Classifications

• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
  • B23K1/00—Soldering, e.g. brazing, or unsoldering
  • B23K1/19—Soldering, e.g. brazing, or unsoldering taking account of the properties of the materials to be soldered
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
  • H01J35/00—X-ray tubes
  • H01J35/02—Details
  • H01J35/04—Electrodes ; Mutual position thereof; Constructional adaptations therefor
  • H01J35/08—Anodes; Anti cathodes
  • H01J35/10—Rotary anodes; Arrangements for rotating anodes; Cooling rotary anodes
  • H01J35/108—Substrates for and bonding of emissive target, e.g. composite structures
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
  • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
  • B23K35/001—Interlayers, transition pieces for metallurgical bonding of workpieces
  • B23K35/005—Interlayers, transition pieces for metallurgical bonding of workpieces at least one of the workpieces being of a refractory metal
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
  • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
  • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
  • B23K35/24—Selection of soldering or welding materials proper
  • B23K35/32—Selection of soldering or welding materials proper with the principal constituent melting at more than 1550 degrees C
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
  • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
  • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
  • B23K35/24—Selection of soldering or welding materials proper
  • B23K35/32—Selection of soldering or welding materials proper with the principal constituent melting at more than 1550 degrees C
  • B23K35/325—Ti as the principal constituent
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  • C04B37/00—Joining burned ceramic articles with other burned ceramic articles or other articles by heating
  • C04B37/02—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles
  • C04B37/023—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles characterised by the interlayer used
  • C04B37/026—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles characterised by the interlayer used consisting of metals or metal salts
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
  • H01J1/00—Details of electrodes, of magnetic control means, of screens, or of the mounting or spacing thereof, common to two or more basic types of discharge tubes or lamps
  • H01J1/02—Main electrodes
  • H01J1/36—Solid anodes; Solid auxiliary anodes for maintaining a discharge
  • H01J1/44—Rotary anodes; Arrangements for rotating anodes; Cooling rotary anodes
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
  • H01J35/00—X-ray tubes
  • H01J35/02—Details
  • H01J35/04—Electrodes ; Mutual position thereof; Constructional adaptations therefor
  • H01J35/08—Anodes; Anti cathodes
  • H01J35/10—Rotary anodes; Arrangements for rotating anodes; Cooling rotary anodes
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
  • B23K1/00—Soldering, e.g. brazing, or unsoldering
  • B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
  • B23K2103/00—Materials to be soldered, welded or cut
  • B23K2103/16—Composite materials, e.g. fibre reinforced
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  • C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
  • C04B2235/65—Aspects relating to heat treatments of ceramic bodies such as green ceramics or pre-sintered ceramics, e.g. burning, sintering or melting processes
  • C04B2235/656—Aspects relating to heat treatments of ceramic bodies such as green ceramics or pre-sintered ceramics, e.g. burning, sintering or melting processes characterised by specific heating conditions during heat treatment
  • C04B2235/6562—Heating rate
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  • C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
  • C04B2235/65—Aspects relating to heat treatments of ceramic bodies such as green ceramics or pre-sintered ceramics, e.g. burning, sintering or melting processes
  • C04B2235/658—Atmosphere during thermal treatment
  • C04B2235/6581—Total pressure below 1 atmosphere, e.g. vacuum
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  • C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
  • C04B2235/65—Aspects relating to heat treatments of ceramic bodies such as green ceramics or pre-sintered ceramics, e.g. burning, sintering or melting processes
  • C04B2235/66—Specific sintering techniques, e.g. centrifugal sintering
  • C04B2235/661—Multi-step sintering
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  • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
  • C04B2237/02—Aspects relating to interlayers, e.g. used to join ceramic articles with other articles by heating
  • C04B2237/12—Metallic interlayers
  • C04B2237/122—Metallic interlayers based on refractory metals
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  • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
  • C04B2237/02—Aspects relating to interlayers, e.g. used to join ceramic articles with other articles by heating
  • C04B2237/12—Metallic interlayers
  • C04B2237/126—Metallic interlayers wherein the active component for bonding is not the largest fraction of the interlayer
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  • C04B2237/12—Metallic interlayers
  • C04B2237/126—Metallic interlayers wherein the active component for bonding is not the largest fraction of the interlayer
  • C04B2237/127—The active component for bonding being a refractory metal
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  • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
  • C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
  • C04B2237/32—Ceramic
  • C04B2237/36—Non-oxidic
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  • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
  • C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
  • C04B2237/32—Ceramic
  • C04B2237/36—Non-oxidic
  • C04B2237/363—Carbon
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  • C04B2237/32—Ceramic
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  • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
  • C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
  • C04B2237/32—Ceramic
  • C04B2237/36—Non-oxidic
  • C04B2237/366—Aluminium nitride
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  • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
  • C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
  • C04B2237/32—Ceramic
  • C04B2237/36—Non-oxidic
  • C04B2237/368—Silicon nitride
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  • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
  • C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
  • C04B2237/32—Ceramic
  • C04B2237/38—Fiber or whisker reinforced
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  • C04B2237/38—Fiber or whisker reinforced
  • C04B2237/385—Carbon or carbon composite
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  • C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
  • C04B2237/40—Metallic
  • C04B2237/403—Refractory metals
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  • C04B2237/50—Processing aspects relating to ceramic laminates or to the joining of ceramic articles with other articles by heating
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  • C04B2237/50—Processing aspects relating to ceramic laminates or to the joining of ceramic articles with other articles by heating
  • C04B2237/55—Pre-treatments of a coated or not coated substrate other than oxidation treatment in order to form an active joining layer
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  • C04B2237/62—Forming laminates or joined articles comprising holes, channels or other types of openings
• • C—CHEMISTRY; METALLURGY
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  • C04B2237/50—Processing aspects relating to ceramic laminates or to the joining of ceramic articles with other articles by heating
  • C04B2237/70—Forming laminates or joined articles comprising layers of a specific, unusual thickness
  • C04B2237/708—Forming laminates or joined articles comprising layers of a specific, unusual thickness of one or more of the interlayers
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  • C04B2237/50—Processing aspects relating to ceramic laminates or to the joining of ceramic articles with other articles by heating
  • C04B2237/72—Forming laminates or joined articles comprising at least two interlayers directly next to each other
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
  • H01J1/00—Details of electrodes, of magnetic control means, of screens, or of the mounting or spacing thereof, common to two or more basic types of discharge tubes or lamps
  • H01J1/02—Main electrodes
  • H01J1/36—Solid anodes; Solid auxiliary anodes for maintaining a discharge
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
  • H01J2235/00—X-ray tubes
  • H01J2235/08—Targets (anodes) and X-ray converters
  • H01J2235/083—Bonding or fixing with the support or substrate

Definitions

• the present invention relates to a method for producing a high-temperature-resistant composite body and to a high-temperature-resistant composite body, in which a first, non-metallic portion is connected via a solder joint layer to a second, metallic portion made of Mo, a Mo-based alloy, W or a W based alloy is connected.
• Such high-temperature-resistant composite bodies are to be provided in particular in the context of the production of x-ray rotary anodes.
• X-ray anodes are used in X-ray tubes to generate X-rays.
• X-ray devices with such X-ray rotary anodes are used in particular in the medical field in diagnostic imaging.
• electrons are emitted from a cathode of the x-ray tube and accelerated in the form of a focused electron beam onto the rotated x-ray rotating anode.
• Much of the energy of the electron beam is converted into heat in the X-ray rotary anode, while a small portion is emitted as X-radiation.
• the rotation of the X-ray rotary anode counteracts local overheating.
• the base material of X-ray rotary anodes is generally formed from a refractory material, which should also have a good thermal conductivity for dissipating the heat. In addition, it should provide sufficient mechanical stability even at high temperatures and at high rotational speeds.
• Suitable materials for the base material are in particular molybdenum and molybdenum-based alloys (eg TZM, MHC), whereby tungsten or tungsten-based alloys are also possible.
• MHC refers to a molybdenum alloy which has an Hf content of 1.0 to 1.3 wt.% (Hf: hafnium), a C content of 0.05-0.12 wt.
• the X-ray rotors are to be designed for high radiation powers, due to the high temperatures, the high temperature gradients and the high mechanical loads (due to the high rotational speeds), particularly high demands are placed on the strength of the main body of the X-ray triodes the stability and the longevity of the compound of the same with the radiator set.
• US 2002/0085678 A1 describes a method for connecting a molybdenum alloy substrate with a graphite disk to an x-ray rotary anode, in which, in a first step, a molybdenum alloy sheet is soldered to the graphite disk with a pure metal solder and, in a second step, the plated graphite subassembly is submerged with the molybdenum alloy substrate
• a special solder alloy is soldered.
• a suitable solder alloy in particular, a Ti-Cr-Be alloy (titanium-chromium-beryllium alloy) and a Ti-Si alloy (titanium-silicon alloy) are described.
• US 2011/0103553 A1 describes a method for producing an X-ray anode, in which starting from a base material made of molybdenum or a molybdenum alloy to form a carbon base material, a first solder layer comprising an Nb-Ti alloy, having a second solder layer Nb or a Nb alloy and a third solder layer comprising Zr are arranged and this arrangement is soldered in one step at a temperature in the range of 1730 ° C to 1900 ° C.
• JP 2010-140879 A a method for producing an X-ray anode is described in which, starting from a base material made of molybdenum or a molybdenum alloy tion to a graphite base material towards a first solder layer of a Ta-Ti alloy, a second solder layer Ta or Ta alloy and a third Zr solder layer, and this assembly is soldered in one step at a temperature in the range of .750 ° C to .900 ° C.
• the second solder layer is provided in each case in order to avoid diffusion of Zr and Mo.
• the object of the present invention is to provide a high-temperature resistant composite body and a method of manufacturing such a high temperature-resistant composite body, wherein a first non-metallic portion is solder-bonded to a second metallic portion of Mo, a Mo-based alloy, W or a W-based alloy is connected, on the one hand, a thermal aging of the metallic portion is largely prevented and on the other hand, the solder joint high temperatures, high temperature gradients and withstand high mechanical stresses between the two sections.
• a method for producing a high temperature resistant composite by surface bonding a first, non-metallic portion via a solder joint layer with a second, metallic portion of Mo (Mo: molybdenum), a Mo-based alloy, W (W: tungsten ) or a W-based alloy.
• Mo molybdenum
• W tungsten
• the method has the following steps.
• the second solder is formed by exactly one material of the group Ti, Ti-based solder combination, V-based solder combination, Zr or Zr-based solder combination and is chosen such that this is in the second Order at a lower temperature than the first Zr solder melts, and
• the present invention further relates to a high-temperature-resistant composite body produced by the method according to the invention.
• a high-temperature-resistant composite body produced by the method according to the invention.
• the first Zr solder By using the first Zr solder, a good hold is achieved on the first non-metallic portion formed in particular of a carbon-based material (e.g., graphite).
• the intermediate layer of said materials Ta, Nb and / or W which has a high melting point and accordingly does not melt in both soldering steps, effectively prevents diffusion of elements across the intermediate layer.
• the first portion is formed of a carbon-based material
• diffusion of carbon into the second metallic portion e.g., Mo or Mo alloy
• the interlayer if the second metallic portion is formed of Mo or a Mo-based alloy, diffusion of Zr from the first Zr solder and Mo from the second portion and a eutectic are prevented due to diffusion is formed.
• the formation of such a eutectic with a comparatively low melting point is undesirable, in particular, in the case of composite bodies which are designed for high operating temperatures.
• the second soldering step may be performed at a lower temperature than the first soldering step.
• the claimed solder materials for the second solder have (on their own or in combination with the adjoining second portion) a low melting temperature and are particularly well suited to the production of a resilient connection of the intermediate layer with the second, metallic portion. Since the second, metallic section only at Performing the second soldering step (to a relatively low temperature) is heated, thermal aging of the second portion is largely avoided. This is particularly advantageous if the second section and / or a section fixedly connected thereto consist / consist of a formed material.
• the intermediate layer is at least 90 at.% Of Ta and / or Nb, in particular at least 90 at.% Of Ta alone or at least 90 at.% Nb alone. Because with these materials, the intermediate layer has elastic and partly plastic properties at the application temperatures and thus effectively compensates for stresses occurring between the two sections and, in some cases, cracks forming in the adjacent solder layers.
• the intermediate layer is at least 99 at.% Of Ta and / or Nb, more preferably at least 99 at.% Of exactly one element, i. from Ta alone or from Nb alone, trained. Nb is advantageous in terms of being cheaper and easier.
• the elastic plastic properties are particularly pronounced when the intermediate layer is formed substantially only from one element and with the highest possible purity. Conversely, by alloying in further elements (for example up to 10 at.%, In particular up to 5 at.%) A higher strength of the intermediate layer can be set in a targeted manner. If an intermediate layer of W (ie at least 90 at.%, In particular at least 99 at.%) Is used, this forms an effective diffusion barrier and is characterized by a high degree of strength, which is maintained to a high degree even at high operating temperatures remains.
• the method according to the invention is within the scope of the production of an x-ray rotary anode for connecting a metallic rotary anode Base body made of Mo, a Mo-based alloy (especially TZM or MHC), W or a W-based alloy with a non-metallic radiator, which is formed in particular of graphite, particularly well suited.
• a basic body of TZM or possibly another, Mo-based alloy, such as MHC
• a radiating body made of graphite made of graphite.
• the main body of the X-ray rotary anode consists of a C-based material (eg of a carbon fiber-reinforced carbon) or of a ceramic (eg silicon carbide (SiC) , Silicon nitride (Si 3 N 4 ), aluminum nitride (AIN), boron carbide (B 4 C), carbon fiber reinforced silicon carbide (C-SiC) or silicon carbide fiber-reinforced silicon carbide (SiC-SiC)) can be formed, and on this directly Brazing (of eg W or a W-based alloy, such as a tungsten-rhenium alloy) is soldered, for which connection, the soldering method according to the invention is also applicable.
• a C-based material eg of a carbon fiber-reinforced carbon
• a ceramic eg silicon carbide (SiC) , Silicon nitride (Si 3 N 4 ), aluminum nitride (AIN), boron carbide (B 4
• a metallic connecting portion of eg Mo or a Mo-based alloy, such as TZM or MHC
• the method according to the invention can also be used to connect such a non-metallic base body with other metallic connection partners, for example in the range of style.
• the method according to the invention is also generally applicable to X-ray anodes (eg, standing anodes), in which - depending on the design - a high-temperature-resistant connection of two sections of the corresponding materials may also be required.
• applications beyond the range of X-ray reverens also result in applications in which two sections of the respectively claimed materials are to be connected to one another by a high-temperature-resistant connection and, accordingly, the method according to the invention can be used.
• a Mo-based or W-based alloy refers to an alloy which has at least 50 at.% Mo or W, in particular at least 90 at.% Mo or W.
• the second metallic portion is formed of a Mo alloy, wherein TZM is a Mo alloy particularly well-established in the field of X-ray reactors.
• MHC is also widely used.
• a “surface bonding" is independent of whether the surfaces to be joined are flat or curved
• a “high-temperature-resistant composite body” refers to a composite body in which the solder joint in particular (locally prevailing at the solder joint) temperatures in the range from 1,000 to 1,600 ° C, wherein the first and / or the second section in use can also have higher temperatures (eg in the case of X-ray rotary anodes are up to 2,500 ° C usual in the field of the focal path).
• a Zr solder (both the first and the second solder) is referred to a solder which consists essentially, in particular at least 90 at.%, Of pure Zr.
• solders generally have a relatively high proportion of impurities or additives (eg Hf; H hafnium), which are typically in the range of up to 5 at.%. For example, an Hf content of 2.35 at.% Is customary.
• impurities or additives eg Hf; H hafnium
• solder combination refers both to the variant that the relevant elements are already present as an alloy or as a finely mixed paste (metal powder with liquid binder phase), and to the variant that the solder combination is formed by two or more films or individual layers of different composition, in particular by films o- or individual layers of the respective individual elements is formed.
• the (first as well as the second) solder may be applied inter alia as a film, as a metallic layer (applied by a coating process, eg, CVD, plasma spraying, etc.) or as a paste.
• a solder having a Ti, V, or Zr-based solder combination which has the relevant element Ti, V or Zr of at least 50 at.%.
• the second solder is formed from exactly one or at most two elements (apart from impurities or additives which can form a maximum proportion of 5 at.%).
• a Ti solder reference is made to a solder which consists essentially, in particular of at least 95 at.%, Of pure Ti.
• the second (and preferably the only other) component of the solder combination is preferably Ti. This achieves a relatively low melting point of the second solder combination.
• a material is selected which has a lower melting point than the first solder. As is known to the person skilled in the art, this can be determined on the basis of the binary or ternary phase diagrams.
• the second solder alone may also have a higher or the same melting point than the first solder, the lower melting point resulting only by the contact with the second section or possibly also by the investment in the intermediate layer, so that due to the diffusion taking place During soldering, a melting point depression occurs and the second solder melts from the side of the contact surface. This is the case, for example, for a Zr solder and for a Zr-based solder combination which forms a lower melting temperature eutectic with Mo (from the second section).
• the heating is performed only at a comparatively lower temperature and / or for a comparatively short duration so as to cause only the second solder, but not the first solder, to melt
• the first as well as the second section can also be sections of a respective larger component or an assembly.
• the solder composite layer according to the invention is preferably formed from exactly the three layers (first solder, intermediate layer, second solder). In principle, there is the possibility that even further layers are provided between the first and the second section.
• the maximum oven temperature reached in the second soldering step is at least 100 ° C. lower than that of the first
• Soldering step reached maximum oven temperature.
• the temperature difference is in a range between 200 ° C inclusive and 400 ° C inclusive, whereby this advantageous effect is enhanced. How high this temperature difference can be selected (or which minimum temperature must be set at the respective soldering step) depends on the solders used in each case.
• Maximum oven temperature refers to the maximum oven temperature reached (typically maintained for a period of 5-10 minutes) as it passes through the temperature profile, and according to one embodiment, the maximum oven temperature in the first soldering step is in the range of 1,800 inclusive C. to 2000 ° C., in particular in the range from 1,900 ° C.
• a maximum oven temperature in the range of from 1,550 ° C. to 1,720 ° C. inclusive, in particular in the range of 1,550 ° C. up to and including 1,650 ° C.
• maximum oven temperatures are in the range of 1,620 ° C. (+/- 10 ° C.), if appropriate also 1,550 ° C. (+ / -10 ° C.)
• this maximum oven temperature is also over a predetermined Zeitda and especially in a range of 3 to 20 minutes, preferably in a range of 5 to 10 minutes.
• the material of the second solder is chosen such that in the second arrangement it has a melting point in the range of from 1,550 ° C to 1,680 ° C inclusive, in particular in the range from 1,600 ° C (eg Ti-V solder combination) to 1,670 ° C (eg Ti solder). In this way, the temperature in the second soldering step can be selected to be correspondingly low and thermal aging of the second section is avoided.
• the melting point which results from the relevant solder composition is considered to be decisive, irrespective of how this solder combination is present (eg as an alloy, as a paste, as separate slides, etc.). Because even in the presence of separate films, it can be assumed that this composition range initially sets in at the interface due to diffusion effects and melts the solder combination from the interface. In addition, depending on the solder and depending on the material which adjoins the solder, melting point depression may also occur in the region of this interface due to diffusion effects. In particular, in the case of a Zr solder and a Zr-based solder combination, it must be taken into account that it forms a eutectic in combination with Mo. Accordingly, by planting the solder on a portion of Mo or a Mo-based alloy and by diffusion effects, a lower melting point (usually the melting point of the eutectic) than the melting point of the solder alone results.
• the second solder is formed by exactly one of the following solders:
• the binary solder combinations each have complete solubilities in the liquid state, which is advantageous for carrying out the soldering is. Furthermore, these solders are particularly well suited for reliable connection to the second, metallic section. These advantageous properties are achieved to a particular extent when the second solder is formed by a Ti-V solder combination. Because the binary system of Ti and V has a melting point minimum, so that a lower melting point than with pure Ti can be achieved. In particular, the Ti-V solder combination has a content of from 12 at.% Up to and including 50 at.% V and the remaining Ti content.
• the V content of the Ti-V solder combination is in a range of from 20 at.% Up to and including 40 at.%.
• Particularly preferred is a V-share on the Ti-V solder combination of exactly 31 at.% Or in a range around 31 at.% (Eg +/- 4 at.%), which corresponds to the melting point minimum of the binary system.
• the method according to the invention also makes it possible, after the intermediate layer has been joined to the first section, to postprocess the
• the surface of the intermediate layer of the part-composite body is mechanically and / or chemically processed after the first soldering step and before the second arrangement is produced, with mechanical machining in particular being preferred. This way, during the first soldering step and before the second arrangement is produced, with mechanical machining in particular being preferred. This way, during the first soldering step and before the second arrangement is produced, with mechanical machining in particular being preferred. This way, during the first soldering step and before the second arrangement is produced.
• a stable intermediate layer can be used. Accordingly, undesirable deformations or warping that may occur in the first soldering step become effective. Subsequently, the intermediate layer can be reduced to a desired thickness or to a desired thickness profile. In particular, the local compensation effect provided by the intermediate layer can be adjusted in a targeted manner. For example, a different thickness can be set in the area of the focal path than in the remaining areas. Alternatively or additionally, a desired structuring can also be introduced, for example in order to increase the adhesion of the second solder. According to a development, the surface of the intermediate layer of the partial composite body after the first soldering step and before the production of the second arrangement is mechanically processed such that it has at least two different levels.
• an annular recess with a constant lower level are incorporated into the intermediate layer.
• the level difference can - depending on the total thickness of the intermediate layer - for example, be in the range of 0.2 to 0.8 mm.
• a stepped formation of at least one level difference is preferred.
• a positive connection can also be provided, which can further increase the stability during use (in particular in the radial direction).
• the at least one solder foil inserted between the intermediate layer and the second metallic portion is subdivided correspondingly into a plurality of partial solder foils in order to ensure good engagement of the respective edges of the intermediate layer and the second metallic one Section to enable.
• the average thickness of the intermediate layer is in the range of from 100 pm to 2,000 pm inclusive. Good results have been achieved, in particular, with layer thicknesses in the region of 600 .mu.m, this range (+/- 50 .mu.m) also being advantageous for cost reasons.
• Nb and / or Ta as the main constituent of the intermediate layer is advantageous because of their elastic plastic properties at the application temperatures in question, if they are made comparatively thick (eg also ranges from 1,200 pm inclusive to 2,000 pm possible) to provide a particularly good compensation function between the first and the second section. If, after the first soldering step, processing of the intermediate layer leads to removal of material, then reference is made to the thicknesses specified above for the reduced (if appropriate average) layer thickness of the intermediate layer.
• a layer thickness of the intermediate layer used before processing is in particular correspondingly higher, for example in the range from 350 .mu.m up to and including 3000 .mu.m. If a processing of the intermediate layer after the first
• the average thickness of the first solder in the range of 80 ⁇ inclusive including up to 500 ⁇ , with thicknesses in the range of 250 ⁇ (+/- 50 ⁇ ) are particularly well suited.
• the average thickness of the second solder in the range of 30 ⁇ inclusive including up to 400 ⁇ , with thicknesses in the range of 180 ⁇ (+/- 50 ⁇ ) are particularly well suited.
• the first section is formed from a C-based material. Suitable materials are in particular graphite or a carbon-fiber-reinforced carbon (CFC). According to a development, the first section is formed from a ceramic. Suitable ceramics are in particular silicon carbide (SiC), silicon nitride (S13N4), aluminum nitride (AIN) and boron carbide (BC). According to a development, the ceramic is formed from a fiber-reinforced ceramic.
• Suitable fiber-reinforced ceramics include carbon fiber-reinforced and silicon carbide fiber-reinforced ceramics, in particular carbon-fiber-reinforced silicon carbide (C-SiC) and silicon carbide fiber-reinforced silicon carbide (SiC-SiC). Furthermore, it is provided according to a development that the second section is formed from Mo or a Mo-based alloy. As explained above, these are in particular materials used in the field of X-ray anodes. Particularly common materials are in particular graphite for the first section and a Mo-based alloy (in particular TZM or also MHC) for the second section.
• Mo-based alloy in particular TZM or also MHC
• both the first section and the second section each form sections of components of an x-ray anode, in particular an x-ray rotary anode.
• the first section is formed by a radiation body and the second section is formed by a base body of an x-ray rotary anode.
• the method according to the invention is also suitable for the connection of other components of an X-ray rotary anode.
• the inventive method can also be used in the realization of other concepts of X-ray rotary anodes, if appropriate sections are to be connected to an X-ray rotary anode or adjacent thereto components.
• the present invention further relates to a high-temperature-resistant composite body in which a first non-metallic portion is bonded via a brazing composite layer to a second metallic portion of Mo, a Mo-based alloy, W or a W-based alloy.
• the first portion is connected via a first solder joint formed by a Zr solder with an intermediate layer which is formed at least in a core region to at least 90 at.% From at least one of the elements Ta, Nb and / or W.
• the intermediate layer in turn is connected to the second section via a second solder connection, which is formed from a Ti solder, a Ti-V solder combination, a Zr solder or a Zr-Ti solder combination.
• the aforementioned solder materials allow that due to their low melting point for the realization of the second solder joint, a comparatively low soldering temperature required is. Accordingly, if the soldering process is carried out in two stages, a thermal aging of the metallic portion is largely avoided. In particular, the metallic portion within the composite body has a high strength, since it was not or only slightly reduced during the second soldering step.
• the respective solder joint is formed from one of said solders
• diffusion occurs during soldering, and accordingly, within the solder layer (after the respective soldering step), there are contained, in particular, materials from the intermediate layer and the respective portion.
• Coating, etc. which serves for example as a diffusion barrier or protection of the respective section, is / are provided.
• the solder is in each case directly adjacent to the base material of the first and / or second section and to the base material of the intermediate layer.
• the reflow temperature of the second solder joint is higher than the melting temperature of the pure, second solder.
• the diffusion effects are relatively small, for example compared to a uniform soldering step, as described in US 2011/0103553 A1 and JP 2010-140879 A. Accordingly, a feature characterizing the second solder joint, attributable to the comparatively low temperatures during the second soldering step, is the comparatively low reflow temperature for each solder employed.
• the second solder joint is formed from a Ti solder having a reflow temperature of at most 1,860 ° C.
• the reflow temperature is in the range of 1,740 ° C to 1,790 ° C inclusive.
• the second solder joint is formed from a Ti-V solder combination having a reflow temperature of at most 1,780 ° C.
• the reflow temperature ranges from 1,650 ° C to 1,700 ° C inclusive.
• the values refer to a composite body when new (i.e., after soldering). Because when used at high temperatures further diffusion occurs, which would lead to a further increase in the re-melting temperature. The applicable measuring method for determining the reflow temperature will be explained below with reference to the figures.
• Suitable ranges for the average thicknesses of the first solder joint, the core region of the intermediate layer and the second solder joint within of the (soldered) high-temperature resistant composite body respectively correspond to the values given above for the average thicknesses of the first solder, the intermediate layer and the second solder.
• Soldering steps occur the above-described diffusion effects in the region of the interfaces.
• the surface at which the concentration of the material of the relevant layer or section concerned has fallen to 90 at.% Is selected as the interface of a layer or a section in the soldered state.
• a part of the solder can escape at an edge area during the execution of the soldering step. Accordingly, these effects are to be considered when a certain thickness of a layer is desired in the brazed, high temperature resistant composite body.
• FIG. 1 shows a schematic representation of an X-ray rotary anode in cross-sectional view
• FIG. 2 shows a schematic representation of a tensile test specimen with the associated dimensions
• Fig. 5 is a schematic illustration in cross-sectional view illustrating the first soldering step of an embodiment of the present invention.
• FIG. 6 is a schematic representation in cross-sectional view for illustrating the second soldering step.
• Fig. 1 the structure of an embodiment of a Röntgenformatanode -2- is shown schematically.
• the X-ray rotary anode -2- is rotationally symmetrical to a rotational axis of symmetry -4- formed.
• the X-ray rotary anode -2- has a plate-shaped main body -6-, on a corresponding Shaft is mountable.
• an annular focal lamination -8- is applied to the base body -6-.
• the portion over which the annular focal lamination -8- extends, has the shape of a truncated cone (a flat cone).
• the focal track covering -8- covers at least the area of the main body -6-, which is scanned in use with an electron beam.
• the main body -6- is connected to a radiating element -10- flatly.
• the base body -6- is connected to the radiating body -10- via a solder joint layer -12-, so that the overall arrangement forms an embodiment of a high-temperature-resistant composite body according to the invention.
• the base body -6- is formed of formed TZM, and the emission body -10- is formed of graphite.
• the radiation body -10- is connected via a first solder joint formed by a Zr solder to an intermediate layer of pure Ta (at least 98 at.% Ta).
• the intermediate layer is connected to the main body -6- via a second solder joint formed from a Ti-V solder combination.
• the measuring method applicable for determining the reflow temperature will be explained in general terms. It should be noted that the reflow temperature determined by this measurement typically has variations in a range of +/- 20 ° C.
• a tensile specimen -14- whose direction of extension is perpendicular to the plane of the soldered composite layer 16 to be examined and in which the soldered composite layer 16 is centrally arranged, is worked out of the soldered composite body.
• the relevant dimensions of the tensile specimen -14- are shown in Fig. 2, wherein the dimensions are given in millimeters.
• Significant parameters of the dimensions are in particular the diameter -d- of the circular cross-section in the central region of the tensile specimen of 12 mm, which is constant over a length -I- of 22 mm.
• the total length -g- of the tensile test sample -14- is 50 mm, with the end-side sections -18-, -20- having an enlarged, circular cross-section.
• external threads are formed at the end sections - 18-, -20-, which in the present case are formed by a metric M24. Thread (ie 24 mm outside diameter) are formed with a pitch of 1.
• the tensile specimen is installed in a hot-drawn furnace and a constant primary force of 90 N (N: Newton) is applied. Due to the diffusion effects occurring at high temperatures, which may affect the result of the remelt temperature measurement, the temperature is increased very rapidly at a heating rate of 50 ° C / min (min: minute) to 50 ° C below the expected reflow temperature. Assuming a re-melt temperature of 1650 ° C, the tensile specimen should e.g. be heated with this high heating rate up to a furnace temperature of 1600 ° C. After a holding time of 10 minutes, which serves to heat the tensile sample, the temperature is now further increased at a significantly lower heating rate of 5 ° C / min (min: minute).
• a Zr-brazed tensile specimen (having the dimensions given above) with only one braze joint formed of a Zr solder, which adjoins a section of Mo or a Mo-based alloy at least on one side (the other side the Zr solder joint adjoins a section of graphite), installed in the hot-melt furnace and measured according to the measuring method described above. Due to the (very casually realizable) formation of a eutectic of Zr with Mo is based on a melting temperature of 1550 ° C.
• this melting point can be confirmed by the measurement (ie the measured melting point is in the range of +/- 25 ° C around the expected melting point of 1550 ° C), then the existing temperature measurement is acceptable. Otherwise, adjust the temperature measurement accordingly until this expected melting point can be verified.
• another, equivalent calibration method can be used for the correct temperature determination within the hot drawing furnace.
• a base body -24- formed from TZM is connected in a planar manner to a radiation body -26- formed from graphite via a solder joint layer -28-.
• the graphite radiation body 26 is provided on the surface to be joined by mechanical processing with structuring, in particular with a groove structure.
• the groove structure has a depth of about 350 in.
• a thermal shock cleaning and a high vacuum annealing of the graphite radiation body -26- is carried out.
• a graphite centering adapter -30- is provided to center the components during soldering.
• a 1 mm thick Ta solder foil (at least 98 at.% From Ta) and a 0.2 mm thick Zr solder foil (at least 95 at.% Zr) are cut by laser cutting and subjected to ultrasonic cleaning.
• the graphite radiation body -26-, the Zr solder foil -32-, and the Ta solder foil -34- are stacked on top of each other in this sequence (compare Fig. 5), wherein the centering adapter -30- serves to center the layers.
• the first arrangement is subjected to a first soldering step in a high vacuum oven.
• the first arrangement is first heated to 1,600 ° C with an average heating rate in the range of 10 ° C / min to 20 ° C / min (min: minute), in particular at a heating rate of 15 ° C / min under high vacuum ,
• a holding time in the range of 10 to 20 minutes is inserted in order to ensure a thorough heating of the components.
• a holding time at this temperature in the range of 5 to 10 minutes (especially 8 minutes) is inserted. Thereafter, the first assembly is slowly cooled to room temperature within the furnace under high vacuum.
• the resulting composite composite -38- is subjected to non-destructive testing (ultrasonic testing).
• the base body -24- on which in the embodiment shown on the cover side a Brennbahnbelag -36- is provided, is mechanically processed and then subjected to ultrasonic cleaning.
• the Ta intermediate layer of the partial composite body 38 is also machined to set a desired thickness of the Ta intermediate layer. Subsequently, the partial composite body 38 is subjected to ultrasonic cleaning.
• a new centering adapter 30 is made (if necessary).
• a 0.1 mm thick V-solder foil (at least 98 at.% From V) and a 0.25 mm thick Ti solder foil (at least 98 at.% Ti) are laser cut cut and then subjected to ultrasonic cleaning.
• the partial composite body -38-, the Ti solder foil -40-, the V-solder foil -42- and the base body -24- are stacked on top of each other in this sequence (compare FIG the centering adapter -30- is used to center the layers.
• the second arrangement is subjected to a second soldering step in a high vacuum oven under high vacuum.
• the second arrangement is first heated to 1,500 ° C with an average heating rate in the range of 20 ° C / min to 40 ° C / min (min: minute), in particular at a heating rate of 30 ° C / min.
• a holding time of between 10 and 20 minutes (in particular 15 minutes) is used to ensure thorough heating of the components.
• the temperature is increased at a heating rate in the range of 10 ° C / min to 30 ° C / min (min: minute), in particular at a heating rate of 20 ° C / min, up to a maximum temperature of 1650 ° C.
• the composite obtained After reaching the temperature of 1650 ° C again a holding time (at this temperature) in the range of 5 to 10 minutes (in particular 8 minutes) inserted. Thereafter, the composite obtained is slowly cooled to room temperature in a high vacuum oven under high vacuum. The obtained composite body is subjected to non-destructive testing (ultrasonic testing).
• the described production method can be carried out accordingly if, instead of the Ta intermediate layer, an otherwise intermediate layer described above is used.
• the second solder other of the materials generally described above can be used, wherein, depending on the material used, the expected melting point within the second arrangement is to be estimated and, accordingly, the maximum temperature must be adjusted during the second soldering step.
• Particularly preferred materials for the second solder are in particular a Ti solder, a Ti-V solder combination, a Zr solder and a Zr-Ti solder combination. As will be explained in detail below, for these materials, a particularly low melting point is achieved, and in the case of the aforementioned solder combinations, this applies at least within certain composition ranges.
• One group of preferred materials form a Ti solder with one
• a Ti solder and a Ti-V solder combination allow the second soldering step to be performed at a comparatively low furnace temperature.
• maximum furnace temperatures in the range of 1,600 ° C to 1,720 ° C are suitable for the second soldering step, depending on how high the temperature margin of safety from the melting point is (typically 50 ° C above the expected melting point) to melt the melt To ensure soldering.
• these solders allow the resulting solder joint to withstand comparatively high use temperatures.
• the other group of preferred materials form a Zr solder as well as a ZrTi solder combination. Due to the diffusion effects described above, when these solders are disposed directly adjacent to a second Mo or Mo alloy portion, a eutectic between Zr and Mo having a melting point of 1550 ° C. is reliably formed. If a Zr-Ti solder combination is used, it is possible to work in the region of the melting point minimum of about 1554 ° C. of this solder combination. In particular, maximum oven temperatures in the range of 1550 ° C to 1630 ° C are suitable for the second soldering step, depending on how high the temperature margin of safety from the melting point is (typically 50 ° C above the expected melting point) to cause melting To ensure soldering. Accordingly, with these solders, particularly low soldering temperatures are possible for the second soldering step. Depending on the materials, the temperature resistance may be somewhat lower than in the case of the above-described Ti solder and the Ti-V solder combination.

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