WO2013024741A1 - Dispositif de séparation de tranches, et procédé de fabrication de tranches mettant en œuvre celui-ci - Google Patents

Dispositif de séparation de tranches, et procédé de fabrication de tranches mettant en œuvre celui-ci Download PDF

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Publication number
WO2013024741A1
WO2013024741A1 PCT/JP2012/070051 JP2012070051W WO2013024741A1 WO 2013024741 A1 WO2013024741 A1 WO 2013024741A1 JP 2012070051 W JP2012070051 W JP 2012070051W WO 2013024741 A1 WO2013024741 A1 WO 2013024741A1
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WIPO (PCT)
Prior art keywords
wafer
liquid
liquid flow
injection nozzle
nozzle
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PCT/JP2012/070051
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English (en)
Japanese (ja)
Inventor
明生 早川
清秀 一見
榊原　健二
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株式会社 安永
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Publication of WO2013024741A1 publication Critical patent/WO2013024741A1/fr

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work

Definitions

  • the present invention relates to a wafer separating apparatus and a wafer manufacturing method using the same, and to a technique for separating a plurality of wafers obtained by cutting a silicon ingot into pieces.
  • silicon wafers for solar cells are used for solar power generation, and the demand for silicon wafers for solar cells is increasing with the spread of solar power generation.
  • solar cell silicon wafers are manufactured by cutting a silicon ingot into a thin plate with a wire saw and turning it into single sheets.
  • the present invention has been made to solve such problems.
  • the object of the present invention is to reliably separate a large number of wafer groups obtained by cutting a silicon ingot into individual wafers after passing a liquid. Then, it is providing the wafer separation apparatus which can be supplied to the following process, and the manufacturing method of a wafer using the same.
  • the wafer separating apparatus is configured such that a plurality of wafer groups obtained by cutting a silicon ingot are stacked horizontally and stacked in layers, and the mounting table is detachable.
  • the wafer group loaded on the loading table which is provided so as to be immersed and lifted together with the loading table support member by the lifting device, is sucked to the transport belt at the one end in order from the uppermost wafer.
  • a liquid flow injection device configured to inject a liquid flow in a lateral direction toward the wafer group which is provided so as to be immersed in a liquid in the liquid tank and is horizontally placed on the loading table in a layered manner.
  • Nozzle and said liquid jet Nozzle of provided below characterized in that it comprises a bubble discharging device for discharging bubbles as bubble between the liquid flow injection nozzle and the wafer group is increased.
  • the wafer separating apparatus according to the first aspect, wherein the bubble discharge device is configured to discharge bubbles having different sizes.
  • the wafer separating apparatus according to the first or second aspect wherein the liquid jet nozzles are arranged on the left and right with respect to the wafer group and jetted from the left and right liquid jet nozzles toward the wafer group, respectively. The liquid flows are provided so as to have a predetermined depression angle.
  • the liquid flow injection nozzle injects a liquid flow toward a wafer group higher than the central layer in the wafer group.
  • the liquid jet nozzle is composed of two upper and lower stages of a lower jet nozzle and an upper jet nozzle.
  • the wafer separating apparatus is the wafer separating apparatus according to the fifth aspect, wherein the lower injection nozzle injects a liquid flow with an injection intensity equal to or higher than a predetermined force, and the upper injection nozzle generates a liquid flow with an injection intensity lower than the predetermined force. It is characterized by spraying.
  • the wafer separating apparatus according to claim 7 is characterized in that, in claim 5 or 6, the lower injection nozzle injects a liquid flow at an injection strength of a predetermined force or more capable of blowing off a broken and broken wafer.
  • the liquid separation nozzle is provided so as to be immersed in a liquid in the liquid tank, and obliquely upward toward the wafer group.
  • a second liquid flow injection nozzle for injecting a liquid flow is provided.
  • a wafer manufacturing method using the wafer separating apparatus according to claim 9 is a wafer manufacturing method using the wafer separating apparatus according to any one of claims 1 to 8, wherein the wafer group is placed horizontally on the loading table.
  • the loading table is supported by the loading table support member, and the loading table support member is raised by the lifting device toward the transfer device while passing the liquid in the liquid tank.
  • the bubbles are ejected so that the bubbles rise between the liquid jet nozzle and the wafer group by the bubble ejection device while jetting a liquid flow laterally toward the wafer group by the flow jet nozzle.
  • a liquid flow injection nozzle for cutting a silicon ingot and injecting a liquid flow in a horizontal direction toward a plurality of wafers stacked horizontally in a layered manner. Since a bubble discharge device is provided below the liquid flow injection nozzle to discharge and raise bubbles between the liquid flow injection nozzle and the wafer group, it is easy to push the bubbles between each wafer in the wafer group with a liquid flow. The wafer can be easily peeled off. Therefore, after passing through the liquid in the wafer group, the wafers can be reliably separated one by one and supplied to the next process. Moreover, the cleaning action of each wafer can be promoted by pushing bubbles between the wafers in a liquid flow.
  • the bubble discharge device is configured to be able to discharge bubbles of different sizes, bubbles of different sizes are generated simultaneously from coarse ones having a large diameter to fine ones having a small diameter. It is easy to widen the gap between the wafers by pushing small bubbles between the wafers in the lower layers of the wafer group, which makes it difficult to widen the gap between the wafers by its own weight due to the liquid flow by the liquid jet nozzle. A large diameter coarse bubble can be pushed in between each upper layer wafer, and the wafer can be more easily peeled off.
  • the wafer separating apparatus of the third aspect since the liquid jet nozzles are arranged on the left and right, the wafer can be more easily peeled off more stably and the posture of the wafer can be stabilized.
  • the wafer separating apparatus of the fourth aspect since the liquid flow is ejected toward at least the wafer group higher than the center layer in the wafer group, bubbles can be efficiently pushed between the wafers in a range close to the transfer device. it can.
  • the liquid flow injection nozzle is composed of the upper and lower stages of the lower injection nozzle and the upper injection nozzle, the liquid flow injected from the lower injection nozzle and the upper injection nozzle are injected. The injection strength can be adjusted and numerical control can be performed with the liquid flow.
  • the lower injection nozzle injects the liquid flow with an injection strength greater than or equal to a predetermined force
  • the upper injection nozzle injects the liquid flow with an injection intensity lower than the predetermined force.
  • the second liquid flow injection nozzle for injecting the liquid flow obliquely upward toward the wafer group is provided separately from the liquid flow injection nozzle, the second liquid flow injection nozzle is used for injection.
  • the uppermost wafer of the wafer group is lifted obliquely by the liquid flow so as to be peeled off very smoothly and smoothly transferred to the inclined transfer device, so that the wafers can be separated more reliably.
  • bubbles are liquefied between the wafers of the wafer group loaded on the loading table while the loading table is raised by the lifting device toward the transfer device.
  • the wafer can be pushed in by a flow, and the wafer can be easily peeled off. Therefore, after passing through the liquid in the wafer group, the wafers can be reliably separated one by one and supplied to the next process. Moreover, the cleaning action of each wafer can be promoted by pushing bubbles between the wafers in a liquid flow.
  • FIG. 1 is a front view of a wafer separating apparatus showing an overall configuration of the wafer separating apparatus according to the present invention. It is a side view of the wafer separation apparatus seen from the arrow A direction of FIG.
  • FIG. 2 is a plan sectional view of the wafer separating apparatus along the line BB in FIG. 1. It is the C section enlarged view of FIG. It is a top view of a basket. It is a front view of a basket. It is a side view of a basket. It is a schematic diagram which expands and shows a flow injection nozzle, a bubble discharge device, and a wafer group placed on a basket. It is a schematic diagram which expands and shows the 2nd liquid-flow injection nozzle, the 1st conveyor, and the wafer group mounted in the basket. It is a figure which shows other embodiment of this invention.
  • FIG. 1 is a front view of a wafer separating apparatus showing the overall configuration of the wafer separating apparatus according to the present invention
  • FIG. 2 is a side view of the wafer separating apparatus viewed from the direction of arrow A in FIG. 1
  • FIG. FIG. 4 is a plan sectional view of the wafer separating apparatus taken along line BB in FIG. 1
  • FIG. 4 is an enlarged view of part C in FIG.
  • the wafer separating apparatus according to the present invention is an apparatus for cutting a silicon ingot and laminating a plurality of wafers stacked in layers, and then separating the wafers one by one and supplying them to the next process. As shown in FIG.
  • a liquid tank 2 in which a cleaning liquid is stored, an elevating device 10 that moves up and down a large number of wafer groups W in the liquid tank 2, and a wafer group W that has been raised by the elevating apparatus 10 are arranged at the top.
  • the belt conveyor (conveyance device) 20 conveys the wafers in order from the wafer at the position, and the storage device 30 that stores the wafer group W that is moved up and down by the lifting device 10.
  • the cleaning liquid stored in the liquid tank 2 is, for example, water (tap water, pure water, etc.), and it is possible to wash away the chips generated on the silicon ingot and adhered to the wafer.
  • the liquid tank 2 is provided with a dirt sensor 3 for detecting the dirt of the cleaning liquid. Based on information from the dirt sensor 3, the degree of dirt of the cleaning liquid can be monitored.
  • the wafer group W is stacked horizontally in a layered manner on a basket (loading table) 40 having a unified standard. Specifically, the wafer group W is processed into a quadrangular shape with the periphery cut off, and FIGS. 4 and 5 show a plan view of the basket 40, FIG. 6 shows a front view of the basket 40, and FIG.
  • the basket 40 has a right side wall 41, a left side wall 42, and a rear side wall 43 extending in the stacking direction of the wafer group W, and can position the square wafer group W appropriately. Standards are unified so that the sides and top are open. Thus, the wafer group W can be loaded into the basket 40 from one side and from above, and the wafer group W loaded on the basket 40 can be approached from one side and from above.
  • the basket 40 is also provided with a right handle 44 and a left handle 45.
  • the right side wall 41 is made of a plate member having a relatively wide width
  • the left side wall 42 is made of a member having a width narrower than the width of the right side wall 41 (for example, about half the width of the right side wall 41).
  • the rear side wall 43 is made of a member having a width narrower than the width of the left side wall 42 (for example, approximately half the width of the left side wall 42), and is arranged on the right side. That is, the left side wall 42 and the rear side wall 43 are arranged such that the distance between the left side wall 42 and the rear side wall 43 is sufficiently larger than the distance between the right side wall 41 and the rear side wall 43.
  • the right handle 44 is composed of an inverted U-shaped bar member
  • the left handle 45 is composed of an F-shaped bar member whose rear is opened.
  • the space between the left side wall 42 and the rear side wall 43 is widened, and the rear side of the left side handle 45 is opened, so that the broken wafer is opened as shown in the direction of the arrow in the figure and described in detail later. It is possible to eliminate by passing through the space.
  • the elevating device 10 includes a pair of left and right elevating units 11, 12, and each of the pair of left and right elevating units 11, 12 can elevate the basket 40 on which the wafer group W is loaded.
  • the elevating units 11 and 12 can be raised and lowered by rotating a ball screw with a stepping motor, for example.
  • the lifting units 11 and 12 are provided with basket support members (loading table support members) 13 and 14 integrally with the lifting units 11 and 12, and the lifting units 11 and 12 are provided on the basket support members 13 and 14.
  • the basket 40 is supported on the wafer group W, and the wafer group W together with the basket 40 can be moved up and down independently.
  • the elevating device 10 is also provided with slide units 15 and 16 so that the elevating units 11 and 12 can be independently moved from the storage device 30 side to the belt conveyor 20 side or in the opposite direction.
  • the slide units 15 and 16 can also be operated by rotating a ball screw with a stepping motor, for example.
  • the elevating units 11 and 12 can move the wafer group W together with the basket 40 in the liquid tank 2 independently in the biaxial directions as indicated by the arrows in FIG.
  • the belt conveyor 20 includes a first conveyor 21 and a second conveyor 22.
  • the first conveyor 21 travels in a pair of endless belts, a vacuum unit 23 is provided from one end to a predetermined range between the pair of endless belts, and one end is predetermined with respect to the horizontal so that one end is immersed in the liquid. Inclined at an angle of (greater than 0 °).
  • the first conveyor 21 can suck the wafer at the uppermost position of the wafer group W in the liquid by the vacuum unit 23, press the wafer against the belt, and transfer it to the second conveyor 22 at the other end. .
  • the liquid tank 2 has an uppermost position sensor 4 for detecting the height position of the uppermost wafer so that the uppermost wafer of the wafer group W loaded on the basket 40 is in the vicinity of one end of the first conveyor 21.
  • a photoelectric sensor is employed as the uppermost position sensor 4.
  • the first conveyor 21 can satisfactorily suck the wafer at the uppermost position of the wafer group W by the vacuum unit 23.
  • the second conveyor 22 is inclined so that a pair of endless belts travel, and the wafer received from the first conveyor 21 can be further transferred to the next process.
  • the storage device 30 is configured such that a stepping motor 33 can rotate a turntable 31 on which a plurality of L-shaped arm members 32 that support the basket 40 are suspended.
  • the arm members 32 are, for example, six pieces, and are arranged at equal intervals of 60 ° so that one side of the basket 40 that is opened is radiated and faces outward.
  • a liquid jet nozzle 50 is provided so as to be spaced apart from the opened side of the basket 40. .
  • the liquid jet nozzle 50 is composed of upper and lower two stages of a lower jet nozzle 51 and an upper jet nozzle 52, and jets a liquid flow from the lateral direction toward one side surface of the wafer group W loaded on the basket 40, respectively. Is configured to do.
  • the lower injection nozzle 51 and the upper injection nozzle 52 are connected to a liquid flow generator 54.
  • the lower injection nozzle 51 and the upper injection nozzle 52 are provided in one of the rectangular wafer groups W with respect to the wafer group W higher than the central layer of the wafer group W.
  • the liquid flow is arranged to be ejected obliquely toward one side corner.
  • the lower injection nozzle 51 is set so as to strongly inject a liquid flow with an injection intensity equal to or higher than a predetermined force
  • the upper injection nozzle 52 has an injection port extending in the vertical direction and smaller than the predetermined force.
  • the liquid flow is set to be jetted gently at the jetting intensity.
  • a bubble discharge device 60 for discharging the bubbles so that the bubbles rise between the liquid jet nozzle 50 and the wafer group W.
  • the bubble discharge device 60 is connected to the bubble generation device 62.
  • the bubble discharge device 60 is configured to be able to generate bubbles of different sizes at the same time.
  • the bubble discharge device 60 is configured by combining two or more types of bubble discharge devices with different amounts of gas to be introduced.
  • the bubble discharge device 60 is a bubble having a different size from a coarse one having a large diameter (for example, a maximum diameter of 0.3 mm to 2 mm) to a fine one having a small diameter (for example, a maximum diameter of 0.03 mm to less than 0.3 mm). Can be generated and mixed at the same time.
  • the bubble discharge device 60 may be configured to include two or more types of bubble discharge nozzles having different opening areas in one bubble discharge device. Even in this case, the bubble discharge device 60 can simultaneously generate and mix bubbles having different sizes from a coarser one with a large diameter to a fine one with a small diameter from each bubble discharge nozzle.
  • a pair of second liquid flow injection nozzles 70 so as to inject a liquid flow obliquely upward toward one side surface of the wafer group W loaded on the basket 40, 70 is provided.
  • a pair of second liquid flow jet nozzles 70, 70 are also connected to the liquid flow generator 54.
  • the wafer separation device includes a control device, and the lifting device 10, the belt conveyor 20, the storage device 30, the liquid flow generation device 54, and the bubble generation device 62 are the contamination sensor 3, the uppermost position. Based on output signals from sensors such as the sensor 4, the operation is appropriately controlled by a control device.
  • the operation of the wafer separating apparatus according to the present invention configured as described above that is, a wafer manufacturing method using the wafer separating apparatus according to the present invention will be described.
  • the basket 40 loaded with the wafer group W is carried by the operator with the handles 44 and 45 so that the L-shaped arm member of the storage device 30 is transported.
  • the storage device 30 is configured such that the arm member 32 rotates and stops in the direction of the arrow by 60 ° at the position shown in FIG. 3, and with the arm member 32 stopped, the elevating unit 11 and the elevating unit 11 of the elevating device 10 are stopped.
  • the unit 12 operates to alternately receive the baskets 40 placed on the arm members 32. Thereby, the basket 40 is sequentially supported by the basket support member 13 of the lift unit 11 and the basket support member 14 of the lift unit 12, respectively.
  • the elevating unit 11 and the elevating unit 12 that have received the basket 40 move the basket 40 in the liquid as indicated by an arrow in FIG. While cleaning, the basket 40 is positioned so that the height position of the uppermost wafer in the wafer group W is in the vicinity of one end of the first conveyor 21 based on information from the uppermost position sensor 4. As a result, the wafer at the uppermost position of the wafer group W is sequentially sucked by the vacuum unit 23 and transferred to the second conveyor 22 by the first conveyor 21.
  • the bubbles are discharged from the bubble discharging device 60 from a large diameter to a small diameter.
  • the bubbles are discharged in a mixed manner, and the bubbles rise between the liquid jet nozzle 50 and the wafer group W. At this time, the liquid flow is jetted from the liquid jet nozzle 50 toward the wafer group W.
  • the liquid jet nozzle 50, the bubble discharge device 60, and the wafer group W placed on the basket 40 are schematically shown in an enlarged manner, and are jetted from the bubbles and the liquid jet nozzle 50.
  • the action of the liquid flow will be described in detail with reference to FIG.
  • the bubbles rise between the liquid jet nozzle 50 and the wafer group W, and the liquid flow from the lower jet nozzle 51 and the upper jet nozzle 52 which are the liquid jet nozzles 50 as indicated by arrows.
  • the bubbles P are pushed between the wafers in the wafer group W by the liquid flow.
  • the wafer group W is easy to widen the gap between the wafers by the liquid flow in the upper layer, but it is difficult to widen the gap between the wafers by its own weight as it becomes the lower layer even in the liquid.
  • the small diameter bubbles P are preferentially pushed in between the wafers by the liquid flow from the lower injection nozzle 51 in order from the finest, and the liquid flow from the upper injection nozzle 52 is inserted between the wafers of the upper layer. A relatively large diameter coarse bubble P is pushed in.
  • the injection nozzle is composed of upper and lower two stages of the lower injection nozzle 51 and the upper injection nozzle 52, the liquid flow injected from the lower injection nozzle 51 and the liquid flow injected from the upper injection nozzle 52 Thus, adjustment of the injection intensity and numerical management can be performed.
  • the liquid flow injected from the lower injection nozzle 51 is set so as to strongly inject the liquid flow with an injection intensity equal to or greater than a predetermined force. Accordingly, a gap is easily formed between the wafers of the wafer group W by the liquid flow from the lower injection nozzle 51, and the small-sized fine bubbles P are favorably pushed between the wafers.
  • the liquid flow injected from the lower injection nozzle 51 is set to an injection strength that is equal to or higher than a predetermined force capable of blowing off a damaged and broken wafer.
  • the wafer thus broken and divided is no longer regulated by the right side wall 41, the left side wall 42, and the rear side wall 43, and the liquid jetted from the lower jet nozzle 51.
  • the air is blown out rearward through the open space behind the left side wall 42, the rear side wall 43 and the left side handle 45, and is eliminated.
  • the damaged wafer can be easily removed, it is possible to prevent the apparatus from being stopped due to jamming, and to improve the operation rate of the apparatus.
  • the liquid flow injected from the upper injection nozzle 52 is set to inject the liquid flow with an injection strength smaller than a predetermined force. Even by such a gentle liquid flow injected from the upper injection nozzle 52, a gap larger than that of the lower layer is easily formed between the wafers in the upper layer of the wafer group W as described above. Since the small-sized fine bubbles P are pushed in first, the large-sized coarse bubbles P are well pushed into the gaps between the wafers formed by the liquid flow from the lower injection nozzle 51 and are evenly arranged. The gap between each wafer is gradually enlarged.
  • the lower injection nozzle 51 and the upper injection nozzle 52 inject the liquid flow toward the wafer group W that is at least higher than the center layer in the wafer group W, the bubbles are efficiently produced in a range close to the first conveyor 21. P can be pushed between the wafers.
  • the bubbles P are sufficiently pushed into the gaps between the wafers, so that the wafer can be lifted by the presence of the bubbles P and easily peeled off.
  • the uppermost wafer can be smoothly peeled off and pressed against the belt by suction of the vacuum unit 23, and the wafers can be reliably separated one by one and transported to the next process.
  • the second liquid jet nozzle 70, the first conveyor 21, and the wafer group W placed on the basket 40 are schematically shown in an enlarged manner. The action of the jetted liquid flow will be described in detail with reference to FIG.
  • the wafers are easy to peel off due to the presence of the bubbles P in the gaps between the wafers.
  • the wafer is largely separated on the second liquid jet nozzle 70 side by the liquid flow from the second liquid jet nozzle 70, that is, the wafer is It inclines so that the 2nd liquid-flow injection nozzle 70 side may become high with an elevation angle larger than 0 degree.
  • the wafer since the first conveyor 21 is inclined at a predetermined angle (greater than 0 °) with respect to the horizontal so that one end is immersed in the liquid, the wafer easily follows the inclined belt of the first conveyor 21. So close. Thereby, only the wafer at the uppermost position of the wafer group W is smoothly sucked by the vacuum unit 23 and pressed against the belt, and is sequentially transferred to the second conveyor 22 by the first conveyor 21.
  • the lifting unit 11 and the lifting unit 12 are operated based on the information from the uppermost position sensor 4 so that the basket 40 is raised by the thickness of the wafer.
  • the position of the uppermost wafer in the wafer group W can always be maintained at a position near one end of the first conveyor 21.
  • the liquid flow from the second liquid flow injection nozzle 70 may be intermittently performed at a constant period in accordance with, for example, the traveling speed of the belt of the first conveyor 21, and thereby the first wafer is timed. It can be delivered to the conveyor 21.
  • the lower injection nozzle 51 and the upper injection nozzle 52 which are the liquid flow injection nozzles 50 are arranged so as to inject the liquid flow obliquely toward one corner on one side of the rectangular wafer group W. Are arranged one by one, and one bubble discharge device 60 is arranged in accordance with this, but as another embodiment, as shown in FIG.
  • a lower injection nozzle 51 and an upper injection nozzle 52 is further directed to not only one side of the wafer group W but also to the other corner so that the liquid flow is ejected obliquely with a predetermined depression angle (for example, 20 ° to 180 °). Two of them may be arranged symmetrically, and two bubble discharge devices 60 may be arranged according to this.
  • the present invention is not limited to the above embodiment.
  • the bubble discharge device 60 is configured by combining two or more types of bubble discharge devices having different amounts of gas to be introduced, or includes two or more types of bubble discharge nozzles having different opening areas.
  • the bubble discharge device 60 includes a bubble discharge device main body that generates bubbles of a certain size and a bubble shearing device provided above the bubble discharge device main body. You may make it mix from a large diameter coarse bubble to a small diameter fine bubble by dividing
  • the liquid injection nozzle 50 is comprised by the lower injection nozzle 51 and the upper injection nozzle 52, even if there is only one liquid injection nozzle 50, the effect of this invention is acquired. be able to. Even in this case, the bubbles are favorably pushed between the wafers in order from the small diameter bubbles from the lower layer to the upper layer of the wafer group W, and the same effect as described above can be obtained.
  • the pair of second liquid jet nozzles 70 and 70 are provided, but the effect of the present invention can be obtained even if there is only one second liquid jet nozzle 70. . Further, since the wafer can be easily lifted and peeled only by the liquid jet nozzle 50, the second liquid jet nozzle 70 is not necessarily provided, and even in this case, the effect of the present invention can be obtained.
  • Liquid tank 10 Lifting device 13, 14 Basket support member (loading table support member) 20 Belt conveyor (conveyor) 40 baskets DESCRIPTION OF SYMBOLS 50 Liquid jet nozzle 51 Lower jet nozzle 52 Upper jet nozzle 54 Liquid flow generator 60 Bubble discharge apparatus 62 Bubble generator 70 Second liquid jet nozzle

Abstract

Selon l'invention, à l'intérieur d'une cuve de liquide sont agencés : une buse d'injection de liquide sous forme de courant (50) qui injecte un liquide sous forme de courant dans une direction latérale vers un groupe d'une pluralité de tranches (W), lesquelles tranches sont posées en couche horizontale après découpe d'un lingot de silicium; et un dispositif de décharge de bulles (60) qui décharge et fait monter des bulles entre la buse d'injection de liquide sous forme de courant et le groupe de tranches (W) vers le bas de la buse d'injection de liquide sous forme de courant.
PCT/JP2012/070051 2011-08-12 2012-08-07 Dispositif de séparation de tranches, et procédé de fabrication de tranches mettant en œuvre celui-ci WO2013024741A1 (fr)

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JP2011176830A JP2014207250A (ja) 2011-08-12 2011-08-12 ウェハ分離装置及びこれを用いたウェハの製造方法
JP2011-176830 2011-08-12

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Cited By (1)

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JP2013149702A (ja) * 2012-01-18 2013-08-01 Nippon Steel & Sumikin Fine Technology Co Ltd ウエハ搬送装置

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TWI556299B (zh) * 2014-01-22 2016-11-01 友達晶材股份有限公司 濕式分離及傳輸半導體基材之方法及其裝置
KR101905692B1 (ko) 2016-11-15 2018-10-12 한국에너지기술연구원 마이크로 버블과 와이어 방전 가공을 이용한 실리콘 잉곳 절단장치, 및 실리콘 잉곳 절단방법

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WO2010082567A1 (fr) * 2009-01-13 2010-07-22 株式会社エクサ Appareil de separation de plaquettes, appareil de separation/transfert de plaquettes, procede de separation de plaquettes, procede de separation/transfert de plaquettes et procede de separation/transfert de plaquettes de cellules solaires
WO2010116949A1 (fr) * 2009-04-07 2010-10-14 株式会社住友金属ファインテック Procédé de transfert de plaquettes et appareil de transfert de plaquettes
WO2011010683A1 (fr) * 2009-07-24 2011-01-27 株式会社住友金属ファインテック Procédé de transport de tranche et dispositif de transport de tranche
JP2011086739A (ja) * 2009-10-15 2011-04-28 Fuashiritei:Kk 切断薄板の分離摘出装置
JP2011129652A (ja) * 2009-12-16 2011-06-30 Takatori Corp ウエハの分離収納装置及び分離収納方法
JP2011151167A (ja) * 2010-01-21 2011-08-04 Sumitomo Metal Fine Technology Co Ltd ウエハ搬送装置およびウエハ搬送方法

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JP2013149702A (ja) * 2012-01-18 2013-08-01 Nippon Steel & Sumikin Fine Technology Co Ltd ウエハ搬送装置

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