JPWO2013042751A1 - 積層体、積層板、多層積層板、プリント配線板及び積層板の製造方法 - Google Patents
積層体、積層板、多層積層板、プリント配線板及び積層板の製造方法 Download PDFInfo
- Publication number
- JPWO2013042751A1 JPWO2013042751A1 JP2013534757A JP2013534757A JPWO2013042751A1 JP WO2013042751 A1 JPWO2013042751 A1 JP WO2013042751A1 JP 2013534757 A JP2013534757 A JP 2013534757A JP 2013534757 A JP2013534757 A JP 2013534757A JP WO2013042751 A1 JPWO2013042751 A1 JP WO2013042751A1
- Authority
- JP
- Japan
- Prior art keywords
- resin
- fiber
- laminate
- layer
- glass substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
- B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
- B32B17/10—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
- B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
- B32B17/10—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin
- B32B17/10005—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing
- B32B17/1055—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the resin layer, i.e. interlayer
- B32B17/10614—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the resin layer, i.e. interlayer comprising particles for purposes other than dyeing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
- B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
- B32B17/10—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin
- B32B17/10005—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing
- B32B17/1055—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the resin layer, i.e. interlayer
- B32B17/10697—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the resin layer, i.e. interlayer being cross-linked
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
- H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
- H01L23/145—Organic substrates, e.g. plastic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
- H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
- H01L23/15—Ceramic or glass substrates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/036—Multilayers with layers of different types
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0183—Dielectric layers
- H05K2201/0191—Dielectric layers wherein the thickness of the dielectric plays an important role
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0209—Inorganic, non-metallic particles
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Laminated Bodies (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013534757A JPWO2013042751A1 (ja) | 2011-09-22 | 2012-09-20 | 積層体、積層板、多層積層板、プリント配線板及び積層板の製造方法 |
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011207981 | 2011-09-22 | ||
JP2011207981 | 2011-09-22 | ||
JP2012200950 | 2012-09-12 | ||
JP2012200950 | 2012-09-12 | ||
JP2013534757A JPWO2013042751A1 (ja) | 2011-09-22 | 2012-09-20 | 積層体、積層板、多層積層板、プリント配線板及び積層板の製造方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPWO2013042751A1 true JPWO2013042751A1 (ja) | 2015-03-26 |
Family
ID=47914511
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2013534757A Pending JPWO2013042751A1 (ja) | 2011-09-22 | 2012-09-20 | 積層体、積層板、多層積層板、プリント配線板及び積層板の製造方法 |
Country Status (5)
Country | Link |
---|---|
JP (1) | JPWO2013042751A1 (ko) |
KR (1) | KR20140063712A (ko) |
CN (2) | CN203093220U (ko) |
TW (1) | TW201334643A (ko) |
WO (1) | WO2013042751A1 (ko) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2013158998A (ja) * | 2012-02-03 | 2013-08-19 | Nippon Kayaku Co Ltd | 積層ガラスシート |
CN106170854A (zh) * | 2014-03-31 | 2016-11-30 | 长濑化成株式会社 | 具有中空部的电路部件及安装构造体、以及安装构造体的制造方法 |
JP6326948B2 (ja) * | 2014-05-09 | 2018-05-23 | 日立化成株式会社 | 積層体、積層板、及び多層プリント配線板 |
WO2019049519A1 (ja) * | 2017-09-06 | 2019-03-14 | 日本ピラー工業株式会社 | 回路基板及びその製造方法 |
JP7283475B2 (ja) * | 2018-06-29 | 2023-05-30 | Agc株式会社 | ガラス樹脂積層体、複合積層体、及びそれらの製造方法 |
CN112601656A (zh) * | 2018-09-28 | 2021-04-02 | 日铁化学材料株式会社 | 覆金属层叠板的制造方法及电路基板的制造方法 |
TW202033361A (zh) * | 2018-12-18 | 2020-09-16 | 日商日立化成股份有限公司 | 積層板、印刷線路板、半導體封裝體及積層板的製造方法 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04219233A (ja) * | 1990-12-20 | 1992-08-10 | Dainippon Ink & Chem Inc | 無機ガラス層を有する成形物 |
JP2010519089A (ja) * | 2007-02-22 | 2010-06-03 | ダウ・コーニング・コーポレイション | 優れた耐火性及び耐衝撃性を有する複合品並びにそれの製造方法 |
JP2010519088A (ja) * | 2007-02-22 | 2010-06-03 | ダウ・コーニング・コーポレイション | 優れた耐火性を有する複合品 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6413620B1 (en) * | 1999-06-30 | 2002-07-02 | Kyocera Corporation | Ceramic wiring substrate and method of producing the same |
JP2001162721A (ja) * | 1999-12-06 | 2001-06-19 | Mitsubishi Plastics Ind Ltd | 熱硬化性樹脂複合品及びその製造方法 |
DE19961842B4 (de) * | 1999-12-21 | 2008-01-31 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Mehrschichtleiterplatte |
US6528145B1 (en) * | 2000-06-29 | 2003-03-04 | International Business Machines Corporation | Polymer and ceramic composite electronic substrates |
CN101321813B (zh) * | 2005-12-01 | 2012-07-04 | 住友电木株式会社 | 预成型料、预成型料的制造方法、基板及半导体装置 |
EP2113524A4 (en) * | 2007-02-23 | 2011-03-30 | Panasonic Elec Works Co Ltd | EPOXY RESIN COMPOSITION, PREPREG, LAMINATES AND PCB |
WO2011030716A1 (ja) * | 2009-09-08 | 2011-03-17 | 旭硝子株式会社 | ガラス/樹脂積層体、及びそれを用いた電子デバイス |
JP5489640B2 (ja) * | 2009-10-22 | 2014-05-14 | 富士フイルム株式会社 | 複合フィルム及び電子部品の製造方法 |
-
2012
- 2012-09-20 JP JP2013534757A patent/JPWO2013042751A1/ja active Pending
- 2012-09-20 KR KR1020147007229A patent/KR20140063712A/ko not_active Application Discontinuation
- 2012-09-20 WO PCT/JP2012/074119 patent/WO2013042751A1/ja active Application Filing
- 2012-09-21 TW TW101134760A patent/TW201334643A/zh unknown
- 2012-09-21 CN CN2012204885689U patent/CN203093220U/zh not_active Expired - Lifetime
- 2012-09-21 CN CN2012103571388A patent/CN103009724A/zh active Pending
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04219233A (ja) * | 1990-12-20 | 1992-08-10 | Dainippon Ink & Chem Inc | 無機ガラス層を有する成形物 |
JP2010519089A (ja) * | 2007-02-22 | 2010-06-03 | ダウ・コーニング・コーポレイション | 優れた耐火性及び耐衝撃性を有する複合品並びにそれの製造方法 |
JP2010519088A (ja) * | 2007-02-22 | 2010-06-03 | ダウ・コーニング・コーポレイション | 優れた耐火性を有する複合品 |
Also Published As
Publication number | Publication date |
---|---|
KR20140063712A (ko) | 2014-05-27 |
WO2013042751A1 (ja) | 2013-03-28 |
CN103009724A (zh) | 2013-04-03 |
CN203093220U (zh) | 2013-07-31 |
TW201334643A (zh) | 2013-08-16 |
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A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20150805 |
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A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20160510 |
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