WO2013061785A1 - 物理量センサ装置とその製造方法 - Google Patents
物理量センサ装置とその製造方法 Download PDFInfo
- Publication number
- WO2013061785A1 WO2013061785A1 PCT/JP2012/076279 JP2012076279W WO2013061785A1 WO 2013061785 A1 WO2013061785 A1 WO 2013061785A1 JP 2012076279 W JP2012076279 W JP 2012076279W WO 2013061785 A1 WO2013061785 A1 WO 2013061785A1
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- WO
- WIPO (PCT)
- Prior art keywords
- hole
- protrusion
- housing
- physical quantity
- lid
- Prior art date
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Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P1/00—Details of instruments
- G01P1/02—Housings
- G01P1/023—Housings for acceleration measuring devices
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
- G01L19/14—Housings
- G01L19/147—Details about the mounting of the sensor to support or covering means
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
- G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
- G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
- G01P15/0802—Details
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/06—Containers; Seals characterised by the material of the container or its electrical properties
- H01L23/08—Containers; Seals characterised by the material of the container or its electrical properties the material being an electrical insulator, e.g. glass
Definitions
- the present invention relates to a physical quantity sensor device, and more particularly to the structure of a housing for housing a physical quantity sensor.
- a physical quantity sensor device that detects a physical quantity loaded from the outside for example, a diaphragm is flexed by the physical quantity loaded from the outside, and a physical quantity sensor device that detects a physical quantity such as pressure or acceleration by this deflection is a mobile phone, a watch, etc.
- a physical quantity sensor device that detects a physical quantity such as pressure or acceleration by this deflection is a mobile phone, a watch, etc.
- a glass pedestal 502 combined with a semiconductor pressure sensor element 501 is formed on the bottom of a recess 503 a formed in the center of the inside of a resin case 503 by an adhesive 508. Bonded and fixed. Then, the adhesive 509 is applied to the outer peripheral surface area (the outer peripheral side of the rib-like protrusion 503 b) of the end face of the resin case 503 joined to the lid 506, and the lid 506 is covered on the resin case 503. 506 and the resin case 503 are fixed. Further, a pressure introducing hole 504 is provided on the bottom side of the resin case 503 so as to be open.
- electrodes (not shown) of the semiconductor pressure sensor element 501 and the lead terminals 510 are electrically connected by bonding wires 505. Then, in order to protect the semiconductor pressure sensor element 501 and the bonding wire 505, a silicone gel 507 is injected into the resin case 503.
- the case member 620 is inserted into the insertion hole 601 of the device housing 600, and the electronic circuit board 640 is attached to the case member 620 through the gasket 630.
- the pressure sensor chip 650 is mounted on the electronic circuit board 640, and the cover member 660 is attached to the case member 620 so as to cover the pressure sensor chip 650.
- the cover member 660 is attached to the case member 620 in a one-touch manner by the claws 661 of the cover member 660 being engaged with the locking holes 624 of the case member 620.
- the electronic circuit board 640 is fixed to the arrangement surface 622 of the case member 620 in a one-touch manner by being locked by the claws 621 of the case member 620.
- the pressure to be measured acts on the pressure receiving surface of the pressure sensor chip 650 made of the silicon diaphragm through the pressure introducing hole 623 and the through hole 643 provided in the case member 620 and the electronic circuit board 640.
- the fixing between the resin case 503 and the lid 506 is performed by applying an adhesive 509 to the outer peripheral area of the end face of the resin case 503.
- the cover 506 is placed on top of the cover and the adhesive 509 is cured while applying pressure between the two.
- the excess adhesive 509 protrudes to the inner and outer peripheral surfaces of the resin case 503 and mixes with the silicon gel 507 injected into the resin case 503 or bonding.
- adhesion to the wire 505 there is a case that such a problem that it is protruded to the outer peripheral surface side of the resin case 503 and the appearance is impaired.
- rib-like projections 503b are formed upright on the end face of the resin case 503 along the circumferential direction. Further, an adhesive reservoir groove 506b is formed on the lid 506 at an abutment portion 506a that abuts against the end face of the resin case 503 on the inner peripheral side than the rib-like protrusion 503b and a part facing the rib-like protrusion 503b. .
- the abutment step 506a is fitted and abuts on the inner peripheral side of the rib-like projection 503b, and the extra adhesive 509
- the adhesive 509 escapes into the resin case 503 by escaping into the adhesive reservoir groove 506b.
- chamfered portions 503 c and 506 c are formed on the outer peripheral edge of the resin case 503 and the lid 506 so as to be tapered.
- the portion pushed out toward the outer peripheral side of the adhesive 509 escapes into the enlarged space surrounded by the chamfered portion 503 c and the chamfered portion 506 c, and the adhesive 509 protrudes to the outer peripheral surface of the resin case 503. I'm preventing.
- the cover member 660 (lid) is attached to the case member 620 (housing) without using an adhesive.
- This attachment is made in a one-touch type by locking each tab portion 661 formed on the cover member 660 to each locking hole 624 formed on the case member 620.
- each claw portion 661 is elastically deformed, and when locked, the deformation is released, whereby each claw portion 661 strikes each locking hole 624 and gives an impact. This impact may be propagated to cause damage such as a crack or a crack to the diaphragm.
- Damages such as cracks and cracks are determined to be defects in shipping inspection, resulting in an increase in manufacturing cost.
- the damage to the diaphragm may be a factor that accelerates deterioration over time after the product is shipped to the market. At this time, a quality problem of increasing the market defect rate occurs.
- An object of the present invention is to solve such problems, and to provide a low-cost and high-quality physical quantity sensor device.
- the physical quantity sensor device of the present invention includes a physical quantity sensor for detecting a physical quantity, a housing for housing the physical quantity sensor, and a lid fixed to the housing, the housing having a hole and the lid
- the body has a protrusion, or the housing has a protrusion and the lid has a hole, and the protrusion is pressed into the hole to fix the housing and the lid. It is characterized by being.
- the protrusion is pressed into the hole, and the lid and the housing are fixed without using an adhesive. Therefore, the material cost of the adhesive can be reduced. In addition, no protrusion failure of the adhesive occurs, and it is not necessary to form a protrusion prevention structure for the housing and the lid.
- the manufacturing cost of the physical quantity sensor device can be reduced by the reduction of the material cost of the adhesive, the reduction of the defect of the adhesive, and the reduction of the processing cost of the protrusion preventing structure.
- the fixation between the housing and the lid is made by pressing the projection into the hole.
- the elastic deformation at the time of pressing the projection into the hole proceeds with the pressing and ends with the end of the pressing. After that, the elastic deformation at the end of the press-in is held as it is and is not released in a short time. Therefore, an impact is generated on the protrusion and the periphery thereof, and damage such as a crack or a crack does not occur in the diaphragm.
- the hole is penetrated, and the protrusion is pressed into the hole and protrudes from the hole, and a step is formed between a portion of the protrusion protruding from the hole and a portion accommodated in the hole. It is preferable that the step portion has a step having a larger outer diameter than the outer diameter of the portion to be accommodated.
- the projection is press-fit into the hole and protrudes to fix the lid and the housing, and the portion of the projection that protrudes from the hole and is accommodated in the hole.
- the formation of the step between the part and the part prevents the protrusion from coming off the hole, so that the fixing between the housing and the lid becomes stable and stable.
- a physical quantity sensor device comprising: a physical quantity sensor for detecting a physical quantity; a housing for housing the physical quantity sensor; and a lid fixed to the housing; A step of forming a projection or a hole in a lid, a step of fixing the housing and the lid by pressing the projection into the hole, a step of heating and deforming the hole and the projection, It is characterized by including.
- the fixing between the housing and the lid becomes stable and stable.
- the fixing of the housing and the lid is achieved by pressing the projection into the hole.
- the elastic deformation at the time of pressing the projection into the hole proceeds with the pressing and ends with the end of the pressing. After that, the elastic deformation at the end of the press-in is held as it is and is not released in a short time. Therefore, an impact is generated on the protrusion and the periphery thereof, and damage such as a crack or a crack does not occur in the diaphragm.
- the hole is formed in a through hole, the protrusion is formed longer than the length in the through direction of the hole, the protrusion is pressed into the hole until a predetermined length protrudes, and the hole and the protrusion are heated. Step so as to transfer the shape of the inner peripheral surface of the through hole to the projection, and between the portion of the projection projecting from the through hole and the portion accommodated in the through hole in the cooling process Is preferably formed.
- the lid and the housing are fixed by pressing the protrusion into the hole and projecting.
- the hole and the protrusion are heated, and the shape of the inner peripheral surface of the hole is transferred to the protrusion by stress due to thermal expansion of each other and compressed and deformed, thereby the portion of the protrusion protruding from the hole and the portion Since the step is formed between the portion accommodated in the hole and the protrusion is prevented from coming off the hole, the fixation between the housing and the lid becomes stable and stable.
- the projections be made of polyphenylene sulfide, polyethylene, polystyrene, ABS resin, vinyl chloride resin, methyl methacrylate resin, nylon, fluorocarbon resin, polycarbonate, polyester resin.
- the projections are made of thermoplastic resins.
- the protrusion and the hole After pressing the protrusion into the hole and causing the protrusion to protrude from the hole, the protrusion and the hole are heated. Since the portion of the protrusion accommodated in the hole is heated in a compressed state on the inner surface of the hole, the protrusion made of a thermoplastic resin is softened by heating and compressive stress from the inner surface of the hole The projection plastically deforms and reduces its outer diameter. As a result, a step is formed between the portion of the protrusion received in the hole and the portion of the protrusion protruding from the hole. Then, in the process of returning from the high temperature in the heated state to room temperature, the protrusions and the holes are thermally shrunk, but the shoulders are held and cured.
- FIG. 1 is a schematic plan view of a physical quantity sensor device in a first embodiment.
- FIG. 2 is a schematic cross-sectional view taken along the line AA of the physical quantity sensor device shown in FIG. 1 and viewed from the arrow direction.
- FIG. 2 is a schematic cross-sectional view taken along the line BB of the physical quantity sensor device shown in FIG. 1 and viewed from the arrow direction. It is the schematic explaining the manufacturing method of 1st Embodiment. It is an enlarged section schematic view of a joint of a projection and a hole. It is the schematic explaining the modification of 1st Embodiment. It is a cross-sectional schematic of the physical quantity sensor apparatus of 2nd Embodiment.
- FIG. 1 It is a cross-sectional schematic of the physical quantity sensor apparatus of 3rd Embodiment. It is a cross-sectional schematic of the physical quantity sensor apparatus disclosed by patent document 1. FIG. It is a cross-sectional schematic of the physical quantity sensor apparatus disclosed by patent document 2. FIG.
- the physical quantity sensor device 1 in the first embodiment is a pressure sensor device that detects an external pressure by the diaphragm being flexed by an external pressure and the electrical resistance of the piezoresistive element provided in the diaphragm being changed by the flexing.
- the physical quantity sensor device 1 is mounted on a seat of a car and used to detect a seating load thereof. For example, there is a demand for detecting the seating of a child so that the airbag does not operate when the child is seated to prevent an accident of the air bag. There is also a demand for detecting seating other than the driver's seat in order to optimize the image of the multi-view display device mounted on a car.
- the physical quantity sensor device 1 is mounted on a seat of a car and used, but the present invention is not limited to this.
- it can be used by being mounted on a mobile device such as a mobile phone, a watch, a video camera and the like.
- the physical quantity sensor device 1 is a pressure sensor device having a diaphragm, but the present invention is not limited to this.
- An acceleration sensor device or a load sensor device with a diaphragm is also possible.
- a physical quantity sensor device without a diaphragm is also possible.
- the Y direction is the left and right direction
- the Y1 direction is the left direction
- the Y2 direction is the right direction
- the X direction is the front and back direction
- the X1 direction is the front direction and the X2 direction is the back direction.
- a direction perpendicular to both the X direction and the Y direction is the vertical direction (Z direction; height direction)
- the Z1 direction is the upper direction
- the Z2 direction is the lower direction.
- FIG. 1 is a schematic plan view of the physical quantity sensor device 1 in the first embodiment.
- FIG. 2 is a schematic cross-sectional view taken along the line AA of the physical quantity sensor device 1 shown in FIG. 1 and viewed from the arrow direction.
- FIG. 3 is a schematic cross-sectional view taken along the line BB of the physical quantity sensor device 1 shown in FIG. 1 and viewed from the arrow direction.
- FIG. 5 is a schematic enlarged cross-sectional view of the joint of the protrusion and the hole.
- the housing 3 is erected on the periphery of the bottom wall 3 a, and a side wall 3 b is formed surrounding the bottom wall 3 a.
- An opening 9 for opening the pressure sensor 6 is formed in the upper portion of the housing 3 so as to be surrounded by the side wall 3 b.
- the lid 2 is provided with a pressure introducing hole 10 which is covered at the opening 9 and is a through hole for introducing an external pressure.
- the physical quantity sensor device 1 is configured to be housed in the housing 3 by fixing the pressure sensor 6 to the upper surface 3c of the bottom wall 3a of the housing 3 having a concave shape. ing.
- the protrusion 5 provided on the lid 2 in a protruding manner is press-fit into the hole 4 provided on the housing 3 and formed in the through hole, The tip end portion of the projection 5 is made to project from the hole 4.
- the step part 5c is provided between the part 5a of the protrusion 5 which protrudes from the hole 4, and the part 5b of the protrusion 5 accommodated in the hole 4.
- the stepped portion 5c is formed such that the outer diameter of the portion 5a of the protrusion 5 protruding from the hole 4 is larger than the outer diameter of the portion 5b of the protrusion 5 accommodated in the hole 4, that is, the inner diameter of the hole 4 formed in the through hole It is done. Therefore, the portion 5 a of the projection 5 protruding from the hole 4 prevents the projection 5 from coming off the hole 4, so that the fixing between the housing 3 and the lid 2 becomes stable and stable.
- the external pressure is introduced into the cavity 11 provided in a hollow shape in the physical quantity sensor device 1 through the pressure introducing hole 10. Further, on the upper surface of the pressure sensor 6 provided in the cavity 11, a diaphragm 7 which is bent according to the external pressure is formed as a sensitive part. Therefore, the diaphragm 7 bends in response to the external pressure introduced through the pressure introducing hole 10, and the electric resistance of the piezoresistive element (not shown) provided on the diaphragm 7 changes in response to the bending. And the external pressure is detected from the change of this electrical resistance.
- the pressure sensor 6 of this embodiment is a strain gauge system such as a piezoresistive element, but is not limited to this. It is also possible to use an electrostatic capacitance system in which a movable electrode formed of a diaphragm and a fixed electrode are opposed to form a capacitor and external pressure is detected.
- the physical quantity sensor device 1 is provided with a lead terminal 21 for outputting an electric signal to the outside, and one end of the lead terminal 21 is the upper surface of the bottom wall 3 a of the housing 3 in the cavity 11.
- a housing electrode 21a is formed on 3c.
- the pad electrode (not shown) of the pressure sensor 6 and the housing electrode 21 a are electrically connected to each other through the bonding wire 13. Further, the pressure sensor 6, the bonding wire 13, and the housing electrode 21a are covered and protected by the potting resin 12 which is a flexible and low elastic resin. Thus, the external pressure acts on the diaphragm 7 through this soft and low elastic resin.
- an electrical signal which is a change in electrical resistance caused by external pressure, is output from the pad electrode of the pressure sensor 6 to the electrical circuit of the automobile by the lead terminal 21 through the bonding wire 13.
- the pressure sensor 6, the bonding wire 13, and the housing electrode 21 a are covered and protected by a flexible and low elastic resin, but the present invention is not limited thereto. It is also possible that it is not covered with a soft, low elasticity resin.
- FIG. 4 is a schematic view for explaining the manufacturing method of the first embodiment.
- FIG. 5 shows a schematic enlarged cross-sectional view of the joint between the protrusion and the hole. Below, the manufacturing method of the physical quantity sensor device 1 of this embodiment is demonstrated according to FIG. 4 and FIG.
- a housing substrate 20 in which a plurality of housings 3 arranged at a constant pitch and a plurality of leads 21 are integrated is manufactured by insert molding or the like.
- a plurality of holes 4 are formed in the through holes in each housing 3.
- one end of each lead terminal 21 is in the cavity 11 of the housing 3 and constitutes each housing electrode 21a on the upper surface 3c of the bottom wall 3a.
- thermosetting resin 23 is applied to a predetermined range of the upper surface 3c of the bottom wall 3a of each housing 3 by a dispenser of an application device. Then, the pressure sensor 6 is placed at the location where the thermosetting resin 23 is applied, and heating is performed for 30 minutes to 2 hours at a temperature of 100 ° C. to 250 ° C. to cure the liquid thermosetting resin 23. The pressure sensor 6 is fixed to the upper surface 3c.
- each pad electrode (not shown) provided on the upper surface of the pressure sensor 6 and each housing electrode 21a provided on the upper surface 3c of the bottom wall 3a of the housing 3 It is electrically connected by the bonding wire 13.
- a liquid potting resin 12 is dropped on the pressure sensor 6, the bonding wire 13, and the like from the opening 9 formed by being surrounded by the side wall 3 b in the upper part of the housing 3 by a dispenser. Then, heating is performed at a temperature of 100 ° C. to 250 ° C. for about 30 minutes to 2 hours. As a result, the liquid potting resin 12 is soft and hardens to a low elasticity resin, and as shown in FIG. 4B, the pressure sensor 6 and the bonding wire 13 are flexible and low elasticity resin potting resin Covered and protected by twelve.
- the lid 2 having the projections 5 is formed by injection molding or the like.
- the projections 5 formed in a projecting shape in the lid 2 from the holes 4 formed in the through holes in the housing 3 are in the vertical direction (Z1-Z2 direction), that is, the holes 4 penetrate It is formed long in the direction. Further, the outer diameter of the projection 5 is formed larger than the inner diameter of the hole 4.
- the projection 5 is inserted into the hole 4 and pressed to press-fit. Then, pressing is performed until a predetermined length of the protrusion 5 protrudes from the hole 4.
- each lid 2 is fixed to each housing 3.
- the predetermined length of the projection 5 is preferably 10% to 50% of the total length of the projection 5 in the vertical direction (Z1-Z2 direction). In such an embodiment, it is possible to firmly form the portion 5 a of the protrusion 5 protruding from the hole 4.
- the lid 2 and the housing 3 are formed of a thermoplastic resin.
- the thermoplastic resin can be selected from polyphenylene sulfide, polyethylene, polystyrene, ABS resin, polyvinyl chloride resin, methyl methacrylate resin, nylon, fluorocarbon resin, polycarbonate, polyester resin and the like.
- the outer diameter of the protrusion 5 formed in the shape of a protrusion is set larger than the inner diameter of the hole 4 formed in the through hole.
- the inner diameter of the hole 4 is about 0.3 mm to 1.0 mm
- the outer diameter of the protrusion 5 is about 0.32 mm to 1.1 mm.
- the outer diameter of the protrusion 5 is larger than the inner diameter of the hole 4 to about 0.02 mm to 0.1 mm.
- the portion 5 b accommodated in the hole 4 of the protrusion 5 It receives compressive stress from the inner circumferential surface 4a.
- the hole 4 accommodating the projection 5 receives tensile stress from the outer peripheral surface of the projection 5.
- the compressive stress acting on the portion 5b accommodated in the hole 4 of the protrusion 5 increases in size so as to converge from the outer peripheral surface of the protrusion 5 formed in the protrusion shape to the axial center.
- the tensile stress acting on the portion of the hole 4 that accommodates the projection 5 decreases in size so as to diverge outward from the inner peripheral surface of the hole 4 formed in the through hole.
- a step 5 c is formed between the portion 5 b accommodated in the hole 4 of the protrusion 5 and the portion 5 a of the protrusion 5 protruding from the hole 4.
- the stepped portion 5c has a step such that the outer diameter of the portion 5a protruding from the hole 4 of the protrusion 5 is larger than the inner diameter of the hole 4 (the outer diameter of the portion 5b accommodated in the hole 4 of the protrusion 5). It is formed.
- the holes 4 and the projections 5 made of thermoplastic resin soften and project from the holes 4 of the projections 5 from the inner diameter of the holes 4 (the outer diameter of the portion 5 b accommodated in the holes 4 of the projections 5). It plastically deforms while holding the step 5c where the outer diameter of the portion 5a is large. And in the cooling process which returns to room temperature, this step part 5c is hold
- the lid 2 and the housing 3 are stably and firmly fixed.
- the lead terminals 21 (housing substrate 20) are cut by a slicing apparatus or the like to be separated into pieces and a plurality of physical quantity sensor devices 1 Is produced.
- the thermal expansion coefficients of the holes 4 and the protrusions 5 may be different. Therefore, at the time of heating at 200 ° C. to 300 ° C., the inner diameter of the hole 4 and the outer diameter of the protrusion 5 both thermally expand and become larger, but the inner diameter becomes larger than the outer diameter. There is concern that the tightening will be insufficient. Therefore, it is preferable to set the dimensional difference between the inner diameter of the hole 4 and the outer diameter of the protrusion 5 in consideration of the thermal expansion coefficient of the hole 4 and the protrusion 5 so that the above-mentioned tightening does not become insufficient.
- the tips of the protrusions 5 are formed to be tapered. By doing this, the projections 5 can be easily pressed into the holes 4.
- the cross section of the hole 4 and the protrusion 5 is a circle, but is not limited to this. It is also possible to form the cross section of the hole 4 formed in the introduction hole into an ellipse or a polygon and to form the cross section of the protrusion 5 formed into a protrusion into a circle or a polygon. Then, the outer diameter of the protrusion 5 is set larger than the inner diameter of the hole 4 in all or a part of the portion where the inner circumferential surface of the hole 4 and the outer circumferential surface of the protrusion 5 abut.
- a gap can be formed in a part between the inner peripheral surface of the hole 4 and the outer peripheral surface of the protrusion 5, and the protrusion 5 can be easily inserted into the hole 4 and press-fitted. Further, since there is a portion where the outer diameter of the protrusion 5 is provided larger than the inner diameter of the hole 4, the protrusion 5 is sufficiently tightened in the hole 4.
- the potting resin 12 is preferably a compound mainly composed of an epoxy resin, a melamine resin, a polyimide resin, a silicone resin, a urethane resin, a polyester resin, or a fluorine-based resin.
- thermosetting resin 23 it is possible to use a compound having any of epoxy resin, melamine resin, phenol resin, and polyester resin as a main material.
- both the lid 2 and the housing 3 are made of the thermoplastic resin, but the present invention is not limited to this. It is preferable that the lid 2 having the projections 5 formed in the shape of a projection be made of a thermoplastic resin, since it is preferable that at least the projections 5 formed in the shape of the projections be plastically deformed. It is not necessary for the housing 3 to have a thermoplastic resin.
- each housing 3 and each lid 2 are fixed without using an adhesive as described above. Therefore, the material cost of the adhesive can be reduced. In addition, no protrusion failure of the adhesive occurs, and it is not necessary to form a protrusion prevention structure for each housing 3 and each lid 2.
- the manufacturing cost of the physical quantity sensor device 1 can be reduced by reducing the material cost of the adhesive, reducing the adhesive defect, and reducing the processing cost of the protrusion preventing structure. It can be reduced.
- the fixing of the respective housings 3 and the respective lids 2 is performed by inserting the projections 5 formed in the shape of projections of the respective lids 2 into the holes 4 formed in the through holes of the respective housings 3 Press-fit by doing. Then, a predetermined length of the protrusion 5 is made to project from the hole 4. As a result, a step 5 c is formed between the portion 5 b accommodated in the hole 4 of the projection 5 and the portion 5 b of the projection 5 protruding from the hole 4 by elastic deformation.
- the heat treatment is performed in a state in which the step 5c is formed, and the hole 4 and the projection 5 are plastically deformed to stably maintain the step 5c.
- the projection 5 is prevented from coming off the hole 4 and the hole 4 and the projection 5 are firmly fixed.
- the projection 5 is inserted into the hole 4 and is elastically deformed while being pressed, and this elastic deformation is changed to plastic deformation. Further, the stepped portion 5c is formed, and the hole 4 and the protrusion 5 are firmly fixed. Therefore, as in the prior art disclosed in Patent Document 2, no impact occurs due to release of elastic deformation or the like. Therefore, the impact is not propagated and damage such as a crack or a crack does not occur in the diaphragm.
- pressing is performed until the predetermined length of the protrusion 5 protrudes from the hole 4 and heating is performed at a temperature of 200 ° C. to 300 ° C. for about 30 minutes to 2 hours.
- heating is performed at a temperature of 200 ° C. to 300 ° C. for about 30 minutes to 2 hours.
- the portion 5 b accommodated in the hole 4 of the projection 5 is tightened by the inner peripheral surface of the hole 4, and the portion 5 b accommodated in the hole 4 of the projection 5 and the projection 5 projecting from the hole 4
- a step 5c is formed between the portion 5a and the hole 4 and the projection 5 are firmly fixed.
- the pressure sensor 6 is accommodated in the housing 3 as shown in FIGS. 2 to 4 in the present embodiment, the present invention is not limited to this. As shown in FIG. 6, it is also possible for the housing 3 together with the pressure sensor 6 to accommodate a control circuit chip 8 for amplifying an output signal from the pressure sensor 6, supplying power to the pressure sensor 6, and the like.
- a gap can be formed between the housing 3 and the lid 2. Then, this gap can be used as a pressure introducing hole for introducing an external pressure. Therefore, it is not necessary to form the pressure introducing hole 10 in the lid 2, and the processing cost of the pressure introducing hole 10 can be reduced. Therefore, in such an embodiment, the manufacturing cost of the physical quantity sensor device 1 is reduced. be able to.
- the housing 3 and the lid 2 are fixed with an adhesive to form a gap between the housing 3 and the lid 2 and this gap can be used as a pressure introducing hole.
- the space between the housing 3 and the lid 2 is not clogged with the adhesive. Therefore, it is possible to provide a longer gap. Therefore, the more responsive physical quantity sensor device 1 can be provided.
- the suction port of the suction nozzle to be picked up is the surface portion of the lid 2 without the pressure introducing hole 10 It is preferable to completely cover the entire pressure introducing hole 10 or completely cover the pressure introducing hole 10.
- the suction port of the suction nozzle to be picked up covers only a part of the pressure introducing hole 10, the suction port is open to the atmosphere, so the adsorption force is weak and the physical quantity sensor device 1 is easily dropped during transportation.
- the gap formed between the housing 3 and the lid 2 is used as a pressure introducing hole for introducing an external pressure
- it is not necessary to completely cover the pressure introducing hole 10 with the suction port and to exhaust the gas in the cavity 11 of the physical quantity sensor device 1 sufficiently it is possible to shorten the transportation time for component mounting.
- the physical quantity sensor device 1 is a pressure sensor device. Therefore, a pressure introducing hole 10 is formed in the lid 2 shown in FIGS. 1 to 4.
- the lid 2 may not be provided with a through hole such as the pressure introducing hole 10.
- FIG. 7 is a schematic cross-sectional view of the physical quantity sensor device 201 of the second embodiment.
- the holes 4 are formed to have bottomed hollow holes.
- the protrusion 5 is formed in protrusion shape. Then, the outer diameter of the protrusion 5 formed in the shape of a protrusion is formed larger than the inner diameter of the hole 4 formed in the bottomed hollow hole.
- the present embodiment is basically the same as the first embodiment except that the hole 4 is a bottomed hollow hole and that the protrusion 5 does not protrude from the hole 4. Therefore, the lid 5 and the housing 3 are firmly fixed by the projection 5 being stably and firmly tightened in the hole 4.
- FIG. 8 is a schematic cross-sectional view of the physical quantity sensor device 301 of the third embodiment.
- the projection 5 is formed in the housing 3 in the form of a projection, and the hole 4 is formed in the lid 2 in the conduction hole. Further, the outer diameter of the projection 5 is formed larger than the inner diameter of the hole 4.
- the present embodiment is basically the same as the first embodiment except that the projection 5 is formed in the housing 3 and the hole 4 is formed in the lid 2. Therefore, the projection 5 is stably and firmly tightened in the hole 4, and a step 5 c is formed between the portion of the projection 5 accommodated in the hole 4 and the portion of the projection 5 projecting from the hole 4.
- the holes 4 and the projections 5 are firmly fixed.
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- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Measuring Fluid Pressure (AREA)
Abstract
Description
第1の実施形態における物理量センサ装置1は、外部の圧力によってダイヤフラムが撓み、この撓みによりダイヤフラムに備わるピエゾ抵抗素子の電気抵抗が変化することで、外部の圧力を検知する圧力センサ装置である。
図7は第2の実施形態の物理量センサ装置201の断面略図である。図7に示すように、本実施形態では、孔4は有底中空の穴を有して形成されている。また、突起5は突起状に形成されている。そして、突起状に形成される突起5の外径は有底中空の穴に形成される孔4の内径より大きく形成されている。
図8は第3の実施形態の物理量センサ装置301の断面略図である。図8に示すように、本実施形態では、ハウジング3に突起5が突起状に形成され、蓋体2に孔4が導通孔に形成されている。また、突起5の外径が孔4の内径より大きく形成されている。
2 蓋体
3 ハウジング
4 孔
5 突起
6 圧力センサ
7 ダイヤフラム
8 制御回路チップ
9 開口部
10 圧力導入孔
11 キャビティ
12 ポッティング樹脂
13 ボンディングワイヤ
20 ハウジング基板
21 リード端子
Claims (5)
- 物理量を検知する物理量センサと、
前記物理量センサを収納するハウジングと、
前記ハウジングに固定される蓋体と、
を有し、
前記ハウジングが孔を有してなると共に前記蓋体が突起を有しなり、または、前記ハウジングが突起を有してなると共に前記蓋体が孔を有してなり、前記孔に前記突起が圧入されて前記ハウジングと前記蓋体とが固定されていることを特徴とする物理量センサ装置。 - 前記孔が貫通してなり、前記突起が前記孔に圧入され前記孔から突出してなり、前記突起の前記孔から突出した部分と前記孔内に収容される部分との間に段部が形成されてなり、前記段部が前記収容される部分の外径より前記突出した部分の外径が大きい段差を有することを特徴とする請求項1に記載の物理量センサ装置。
- 物理量を検知する物理量センサと、
前記物理量センサを収納するハウジングと、
前記ハウジングに固定される蓋体と、
を有する物理量センサ装置の製造方法において、
前記ハウジングに孔または突起を形成する工程と、
前記蓋体に突起または孔を形成する工程と、
前記孔に前記突起を圧入することで前記ハウジングと前記蓋体とを固定する工程と、
前記孔と前記突起とを加熱して変形させる工程と、
を含むことを特徴とする物理量センサ装置の製造方法。 - 前記孔を貫通孔に形成し、前記突起を前記孔の貫通方向の長さより長く形成し、所定の長さが突出するまで前記孔に前記突起を圧入し、前記孔と前記突起とを加熱して前記突起に該貫通孔の内周面の形状を転写するように変形させ、冷却過程において前記突起の該貫通孔から突出した部分と該貫通孔内に収容される部分との間に段部を形成させることを特徴とする請求項3に記載の物理量センサ装置の製造方法。
- 前記突起が、ポリフェニレンスルファイド、ポリエチレン、ポリスチレン、ABS樹脂、塩化ビニール樹脂、メタクリル酸メチル樹脂、ナイロン、フッ素樹脂、ポリカーボネート、ポリエステル樹脂からなることを特徴とする請求項3または請求項4に記載の物理量センサ装置の製造方法。
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Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2015152501A (ja) * | 2014-02-17 | 2015-08-24 | セイコーエプソン株式会社 | 物理量センサー、電子機器および移動体 |
CN107367257A (zh) * | 2016-04-25 | 2017-11-21 | Asm自动化传感器测量技术有限公司 | 传感器壳体 |
WO2018168416A1 (ja) * | 2017-03-17 | 2018-09-20 | 株式会社鷺宮製作所 | 圧力センサ |
US20230160919A1 (en) * | 2019-10-17 | 2023-05-25 | Valqua, Ltd. | Low Heat-Resistant Sensor |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH11173936A (ja) * | 1997-12-15 | 1999-07-02 | Matsushita Electric Works Ltd | 圧力センサ |
JP2004260010A (ja) * | 2003-02-26 | 2004-09-16 | Kyocera Corp | 電子部品及びその組立方法 |
-
2012
- 2012-10-11 WO PCT/JP2012/076279 patent/WO2013061785A1/ja active Application Filing
- 2012-10-11 JP JP2013540718A patent/JP5755337B2/ja active Active
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH11173936A (ja) * | 1997-12-15 | 1999-07-02 | Matsushita Electric Works Ltd | 圧力センサ |
JP2004260010A (ja) * | 2003-02-26 | 2004-09-16 | Kyocera Corp | 電子部品及びその組立方法 |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2015152501A (ja) * | 2014-02-17 | 2015-08-24 | セイコーエプソン株式会社 | 物理量センサー、電子機器および移動体 |
CN107367257A (zh) * | 2016-04-25 | 2017-11-21 | Asm自动化传感器测量技术有限公司 | 传感器壳体 |
CN107367257B (zh) * | 2016-04-25 | 2021-01-15 | Asm自动化传感器测量技术有限公司 | 传感器壳体 |
WO2018168416A1 (ja) * | 2017-03-17 | 2018-09-20 | 株式会社鷺宮製作所 | 圧力センサ |
JP2018155621A (ja) * | 2017-03-17 | 2018-10-04 | 株式会社鷺宮製作所 | 圧力センサ |
US20230160919A1 (en) * | 2019-10-17 | 2023-05-25 | Valqua, Ltd. | Low Heat-Resistant Sensor |
US11835539B2 (en) * | 2019-10-17 | 2023-12-05 | Valqua, Ltd. | Low heat-resistant sensor |
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JP5755337B2 (ja) | 2015-07-29 |
JPWO2013061785A1 (ja) | 2015-04-02 |
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