WO2013042751A1 - 積層体、積層板、多層積層板、プリント配線板及び積層板の製造方法 - Google Patents

積層体、積層板、多層積層板、プリント配線板及び積層板の製造方法 Download PDF

Info

Publication number
WO2013042751A1
WO2013042751A1 PCT/JP2012/074119 JP2012074119W WO2013042751A1 WO 2013042751 A1 WO2013042751 A1 WO 2013042751A1 JP 2012074119 W JP2012074119 W JP 2012074119W WO 2013042751 A1 WO2013042751 A1 WO 2013042751A1
Authority
WO
WIPO (PCT)
Prior art keywords
resin
fiber
laminate
layer
glass substrate
Prior art date
Application number
PCT/JP2012/074119
Other languages
English (en)
French (fr)
Japanese (ja)
Inventor
真裕 青嶌
佳弘 高橋
由香 山崎
上方　康雄
村井　曜
Original Assignee
日立化成株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日立化成株式会社 filed Critical 日立化成株式会社
Priority to KR1020147007229A priority Critical patent/KR20140063712A/ko
Publication of WO2013042751A1 publication Critical patent/WO2013042751A1/ja

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
    • B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
    • B32B17/10—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
    • B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
    • B32B17/10—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin
    • B32B17/10005—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing
    • B32B17/1055—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the resin layer, i.e. interlayer
    • B32B17/10614—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the resin layer, i.e. interlayer comprising particles for purposes other than dyeing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
    • B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
    • B32B17/10—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin
    • B32B17/10005—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing
    • B32B17/1055—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the resin layer, i.e. interlayer
    • B32B17/10697—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the resin layer, i.e. interlayer being cross-linked
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
    • H01L23/145—Organic substrates, e.g. plastic
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/036—Multilayers with layers of different types
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
    • H01L23/15—Ceramic or glass substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0183—Dielectric layers
    • H05K2201/0191—Dielectric layers wherein the thickness of the dielectric plays an important role
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles

Definitions

  • the present invention relates to a laminate and a laminate suitable for semiconductor packages and printed wiring boards, a printed wiring board using the laminate, a multilayer laminate, and a method for producing the laminate.
  • the low elastic modulus of the laminated plate also causes warpage, it is also effective to increase the elasticity of the laminated plate in order to reduce warpage.
  • it is effective to reduce the expansion coefficient and increase the elasticity of the laminate.
  • a glass film is used as a layer having a coefficient of thermal expansion substantially matching the coefficient of thermal expansion of the electronic component (silicon chip), and the resin and the glass film are pressed and laminated. Attempts have been made to reduce the shock stress (Patent Document 4), but since the elastic modulus of the resin layer is low and the thermal expansion coefficient is high, it is insufficient to realize a low warpage of the substrate.
  • the substrate obtained by the manufacturing method of Patent Document 4 still has a low elastic modulus and a high coefficient of thermal expansion, it is insufficient for realizing a low warpage of the substrate.
  • the present invention has been made in view of such circumstances, and has a low thermal expansion coefficient and a high elastic modulus, can suppress warpage, and is suitable for the production of a laminated board and a multilayer laminated board, and a laminated board that hardly causes cracks. It is an object of the present invention to provide a multilayer laminated board, a printed wiring board using the laminated board and the multilayer laminated board, and a method for producing the laminated board.
  • Patent Document 4 there is no description that a fiber base material is contained in a resin in a substrate formed by laminating a glass film and a resin. From the description of Patent Document 4, it is considered that the resin should contain a fiber base material. That is, in patent document 4, it is set as the essential structure that the thermal expansion effect
  • the resin when the fiber base material is contained in the resin, the resin has a high elastic modulus. Therefore, from the description of Patent Document 4, it should be avoided that the resin contains a fiber base material. Moreover, when a fiber base material is contained in the resin of Patent Document 4, it is considered that the glass substrate easily breaks starting from the fiber base material. Also from this point, in patent document 4, it is estimated that it contains avoiding containing a fiber base material in resin. At present, there is no example of a laminate in which a fiber base material is contained in a resin layer in a laminate of a glass substrate layer and a resin layer as in Patent Document 4.
  • the present inventors have conducted extensive research to solve the above problems, and as a result, in the laminate including the resin cured product layer and the glass substrate layer, the resin cured product layer contains a fiber base material. It has been found that a laminated board having a low thermal expansion coefficient and a high elastic modulus, suppressing warpage, and hardly causing cracks can be obtained.
  • the inorganic filler is one or more selected from silica, alumina, talc, mica, aluminum hydroxide, magnesium hydroxide, calcium carbonate, aluminum borate, and borosilicate glass.
  • the laminated body as described in. [5] The laminate according to any one of [1] to [4], wherein the fiber base material is one or more selected from glass fiber, polyimide fiber, polyester fiber, and polytetrafluoroethylene fiber.
  • thermosetting resin is an epoxy resin, phenol resin, unsaturated imide resin, cyanate resin, isocyanate resin, benzoxazine resin, oxetane resin, amino resin, unsaturated polyester resin, allyl resin, dicyclopentadiene resin,
  • the laminate according to any one of [1] to [5], which is one or more selected from silicone resins, triazine resins, and melamine resins.
  • a laminate including one or more resin cured product layers and one or more glass substrate layers, wherein the resin cured product layer is a cured fiber-containing resin composition including a thermosetting resin fiber substrate.
  • a laminated plate comprising a cured fiber-containing resin layer comprising 10 to 70% by volume of the glass substrate layer with respect to the entire laminated plate.
  • a multilayer laminate comprising a plurality of laminates, wherein at least one laminate is the laminate according to any one of [7] to [9].
  • a printed wiring board comprising the laminated board according to any one of [7] to [9] and wiring provided on the surface of the laminated board.
  • the fiber-containing resin cured product layer forming step is a step of laminating and curing a film made of the fiber-containing resin composition on the glass substrate using a vacuum laminator or a roll laminator.
  • the manufacturing method of the laminated board of description [15]
  • the laminated plate according to [13], wherein the fiber-containing resin cured product layer forming step is a step of placing and curing the film made of the fiber-containing resin composition on the glass substrate. Production method.
  • laminates and multilayer laminates that have a low thermal expansion coefficient and a high elastic modulus, can suppress warpage, and are less likely to crack, and laminates suitable for manufacturing these laminates and multilayer laminates And the printed wiring board using these laminated boards and multilayer laminated boards, and the manufacturing method of this laminated board can be provided.
  • the laminate means that the thermosetting resin that is a constituent component is uncured or semi-cured
  • the laminate means that the thermosetting resin that is a constituent component is cured.
  • the laminate of the present invention is a laminate comprising one or more resin composition layers and one or more glass substrate layers, wherein the resin composition layer contains a thermosetting resin and a fiber substrate. It is made of a resin composition, and the glass substrate layer is 10 to 70% by volume with respect to the entire laminate.
  • the size of the laminate of the present invention is selected in the range of 10 mm to 1000 mm in width and 10 mm to 3000 mm in length (in the case of use in a roll, the length is appropriately applied) from the viewpoint of handleability. preferable.
  • the width is preferably 25 mm to 550 mm and the length is 25 mm to 550 mm.
  • the thickness of the laminate of the present invention is preferably selected in the range of 35 ⁇ m to 20 mm depending on the application.
  • the thickness of the laminate is more preferably 50 to 1000 ⁇ m, still more preferably 80 to 600 ⁇ m, still more preferably 100 to 500 ⁇ m, and still more preferably 110 to 450 ⁇ m.
  • the laminate of the present invention is a laminate comprising one or more resin composition layers and one or more glass substrate layers, wherein the resin composition layer contains a thermosetting resin and a fiber substrate. It is made of a resin composition, and the glass substrate layer is 10 to 70% by volume with respect to the entire laminate.
  • a laminated board obtained by curing the fiber-containing resin composition layer of the laminate of the present invention to obtain a fiber-containing resin cured material layer is a glass substrate layer having a low thermal expansion coefficient and a high elastic modulus as much as a silicon chip. Therefore, it becomes a thing with a low thermal expansion coefficient and a high elasticity modulus, a curvature is suppressed, and it becomes difficult to produce a crack.
  • this laminate since this laminate has a glass substrate layer with high heat resistance, it has a low thermal expansion property in a temperature range from 100 ° C. to less than Tg of the fiber-containing resin cured product.
  • the fiber base material contains in the fiber-containing resin cured product layer
  • the fiber-containing resin cured product layer has a low thermal expansion coefficient and a high elastic modulus
  • the laminate including the fiber-containing resin cured product layer is thus, a lower expansion coefficient and a higher elastic modulus are obtained.
  • the laminated body of this invention has the said structure other than the fiber base material containing resin composition layer of 1 layer or more and the glass substrate layer of 1 layer or more, it will not contain a fiber further. Can have.
  • the laminate is preferably composed of one or more fiber-containing resin composition layers and one or more glass substrate layers.
  • the laminated board mentioned later consists of one or more fiber-containing resin cured material layers and one or more glass substrate layers from a viewpoint of reducing thickness.
  • the fiber-containing resin composition of the present invention includes a thermosetting resin and a fiber base material.
  • the thermosetting resin is not particularly limited, and examples thereof include epoxy resins, phenol resins, unsaturated imide resins, cyanate resins, isocyanate resins, benzoxazine resins, oxetane resins, amino resins, unsaturated polyester resins, allyl resins, dicyclohexanes. Examples include pentadiene resin, silicone resin, triazine resin, and melamine resin. Among these, an epoxy resin and a cyanate resin are preferable because they are excellent in moldability and electrical insulation.
  • epoxy resin examples include bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol S type epoxy resin, phenol novolac type epoxy resin, cresol novolac type epoxy resin, bisphenol A novolak type epoxy resin, bisphenol F novolak type epoxy resin.
  • Stilbene type epoxy resin triazine skeleton containing epoxy resin, fluorene skeleton containing epoxy resin, triphenol phenol methane type epoxy resin, biphenyl type epoxy resin, xylylene type epoxy resin, biphenyl aralkyl type epoxy resin, naphthalene type epoxy resin, dicyclopentadiene -Type epoxy resin, alicyclic epoxy resin, polyfunctional phenols and diglycidyl ether compounds of polycyclic aromatics such as anthracene And the like.
  • the phosphorus containing epoxy resin which introduce
  • biphenylaralkyl type epoxy resins and naphthalene type epoxy resins are preferred from the viewpoint of heat resistance and flame retardancy. These can be used alone or in combination of two or more.
  • the cyanate resin include bisphenol type cyanate resins such as novolak type cyanate resin, bisphenol A type cyanate resin, bisphenol E type cyanate resin, and tetramethylbisphenol F type cyanate resin, and prepolymers in which these are partially triazine. .
  • a novolak type cyanate resin is preferable from the viewpoint of heat resistance and flame retardancy. These can be used alone or in combination of two or more.
  • the content of the thermosetting resin contained in the fiber-containing resin composition is in the range of 20 to 80% by mass with respect to the mass of the non-fiber substrate component excluding the fiber substrate from the total amount of the fiber-containing resin composition. It is preferably 25 to 60% by mass, more preferably 25 to 50% by mass, still more preferably 25 to 40% by mass.
  • Fiber base material There is no restriction
  • the thickness of the base material is not particularly limited, and can be, for example, about 0.03 to 0.5 mm, and is surface-treated with a silane coupling agent or the like or mechanically subjected to fiber opening treatment. However, it is suitable from the aspects of heat resistance, moisture resistance, and workability.
  • the total content of the fiber base material is preferably in the range of 10 to 80% by volume, more preferably 15 to 75% by weight, still more preferably 20 to 70% by weight, based on the total amount of the fiber-containing resin composition. 30 to 60% by mass is even more preferable, and 30 to 55% by mass is even more preferable.
  • the fiber-containing resin composition may further contain an inorganic filler.
  • the content of the inorganic filler is in the range of 5 to 75% by volume with respect to the non-fiber base component excluding the fiber base from the fiber-containing resin composition. It is preferable that Further, the content of the inorganic filler is more preferably 15 to 70% by mass, and still more preferably 30 to 70% by mass with respect to the non-fiber base component obtained by removing the fiber base from the fiber-containing resin composition.
  • the inorganic filler include silica, alumina, talc, mica, aluminum hydroxide, magnesium hydroxide, calcium carbonate, aluminum borate, and borosilicate glass.
  • silica is preferable from the viewpoint of low thermal expansion, and further, the thermal expansion coefficient is as small as about 0.6 ppm / K, and spherical amorphous silica with little decrease in fluidity when highly filled in a resin is used. More preferred.
  • the spherical amorphous silica preferably has a cumulative 50% particle size of 0.01 to 10 ⁇ m, preferably 0.03 to 5 ⁇ m.
  • the cumulative 50% particle diameter is the particle diameter at a point corresponding to a volume of 50% when a cumulative frequency distribution curve based on the particle diameter is obtained with the total volume of the powder as 100%.
  • a fine wiring can be formed on the fiber-containing resin cured product layer of the laminate by using silica (nanosilica) having an average primary particle size of 1 ⁇ m or less as the inorganic filler.
  • the nano silica preferably has a specific surface area of 20 m 2 / g or more.
  • the average primary particle size is preferably 100 nm or less. This specific surface area can be measured by the BET method.
  • the “average primary particle size” here refers to the average particle size of aggregated particles, that is, not the secondary particle size, but the average particle size of single particles that are not aggregated.
  • the average primary particle size can be determined by measuring with, for example, a laser diffraction particle size distribution meter.
  • an inorganic filler fumed silica is preferable.
  • the inorganic filler is preferably treated with a surface treatment agent such as a silane coupling agent in order to improve moisture resistance, and is preferably hydrophobized to improve dispersibility.
  • the content of the inorganic filler is 20% by mass or less in the non-fiber component excluding the fiber substrate from the fiber-containing resin composition. It is preferable.
  • the blending amount is 20% by mass or less, a good surface shape after the roughening treatment can be maintained, and deterioration of plating characteristics and interlayer insulation reliability can be prevented.
  • the fiber-containing resin composition can be expected to have low thermal expansion and high elasticity by containing an inorganic filler, the inclusion of an inorganic filler is important when low thermal expansion and high elasticity are also considered as well as fine wiring formation.
  • the amount is preferably 3 to 20% by mass.
  • this fiber-containing resin composition includes a curing agent, a curing accelerator, a thermoplastic resin, an elastomer, a flame retardant, an ultraviolet absorber, an antioxidant, a photopolymerization initiator, a fluorescent whitening agent, and improved adhesion.
  • An agent or the like can be added.
  • curing agents include, for example, when epoxy resin is used, polyfunctional phenolic compounds such as phenol novolac and cresol novolac; amine compounds such as dicyandiamide, diaminodiphenylmethane, and diaminodiphenylsulfone; phthalic anhydride, pyromellitic anhydride Acid anhydrides such as maleic anhydride and maleic anhydride copolymers; polyimides can be used.
  • curing accelerators include, for example, epoxy resin curing accelerators such as imidazoles and derivatives thereof; organophosphorus compounds; secondary amines, tertiary amines, and quaternary ammonium salts.
  • ultraviolet absorbers examples include benzotriazole-based ultraviolet absorbers.
  • Antioxidants include hindered phenols and styrenated phenol antioxidants.
  • the photopolymerization initiator examples include photopolymerization initiators such as benzophenones, benzyl ketals, and thioxanthones.
  • fluorescent whitening agents include fluorescent whitening agents such as stilbene derivatives.
  • the adhesion improver include a urea compound such as urea silane and an adhesion improver such as a silane coupling agent.
  • a fiber containing resin composition layer consists of said fiber containing resin composition.
  • the fiber-containing resin composition layer includes a semi-cured product in addition to an uncured product of the fiber-containing resin composition.
  • the size of the fiber-containing resin composition layer of the present invention is preferably selected in the range of 10 mm to 1000 mm in width and 10 mm to 3000 mm in length (the length is appropriately applied when used in a roll). In particular, the width of 25 mm to 550 mm and the length of 25 mm to 550 mm are preferable from the viewpoint of handleability.
  • the thickness per layer of the fiber-containing resin composition layer of the present invention is preferably selected in the range of 3 ⁇ m to 200 ⁇ m.
  • the thickness of the resin composition per layer is preferably 3 to 150 ⁇ m, more preferably 10 to 120 ⁇ m, and more preferably 20 to It is further preferably 120 ⁇ m, and further preferably 25 to 110 ⁇ m.
  • the fiber-containing resin composition layer of the present invention is preferably contained in an amount of 4 to 90% by volume, more preferably 30 to 90% by volume, still more preferably 30 to 85% by volume, and more based on the entire laminate. More preferably, it is contained in a proportion of 30 to 80% by volume.
  • the laminated body and laminated board of this invention have the resin composition layer in which at least 1 layer of fiber base material is contained, you may have the resin composition layer which does not contain a fiber base material in addition to that. Absent.
  • the resin composition layer not containing the fiber base material can be used for the purpose of, for example, arranging between the glass layer and the resin composition layer containing the fiber base material to improve the adhesion between the two layers.
  • the resin content after drying of the fiber-containing resin composition layer is preferably 20 to 90% by mass, more preferably 25 to 85% by mass or more, further preferably 30 to 80% by mass, and more preferably 40 to 70% by mass. More preferred is 45 to 70% by mass. When it is 20% by mass or more, processability and handling properties (ease of handling) are improved.
  • resin content means the amount of components other than the fiber base material in the total amount of a fiber containing resin composition.
  • the fiber-containing resin composition contains an inorganic filler
  • the total amount of the thermosetting resin and the inorganic filler is preferably 5 to 75% by volume, more preferably 15 to 70% by volume. 30 to 70% by volume is more preferable.
  • the content of the inorganic filler is 5 to 75% by volume of the total amount of the thermosetting resin and the inorganic filler, the effect of reducing the coefficient of thermal expansion is sufficient, and the moldability is appropriate with appropriate fluidity. Excellent. That is, when the content of the inorganic filler is 5% by volume or more, the effect of reducing the coefficient of thermal expansion is sufficient, and when it is 75% by volume or less, the fluidity is increased and the moldability is improved.
  • a thin glass film having a thickness of 30 to 200 ⁇ m is preferable for the purpose of reducing the thickness of the laminate and from the viewpoint of workability, Considering practicality such as ease of handling, the thickness is more preferably 30 to 150 ⁇ m, and further preferably 80 to 120 ⁇ m.
  • the thickness of a glass substrate layer here refers to the average thickness of a glass substrate layer.
  • the average thickness of the glass substrate layer can be measured using a known thickness measuring instrument such as a micrometer or a film thickness measuring instrument.
  • the thickness of the four corners and the center can be measured using a micrometer, and the average value can be obtained as the average thickness of the glass substrate layer.
  • glass such as alkali silicate glass, non-alkali glass and quartz glass can be used, but borosilicate glass is preferred from the viewpoint of low thermal expansion.
  • the size of the glass substrate layer of the present invention is preferably selected in the range of 10 mm to 1000 mm in width and 10 mm to 3000 mm in length (the length is appropriately applied when used in a roll).
  • a width of 25 mm to 550 mm and a length of 25 mm to 550 mm are more preferable from the viewpoint of handleability.
  • the thermal expansion coefficient of the glass substrate layer is closer to the thermal expansion coefficient (about 3 ppm / ° C.) of the silicon chip, warpage of the laminated plate or the laminated plate obtained from the laminated body may be suppressed, but preferably 8 ppm / ° C. It is below, More preferably, it is 6 ppm / degrees C or less, More preferably, it is 4 ppm / degrees C or less.
  • the glass substrate layer is preferably 10 to 70% by volume, more preferably 15 to 70% by volume, and still more preferably 20 to 70% by volume with respect to the entire laminate.
  • the content of the glass substrate layer is 10% by volume or more, it is advantageous to obtain a laminate having low thermal expansion and high elasticity, and conversely, when the content of the glass substrate layer is 70% by volume or less, processing is performed. It is advantageous in terms of the properties and handling properties (ease of handling).
  • Said laminated body may have a support body film on the surface.
  • This support body film it demonstrates in detail in description of the manufacturing method of the following laminated body.
  • This B-stage can be usually performed by heating and drying at a temperature of 100 to 200 ° C. for about 1 to 30 minutes.
  • the pressure laminate uses a pressure laminator such as a vacuum laminator or a roll laminator to laminate a prepreg laminated body in which one prepreg or a plurality of (for example, 2 to 20) prepregs are stacked, and a glass substrate. This can be done by laminating. Vacuum lamination and roll lamination can be performed using a commercially available vacuum laminator or roll laminator.
  • a thermosetting resin in said fiber containing resin composition what melt
  • thermosetting resin in the fiber-containing resin composition is preferably melted at 140 ° C. or lower.
  • the prepreg used for laminating preferably has a support film disposed on one side.
  • the support film include polyolefins such as polyethylene and polyvinyl chloride, polyethylene terephthalate (hereinafter may be abbreviated as “PET”), polyesters such as polyethylene naphthalate, polycarbonate, polyimide, and release paper and copper.
  • PET polyethylene terephthalate
  • polyesters such as polyethylene naphthalate, polycarbonate, polyimide, and release paper and copper.
  • metal foil such as foil and aluminum foil.
  • the copper foil can be used as a conductor layer as it is to form a circuit.
  • examples of the copper foil include rolled copper and electrolytic copper foil, and those having a thickness of 2 ⁇ m to 36 ⁇ m are generally used.
  • a copper foil with a carrier may be used in order to improve workability.
  • the support film may be subjected to a release treatment in addition to the mat treatment and the corona treatment.
  • the thickness of the support film is usually 10 ⁇ m to 150 ⁇ m, preferably 25 to 50 ⁇ m. If it is thinner than 10 ⁇ m, handling becomes difficult. On the other hand, as described above, since the support film is usually finally peeled or removed, a thickness exceeding 150 ⁇ m is not preferable from the viewpoint of energy saving.
  • a prepreg with a support film is pressed against a glass substrate while being pressurized and heated.
  • the lamination is preferably performed by preheating the prepreg and the glass substrate as necessary, and laminating at a pressure bonding temperature (laminating temperature) of preferably 60 ° C. to 140 ° C. and a pressure bonding pressure of preferably 1 to 11 kgf / cm 2 .
  • a pressure bonding temperature laminating temperature
  • laminating temperature preferably 60 ° C. to 140 ° C.
  • a pressure bonding pressure preferably 1 to 11 kgf / cm 2 .
  • a vacuum laminator it is preferable to laminate under a reduced pressure with an air pressure of 20 mmHg (26.7 hPa) or less.
  • the laminating method may be a batch method or a continuous method using a roll. As described above, after the prepreg is laminated on the glass substrate, it is cooled to around room temperature. Thus, a laminated body can be manufactured.
  • the laminate of the present invention is a laminate comprising one or more cured resin layers and one or more glass substrate layers, wherein the cured resin layer includes a thermosetting resin fiber substrate.
  • a cured fiber-containing resin layer made of a cured product of the composition, wherein the glass substrate layer is 10 to 70% by volume relative to the entire laminate.
  • the size of the laminate of the present invention is preferably selected in the range of 10 mm to 1000 mm in width and 10 mm to 3000 mm in length (the length is appropriately applied when used in a roll). In particular, a width of 25 mm to 550 mm and a length of 25 mm to 550 mm are more preferable from the viewpoint of handleability.
  • the thickness of the laminate of the present invention is preferably selected in the range of 35 ⁇ m to 20 mm depending on the application.
  • the thickness of the laminate is more preferably 50 to 1000 ⁇ m, still more preferably 80 to 600 ⁇ m, still more preferably 100 to 500 ⁇ m, and still more preferably 110 to 450 ⁇ m.
  • This laminated board preferably has a structure in which the fiber-containing resin composition layer of the above-described laminate is a fiber-containing resin cured product layer. In this case, the details of the glass substrate layer and the fiber-containing resin composition are as described in the description regarding the laminate.
  • the thickness of the fiber-containing cured product layer is preferably equal to the thickness of the fiber-containing composition layer described above, and the ratio of the fiber-containing resin cured product and the glass substrate layer in the laminate is the same as that of the laminate described above.
  • the ratio of the cured fiber-containing resin and the glass substrate layer is preferably the same.
  • the thickness of the fiber-containing resin cured product layer is preferably 3 to 200 ⁇ m. If it is 3 ⁇ m or more, cracking of the laminate is suppressed. When the thickness is 200 ⁇ m or less, the thickness of the glass substrate is relatively increased, so that the thermal expansion coefficient and the high elastic modulus of the laminated plate can be reduced. From this viewpoint, the thickness of the fiber-containing resin cured product layer is more preferably 3 to 150 ⁇ m, still more preferably 10 to 120 ⁇ m, still more preferably 20 to 120 ⁇ m, and still more preferably 25 to 110 ⁇ m. It is.
  • the storage elastic modulus at 40 ° C. of this fiber-containing resin cured product layer is preferably 10 to 80 GPa.
  • a glass substrate layer is protected as it is 10 GPa or more, and the crack of a laminated board is suppressed.
  • it is 80 GPa or less, the stress due to the difference in thermal expansion coefficient between the glass substrate layer and the fiber-containing resin cured product layer is suppressed, and warpage and cracking of the laminate are suppressed.
  • the storage elastic modulus of the fiber-containing cured resin layer is more preferably 12 to 75 GPa, and further preferably 15 to 70 GPa.
  • the metal foil is not particularly limited as long as it is used for electrical insulating material applications.
  • the storage elastic modulus of the laminate at 40 ° C. is preferably 10 to 70 GPa, more preferably 20 to 60 GPa, and further preferably 25 to 50 GPa, from the viewpoint of suppressing warpage and cracking of the laminate. More preferably, it is 25 to 45 GPa.
  • the average thermal expansion coefficient in the range of 50 to 120 ° C. of the laminate is preferably 1 to 10 ppm / ° C., more preferably 2 to 8 ppm / ° C. from the viewpoint of suppressing warpage and cracking of the laminate. More preferably, it is 2 to 6 ppm / ° C, and still more preferably 2 to 5 ppm / ° C.
  • the average coefficient of thermal expansion in the range of 120 to 190 ° C. of the laminate is preferably 1 to 15 ppm / ° C., more preferably 2 to 10 ppm / ° C. from the viewpoint of suppressing warpage and cracking of the laminate. More preferably, it is 2 to 8 ppm / ° C, and still more preferably 2 to 6 ppm / ° C.
  • the support film When a support film subjected to a release treatment is used, the support film may be peeled off after being cured by heating. According to this method, since it is not necessary to pressurize at the time of manufacture of a laminated board, it is controlled that a crack arises at the time of manufacture.
  • the laminated board which concerns on this invention can be manufactured by the press method.
  • a laminate can be produced by curing the laminate obtained by the above-mentioned laminate by heating and pressurizing by a pressing method.
  • a prepreg laminated body formed by superimposing one prepreg or a plurality of prepregs (for example, 2 to 20 sheets) and a glass substrate are laminated, and heated and pressed by a press method to be cured by being cured, whereby a laminated plate Can also be manufactured.
  • a laminate may be produced by attaching a support film to the surface of the outermost prepreg and then curing by heating and pressurizing by a pressing method.
  • This pressing method is preferable from the viewpoint of uniform molding, but the lamination conditions may be limited because the glass substrate is easily broken during lamination.
  • the production method by heat curing (laminating method) of the laminate obtained by laminating is preferable from the viewpoint that the glass substrate is hard to break and easy in production, but the fiber-containing resin composition and Molding may be difficult depending on the properties and content of the fiber substrate. Therefore, it is preferable to use the pressing method and the laminating method properly as necessary.
  • the multilayer laminate of the present invention is a multilayer laminate including a plurality of laminates, and at least one laminate is the aforementioned laminate of the present invention.
  • a multilayer laminate can be produced by stacking and laminating a plurality of the above laminates (for example, 2 to 20). Specifically, using a multistage press, a multistage vacuum press, a continuous molding machine, an autoclave molding machine, etc., at a temperature of about 100 to 250 ° C., a pressure of about 2 to 100 MPa, and a heating time of about 0.1 to 5 hours. Can be molded.
  • the printed wiring board of this invention has said laminated board or multilayer laminated board, and the wiring provided in the surface of the laminated board or multilayer laminated board. Next, a method for manufacturing this printed wiring board will be described.
  • the above laminated plate is drilled by a method such as drilling, laser, plasma, or a combination thereof as necessary to form a via hole or a through hole.
  • a method such as drilling, laser, plasma, or a combination thereof as necessary to form a via hole or a through hole.
  • the laser a carbon dioxide laser, a YAG laser, a UV laser, an excimer laser, or the like is generally used.
  • a conductor layer is formed on the fiber-containing resin composition layer of the laminate by dry plating or wet plating.
  • dry plating a known method such as vapor deposition, sputtering, or ion plating can be used.
  • wet plating first, the surface of the cured fiber-containing resin composition layer is coated with permanganate (potassium permanganate, sodium permanganate, etc.), dichromate, ozone, hydrogen peroxide / sulfuric acid ( That is, a roughening treatment is performed with an oxidizing agent such as a mixture of hydrogen peroxide and sulfuric acid) and nitric acid to form uneven anchors.
  • an aqueous sodium hydroxide solution such as potassium permanganate and sodium permanganate is particularly preferably used.
  • a conductor layer is formed by a method combining electroless plating and electrolytic plating.
  • a plating resist having a pattern opposite to that of the conductor layer can be formed, and the conductor layer can be formed only by electroless plating.
  • the formation process of this conductor layer can be skipped.
  • ⁇ Formation of wiring pattern> As a subsequent pattern formation method, for example, a known subtractive method or semi-additive method can be used.
  • a multilayer printed wiring board may be formed by laminating a plurality of laminated boards on which wiring patterns are formed as described above.
  • a multilayer is formed by laminating a plurality of laminated boards on which the above wiring patterns are formed via the above-mentioned adhesive film. Thereafter, through holes or blind via holes are formed by drilling or laser processing, and interlayer wiring is formed by plating or conductive paste. In this way, a multilayer printed wiring board can be manufactured.
  • the laminate and multilayer laminate may be a laminate with a metal foil and a multilayer laminate having a metal foil such as copper, aluminum or nickel on one or both sides.
  • a laminate with a metal foil can be produced by using a metal foil as the support film.
  • a laminate with metal foil is obtained by laminating one or a plurality of (for example, 2 to 20) laminates obtained by the above-mentioned laminate and arranging metal foil on one or both sides thereof. It can also be manufactured.
  • the molding conditions can be applied to laminates for electrical insulating materials and multilayer boards.
  • a multistage press for example, a multistage press, a multistage vacuum press, a continuous molding machine, an autoclave molding machine, etc. are used, and the temperature is about 100 to 250 ° C., the pressure is 2 to Molding can be performed in a range of about 100 MPa and a heating time of about 0.1 to 5 hours.
  • the thermal expansion coefficient of the laminated plate can be measured by using a thermomechanical analyzer (TMA: Thermal Mechanical Analysis), a temperature-dependent three-dimensional displacement measuring device (DIC: Digital Image Correlation), a laser interferometry, or the like.
  • TMA Thermal Mechanical Analysis
  • DI temperature-dependent three-dimensional displacement measuring device
  • a laser interferometry or the like.
  • the elastic modulus of the laminated plate can be measured as a bending elastic modulus as a static elastic modulus, including measurement of storage elastic modulus using a wide area viscoelasticity measuring device.
  • the bending elastic modulus can be obtained by performing a three-point bending test.
  • the laminated structure of the laminated body is not particularly limited as long as it is a laminated structure including one or more resin composition layers and one or more glass substrate layers.
  • a laminate 10 having a five-layer structure in which a resin composition layer 11a, a resin composition layer 11b, a glass substrate layer 12, a resin composition layer 11c, and a resin composition layer 11 are laminated in this order.
  • stacking the resin composition layer 21a, the glass substrate layer 22, and the resin composition layer 21b in this order may be sufficient as FIG.
  • the laminate 30 has a five-layer structure in which a resin composition layer 31a, a glass substrate layer 32a, a resin composition layer 31b, a glass substrate layer 32b, and a resin composition layer 31c are laminated in this order. May be.
  • the laminated structure of the laminated plate is not particularly limited as long as it is a laminated structure including one or more cured resin layers and one or more glass substrate layers.
  • a laminated board 110 having a five-layer structure in which a cured resin layer 111a, a cured resin layer 111b, a glass substrate layer 112, a cured resin layer 111c, and a cured resin layer 111 are stacked in this order. There may be.
  • FIG. 4 a laminated board 110 having a five-layer structure in which a cured resin layer 111a, a cured resin layer 111b, a glass substrate layer 112, a cured resin layer 111c, and a cured resin layer 111 are stacked in this order. There may be.
  • FIG. 4 As shown in FIG. 4, a laminated board 110 having a five-layer structure in which a cured resin layer 111a, a cured resin layer 111b, a glass substrate layer 112, a cured resin layer 111c, and
  • stacking the resin cured material layer 121a, the glass substrate layer 122, and the resin cured material layer 121b in this order may be sufficient.
  • thermosetting resin composition a solution of a resin composition having the unsaturated maleimide group, (2) Bifunctional naphthalene type epoxy resin (trade name, HP-4032D, manufactured by Dainippon Ink & Chemicals, Inc.) as the thermosetting resin (B), (3) As modified imidazole (C), isocyanate mask imidazole [Daiichi Kogyo Seiyaku Co., Ltd., trade name: G8009L], (4) As an inorganic filler (D), fused silica [manufactured by Admatech Co., Ltd., trade name: SC2050-KC, concentration 70%, average primary particle diameter: 500 nm, specific surface area by BET method: 6.8 m 2 / G], (5) As a phosphorus-containing compound (E) that imparts flame retardancy, a phosphorus-containing phenol resin [manufactured by Sanko Chemical Co., Ltd., trade name: H
  • Examples 1 to 6 and Comparative Example 1 As a glass film, a 50 ⁇ m thick glass film “trade name OA-10G” (Nippon Electric Glass Co., Ltd., 250 mm ⁇ 250 mm) and a 100 ⁇ m thick glass film “trade name OA-10G” (Nippon Electric Glass Co., Ltd.) , 250 mm ⁇ 250 mm) (which may be referred to as GF50 ⁇ m and GF100 ⁇ m, respectively).
  • the glass film and the prepreg are overlaid as shown in Table 2, and an electrolytic copper foil with a thickness of 12 ⁇ m is placed up and down, and pressed at a pressure of 3.0 MPa and a temperature of 235 ° C. for 120 minutes to obtain a copper-clad laminate. A plate was made.
  • the temperature measurement was performed at a rate of 5 ° C./min, 1 st run, measurement range 20 to 200 ° C., 2nd run measurement range ⁇ 10 to 280 ° C., load 5 g, 10 mm between chucks, and 50 to 120
  • the average coefficient of thermal expansion in the range of ° C and in the range of 120 to 190 ° C was determined.
  • the results are shown in Table 2.
  • (2) Measurement of storage elastic modulus A test piece of 5 mm ⁇ 30 mm was cut out from the laminate. When using a copper clad laminated board, after removing copper foil by being immersed in copper etching liquid, the test piece was cut out.
  • Examples 1 to 6 of the present invention containing a glass film are excellent in low thermal expansion at 50 to 120 ° C. and high elasticity at 40 ° C. compared to Comparative Example 1 not containing a glass film. . Also, in the high temperature region of 120 to 190 ° C., the coefficient of thermal expansion is higher in Comparative Example 1 than in the low temperature region (50 to 120 ° C.), whereas in Examples 1 to 6, it is almost the same as the low temperature region. It can be seen that it has a low thermal expansion property. Therefore, Examples 1 to 6 of the present invention maintain low thermal expansion not only in the low temperature region but also in the high temperature region.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Laminated Bodies (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
PCT/JP2012/074119 2011-09-22 2012-09-20 積層体、積層板、多層積層板、プリント配線板及び積層板の製造方法 WO2013042751A1 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020147007229A KR20140063712A (ko) 2011-09-22 2012-09-20 적층체, 적층판, 다층 적층판, 프린트 배선판 및 적층판의 제조 방법

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2011-207981 2011-09-22
JP2011207981 2011-09-22
JP2012200950 2012-09-12
JP2012-200950 2012-09-12

Publications (1)

Publication Number Publication Date
WO2013042751A1 true WO2013042751A1 (ja) 2013-03-28

Family

ID=47914511

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2012/074119 WO2013042751A1 (ja) 2011-09-22 2012-09-20 積層体、積層板、多層積層板、プリント配線板及び積層板の製造方法

Country Status (5)

Country Link
JP (1) JPWO2013042751A1 (ko)
KR (1) KR20140063712A (ko)
CN (2) CN203093220U (ko)
TW (1) TW201334643A (ko)
WO (1) WO2013042751A1 (ko)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013158998A (ja) * 2012-02-03 2013-08-19 Nippon Kayaku Co Ltd 積層ガラスシート
JP2015214085A (ja) * 2014-05-09 2015-12-03 日立化成株式会社 積層体、積層板、及び多層プリント配線板
EP3128545A4 (en) * 2014-03-31 2018-02-28 Nagase ChemteX Corporation Circuit member having hollow section, mounting structure, and mounting structure manufacturing method

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019049519A1 (ja) * 2017-09-06 2019-03-14 日本ピラー工業株式会社 回路基板及びその製造方法
JP7283475B2 (ja) * 2018-06-29 2023-05-30 Ａｇｃ株式会社 ガラス樹脂積層体、複合積層体、及びそれらの製造方法
CN112601656A (zh) * 2018-09-28 2021-04-02 日铁化学材料株式会社 覆金属层叠板的制造方法及电路基板的制造方法
TW202033361A (zh) * 2018-12-18 2020-09-16 日商日立化成股份有限公司 積層板、印刷線路板、半導體封裝體及積層板的製造方法

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04219233A (ja) * 1990-12-20 1992-08-10 Dainippon Ink & Chem Inc 無機ガラス層を有する成形物
JP2001162721A (ja) * 1999-12-06 2001-06-19 Mitsubishi Plastics Ind Ltd 熱硬化性樹脂複合品及びその製造方法
JP2004512667A (ja) * 1999-12-21 2004-04-22 フラウンホファー　ゲセルシャフトツール　フェールデルンク　ダー　アンゲヴァンテン　フォルシュンク　エー．ファオ． 多層プリント基板
JP2010519089A (ja) * 2007-02-22 2010-06-03 ダウ・コーニング・コーポレイション 優れた耐火性及び耐衝撃性を有する複合品並びにそれの製造方法
JP2010519088A (ja) * 2007-02-22 2010-06-03 ダウ・コーニング・コーポレイション 優れた耐火性を有する複合品
WO2011030716A1 (ja) * 2009-09-08 2011-03-17 旭硝子株式会社 ガラス／樹脂積層体、及びそれを用いた電子デバイス
JP2011088355A (ja) * 2009-10-22 2011-05-06 Fujifilm Corp 複合フィルム及び電子部品の製造方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6413620B1 (en) * 1999-06-30 2002-07-02 Kyocera Corporation Ceramic wiring substrate and method of producing the same
US6528145B1 (en) * 2000-06-29 2003-03-04 International Business Machines Corporation Polymer and ceramic composite electronic substrates
CN101321813B (zh) * 2005-12-01 2012-07-04 住友电木株式会社 预成型料、预成型料的制造方法、基板及半导体装置
EP2113524A4 (en) * 2007-02-23 2011-03-30 Panasonic Elec Works Co Ltd EPOXY RESIN COMPOSITION, PREPREG, LAMINATES AND PCB

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04219233A (ja) * 1990-12-20 1992-08-10 Dainippon Ink & Chem Inc 無機ガラス層を有する成形物
JP2001162721A (ja) * 1999-12-06 2001-06-19 Mitsubishi Plastics Ind Ltd 熱硬化性樹脂複合品及びその製造方法
JP2004512667A (ja) * 1999-12-21 2004-04-22 フラウンホファー　ゲセルシャフトツール　フェールデルンク　ダー　アンゲヴァンテン　フォルシュンク　エー．ファオ． 多層プリント基板
JP2010519089A (ja) * 2007-02-22 2010-06-03 ダウ・コーニング・コーポレイション 優れた耐火性及び耐衝撃性を有する複合品並びにそれの製造方法
JP2010519088A (ja) * 2007-02-22 2010-06-03 ダウ・コーニング・コーポレイション 優れた耐火性を有する複合品
WO2011030716A1 (ja) * 2009-09-08 2011-03-17 旭硝子株式会社 ガラス／樹脂積層体、及びそれを用いた電子デバイス
JP2011088355A (ja) * 2009-10-22 2011-05-06 Fujifilm Corp 複合フィルム及び電子部品の製造方法

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013158998A (ja) * 2012-02-03 2013-08-19 Nippon Kayaku Co Ltd 積層ガラスシート
EP3128545A4 (en) * 2014-03-31 2018-02-28 Nagase ChemteX Corporation Circuit member having hollow section, mounting structure, and mounting structure manufacturing method
JP2015214085A (ja) * 2014-05-09 2015-12-03 日立化成株式会社 積層体、積層板、及び多層プリント配線板

Also Published As

Publication number Publication date
KR20140063712A (ko) 2014-05-27
CN103009724A (zh) 2013-04-03
CN203093220U (zh) 2013-07-31
TW201334643A (zh) 2013-08-16
JPWO2013042751A1 (ja) 2015-03-26

Similar Documents

Publication Publication Date Title
JP6801632B2 (ja) 積層体、積層板、多層積層板、プリント配線板及び積層板の製造方法
JP6801631B2 (ja) 積層体、積層板、多層積層板、プリント配線板及び積層板の製造方法
WO2013042752A1 (ja) 積層体、積層板、多層積層板、プリント配線板及び積層板の製造方法
WO2013042751A1 (ja) 積層体、積層板、多層積層板、プリント配線板及び積層板の製造方法
WO2013042750A1 (ja) 積層体、積層板、多層積層板、プリント配線板及び積層板の製造方法
US9050780B2 (en) Laminate body, laminate plate, multilayer laminate plate, printed wiring board, and method for manufacture of laminate plate
US20130112459A1 (en) Laminate body, laminate plate, multilayer laminate plate, printed wiring board, and method for manufacture of laminate plate
US9101061B2 (en) Laminate body, laminate plate, multilayer laminate plate, printed wiring board, and method for manufacture of laminate plate
JP2018029204A (ja) 積層体、積層板、多層積層板、プリント配線板、多層プリント配線板及び積層板の製造方法
JP6248390B2 (ja) 積層体、積層板、多層積層板、プリント配線板、多層プリント配線板及び積層板の製造方法
US20130180769A1 (en) Laminate body, laminate plate, multilayer laminate plate, printed wiring board, and method for manufacture of laminate plate
US20130180760A1 (en) Laminate body, laminate plate, multilayer laminate plate, printed wiring board, and method for manufacture of laminate plate
JP2014120687A (ja) 積層板、多層積層板、プリント配線板、多層プリント配線板及び積層板の製造方法
JP6322887B2 (ja) 積層体、積層板、多層積層板、プリント配線板、多層プリント配線板及び積層板の製造方法
JP6260097B2 (ja) 積層板、多層積層板、プリント配線板、多層プリント配線板、及び積層板の製造方法
JP6179096B2 (ja) 積層板、多層積層板、プリント配線板、多層プリント配線板及び積層板の製造方法
JP6326948B2 (ja) 積層体、積層板、及び多層プリント配線板

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 12834156

Country of ref document: EP

Kind code of ref document: A1

ENP Entry into the national phase

Ref document number: 2013534757

Country of ref document: JP

Kind code of ref document: A

ENP Entry into the national phase

Ref document number: 20147007229

Country of ref document: KR

Kind code of ref document: A

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 12834156

Country of ref document: EP

Kind code of ref document: A1