WO2013027702A1 - ワイヤソー - Google Patents
ワイヤソー Download PDFInfo
- Publication number
- WO2013027702A1 WO2013027702A1 PCT/JP2012/071004 JP2012071004W WO2013027702A1 WO 2013027702 A1 WO2013027702 A1 WO 2013027702A1 JP 2012071004 W JP2012071004 W JP 2012071004W WO 2013027702 A1 WO2013027702 A1 WO 2013027702A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- wire
- work
- roller
- wire saw
- workpiece
- Prior art date
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
- B23D57/00—Sawing machines or sawing devices not covered by one of the preceding groups B23D45/00 - B23D55/00
- B23D57/003—Sawing machines or sawing devices working with saw wires, characterised only by constructional features of particular parts
- B23D57/0046—Sawing machines or sawing devices working with saw wires, characterised only by constructional features of particular parts of devices for feeding, conveying or clamping work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
- B23D57/00—Sawing machines or sawing devices not covered by one of the preceding groups B23D45/00 - B23D55/00
- B23D57/0007—Sawing machines or sawing devices not covered by one of the preceding groups B23D45/00 - B23D55/00 using saw wires
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B27/00—Other grinding machines or devices
- B24B27/06—Grinders for cutting-off
- B24B27/0633—Grinders for cutting-off using a cutting wire
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/005—Feeding or manipulating devices specially adapted to grinding machines
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/06—Work supports, e.g. adjustable steadies
- B24B41/067—Work supports, e.g. adjustable steadies radially supporting workpieces
Definitions
- the present invention relates to a wire saw for cutting a workpiece made of a brittle material such as a semiconductor material, a magnetic material, and a ceramic with a wire.
- Patent Document 1 discloses a wire saw of this type.
- the wire saw disclosed in this document comprises a plurality of processing rollers and a wire.
- the wire orbits around a plurality of processing rollers multiple times.
- a lifting mechanism is disposed above the winding area of the wire.
- the work is attached to and detached from the elevating mechanism via the carbon plate and the mounting plate.
- the work is fixed to the carbon plate and the mounting plate by an adhesive.
- a working fluid containing abrasive grains is supplied to the wire.
- the lifting mechanism descends in this state, the work is pressed against the wire and cut.
- An object of the present invention is to provide a wire saw that does not require work for bonding and peeling of a work before and after cutting.
- a wire saw comprising a plurality of processing rollers and a wire wound around a plurality of processing rollers a plurality of times.
- the wire saw includes clamping means for elastically clamping the workpiece in a lateral direction above the circumferential area of the wire, and pressing means for pressing the workpiece clamped by the clamping means toward the wire.
- the work is elastically held in the lateral direction by the holding means above the circumferential area of the wire. Then, the work is pushed down toward the wire by the pressing means while being held by the holding means.
- the work is bonded to the carbon plate and the mounting plate with an adhesive before the work is cut, or the work is peeled off from the carbon plate and the work plate after the work is cut. No need to Furthermore, the workpiece can be fed continuously onto the wire. Thus, the machining efficiency of the workpiece is improved, and the manufacturing cost is reduced.
- the holding means preferably includes a receiving member for receiving the side surface of the work and a pressing member for pressing the work toward the receiving member using a spring force.
- the side surface of the workpiece includes not only the side surface extending along the longitudinal direction of the workpiece, but also the end surface located at the end in the longitudinal direction.
- auxiliary clamping means which elastically clamps the work in the lateral direction below the circumference of the wire.
- the auxiliary clamping means preferably includes a receiving member for receiving the side surface of the work and a pressing member for pressing the work toward the receiving member using a spring force.
- a roller is provided below the winding area of the wire between the processing rollers, the roller rotates around an axis parallel to the axis of the processing roller, and between the outer peripheral surface of the rotating roller and the wire
- the shortest distance is set to be longer than the radius of the workpiece and shorter than the diameter of the workpiece, and the workpiece cut by the wire is pressed against the outer peripheral surface of the roller.
- FIG. 2 is a cross-sectional view taken along line 2-2 of FIG. Sectional drawing which shows the wire saw which concerns on 2nd Embodiment of this invention. Sectional drawing which shows the wire saw which concerns on 3rd Embodiment of this invention. Sectional drawing which shows the wire saw which concerns on 4th Embodiment of this invention. Sectional drawing which shows the wire saw of a modification.
- FIG. 1 a first embodiment in which the wire saw of the present invention is embodied will be described with reference to FIGS. 1 and 2.
- FIG. 1 a first embodiment in which the wire saw of the present invention is embodied will be described with reference to FIGS. 1 and 2.
- the wire saw includes a frame (not shown) and a pair of processing rollers 11.
- Each processing roller 11 is rotatably supported on the frame.
- the wire 12 is provided along the annular groove 11a. The wire 12 orbits around both processing rollers 11 multiple times.
- a pair of pinching mechanisms 13 as pinching means is disposed above the winding area of the wire 12 between the processing rollers 11.
- the holding mechanism 13 elastically holds the work W in the lateral direction.
- the work W is in the shape of a square prism having a rectangular cross section, but may have a cylindrical shape or the like.
- Each holding mechanism 13 includes a pair of guide plates 14 and 15 extending along the axis of the processing roller 11.
- the guide plates 14 and 15 are spaced apart in the lateral direction.
- Support holes 14 a are formed in the guide plate 14.
- a holding member 16 as a pressing member is inserted into the support hole 14a.
- the holding member 16 is supported by the guide plate 15 as a receiving member so as to be capable of coming into and coming out of contact.
- a holding plate 17 is attached to the side surface of the guide plate 14 by a plurality of screws 18.
- the holding plate 17 holds the holding member 16 so as not to drop out of the support hole 14a.
- a plurality of springs 19 are interposed between the holding member 16 and the holding plate 17. The spring 19 biases the holding member 16 toward the guide plate 15.
- a restriction plate 20 as a receiving member is disposed between the first ends of the guide plates 14 and 15.
- a support plate 21 is disposed between the second ends of the two guide plates 14 and 15.
- a positioning member 22 as a pressing member is disposed inside the support plate 21.
- the positioning member 22 is capable of coming into and coming out of contact with the regulating plate 20.
- a spring 23 is interposed between the positioning member 22 and the support plate 21. The spring 23 biases the positioning member 22 toward the regulating plate 20.
- a pair of feeding mechanisms 24 are disposed above the respective holding mechanisms 13. Each feed mechanism 24 is disposed outside the corresponding holding mechanism 13.
- the feed mechanism 24 feeds a plurality of works W one by one between the guide plates 14 and 15 from above.
- the work W fed between the guide plates 14 and 15 is elastically held in the lateral direction by the holding member 16 and the guide plate 15.
- both end portions in the lengthwise direction of the workpiece W are nipped by the positioning member 22 and the restriction plate 20. Thereby, the position of the work W in the axial direction of the processing roller 11 is determined.
- the pressing mechanism 25 pushes the work W held by each holding mechanism 13 toward the wire 12.
- the pressing mechanism 25 includes an elevating body 26 and a pair of pressing members 27 provided on the lower surface of the elevating body 26.
- the elevating body 26 is movably supported on the frame.
- a pressing piece 27a made of synthetic resin is attached at the lower end of the pressing member 27.
- the pressing piece 27 a is attached to and detached from the lower end of the pressing member 27.
- auxiliary clamping mechanisms 28 as auxiliary clamping means are arranged below the circumference of the wire 12 between the processing rollers 11.
- the pair of auxiliary clamping mechanisms 28 are arranged to correspond to the respective clamping mechanisms 13.
- the auxiliary holding mechanism 28 includes guide plates 14 and 15, a holding member 16, a holding plate 17, a spring 19 and the like.
- the workpiece W thinly cut by the wire 12 is held by the guide plate 15 and the holding member 16 and then released from being held by the guide plate 15 and the holding member 16.
- the gripping member 16 functions as a pressing member
- the guide plate 15 functions as a receiving member.
- a shooter 29 for discharging the product is disposed below the auxiliary clamping mechanism 28, a shooter 29 for discharging the product is disposed.
- the cut work W is released from being held by the guide plate 15 and the holding member 16, and then drops from between the holding member 16 and the guide plate 15 and is discharged to the outside through the shooter 29.
- a plurality of works W are fed between the guide plates 14 and 15 by the feeding mechanism 24. Subsequently, the plurality of works W are pushed down by the pressing member 27 and arranged between the holding member 16 and the guide plate 15. Then, the plurality of works W are elastically held in the lateral direction by the holding member 16 and the guide plate 15. In this case, as shown in FIG. 2, both end portions in the lengthwise direction of the workpiece W are elastically held by the positioning member 22 and the restriction plate 20. Thereby, the position of the work W in the axial direction of the processing roller 11 is determined.
- the workpiece W is elastically held in the lateral direction by the holding mechanism 13 above the circumferential area of the wire 12. Then, the work W is pressed down toward the wire 12 by the pressing mechanism 25 while being held by the holding mechanism 13. According to this configuration, unlike the conventional configuration, before cutting the work W, the work W is bonded to the carbon plate and the mounting plate with an adhesive, or after cutting the work W, the work W is carbon plate and mounting The work of peeling off the plate becomes unnecessary. In addition, by sequentially feeding the plurality of works W onto the wire 12, cutting and processing of the works W can be performed continuously. Therefore, the processing efficiency of the workpiece W is improved, and the manufacturing cost is reduced.
- the thinly cut workpiece W is elastically held by the auxiliary holding mechanism 28 below the circumferential area of the wire 12. Thereby, the unstable behavior of the thinly cut workpiece W can be prevented, and breakage of the workpiece W can be avoided in advance.
- one clamping mechanism 13 having the same structure as that of the first embodiment is disposed above the winding area of the wire 12 between the processing rollers 11. Further, below the winding area of the wire 12 between the processing rollers 11, one auxiliary holding mechanism 28 having the same structure as that of the first embodiment is disposed.
- one pressing member 27 is provided in the pressing mechanism 25 so as to correspond to the holding mechanism 13. According to the second embodiment, first, the workpiece W having a circular cross section is fed into the holding mechanism 13 by the feeding mechanism 24. Subsequently, in a state where the work W is held by the holding mechanism 13, the work W is pushed down to the wire 12 by the pressing member 27 of the pressing mechanism 25 and is cut.
- one pinching mechanism 13 having the same structure as that of the first embodiment is disposed above the circumferential area of the wire 12 between the processing rollers 11.
- a pair of pressing rollers 31 is disposed below the elevating body 26. Both pressing rollers 31 rotate around an axis parallel to the axis of the processing roller 11. According to the third embodiment, the work W having a circular cross section is pressed from above by the pressing roller 31 and pushed down to the wire 12.
- a rotary roller 32 is disposed to correspond to the pinching mechanism 13 instead of the auxiliary pinching mechanism 28 of the first embodiment.
- the rotating roller 32 rotates around an axis parallel to the axis of the processing roller 11.
- a motor 33 as a driving means is connected to the rotating roller 32.
- the rotating roller 32 is rotated by the motor 33.
- the shortest distance between the outer peripheral surface of the rotating roller 32 and the wire 12 is set to be longer than the radius of the workpiece W and shorter than the diameter of the workpiece W.
- the workpiece W having a circular cross-sectional shape is cut by the wire 12 while being pressed by the pressing roller 31 in a state of being held by the holding mechanism 13.
- the workpiece W exceeds the clamping area of the clamping mechanism 13
- the workpiece W is released from the clamping state by the clamping mechanism 13.
- the work W is rotated following the travel of the wire 12.
- the work W is pressed against the outer peripheral surface of the rotation roller 32
- the work W receives a rotational force by the rotation of the rotation roller 32.
- the roller 32 rotates in the same direction (clockwise direction in FIG.
- a roller 32 that is rotated by a motor 33 is provided below the winding area of the wire 12 between the processing rollers 11.
- the roller 32 rotates around an axis parallel to the axis of the processing roller 11.
- the cylindrical workpiece W is cut by the wire 12 and then pressed against the outer peripheral surface of the roller 32.
- the shortest distance between the outer peripheral surface of the rotating roller 32 and the wire 12 is set to be longer than the radius of the workpiece W and shorter than the diameter of the workpiece W. For this reason, when the workpiece W is pressed against the roller 32 while being cut by the wire 12, a rotational force is applied to the workpiece W due to the rotation of the rotary roller 32. Therefore, in order to cut and process the entire workpiece W, it is not necessary to push the workpiece W down to a position beyond the circumferential area of the wire 12. Thus, the processing efficiency of the workpiece W is improved.
- the holding mechanism 13 includes a plurality of sets of first holding rollers 34, second holding rollers 35, and springs 36.
- a plurality of sets of the first nipping roller 34, the second nipping roller 35, and the spring 36 are arranged at intervals above and below the winding area of the wire 12 in the vertical direction.
- Each first pinching roller 34 is rotatably disposed at a first position in the traveling direction of the wire 12.
- Each second pinching roller 35 is disposed upstream of the first position in the traveling direction of the wire 12.
- the first and second pinching rollers 34 and 35 are both rotatable.
- the second pinching roller 35 is disposed so as to be capable of coming into and coming out of contact with the first pinching roller 34.
- Each spring 36 biases the second nipping roller 35 toward the first nipping roller 34.
- each first pinching roller 34 is synchronously rotated counterclockwise in FIG. 5 by a motor (not shown).
- a pressing mechanism 25 for pressing the work W toward the wire 12 is configured by the motor and the first holding rollers 34.
- the auxiliary gripping mechanism 28 includes a pair of first gripping rollers 34, a second gripping roller 35, and a spring 36, which have the same configuration as the gripping mechanism 13.
- the workpiece W having a rectangular cross section is held between the first holding roller 34 and the second holding roller 35 of the holding mechanism 13. In this state, the workpiece W is pushed down toward the wire 12 by the rotation of the first gripping roller 34 and cut.
- the configuration of the holding mechanism 13 and the configuration of the pressing mechanism 25 may be changed.
- the auxiliary clamping mechanism 28 may be omitted.
- the rotational speed of the motor 33 may be changeable.
- the rotary roller 32 may be free rotated. In this case, the work W rotates following the travel of the wire 12.
- the lower pressing member 51 inserted inside the work W may be provided below the wire 12. That is, when the workpiece W moves downward from the wire 12, the lower pressing member 51 is inserted into the workpiece W from the retracted position on the side of the workpiece W. Then, the lower pressing member 51 is lowered and the work W is pushed down until the cutting of the work W is completed. According to this configuration, the pressing member 27 on the upper side may be lowered to just before contacting the wire 12. In this case, the lower pressing member 51 constitutes the pressing mechanism 25.
- the guide plate 15 of the auxiliary gripping mechanism 28 may be moved from the guide position in FIG. 1 in the direction opposite to the guide plate 14. That is, when cutting of all the workpieces W is finished, the guide plate 15 is separated from the guide plate 14, and finally, the workpiece W cut thin is released from the auxiliary gripping mechanism 28 and dropped to the shooter 29. May be
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
Description
以下、本発明のワイヤソーを具体化した第1実施形態について図1及び図2を参照して説明する。
次に、本発明のワイヤソーを具体化した第2実施形態について第1実施形態と異なる部分を中心に説明する。
次に、本発明のワイヤソーを具体化した第3実施形態について第1実施形態と異なる部分を中心に説明する。
次に、本発明のワイヤソーを具体化した第4実施形態について第1実施形態と異なる部分を中心に説明する。
Claims (6)
- 複数の加工用ローラと、複数の加工用ローラの周りを複数回周回させたワイヤとを備えるワイヤソーにおいて、
前記ワイヤの周回域の上方において前記ワークを横方向から弾性的に挟持する挟持手段と、
前記挟持手段に挟持されたワークを前記ワイヤに向けて押し下げる押下手段と
を備えることを特徴とするワイヤソー。 - 請求項1に記載のワイヤソーにおいて、
前記挟持手段は、前記ワークの側面を受ける受け部材と、バネ力を用いて前記ワークを前記受け部材に向けて押圧する押圧部材とを備えることを特徴とするワイヤソー。 - 請求項1又は2に記載のワイヤソーは、更に、
前記ワイヤの周回域の下方において前記ワークを横方向から弾性的に挟持する補助挟持手段を備えることを特徴とするワイヤソー。 - 請求項3に記載のワイヤソーにおいて、
前記補助挟持手段は、前記ワークの側面を受ける受け部材と、バネ力を用いて前記ワークを受け部材に向けて押圧するための押圧部材とを備えることを特徴とするワイヤソー。 - 請求項1に記載のワイヤソーにおいて、
前記加工用ローラ間において前記ワイヤの周回域の下方にローラが設けられ、
前記ローラは、前記加工用ローラの軸線と平行な軸線を中心に回転し、
前記回転ローラの外周面と前記ワイヤとの間の最短距離は、前記ワークの半径より長く、かつ前記ワークの直径より短く設定され、
前記ワイヤにより切断された前記ワークが、前記ローラの外周面に圧接されることを特徴とするワイヤソー。 - 請求項5に記載のワイヤソーは、更に、
前記ローラを回転させるための駆動手段を備えることを特徴とするワイヤソー。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201280012682.7A CN103429387B (zh) | 2011-08-22 | 2012-08-20 | 线状锯 |
US14/352,958 US10124431B2 (en) | 2011-08-22 | 2012-08-20 | Wire saw |
KR1020147007219A KR20140049078A (ko) | 2011-08-22 | 2012-08-20 | 와이어 소 |
CH00583/14A CH707317B1 (en) | 2011-08-22 | 2012-08-20 | Wire saw. |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011180677A JP5185419B2 (ja) | 2011-08-22 | 2011-08-22 | ワイヤソー |
JP2011-180677 | 2011-08-22 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2013027702A1 true WO2013027702A1 (ja) | 2013-02-28 |
Family
ID=47746442
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2012/071004 WO2013027702A1 (ja) | 2011-08-22 | 2012-08-20 | ワイヤソー |
Country Status (7)
Country | Link |
---|---|
US (1) | US10124431B2 (ja) |
JP (1) | JP5185419B2 (ja) |
KR (1) | KR20140049078A (ja) |
CN (1) | CN103429387B (ja) |
CH (1) | CH707317B1 (ja) |
TW (1) | TWI441702B (ja) |
WO (1) | WO2013027702A1 (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2009078130A1 (ja) | 2007-12-19 | 2009-06-25 | Shin-Etsu Handotai Co., Ltd. | ワイヤソーによるワークの切断方法およびワイヤソー |
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JPH07304030A (ja) * | 1994-05-13 | 1995-11-21 | M Setetsuku Kk | インゴット切断装置 |
JP2000271848A (ja) * | 1999-03-25 | 2000-10-03 | Nippei Toyama Corp | ワイヤソーにおけるワークの加工方法 |
JP2001510742A (ja) * | 1997-07-07 | 2001-08-07 | レーザー・テクノロジー・ウエスト・リミテッド | ダイヤモンドインプリグネイテッドワイヤを利用して加工物を薄切りにするための装置および方法 |
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2011
- 2011-08-22 JP JP2011180677A patent/JP5185419B2/ja active Active
-
2012
- 2012-08-16 TW TW101129641A patent/TWI441702B/zh active
- 2012-08-20 CN CN201280012682.7A patent/CN103429387B/zh active Active
- 2012-08-20 US US14/352,958 patent/US10124431B2/en active Active
- 2012-08-20 CH CH00583/14A patent/CH707317B1/en not_active IP Right Cessation
- 2012-08-20 KR KR1020147007219A patent/KR20140049078A/ko not_active Application Discontinuation
- 2012-08-20 WO PCT/JP2012/071004 patent/WO2013027702A1/ja active Application Filing
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Also Published As
Publication number | Publication date |
---|---|
TWI441702B (zh) | 2014-06-21 |
CH707317B1 (en) | 2017-04-13 |
CN103429387B (zh) | 2015-05-06 |
KR20140049078A (ko) | 2014-04-24 |
US20160175953A1 (en) | 2016-06-23 |
CN103429387A (zh) | 2013-12-04 |
JP2013043225A (ja) | 2013-03-04 |
US10124431B2 (en) | 2018-11-13 |
JP5185419B2 (ja) | 2013-04-17 |
TW201309406A (zh) | 2013-03-01 |
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