WO2013069440A1 - Procédé et dispositif d'abrasion, et matrice - Google Patents

Procédé et dispositif d'abrasion, et matrice Download PDF

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Publication number
WO2013069440A1
WO2013069440A1 PCT/JP2012/077210 JP2012077210W WO2013069440A1 WO 2013069440 A1 WO2013069440 A1 WO 2013069440A1 JP 2012077210 W JP2012077210 W JP 2012077210W WO 2013069440 A1 WO2013069440 A1 WO 2013069440A1
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WO
WIPO (PCT)
Prior art keywords
peeling
die
workpiece
tool
hole
Prior art date
Application number
PCT/JP2012/077210
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English (en)
Japanese (ja)
Inventor
岩本　正己
大塚　保之
関　正行
Original Assignee
株式会社 アマダ
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社 アマダ filed Critical 株式会社 アマダ
Publication of WO2013069440A1 publication Critical patent/WO2013069440A1/fr

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21D—WORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS OR PROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21D28/00—Shaping by press-cutting; Perforating
    • B21D28/02—Punching blanks or articles with or without obtaining scrap; Notching
    • B21D28/12—Punching using rotatable carriers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21D—WORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS OR PROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21D28/00—Shaping by press-cutting; Perforating
    • B21D28/24—Perforating, i.e. punching holes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/04—Headstocks; Working-spindles; Features relating thereto
    • B24B41/047—Grinding heads for working on plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
    • B24B55/06—Dust extraction equipment on grinding or polishing machines
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D13/00—Wheels having flexibly-acting working parts, e.g. buffing wheels; Mountings therefor
    • B24D13/14—Wheels having flexibly-acting working parts, e.g. buffing wheels; Mountings therefor acting by the front face
    • B24D13/145—Wheels having flexibly-acting working parts, e.g. buffing wheels; Mountings therefor acting by the front face having a brush-like working surface

Definitions

  • the present invention relates to a peeling method [abrasion method] for peeling a surface layer of a plate-shaped workpiece punched by a punch press such as a turret punch press, a peeling processing device [abrasion apparatus] used in this method, It relates to a die used in the apparatus.
  • burrs When punching a plate-like workpiece with a punch press, burrs may be formed on the lower surface of the workpiece. Further, when nibbling is performed, burrs may be formed on the inner periphery of the punched hole.
  • Patent Document 1 discloses a deburring machine.
  • the lower surface of the workpiece is deburred by a rotating tool [rotating tool] (deburring tool) attached to a die of a punch press. Further, the lower surface of the workpiece is deburred by the deburring tool, and the swarf is sucked downward by the vacuum device. Therefore, scattering of the chips around is prevented.
  • rotating tool rotating tool
  • Patent Document 2 discloses a rotary cutting tool [rotational cutting tool].
  • This rotary cutting tool is a reamer or an end mill mounted on a punch holder of a punch press.
  • a chip scattering prevention mechanism is provided around the rotary cutting tool, and a mechanism for sucking and removing chips from an opening formed in the die is also provided. By these mechanisms, scattering of the chips around is prevented.
  • the die is perpendicularly opposed to the workpiece machining position, and the workpiece machining position and the die opening communicate with each other. Therefore, the chips generated at the processing position are quickly sucked and removed through the opening of the die.
  • the surface layer (oxide film layer, etc.) of the plate workpiece may be peeled off.
  • the surface layer of the workpiece is removed by a peeling processing tool [abrasion unit] attached to a punch holder of a punch press.
  • the peeling powder [abraded swarf] generated by the peeling processing is scattered on the workpiece surface unlike the devices and tools described in Patent Documents 1 and 2 described above.
  • the release powder scattered on the work surface falls from the punched hole onto the lower die holder. Therefore, it is necessary to clean the peeling powder that has dropped onto the die holder, which has been an obstacle to improving the operating rate of the punch press.
  • An object of the present invention is to provide a peeling processing method capable of collecting the peeling powder generated by the peeling processing without being scattered around, a peeling processing apparatus used in the method, and a die used in the peeling processing apparatus. It is in.
  • a first feature of the present invention is a peeling processing method for peeling a surface layer of a workpiece by a punch press having a punch holder having a vertically movable peeling tool and a die holder having a die having a die hole, The workpiece is held in a state in which a through-hole formed in the vicinity of the peeling processing portion on the workpiece is communicated with the die hole of the die, and is peeled to the peeling processing portion of the workpiece by the peeling processing tool.
  • a peeling processing method characterized in that, simultaneously with the processing, the peeling powder generated by the peeling processing is sucked into the die hole through the through hole.
  • a second feature of the present invention is a punch holder having a vertically movable peeling processing tool having a rotatable peeling tool and a scattering prevention portion provided so as to surround the peeling tool, and a die having a die hole
  • the peeling powder generated by the above is attached to the scattering prevention part, the work is moved so as to open at least a part of the die hole of the die, and a suction force is applied to the die to adhere to the scattering prevention part.
  • a release processing method is provided, wherein the release powder is sucked into the die hole.
  • the peeling powder is sucked by the suction force every predetermined time or every time the peeling portion of the workpiece is changed.
  • the release powder scattering prevention unit is brought close to the die hole. It is preferable that the peeling tool is lowered.
  • a peeling apparatus for use in the peeling method according to the first or second feature, wherein the punch holder includes a vertically movable peeling tool, and a die having a die hole.
  • a die holder having a cylindrical tool holder capable of moving vertically with respect to the punch holder, a rotary actuator provided inside the tool holder, and rotating by the rotary actuator.
  • the peeling tool provided at the lower part of the tool holder and the peeling tool which is provided so as to surround the peeling tool and rotated by the rotary actuator are brought into contact with the peeling processing portion of the workpiece to perform the peeling processing.
  • a scatter preventing portion for preventing scatter of the delamination powder generated during application, and the die supports the delamination portion of the workpiece from below. It is provided on a center of the die holes, to provide a release processing apparatus characterized by.
  • the scattering prevention part is configured as an annular body whose lower end can contact the work, and the outer diameter or maximum width of the work support part is smaller than the inner diameter of the annular body. preferable.
  • a third feature of the present invention is a die used for the peeling processing method of the first or second feature, wherein a die hole opened upward is formed in the die.
  • a die characterized in that a workpiece support portion for supporting a workpiece peeling process portion from below is provided at the center.
  • the die is provided with a flange extended outward, and the inner diameter of the die hole is increased by an inclined peripheral surface formed in the flange.
  • the work support portion is connected to the inner peripheral surface of the die hole by at least one connecting portion, and an upper edge of the connecting portion is set lower than an upper surface of the die. .
  • an exfoliation processing apparatus 1 includes an exfoliation processing tool [abrasion unit] 5 attached to a vertically movable punch holder (upper turret) 3 of a turret punch press, and a die holder (lower turret) of a punch press. And a die 9 attached to 7.
  • the peeling tool 5 has a cylindrical tool holder 11.
  • the tool holder 11 is supported by a lifter spring 13 provided in the punch holder 3 so as to be vertically movable.
  • a rotary actuator 12 such as a fluid pressure motor is provided so as to be vertically movable.
  • the rotary actuator 12 is biased upward with respect to the tool holder 11.
  • a rotation axis [rotary shaft] 12A of the rotary actuator 12 is connected to a tool attachment shaft [tool attachment shaft] 12B that can move vertically relative to the rotation axis 12A.
  • the tool attachment shaft 12B rotates integrally with the rotation shaft 12A.
  • a peeling tool [abrading rad tool] 15 is attached to the tool mounting shaft 12B in a replaceable manner.
  • the peeling tool 15 has a peeling part 16 such as a wire brush or a grindstone at its tip (lower end).
  • an annular elevating body 17 surrounding the peeling tool 15 is mounted so as to be vertically movable.
  • the elevating body 17 is urged downward by a coil spring (elastic member) 19 provided inside the tool holder 11.
  • the lifting body 17 has a scatter prevention part [scatter [prevention portion] 21 on its lower surface for preventing the scattering of the peeling powder generated when the peeling part 16 of the peeling tool 15 peels the surface of the workpiece W.
  • the scattering prevention part 21 of the present embodiment is configured such that a nylon brush is planted in an annular shape, and its tip (lower end) is in contact with the upper surface of the workpiece W.
  • the scattering prevention part 21 formed in an annular shape is also referred to as a ring-shaped element.
  • the scattering prevention part 21 is not limited to a brush, The material is not limited to nylon even if it is a brush.
  • the scattering prevention part 21 may be a cylindrical body in which a plurality of holes or slits for allowing air to flow from the outside to the inside are formed.
  • the cylindrical body is preferably formed of an elastic member such as rubber or resin.
  • the punch press is provided with a vertically movable striker (ram) ST for lowering the peeling tool 5 against the biasing force of the lifter spring 13 described above.
  • the vertical position of the striker ST can be adjusted.
  • a head portion [head] 23 that is pressed downward by the striker ST is provided on the upper part of the peeling processing tool 5.
  • the head unit 23 is connected to the rotary actuator 12.
  • the peeling tool 5 When the head part 23 is pressed downward by the striker ST, the peeling tool 5 is stroked downward against the lifter spring 13. And the scattering prevention part 21 contacts the upper surface of the workpiece
  • FIG. The peeling tool 15 is rotated in advance by the rotary actuator 12, and the surface layer of the workpiece W is peeled by the rotation of the peeling portion 16.
  • peeling powder is generated on the surface of the workpiece W.
  • the peeling powder scatters on the surface of the workpiece W and falls onto the die holder 7 from the through hole H punched into the workpiece W in advance.
  • the die 9 is detachably mounted in a die mounting hole 25 formed in the die holder 7 facing the peeling processing tool 5.
  • the die 9 has a cylindrical die body 27, and a die hole 29 penetrating vertically is formed in the die body 27.
  • a workpiece support portion 31 is provided that supports a portion of the workpiece W that contacts the peeling portion 16 from below.
  • the work support portion 31 of this embodiment has a solid cylindrical shape.
  • the work support part 31 is made smaller than the annular region of the scattering prevention part 21 (annular body).
  • the upper surface of the work support portion 31 is set to a height equal to the upper surface 27U of the die body 27.
  • the upper edge of the connecting portion [bridging portions] 33 that connects the workpiece support portion 31 and the inner surface of the die hole 29 is set lower than the upper surface of the workpiece support portion 31 and the upper surface 27U of the die body 27.
  • the upper edge of the connecting portion 33 may be set at the same height as the upper surface of the work support portion 31 (the upper surface 27U of the die body 27).
  • the die mounting hole 25 is connected to a vacuum device 30.
  • a suction force is generated in the die hole 29.
  • a circumferential groove 35 is formed on the outer periphery of the die body 27, and a plurality of inclined through holes 37 penetrating from the circumferential groove 35 to the vicinity of the lower end of the inner periphery of the die body 27 are formed.
  • an air supply device [air ⁇ ⁇ ⁇ supply device] 36 for supplying air to the circumferential groove 35 of the die body 27 mounted on the die holder 7 is provided.
  • suction force is generated at the opening of the die hole 29.
  • the first mechanism and the second mechanism described above are operated simultaneously, but only one of them may be operated. Alternatively, only one of the first mechanism and the second mechanism may be provided.
  • a through-hole H is required in the vicinity of the peeling processing portion on the workpiece W in order to collect the peeling. If the hole formed in the workpiece W communicates with the die hole 29 when the peeled portion on the workpiece W is set on the workpiece support portion 31, the hole may be used as the through hole H. If there is no such hole, a through hole H communicating with the die hole 29 is previously formed in the vicinity of the peeling portion on the workpiece W for the peeling processing.
  • the size of the through hole H is preferably substantially equal to the outer diameter of the peeling portion 16 of the peeling tool 15.
  • the through-hole H is formed in the workpiece W in advance (Step S0). Note that the through hole H is formed in the vicinity of the peeling portion of the workpiece W so as to communicate with the die hole 29 when the peeling portion on the workpiece W is set on the workpiece support 31.
  • the punch holder (upper turret) 3 and the die holder (lower turret) 7 are rotated to prepare the peeling tool 5 and the die 9 (step S1).
  • step S2 the peeled portion on the workpiece W is set on the workpiece support portion 31 (step S2).
  • step S2 the through hole H formed in the vicinity of the peeled portion of the workpiece W is in a state of communicating with the die hole 29.
  • the rotation of the peeling tool 15 is started, the vacuum device 30 is operated, and air is supplied from the air supply device 36 to the circumferential groove 35 (step S3).
  • a suction force is generated in the die hole 29 by the operation of the vacuum device 30 and the supply of air to the circumferential groove 35.
  • the stripping tool 5 is moved downward by the striker ST, and the stripping process on the workpiece W is performed by the stripping tool 15 (step S4).
  • the surface layer of the workpiece W is peeled off by the peeling portion 16 of the peeling tool 15 to generate peeling powder.
  • the exfoliated powder is collected (prevented from scattering) by the scattering prevention unit 21, and is sucked into the die hole 29 through the through hole H by the suction force generated in the die hole 29 (step S5).
  • the through hole H is located between the outer periphery of the work support portion 31 and the inner periphery of the die hole 29 and communicates with the die hole 29. Therefore, the peeling powder immediately after being generated by the peeling portion 16 and the peeling powder collected by the scattering prevention portion 21 are sucked into the die hole 29 through the through hole H. In this way, the release powder is collected through the die hole 29, and scattering onto the workpiece W is prevented.
  • step S6 it is determined whether or not there is another peeling processed part.
  • step 6 it is determined whether or not there is another peeling processed part.
  • step 6 is affirmed, the workpiece W is moved, the next separation processing portion is set to the workpiece support 31, and the same processing is performed (processing returns to step S2).
  • step 6 is negative, the peeling process is terminated, the rotation of the peeling tool 15 is stopped, and the vacuum device 30 and the air supply device 36 are also stopped (step S7).
  • the lower surface of the peeling process part of the work W is supported by the work support part 31. For this reason, even if the workpiece W is thin, the peeling process can be performed satisfactorily without bending the workpiece W. Further, since the upper edge of the connecting portion 33 is set lower than the upper surface of the die 9 (that is, the upper surface 27U of the die body 27 and the upper surface of the work support portion 31), the workpiece W is removed by the peeling powder adhering to the connecting portion 33. There is no scratch on the lower surface of the.
  • the die 9 may be provided with an [expanded outward] flange F extended outward.
  • the flange F is in contact with the upper surface of the die holder 7.
  • the inclined peripheral surface FO can be formed, and the die hole 29 having an inner diameter larger than the die hole 29 shown in FIG. 1 described above can be formed.
  • a suction force can be applied in a wider range, so that it is possible to cope with a long distance to the through hole H formed in the vicinity of the peeling processed portion. Therefore, it can suppress forming the through-hole H only for peeling processing.
  • step S1 the punch holder (upper turret) 3 and the die holder (lower turret) 7 are rotated to prepare the peeling tool 5 and the die 9 (step S1).
  • step S2 the peeling process part on the workpiece
  • work W is set to the workpiece
  • step S3A The stripping tool 5 is moved downward by the striker ST, and the stripping process on the workpiece W is performed by the stripping tool 15 (step S4A).
  • step S4 in the peeling processing shown in FIG. 3 the peeling processing of one peeling processing portion was performed, but in step S4A in this modified example, the peeling processing of a plurality of peeling processing portions is continuously performed. Can be broken.
  • step S50 it is determined whether or not a predetermined time has elapsed from the start of the peeling process (step S50). If step S50 is negative, the peeling process is continued as it is (the treatment continues the process of step S4A). On the other hand, if step S50 is negative, the workpiece W is moved after the rotation of the peeling tool 15 is stopped and the peeling tool 5 is moved upward in order to collect the collected peeling powder. Thus, at least a part (preferably all) of the die hole 29 is opened (step S51). For opening the die hole 29, a punched hole formed by punching may be used, or an outline of the workpiece W may be used.
  • step S52 the vacuum device 30 is operated, and air is supplied from the air supply device 36 to the circumferential groove 35 (step S52).
  • the operation of the vacuum device 30 and the air supply device 36 may be performed prior to step S52.
  • the rotation of the peeling tool 15 is performed in step S3A in the same manner as in step S3 of the peeling processing shown in FIG. It may be started at the same time.
  • the stripping tool 5 is again moved downward by the striker ST (step S53), and the stripped powder collected in the scattering prevention unit 21 is sucked into the opened die hole 29 by the suction force generated in the die hole 29. (Step S5A). At this time, the scattering prevention part 21 is directly above the die hole 29. Therefore, the peeling powder collected by the scattering prevention unit 21 is sucked into the opened die hole 29. In this way, the release powder is collected through the die hole 29, and scattering onto the workpiece W is prevented. In step S5A, it is preferable that the stripping tool 5 is vibrated vertically by the striker ST to promote the detachment of the stripped powder from the scattering prevention unit 21.
  • step S6A it is determined whether or not a part to be processed remains to be processed.
  • step 6A the workpiece W 31 is set by moving the workpiece W to be processed, and the same processing is performed (the processing returns to step S2).
  • Step 6A is denied, the peeling processing is finished, and the vacuum device 30 and the air supply device 36 are stopped (Step S7A).
  • the peeling powder was collected every time the peeling process was performed. Instead of such a process, the peeling powder may be collected every time one peeling processing part is finished (another modified example).
  • Another modification of the peeling processing will be described with reference to the flowchart of FIG.
  • This other modified example is a modified example of the process of FIG. 3 described above and a modified example of the process of FIG.
  • step S1 the punch holder (upper turret) 3 and the die holder (lower turret) 7 are rotated to prepare the peeling tool 5 and the die 9 (step S1).
  • step S2 the peeling process part on the workpiece
  • work W is set to the workpiece
  • the stripping tool 5 is moved downward by the striker ST, and the stripping process on the workpiece W is performed by the stripping tool 15 (step S4).
  • the release powder is collected (prevented from scattering) by the scattering prevention unit 21. Note that in step S4 in the present modification, a peeling process for one peeling part is performed as in step S4 in the peeling process shown in FIG.
  • step S51 After the peeling process of one peeling part is completed, in order to collect the collected peeling powder, first, after the rotation of the peeling tool 15 is stopped and the peeling tool 5 is moved upward, The workpiece W is moved, and at least a part (preferably all) of the die hole 29 is opened (step S51).
  • a punched hole formed by punching may be used, or an outline of the workpiece W may be used.
  • step S52 the vacuum device 30 is operated, and air is supplied from the air supply device 36 to the circumferential groove 35 (step S52).
  • the operation of the vacuum device 30 and the air supply device 36 may be performed prior to step S52.
  • the rotation of the peeling tool 15 is performed in step S3A in the same manner as in step S3 of the peeling processing shown in FIG. It may be started at the same time.
  • the stripping tool 5 is again moved downward by the striker ST (step S53), and the stripped powder collected in the scattering prevention unit 21 is sucked into the opened die hole 29 by the suction force generated in the die hole 29. (Step S5A). At this time, the scattering prevention part 21 is directly above the die hole 29. Therefore, the peeling powder collected by the scattering prevention unit 21 is sucked into the opened die hole 29. In this way, the release powder is collected through the die hole 29, and scattering onto the workpiece W is prevented. In step S5A, it is preferable that the stripping tool 5 is vibrated vertically by the striker ST to promote the detachment of the stripped powder from the scattering prevention unit 21.
  • step S6A it is determined whether or not there is another peeling processing part.
  • step S6 it is determined whether or not there is another peeling processing part.
  • step 6 it is affirmed, the workpiece W is moved, the next separation processing portion is set to the workpiece support 31, and the same processing is performed (processing returns to step S2).
  • step 6 is negative, the peeling process is terminated, and the vacuum device 30 and the air supply device 36 are stopped (step S7A).
  • the workpiece W is moved to open at least a part of the die hole 29 to release the release powder into the die hole 29.
  • sucking it is not necessary to form the through hole H only for the peeling process. Accordingly, the appearance of the work W is improved.
  • a large amount of exfoliated powder adheres to the anti-scattering unit 21 by collecting the exfoliating powder attached to the anti-scattering unit 21 every predetermined time or for each exfoliation processing part. It can prevent, and scattering of peeling powder can be prevented effectively.

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Punching Or Piercing (AREA)

Abstract

L'invention porte sur un procédé d'abrasion pour abraser la couche de surface d'une pièce à travailler à l'aide d'une presse poinçonneuse qui comporte un porte-poinçon ayant un outil d'abrasion mobile et un porte-matrice ayant une matrice munie d'un trou de matrice, la pièce à travailler étant maintenue dans un état dans lequel un trou traversant préformé au voisinage de la partie d'abrasion de la pièce à travailler est amené à communiquer avec le trou de matrice de la matrice, et, en même temps que la partie d'abrasion de la pièce à travailler est abrasée à l'aide de l'outil d'abrasion, une poussière d'abrasion générée par l'abrasion est aspirée dans le trou de matrice par l'intermédiaire du trou traversant. Ce procédé d'abrasion rend possible de récupérer une poussière d'abrasion générée par abrasion sans disperser la poussière dans l'environnement.
PCT/JP2012/077210 2011-11-08 2012-10-22 Procédé et dispositif d'abrasion, et matrice WO2013069440A1 (fr)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2011-244547 2011-11-08
JP2011244547 2011-11-08
JP2012094671A JP5995500B2 (ja) 2011-11-08 2012-04-18 剥離加工方法及び装置並びにダイ
JP2012-094671 2012-04-18

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WO2013069440A1 true WO2013069440A1 (fr) 2013-05-16

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JP6608617B2 (ja) * 2015-05-20 2019-11-20 Ｙｋｋ株式会社 雌型スナップボタン及びその製造方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10235434A (ja) * 1997-02-24 1998-09-08 Amada Metrecs Co Ltd パンチプレスおよびバリ取り加工方法並びにバリ取り装置
JP2006123063A (ja) * 2004-10-28 2006-05-18 Amada Co Ltd 切削加工方法及び回転切削工具
JP2007000901A (ja) * 2005-06-24 2007-01-11 Murata Mach Ltd パンチプレスのバリ取りツール
JP2010069615A (ja) * 2008-09-18 2010-04-02 Trumpf Werkzeugmaschinen Gmbh & Co Kg 板状の被加工材、特に金属薄板を加工する機械、被加工材を加工する機械のための工具セット、ねじフライス削り工具アッセンブリ、及びねじフライス削り工具の使用

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10235434A (ja) * 1997-02-24 1998-09-08 Amada Metrecs Co Ltd パンチプレスおよびバリ取り加工方法並びにバリ取り装置
JP2006123063A (ja) * 2004-10-28 2006-05-18 Amada Co Ltd 切削加工方法及び回転切削工具
JP2007000901A (ja) * 2005-06-24 2007-01-11 Murata Mach Ltd パンチプレスのバリ取りツール
JP2010069615A (ja) * 2008-09-18 2010-04-02 Trumpf Werkzeugmaschinen Gmbh & Co Kg 板状の被加工材、特に金属薄板を加工する機械、被加工材を加工する機械のための工具セット、ねじフライス削り工具アッセンブリ、及びねじフライス削り工具の使用

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JP2013121650A (ja) 2013-06-20

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