JPH05167299A - Device and method of checking chip mounting device cassette - Google Patents

Abstract

PURPOSE:To provide a method and a device of checking the deviation of a cassette in suction point due to deformation or abrasion, where a master tape corespondent to a component enveloping tape is mounted in a chip mounting device cassette in place of a component enveloping tape. CONSTITUTION:A master tape 1 where component position detecting holes 3 are provided corresponding to the component position of a component enveloping tape, an optical sensor 7 provided at a component pickup station, and a comparison section 9 which checks a difference between the image-processed data of the component position detecting holes 3 and hole position data which serve as reference data are provided.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention is used by mounting it on a chip mounting apparatus for mounting a plurality of components on a substrate or the like, mounting a chip component storage tape, and feeding the chips to a predetermined position while feeding the tape in sequence. The present invention relates to a method for inspecting the quality of a cassette and an inspection apparatus therefor.

[0002]

2. Description of the Related Art The basic structure of a conventional chip mounting apparatus is that a cassette containing a component storage tape or the like can be detachably mounted as appropriate, and the components supplied by the tape are picked up by suction or the like. A component mounting mechanism is moved by an XY stage or the like to automatically mount the component at a predetermined position on the substrate.

As for the cassette on which the component storage tape is mounted, a plurality of models corresponding to the number or size of the components to be mounted on the substrate are prepared in advance, and the required components are stored on the substrate. A cassette is appropriately selected for each tape to be mounted by the operator in the chip mounting apparatus. In this operation, it is possible to inspect whether or not the cassette is equipped with a tape in which necessary components are stored on the substrate, as disclosed in JP-A-1-257536.
As disclosed in the publication, by recognizing with an optical sensor and determining the component mounting operation on the board based on the discrimination result based on this recognition, it is possible to frequently mount a cassette having a component storage tape. There is disclosed a component mounting mechanism which does not cause a problem even if the mounting position is mistakenly replaced.

As another inspection method, image information from an optical sensor provided at the pickup position is actually analyzed for the feeding state of the component storage tape, and the analyzed information is sequentially monitored on a display such as a cathode ray tube. Then, the chip mounting device was stopped manually and the cassette containing the component storage tape was replaced.

[0005]

However, in the above-mentioned conventional example, the emphasis is placed on the prevention of human error in the cassette having the component storage tape, the inspection after the components are mounted on the substrate, and the obstacles. When a problem occurs, it is often impossible to judge the quality of each component and it takes time to investigate the cause. In particular, in order to increase the mounting density in today's world, a high degree of precision is required for the operation of adsorbing from the component storage tape and holding it on the substrate accompanying the minimization of precision of the component itself.
It is extremely necessary to make sure that the individual mechanisms move precisely. In addition, in order to support high-mix low-volume production, deformation, wear, and
It is essential to prevent the need for comprehensive adjustment due to changes over time.

The present invention has been made in view of these problems, and of the inspections of each element constituting the chip mounting apparatus, an accurate feeding mechanism of a cassette on which a component storage tape is mounted is inspected in advance. It has a particular problem.

[0007]

In order to achieve the above object, the present invention is for detecting the position of a component corresponding to the position of a component previously stored in a component storage tape and a feed hole for sequentially feeding the tape. Create a master tape of a specified length with holes and feed holes, insert this master tape into a cassette and send it out, and detect the position of the part with an optical sensor provided corresponding to the picked-up position of the set part A method for inspecting a cassette for a chip mounting device, which comprises detecting a mounting hole and detecting a positional deviation amount between the detected hole position and a preset reference hole position, which is detected by an optical sensor. This is a method for inspecting a cassette for a chip mounting device that displays the component position detection holes and preset reference hole positions as a monitor image so that the amount of deviation between them can be visually confirmed. Method of inspecting a chip mounting apparatus for a cassette which is characterized in that the deviation amount between the component position detection hole and the reference hole position storage managed as data of each cassette,
In addition, a master tape having a component position detection hole and a feed hole corresponding to the positions of the components stored in the component storage tape and the feed holes for sequentially feeding the tape is prepared in advance, and the master tape is cassette. Means for sending out at a predetermined speed by substituting for, an optical sensor provided corresponding to the set pickup position of the component, and detection position information of the component position detection hole obtained from the optical sensor, It is characterized by comprising a comparison calculation unit for calculating the positional deviation amount of the detection hole from preset reference hole position information, and a display unit and a printing unit for appropriately outputting information from the comparison calculation unit. It is an inspection device for a cassette for a chip mounting device.

[0008]

According to the present invention, the master tape provided with the component position detecting holes corresponding to the positions of the components previously stored in the component storage tape is adapted to the component storage tape storing various components mounted on the substrate. By making it, it becomes possible to inspect the component feed position accuracy of the cassette in which each component storage tape is mounted.

Further, this master tape is inserted into a cassette for a chip mounting apparatus and sent out, and hole position information from a component position detecting hole obtained by an optical sensor provided at a position where a component of the cassette is taken out is preset. By detecting the amount of displacement of the hole from the reference hole position information, it is possible to prevent the component of the component storage tape from being taken out, and prevent the component from falling during transfer.

The optical sensor provided directly above the pickup position of the cassette can be used both when the component storage tape is being sent out and when the master tape is being sent out. That is, it is possible to monitor the component when the component storage tape is being sent out by image information, and in the case of inspection, the amount of positional deviation from the information from the component position detection hole of the master tape and the reference information can be calculated. It can be displayed as a monitor image for inspection.

By providing a function of calculating the positional deviation amount of the hole from the hole position from the component position detecting hole obtained from the optical sensor and the preset reference hole position, it is possible to perform the judgment without subjective judgment. It is possible to accurately detect the amount of positional deviation.

Since the amount of positional deviation can be stored and managed as data for each cassette, each cassette should be used as a judgment material for presence / absence of use, periodic maintenance, overhaul, etc. based on time-lapse data. You can

[0013]

The present invention will be described in detail with reference to the drawings. As shown in FIG. 1, the chip mounting device cassette inspection device has a component position detection hole 3 corresponding to the positions of the components stored in the component storage tape and the feed holes for sequentially feeding the tape in advance. A master tape 1 provided with a feed hole 5 is prepared, means for substituting the master tape 1 into a cassette and feeding it at a predetermined speed, and an optical sensor 7 provided corresponding to a picked-up position of a set component. And a comparison calculation unit 9 for calculating the amount of positional deviation of the detection hole from the detection position information of the component position detection hole 3 obtained from the optical sensor 7 and preset reference hole position information, and this comparison calculation. It is composed of a display unit 11 and a printing unit 13 that appropriately output information from the unit 9.

The master tape 1 is a tape having a component position detecting hole 3 corresponding to the position of the component stored in the component storage tape in advance, and is set on the tape supply reel 24 and fed by the tape feeding mechanism. A feed hole 5 is provided for this purpose. The master tape 1 of the embodiment in FIG.
The intervals of the component position detecting holes 3 are provided just in the middle of the feed holes 5, but are set at intervals corresponding to the respective component storing tapes.

The means for substituting the master tape 1 into the cassette 21 and delivering it at a predetermined speed has a structure, not shown, for pushing the master tape 1 frame by frame at a predetermined speed by pushing with an air cylinder. With respect to the means for feeding one frame at a predetermined speed, the pitch feeding method and the position to be pushed by the air cylinder are different because the cassettes 21 are different depending on each manufacturer.
For example, in order to feed the master tape 1 frame by frame in the cassette 21 as shown in FIG.
Fulcrum 2 by pushing in the direction of the arrow with the air cylinder.
The connecting rod 33 connected to the lower fulcrum 31 via 9 is pulled rearward, and the frame feed shaft 39 connected to the connecting fulcrum 35 rotates rearward. This rotation moves the frame feed unit 41 upward with respect to the central axis 37 via the fulcrum 40, and at the same time, the frame feed rotary wheel 43 also moves by one mountain.

At the same time, since the frame feed rotary wheel 43 and the tape rotary wheel are connected to the center axis 37 about the center shaft 37, they rotate together with the frame feed rotary wheel 43. That is,
When the frame feed rotating wheel 43 rotates by one frame, the tape rotating wheel 45 also moves at the same time, so that the component storage tape or the master tape 1 sandwiched by the tape rotating wheel 45 can be fed one frame at a time. Send at a speed of about 0.2 seconds.

As shown in FIG. 3, the optical sensor 7 is provided almost directly above the pickup position 23 of the cassette 21 and is illuminated by halogen.
The image signal captured by the CCD camera from 3 is transmitted to the comparison calculation unit 9 (FIG. 1).

The comparison calculation unit 9 uses the image signal of the component position detecting hole 3 obtained by imaging with the optical sensor 7 to obtain the hole position information of the component position detecting hole 3 and the preset reference hole position information. The amount of positional deviation of the detection hole is calculated from For the reference hole position, for example, a master jig having a precision corresponding to the cassette 21 of each manufacturer is used, and the hole at the pickup position is image-processed by the master jig to set the origin. The reference hole position information set in advance is displayed by appropriately reading from the inspection reference position setting master file in which data regarding the master tape 1 corresponding to the component storage tape to be inspected is accumulated as shown in FIG. Part 1
The reference position coordinates 53 and 55 are automatically set to 1 and displayed as the monitor image 50.

The process in which the comparison calculation unit 9 fetches the image signal from the CCD camera and then calculates the positional deviation amount will be described with reference to the block flow shown in FIG. 5 and FIG. The comparison calculation unit 9 inputs a signal from the chip feeding mechanism unit which is generated every time one frame is fed by being sandwiched by the tape feeding unit 25 of the cassette 21 for the chip mounting apparatus, and the CCD is also sent together with this signal.
An image signal obtained by binarizing the video signal of the pickup position 23 captured by the camera is captured (S11, S13).

This binarized image signal is clearly distinguished by the halogen illumination illuminating the pickup position 23, that is, the surface of the master tape 1 is white and the component detecting hole 3 is black. It has been quantified. Therefore, the center points 57a and 59a of the positions 57 and 59 corresponding to the component position detecting holes 3 can be easily detected from the captured image signal (S15).

Next, the difference between the detected center points 57a and 59a of the component position detecting hole 3 and the center point 50a of the reference position 50 between the X axis 53 and the Y axis 55 is calculated (S17). The compared data is calculated separately for the X-axis 53 and the Y-axis 55, and it is possible to easily discriminate by visually observing the monitor image whether it is within the allowable range of the error set corresponding to each component storage tape. .. The data calculated by the X-axis 53 and the Y-axis 55 is stored and managed as data for each cassette, and can be appropriately output to the print unit 13 to be used as a reference material for storage management of the cassette.

[0022]

INDUSTRIAL APPLICABILITY The chip mounting apparatus cassette inspection method and inspection apparatus according to the present invention described above correspond to the positions of the components previously stored in the component storage tape and the feed holes for sequentially feeding the tape. Create a master tape with the component position detection hole and the feed hole, insert this master tape into the cassette and send it out, and use the optical sensor provided corresponding to the set pickup position to detect the component position hole By detecting the position deviation amount between the detected hole position and the preset reference hole position, it is possible to detect distortion, deformation wear, etc. of the cassette before mounting the component storage tape. In addition, it is possible to significantly reduce mistakes such as suction of a component from the component storage tape, and at the same time reduce the damage and discard of the component, thereby significantly increasing the productivity.

Further, the component position detection hole detected by the optical sensor and the preset reference hole position are displayed as a monitor image so that the deviation amount between the two can be visually recognized on the screen, so that the actual position can be detected. Since the amount of deviation can be confirmed immediately and easily, the quality of the cassette can be quickly judged.

Further, by storing and managing the amount of deviation between the detected component position detection hole and the reference hole position as data for each cassette, it is possible to make a systematic material judgment.

Then, the chip mounting apparatus cassette inspection device has a component position detection hole and a feed hole corresponding to the positions of the components stored in the component storage tape and the feed holes for sequentially feeding the tape in advance. A master tape that has been provided with, a means for substituting this master tape into a cassette and sending it at a predetermined speed, an optical sensor provided corresponding to the picked-up position of a set component, and this optical sensor A comparison calculation unit that calculates the positional deviation amount of the detection hole from the obtained detection position information of the component position detection hole and preset reference hole position information, and a display unit that appropriately outputs information from the comparison calculation unit, By configuring with the print unit, it is possible to maintain highly accurate chip mounting, greatly reduce cassette mounting correction, and mispick up parts from the pickup position. Can be reduced, the burden of re-implement greatly reduced, thereby improving the productivity increase the mounting efficiency.

[Brief description of drawings]

FIG. 1 is a block schematic diagram of an inspection apparatus according to an embodiment of the present invention.

FIG. 2 is a right side view of the cassette according to the embodiment of the present invention, in which a part of the connecting rod 33 and the frame feed shaft 39 is cut away.

FIG. 3 is a side view of a mounting apparatus according to an embodiment of the present invention.

FIG. 4 is a diagram showing a correlation between a reference hole position and a detection hole position displayed on a monitor image that is an embodiment according to the present invention.

FIG. 5 is a block flow diagram showing comparison between a reference hole position and a detection hole position in a comparison calculation unit according to the present invention.

[Explanation of symbols]

 1 master tape 3 hole for detecting component position 5 feed hole 7 optical sensor 9 comparison calculation unit 11 display unit 13 print unit 21 cassette 23 pickup position 24 tape supply reel 25 tape feed unit 27 drive knob 28 press drive unit 29 upper fulcrum 31 Lower fulcrum 33 Coupling rod 35 Coupling fulcrum 37 Center axis 39 Frame feed axis 41 Frame feed section 43 Frame feed rotary wheel 45 Tape rotary wheel

Claims (4)

[Claims] 1. A master tape of a predetermined length provided with a component position detecting hole and a feed hole corresponding to a position of a component previously stored in a component storage tape and a feed hole for sequentially feeding the tape. This master tape is created and inserted into a cassette and sent out, and the component position detection hole is detected by an optical sensor provided corresponding to the set pickup position of the component, and the detected hole position and preset A method for inspecting a cassette for a chip mounting apparatus, which is characterized by detecting an amount of positional deviation from the reference hole position. 2. A component position detection hole detected by an optical sensor and a preset reference hole position are displayed as a monitor image so that the deviation amount between the both can be visually recognized on the screen. Inspection method of cassette for chip mounting equipment. 3. The method for inspecting a cassette for a chip mounting apparatus according to claim 1, wherein the amount of deviation between the detected component position detection hole and the reference hole position is stored and managed as data for each cassette. 4. A master tape having a component position detection hole and a feed hole corresponding to the positions of the components stored in the component storage tape and the feed holes for sequentially feeding the tape is prepared in advance, Means for substituting the master tape into the cassette and sending it out at a predetermined speed, an optical sensor provided corresponding to the picked-up position of the set component, and the component position detecting hole obtained from the optical sensor. It is composed of a comparison calculation unit that calculates the amount of positional deviation of the detection hole from the detection position information and preset reference hole position information, and a display unit and a print unit that appropriately outputs information from the comparison calculation unit. A device for inspecting a cassette for a chip mounting device.