WO2013120348A1 - 静电保护膜、显示装置和静电保护膜的制备方法 - Google Patents

静电保护膜、显示装置和静电保护膜的制备方法 Download PDF

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Publication number
WO2013120348A1
WO2013120348A1 PCT/CN2012/081853 CN2012081853W WO2013120348A1 WO 2013120348 A1 WO2013120348 A1 WO 2013120348A1 CN 2012081853 W CN2012081853 W CN 2012081853W WO 2013120348 A1 WO2013120348 A1 WO 2013120348A1
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Prior art keywords
graphene
substrate
protection film
electrostatic protection
preparing
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PCT/CN2012/081853
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English (en)
French (fr)
Inventor
戴天明
薛建设
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京东方科技集团股份有限公司
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Priority to US13/995,463 priority Critical patent/US20140212659A1/en
Publication of WO2013120348A1 publication Critical patent/WO2013120348A1/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/04—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of carbon-silicon compounds, carbon or silicon
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
    • B32B27/281—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyimides
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
    • B32B27/304—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers comprising vinyl halide (co)polymers, e.g. PVC, PVDC, PVF, PVDF
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/32—Layered products comprising a layer of synthetic resin comprising polyolefins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
    • B32B27/365—Layered products comprising a layer of synthetic resin comprising polyesters comprising polycarbonates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/38—Layered products comprising a layer of synthetic resin comprising epoxy resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/02—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by a sequence of laminating steps, e.g. by adding new layers at consecutive laminating stations
    • B32B37/025—Transfer laminating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
    • B32B9/005—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising one layer of ceramic material, e.g. porcelain, ceramic tile
    • B32B9/007—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising one layer of ceramic material, e.g. porcelain, ceramic tile comprising carbon, e.g. graphite, composite carbon
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
    • B32B9/04—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B9/041—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material of metal
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
    • B32B9/04—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B9/045—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/16—Anti-static materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/21—Anti-static
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/40—Properties of the layers or laminate having particular optical properties
    • B32B2307/412—Transparent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/50—Properties of the layers or laminate having particular mechanical properties
    • B32B2307/536—Hardness
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/50—Properties of the layers or laminate having particular mechanical properties
    • B32B2307/584—Scratch resistance
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/20—Displays, e.g. liquid crystal displays, plasma displays
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/841—Self-supporting sealing arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/871—Self-supporting sealing arrangements
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/26—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension
    • Y10T428/263—Coating layer not in excess of 5 mils thick or equivalent
    • Y10T428/264—Up to 3 mils
    • Y10T428/265—1 mil or less
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/26—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension
    • Y10T428/266—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension of base or substrate
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/30—Self-sustaining carbon mass or layer with impregnant or other layer

Definitions

  • Embodiments of the present invention relate to a method of preparing an electrostatic protection film, a display device, and an electrostatic protection film. Background technique
  • an electrostatic protective film is usually applied to the surface of the above electronic components.
  • the electrostatic protection film is used for both protecting the safety of electronic components and for preventing electrostatic damage to electronic components and the like.
  • the electrostatic protective film for protecting electronic components is mainly a polymer film filled with an antistatic agent, and a polymer film such as polyethylene terephthalate.
  • the surface of a high molecular film such as a polyethylene terephthalate film has a high electrical resistivity, so that the effect of antistatic protection is unstable, and the flexibility is insufficient, and the electronic component is easily scratched, resulting in low safety.
  • Embodiments of the present invention provide a method for preparing an electrostatic protection film, a display device, and an electrostatic protection film, which are used to solve the problems of high resistivity and low safety of the electrostatic protection film in the prior art.
  • One embodiment of the present invention provides an electrostatic protection film comprising: a layer of a substrate and a layer of graphene; the substrate and the graphene are pasted together.
  • the graphene has a thickness ranging between 20 and 200 nm.
  • the material of the substrate includes one of the following: polyethylene, polypropylene, polycarbonate, polyvinyl chloride, polyimide, epoxy resin, phenolic resin, polyethylene terephthalate PET, and Rubber.
  • the thickness of the substrate ranges from 50 to 1000 ⁇ .
  • Another embodiment of the present invention also provides a display device comprising any of the above electrostatic protection films.
  • Still another embodiment of the present invention provides a method for preparing an electrostatic protection film, comprising: Clean the substrate;
  • a layer of graphene is prepared on the substrate.
  • preparing the layer of graphene on the substrate comprises:
  • the metal piece is etched away to obtain an electrostatic protection film.
  • the preset temperature ranges from 600 to 1000 ° C;
  • the carbon-containing gas includes at least one of a gas: carbon monoxide, ethane, ethylene, ethanol, acetylene, propane, butadiene, cyclopentadiene, benzene, and toluene.
  • the etching and removing the metal piece includes:
  • the acidic solution includes hydrochloric acid, acid or acetic acid.
  • the preparing a layer of graphene on the substrate comprises:
  • the reducing agent includes hydrazine, hydrazine hydrate, sodium borohydride or a halogen acid.
  • coating the graphene oxide powder on the surface of the substrate includes:
  • the above aqueous graphene oxide solution was subjected to ultrasonic treatment.
  • the electrostatic protection film comprises graphene, which protects the electronic component from scratches or friction of the foreign object through the graphene, and at the same time releases the static electricity on the electronic component in time to protect the electronic component from The damage of static electricity prolongs the service life of the electronic component, and the transmittance of the electrostatic protection film is high, thereby greatly reducing the influence of the electrostatic protection film on the light output of the electronic component.
  • FIG. 1 is a schematic structural view of an embodiment of an electrostatic protection film of the present invention
  • FIG. 2 is a flow chart of a first embodiment of a method for preparing an electrostatic protective film of the present invention
  • FIG. 3 is a flow chart of a second embodiment of a method for preparing an electrostatic protective film of the present invention.
  • FIG. 4 is a schematic view of a roll-to-roll pasting method in the embodiment
  • Fig. 5 is a schematic view showing the roll-to-roll transfer mode in the embodiment.
  • FIG. 1 is a schematic structural view of an embodiment of an electrostatic protection film of the present invention.
  • the electrostatic protection film of this embodiment includes a transparent substrate 101 and a layer of graphene 102, and the substrate 101 and the graphene 102 are closely adhered together.
  • the intrinsic electron mobility of graphene 102 can reach 200,000 cm 2 /V*s at room temperature, and the electrical properties are excellent; the visible light transmittance of graphene 102 is 97.7%, and the light transmittance is relatively high; each of graphene 102
  • the carbon atoms are connected to the three carbon atoms in the periphery through the sigma bond, so the graphene 102 is very strong and wear resistant, which is advantageous for preparing a protective film.
  • graphene 102 can range in thickness from 20 to 200 nm, ensuring both graphene 102 robust wear resistance without affecting light transmission. For example, when the thickness of graphene 102 is 100 nm, a force of 200 kN is required to tear it.
  • the thickness of the substrate 101 ranges from 50 to 1000 ⁇
  • the material of the substrate 101 includes polyethylene, polypropylene, polycarbonate, polyvinyl chloride, polyimide, epoxy resin, phenol resin or rubber.
  • the substrate can also be opaque.
  • the graphene is included in the electrostatic protection film, and the electronic component is protected from scratching or rubbing of the foreign object by the graphene, and at the same time, the static electricity on the electronic component is released in time, so that the electronic component is freed. Damaged by static electricity, prolongs the service life of electronic components; at the same time, the transmittance of the electrostatic protection film is high, which greatly reduces the shadow of the electrostatic protection film on the output of the electronic components. ring.
  • Another embodiment of the present invention further provides a display device, wherein an electrostatic protection film shown in FIG. 1 is attached to an electronic component of the display device to provide dual protection for the display device, thereby protecting the display device from scratching or scratching. Damage and other damage, and provide static protection to the display device.
  • the display device may be a liquid crystal display, a mobile phone, a camera, etc., and the above-mentioned electrostatic protection film is attached to the lens of the liquid crystal display, the mobile phone display or the camera to obtain double protection of the display device.
  • a further embodiment of the present invention further provides a method for preparing an electrostatic protection film.
  • a layer of graphene 102 can be prepared on a substrate 101 by a chemical vapor deposition (CVD) method or a reduction method. .
  • CVD chemical vapor deposition
  • FIG. 2 is a flow chart of a first embodiment of a method for preparing an electrostatic protective film of the present invention. As shown in FIG. 2, the specific process of the method for preparing the electrostatic protective film in this embodiment includes the following steps:
  • Step 201 Clean the substrate.
  • the substrate 101 is first cleaned with a clean liquid such as deionized water, and then the substrate 101 is dried, and then the process proceeds to step 202.
  • a clean liquid such as deionized water
  • Step 202 Prepare a layer of graphene on the substrate to obtain an electrostatic protection film.
  • the graphene oxide powder is first dissolved in water, and the concentration of the graphene oxide aqueous solution is between 0.1 and 10 mg/ml.
  • the above graphene oxide aqueous solution can be ultrasonically treated to sufficiently dissolve the graphene oxide powder in water.
  • the substrate 101 is placed in water to uniformly coat the graphene powder on the substrate 101.
  • the substrate 101 coated with the graphene oxide powder is then dried.
  • the graphene oxide is reduced with a reducing agent such as hydrazine, hydrazine hydrate, sodium borohydride or a halogen acid to obtain a uniform thickness of graphene 102 on the substrate 101.
  • the graphene oxide powder is, for example, a commercially available product.
  • the thickness of the obtained layer of graphene is controlled by controlling the concentration of a layer of graphene powder aqueous solution, which is convenient to operate.
  • the obtained electrostatic protection film can protect the electronic component from the scratch or friction of the foreign object, and can release the static electricity on the electronic component in time, so that the electronic component is protected from static electricity, thereby providing the electronic component with double. protection.
  • an electrostatic protective film is obtained, which is not only easy. Control the thickness of graphene, and the manufacturing process of electrostatic protective film is simple and the operation is Will.
  • FIG. 3 is a flow chart of a second embodiment of a method for preparing an electrostatic protective film of the present invention. As shown in FIG. 3, the process of the method for preparing an electrostatic protection film in this embodiment specifically includes the following steps:
  • Step 301 Place the metal piece in a cavity containing carbon gas.
  • the metal piece may be a copper piece, a bake piece or a chrome piece or the like;
  • the carbon-containing gas may include carbon monoxide, ethane, ethylene, ethanol, acetylene, propane, butadiene, cyclopentadiene, benzene or toluene. At least one of; the pressure of the carbon-containing gas ranges from 20 to 600 mTorr.
  • Step 302 Cracking the carbonaceous gas at a preset temperature to deposit a layer of graphene on the metal sheet.
  • the preset temperature can be between 600-1000 ° C
  • the cracking reaction time of the carbon-containing gas is between 10-40 minutes
  • the obtained graphene layer can be controlled by controlling the cracking reaction time of the carbon-containing gas. Thickness; After obtaining a layer of graphene, the process proceeds to step 303.
  • Step 303 attaching the metal piece and the graphene attached together to the substrate.
  • step 302 the attached metal piece and graphene obtained in step 302 are adhered to the substrate, wherein the graphene is in close contact with the substrate.
  • the attached metal piece and the graphene can be attached to the substrate by a roll to roll method.
  • the substrate may be any one of polyethylene, polypropylene, polycarbonate, polyvinyl chloride, polyimide, epoxy resin, phenolic resin or rubber; for example, the thickness of the substrate 102 ranges from 50 to 1000 nm.
  • FIG. 4 is a schematic diagram of a roll-to-roll pasting method in the embodiment. As shown in FIG. 4, the base 101 and the fixedly attached metal piece 103 and the graphene 102 are inserted between the two press rolls 201, and the metal piece 103 and the graphene 102 and the base 101 which are fixedly attached together are attached. After being closely pasted together, the process proceeds to step 304.
  • Step 304 Etching the metal piece to obtain an electrostatic protection film.
  • the metal piece is etched away by an acidic solution such as hydrochloric acid, sulfuric acid or acetic acid to obtain an electrostatic protective film.
  • an acidic solution such as hydrochloric acid, sulfuric acid or acetic acid to obtain an electrostatic protective film.
  • the graphene layer in the electrostatic protection film can be transferred from the soft substrate to the substrate by a roll-to-roll method.
  • Fig. 5 is a schematic view showing the roll-to-roll transfer mode in the embodiment. As shown in FIG. 5, the electrostatic protection film and the PET substrate 101 are inserted into two rotating press rolls 201, and on the other side of the press roll 201, the graphene 102 is separated from the polymethylene substrate 101, and Graphene paste in On the PET substrate 10, an electrostatic protective film of a corresponding hardness is obtained.
  • the graphene is prepared by a chemical vapor deposition CVD method in an environment containing a carbon gas, and then the graphene is adhered to the substrate, and the metal sheet is etched away by an acidic solution to obtain an electrostatic protection film. It is not only easy to control the thickness of graphene, but also has a simple manufacturing process and convenient operation. An exemplary embodiment, however, the invention is not limited thereto. It will be apparent to those skilled in the art that various modifications and improvements can be made without departing from the spirit and scope of the invention.

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  • Carbon And Carbon Compounds (AREA)

Abstract

本发明的实施例提供一种静电保护膜、显示装置和静电保护膜的制备方法。该静电保护膜包括：一层基体和一层石墨烯；所述基体和所述石墨烯粘贴在一起。本发明实施例的静电保护膜通过石墨烯来保护元件免受外物刮伤或摩擦的损害，同时又能将电子元件上的静电及时释放出去，使电子元件免受静电的损害，延长了电子元件的使用寿命，同时静电保护膜的透光率高，从而大大降低了静电保护膜对电子元件所输出光线的影响。

Description

静电保护膜、 显示装置和静电保护膜的制备方法 技术领域
本发明的实施例涉及一种静电保护膜、 显示装置和静电保护膜的制备方 法。 背景技术
目前， 手机屏幕、液晶显示屏等电子元件的结构精密、价格也比较昂贵， 为防止电子元件在运输和使用过程中被刮伤或者其他损伤， 通常在上述电子 元件的表面粘贴一层静电保护膜。该静电保护膜既用于保护电子元件的安全， 又用于防止静电对电子元件等造成伤害。
这种保护电子元件的静电保护膜主要是内部填充有抗静电剂的高分子薄 膜， 包括聚对苯二曱酸乙二脂等高分子薄膜。 聚对苯二曱酸乙二脂薄膜等高 分子薄膜的表面的电阻率较高， 所以抗静电保护的效果不稳定， 另外柔韧性 不够， 容易造成电子元件被划伤， 安全性较低。 发明内容
本发明的实施例提供一种静电保护膜、 显示装置和静电保护膜的制备方 法， 用于解决现有技术中静电保护膜的电阻率高、 安全性低的问题。
本发明的一个实施例提供了一种静电保护膜， 包括： 一层基体和一层石 墨烯； 所述基体和所述石墨烯粘贴在一起。
例如， 所述石墨烯的厚度范围在 20-200nm之间。
例如， 所述基体的材料包括如下之一： 聚乙烯、 聚丙烯、 聚碳酸酯、 聚 氯乙烯、 聚酰亚胺、 环氧树脂、 酚醛树脂、 聚对苯二曱酸乙二醇酯 PET和橡 胶.
例如， 所述基体的厚度范围在 50-1000匪之间。
本发明的另一个实施例还提供一种显示装置， 包括上述的任意一种静电 保护膜。
本发明的再一个实施例还提供一种静电保护膜的制备方法， 包括： 将基体清洗干净；
在所述基体上制备一层石墨烯。
其中， 所述在所述基体上制备一层石墨烯包括：
将金属片放置在含碳气体的腔体内；
在预设温度将所述含碳气体裂解， 以在所述金属片上沉积一层石墨烯； 将上述贴附的金属片和石墨烯粘贴在所述基体上 , 所述石墨烯与所述基 体粘贴；
将所述金属片刻蚀去除， 以得到静电保护膜。
例如， 所述预设温度的范围为 600- 1000 °C之间；
所述含碳气体包括气体中的至少一种： 一氧化碳、 乙烷、 乙烯、 乙醇、 乙炔、 丙烷、 丁二烯、 环戊二烯、 苯和曱苯。
例如， 所述将所述金属片刻蚀去除包括：
利用酸性溶液刻蚀去除所述金属；
所述酸性溶液包括盐酸、 酸或醋酸。
例如， 所述在所述基体上制备一层石墨烯包括：
将氧化石墨烯粉末涂覆在所述基体表面；
利用还原剂将所述石墨烯粉末还原为石墨烯；
所述还原剂包括肼、 水合肼、 硼氢化钠或卤酸。
例如， 所述将氧化石墨烯粉末涂覆在所述基体表面包括：
将所述氧化石墨烯粉末溶于水中， 氧化石墨烯水溶液的浓度在
0.1~10mg/ml之间；
对上述氧化石墨烯水溶液进行超声波处理。
本发明具有下述有益效果：
本发明的实施例中， 静电保护膜包括石墨烯， 通过石墨烯来保护电子元 件免受外物刮伤或摩擦的损害，同时又能将电子元件上的静电及时释放出去， 使电子元件免受静电的损害， 延长了电子元件的使用寿命， 同时静电保护膜 的透光率高 , 从而大大降低了静电保护膜对电子元件所输出光线的影响。 附图说明
为了更清楚地说明本发明实施例的技术方案， 下面将对实施例的附图作 简单地介绍，显而易见地，下面描述中的附图仅仅涉及本发明的一些实施例, 而非对本发明的限制。
图 1为本发明静电保护膜实施例的结构示意图；
图 2为本发明静电保护膜的制备方法第一实施例的流程图；
图 3为本发明静电保护膜的制备方法第二实施例的流程图；
图 4为本实施例中卷对卷粘贴方式的示意图；
图 5为本实施例中卷对卷转印方式的示意图。
具体实施方式
为使本发明实施例的目的、 技术方案和优点更加清楚， 下面将结合本发 明实施例的附图，对本发明实施例的技术方案进行清楚、完整地描述。显然， 所描述的实施例是本发明的一部分实施例， 而不是全部的实施例。 基于所描 述的本发明的实施例， 本领域普通技术人员在无需创造性劳动的前提下所获 得的所有其他实施例， 都属于本发明保护的范围。
图 1为本发明静电保护膜实施例的结构示意图。 如图 1所述， 本实施例 的静电保护膜包括透明的基体 101和一层石墨烯 102,基体 101和石墨烯 102 紧密粘贴在一起。 石墨烯 102 在室温条件下的本征电子迁移率可以达到 200000cm2/V*s, 电学性能优异； 石墨烯 102的可见光透过率为 97.7%, 透光 率比较高；石墨烯 102中的每个碳原子与周边的三个碳原子通过 σ键相连接， 所以石墨烯 102非常坚固耐磨， 有利于制备保护膜。
例如，石墨烯 102的厚度范围可以在 20-200nm之间，既确保石墨烯 102 坚固耐磨性能， 又不影响透光率。 例如， 在石墨烯 102的厚度为 lOOnm时， 需要 200kN的力量才能将其撕裂。
例如， 基体 101的厚度范围在 50-1000匪之间， 基体 101的材料包括聚 乙烯、 聚丙烯、 聚碳酸酯、 聚氯乙烯、 聚酰亚胺、 环氧树脂、 酚醛树脂或橡 胶等。 根据使用对象， 基体也可以是非透明的。
在本实施例中， 在静电保护膜中包括石墨烯， 通过石墨烯来保护电子元 件免受外物刮伤或摩擦的损害， 同时又能将电子元件上的静电及时释放出 去， 使电子元件免受静电的损害， 延长了电子元件的使用寿命； 同时， 静电 保护膜的透光率高， 从而大大降低了静电保护膜对电子元件所输出光线的影 响。
本发明的另一个实施例还提供一种显示装置，显示装置的电子元件上贴 附一层图 1所示的静电保护膜，为显示装置提供双重保护，既保护显示装置 免受刮伤或划伤等损害， 又对显示装置提供静电保护。 例如， 显示装置可以 为液晶显示器、 手机、 照相机等， 在液晶显示器、 手机显示屏或照相机的镜 片上粘贴上述的静电保护膜， 以使显示装置获得双重保护。
本发明的再一个实施例还提供一种静电保护膜的制备方法，在实际应用 中， 可以通过化学气相沉积 (Chemical Vapor Deposition , C VD)方法或还原法 在基体 101上制备一层石墨烯 102。
在本实施例中，以还原法在基体 101上制备石墨烯 102为例来介绍技术 方案。 图 2 为本发明静电保护膜的制备方法第一实施例的流程图。 如图 2 所示， 本实施例中静电保护膜的制备方法的具体过程包括如下步骤：
步骤 201、 将基体清洗干净。
在本步骤中，首先利用去离子水等洁净液体将基体 101清洗干净，再将 基体 101做干燥处理， 然后进入步骤 202。
步骤 202、 在基体上制备一层石墨烯， 以得到静电保护膜。
在本步骤，先将氧化石墨烯粉末溶解在水中，氧化石墨烯水溶液浓度在 0.1~10mg/ml之间。 可以通过超声波处理上述的氧化石墨烯水溶液， 以使氧 化石墨烯粉末在水中充分溶解。 然后， 将基体 101放置在水中， 以使石墨烯 粉末均匀地涂覆在基体 101上。再将涂覆有氧化石墨烯粉末的基体 101晾干。 最后用肼、 水合肼、硼氢化钠或卤酸等还原剂对氧化石墨烯进行还原，从而 在基体 101上得到一层厚度均匀的石墨烯 102。氧化石墨烯粉末例如为市售 的产品。
在本步骤中，通过控制一层石墨烯粉末水溶液的浓度来控制所得到的一 层石墨烯的厚度，操作方便。所得到的静电保护膜既能保护电子元件免受外 物刮伤或摩擦的损害，又能将电子元件上的静电及时释放出去，使电子元件 免受静电的损害， 从而为电子元件提供双重的保护。
在本实施例中，通过将氧化石墨烯粉末均勾地涂覆在基体上， 然后再用 还原剂将氧化石墨烯粉末还原为一层厚度均勾的石墨烯，从而得到静电保护 膜， 不仅容易控制石墨烯的厚度， 而且静电保护膜的制作过程简单、操作方 便。
图 3为本发明静电保护膜的制备方法第二实施例的流程图。如图 3所示， 本实施例中静电保护膜的制备方法的流程具体包括如下步骤：
步骤 301、 将金属片放置在含碳气体的腔体内。
在本步骤中， 金属片可以为铜片、 铷片或铬片等； 含碳气体可以包括一 氧化碳、 乙烷、 乙烯、 乙醇、 乙炔、 丙烷、 丁二烯、 环戊二烯、 苯或曱苯中 至少一种； 含碳气体的压强范围在 20-600mTorr之间。
步骤 302、在预设温度将含碳气体裂解， 以在金属片上沉积一层石墨烯。 在本步骤中， 预设温度可以在 600-1000°C之间， 含碳气体的裂解反应时 间在 10-40分钟之间， 通过控制含碳气体的裂解反应时间可以控制所获得石 墨烯层的厚度； 获得一层石墨烯后， 进入步骤 303。
步骤 303、 将上述贴附一起的金属片和石墨烯粘贴在基体上。
在本步骤中 , 将步骤 302得到的贴附一起的金属片和石墨烯与基体粘贴 在一起， 其中石墨烯与基体紧密接触。
例如， 可以通过卷对卷（Roll to Roll )方式来将贴附一起的金属片和石 墨烯与基体粘贴。 基体可以为聚乙烯、 聚丙烯、 聚碳酸酯、 聚氯乙烯、 聚酰 亚胺、 环氧树脂、 酚醛树脂或橡胶中任意一种； 例如， 基体 102的厚度范围 在 50-1000nm之间。
图 4为本实施例中卷对卷粘贴方式的示意图。 如图 4所示， 将基体 101 与固定贴附在一起的金属片 103和石墨烯 102插入到两个压辊 201之间， 在 固定贴附在一起的金属片 103和石墨烯 102与基体 101紧密粘贴在一起之后， 进入步骤 304。
步骤 304、 将金属片刻蚀去除， 以得到静电保护膜。
在本步骤中， 通过盐酸、硫酸、 醋酸等酸性溶液将金属片刻蚀去除， 从 而得到静电保护膜。
又例如， 当静电保护膜中基材为质地较软基材如聚乙婦基材时，还可以 通过卷对卷方式，将静电保护膜中石墨烯层从质地较软的基材上转移到质地 较硬的如 PET基材上。 图 5为本实施例中卷对卷转印方式的示意图。如图 5 所示， 将静电保护膜与 PET基材 101 , 插入到两个旋转的压辊 201中， 在压 辊 201的另一侧， 石墨烯 102与聚乙婦基材 101分离， 同时， 石墨烯粘贴在 PET基材 10上， 以得到相应硬度的静电保护膜。
在本实施例中， 通过化学气相沉积 CVD方法， 在含碳气体的环境中制 备石墨烯， 然后将石墨烯与基材紧密粘贴， 再利用酸性溶液刻蚀掉金属片， 从而得到静电保护膜， 不仅容易控制石墨烯的厚度， 而且制作过程简单、操 作方便。 例性实施方式， 然而本发明并不局限于此。 对于本领域内的普通技术人员而 言， 在不脱离本发明的精神和实质的情况下， 可以做出各种变型和改进， 这 些变型和改进也在本发明的保护范围内。

Claims

权利要求书
1. 一种静电保护膜， 包括：
一层基体， 和
一层石墨烯；
其中， 所述基体和所述石墨烯粘贴在一起。
2. 根据权利要求 1所述的静电保护膜， 其中， 所述石墨烯的厚度范围在 20-200nm之间。
3. 根据权利要求 1或 2所述的静电保护膜， 其中， 所述基体的材料包括 如下之一： 聚乙烯、 聚丙烯、 聚碳酸酯、 聚氯乙烯、 聚酰亚胺、 环氧树脂、 酚醛树脂、 聚对苯二曱酸乙二醇酯（PET )和橡胶。
4. 根据权利要求 1-3任一所述的静电保护膜， 其中， 所述基体的厚度范 围在 50-1000nm之间。
5. 一种显示装置， 包括权利要求 1-4任一所述静电保护膜。
6. 一种静电保护膜的制备方法， 包括：
将基体清洗干净；
在所述基体上制备一层石墨烯。
7. 根据权利要求 6所述的静电保护膜的制备方法， 其中， 所述在所述基 体上制备一层石墨烯包括：
将金属片放置在含碳气体的腔体内；
在预设温度将所述含碳气体裂解， 以在所述金属片上固定贴附一层石墨 将上述固定贴附的金属片和石墨烯粘贴在所述基体上， 所述石墨烯与所 述基体粘贴；
将所述金属片刻蚀去除， 以得到静电保护膜。
8. 根据权利要求 7所述的静电保护膜的制备方法， 其中， 所述预设温度 的范围为 600-1000 °C之间；
所述含碳气体包括气体中的至少一种： 一氧化碳、 乙烷、 乙烯、 乙醇、 乙炔、 丙烷、 丁二烯、 环戊二烯、 苯和曱苯。
9. 根据权利要求 7所述的静电保护膜的制备方法， 其中， 所述将所述金 属片刻蚀去除包括：
利用酸性溶液刻蚀去除所述金属；
所述酸性溶液包括盐酸、 酸或醋酸。
10. 根据权利要求 6所述的静电保护膜的制备方法， 其中， 所述在所述 基体上制备一层石墨烯包括：
将氧化石墨烯粉末涂覆在所述基体表面；
利用还原剂将所述石墨烯粉末还原为石墨烯；
所述还原剂包括肼、 水合肼、 硼氢化钠或卤酸。
11. 根据权利要求 10所述的静电保护膜的制备方法， 其中， 所述将氧化 石墨烯粉末涂覆在所述基体表面包括：
将所述氧化石墨烯粉末溶于水中， 氧化石墨烯水溶液的浓度在
0.1~10mg/ml之间；
对上述氧化石墨烯水溶液进行超声波处理。
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