WO2013080732A1 - Composition de résine époxy de type en un paquet - Google Patents

Composition de résine époxy de type en un paquet Download PDF

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Publication number
WO2013080732A1
WO2013080732A1 PCT/JP2012/078109 JP2012078109W WO2013080732A1 WO 2013080732 A1 WO2013080732 A1 WO 2013080732A1 JP 2012078109 W JP2012078109 W JP 2012078109W WO 2013080732 A1 WO2013080732 A1 WO 2013080732A1
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Prior art keywords
epoxy resin
resin composition
underfill material
component
type epoxy
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PCT/JP2012/078109
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English (en)
Japanese (ja)
Inventor
明美 加納
敏行 佐藤
山田　和義
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ナミックス株式会社
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Priority to JP2013547072A priority Critical patent/JP5938417B2/ja
Publication of WO2013080732A1 publication Critical patent/WO2013080732A1/fr

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C08G59/625—Hydroxyacids
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the present invention relates to a one-pack type epoxy resin composition used as an underfill material for a flip chip mounting body, and more particularly to an epoxy resin composition suitable for use as a pre-feed type underfill material.
  • the flip chip mounting body has a structure in which an electrode portion on a substrate and a chip or a package as a semiconductor element are connected via a bump electrode, and the connecting portion of both is reinforced with an underfill.
  • the underfill material can be supplied by connecting the chip or package and the electrode part on the substrate, and then applying (dispensing) a post-feed type underfill material along the outer periphery of the chip or package, and then the capillary tube.
  • a capillary flow that fills the gap between the two with an underfill material, and a portion that is reinforced with an underfill material on a substrate using a flip chip bonder device (specifically, electrode portions on the substrate and There is a compression flow in which a pre-feed type underfill material is applied (dispensed) in advance to the periphery thereof, and the chip or package is pressed from above, thereby connecting the chip or package to the substrate.
  • the connection portion between the two is reinforced by heat-curing the underfill material.
  • the underfill material is dispensed on a preheated substrate (for example, 60 ° C. to 120 ° C.) for the purpose of shortening the process time or reducing voids.
  • the fill material is required to have stability in the middle temperature range of 60 ° C to 120 ° C.
  • a one-pack type epoxy resin composition is usually used as the underfill material because it is easy to store and handle.
  • the one-pack type epoxy resin composition has low stability in the middle temperature range, the curing reaction may proceed when dispensing the underfill material on the substrate. There was a problem.
  • the present invention provides a one-pack type epoxy resin composition that maintains fast curability at 150 ° C. or higher and has high stability in the middle temperature range of 60 ° C. to 120 ° C.
  • the purpose is to provide.
  • the present invention provides (a) a liquid epoxy resin, (b) an acid anhydride curing agent or a phenol curing agent, (c) a latent curing accelerator, (d) 5-hydroxyisophthalate.
  • a one-part epoxy resin composition comprising an acid, 5-nitroisophthalic acid, 1,3,5-benzenetricarboxylic acid or a mixture thereof is provided.
  • the (c) latent curing accelerator is preferably solid at room temperature.
  • the (c) latent curing accelerator is preferably a microcapsule type latent curing accelerator or an amine adduct type latent curing agent.
  • the mass ratio ((d) / (c)) of (c) and (d) is preferably 0.01 to 5.
  • the one-pack type epoxy resin composition of the present invention may further contain an inorganic filler.
  • the present invention also provides an underfill material comprising the one-component epoxy resin composition of the present invention.
  • the present invention is a method for manufacturing a semiconductor device in which a semiconductor chip is mounted on a wiring board by a flip chip bonding method, A step of heating the wiring board and holding it at 60 ° C. to 120 ° C .; Applying the underfill material of the present invention on the wiring board; A step of aligning and pressing a semiconductor chip on a portion of the wiring board to which the underfill has been applied; and Curing the underfill material at 150 ° C. to 200 ° C .; The manufacturing method of the semiconductor device containing this is provided.
  • the present invention is a method for manufacturing a semiconductor device in which a semiconductor chip is mounted on a wiring board by a flip chip bonding method, Connecting a semiconductor chip to a wiring board; Heating the wiring board and holding at 60 ° C. to 120 ° C .;
  • a method for manufacturing a semiconductor device including a step of filling an underfill material of the present invention in a gap between the wiring board and the semiconductor chip, and a step of curing the underfill material at 150 ° C. to 200 ° C.
  • the one-pack type epoxy resin composition of the present invention has a fast curing property at 150 ° C. or higher and a high stability in the middle temperature range of 60 ° C. to 120 ° C. Suitable as an underfill material.
  • the one-pack type epoxy resin composition of the present invention as an underfill material, workability at the time of flip chip mounting is improved.
  • the one-pack type epoxy resin composition of the present invention contains the following components (a) to (d) as essential components.
  • the liquid epoxy resin (a) is a component that forms the main component of the one-pack type epoxy resin composition of the present invention.
  • the liquid epoxy resin means an epoxy resin that is liquid at room temperature.
  • the liquid epoxy resin in the present invention includes a bisphenol A type epoxy resin having an average molecular weight of about 400 or less; a branched polyfunctional bisphenol A type epoxy resin such as p-glycidyloxyphenyldimethyltrisbisphenol A diglycidyl ether; F type epoxy resin; phenol novolac type epoxy resin having an average molecular weight of about 570 or less; vinyl (3,4-cyclohexene) dioxide, 3,4-epoxycyclohexylcarboxylic acid (3,4-epoxycyclohexyl) methyl, adipic acid Alicyclic epoxy resins such as bis (3,4-epoxy-6-methylcyclohexylmethyl), 2- (3,4-epoxycyclohexylmethyl), 2- (3,4-epoxycycl
  • An epoxy resin having a silicone skeleton such as 1,3-bis (3-glycidoxypropyl) -1,1,3,3-tetramethyldisiloxane can also be used.
  • diepoxide compounds such as (poly) ethylene glycol diglycidyl ether, (poly) propylene glycol diglycidyl ether, butanediol diglycidyl ether, neopentyl glycol diglycidyl ether, cyclohexane dimethanol diglycidyl ether; trimethylolpropane triglycidyl Examples include ethers and triepoxide compounds such as glycerin triglycidyl ether.
  • liquid bisphenol type epoxy resin a liquid aminophenol type epoxy resin, a silicone-modified epoxy resin, and a naphthalene type epoxy resin are preferable. More preferred are liquid bisphenol A type epoxy resin, liquid bisphenol F type epoxy resin, p-aminophenol type liquid epoxy resin, and 1,3-bis (3-glycidoxypropyl) tetramethyldisiloxane.
  • the liquid epoxy resin as a component may be individual or may be used together 2 or more types. Moreover, even if it is an epoxy resin solid at normal temperature, it can be used when it shows liquid as a mixture by using together with a liquid epoxy resin.
  • the component is a curing agent for the epoxy resin of component (a).
  • the storage stability at room temperature, the fluidity when used as an underfill material, excellent curability, and the balance of physical properties of the cured product Therefore, as an epoxy resin curing agent, an acid anhydride curing agent or A phenolic curing agent is used.
  • acid anhydride curing agents include phthalic anhydride, methylhexahydrophthalic anhydride, methyltetrahydrophthalic anhydride, maleic anhydride, dodecenyl succinic anhydride, trimellitic anhydride, benzophenone tetracarbanoic acid dianhydride Tetrahydrophthalic anhydride, hexahydrophthalic anhydride, 3,4-dimethyl-6- (2-methyl-1-propenyl) -4-cyclohexene-1,2-dicarboxylic anhydride, 1-isopropyl-4-methylbicyclo [2.2.2] Oct-5-ene-2,3-dicarboxylic anhydride.
  • methylhexahydrophthalic anhydride, methyltetrahydrophthalic anhydride, 3,4-dimethyl-6- (2-methyl-1-propenyl) -4-cyclohexene-1,2-dicarboxylic anhydride, 1- Isopropyl-4-methylbicyclo [2.2.2] oct-5-ene-2,3-dicarboxylic anhydride and mixtures thereof are preferred.
  • Specific examples of the phenolic curing agent include monomers, oligomers, and polymers in general having a phenolic hydroxyl group.
  • phenol novolak resins and alkylated products or allylated products thereof cresol novolak resins, phenol aralkyls (including phenylene and biphenylene skeletons) ) Resin, naphthol aralkyl resin, triphenol methane resin, dicyclopentadiene type phenol resin and the like.
  • allylphenol novolac resins are preferable because the viscosity of the composition can be reduced.
  • any 1 type may be used among said hardening
  • curing agent as (b) component can be suitably selected according to the characteristic requested
  • An acid anhydride-based curing agent is excellent in injectability when used as an underfill material because it is easy to lower the viscosity of the composition.
  • the phenolic curing material can obtain a cured product with low stress.
  • the content of the curing agent as the component (b) is determined by an equivalent ratio with respect to the epoxy group contained in the liquid epoxy resin as the component (a).
  • the curing agent is preferably 0.6 to 1.2 equivalents, preferably 0.7 to 1.0 equivalents per equivalent of epoxy group of the liquid epoxy resin of component (a). It is more preferable that In the case of a phenolic curing agent, the curing agent is preferably 0.6 to 1.2 equivalents, preferably 0.7 to 1.1 equivalents per 1 equivalent of epoxy group of the liquid epoxy resin of component (a). It is more preferable.
  • the total of the equivalents of the individual curing agents is 0.6 to 1.2 equivalents relative to 1 equivalent of the epoxy group of the liquid epoxy resin. It is preferably 0.7 to 1.1 equivalents.
  • an epoxy resin is used in order to obtain a one-pack type epoxy resin composition having fast curability and high stability in the middle temperature range of 60 ° C to 120 ° C.
  • a latent curing accelerator is used as the curing accelerator.
  • the latent curing accelerator as the component (c) is solid at room temperature because of excellent storage stability at room temperature.
  • the component (c) is not particularly limited as long as it is a latent curing accelerator for an epoxy resin, and a known one can be used, but a microcapsule type latent curing accelerator or an amine adduct type latent curing can be used.
  • the agent is preferable because a composition having excellent stability in the middle temperature range of 60 ° C. to 120 ° C. can be obtained by combination with the component (d).
  • the microcapsule-type latent curing accelerator is an amine compound having a primary, secondary, or tertiary amino group, or an amine adduct compound obtained by a reaction between these amine compounds and an epoxy resin.
  • an amine compound an imidazole derivative is preferable because it is a curing accelerator having a structure covered with a shell made of a synthetic resin or an inorganic oxide.
  • imidazole derivatives include 2-methylimidazole, 2-phenylimidazole, 2-phenyl-4-methylimidazole, 2-phenyl-4,5-dihydroxymethylimidazole, 2-phenyl-4-methyl-5-hydroxymethyl. Mention may be made of imidazole.
  • Examples of the synthetic resin to be a shell include phenol resin, melamine resin, epoxy resin, urethane resin, and urea resin, and these resins can be used in combination.
  • Examples of the inorganic oxide serving as the shell include silica, alumina, titania, and magnesia. Specific examples include NOVACURE manufactured by Asahi Kasei E-Materials Co., Ltd., in which a latent curing accelerator obtained by coating an imidazole derivative with a reaction product such as an epoxy resin is dispersed in a liquid epoxy resin. -3721, HX-3742, HX-3088, HX-3921, HX-3941 (all are trade names) and the like.
  • the amine adduct type latent curing accelerator is a reaction product of an amine compound having a primary, secondary or tertiary amino group and an epoxy resin (amine-epoxy adduct system), an amine compound and an isocyanate compound, or A reaction product with a urea compound (urea type adduct system), and further, those obtained by treating the surface of these curing agents with an isocyanate compound or an acidic compound.
  • an imidazole derivative is preferable, and specifically, an amine-epoxy adduct type Amicure PN-23 manufactured by Ajinomoto Fine Techno Co., Amicure PN-40, and an amine-urea adduct type Fuji Cure Industry Fujicure FX. -1000, FXR-1121 (both are trade names), etc.
  • the latent curing accelerator as the component (c) is preferably 0.5 to 60 parts by mass and preferably 5 to 50 parts by mass with respect to 100 parts by mass of the liquid epoxy resin as the component (a). Is more preferable.
  • HIPA 5-hydroxyisophthalic acid
  • NIPA 5-nitroisophthalic acid
  • BTCA 1,3,5-benzenetricarboxylic acid
  • 5 as component (d) -Hydroxyisophthalic acid, 5-nitroisophthalic acid, 1,3,5-benzenetricarboxylic acid or a mixture thereof is a component that improves the stability in the middle temperature range of 60 ° C to 120 ° C of the one-pack type epoxy resin composition. is there.
  • an imidazole dissolved in a solvent such as methanol in advance and an isophthalic acid compound dissolved in the solvent are heated and reacted to form an inclusion compound as a curing catalyst (curing accelerator).
  • a curing catalyst curing catalyst
  • Patent Document 3 by using an inclusion complex of 5-hydroxyisophthalic acid and 2-ethyl-4-methylimidazole as a curing agent or curing accelerator for an epoxy resin, the storage stability is improved, the fluidity of the sealing material at the time of sealing is maintained, and an efficient curing rate of the sealing material by heat can be realized.
  • Patent Documents 2 and 3 both improve the stability of the curing accelerator by forming an inclusion compound (or inclusion complex) with imidazole as a curing accelerator and an isophthalic acid compound.
  • an inclusion compound or inclusion complex
  • the clathrate dissociates during heating and a rapid curing reaction occurs.
  • the clathrate compound or clathrate complex
  • the clathrate is dissociated during heating. Since it becomes difficult, gel time becomes long and quick curability is impaired. Therefore, it is not possible to achieve both fast curability at 150 ° C. or higher and stability in the middle temperature range of 60 ° C. to 120 ° C.
  • a latent curing accelerator is used as the component (c), and HIPA, NIPA, BTCA or a mixture thereof is used as the component (d). It is possible to achieve both fast curability at 150 ° C. or higher and stability in the middle temperature range of 60 ° C. to 120 ° C.
  • a latent curing accelerator as component and (d) HIPA, NIPA, BTCA or a mixture thereof as component include an inclusion compound (or an inclusion compound). It is considered that no complex is formed.
  • the latent curing accelerator as component and (d) HIPA, NIPA, BTCA or a mixture thereof as component do not form an inclusion compound (or inclusion complex). Even if the content of HIPA, NIPA, BTCA or a mixture thereof as a component is a small amount as will be described later, it can be estimated that the intended effect is exhibited.
  • the latent curing accelerator as the component (c) and HIPA, NIPA, BTCA, or a mixture thereof as the component (d) do not form an inclusion compound (or inclusion complex)
  • the latent curing accelerator as the component c) is a microcapsule type latent curing accelerator, it is considered that the reason is that the curing accelerator component is covered with the coating layer.
  • the latent curing accelerator as the component (c) is an amine adduct type latent curing accelerator, it is considered that the reason is that the curing accelerator component has already reacted.
  • the latent curing accelerator as the component (c) and HIPA, NIPA, BTCA or a mixture thereof as the component (d) the one-pack type epoxy resin composition can be stored at room temperature. Stability is also improved.
  • the mass ratio of the two ((d) / (c)) is smaller than 0.01, the content of HIPA, NIPA or a mixture thereof as component (d) is latent curable as component (c).
  • the content of the accelerator is small, the effect of adding HIPA, NIPA, BTCA or a mixture thereof as the component (d) is not sufficiently exhibited, and the one-pack type epoxy resin composition has a temperature of 60 ° C. to 120 ° C. There is a risk that the stability in the middle temperature range will be reduced. Moreover, there exists a possibility that the storage stability at normal temperature of a one-pack type epoxy resin composition may fall. On the other hand, when the mass ratio ((d) / (c)) of both is greater than 5, the content of HIPA, NIPA, BTCA as a component (d) or a mixture thereof is a potential as a component (c).
  • the mass ratio ((d) / (c)) of the two is more preferably 0.012 to 1.5, and preferably 0.015 to 0.8. Is more preferable.
  • (E) Component Inorganic Filler
  • an inorganic filler As the (e) component, it is preferable to contain an inorganic filler as the (e) component.
  • an inorganic filler By containing an inorganic filler as a component, when the one-pack type epoxy resin composition of the present invention is used as an underfill material, the moisture resistance and thermal cycle resistance of the sealed portion, Thermal cycle performance is improved. The reason why the thermal cycle resistance is improved by using the inorganic filler is that the expansion / contraction of the cured product of the underfill material due to the thermal cycle can be suppressed by lowering the linear expansion coefficient.
  • the inorganic filler is not particularly limited as long as it has an effect of lowering the linear expansion coefficient by addition, and various inorganic fillers can be used. Specific examples include amorphous silica, crystalline silica, alumina, boron nitride, aluminum nitride, silicon nitride, and the like. Among these, silica, particularly amorphous spherical silica, is excellent in fluidity when the one-part epoxy resin composition of the present invention is used as an underfill material, and can reduce the linear expansion coefficient of the cured product. desirable.
  • the silica said here may have an organic group derived from a manufacturing raw material, for example, alkyl groups, such as a methyl group and an ethyl group.
  • the amorphous spherical silica is preferably colloidal silica from the viewpoint of ease of production.
  • a silica-containing composition obtained by the production method described in JP 2007-1976655 A may be used as the silica used as the inorganic filler.
  • the inorganic filler may be one that has been surface-treated with a silane coupling agent or the like. When an inorganic filler that has been subjected to surface treatment is used, an effect of preventing aggregation of the inorganic filler is expected. Thereby, the improvement of the storage stability of the one-pack type epoxy resin composition of the present invention is expected.
  • the inorganic filler as the component (e) preferably has an average particle size of 0.01 to 20 ⁇ m, more preferably 0.1 to 5 ⁇ m.
  • the shape of the inorganic filler is not particularly limited, and may be any shape such as a spherical shape, an indeterminate shape, and a flake shape.
  • the average particle diameter of the inorganic filler means the average maximum diameter of the inorganic filler.
  • the content of the inorganic filler in the one-pack type epoxy resin composition of the present invention is preferably 30 to 80% by mass.
  • the content of the inorganic filler referred to here is, in addition to the components (a) to (d), the mass% based on the total amount of the one-component epoxy resin composition-containing component of the present invention, including any components described later. It is.
  • the content of the inorganic filler is less than 30% by mass, the effect of lowering the linear expansion coefficient due to the addition of the inorganic filler is insufficient, and the one-pack type epoxy resin composition of the present invention is used as an underfill material In addition, the effect of improving the thermal cycle resistance may be insufficient.
  • the coating property when the one-pack type epoxy resin composition of the present invention is used as a pre-feed type underfill material, and the post-feed type underfill material are used.
  • the filling property into the gap and the electrical connectivity will be lowered.
  • the one-pack type epoxy resin composition of the present invention may further contain components other than the components (a) to (e) as necessary.
  • a leveling agent, a colorant, an ion trapping agent, an antifoaming agent, a flame retardant, and the like can be blended.
  • the type and amount of each compounding agent are as usual.
  • thermosetting resins such as oxetane, acrylate, bismaleimide, thermoplastic resins, elastomers, and the like may be blended.
  • the one-pack type epoxy resin composition of the present invention is prepared by mixing and stirring the above components (a) to (e) and other compounding agents to be blended as necessary. Although mixing and stirring can be performed using a roll mill, of course, it is not limited to this. Even if the components are mixed at the same time, some components may be mixed first, and the remaining components may be mixed later.
  • the one-pack type epoxy resin composition of the present invention has the following characteristics, it is suitable for both a pre-feed type underfill material and a post-feed type underfill material.
  • the one-pack type epoxy resin composition of the present invention has an initial viscosity, specifically, a viscosity at 25 ° C. of 0.5 to 200 Pa ⁇ s. Since the one-component epoxy resin composition of the present invention has an initial viscosity in the above range, the rheometer viscosity double-thickening time measured by the procedure described in the examples described later is 20 min or more.
  • the stability in the middle temperature range of 60 ° C. to 120 ° C. is good, and the workability when used as an underfill material of a pre-feed type and a post-feed type is good.
  • the one-pack type epoxy resin composition of the present invention has good storage stability at room temperature and is excellent in pot life. Specifically, the rate of increase in viscosity after being left for 24 hours in an environment of 25 ° C. and 50% humidity is 1.5 times or less.
  • the one-component epoxy resin composition of the present invention is excellent in rapid curability and can be cured by heating at a temperature of 150 to 200 ° C. for 3 seconds to 2 hours.
  • the one-pack type epoxy resin composition of the present invention preferably has a gel time of 5 minutes or less as measured by the procedure described in the examples described later.
  • the underfill material of the present invention is composed of the one-pack type epoxy resin composition of the present invention. Next, a method for using the underfill material of the present invention will be described.
  • the underfill material of the present invention is used as a pre-feed type underfill material or a post-feed type underfill material when manufacturing a semiconductor device in which a semiconductor chip is mounted on a wiring board by a flip chip bonding method.
  • a semiconductor device When used as a pre-feed type underfill material, a semiconductor device is manufactured according to the procedure of the compression flow.
  • the wiring board In the compression flow, the wiring board is first heated and held at 60 ° C. to 120 ° C. This is for heating the wiring board to a temperature suitable for application of the underfill material in order to apply the underfill material to the portion to be reinforced with the underfill material (specifically, the electrode portion on the substrate and its periphery).
  • an underfill material is applied on the wiring board. Specifically, the underfill material is applied (dispensed) to a portion (specifically, the electrode portion on the substrate and its periphery) that is reinforced with the underfill material on the substrate using a flip chip bonder device.
  • the semiconductor chip is aligned and pressed against the portion where the underfill is applied.
  • the wiring board is heated to 200 ° C. to 300 ° C. Thereby, an underfill material will be in a semi-hardened state.
  • a post cure process is performed. Specifically, the wiring board is heated to 150 to 200 ° C. to cure the underfill.
  • a semiconductor device When used as a post-feed type underfill material, a semiconductor device is manufactured according to a capillary flow procedure.
  • capillary flow first, a semiconductor chip is connected to a wiring board. Specifically, the electrode part provided on the wiring board and the bump electrode of the semiconductor chip are connected. For example, when soldering both, the flux electrode is applied to the electrode part provided on the wiring board, the bump electrode of the semiconductor chip, or both, and then the bump electrode is applied to the electrode part.
  • the semiconductor element is temporarily placed on the substrate so as to be positioned, and then the substrate is heated to melt the solder, thereby connecting the electrode portion and the bump electrode.
  • the wiring board is heated and held at 60 ° C. to 120 ° C.
  • an underfill material is applied (dispensed) along the outer periphery of the semiconductor chip, and the gap between the two is filled with the underfill material using a capillary phenomenon.
  • the wiring substrate is heated to 150 to 200 ° C. to cure the underfill.
  • Examples 1 to 11, Comparative Examples 1 to 10 The components shown in the table below were weighed out in the amounts (parts by mass) shown in the table, and the mixture obtained by mixing the components was kneaded with a three roll mill to obtain a uniform one-pack type epoxy resin composition.
  • surface represents the following, respectively.
  • Liquid epoxy resin (a1) Naphthalene type epoxy resin (epoxy equivalent 140 g / Eq)
  • Liquid epoxy resin (a2) Bisphenol F type epoxy resin (epoxy equivalent 160 g / Eq)
  • the curability and injectability of the one-pack type epoxy resin composition obtained by the above procedure, the appearance of the cured product of the liquid sealing material, and the thermal cycle resistance were evaluated by the following methods.
  • Example 9 even when a phenolic curing agent is used as the component (b), the intended effect can be exhibited. Further, as shown in Examples 10 and 11, even when BTCA is used as the component (d), the intended effect can be exhibited. In Comparative Examples 1 to 3 and 6 in which the component (d) was not contained, the evaluation results of the rheometer viscosity doubled thickening time were inferior. Further, as apparent from the comparison between Examples 4 and 11 and Comparative Example 1, by containing HIPA or BTCA as the component (d), stability in the middle temperature range of 60 to 100 ° C., particularly 80 Stability in the middle temperature range of ⁇ 90 ° C has been improved.
  • Comparative Examples 4 and 5 using an inclusion compound of HIPA or NIPA and imidazole instead of the components (c) and (d) had a medium temperature compared to Comparative Example 1 containing no component (d). Although the stability of the area has improved, the fast curability has decreased accordingly.
  • (D) In place of component, compounds having structures similar to HIPA and NIPA (Comparative Examples 7 to 10 using 5-aminoisophthalic acid, dimethyl isophthalate, dimethyl 5-hydroxyisophthalate, and p-toluic acid are all used. The evaluation result of the rheometer viscosity double thickening time was inferior.

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Abstract

La présente invention concerne une composition de résine époxy de type en un paquet qui conserve une capacité de durcissement rapide à 150°C ou plus, et montre une stabilité élevée à une gamme de températures intermédiaires de 60-120°C. La présente invention concerne une composition de résine époxy de type en un paquet contenant : (a) une résine époxy liquide ; (b) un agent de durcissement d'anhydride d'acide ou un agent de durcissement phénolique ; (c) un accélérateur de durcissement latent ; et (d) de l'acide 5‑hydroxyisophtalique, de l'acide 5-nitroisophtalique et de l'acide 1,3,5-benzènetricarboxylique ou un mélange de ceux-ci.
PCT/JP2012/078109 2011-11-29 2012-10-31 Composition de résine époxy de type en un paquet WO2013080732A1 (fr)

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JP2013547072A JP5938417B2 (ja) 2011-11-29 2012-10-31 一液型エポキシ樹脂組成物

Applications Claiming Priority (2)

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WO2016060088A1 (fr) * 2014-10-14 2016-04-21 三菱化学株式会社 Composition de charge intercouche pour dispositif semi-conducteur, et procédé de fabrication de dispositif semi-conducteur
JP2018203967A (ja) * 2017-06-09 2018-12-27 信越化学工業株式会社 熱硬化性エポキシ樹脂組成物
JPWO2019163818A1 (ja) * 2018-02-21 2021-02-04 ナミックス株式会社 エポキシ樹脂組成物
WO2023090317A1 (fr) * 2021-11-19 2023-05-25 ナミックス株式会社 Composition de résine durcissable

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JP2010171118A (ja) * 2009-01-21 2010-08-05 Panasonic Electric Works Co Ltd 実装部品の表面実装方法、その方法を用いて得られる実装部品構造体、及びその方法に用いられるアンダーフィル用液状エポキシ樹脂組成物
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JP2014114426A (ja) * 2012-12-12 2014-06-26 Panasonic Corp 半導体封止用エポキシ樹脂組成物とそれを用いたパワーモジュール
WO2016060088A1 (fr) * 2014-10-14 2016-04-21 三菱化学株式会社 Composition de charge intercouche pour dispositif semi-conducteur, et procédé de fabrication de dispositif semi-conducteur
JP2018203967A (ja) * 2017-06-09 2018-12-27 信越化学工業株式会社 熱硬化性エポキシ樹脂組成物
JPWO2019163818A1 (ja) * 2018-02-21 2021-02-04 ナミックス株式会社 エポキシ樹脂組成物
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WO2023090317A1 (fr) * 2021-11-19 2023-05-25 ナミックス株式会社 Composition de résine durcissable

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