WO2013069440A1

WO2013069440A1 - Abrasion method and device, and die

Info

Publication number: WO2013069440A1
Application number: PCT/JP2012/077210
Authority: WO
Inventors: 岩本　正己; 大塚　保之; 関　正行
Original assignee: 株式会社アマダ
Priority date: 2011-11-08
Filing date: 2012-10-22
Publication date: 2013-05-16
Also published as: JP5995500B2; JP2013121650A

Abstract

In this abrasion method for abrading the surface layer of a workpiece by means of a punch press which is provided with a punch holder having a vertically moveable abrasion tool and with a die holder having a die with a die hole, the workpiece is held in a state in which a through-hole pre-formed in the vicinity of the abrasion portion of the workpiece is made to communicate with the die hole of the die, and, at the same time as the abrasion portion of the workpiece is abraded by means of the abrasion tool, abrasion dust generated by the abrasion is sucked into the die hole via the through-hole. This abrasion method makes it possible to recover abrasion dust generated by abrasion without scattering said dust in the surroundings.

Description

Peeling method and apparatus, and die

The present invention relates to a peeling method [abrasion method] for peeling a surface layer of a plate-shaped workpiece punched by a punch press such as a turret punch press, a peeling processing device [abrasion apparatus] used in this method, It relates to a die used in the apparatus.

When punching a plate-like workpiece with a punch press, burrs may be formed on the lower surface of the workpiece. Further, when nibbling is performed, burrs may be formed on the inner periphery of the punched hole.

The following Patent Document 1 discloses a deburring machine. In this deburring apparatus, the lower surface of the workpiece is deburred by a rotating tool [rotating tool] (deburring tool) attached to a die of a punch press. Further, the lower surface of the workpiece is deburred by the deburring tool, and the swarf is sucked downward by the vacuum device. Therefore, scattering of the chips around is prevented.

The following Patent Document 2 discloses a rotary cutting tool [rotational cutting tool]. This rotary cutting tool is a reamer or an end mill mounted on a punch holder of a punch press. A chip scattering prevention mechanism is provided around the rotary cutting tool, and a mechanism for sucking and removing chips from an opening formed in the die is also provided. By these mechanisms, scattering of the chips around is prevented.

In the apparatuses and tools described in

Patent Documents

1 and 2, the die is perpendicularly opposed to the workpiece machining position, and the workpiece machining position and the die opening communicate with each other. Therefore, the chips generated at the processing position are quickly sucked and removed through the opening of the die.

Japanese Patent Laid-Open No. 10-235434 Japanese Laid-Open Patent Publication No. 2006-123063

On the other hand, as a pretreatment for spot welding or stud welding, the surface layer (oxide film layer, etc.) of the plate workpiece may be peeled off. In this peeling processing, the surface layer of the workpiece is removed by a peeling processing tool [abrasion unit] attached to a punch holder of a punch press. In such a case, the peeling powder [abraded swarf] generated by the peeling processing is scattered on the workpiece surface unlike the devices and tools described in

Patent Documents

1 and 2 described above. The release powder scattered on the work surface falls from the punched hole onto the lower die holder. Therefore, it is necessary to clean the peeling powder that has dropped onto the die holder, which has been an obstacle to improving the operating rate of the punch press.

An object of the present invention is to provide a peeling processing method capable of collecting the peeling powder generated by the peeling processing without being scattered around, a peeling processing apparatus used in the method, and a die used in the peeling processing apparatus. It is in.

A first feature of the present invention is a peeling processing method for peeling a surface layer of a workpiece by a punch press having a punch holder having a vertically movable peeling tool and a die holder having a die having a die hole, The workpiece is held in a state in which a through-hole formed in the vicinity of the peeling processing portion on the workpiece is communicated with the die hole of the die, and is peeled to the peeling processing portion of the workpiece by the peeling processing tool. Provided is a peeling processing method characterized in that, simultaneously with the processing, the peeling powder generated by the peeling processing is sucked into the die hole through the through hole.

A second feature of the present invention is a punch holder having a vertically movable peeling processing tool having a rotatable peeling tool and a scattering prevention portion provided so as to surround the peeling tool, and a die having a die hole A peeling process method for peeling a surface layer of a workpiece by a punch press having a die holder, and simultaneously performing the peeling process on the peeling process portion of the workpiece by the peeling tool of the peeling tool. The peeling powder generated by the above is attached to the scattering prevention part, the work is moved so as to open at least a part of the die hole of the die, and a suction force is applied to the die to adhere to the scattering prevention part. A release processing method is provided, wherein the release powder is sucked into the die hole.

Here, it is preferable that the peeling powder is sucked by the suction force every predetermined time or every time the peeling portion of the workpiece is changed.

In addition, after the workpiece is moved so as to open at least a part of the die hole, and before the release powder is sucked by the suction force, the release powder scattering prevention unit is brought close to the die hole. It is preferable that the peeling tool is lowered.

According to a third aspect of the present invention, there is provided a peeling apparatus for use in the peeling method according to the first or second feature, wherein the punch holder includes a vertically movable peeling tool, and a die having a die hole. A die holder having a cylindrical tool holder capable of moving vertically with respect to the punch holder, a rotary actuator provided inside the tool holder, and rotating by the rotary actuator The peeling tool provided at the lower part of the tool holder and the peeling tool which is provided so as to surround the peeling tool and rotated by the rotary actuator are brought into contact with the peeling processing portion of the workpiece to perform the peeling processing. A scatter preventing portion for preventing scatter of the delamination powder generated during application, and the die supports the delamination portion of the workpiece from below. It is provided on a center of the die holes, to provide a release processing apparatus characterized by.

Here, the scattering prevention part is configured as an annular body whose lower end can contact the work, and the outer diameter or maximum width of the work support part is smaller than the inner diameter of the annular body. preferable.

A third feature of the present invention is a die used for the peeling processing method of the first or second feature, wherein a die hole opened upward is formed in the die. There is provided a die characterized in that a workpiece support portion for supporting a workpiece peeling process portion from below is provided at the center.

Here, it is preferable that the die is provided with a flange extended outward, and the inner diameter of the die hole is increased by an inclined peripheral surface formed in the flange.

Further, it is preferable that the work support portion is connected to the inner peripheral surface of the die hole by at least one connecting portion, and an upper edge of the connecting portion is set lower than an upper surface of the die. .

According to the above feature, it is possible to collect the peeling powder generated at the peeling processing portion without scattering on the upper surface of the workpiece during the workpiece peeling processing.

It is a side view (partial sectional view) showing an embodiment of a peeling processing apparatus. It is a perspective view of the die | dye in the said apparatus. It is a flowchart of the peeling process process by the said apparatus. It is sectional drawing which shows the modification of die | dye. It is a flowchart of the peeling process process (modification) by the said apparatus. It is a flowchart of the peeling process process (another modification) by the said apparatus.

Hereinafter, embodiments of a peeling processing apparatus (processing method and die) will be described with reference to the drawings. As shown in FIG. 1, an exfoliation processing apparatus 1 includes an exfoliation processing tool [abrasion unit] 5 attached to a vertically movable punch holder (upper turret) 3 of a turret punch press, and a die holder (lower turret) of a punch press. And a die 9 attached to 7.

The peeling tool 5 has a cylindrical tool holder 11. The tool holder 11 is supported by a lifter spring 13 provided in the punch holder 3 so as to be vertically movable. In the tool holder 11, a rotary actuator 12 such as a fluid pressure motor is provided so as to be vertically movable. The rotary actuator 12 is biased upward with respect to the tool holder 11. A rotation axis [rotary shaft] 12A of the rotary actuator 12 is connected to a tool attachment shaft [tool attachment shaft] 12B that can move vertically relative to the rotation axis 12A. The tool attachment shaft 12B rotates integrally with the rotation shaft 12A. A peeling tool [abrading rad tool] 15 is attached to the tool mounting shaft 12B in a replaceable manner. The peeling tool 15 has a peeling part 16 such as a wire brush or a grindstone at its tip (lower end).

In the lower end of the tool holder 11, an annular elevating body 17 surrounding the peeling tool 15 is mounted so as to be vertically movable. The elevating body 17 is urged downward by a coil spring (elastic member) 19 provided inside the tool holder 11. The lifting body 17 has a scatter prevention part [scatter [prevention portion] 21 on its lower surface for preventing the scattering of the peeling powder generated when the peeling part 16 of the peeling tool 15 peels the surface of the workpiece W.

The scattering prevention part 21 of the present embodiment is configured such that a nylon brush is planted in an annular shape, and its tip (lower end) is in contact with the upper surface of the workpiece W. Hereinafter, the scattering prevention part 21 formed in an annular shape is also referred to as a ring-shaped element. In addition, the scattering prevention part 21 is not limited to a brush, The material is not limited to nylon even if it is a brush. For example, the scattering prevention part 21 may be a cylindrical body in which a plurality of holes or slits for allowing air to flow from the outside to the inside are formed. In this case, the cylindrical body is preferably formed of an elastic member such as rubber or resin.

The punch press is provided with a vertically movable striker (ram) ST for lowering the peeling tool 5 against the biasing force of the lifter spring 13 described above. The vertical position of the striker ST can be adjusted. A head portion [head] 23 that is pressed downward by the striker ST is provided on the upper part of the peeling processing tool 5. The head unit 23 is connected to the rotary actuator 12.

When the head part 23 is pressed downward by the striker ST, the peeling tool 5 is stroked downward against the lifter spring 13. And the scattering prevention part 21 contacts the upper surface of the workpiece | work W, and the peeling part 16 of the peeling tool 15 also contacts the upper surface of the workpiece | work W. FIG. The peeling tool 15 is rotated in advance by the rotary actuator 12, and the surface layer of the workpiece W is peeled by the rotation of the peeling portion 16.

As described above, when the surface layer of the workpiece W is peeled off by the peeling tool 15, peeling powder is generated on the surface of the workpiece W. The peeling powder scatters on the surface of the workpiece W and falls onto the die holder 7 from the through hole H punched into the workpiece W in advance.

Therefore, in the present embodiment, a mechanism for preventing the release powder from scattering is provided. This scattering prevention mechanism mechanism will be described below. The die 9 is detachably mounted in a die mounting hole 25 formed in the die holder 7 facing the peeling processing tool 5. The die 9 has a cylindrical die body 27, and a die hole 29 penetrating vertically is formed in the die body 27. In the upper center of the die hole 29, a workpiece support portion 31 is provided that supports a portion of the workpiece W that contacts the peeling portion 16 from below.

As shown in FIGS. 1 and 2, the work support portion 31 of this embodiment has a solid cylindrical shape. The work support part 31 is made smaller than the annular region of the scattering prevention part 21 (annular body). Further, the upper surface of the work support portion 31 is set to a height equal to the upper surface 27U of the die body 27. In addition, it is desirable that the upper edge of the connecting portion [bridging portions] 33 that connects the workpiece support portion 31 and the inner surface of the die hole 29 is set lower than the upper surface of the workpiece support portion 31 and the upper surface 27U of the die body 27. However, it does not necessarily have to be low. The upper edge of the connecting portion 33 may be set at the same height as the upper surface of the work support portion 31 (the upper surface 27U of the die body 27).

In order to cause the die hole 29 in the die 9 to have a suction action, the following two mechanisms are provided. In the first mechanism, the die mounting hole 25 is connected to a vacuum device 30. When the vacuum device 30 is operated, a suction force is generated in the die hole 29. In the second mechanism, a circumferential groove 35 is formed on the outer periphery of the die body 27, and a plurality of inclined through holes 37 penetrating from the circumferential groove 35 to the vicinity of the lower end of the inner periphery of the die body 27 are formed. Further, an air supply device [air 供給する supply device] 36 for supplying air to the circumferential groove 35 of the die body 27 mounted on the die holder 7 is provided. By supplying air from the air supply device 36 to the circumferential groove 35 and injecting air from the inclined through-hole 37 toward the inside of the die body 27, suction force is generated at the opening of the die hole 29. In the present embodiment, the first mechanism and the second mechanism described above are operated simultaneously, but only one of them may be operated. Alternatively, only one of the first mechanism and the second mechanism may be provided.

When the peeling processing is performed by the above-described peeling processing apparatus, a through-hole H is required in the vicinity of the peeling processing portion on the workpiece W in order to collect the peeling. If the hole formed in the workpiece W communicates with the die hole 29 when the peeled portion on the workpiece W is set on the workpiece support portion 31, the hole may be used as the through hole H. If there is no such hole, a through hole H communicating with the die hole 29 is previously formed in the vicinity of the peeling portion on the workpiece W for the peeling processing.

It is preferable that two through holes H are provided so as to interpose a part to be peeled on the workpiece W. The size of the through hole H is preferably substantially equal to the outer diameter of the peeling portion 16 of the peeling tool 15.

The peeling processing by the above-described peeling processing apparatus will be described with reference to the flowchart of FIG. As described above, the through-hole H is formed in the workpiece W in advance (Step S0). Note that the through hole H is formed in the vicinity of the peeling portion of the workpiece W so as to communicate with the die hole 29 when the peeling portion on the workpiece W is set on the workpiece support 31. Next, the punch holder (upper turret) 3 and the die holder (lower turret) 7 are rotated to prepare the peeling tool 5 and the die 9 (step S1).

Next, the peeled portion on the workpiece W is set on the workpiece support portion 31 (step S2). At this time, as described above, the through hole H formed in the vicinity of the peeled portion of the workpiece W is in a state of communicating with the die hole 29. The rotation of the peeling tool 15 is started, the vacuum device 30 is operated, and air is supplied from the air supply device 36 to the circumferential groove 35 (step S3). A suction force is generated in the die hole 29 by the operation of the vacuum device 30 and the supply of air to the circumferential groove 35. The stripping tool 5 is moved downward by the striker ST, and the stripping process on the workpiece W is performed by the stripping tool 15 (step S4).

At the time of peeling processing on the peeling portion on the workpiece W, the surface layer of the workpiece W is peeled off by the peeling portion 16 of the peeling tool 15 to generate peeling powder. The exfoliated powder is collected (prevented from scattering) by the scattering prevention unit 21, and is sucked into the die hole 29 through the through hole H by the suction force generated in the die hole 29 (step S5). At this time, the through hole H is located between the outer periphery of the work support portion 31 and the inner periphery of the die hole 29 and communicates with the die hole 29. Therefore, the peeling powder immediately after being generated by the peeling portion 16 and the peeling powder collected by the scattering prevention portion 21 are sucked into the die hole 29 through the through hole H. In this way, the release powder is collected through the die hole 29, and scattering onto the workpiece W is prevented.

Thereafter, it is determined whether or not there is another peeling processed part (step S6). When step 6 is affirmed, the workpiece W is moved, the next separation processing portion is set to the workpiece support 31, and the same processing is performed (processing returns to step S2). On the other hand, if step 6 is negative, the peeling process is terminated, the rotation of the peeling tool 15 is stopped, and the vacuum device 30 and the air supply device 36 are also stopped (step S7).

In the peeling process, the lower surface of the peeling process part of the work W is supported by the work support part 31. For this reason, even if the workpiece W is thin, the peeling process can be performed satisfactorily without bending the workpiece W. Further, since the upper edge of the connecting portion 33 is set lower than the upper surface of the die 9 (that is, the upper surface 27U of the die body 27 and the upper surface of the work support portion 31), the workpiece W is removed by the peeling powder adhering to the connecting portion 33. There is no scratch on the lower surface of the.

In addition, this invention is not limited to the said embodiment, In the range of invention, it can change suitably. For example, as shown in FIG. 4, the die 9 may be provided with an [expanded outward] flange F extended outward. The flange F is in contact with the upper surface of the die holder 7. By providing the flange F, the inclined peripheral surface FO can be formed, and the die hole 29 having an inner diameter larger than the die hole 29 shown in FIG. 1 described above can be formed. According to such a die hole 29, a suction force can be applied in a wider range, so that it is possible to cope with a long distance to the through hole H formed in the vicinity of the peeling processed portion. Therefore, it can suppress forming the through-hole H only for peeling processing.

Next, a modified example of the peeling processing using the peeling processing apparatus described above will be described with reference to the flowchart of FIG. However, in this modification, it is not necessary to previously form the through hole H to be used only for the peeling process. First, the punch holder (upper turret) 3 and the die holder (lower turret) 7 are rotated to prepare the peeling tool 5 and the die 9 (step S1). Next, the peeling process part on the workpiece | work W is set to the workpiece | work support part 31 (step S2), and rotation of the peeling tool 15 is started (step S3A). The stripping tool 5 is moved downward by the striker ST, and the stripping process on the workpiece W is performed by the stripping tool 15 (step S4A). At this time, the release powder is collected (prevented from scattering) by the scattering prevention unit 21. In addition, in step S4 in the peeling processing shown in FIG. 3, the peeling processing of one peeling processing portion was performed, but in step S4A in this modified example, the peeling processing of a plurality of peeling processing portions is continuously performed. Can be broken.

Next, it is determined whether or not a predetermined time has elapsed from the start of the peeling process (step S50). If step S50 is negative, the peeling process is continued as it is (the treatment continues the process of step S4A). On the other hand, if step S50 is negative, the workpiece W is moved after the rotation of the peeling tool 15 is stopped and the peeling tool 5 is moved upward in order to collect the collected peeling powder. Thus, at least a part (preferably all) of the die hole 29 is opened (step S51). For opening the die hole 29, a punched hole formed by punching may be used, or an outline of the workpiece W may be used.

Next, the vacuum device 30 is operated, and air is supplied from the air supply device 36 to the circumferential groove 35 (step S52). The operation of the vacuum device 30 and the air supply device 36 may be performed prior to step S52. For example, the rotation of the peeling tool 15 is performed in step S3A in the same manner as in step S3 of the peeling processing shown in FIG. It may be started at the same time.

The stripping tool 5 is again moved downward by the striker ST (step S53), and the stripped powder collected in the scattering prevention unit 21 is sucked into the opened die hole 29 by the suction force generated in the die hole 29. (Step S5A). At this time, the scattering prevention part 21 is directly above the die hole 29. Therefore, the peeling powder collected by the scattering prevention unit 21 is sucked into the opened die hole 29. In this way, the release powder is collected through the die hole 29, and scattering onto the workpiece W is prevented. In step S5A, it is preferable that the stripping tool 5 is vibrated vertically by the striker ST to promote the detachment of the stripped powder from the scattering prevention unit 21.

After step S5A, it is determined whether or not a part to be processed remains to be processed (step S6A). When step 6A is affirmed, the workpiece W 31 is set by moving the workpiece W to be processed, and the same processing is performed (the processing returns to step S2). On the other hand, when Step 6A is denied, the peeling processing is finished, and the vacuum device 30 and the air supply device 36 are stopped (Step S7A).

In addition, in the modified example of the peeling process described above, the peeling powder was collected every time the peeling process was performed. Instead of such a process, the peeling powder may be collected every time one peeling processing part is finished (another modified example). Another modification of the peeling processing will be described with reference to the flowchart of FIG. This other modified example is a modified example of the process of FIG. 3 described above and a modified example of the process of FIG.

First, the punch holder (upper turret) 3 and the die holder (lower turret) 7 are rotated to prepare the peeling tool 5 and the die 9 (step S1). Next, the peeling process part on the workpiece | work W is set to the workpiece | work support part 31 (step S2), and rotation of the peeling tool 15 is started (step S3A). The stripping tool 5 is moved downward by the striker ST, and the stripping process on the workpiece W is performed by the stripping tool 15 (step S4). At this time, the release powder is collected (prevented from scattering) by the scattering prevention unit 21. Note that in step S4 in the present modification, a peeling process for one peeling part is performed as in step S4 in the peeling process shown in FIG.

Next, after the peeling process of one peeling part is completed, in order to collect the collected peeling powder, first, after the rotation of the peeling tool 15 is stopped and the peeling tool 5 is moved upward, The workpiece W is moved, and at least a part (preferably all) of the die hole 29 is opened (step S51). For opening the die hole 29, a punched hole formed by punching may be used, or an outline of the workpiece W may be used.

After step S5A, it is determined whether or not there is another peeling processing part (step S6). When step 6 is affirmed, the workpiece W is moved, the next separation processing portion is set to the workpiece support 31, and the same processing is performed (processing returns to step S2). On the other hand, if step 6 is negative, the peeling process is terminated, and the vacuum device 30 and the air supply device 36 are stopped (step S7A).

5 and FIG. 6, after the release powder is attached to the anti-scattering portion 21, the workpiece W is moved to open at least a part of the die hole 29 to release the release powder into the die hole 29. By sucking, it is not necessary to form the through hole H only for the peeling process. Accordingly, the appearance of the work W is improved. At this time, a large amount of exfoliated powder adheres to the anti-scattering unit 21 by collecting the exfoliating powder attached to the anti-scattering unit 21 every predetermined time or for each exfoliation processing part. It can prevent, and scattering of peeling powder can be prevented effectively.

Claims

A peeling processing method for peeling a surface layer of a workpiece by a punch press having a punch holder having a vertically movable peeling processing tool and a die holder having a die having a die hole,
Holding the workpiece in a state where a through-hole formed in the vicinity of the peeled portion on the workpiece is communicated with the die hole of the die,
A peeling processing method comprising: performing peeling processing on the peeling processing portion of the workpiece by the peeling processing tool, and simultaneously sucking release powder generated by the peeling processing into the die hole through the through hole.
Punch having a rotatable peeling tool and a punch holder having a vertically movable peeling tool having a scattering prevention portion provided so as to surround the peeling tool, and a die holder having a die having a die hole It is a peeling processing method for peeling the surface layer of a workpiece by pressing,
At the same time as performing the peeling process on the peeling part of the workpiece by the peeling tool of the peeling tool, the peeling powder generated by the peeling process is attached to the scattering prevention part,
Moving the workpiece to open at least a portion of the die hole of the die;
A peeling processing method, wherein a suction force is applied to the die to suck the peeling powder adhered to the scattering prevention portion into the die hole.
It is the peeling processing method of Claim 2, Comprising:
The peeling processing method characterized by performing suction of the peeling powder by the suction force every predetermined time or every change of the peeling processing portion of the workpiece.
It is the peeling processing method of Claim 2 or 3,
After the workpiece is moved so as to open at least a part of the die hole and before the peeling powder is sucked by the suction force, the peeling powder scattering prevention unit is brought close to the die hole. A peeling processing method, wherein the peeling processing tool is lowered.
A peeling processing apparatus for use in the peeling processing method according to any one of claims 1 to 4,
A punch holder with a vertically movable peeling tool;
A die holder including a die having a die hole,
The peeling tool is a cylindrical tool holder that can move vertically with respect to the punch holder;
A rotary actuator provided inside the tool holder, a peeling tool rotated by the rotary actuator, provided at a lower portion of the tool holder, and provided to surround the peeling tool, and rotated by the rotary actuator. The anti-scattering part prevents the exfoliation powder generated when the exfoliation tool is brought into contact with the exfoliation processing part of the workpiece to perform exfoliation processing, and
The peeling processing apparatus according to claim 1, wherein the die includes a workpiece support portion that supports the peeling portion of the workpiece from below at the center of the die hole.
It is a peeling processing apparatus of Claim 5, Comprising:
The scattering prevention part is configured as an annular body whose lower end can contact the workpiece,
An exfoliation processing device, wherein an outside diameter or maximum width of the work support part is made smaller than an inside diameter of the annular body.
A die for use in the peeling method according to any one of claims 1 to 4,
The die has a die hole opened upward,
A die characterized in that a workpiece support portion is provided in the center of the die hole for supporting a workpiece peeled portion from below.
A die according to claim 7,
It has a flange that expands outwards at the top,
The die characterized in that an inner diameter of the die hole is expanded by an inclined peripheral surface formed in the flange.
A die according to claim 7 or 8,
The work support portion is connected to the inner peripheral surface of the die hole by at least one connecting portion;
The die characterized in that the upper edge of the connecting portion is set lower than the upper surface of the die.