JP2934546B2 - Inspection method of cassette for chip mounting device and its inspection device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention is used by being mounted on a chip mounting apparatus for mounting a plurality of components on a substrate or the like, mounting a chip component storage tape, and supplying chips to a predetermined position while feeding the tape sequentially. The present invention relates to a method for inspecting the quality of a cassette and an inspection apparatus therefor.

[0002]

2. Description of the Related Art The basic structure of a conventional chip mounting apparatus is such that a cassette on which a component storage tape or the like is mounted can be appropriately detachably mounted, and components supplied by the tape are picked up by suction or the like, and the picked-up device is mounted. The component is automatically mounted at a predetermined position on the substrate by moving the component mounting mechanism using an XY stage or the like.

A plurality of types of cassettes for mounting the component storage tapes are prepared in advance in accordance with the number or size of components to be mounted on the substrate, and the necessary components are stored in the substrate. The cassette is appropriately selected for each tape and the operator mounts the cassette on the chip mounting apparatus. In this operation, the inspection as to whether or not the cassette is loaded with a tape in which necessary components are stored in the substrate is described in JP-A-1-257536.
As disclosed in Japanese Unexamined Patent Application Publication No. H10-260, a cassette mounted with a component storage tape is frequently mounted by recognizing by an optical sensor and determining a component mounting operation on a board based on a determination result based on the recognition. There is disclosed a component mounting mechanism that does not cause a problem even if the mounting position is incorrectly changed.

Another inspection method is to analyze the image information from an optical sensor provided at the pickup position and to monitor the analyzed information sequentially on a display unit such as a cathode ray tube. When the deviation from a certain reference value was reached, the chip mounting apparatus was manually stopped, and the cassette mounting the component storage tape was replaced.

[0005]

However, in the above-mentioned conventional example, emphasis is placed on prevention of human error of the cassette on which the component storage tape is mounted, and on the inspection after the component is mounted on the substrate, which causes problems. In the case where the error occurs, it is often impossible to determine the quality of each component, and it often takes time to investigate the cause. In particular, in order to increase the mounting density today, if the precision of the operation of holding on the board by sucking it from the component storage tape accompanying the miniaturization of the component itself is required,
There is a great need to ensure that individual mechanisms move precisely. In addition, in order to respond to high-mix low-volume production, deformation, wear,
It is an essential requirement to prevent the necessity of comprehensive adjustment due to aging and the like.

The present invention has been made in view of these problems, and among the inspections for each element constituting a chip mounting apparatus, an accurate feeding mechanism for a cassette in which a component storage tape is mounted is inspected in advance. There is a particular problem.

[0007]

SUMMARY OF THE INVENTION In order to achieve the above object, the present invention relates to a component position detecting method for detecting the position of a component previously stored in a component storage tape and a feed hole for sequentially feeding the tape. A master tape of a predetermined length provided with holes and feed holes is prepared, the master tape is inserted into a cassette and fed out, and the component position is detected by an optical sensor provided corresponding to the set pickup position of the component. This is a method for inspecting a cassette for a chip mounting device, comprising detecting a hole for use, and detecting a positional shift amount between the detected hole position and a preset reference hole position, wherein the method is performed by an optical sensor. This is a method of inspecting a cassette for a chip mounting apparatus in which a component position detection hole and a preset reference hole position are displayed as a monitor image, and a deviation amount between the two is visually recognized on a screen. Method of inspecting a chip mounting apparatus for a cassette which is characterized in that the deviation amount between the component position detection hole and the reference hole position storage managed as data of each cassette,
In addition, a master tape having a component position detection hole and a feed hole corresponding to a position of a component stored in the component storage tape and a feed hole for sequentially feeding out the tape is created in advance, and the master tape is set in a cassette. And means for feeding at a predetermined speed, an optical sensor provided corresponding to the set pickup position of the component, and detection position information of the component position detection hole obtained from the optical sensor. It is characterized by comprising a comparison operation unit for calculating a displacement amount of a detection hole from predetermined reference hole position information, a display unit and a printing unit for appropriately outputting information from the comparison operation unit. This is an inspection device for a chip mounting device cassette.

[0008]

According to the present invention, the master tape provided with the component position detecting holes corresponding to the positions of the components stored in the component storage tape in advance is adapted to the component storage tape storing various components mounted on the substrate. By creating, it is possible to inspect the component feeding position accuracy of the cassette to which each component storage tape is mounted.

Furthermore, the master tape is inserted into a cassette for a chip mounting apparatus, sent out, and preset with hole position information from a component position detecting hole obtained by an optical sensor provided at a position where a component of the cassette is taken out. By detecting the amount of displacement of the holes from the reference hole position information, it is possible to prevent the components of the component storage tape from being taken out or to prevent components from dropping during transfer.

The optical sensor provided almost directly above the pickup position of the cassette can be used both when the component storage tape is being sent out and when the master tape is being sent out. That is, it is possible to monitor the components while the component storage tape is being sent out with the image information, and in the case of inspection, to determine the amount of positional deviation from the information from the component position detection holes of the master tape and the reference information. It can be displayed and inspected as a monitor image.

[0011] By providing a function of calculating the amount of hole displacement from the hole position from the component position detection hole obtained from the optical sensor and a preset reference hole position, it is possible to eliminate the need for subjective judgment. An accurate displacement amount can be detected.

[0012] Since the amount of displacement can be stored and managed as data for each cassette, each cassette should be used as a material for judging whether or not to use, regular maintenance, overhaul, etc., based on data over time. Can be.

[0013]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described in detail with reference to the drawings. As shown in FIG. 1, the chip mounting apparatus cassette inspection apparatus includes a component position detection hole 3 corresponding to a position of a component stored in a component storage tape and a feed hole for sequentially feeding out the tape. A means for preparing a master tape 1 provided with a feed hole 5 and substituting the master tape 1 into a cassette and feeding it at a predetermined speed, and an optical sensor 7 provided corresponding to a set pickup position of a component. A comparison operation unit 9 for calculating a position shift amount of a detection hole from detection position information of the component position detection hole 3 obtained from the optical sensor 7 and preset reference hole position information; The display unit 11 and the print unit 13 appropriately output information from the unit 9.

The master tape 1 is a tape provided with component position detecting holes 3 corresponding to the positions of the components stored in the component storage tape in advance, and is set on a tape supply reel 24 and fed by a tape feed mechanism. Holes 5 are provided. Master tape 1 of the embodiment in FIG.
The intervals between the component position detection holes 3 are provided just in the middle of the feed holes 5, but are set at intervals corresponding to the respective component storage tapes.

The means for substituting the master tape 1 into the cassette 21 and sending it out at a predetermined speed is not shown, but has a structure in which the master tape 1 is pushed by an air cylinder and fed one frame at a time at a predetermined speed. As for the means for feeding one frame at a predetermined speed, the cassette 21 differs depending on the manufacturer, so the pitch feeding method and the position pressed by the air cylinder also differ.
For example, in order to feed the master tape 1 frame by frame in the cassette 21 as shown in FIG.
By pressing it in the direction of the arrow with an air cylinder.
The connecting rod 33 connected to the lower fulcrum 31 via 9 is pulled backward, and the frame feed shaft 39 connected to the connecting fulcrum 35 rotates backward. This rotation moves the frame feed unit 41 upward with respect to the central axis 37 via the fulcrum 40, and at the same time, the frame feed rotary wheel 43 also moves by one mountain.

At the same time, since the frame feed rotary wheel 43 and the tape rotary wheel are connected to the central axis 37 about the central axis 37, they rotate together with the frame feed rotary wheel 43. That is,
When the frame feed rotating wheel 43 rotates by one frame, the tape rotating wheel 45 also moves at the same time, so that the component storage tape or the master tape 1 sandwiched between the tape rotating wheels 45 can be fed one frame at a time. Send at a rate of about 0.2 seconds.

As shown in FIG. 3, the optical sensor 7 is provided almost directly above the pickup position 23 of the cassette 21, and the component reading section 2 illuminated with halogen.
From 3, an image signal captured by the CCD camera is transmitted to the comparison operation unit 9 (FIG. 1).

The comparison operation unit 9 obtains the hole position information of the component position detection hole 3 and the preset reference hole position information from the image signal of the component position detection hole 3 obtained by imaging with the optical sensor 7. Then, the amount of displacement of the detection hole is calculated from the above. For the reference hole position, for example, a master jig having the precision corresponding to the cassette 21 of each manufacturer is used, and the hole at the pickup position is image-processed with the master jig to set the origin. The preset reference hole position information is displayed by appropriately reading out the inspection reference position setting master file in which data relating to the master tape 1 corresponding to the component storage tape to be inspected is accumulated as shown in FIG. Part 1
1, the reference position coordinates 53 and 55 are automatically set and displayed as the monitor image 50.

The process of calculating the amount of displacement after the comparison operation unit 9 captures the image signal from the CCD camera will be described with reference to the block flow shown in FIG. 5 and FIG. The comparison operation unit 9 receives a signal from the chip feed mechanism unit that is generated each time one frame is fed between the tape feed units 25 of the cassette 21 for the chip mounting device,
An image signal obtained by binarizing the image signal of the pickup position 23 captured by the camera is captured (S11, S13).

The binarized image signal is obtained by binarizing information captured by the halogen illumination illuminating the pickup position 23 so that the surface of the master tape 1 is clearly white and the component detection holes 3 are clearly black. It is a value. Therefore, the center points 57a and 59a of the positions 57 and 59 corresponding to the component position detection holes 3 can be easily detected from the captured image signal (S15).

Next, the difference between the X-axis 53 and the Y-axis 55 between the center points 57a and 59a of the detected component position detecting hole 3 and the center point 50a of the reference position 50 is calculated (S17). The compared data is calculated separately for the X axis 53 and the Y axis 55, and it can be easily determined by visually checking the monitor image whether the error is within the allowable range set for each component storage tape. . The data calculated by the X-axis 53 and the Y-axis 55 are stored and managed as data for each cassette, and can be output to the printing unit 13 as appropriate to be used as judgment data for storage management and the like of the cassette.

[0022]

The above-described method and apparatus for inspecting a cassette for a chip mounting apparatus according to the present invention correspond to the positions of the components stored in the component storage tape and the feed holes for sequentially feeding the tape. Create a master tape provided with a hole for component position detection and a feed hole, substitute this master tape into a cassette and feed it out, and use the optical sensor provided corresponding to the set pickup position to create a hole for component position detection. By detecting the positional deviation between the detected hole position and a preset reference hole position, distortion, deformation and wear of the cassette can be detected before the component storage tape is mounted. In addition, it is possible to greatly reduce errors such as suction of components from the component storage tape, and at the same time, reduce the number of parts damaged and discarded, thereby greatly increasing productivity.

Also, the component position detection holes detected by the optical sensor and the preset reference hole positions are displayed as a monitor image so that the amount of displacement between the two can be visually recognized on the screen, so that the actual position is determined. Since the amount of displacement can be confirmed immediately and easily, the quality of the cassette can be determined quickly.

Further, by storing and managing the amount of deviation between the detected component position detection hole and the reference hole position as data for each cassette, it is possible to make a systematic data judgment.

The inspection device for the cassette for the chip mounting apparatus is provided with a component position detecting hole and a feed hole corresponding to the positions of the components stored in the component storage tape and the feed holes for sequentially feeding out the tape. A means for preparing a master tape provided with the above, substituting the master tape into a cassette and sending out at a predetermined speed, an optical sensor provided corresponding to a set pickup position of the component, and an optical sensor A comparison calculation unit that calculates the detection hole positional deviation amount from the obtained detection position information of the component position detection hole and the preset reference hole position information, a display unit that appropriately outputs information from the comparison calculation unit, and High accuracy chip mounting can be maintained by using the print unit, cassette mounting correction is greatly reduced, and parts are not correctly picked up from the pickup position. Can be reduced, the burden of re-implement greatly reduced, thereby improving the productivity increase the mounting efficiency.

[Brief description of the drawings]

FIG. 1 is a schematic block diagram of an inspection apparatus according to an embodiment of the present invention.

FIG. 2 is a right side view of the cassette according to the embodiment of the present invention, in which a connecting rod 33 and a frame feed shaft 39 are partially cut away.

FIG. 3 is a side view of the mounting apparatus according to one embodiment of the present invention.

FIG. 4 shows a correlation between a reference hole position and a detection hole position displayed on a monitor image according to an embodiment of the present invention.

FIG. 5 is a block diagram showing a comparison between a reference hole position and a detection hole position in a comparison operation unit according to the present invention.

[Explanation of symbols]

 Reference Signs List 1 master tape 3 component position detection hole 5 feed hole 7 optical sensor 9 comparison operation unit 11 display unit 13 print unit 21 cassette 23 pickup position 24 tape supply reel 25 tape feed unit 27 drive knob 28 press drive unit 29 upper fulcrum 31 Lower fulcrum 33 Connecting rod 35 Connecting fulcrum 37 Center axis 39 Frame feed shaft 41 Frame feed unit 43 Frame feed rotary wheel 45 Tape rotary wheel

────────────────────────────────────────────────── ─── Continuation of the front page (56) References JP-A-2-10898 (JP, A) JP-A-2-209,000 (JP, A) (58) Fields investigated (Int. Cl. ⁶ , DB name) H05K 13/08 B23P 19/00 B23P 21/00

Claims (4)

(57) [Claims] A master tape having a predetermined length provided with a component position detecting hole and a feed hole corresponding to a position of a component previously stored in a component storage tape and a feed hole for sequentially feeding the tape. Then, the master tape is inserted into the cassette and sent out, and the component position detection hole is detected by an optical sensor provided corresponding to the set pickup position of the component, and the detected hole position is set in advance. A method for inspecting a cassette for a chip mounting apparatus, comprising: detecting an amount of positional deviation from a reference hole position. 2. The device according to claim 1, wherein a component position detection hole detected by the optical sensor and a preset reference hole position are displayed as a monitor image, and a shift amount between the two can be visually recognized on a screen. Inspection method for cassette for chip mounting device. 3. The method for inspecting a cassette for a chip mounting device according to claim 1, wherein the detected deviation amount between the component position detection hole and the reference hole position is stored and managed as data for each cassette. 4. A master tape having a component position detecting hole and a feed hole corresponding to a position of a component stored in a component storage tape and a feed hole for sequentially feeding out the tape is prepared in advance. Means for substituting a master tape into a cassette and feeding it at a predetermined speed, an optical sensor provided corresponding to a set pickup position of the component, and a component position detection hole obtained from the optical sensor. A comparison operation unit for calculating a displacement amount of the detection hole from the detection position information and preset reference hole position information, and a display unit and a printing unit for appropriately outputting information from the comparison operation unit. An inspection device for a cassette for a chip mounting device.