WO2013026368A1 - 一种干涉曝光装置及方法 - Google Patents

一种干涉曝光装置及方法 Download PDF

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Publication number
WO2013026368A1
WO2013026368A1 PCT/CN2012/080258 CN2012080258W WO2013026368A1 WO 2013026368 A1 WO2013026368 A1 WO 2013026368A1 CN 2012080258 W CN2012080258 W CN 2012080258W WO 2013026368 A1 WO2013026368 A1 WO 2013026368A1
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WIPO (PCT)
Prior art keywords
interference
unit
exposure
motion
head
Prior art date
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PCT/CN2012/080258
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English (en)
French (fr)
Inventor
许琦欣
王帆
Original Assignee
上海微电子装备有限公司
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Filing date
Publication date
Application filed by 上海微电子装备有限公司 filed Critical 上海微电子装备有限公司
Priority to US14/239,515 priority Critical patent/US9195146B2/en
Priority to KR1020147006799A priority patent/KR101576071B1/ko
Priority to EP12825707.8A priority patent/EP2749948B1/en
Publication of WO2013026368A1 publication Critical patent/WO2013026368A1/zh

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Classifications

    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20Exposure; Apparatus therefor
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70058Mask illumination systems
    • G03F7/70208Multiple illumination paths, e.g. radiation distribution devices, microlens illumination systems, multiplexers or demultiplexers for single or multiple projection systems
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01BMEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00Measuring arrangements characterised by the use of optical techniques
    • G01B11/14Measuring arrangements characterised by the use of optical techniques for measuring distance or clearance between spaced objects or spaced apertures
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01BMEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00Measuring arrangements characterised by the use of optical techniques
    • G01B11/26Measuring arrangements characterised by the use of optical techniques for measuring angles or tapers; for testing the alignment of axes
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20Exposure; Apparatus therefor
    • G03F7/2002Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image
    • G03F7/2004Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image characterised by the use of a particular light source, e.g. fluorescent lamps or deep UV light
    • G03F7/2006Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image characterised by the use of a particular light source, e.g. fluorescent lamps or deep UV light using coherent light; using polarised light
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70408Interferometric lithography; Holographic lithography; Self-imaging lithography, e.g. utilizing the Talbot effect
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691Handling of masks or workpieces
    • G03F7/70775Position control, e.g. interferometers or encoders for determining the stage position
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7003Alignment type or strategy, e.g. leveling, global alignment
    • G03F9/7007Alignment other than original with workpiece

Definitions

  • the present invention relates to the field of integrated circuit equipment manufacturing, and more particularly to a step lithography apparatus and a lithography exposure method. Background technique
  • Interferometric lithography uses the interference and diffraction characteristics of light to modulate the intensity distribution in the interference field by a specific beam combination and record it with a photosensitive material to produce a lithographic pattern.
  • Interferometric lithography has the advantages of high resolution (which can reach 1/4 of the exposure wavelength relatively easily) and large depth of focus (close to the coherence length of the light source), and can be used for periodic pattern processing of several tens of nanometers to several micrometers. .
  • US Pat. No. 6,286,017 proposes a multi-beam interference lithography scheme based on spherical wave, which uses a plurality of point light sources placed far away from the substrate to be exposed to generate a diffusion sphere. Waves converge on a glued substrate at a certain propagation angle to form a large area of interference pattern. Since the spherical wave itself has wavefront distortion, it causes uneven pattern distribution at the center and edge of the substrate.
  • the second solution of the prior art is that the "Scan Beam Interference Lithography (SBIL)" is proposed in the U.S. Patent No. 7,561,252, which is called Doppler Writing.
  • SBIL Scan Beam Interference Lithography
  • an ultra-long grating can be fabricated on a substrate of up to 12 inches with a line width of up to 100 nm and a uniformity of 4 ,.
  • the limitation of this method is that the structure is complicated and cannot be applied to two-dimensional graphics. Processing.
  • the present invention provides an interference exposure apparatus and method, which can realize pattern splicing of large area and high uniformity, and is compatible with various types of periodic graphic structures.
  • an interference exposure apparatus including:
  • a light source for providing an exposure beam
  • a uniform light collimating unit for collimating the exposure beams emitted by the light source
  • An interference head comprising at least two sets of gratings for forming the exposure beam to form at least two interference beams and concentrating the at least two interference beams on a surface of the substrate by a one-dimensional movement of the interference head in a vertical direction to form a Interfering with the exposure pattern, the period and position of the grating are consistent with the period and distribution characteristics of the pattern to be exposed;
  • a motion carrying unit for carrying the substrate and providing the substrate with at least three degrees of freedom of motion
  • a measuring unit configured to obtain an angle between a coordinate system of the interference head and a coordinate system of the motion bearing unit, to perform the motion according to the measurement result of the measuring unit before being exposed to the substrate The exposure position of the carrying unit is adjusted.
  • the interference head comprises three sets of regular hexagonal gratings arranged at 120 degrees between the gratings; or the interference head comprises two sets of rectangular gratings, the gratings being arranged in parallel.
  • the motion bearing unit includes an alignment mark thereon.
  • a stop is also placed between the motion carrying unit and the substrate.
  • the mirroring collimating unit and the interference head further include a mirror.
  • the interference head can be replaced.
  • the grating area of the interference head is the same as the shape of the exposure field.
  • the invention also discloses an interference exposure method, which comprises:
  • the set exposure field position of the dynamic carrier unit is the set exposure field position of the dynamic carrier unit.
  • the invention also discloses an alignment device for step interference exposure, comprising at least two measuring units mounted above the interference head; the interference head further comprising at least two identification marks on the motion carrying unit An alignment mark is provided; the alignment device detects an identification mark on the interference head by adjusting an imaging focal length, and an alignment mark on the moving 7-load unit.
  • the invention also discloses an interference exposure alignment method for a wide range of periodic substrate processing, comprising: determining, by off-line calibration, a conversion between the coordinate system of the first and second measurement units and the zero coordinate system of the motion bearing unit
  • the relationship and the first and second measurement unit coordinate systems are non-orthogonal and distorted by themselves; and the alignment marks on the motion bearing unit are respectively moved to the reference positions corresponding to the target positions in the first and second measurement unit coordinate systems, and the Aligning the pixel position of the mark in the measuring unit, taking the two pixel positions as a new target position; acquiring the positions of the first and second interference head marks in the device constant; acquiring the first and second interference heads respectively by the measuring unit Marked pixel position; calculate current pixel separately Offset of position and target position; obtaining conversion parameters between the first and second measurement unit coordinate systems and the motion bearing unit zero coordinate system, and the first and second measurement unit coordinate systems and the motion bearing unit zero coordinate Conversion parameters between the systems; converting the offset of the current pixel position from the target position into
  • the present invention provides an interference exposure apparatus and method for detecting an angular deviation of an interference pattern relative to a motion bearing unit (ie, a carrier) by using a measuring unit, and using the angular deviation to correct the motion bearing
  • a motion bearing unit ie, a carrier
  • the exposure position of the unit enables a large-area, high-uniformity pattern stitching. Since the interference head can be replaced, it is compatible with a variety of periodic graphic structures.
  • 1 is a schematic diagram of the interference fringe direction disclosed in the prior art, which is inconsistent with the moving direction of the motion bearing unit;
  • FIG. 2 is a schematic diagram of splicing error in the large-area periodic pattern interference processing disclosed in the prior art
  • FIG. 3 is a schematic structural view of the interference exposure apparatus of the present invention
  • FIG. 4 is a schematic structural view of a first embodiment of an interference head in the interference exposure apparatus of the present invention
  • FIG. 5 is a schematic diagram of an interference beam according to the first embodiment of the present invention
  • Figure 6 is an exposure effect of the first embodiment of the present invention.
  • Figure 7 is an exposure field splicing of the first embodiment of the present invention
  • Figure 9 is a schematic view of an interference beam of a second embodiment of the interference exposure apparatus of the present invention
  • Figure 10 is an exposure effect of the second embodiment of the present invention.
  • the interference exposure apparatus is suitable for a wide range of period pattern processing, and the structure of the interference exposure apparatus is as shown in Fig. 3.
  • the interference exposure device comprises a light source 100 for providing a light beam required for exposure; a hook light expansion unit 200 for collimating or shaping a light beam emitted by the light source; and an interference head 300 for dividing the coherent light source to form At least two interference arms (or interference beams); the interference arms of the interference head 300 are concentrated on the substrate (not shown) and then incident on the measuring unit 500; the interference exposure device further includes a motion carrying unit 406, The motion carrying unit 406 can carry the substrate in motion in at least 3 degrees of freedom.
  • the interference head 300 is composed of at least two sets of blazed gratings.
  • the grating direction of the interference head 300 is at an angle to the moving direction of the motion bearing unit 406, a splicing error is generated on the exposure pattern of the substrate.
  • the angle taken by the measuring unit 500 can be obtained and the position of the motion carrying unit 406 can be compensated.
  • the interference exposure apparatus includes a laser, that is, a light source 100, and a Gaussian beam emitted from the laser 100 enters the hook light expanding unit 200.
  • the laser beam is collimated into a uniform beam after passing through the hook beam expanding unit 200, and the beam diameter can cover at least the grating region on the interference head. Since the homogenizing beam expander unit 200 has been widely used in the prior art, it will not be described in detail herein.
  • the beam collimated by the uniformizing beam expanding unit 200 passes through a mirror 201 and is incident on the interference head 300.
  • the interference head 300 is required to be capable of dividing the coherent light source to form the interference arm 301 and to converge the interference arms 301 at a certain spatial angle.
  • the structure of the interference head is as shown in FIG. 4, and its surface is formed by chrome plating to form a non-transparent area 302, and is provided with three sets of one-dimensional blazed gratings 303 arranged at an angle of 120 degrees to each other, and at least two The "ten" character mark 304 is used as the identification mark " ⁇ .
  • the laser beam After the laser beam is irradiated to the blazed grating region, its +1 order diffracted light is enhanced, and the remaining levels are Diffraction is suppressed to form three interference arms 301 (only two are shown).
  • the three interference arms 301 are concentrated on the glue substrate adsorbed on the motion bearing unit by the diffraction angle ⁇ of the first-order light, as shown in FIG. 5, and the region where the three beams meet is formed as shown in FIG. Dense hole effect.
  • the distance p between the dense holes is determined by the diffraction angle ⁇ and the exposure wavelength:
  • the interference head Since the grating is used as the interference head, when the distance between the hole and the hole is changed, only the interference head needs to be replaced, and since the interference head is similar to the mask in the projection lithography in this embodiment, The interference head is placed on the support platform 409 using an automated transport mechanism.
  • the dense hole diameter is determined by the exposure time, which is related to the hole diameter, the characteristics of the photoresist used, and the illuminance of the light source on the substrate.
  • the area of the exposure field is determined by the area of the blazed grating depicted on the interference head. As shown in FIG. 4, in this embodiment, the regions of the three sets of blazed gratings are all regular hexagons, so that the exposure field area is equal to the grating area. The area is controlled to control the size of the exposed area, and at the same time, the hexagonal structure can form a seamless mosaic effect, as shown in FIG.
  • d is the distance between the centers of the blazed gratings on the interference head.
  • a substrate (not shown) is placed over the motion carrying unit (i.e., the wafer stage) 406, and the motion carrying unit 406 can provide motion of the substrate for at least 3 degrees of freedom.
  • an air flotation system 405 is placed under the motion carrying unit 406 to avoid interference from the external environment.
  • carrier flotation units 406 and a system 405 are positioned within a main frame 410, and the main frame 410 and a damper 407 (Air Mount) providing support means to isolate external vibration exposed to interference lithography interference.
  • the other components of the interference exposure apparatus and the measurement unit are located in the internal world defined by the main frame.
  • a stop 404 is also mounted to block residual 0-order light of the blazed grating and other unnecessary stray light from entering the interference region.
  • the motion loading unit 406 floats on the main frame 410 and is servo-operated by a laser interferometer 403 rigidly coupled to the main frame 410, and carries the rubberized substrate in a horizontal direction.
  • the laser shutter (Shutter) 101 is turned on, and after a certain time of exposure, ShutterlOl is turned off, at which time an exposure field exposure is completed, and the motion carrying unit 406 continues to step down to the next. A position to be exposed.
  • the corresponding interference pattern and the moving direction of the moving 7-load unit 406 may also have the same angle a, and thus In step exposure, the exposure pattern on the entire substrate produces a stitching error as shown in Figure 2.
  • a CCD camera (ie, measuring unit) 500 is mounted on each of the left and right sides of the main frame 410, and the focal length thereof can be adjusted.
  • the interference head 300 is provided with two "ten"-shaped marks 304 for respectively.
  • the CCD performs identification, and the motion bearing unit 406 is also provided with an alignment mark 408, which can be recognized by any CCD.
  • the CCD 500 respectively identifies the interference head mark 304 and the alignment mark 408 on the motion bearing unit, and can be obtained. The angle is compensated by modifying the set position of the motion carrying unit 406, which will be described in detail below.
  • Motion bearing unit ie, the bearing table
  • Coordinate system tube called WSCS
  • WZCS zero coordinate system of the motion bearing unit
  • Interference head coordinate system Two-dimensional orthogonal coordinate system, whose origin is located in the geometry of the interference head. The x-axis direction is determined by the geometric boundary of the interference head. Each time the interference head is replaced, the coordinate system is Will change;
  • Interference head zero coordinate system Two-dimensional orthogonal coordinate system, which is the projection of WZCS in the plane of the interference head;
  • Aim Position Described in MVL(R)CS, which means that when the "ten" mark on the interference head is aligned, the image of the mark is in the pixel position described in MVL(R)CS;
  • Reference position Described in WZCS, which means the corresponding position of the target position under WZCS, which is a constant amount.
  • the target positions in the left and right CCDs each correspond to a reference position;
  • Step 1 First, determine the following relationship by offline calibration:
  • MVL(R)CS itself is non-orthogonal and distorted.
  • the second step is: updating the target position, moving the alignment mark 408 on the motion carrying unit 406 to the reference position corresponding to the target position in the MVL (R) CS, and obtaining the pixel position of the alignment mark 408 in the two CCDs. Use these two pixel locations as the new target location:
  • Step 3 Obtain the position of the left and right "ten" glyphs 304 on the interference head 300, which is determined by the interference head 300 and ensures accuracy:
  • Step 4 The position of the left and right "ten" glyphs 304 in their respective coordinate systems is obtained by the CCD 500:
  • Step 5 Calculate the offset between the current position and the target position separately:
  • Step 7 Convert the position offset in the left and right CCDs in step 5 to WZCS: j rr .WZCS n WZ MVLCS MVLCS,
  • Step 8 Obtain the alignment reference position of the left and right "ten" word mark 304 in WZCS
  • Step 9 Calculate the position of the left and right "ten" word mark 304 in WZCS
  • Mr is the mark magnification at this time
  • f is the angle ⁇ between RCS and WZCS
  • Ro zcs ?o es is the translation between the two coordinate systems.
  • RCS WZCS RCS WZCS
  • the present invention also provides a second embodiment.
  • the second embodiment differs from the first embodiment in the graphical arrangement of the interference head 300.
  • the interference head 300 is provided with two sets of one-dimensional blazed gratings 303 arranged in parallel, and two detector identification marks 304 are also disposed. Both sets of one-dimensional blazed gratings 303 are rectangular.
  • an interference region where the two beams meet is formed, and interference fringes as shown in Fig. 10 are formed.
  • the relationship between the height H of the interference region from the interference surface and the diffraction angle ⁇ of the grating is:
  • the present invention provides an interference exposure apparatus and method for detecting an angular deviation of an interference pattern relative to a motion bearing unit by using a measuring unit, and using the angle deviation to correct an exposure position of the motion bearing unit, Can achieve large area and high uniformity of graphic stitching. Since the interference head can be replaced, it is compatible with a variety of periodic graphic structures.

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Length Measuring Devices By Optical Means (AREA)

Abstract

一种干涉曝光装置,包括:光源(100),用于提供曝光光束;匀光扩束单元(200),用于对光源发出的光束进行准直或整形;干涉头(300),包括至少两组光栅(303),用于将曝光光束形成至少两束干涉光束并会聚于基底表面形成一干涉曝光图形,光栅(303)的周期及位置与待曝光的图形的周期及分布特征相一致;运动承载单元(406),用于提供基底至少三自由度运动;测量单元(500),用于获得干涉头坐标系与运动承载单元坐标系的夹角,以便在对基底曝光之前依据测量单元(500)的测量结果对运动承载单元(406)的曝光位置进行调整。

Description

技术领域
本发明涉及集成电路装备制造领域, 尤其涉及一种步进光刻设备及光刻 曝光方法。 背景技术
干涉光刻技术利用光的干涉和衍射特性, 通过特定的光束组合方式, 对 干涉场内的光强分布进行调制, 并用感光材料记录下来, 产生光刻图形。
干涉光刻兼具高分辨率 (可以相对容易地达到曝光波长的 1/4 )、 大焦深 (接近光源的相干长度)的优点, 可用于几十纳米〜几个微米尺寸的周期性图 形加工。
目前, 大范围周期性图形结构, 如超长光栅、 图形化蓝宝石衬底、 光子 晶体、 太阳能吸收器、 FED ( Field Emmition Display )等, 都需要在 2英寸〜 6 英寸的衬底上, 制造均匀密布的周期性结构。 这些结构不仅包含一维结构, 还有二维结构。如何保证这些特征图形在较大面积的衬底上做到均勾分布(即 很高的拼接精度)是一个很关键的技术问题。
现有技术的解决方案之一是美国专利 US6285817提出了一种基于球面波 的多光束干涉光刻技术方案, 该方案使用若干个放置在离待曝光衬底很远处 的点光源, 产生扩散球面波, 以一定传播角度会聚在涂胶衬底之上, 形成大 面积的干涉图形。 由于球面波本身具有波前畸变, 因此会导致衬底中心和边 缘处图形分布不均匀。
现有技术的解决方案之二是美国专利 US7561252 中提出了 "Scan Beam Interference Lithography (SBIL) " 的相无念 , 称为 Doppler Writing。 使用该方法, 可在最大为 12英寸的衬底上制造超长光栅, 线宽可达 lOOnm, 同时具有 4艮好 的均匀性, 但该方法的局限在于结构复杂, 且无法应用于二维图形的加工。
现有技术的解决方案之三是美国专利 US6882477及文献《使用塔尔博特 冷静干涉仪实现 193nm 浸没式光刻》 Proc. SPIE 5377, " Immersion microlithography at 193 nm with a Talbot prism interferometer" 中公开了基于平 面波的 Talbot干涉曝光方案, 相对球面波, 平面波的波前畸变要小得多, 但 如果曝光场过大的话, 各光学元件、 环境介质引起的位相误差将对曝光图形 均匀性产生影响。 通过减小单个曝光场面积, 采用逐场曝光的方式, 可减小 这一影响, 但会带来另外的问题: 因为干涉曝光图形的方向与运动承载单元 的运动方向不一致, 导致干涉光束与成片台运动位置之间存在夹角 α (如图 1 ), 从而将导致图形产生拼接问题, 如图 2所示。
综上所述, 现有技术中出现了不同的基于光束干涉的光刻技术, 但是都 具有一个至关重要的技术问题有待突破, 即如何解决应用于大范围的微纳米 周期图形加工的问题。 发明内容
为了克服现有技术中存在的缺陷, 本发明提供一种干涉曝光装置及方法, 能够实现大面积高均匀性的图形拼接, 且兼容于多种类别的周期性图形结构。
为实现上述发明目的, 本发明公开一种干涉曝光装置, 包括:
一光源, 用于提供曝光光束;
一匀光准直单元, 用以将所述光源出射的曝光光束均勾准直;
一干涉头, 包括至少两组光栅, 用于将所述曝光光束形成至少两束干涉 光束并通过所述干涉头沿垂向的一维运动将所述至少两束干涉光束会聚于基 底表面形成一干涉曝光图形, 所述光栅的周期及位置与待曝光的图形的周期 及分布特征相一致;
一运动承载单元, 用于承载所述基底, 并提供所述基底至少三自由度运 动;
一测量单元, 用于获得所述干涉头的坐标系与所述运动承载单元的坐标 系之间的夹角, 以便在曝光至所述基底上之前依据所述测量单元的测量结果 对所述运动承载单元的曝光位置进行调整。
更进一步地, 该干涉头包括三组正六边型光栅, 该光栅之间呈 120度排 列; 或者该干涉头包括两组矩形光栅, 该光栅平行排列。 该运动承载单元上包括一对准标记。 该运动承载单元与该基底之间还放 置一光阑。 该匀光准直单元与该干涉头之间还包括一反射镜。 干涉头可替换。 干涉头的光栅区域与曝光场形状相同。
本发明同时公开一种干涉曝光方法, 包括:
加载干涉头, 及加载待曝光基底于运动承载单元上;
利用测量单元测得所述干涉头坐标系与所述运动承载单元坐标系之间的 夹角; 以及
根据所述夹角及设定的曝光场位置更新所述运动承载单元的曝光位置; 将所述运动承载单元运动至所述更新后的曝光位置; 以及 底表面, 逐场曝光所述基底。 更进
Figure imgf000005_0002
其中 为运
Figure imgf000005_0001
动承载单元的设定的曝光场位置。
本发明还公开一种用于步进干涉曝光的对准装置, 其包括至少两个测量 单元, 安装在干涉头上方; 所述干涉头上还包括至少两个识别标记, 所述运 动承载单元上设有对准标记; 所述对准装置通过调整成像焦距以探测所述干 涉头上的识别标记, 以及所述运动 7 载单元上的对准标记。
本发明还公开一种用于大范围周期性基底加工的干涉曝光对准方法, 包 括: 通过离线测校, 确定第一、 第二测量单元坐标系与运动承载单元零位坐 标系之间的转换关系及第一、 第二测量单元坐标系自身的非正交、 畸变; 将 运动承载单元上的对准标记分别移动至第一、 第二测量单元坐标系中目标位 置对应的参考位置, 获取该对准标记在测量单元中的像素位置, 将这两个像 素位置作为新的目标位置; 设备常数中获取第一、 第二干涉头标记的位置; 由测量单元分别获取第一、 第二干涉头标记的像素位置; 分别计算当前像素 位置与目标位置的偏移量; 获取第一、 第二测量单元坐标系与运动承载单元 零位坐标系之间的转换参数, 以及第一、 第二测量单元坐标系与运动承载单 元零位坐标系之间的转换参数; 将当前像素位置与目标位置的偏移量转换到 运动承载单元零位坐标系中; 获取运动承载单元零位坐标系中第一、 第二干 涉头标记的对准参考位置; 计算当前第一、 第二干涉头标记在运动承载单元 零位坐标系中的实际位置; 求解对准模型, 求得干涉头相对运动承载单元零 位坐标系 的旋转量 RR ; 修正运动承载单元步进的设定位置
Figure imgf000006_0001
与现有技术相比较, 本发明提供一种干涉曝光装置及方法, 利用一测量 单元来检测干涉图形相对于运动承载单元(即承片台) 的角度偏差, 利用该 角度偏差用来修正运动承载单元的曝光位置, 因此能够实现大面积高均匀性 的图形拼接。 由于该干涉头可以被替换, 因此兼容于多种类别的周期性图形 结构。 附图说明
关于本发明的优点与精神可以通过以下的发明详述及所附图式得到进一 步的了解。
图 1 是现有技术公开的干涉条纹方向与运动承载单元运动方向不一致时 的示意图;
图 2是现有技术公开的大面积周期性图形干涉加工时的拼接误差示意图; 图 3是本发明干涉曝光装置结构示意图;
图 4是本发明干涉曝光装置中干涉头的第一实施方式的结构示意图; 图 5是本发明第一实施方式的干涉光束示意图;
图 6是本发明第一实施方式的曝光效果;
图 7是本发明第一实施方式的曝光场拼接; 图 9是本发明干涉曝光装置第二实施方式的干涉光束示意图; 图 10是本发明第二实施方式的曝光效果。 具体实施方式
下面结合附图详细说明本发明的具体实施例。
本发明所提供的干涉曝光装置适用于大范围周期图形加工, 该干涉曝光 装置的结构示意图如图 3中所示。 该干涉曝光装置包括光源 100, 用于提供曝 光所需的光束; 勾光扩束单元 200, 用于对光源发出的光束进行准直或整形; 干涉头 300, 用于对相干光源进行分割后形成至少两道干涉臂(或称干涉光 束); 干涉头 300 出射的干涉臂会聚在基底上(图中未示出), 然后入射测量 单元 500; 该干涉曝光装置还包括一运动承载单元 406, 该运动承载单元 406 可以承载基底在至少 3个自由度方向上运动。 干涉头 300由至少两组闪耀光 栅构成, 当该干涉头 300的光栅方向与运动承载单元 406的运动方向存在夹 角时, 即会在基底的曝光图形上产生拼接误差。 通过设置的测量单元 500可 以获取其夹角, 并对该运动承载单元 406的位置进行补偿。
下面将结合图 3详细说明本发明所公开的干涉曝光装置的详细的结构示 意图及如何实现无拼接误差的大范围周期图形加工。
如图 3中所示, 该干涉曝光装置包括一激光器, 即光源 100, 激光器 100 发出的高斯光束进入勾光扩束单元 200。激光光束经过勾光扩束单元 200后被 准直为均匀光束, 且光束直径能够至少覆盖干涉头上的光栅区域。 由于匀光 扩束单元 200在现有技术中已经得到广泛的应用, 因此此处不详述。
经过匀光扩束单元 200 准直后的光束经过一反射镜 201 , 照射到干涉头 300上。 在本发明中, 要求干涉头 300既能够将相干光源进行分割, 形成干涉 臂 301 , 又能使各干涉臂 301以一定空间角度会聚。 本实施例中, 干涉头的结 构如图 4所示, 它的表面通过镀铬形成非透光区 302, 并配有三组互相成 120 度角排列的一维闪耀光栅 303 , 此外还有至少两个 "十"字形标记 304作为识 别标" ^己。
激光光束照射到闪耀光栅区域后, 其 +1级衍射光受到增强, 而其余级次 衍射则被抑制,从而形成三个干涉臂 301 (图中仅示出两个)。三个干涉臂 301 以一级光的衍射角 Θ会聚于吸附在运动承载单元上的涂胶基底之上, 如图 5 所示, 则在三光束交汇的区域, 会形成如图 6所示的密集孔效果。
密集孔之间的距离 p由衍射角 Θ和曝光波长确定:
ρ = (1)
3 sin *
由于采用光栅作为干涉头, 因此要改变孔与孔之间的距离时, 只需要更 换干涉头即可, 而由于在本实施例中, 干涉头作用与投影光刻中的掩膜类似, 所以可采用自动化的传输机构, 将干涉头安放于支撑平台 409上。
密集孔直径由曝光时间确定, 该时间与孔直径大小、 所用光刻胶特性、 光源在基底上的光照度等参数有关。
曝光场面积则由干涉头上刻画出的闪耀光栅的面积确定, 如图 4所示, 本实施例中, 三组闪耀光栅的区域均为正六边形, 这样可以恰好使曝光场面 积等于光栅区域的面积, 以控制曝光区域大小, 同时, 六边形结构能够形成 图形无缝拼接效果, 如图 7所示。
在本实施例中, 曝光不同密集孔间距, 光栅衍射角 Θ不同, 因此干涉区 域的垂向位置也有所区别, 由筒单的几何关系可知, 干涉区域距离干涉面的 高度 H与光栅
Figure imgf000008_0001
其中 d为干涉头上的闪耀光栅中心之间的距离。
基底(图中未示出)放置于运动承载单元(即承片台) 406上面, 运动承 载单元 406可以提供基底至少 3个自由度的运动。 为了实现最佳的技术效果, 避免外界环境的干扰,在运动承载单元 406下放置一气浮系统 405。上述基底、 运动 7|载单元 406及气浮系统 405均放置于一主框架 410内, 而主框架 410 又由减震装置 407 ( Air Mount )提供支撑, 以隔离外界振动对于干涉光刻曝 光的干扰。 本干涉曝光装置其他各组成部分及测量单元均位于主框架确定的 内部世界中。
在主框架 410的两侧, 安装两个一维线性导轨 401 , 用于驱动干涉头支撑 平台 409沿着垂直方向做一维运动, 以保证干涉区域始终位于涂胶基底表面。 在涂胶基底上表面,还安装有一光阑 404, 以阻挡闪耀光栅的残余 0级光 及其他非必要的杂散光进入干涉区域。
运动^载单元 406气浮于主框架 410上, 由刚性连接在主框架 410上的 激光干涉仪 403伺服, 承载涂胶基底在水平方向进行步进。 当运动承载单元 406步进并稳定于设定位置时, 激光快门 (Shutter ) 101开启, 当曝光到一定 时间后, ShutterlOl关闭, 此时一个曝光场曝光完成, 运动 载单元 406继续 步进至下一个待曝光位置。
由于位于干涉头 300上的光栅方向与运动承载单元运动方向存在如图 1 所示的夹角 α , 因此对应的干涉图形与运动 7 载单元 406运动方向之间也会 存在相同角度 a , 于是在步进曝光时, 会使整个衬底上的曝光图形产生如图 2 所示的拼接误差。
在本实施例中, 在主框架 410上左右两侧各安装一个 CCD摄像机 (即测 量单元)500,其焦距可进行调节,干涉头 300上配有两个 "十"字形标记 304, 分别供左右 CCD进行识别, 同时运动承载单元 406上也附有一个对准标记 408, 可供任意一个 CCD识别, 通过 CCD 500分别对干涉头标记 304及运动 承载单元上的对准标记 408进行识别, 可获取其夹角 , 并通过修改运动承 载单元 406的设定位置进行补偿, 下面将详细说明这一流程。
在说明流程之前, 先预定义以下坐标系, 请结合图 8理解坐标系: 运动承载单元(即承片台) 坐标系 (筒称 WSCS ): 其原点位于运动承载 单元的几何中心, x、 y轴方向由激光干涉仪平面镜确定, 为二维正交坐标系; 运动承载单元零位坐标系 (筒称 WZCS ): 与运动承载单元处于(0,0 )时 的运动承载单元坐标系重合,运动承载单元的位置描述为 WZCS原点在 WSCS 下的向量, 即 WSCS与 WZCS间仅存在平移关系:
Figure imgf000009_0001
Figure imgf000009_0002
干涉头坐标系 (筒称 RCS ): 二维正交坐标系, 其原点位于干涉头的几何 x、 y轴方向由干涉头的几何边界确定, 每次更换干涉头, 该坐标系都 会发生改变;
干涉头零位坐标系 (筒称 RZCS ): 二维正交坐标系, 为 WZCS在干涉头 平面内的投影;
左 /右 CCD (即测量单元) 坐标系 (MVLCS、 MVRCS ): 为二维非正交 坐标系, 原点由 CCD测量系统的逻辑像素位置(0,0 )确定, 坐标轴方向垂直 于 CCD成像边界确定。
为方便叙述, 再定义若干位置:
目标位置( Aim Position ): 描述于 MVL(R)CS中, 其意义为干涉头上的 "十" 字标记对准时, 该标记的像在描述于 MVL(R)CS中的像素位置;
参考位置( Ref Position ): 描述于 WZCS中, 其意义为目标位置在 WZCS 下的对应位置, 该位置作为一恒定量, 在本实施例中, 左右 CCD中的目标位 置各对应一个参考位置;
当前位置( Current Position ): 描述于 MVL(R)CS下, 表明干涉头或运动 承载单元上的标记实际在左 /右 CCD中的像素位置。
通过对准所希望确定的夹角(X , 是指干涉头坐标系与运动承载单元零位 坐标系之间的夹角。
整个校正流程如下:
第一步: 首先通过离线测校, 确定以下关系:
MVL(R)CS与 WZCS之间的转换关系, 即 CCD中的任意像素位置,对应 WZCS下的位置坐标;
MVL(R)CS与 RZCS之间的转换关系, 即 CCD中的任意像素位置, 对应 RZCS下的位置坐标;
MVL(R)CS自身的非正交、 畸变。
第二步: 更新目标位置, 将运动 载单元 406上的对准标记 408分别移 动至 MVL(R)CS 中目标位置对应的参考位置, 获取该对准标记 408 在两个 CCD中的像素位置, 将这两个像素位置作为新的目标位置:
, 。 第三步: 获取干涉头 300上左右 "十" 字形标记 304的位置, 该位置由 干涉头 300加工时确定并保证精度:
Y RCS · ( r RCS vRCS Λ
^LRM · \Λ LRM, J LRM )
RCS · ( Y RCS ^CS
^RRM · \XRRM, y RRM )
第四步: 由 CCD 500分别获取左、 右 "十" 字形标记 304在各自坐标系 中的位置:
Figure imgf000011_0001
MVRCS , ( MVRCS MVRCS
^-Cur · \XCur , y Cur )
第五步: 分别计算当前位置与目标位置的偏移量:
f MVLCS MVLCS
CS XRA ― XCur
Figure imgf000011_0002
MVLCS MVLCS
y RA 一 Cur J
MVRCS
offset CurToAim
Figure imgf000011_0003
第七步: 将第五步中的左右 CCD中的位置偏移量转换到 WZCS中: j rr .WZCS n WZ MVLCS MVLCS、
L°ffSet A ,i,m„Tr„orC-„ur, = RMVL -(Xcur ^-RA )
WZCS z (x MVRCS MVRCS
Roffset Rw
IVMVR ^-RA ) 第八步: 获取 WZCS 中左右 "十" 字标记 304 的对准参考位置
WZCS / WZCS WZCS WZCS . / WZCS WZCS
X LRA , y )、 ^ , y
第九步: 计算左右 "十" 字标记 304 的像在 WZCS 中的位置
WZCS . ( WZCS WZCS x WZCS . , WZCS WZCS ·
^-LRM •· X^ LLRRMM , y LRM )、 - ■RRRRMM · \ yX-^RRRRMM , Y RRM ),
WZCS WZCS
X LRM ^LRA + L offset
WZCS _ WZCS , n ff WZCS 第十步: 两 "十" 字标记 304在 WZCS下的位置满足方程组:
cos(W ) - sin(f )
Figure imgf000011_0004
sin(RRwzcs) cos(RRwzcs)
Figure imgf000011_0005
其中 Mr为此时标记倍率, f 即为 RCS 与 WZCS之间的夹角 α , Ro:zcs ?o es为两坐标系间的平移,通过两个 "十"标记 304的测量转换结果, 可得到四组方程, 可解得:
f =β,Α (4)
其中:
RCS WZCS , RCS WZCS
ox .ox + oy .oy
A
(SxRCSf + (SyRCS)
- RCS WZCS RCS
>y .ox + ox
B
(SxK " )z + (SyK " )
S RCS _ RCS RCS
ox --― XLRM ― XRRM ,
SyRCS -- = vLRRCMS - WZCS _ WZCS WZCS
OX ― XLRM ― XRRM ,
Figure imgf000012_0001
第十一步: 重新计算运动承载单元设定位置
Figure imgf000012_0003
Figure imgf000012_0002
经过上述步骤, 就可以实现在大面积的基底上达到较高的图形拼接精度。 本发明还提供第二实施方式。 第二实施方式与第一实施方式的区别在于 干涉头 300的图形设置。 如图 9所示, 该干涉头 300上设置有两组并行排列 的一维闪耀光栅 303 , 同时也设置两个探测器识别标志 304。 两组一维闪耀光 栅 303均呈矩形。 利用图 9中所涉及的干涉头会形成两光束交汇的干涉区域, 会形成如图 10中所示的干涉条纹。其中干涉区域距离干涉面的高度 H与光栅 衍射角 Θ的关系为:
d
H 其中 d为干涉头上闪耀光栅中心的间距。 其他的对夹角的补偿公式如上 文所示。
与现有技术相比较, 本发明提供一种干涉曝光装置及方法, 利用一测量 单元来检测干涉图形相对于运动承载单元的角度偏差, 利用该角度偏差用来 修正运动承载单元的曝光位置, 因此能够实现大面积高均匀性的图形拼接。 由于该干涉头可以被替换, 因此兼容于多种类别的周期性图形结构。
本说明书中所述的只是本发明的较佳具体实施例, 以上实施例仅用以说 明本发明的技术方案而非对本发明的限制。 凡本领域技术人员依本发明的构 思通过逻辑分析、 推理或者有限的实验可以得到的技术方案, 皆应在本发明 的范围之内。

Claims

权利要求
1、 一种干涉曝光装置, 其特征在于, 包括:
一光源, 用于提供曝光光束;
一匀光准直单元, 用以将所述光源出射的曝光光束均勾准直;
一干涉头, 包括至少两组光栅, 用于将所述曝光光束形成至少两束干涉 光束并通过所述干涉头沿垂向的一维运动将所述至少两束干涉光束会聚于基 底表面形成一干涉曝光图形, 所述光栅的周期及位置与待曝光的图形的周期 及分布特征相一致;
一运动承载单元, 用于承载所述基底, 并提供所述基底至少三自由度运 动;
一测量单元, 用于获得所述干涉头的坐标系与所述运动承载单元的坐标 系之间的夹角, 以便在曝光至所述基底上之前依据所述测量单元的测量结果 对所述运动承载单元的曝光位置进行调整。
2、 如权利要求 1所述的干涉曝光装置, 其特征在于, 所述干涉头包括三 组正六边型光栅, 所述正六边型光栅的栅线之间呈 120度排列, 以在所述基 底上形成呈六边形分布的密集孔阵列的干涉曝光图形。
3、 如权利要求 1所述的干涉曝光装置, 其特征在于, 所述干涉头包括两 组矩型光栅, 所述两组矩型光栅平行排列, 且光栅的栅线之间互相平行, 以 在所述基底上形成呈密集线结构的干涉曝光图形。
4、 如权利要求 1所述的干涉曝光装置, 其特征在于, 所述运动承载单元 上包括一对准标记。
5、 如权利要求 1所述的干涉曝光装置, 其特征在于, 所述运动承载单元 与所述基底之间还放置一光阑。
6、如权利要求 1所述的干涉曝光装置, 其特征在于,所述干涉头可替换。
7、 如权利要求 1所述的干涉曝光装置, 其特征在于, 所述干涉头的光栅 区域与曝光场形状相同。
8、 一种采用如权利要求 1所述的干涉曝光装置的干涉曝光方法, 其特征 在于, 包括: 加载干涉头, 及加载待曝光基底于运动承载单元上;
利用测量单元测得所述干涉头坐标系与所述运动承载单元坐标系之间的 夹角; 以及
根据所述夹角及设定的曝光场位置更新所述运动承载单元的曝光位置; 将所述运动承载单元运动至所述更新后的曝光位置; 以及
底表面, 逐场曝光所述基底。
9、 如权利要求 8述的干涉曝光方法, 其特征在于, 所述运动承载单元的 曝光位置 采用如下公式计算:
Figure imgf000015_0002
其中 RRWZCS为所述干涉头坐标系与所述运动承载单元坐标系之间的夹角 为运动承载单元的设定的曝光场位置。
Figure imgf000015_0001
10、 如权利要求 1 所述的干涉曝光装置, 其特征在于, 还包括一对准装 置, 所述对准装置包括至少两个测量单元安装在所述干涉头上方; 所述干涉 头上还包括至少两个识别标记, 所述运动 7 载单元上设有对准标记; 所述对 准装置通过调整成像焦距以探测所述干涉头上的识别标记, 以及所述运动承 载单元上的对准标记。
11、 一种用于大范围周期性基底加工的干涉曝光对准方法, 采用如权利 要求 10所述的干涉曝光装置, 其中所述对准装置包括两个测量单元, 分别为 第一、 第二测量单元, 所述干涉头上包括两个识别标记, 分别为第一、 第二 干涉头标记, 其特征在于, 所述方法包括:
a) 通过离线测校, 确定第一、 第二测量单元坐标系与运动承载单元零 位坐标系之间的转换关系及第一、 第二测量单元坐标系自身的非正交、 畸变; b) 将运动承载单元上的对准标记分别移动至第一、 第二测量单元坐标 系中目标位置对应的参考位置, 获取该对准标记在测量单元中的像素 位置, 将这两个像素位置作为新的目标位置;
c) 设备常数中获取第一、 第二干涉头标记的位置;
d) 由测量单运元分别获取第一、 第二干涉头标记的像素位置;
e) 分别计算当前像动素位置与所述目标位置的偏移量;
f) 获取第一、 第二测量单元坐标系与运动承载单元零位坐标系之间的 转换参数, 以及第一、 第二载测量单元坐标系与运动承载单元零位坐标 系之间的转换参数; 单
g) 将当前像素位置与目标位置的偏移量转换到运动承载单元零位坐 标系中; 步
h) 获取运动承载单元零位坐标系中第一、 第二进干涉头标记的对准参考 位置;
i) 计算当前第一、 第二干涉头标记在运动承载单元零位设坐标系中的实 际位置;
j) 求解对准模型, 求得干涉头相对运动承载单元零位坐标系的旋位转量
WZCS
RR
Figure imgf000016_0001
为运动承载单元的原设定
Figure imgf000016_0002
y0
位置,
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