition error message is displayed.
[0095]
Here, when the operator presses the “save image” button 73, the CPU 40 executes the same processing as steps S406, S407 and S408 in FIG. As a result, even for a recognition failure that occurs during teaching, detailed recognition failure information at the time of the recognition failure can be stored, and the recognition failure that has occurred can be quickly resolved based on the recognition failure information.
[0096]
The above-described recognition failure information at the time of occurrence of the recognition failure may be recorded and stored in a portable recording medium such as an FD, an MO, a CD-ROM / RW, and a flash memory. When it is not necessary to solve the problem urgently, the problem may be solved by using the recognition failure information recorded on the portable recording medium.
[0097]
【The invention's effect】
As described above, according to the present invention, when component or board recognition failure occurs during production of a board unit, an image image when the recognition failure occurs, library information used for recognition, and Since the device information in is stored as recognition failure information, the situation of recognition failure can be completely reproduced without causing human error or information shortage during information transmission by using the saved recognition failure information. In addition, it is possible to greatly reduce the labor required for a test for recognizing a recognition failure, and to quickly perform the investigation for the cause of the recognition failure and a solution for solving the problem. As a result, the working efficiency of the board unit production site is significantly improved.
[Brief description of the drawings]
FIG. 1 is a diagram illustrating only a CPU and a memory of a control unit of an electronic component mounting apparatus and a recording device of a peripheral device and an image recognition camera according to an embodiment.
FIG. 2 is a diagram illustrating an example of an image recognition error window screen displayed on a display input panel when an image recognition error occurs.
FIG. 3 is a diagram illustrating an example of a display screen displayed when an image reference button is pressed on an image recognition error window screen.
FIG. 4 is a flowchart illustrating an operation of processing for storing recognition error information at the time of recognition failure, which is executed by a CPU of a control unit when a recognition failure of a component or a board occurs.
FIG. 5 is a flowchart of a process of transmitting stored recognition error information to a manufacturer of an electronic component mounting apparatus for investigating a cause.
FIG. 6 is a flowchart of a process in which a problem of a recognition error is automatically solved by transmitting recognition error information to an electronic component mounting apparatus maker.
FIG. 7 is a diagram showing an example of a teaching display screen displayed on the input display panel.
FIG. 8 is a diagram showing an example of a recognition failure notification display screen displayed on the input display panel when a recognition failure occurs during teaching.
9A is an external perspective view of a conventional electronic component mounting apparatus, and FIG. 9B is a perspective view schematically showing an internal configuration of the electronic component mounting apparatus by removing upper and lower protective covers.
FIG. 10 is a block diagram showing a system configuration of a conventional electronic component mounting apparatus.
[Explanation of symbols]
1 Electronic component mounting device
2 Monitor device
3 Warning lamp
4 Upper protective cover
5 Display input panel
6 bases
7 Board guide rail
8. Printed circuit board (board)
9 Electronic component supply stand
11 Tape cassette type electronic component supply device (tape feeder)
12 X-axis rail
13 Y axis rail
14 Working head support tower
15 Working head
16 CPU
17 Bus
18 i / o control unit
19 Image processing unit
21 memory
23 Lighting equipment
24 Suction nozzle
25 parts
26 Lighting equipment
27 X-axis motor
28 Y-axis motor
29 Z motor
31 θ axis motor
32 vacuum unit
33 Vacuum tube
34 Pneumatic sensor
35 Communication i / o interface
36 Recording device
38, 39 camera
40 CPU
41 bus
42 memory
43 Recording device
44 Parts Recognition Camera
45 Image capture device
46 Image storage device
47 Camera for board recognition
48 Image capture device
49 Image Storage
51 Image recognition program recording area
52 Library information recording area
53 Device information recording area
54 Recognition error information recording area
55 Image recognition program area
56 Library information area
57 Device information area
58 Image area
59 Recognition error information area
60 Normal production display screen
61 Image recognition error window display
62 Error message display
63 Teaching button
64 Image reference button
70 Display screen for teaching
71 Task button display area
72 Teaching data display area
73 Save Image Button
74 Error message display area

Claims (3)

In an electronic component mounting apparatus that automatically mounts an electronic component on a circuit board while performing position correction by image recognition, when a recognition failure occurs in image recognition of a board mark of the circuit board or image recognition of the electronic component, A method for resolving the occurrence of poor recognition, the method comprising:
Image data of the board mark obtained by shooting the board mark, image data of the electronic component obtained by shooting the electronic component, library information of the circuit board and the electronic component, and a device of the main body device An information holding step of holding information as image recognition information;
When a recognition failure occurs in the image recognition of the board mark or the image recognition of the electronic component, a recognition failure time information storing step of storing the recognition time information held in the information holding step as recognition failure time information,
Has,
In the recognition failure solving section, the recognition failure occurrence information stored in the recognition failure information storage step reproduces the recognition environment in which the recognition failure has occurred to construct the analysis environment for the recognition failure, and the constructed analysis A method for resolving a recognition failure, comprising analyzing the recognition failure according to an environment and solving the recognition failure. In electronic component mounting equipment that automatically mounts electronic components on circuit boards while performing position correction by image recognition,
Image data of the board mark obtained by shooting the board mark, image data of the electronic component obtained by shooting the electronic component, library information of the circuit board and the electronic component, and a device of the main body device Information holding means for holding information as image recognition information,
When a recognition failure occurs in the image recognition of the board mark or the image recognition of the electronic component, a recognition failure time information storage unit that stores the recognition time information held in the information holding unit as recognition failure time information,
A defect resolution requesting unit for requesting a resolution of a recognition failure by transmitting the recognition failure information stored in the recognition failure information storage unit to a recognition failure analysis unit by wire or wirelessly,
An electronic component mounting device comprising: 3. The defect resolution requesting unit further includes a medium recording unit that records the recognition failure information on a portable recording medium so as to deliver the recognition failure information to the recognition failure analysis department. Electronic component mounting equipment.

Images