WO2013089410A1 - Composition de résine d'ester cyanate pour la fabrication d'une plaque à circuits imprimés et stratifiés flexibles métal-revêtement la comprenant - Google Patents

Composition de résine d'ester cyanate pour la fabrication d'une plaque à circuits imprimés et stratifiés flexibles métal-revêtement la comprenant Download PDF

Info

Publication number
WO2013089410A1
WO2013089410A1 PCT/KR2012/010743 KR2012010743W WO2013089410A1 WO 2013089410 A1 WO2013089410 A1 WO 2013089410A1 KR 2012010743 W KR2012010743 W KR 2012010743W WO 2013089410 A1 WO2013089410 A1 WO 2013089410A1
Authority
WO
WIPO (PCT)
Prior art keywords
resin composition
cyanate ester
adhesive resin
film
rubber
Prior art date
Application number
PCT/KR2012/010743
Other languages
English (en)
Korean (ko)
Inventor
박영석
박순용
장세명
Original Assignee
주식회사 엘지화학
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 주식회사 엘지화학 filed Critical 주식회사 엘지화학
Priority to JP2014545830A priority Critical patent/JP2015509113A/ja
Priority to CN201280061297.1A priority patent/CN104011163A/zh
Priority to US14/364,978 priority patent/US20140335341A1/en
Priority claimed from KR1020120143418A external-priority patent/KR101413203B1/ko
Publication of WO2013089410A1 publication Critical patent/WO2013089410A1/fr

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L21/00—Compositions of unspecified rubbers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L27/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Compositions of derivatives of such polymers
    • C08L27/02—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Compositions of derivatives of such polymers not modified by chemical after-treatment
    • C08L27/12—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Compositions of derivatives of such polymers not modified by chemical after-treatment containing fluorine atoms
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J127/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Adhesives based on derivatives of such polymers
    • C09J127/02—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Adhesives based on derivatives of such polymers not modified by chemical after-treatment
    • C09J127/12—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Adhesives based on derivatives of such polymers not modified by chemical after-treatment containing fluorine atoms
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J179/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09J161/00 - C09J177/00
    • C09J179/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards

Definitions

  • the adhesive resin composition may include 10 to 90 parts by weight of the fluorine resin powder and 1 to 80 parts by weight of the rubber component based on 100 parts by weight of the cyanate ester resin.
  • the fluorine-based resin powder included in the composition may have a number average particle diameter of 10 or less.
  • the bloso resin powder is poly tetrafluoro ethylene (PTFE), perfluoroalkoxy polymer (PFA), fluorinated ethylene-propylene copolymer (FEP), chlorotrifluoro ethylene (CTFE) ), Tetrafluoro ethylene / chlorotrifluoroethylene copolymer (TFE / CTFE), ethylene-chlorotrifluoroethylene copolymer (ECTFE), ethylene-tetrafluoroethylene copolymer (ETFE), and polychloro It may be a powder of at least one fluorine resin selected from the group consisting of trifluoro ethylene (PCTFE).
  • the cyanate ester resin may be at least difunctional aliphatic cyanate ester, at least difunctional aromatic cyanate ester, or a combination thereof.
  • the adhesive resin composition according to the present invention has a low dielectric constant and a low dielectric loss coefficient, which enables the production of a circuit board having more improved electrical properties.
  • FIG. 1 and 2 are cross-sectional views schematically showing the configuration of a flexible metal foil laminate according to an embodiment of the present invention, respectively.
  • an adhesive resin composition for producing a circuit board comprising a cyanate ester resin and a bloso resin powder and a rubber component dispersed in the cyanate ester resin.
  • the cyanate ester resin is a base resin, as long as it is suitable for use as an adhesive resin in the art to which the present invention pertains, it can be applied without particular limitation of its configuration.
  • cyanate ester resins examples include 1,3,5-tricyanatobenzene (1,3,5-tricyanatobenzene),
  • AcroCy B made by Ciba-Geigy, the average cyanate ester group in about 1 molecule
  • AcroCy F made by Ciba-Geigy, in 1 molecule
  • the fluorine-based resin powder may have a greater effect of lowering the dielectric constant.
  • the fluorine-based resin powder is 10 or less, preferably 0.1 to 10, more preferably 0.1 to 7 ⁇ , even more preferably 0.1 It may be to have a number average particle diameter of 5 to.
  • the fluorine-based resin powder It can be used that can express the effect of improving the dielectric properties, preferably polytetrafluoroethylene (PTFE), perfluoroalkoxy polymer (PFA), fluorinity J ethylene-propylene copolymer (FEP), Chlorotrifluoroethylene (CTFE), tetrafluoroethylene / chlorotrifluoroethylene copolymer (TFE / CTFE), ethylene-chlorotrifluoroethylene copolymer (ECTFE), ethylene-tetrafluoroethylene copolymer (ETFE ), And polychlorotrifluoroethylene (PCTFE) may be a powder of at least one fluorine-based resin selected from the group consisting of.
  • PTFE polytetrafluoroethylene
  • PFA perfluoroalkoxy polymer
  • FEP fluorinity J ethylene-propylene copolymer
  • CTFE Chlorotrifluoroethylene
  • TFE / CTFE t
  • the amount of the fluorine resin powder contained in the adhesive resin composition of the present invention is 10 to 90 parts by weight, preferably 10 to 70 parts by weight, more preferably 20 to 60 parts by weight of 100 parts by weight of the cyanate ester resin. It may be part by weight. That is, in order to sufficiently express characteristics such as low dielectric constant, low dielectric loss, and low water absorption according to the addition of the fluorine resin powder, the fluorine resin powder is included in an amount of 10 parts by weight or more based on 100 parts by weight of cyanate ester resin. It is advantageous. In addition, when the fluorine-based resin powder is included in an excessive amount, the mechanical properties of the coating layer formed using the adhesive resin composition is relatively poor, the coating layer may be torn or broken.
  • a bonding sheet including a cured product of the above-described adhesive resin composition is provided.
  • the bonding sheet is formed by applying the above-mentioned composition on the protective layer using a comma coater, reverse roll coater, etc. to form an adhesive layer, drying it to a semi-cured state, and laminating a separate protective layer thereon. It can be prepared by the method.
  • the thickness of the bonding sheet (that is, the adhesive layer) including the cured product of the adhesive resin composition described above may be determined in consideration of the adhesive force required for the bonding sheet, the thickness of the circuit board to be applied, and the like, and is not particularly limited. .
  • the thickness of the bonding sheet may be 5 to 100 / ⁇ .
  • a coverlay including an electrically insulating film and the bonding sheet bonded to at least one side of the electrically insulating film is provided.
  • cyanate ester resin was added in the content ratio shown in Table 1 below (reference: 100 parts by weight of cyanate ester resin), and then the resin was completely dissolved using a stirrer. Then, a 20% by weight solution of styrene butadiene rubber dissolved in toluene was added and stirred. Then, the cyanate ester resin composition which the fluororesin powder disperse
  • thermosetting coverlay On one side of the polyimide film (thickness: 12.5 / m, manufacturer: KANEKA), the respective compositions according to Examples 1 to 3 or Comparative Examples 1 and 2 were applied so as to be about 25 based on the thickness after drying, and After drying at 150 ° C. for about 10 minutes, a release paper (product name: EX3, manufacturer: Lintec) having a thickness of 100 ai with a release coating was laminated to prepare a thermosetting coverlay.
  • a release paper product name: EX3, manufacturer: Lintec
  • thermosetting prepreg After incorporating each composition according to 2, dried at about 150 ° C. for about 12 minutes to prepare a thermosetting prepreg having a total thickness of about 50 kPa.
  • the respective compositions according to Examples 1 to 3 or Comparative Examples 1 and 2 were about 10; / m based on the thickness after drying After coating to form an adhesive resin layer, It was dried to form a semi-cured state. Then, the adhesive resin layer as described above was formed on the remaining surface of the polyimide film in the same manner to prepare an adhesive sheet.

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Abstract

La présente invention concerne une composition de résine adhésive pour la fabrication d'une plaque à circuits imprimés et son utilisation. La composition de résine adhésive selon la présente invention comprend : une résine d'ester cyanate ; une poudre de résine fluorée qui est dispersée à l'intérieur de ladite résine d'ester cyanate ; et un composant caoutchouc, l'invention ayant une permittivité diélectrique faible et un coefficient de perte diélectrique faible, permettant ainsi de fabriquer une plaque à circuits imprimés ayant une caractéristique électrique encore améliorée.
PCT/KR2012/010743 2011-12-12 2012-12-11 Composition de résine d'ester cyanate pour la fabrication d'une plaque à circuits imprimés et stratifiés flexibles métal-revêtement la comprenant WO2013089410A1 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2014545830A JP2015509113A (ja) 2011-12-12 2012-12-11 回路基板製造用シアネートエステル系樹脂組成物およびこれを含む軟性金属箔積層板
CN201280061297.1A CN104011163A (zh) 2011-12-12 2012-12-11 用于制造电路板的氰酸酯树脂组合物以及含有其的柔性覆金属层压制品
US14/364,978 US20140335341A1 (en) 2011-12-12 2012-12-11 Cyanate esters-based adhesive resin composition for fabrication of circuit board and flexible metal clad laminate comprising the same

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
KR20110133108 2011-12-12
KR10-2011-0133108 2011-12-12
KR10-2012-0143418 2012-12-11
KR1020120143418A KR101413203B1 (ko) 2011-12-12 2012-12-11 회로 기판 제조용 시아네이트 에스테르계 수지 조성물
KR10-2012-0143419 2012-12-11
KR20120143419A KR20130066527A (ko) 2011-12-12 2012-12-11 연성 금속박 적층판

Publications (1)

Publication Number Publication Date
WO2013089410A1 true WO2013089410A1 (fr) 2013-06-20

Family

ID=48612796

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2012/010743 WO2013089410A1 (fr) 2011-12-12 2012-12-11 Composition de résine d'ester cyanate pour la fabrication d'une plaque à circuits imprimés et stratifiés flexibles métal-revêtement la comprenant

Country Status (1)

Country Link
WO (1) WO2013089410A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112680172A (zh) * 2020-11-11 2021-04-20 浙江福斯特新材料研究院有限公司 耐燃的覆盖膜组合物、覆盖膜产品及多层叠置软硬组合板

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0786505A2 (fr) * 1996-01-25 1997-07-30 W.L. GORE & ASSOCIATES, INC. Film composite adhésif-charge et son procédé de fabrication
KR100210740B1 (ko) * 1991-07-12 1999-07-15 스프레이그 로버트 월터 비등방성의 전도성 접착제 필름
US20050005437A1 (en) * 2001-11-30 2005-01-13 Ajinomoto Co., Inc. Adhesive film for use in multilayer printed wiring board and method of producing multilayer printed wiring board
EP2374853A1 (fr) * 2010-04-12 2011-10-12 Cornerstone Research Group, Inc. Adhésif sensible à la pression à base d'ester de cyanate

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100210740B1 (ko) * 1991-07-12 1999-07-15 스프레이그 로버트 월터 비등방성의 전도성 접착제 필름
EP0786505A2 (fr) * 1996-01-25 1997-07-30 W.L. GORE & ASSOCIATES, INC. Film composite adhésif-charge et son procédé de fabrication
US20050005437A1 (en) * 2001-11-30 2005-01-13 Ajinomoto Co., Inc. Adhesive film for use in multilayer printed wiring board and method of producing multilayer printed wiring board
EP2374853A1 (fr) * 2010-04-12 2011-10-12 Cornerstone Research Group, Inc. Adhésif sensible à la pression à base d'ester de cyanate

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112680172A (zh) * 2020-11-11 2021-04-20 浙江福斯特新材料研究院有限公司 耐燃的覆盖膜组合物、覆盖膜产品及多层叠置软硬组合板
CN112680172B (zh) * 2020-11-11 2022-11-29 杭州福斯特电子材料有限公司 耐燃的覆盖膜组合物、覆盖膜产品及多层叠置软硬组合板

Similar Documents

Publication Publication Date Title
KR101413203B1 (ko) 회로 기판 제조용 시아네이트 에스테르계 수지 조성물
KR102438820B1 (ko) 수지 조성물
KR101692704B1 (ko) 수지 조성물
JP6283449B1 (ja) 回路基板用接着剤組成物
KR102481557B1 (ko) 수지 조성물
KR101816503B1 (ko) 수지 조성물
TWI777950B (zh) 聚醯亞胺、聚醯亞胺系黏著劑、薄膜狀黏著材料、黏著層、黏著薄片、附有樹脂之銅箔、覆銅積層板及印刷線路板、以及多層線路板及其製造方法
KR101677461B1 (ko) 에폭시 수지 조성물
KR102548004B1 (ko) 수지 조성물
WO2018062404A1 (fr) Matériau isolant intercouche et carte de circuit imprimé multicouche
JP2010524265A (ja) 回路材料、多層回路、およびこれらを製造する方法
KR102562172B1 (ko) 불소계 수지의 비수계 분산체, 불소계 수지 함유 열경화 수지 조성물과 그 경화물, 및 회로 기판용 접착제 조성물
JP2010222408A (ja) フレキシブルプリント配線板用樹脂組成物、樹脂フィルム、プリプレグ、樹脂付き金属箔、フレキシブルプリント配線板
JP2009144052A (ja) プリント回路板用樹脂組成物、支持基材付き絶縁層、積層板およびプリント回路板
TW201412864A (zh) 熱硬化性樹脂組成物、ｂ階段（半硬化階段）化的樹脂薄膜、金屬箔、覆銅箔板及多層增層基板
JP7212626B2 (ja) プリント配線板用樹脂組成物、樹脂付銅箔、銅張積層板、及びプリント配線板
TWI445790B (zh) A flame retardant adhesive resin composition, and a flexible printed circuit board material using the same
CN110387155A (zh) 树脂组合物
JP6461700B2 (ja) 回路基板用接着剤組成物
WO2013089410A1 (fr) Composition de résine d'ester cyanate pour la fabrication d'une plaque à circuits imprimés et stratifiés flexibles métal-revêtement la comprenant
JP2012041510A (ja) 樹脂組成物、ｂステージフィルム、積層フィルム及び多層基板
CN114958287A (zh) 粘接剂组合物、固化物、粘接片、带树脂的铜箔、覆铜层叠板、印刷布线板
JP4214573B2 (ja) 積層板の製造方法
JP6816566B2 (ja) 樹脂組成物、接着フィルム、プリプレグ、多層プリント配線板及び半導体装置
CN114621723A (zh) 粘接剂组合物、固化物、粘接片、带树脂的铜箔、覆铜层叠板、印刷布线板

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 12858496

Country of ref document: EP

Kind code of ref document: A1

ENP Entry into the national phase

Ref document number: 2014545830

Country of ref document: JP

Kind code of ref document: A

NENP Non-entry into the national phase

Ref country code: DE

WWE Wipo information: entry into national phase

Ref document number: 14364978

Country of ref document: US

122 Ep: pct application non-entry in european phase

Ref document number: 12858496

Country of ref document: EP

Kind code of ref document: A1