WO2013075591A1 - 阵列基板及其制作方法、显示装置 - Google Patents
阵列基板及其制作方法、显示装置 Download PDFInfo
- Publication number
- WO2013075591A1 WO2013075591A1 PCT/CN2012/084404 CN2012084404W WO2013075591A1 WO 2013075591 A1 WO2013075591 A1 WO 2013075591A1 CN 2012084404 W CN2012084404 W CN 2012084404W WO 2013075591 A1 WO2013075591 A1 WO 2013075591A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- electrode
- strip electrodes
- layer
- array substrate
- adjacent strip
- Prior art date
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 94
- 238000000034 method Methods 0.000 title claims abstract description 49
- 230000008569 process Effects 0.000 claims abstract description 38
- 238000002161 passivation Methods 0.000 claims abstract description 27
- 238000005530 etching Methods 0.000 claims abstract description 20
- 238000004380 ashing Methods 0.000 claims abstract description 10
- 238000009413 insulation Methods 0.000 claims abstract 3
- 229920002120 photoresistant polymer Polymers 0.000 claims description 24
- 238000004519 manufacturing process Methods 0.000 claims description 17
- 238000000151 deposition Methods 0.000 claims description 6
- 239000004973 liquid crystal related substance Substances 0.000 description 31
- 239000010408 film Substances 0.000 description 18
- 229910021417 amorphous silicon Inorganic materials 0.000 description 13
- 238000002834 transmittance Methods 0.000 description 11
- 230000005684 electric field Effects 0.000 description 5
- 238000000059 patterning Methods 0.000 description 4
- 239000010409 thin film Substances 0.000 description 4
- 210000002858 crystal cell Anatomy 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 230000008859 change Effects 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 238000002845 discoloration Methods 0.000 description 2
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 2
- NPXOKRUENSOPAO-UHFFFAOYSA-N Raney nickel Chemical class [Al].[Ni] NPXOKRUENSOPAO-UHFFFAOYSA-N 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 238000004088 simulation Methods 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/124—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition, shape or layout of the wiring layers specially adapted to the circuit arrangement, e.g. scanning lines in LCD pixel circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/1259—Multistep manufacturing methods
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/1259—Multistep manufacturing methods
- H01L27/1288—Multistep manufacturing methods employing particular masking sequences or specially adapted masks, e.g. half-tone mask
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
- G02F1/1362—Active matrix addressed cells
- G02F1/136227—Through-hole connection of the pixel electrode to the active element through an insulation layer
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
- G02F1/1362—Active matrix addressed cells
- G02F1/136231—Active matrix addressed cells for reducing the number of lithographic steps
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Liquid Crystal (AREA)
- Thin Film Transistor (AREA)
Abstract
Description
Claims
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US13/806,182 US9147697B2 (en) | 2011-11-24 | 2012-11-09 | Manufacturing method of array substrate, array substrate, and display apparatus |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201110379466.3 | 2011-11-24 | ||
CN2011103794663A CN102629587A (zh) | 2011-11-24 | 2011-11-24 | 阵列基板及其制作方法、显示装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2013075591A1 true WO2013075591A1 (zh) | 2013-05-30 |
Family
ID=46587815
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/CN2012/084404 WO2013075591A1 (zh) | 2011-11-24 | 2012-11-09 | 阵列基板及其制作方法、显示装置 |
Country Status (3)
Country | Link |
---|---|
US (1) | US9147697B2 (zh) |
CN (1) | CN102629587A (zh) |
WO (1) | WO2013075591A1 (zh) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102629587A (zh) | 2011-11-24 | 2012-08-08 | 京东方科技集团股份有限公司 | 阵列基板及其制作方法、显示装置 |
CN103018978B (zh) * | 2012-12-14 | 2016-08-17 | 京东方科技集团股份有限公司 | 一种液晶面板及显示装置 |
CN104419930B (zh) * | 2013-08-27 | 2018-03-27 | 东友精细化工有限公司 | 蚀刻液组合物及液晶显示装置用阵列基板的制造方法 |
CN103488008B (zh) * | 2013-10-09 | 2017-02-01 | 京东方科技集团股份有限公司 | 阵列基板及其驱动方法、显示装置 |
CN103972075A (zh) * | 2014-05-05 | 2014-08-06 | 京东方科技集团股份有限公司 | 一种刻蚀方法和阵列基板 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20070001961A1 (en) * | 2005-06-30 | 2007-01-04 | Lg.Philips Lcd Co., Ltd. | Method of forming fine pattern, liquid crystal display device having a fine pattern and fabricating method thereof |
CN101276106A (zh) * | 2007-03-28 | 2008-10-01 | Lg.菲利浦Lcd株式会社 | 共平面开关模式液晶显示面板及其制造方法 |
CN101290937A (zh) * | 2007-04-19 | 2008-10-22 | 乐金显示有限公司 | 显示器件及其制造方法 |
CN101656230A (zh) * | 2008-08-21 | 2010-02-24 | 乐金显示有限公司 | 制造薄膜晶体管阵列基板的方法 |
CN102087450A (zh) * | 2009-12-07 | 2011-06-08 | 乐金显示有限公司 | 制造液晶显示装置的方法 |
CN102629587A (zh) * | 2011-11-24 | 2012-08-08 | 京东方科技集团股份有限公司 | 阵列基板及其制作方法、显示装置 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100857719B1 (ko) * | 2001-03-26 | 2008-09-08 | 엘지디스플레이 주식회사 | 액정표시장치 및 그 제조방법 |
TW588171B (en) * | 2001-10-12 | 2004-05-21 | Fujitsu Display Tech | Liquid crystal display device |
KR20060133670A (ko) * | 2005-06-21 | 2006-12-27 | 삼성전자주식회사 | 발광 소자 및 이의 제조 방법과, 이를 구비한 표시 기판 |
KR101281756B1 (ko) * | 2006-10-18 | 2013-07-04 | 삼성디스플레이 주식회사 | 액정 표시 장치의 제조 방법 및 이 방법으로 제조된 액정표시 장치 |
KR101278477B1 (ko) * | 2006-11-07 | 2013-06-24 | 삼성디스플레이 주식회사 | 박막 트랜지스터 기판의 제조 방법 |
US8125603B2 (en) * | 2007-05-17 | 2012-02-28 | Lg Display Co., Ltd. | In-plane switching mode liquid crystal display device and method for fabricating the same |
KR101159399B1 (ko) * | 2009-02-18 | 2012-06-28 | 엘지디스플레이 주식회사 | 박막트랜지스터 어레이기판 및 그의 제조방법 |
KR20130017034A (ko) * | 2011-08-09 | 2013-02-19 | 엘지디스플레이 주식회사 | 박막트랜지스터 어레이 기판 및 그 제조방법 |
-
2011
- 2011-11-24 CN CN2011103794663A patent/CN102629587A/zh active Pending
-
2012
- 2012-11-09 US US13/806,182 patent/US9147697B2/en active Active
- 2012-11-09 WO PCT/CN2012/084404 patent/WO2013075591A1/zh active Application Filing
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20070001961A1 (en) * | 2005-06-30 | 2007-01-04 | Lg.Philips Lcd Co., Ltd. | Method of forming fine pattern, liquid crystal display device having a fine pattern and fabricating method thereof |
CN101276106A (zh) * | 2007-03-28 | 2008-10-01 | Lg.菲利浦Lcd株式会社 | 共平面开关模式液晶显示面板及其制造方法 |
CN101290937A (zh) * | 2007-04-19 | 2008-10-22 | 乐金显示有限公司 | 显示器件及其制造方法 |
CN101656230A (zh) * | 2008-08-21 | 2010-02-24 | 乐金显示有限公司 | 制造薄膜晶体管阵列基板的方法 |
CN102087450A (zh) * | 2009-12-07 | 2011-06-08 | 乐金显示有限公司 | 制造液晶显示装置的方法 |
CN102629587A (zh) * | 2011-11-24 | 2012-08-08 | 京东方科技集团股份有限公司 | 阵列基板及其制作方法、显示装置 |
Also Published As
Publication number | Publication date |
---|---|
US9147697B2 (en) | 2015-09-29 |
CN102629587A (zh) | 2012-08-08 |
US20140054626A1 (en) | 2014-02-27 |
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