WO2011010683A1 - Procédé de transport de tranche et dispositif de transport de tranche - Google Patents

Procédé de transport de tranche et dispositif de transport de tranche Download PDF

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Publication number
WO2011010683A1
WO2011010683A1 PCT/JP2010/062303 JP2010062303W WO2011010683A1 WO 2011010683 A1 WO2011010683 A1 WO 2011010683A1 JP 2010062303 W JP2010062303 W JP 2010062303W WO 2011010683 A1 WO2011010683 A1 WO 2011010683A1
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WO
WIPO (PCT)
Prior art keywords
wafer
liquid
wafers
ejecting
face
Prior art date
Application number
PCT/JP2010/062303
Other languages
English (en)
Japanese (ja)
Inventor
寛高 宮井
茂雄 山本
浩成 關目
弘一 富田
正敬 原
Original Assignee
株式会社住友金属ファインテック
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2009173210A external-priority patent/JP2011029390A/ja
Priority claimed from JP2009173508A external-priority patent/JP2011029401A/ja
Priority claimed from JP2009211484A external-priority patent/JP2011061120A/ja
Application filed by 株式会社住友金属ファインテック filed Critical 株式会社住友金属ファインテック
Priority to KR1020117029322A priority Critical patent/KR101370578B1/ko
Priority to CN201080033609.9A priority patent/CN102473666B/zh
Publication of WO2011010683A1 publication Critical patent/WO2011010683A1/fr

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67784—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations using air tracks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67109—Apparatus for thermal treatment mainly by convection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67784—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations using air tracks
    • H01L21/6779—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations using air tracks the workpieces being stored in a carrier, involving loading and unloading

Definitions

  • the present invention relates to a wafer transfer method and a wafer transfer apparatus for transferring, for example, semiconductor wafers used for a solar cell material one by one.
  • FIG. 27 shows a cutting process using a wire saw device in the manufacture of a semiconductor wafer (see, for example, Patent Document 1).
  • the wire saw apparatus 900 shown in the figure includes four guide rollers 903 and wires 904, and is an apparatus for cutting the semiconductor material 902 into a wafer shape.
  • the wire 904 is, for example, a plated piano wire, is wound around four guide rollers 903, and is sent in the direction indicated by the arrow.
  • the semiconductor material 902 is pressed against the wire 904 in a state where the semiconductor material 902 is bonded to a holding member 901 made of glass, for example, with an adhesive.
  • the wire 904 reaches the holding member 901 beyond the semiconductor material 902, the cutting of the semiconductor material 902 is completed. By this cutting, a plurality of wafers are obtained in a state where the respective edges are joined to the holding member 901.
  • the wafer is immersed in a solution that dissolves the cleaning liquid and the adhesive for the purpose of cleaning the cutting powder and peeling from the holding member 901.
  • the wafers are wet by these liquids, the wafers that are adjacent to each other are likely to stick to each other. For this reason, it is not easy to separate the wafers one by one. For example, an operator is forced to manually pick up the semiconductor wafers one by one.
  • the present invention has been conceived under the circumstances described above.
  • a wafer transfer method and wafer transfer capable of separating semiconductor wafers one by one after being cut by a wire saw without human intervention.
  • An object is to provide an apparatus.
  • the gap is formed between the plurality of wafers stacked in the liquid toward the end face of the plurality of wafers in order to create a gap between the wafers.
  • the step of ejecting the liquid includes a first step of ejecting the liquid toward the center of the end surface in the extending direction of the end surface of the wafer.
  • the step of ejecting the liquid includes the first step of ejecting the liquid from the position overlapping the end surface toward the end surface in the extending direction of the end surface of the wafer. A different second step is further included.
  • the direction in which the liquid is ejected in the first step is the same as the direction in which the liquid is ejected in the second step.
  • the liquid ejected in the first and second steps is ejected from the same position in the wafer stacking direction.
  • the step of ejecting the liquid further includes a third step of ejecting the liquid from the outside of the end surface in the direction in which the end surface of the wafer extends toward the end surface.
  • the liquid in the third step, is ejected toward the upper side of the uppermost wafer.
  • the liquid ejected in the first step is ejected from a position lower than a position where the liquid is ejected in the third step.
  • the liquid in the step of ejecting the liquid, is ejected in a flat shape along the wafer stacking direction.
  • the step of ejecting the liquid is continuously performed before and after the step of picking up the wafer.
  • the top wafer among the plurality of wafers is sucked in an in-plane direction while the top wafer is sucked, and the wafer is sequentially moved from the top wafer.
  • the method further includes a step of transporting the wafer.
  • the suction slide means a pair of rollers spaced apart from each other and an endless belt that is wound around the pair of rollers and has a suction section provided with a plurality of holes. And a decompression means capable of decompressing the space surrounded by the endless belt.
  • the wafer suction surface of the suction slide means is inclined so as to be higher as it goes to the front side in the sliding direction of the wafer, and the uppermost wafer is the wafer suction surface. Is directly facing.
  • the liquid in the step of ejecting the liquid, is ejected from the front side of the wafer in the sliding direction with respect to the plurality of wafers.
  • the liquid is directed from the separation nozzle disposed on the front side in the wafer sliding direction with respect to the plurality of wafers toward the end surface of the wafer adsorbed by the adsorption slide means. Erupt.
  • the method further includes a liquid temperature adjusting step of measuring the temperature of the liquid and heating the liquid so that the measured temperature falls within a predetermined temperature range.
  • the predetermined temperature range is 30 to 50 degrees.
  • the wafer transfer apparatus provided by the second aspect of the present invention is configured to eject any of the liquids toward the end surfaces of the plurality of wafers stacked in the liquid, thereby allowing any one of the plurality of wafers to be in contact with each other. And at least one liquid ejecting means for generating a gap in the wafer and wafer receiving means capable of receiving at least the uppermost wafer among the plurality of wafers in the state in which the gap is generated.
  • the at least one liquid ejecting means includes first liquid ejecting means for ejecting the liquid toward the center of the end face in the extending direction of the end face of the wafer.
  • the at least one liquid ejecting means is disposed at a position overlapping the end face in the extending direction of the end face and ejects the liquid toward the end face.
  • Second liquid ejecting means different from the ejecting means is further included.
  • each of the first and second liquid ejecting means ejects the liquid in the same direction.
  • the first liquid ejecting means and the second liquid ejecting means are located in the same direction in the wafer stacking direction.
  • the at least one liquid ejecting means further includes third liquid ejecting means for ejecting the liquid from the outside of the end face in the extending direction of the end face toward the end face.
  • the third liquid ejecting means further ejects the liquid toward the upper side of the uppermost wafer.
  • the first liquid ejecting means is positioned lower than the third liquid ejecting means.
  • any one of the at least one liquid ejecting means ejects the liquid having a flat shape along the wafer stacking direction.
  • the wafer receiving means includes suction slide means for sliding the wafer in the in-plane direction with the uppermost one of the plurality of wafers being sucked.
  • the suction slide means includes a pair of rollers spaced apart from each other and an endless belt wrapped around the pair of rollers, and the endless belt is surrounded by the endless belt.
  • a plurality of holes connected to a space that can be decompressed are provided.
  • the at least one liquid ejecting means is arranged on the front side in the sliding direction of the wafer with respect to the plurality of wafers.
  • the separation nozzle is disposed on the front side in the wafer sliding direction with respect to the plurality of wafers and ejects the liquid toward the end surface of the wafer sucked by the suction slide means. Is further provided.
  • the suction slide means is arranged such that the wafer suction surface becomes higher as the wafer slide surface moves forward in the sliding direction, and the plurality of wafers are positioned relative to the wafer suction surface. So that they face each other.
  • the heating means for heating the liquid the temperature measuring means for measuring the temperature of the liquid, and the temperature measured by the temperature measuring means within a predetermined temperature range.
  • the heating means is a heater immersed in the liquid.
  • FIG. 1 is an overall schematic diagram showing a wafer transfer apparatus according to a first embodiment of the present invention. It is principal part sectional drawing which shows the wafer conveyance apparatus shown in FIG. It is the principal part perspective view which looked at the adsorption conveyor of the wafer conveyance apparatus shown in FIG. 1 from diagonally downward. It is principal part sectional drawing which shows the process of levitating a wafer in the wafer conveyance method which concerns on this invention.
  • FIG. 4 is a perspective view of essential parts similar to FIG. 3, showing a step of floating the wafer in the wafer transfer method according to the present invention.
  • FIG. 4 is a perspective view of essential parts similar to FIG. 3, showing a process for adsorbing a wafer in the wafer transfer method according to the present invention.
  • FIG. 4 is a perspective view of essential parts similar to FIG. 3, showing a step of sliding the wafer in the wafer transfer method according to the present invention.
  • the wafer conveyance method which concerns on this invention it is principal part sectional drawing which shows the process of delivering a wafer to a relay conveyor. It is a principal part top view which shows the wafer conveyance apparatus based on 2nd Embodiment of this invention.
  • FIG. 1 is an overall schematic diagram illustrating an example of a wafer transfer apparatus according to the present invention. It is principal part sectional drawing which shows the wafer conveyance apparatus shown in FIG.
  • FIG. 14 is a perspective view showing only a part of the configuration of the wafer transfer apparatus shown in FIG. 13. It is principal part sectional drawing in alignment with the XVI-XVI line
  • FIG. 19 is a perspective view of essential parts similar to FIG. 18, showing a step of floating a wafer in the wafer transfer method according to the present invention.
  • FIG. 19 is a main part perspective view similar to FIG. 18 showing a process of sucking a wafer in the wafer conveyance method according to the present invention.
  • the wafer conveyance method concerning this invention, it is principal part sectional drawing which shows the process of adsorb
  • sucking a wafer sucking a wafer.
  • sucking a wafer it is principal part sectional drawing which shows the process of sliding a wafer in the wafer conveyance method which concerns on this invention.
  • FIG. 1 shows a wafer transfer apparatus according to the first embodiment of the present invention.
  • the wafer transfer apparatus 10 of this embodiment includes a wafer tank 1, a suction conveyor 2, a nozzle 31, a sponge roller 32, a heater 41, a temperature sensor 42, a heater control unit 43, a relay conveyor 5, a loading conveyor 6, and a stacker 7. ing.
  • the wafer tank 1 is formed in a container shape that opens upward in the vertical direction, and accommodates a plurality of wafers 90 in a state of being immersed in a predetermined liquid 91.
  • the plurality of wafers 90 are placed in the liquid 91 in a state where they are stacked up and down, and are inclined at a predetermined angle with respect to the liquid surface 92 of the liquid 91.
  • the liquid 91 is, for example, water in which an appropriate amount of a surfactant is mixed.
  • the number of these wafers 90 is about 1000, for example.
  • the outer shape is 156 mm square and the thickness is 0.14 to 0.18 mm.
  • the plurality of wafers 90 are stacked so that the upper surface of the wafer 90 is parallel to a wafer suction surface 223 of the suction conveyor 2 described later.
  • the distance between the upper surface of the uppermost wafer 90 and the wafer suction surface 223 of the suction conveyor 2 is, for example, about 30 mm.
  • the plurality of wafers 90 are stacked, for example, on the left side of the wafer tank 1 in the figure, and then sent to the right part of the wafer tank 1 in the figure by the conveyor 11.
  • the plurality of wafers 90 that have been sent are handled by the lifter 12 so as to be movable up and down.
  • the lifter 12 can be raised and lowered with an accuracy corresponding to at least the thickness of one wafer 90 by, for example, a servo motor (not shown).
  • the suction conveyor 2 corresponds to an example of the suction slide means referred to in the present invention, and is provided in a position where the lower part of the wafer tank 1 is immersed in the liquid 91. As shown in FIG. 2, the suction conveyor 2 includes a pair of rollers 21, a pair of endless belts 22, and a vacuum box 23.
  • the pair of rollers 21 are spaced apart from each other in parallel and at least one of them is connected to a drive source such as a servo motor (not shown).
  • a drive source such as a servo motor (not shown).
  • the roller 21 shown in FIG. 2 is rotated counterclockwise in the drawing.
  • the pair of endless belts 22 are, for example, rubber belt-like belts that are annular, and are wound around the pair of rollers 21. As shown in FIG. 3, the pair of endless belts 22 are spaced apart from each other in parallel. As shown in FIGS. 2 and 3, a plurality of holes 222 are formed in the suction section 221 that is a part of the endless belt 22 in the circumferential direction. Each hole 222 penetrates the endless belt 22 in the thickness direction, and allows liquid 91 and air to pass therethrough. In the present embodiment, the circumferential dimension of the suction section 221 is substantially the same as the circumferential dimension of the wafer 90.
  • the vacuum box 23 is disposed in the inner space of the endless belt 22, and is a box made of, for example, SUS having a rectangular cross section.
  • the dimension in the height direction of the vacuum box 23 is substantially the same as the interval between the inner sides of the endless belt 22. For this reason, the endless belt 22 slides along the upper and lower surfaces of the vacuum box 23.
  • Each endless belt 22 is rotated in the direction of the arrow (counterclockwise) in FIG. That is, when the roller 21 is driven to rotate, a portion (wafer suction surface 223) of the endless belt 22 positioned below the vacuum box 23 slides from the left to the right in the drawing.
  • the vacuum box 23 has three compartments 231, 232 and 233. These compartments 231, 232 and 233 are arranged along the direction in which the pair of rollers 21 are separated. A plurality of holes 235 are formed in the vacuum box 23. The plurality of holes 235 are provided in the lower portion of the vacuum box 23. In the present embodiment, the plurality of holes 235 are provided in substantially the entire lower portion of the vacuum box 23.
  • the compartments 231, 232, and 233 are each provided with an air inlet 234.
  • the suction conveyor 2 is inclined slightly with respect to the liquid surface 92 of the liquid 91. More specifically, the suction conveyor 2 is inclined so that the right end is higher than the left end.
  • a pump 26 is connected to the intake port 234 via a hose 24, a valve unit 27, and a dehydration tank 25.
  • the hose 24 is a flexible piping component made of resin, for example.
  • the valve unit 27 can switch which of the compartments 231, 232, and 233 is connected to the pump 26.
  • the dehydration tank 25 is for separating the liquid 91 from the air sucked through the vacuum box 23.
  • the pump 26 is a depressurization source for depressurizing the space in the vacuum box 23 accommodated in the endless belt 22 to such an extent that the wafer 90 can be adsorbed by the adsorption conveyor 2.
  • the nozzle 31 is a component from which the liquid 91 is discharged, and generates a jet of the liquid 91.
  • a discharge pump (not shown) is connected to the nozzle 31 via a pipe (not shown).
  • the nozzle 31 is disposed on the right side of the plurality of stacked wafers 90 in the drawing, and the liquid 91 is directed toward the end surfaces of the plurality of wafers 90. It is provided in a posture to erupt. More specifically, as shown in FIG. 3, the position where the jet flow from the nozzle 31 hits the end surface of the wafer 90 is a position corresponding to several sheets (about 5 to 6 sheets) from the top in the height direction. Yes, approximately in the center in the depth direction.
  • the flow rate of the liquid 91 discharged from the nozzle 31 is, for example, about 9 L / min.
  • the sponge roller 32 is a roller whose surface is made of sponge.
  • the sponge roller 32 is disposed rightward in the drawing with respect to the stacked wafers 90 just below the suction conveyor 2.
  • the sponge roller 32 is connected to a motor (not shown), for example, and is rotatable.
  • the sponge roller 32 is fixed to the suction conveyor 2 by a bracket.
  • the heater 41 is immersed in the liquid 91 and is disposed, for example, near the wall surface of the wafer tank 1.
  • a liquid heating one is used as the heater 41.
  • the heater 41 is connected to the heater control unit 43 via a cable, and its driving is controlled by an electric signal from the heater control unit 43.
  • a stirring blade (not shown) for stirring the liquid 91 in the wafer tank 1 may be provided in the vicinity of the heater 41. In this case, the temperature of the liquid 91 can be quickly raised by the operation of the stirring blade, and the temperature of the entire liquid 91 can be made uniform.
  • the temperature sensor 42 is immersed in the liquid 91 and is disposed, for example, near the wall surface of the wafer tank 1.
  • a thermistor for measuring a liquid temperature can be employed.
  • An output signal from the temperature sensor 42 is transmitted to the heater control unit 43 via a cable.
  • the heater control unit 43 is for supplying driving power to the heater 41, and is provided outside the wafer tank 1.
  • the heater control unit 43 includes a control circuit that controls driving of the heater 41 in accordance with an electrical signal from the temperature sensor 42. Examples of the control by the heater control unit 43 include so-called feedback control that controls the driving of the heater 41 so that the temperature measured by the temperature sensor 42 falls within a predetermined temperature range.
  • the relay conveyor 5 is disposed above the liquid level 92 on the downstream side of the suction conveyor 2.
  • the relay conveyor 5 receives the wafer 90 sucked by the procedure described later from the suction conveyor 2.
  • the loading conveyor 6 is arranged on the downstream side of the relay conveyor 5.
  • the loading conveyor 6 is used to load the wafer 90 received from the relay conveyor 5 into the stacker 7.
  • the stacker 7 is for storing a plurality of wafers 90 one by one, and has a plurality of pockets 71 arranged in parallel to each other in the vertical direction.
  • the wafer 90 is sent from the loading conveyor 6, the wafer 90 is loaded into a pocket 71.
  • the stacker 7 is raised by one step of the pocket 71 by lifting means (not shown). As a result, the next wafer 90 can be loaded.
  • the suction section 221 of the endless belt 22 is positioned immediately above the stacked wafers 90.
  • the adsorption section 221 is at this position, the plurality of holes 235 of the vacuum box 23 provided in the compartments 231 and 232 overlap the adsorption section 221.
  • the valve unit 27 by switching the valve unit 27, the compartments 231 and 232 and the pump 26 are connected, and the compartment 233 and the pump 26 are shut off.
  • the pump 26 is driven, and the internal pressure of the compartments 231 and 232 is set to a negative pressure.
  • the temperature of the liquid 91 is set to about 30 to 50 degrees in advance by driving the heater 41.
  • the liquid 91 is ejected from the nozzle 31 toward the end surface of the wafer 90 at a predetermined discharge pressure (see FIG. 3).
  • the liquid 91 penetrates between the wafers 90 at a portion where the liquid 91 is sprayed by the discharge pressure from the nozzle 31.
  • the plurality of wafers 90 including the uppermost wafer 90 are lifted so that a gap is generated between them.
  • the uppermost wafer 90 is close to the suction section 221 (wafer suction surface 223) of the endless belt 22.
  • guides (not shown) for moving the wafer 90 up and down along a direction perpendicular to the in-plane direction are provided at appropriate positions around the stacked wafers 90.
  • the ejection of the liquid 91 from the nozzle 31 is stopped, and the endless belt 22 is rotated counterclockwise by driving the roller 21 as shown in FIGS.
  • the attracted wafer 90 is slid rightward in the figure.
  • the sponge roller 32 is rotated counterclockwise.
  • the slidable wafer 90 passes through the sponge roller 32 in order from the tip while contacting the wafer 90.
  • a resistance force is applied to the wafer 90 in the direction opposite to the sliding direction. If two wafers 90 that were positioned at the uppermost position and the wafer 90 that was immediately below the uppermost wafer 90 were mistakenly taken, the lower wafer 90 can be removed by this resistance force.
  • the surfactant mixed in the liquid 91 favorably promotes the penetration of the liquid 91 between the two wafers 90.
  • the suction section 221 moves from a position overlapping the compartments 231 and 232 to a position overlapping the compartments 232 and 233.
  • the valve unit 27 by switching the valve unit 27, the compartments 232 and 233 and the pump 26 are connected, and the compartment 231 and the pump 26 are shut off.
  • the internal pressure of the compartments 232 and 233 becomes negative, and the compartment 231 is released from the state where the internal pressure becomes a strong negative pressure.
  • the endless belt 22 is further rotated. Then, the sucked wafer 90 slides further to the right and is delivered to the relay conveyor 5. In the state shown in the figure, the adsorption section 221 overlaps only the compartment 233. At this time, by switching the valve unit 27, the compartment 233 and the pump 26 are connected, and the compartments 231 and 232 and the pump 26 are shut off.
  • the wafer 90 is loaded into the stacker 7 via the relay conveyor 5 and the loading conveyor 6.
  • the suction conveyor 2 is brought into the state shown in FIG. 4 again by rotating the endless belt 22 and switching the valve unit 27.
  • the lifter 12 raises the stacked wafers 90 by a height corresponding to the thickness of the single wafer 90, so that the next wafer 90 can be adsorbed.
  • a plurality of stacked wafers 90 can be transferred one by one and loaded into the stacker 7.
  • the plurality of wafers 90 are in a wet state because, for example, a cutting process using a wire saw is followed by a cleaning process and an adhesive dissolving process.
  • these wet wafers 90 are placed in the atmosphere, they stick to each other and it is difficult to separate them one by one.
  • the liquid 91 in which the plurality of wafers 90 are immersed is heated by the heater 41 and has a temperature higher than room temperature.
  • the viscosity of the liquid 91 is lower than that before the heating, and the penetration of the liquid 91 between the adjacent wafers 90 is promoted.
  • the wafer 90 positioned at the uppermost position among the plurality of wafers 90 can be easily separated from the wafer 90 adjacent immediately below the wafer 90, and the uppermost wafer 90 can be picked up appropriately.
  • the driving of the heater 41 is controlled by the heater control unit 43 in accordance with the temperature of the liquid 91 (measured temperature by the temperature sensor 42). For this reason, the temperature of the liquid 91 can be maintained in a desired temperature range in the work process of sequentially picking up the wafers 90 from the liquid 91.
  • the liquid 91 is ejected onto the end surfaces of the wafers 90, thereby interposing between the plurality of wafers 90 including the uppermost wafer 90.
  • a gap is created. That is, since there is a gap between the uppermost wafer 90 and the wafer 90 immediately below the uppermost wafer 90, the state in which the wafers 90 are stuck together is eliminated, and the wafer 90 positioned at the uppermost position is appropriately sucked by the conveyor. 2 can be adsorbed.
  • the liquid 91 in which the plurality of wafers 90 are immersed is in a state where the viscosity is lowered by being heated, the liquid 91 easily enters between the wafers 90. This and the liquid ejection to the end face of the wafer 90 tend to cause a gap between the wafers 90.
  • the suction conveyor 2 that slides the wafer 90 If the suction conveyor 2 that slides the wafer 90 is used, the sucked wafers 90 can be smoothly retracted from directly above the plurality of stacked wafers 90. At this time, there is little possibility that the plurality of wafers 90 are greatly disturbed.
  • the plurality of wafers 90 are stacked so that the upper surface of the wafer 90 is parallel to the wafer suction surface 223 of the suction conveyor 2. For this reason, the suction force by the suction conveyor 2 acts substantially evenly on the entire surface of the uppermost wafer 90 that has been lifted by the liquid jet from the nozzle 31. Such a configuration is suitable for accurately adsorbing the wafer 90 at the uppermost position. Further, since the wafer suction surface 223 is inclined so that the front side in the sliding direction of the wafer 90 (right side in the figure) is higher, it is suitable for efficiently transporting the wafer 90 in a short movement process.
  • the nozzle 31 is arranged on the front side in the sliding direction of the wafer 90 (right side in the figure) with respect to the plurality of wafers 90, and ejects the liquid 91 toward the end face of the stacked wafers 90. That is, the liquid 91 is ejected from the nozzle 31 in the direction opposite to the sliding direction of the wafer 90. Thereby, it is possible to prevent the wafer 90 immediately below the wafer 90 positioned at the top from being mistakenly carried.
  • compartments 231, 232, and 233 those that do not overlap with the adsorption section 221 are sequentially blocked from the pump 26, so that a wafer 90 other than the wafer 90 that is to be adsorbed by a portion other than the adsorption section 221 is erroneously adsorbed. Can be prevented.
  • FIG. 11 and 12 show a wafer transfer apparatus according to the second embodiment of the present invention.
  • the configuration shown in the drawing is different from the above-described embodiment in that it further includes two nozzles 8 for separation, and the other configurations are the same as those in the above-described embodiment and are not shown. .
  • the nozzles 8 are provided on both sides across the direction in which the uppermost wafer 90 indicated by the arrow in the figure is conveyed.
  • the jet flow from the nozzle 8 is discharged toward the end surface of the wafer 90 that is levitated by the jet flow from the nozzle 31.
  • the liquid 91 can enter between them by the jet flow from the nozzle 8. is there.
  • separation between the uppermost wafer 90 and the second wafer 90 can be promoted. Therefore, when the uppermost wafer 90 is lifted by the jet flow of the nozzle 31 described above, it is possible to prevent the second wafer 90 from being erroneously lifted in a state of sticking to the uppermost wafer 90. it can.
  • FIG. 13 shows a wafer transfer apparatus according to the third embodiment of the present invention.
  • the wafer transfer apparatus 10 of this embodiment includes a wafer tank 1, a suction conveyor 2, a plurality of nozzles 31, a sponge roller 32, a heater 41, a temperature sensor 42, a heater control unit 43, a relay conveyor 5, a loading conveyor 6, a stacker 7, A mounting table 81 and a support member 82 are provided.
  • the wafer tank 1 is formed in a container shape that opens upward in the vertical direction, and accommodates a plurality of wafers 90 in a state of being immersed in a predetermined liquid 91.
  • the plurality of wafers 90 are mounted on a mounting table 81 to be described later and guided by a support member 82.
  • the plurality of wafers 90 are placed in the liquid 91 in a state where they are stacked up and down, and are inclined at a predetermined angle with respect to the liquid surface 92 of the liquid 91.
  • the liquid 91 is, for example, water in which an appropriate amount of a surfactant is mixed.
  • the number of these wafers 90 is about 1000, for example.
  • the outer shape is 156 mm square and the thickness is 0.14 to 0.18 mm.
  • the plurality of wafers 90 are stacked so that the upper surface of the wafer 90 is parallel to a wafer suction surface 223 of the suction conveyor 2 described later.
  • the distance between the upper surface of the uppermost wafer 90 and the wafer suction surface 223 of the suction conveyor 2 is, for example, 15 to 35 mm.
  • FIG. 15 is a perspective view showing only the mounting table 81 and the support member 82 in a partially transparent manner.
  • FIG. 16 is a cross-sectional view of a principal part taken along line XVI-XVI in FIG.
  • FIG. 17 shows a plan view seen from the upper side of FIG.
  • the mounting table 81 is for mounting a plurality of wafers 90.
  • the mounting table 81 is made of, for example, vinyl chloride resin or glass epoxy resin.
  • the mounting table 81 includes a bottom base portion 811, a pair of plate-like members 812 and 813, and an auxiliary support member 814.
  • the bottom portion 811 has a square flat plate shape.
  • the outer shape of the base portion 811 is approximately the same size as the wafer 90 and has a thickness of, for example, 10 mm.
  • Each of the pair of plate-like members 812 and 813 and the auxiliary support member 814 is erected upward from the bottom base portion 811 in FIGS. 15 and 16.
  • the pair of plate-like members 812 and 813 and the auxiliary support member 814 are arranged in parallel to each other and have a long plate shape extending along the x1-x2 direction.
  • the pair of plate-like members 812 and 813 and the auxiliary support member 814 are all for supporting the wafer 90. Even if only a pair of plate-like members 812 and 813 is disposed, a plurality of wafers 90 can be supported. However, by further disposing the auxiliary support member 814, the wafer 90 can be prevented from being bent downward.
  • the dimensions of the pair of plate-like members 812 and 813 and the auxiliary support member 814 are, for example, a long side of 156 mm, a short side of 15 to 35 mm, and a thickness of 2 to 10 mm.
  • two spaces 815 are formed by being sandwiched between the bottom portion 811, the pair of plate-like members 812 and 813, and the auxiliary support member 814.
  • the space 815 penetrates in the x1-x2 direction. Further, the space 815 is exposed toward the side opposite to the base portion 811, that is, the side on which the wafer 90 is placed.
  • the support member 82 is for guiding the plurality of wafers 90 so that the plurality of wafers 90 are not displaced.
  • the support member 82 is connected to the mounting table 81.
  • the support member 82 is made of, for example, glass epoxy resin or stainless steel. As shown in FIGS. 15 to 17, the support member 82 includes a pair of movement restricting portions 821, 822 and movement restricting portions 823, 824. All of the movement restricting portions 821 and 822 are arranged on the direction x1 side with respect to the plurality of wafers 90. By thus disposing the movement restricting portions 821 and 822, the movement of the plurality of wafers 90 in the direction x1 is restricted.
  • the movement restricting portions 821 and 822 have a long plate shape extending along the stacking direction of the wafers 90.
  • the movement restricting portions 821 and 822 are separated from each other, and the separation distance L1 is, for example, 101 to 140 mm. Further, the separation distance is smaller than the width of the wafer 90.
  • the movement restricting portion 823 is disposed on the direction y1 side with respect to the plurality of wafers 90, and the movement restricting portion 824 is disposed on the direction y2 side with respect to the plurality of wafers 90. Since the movement restricting portions 823 and 824 are arranged in this way, the movement of the plurality of wafers 90 in the y1-y2 direction is restricted.
  • the movement restricting portions 823 and 824 have a long plate shape extending along the stacking direction of the wafers 90.
  • the movement restricting portion 823 is integrally formed with the movement restricting portion 821, and the movement restricting portion 824 is integrally formed with the movement restricting portion 824.
  • the plurality of wafers 90 are, for example, stacked on the table 81 on the left side of the wafer tank 1 in FIG. 13 and guided by the support member 82, and are sent to the right part of the wafer tank 1 in the drawing by the conveyor 11.
  • the lifter 12 can be raised and lowered with an accuracy corresponding to at least the thickness of one wafer 90 by, for example, a servo motor (not shown). As the lifter 12 moves up and down, the table 81, the support member 82, and the wafer 90 move up and down.
  • the suction conveyor 2 corresponds to an example of the suction slide means referred to in the present invention, and is provided in a position where the lower part of the wafer tank 1 is immersed in the liquid 91. As shown in FIG. 17, the size L2 of the suction conveyor 2 in the y1-y2 direction is smaller than the separation distance L1 between the movement restricting portions 821 and 822, for example, 100 mm. As shown in FIG. 14, the suction conveyor 2 includes a pair of rollers 21, a pair of endless belts 22, and a vacuum box 23.
  • the pair of rollers 21 are spaced apart from each other in parallel and at least one of them is connected to a drive source such as a servo motor (not shown).
  • a drive source such as a servo motor (not shown).
  • the roller 21 shown in FIG. 14 is rotated counterclockwise in the drawing.
  • the pair of endless belts 22 are, for example, rubber belt-like belts that are annular, and are wound around the pair of rollers 21. As shown in FIG. 18, the pair of endless belts 22 are spaced apart from each other in parallel. As shown in FIG. 14 and FIG. 18, a plurality of holes 222 are formed in the suction section 221 that is a part in the circumferential direction of each endless belt 22. Each hole 222 penetrates the endless belt 22 in the thickness direction, and allows liquid 91 and air to pass therethrough. In the present embodiment, the circumferential dimension of the suction section 221 is substantially the same as the circumferential dimension of the wafer 90.
  • the vacuum box 23 is disposed in the inner space of the endless belt 22 and is a box made of, for example, SUS having a rectangular cross section.
  • the dimension in the height direction of the vacuum box 23 is substantially the same as the interval between the inner sides of the endless belt 22. For this reason, the endless belt 22 slides along the upper and lower surfaces of the vacuum box 23.
  • Each endless belt 22 is rotated in the direction of the arrow in FIG. That is, when the roller 21 is driven to rotate, a portion (wafer suction surface 223) of the endless belt 22 positioned below the vacuum box 23 slides from the left to the right in the drawing.
  • the vacuum box 23 has three compartments 231, 232 and 233. These compartments 231, 232 and 233 are arranged along the direction in which the pair of rollers 21 are separated. A plurality of holes 235 are formed in the vacuum box 23. The plurality of holes 235 are provided in the lower portion of the vacuum box 23. In the present embodiment, the plurality of holes 235 are provided in substantially the entire lower portion of the vacuum box 23.
  • the compartments 231, 232, and 233 are each provided with an air inlet 234.
  • the suction conveyor 2 is inclined slightly with respect to the liquid surface 92 of the liquid 91. More specifically, the suction conveyor 2 is inclined so that the right end is higher than the left end.
  • a pump 26 is connected to the intake port 234 via a hose 24, a valve unit 27, and a dehydration tank 25.
  • the hose 24 is a flexible piping component made of resin, for example.
  • the valve unit 27 can switch which of the compartments 231, 232, and 233 is connected to the pump 26.
  • the dehydration tank 25 is for separating the liquid 91 from the air sucked through the vacuum box 23.
  • the pump 26 is a depressurization source for depressurizing the space in the vacuum box 23 accommodated in the endless belt 22 to such an extent that the wafer 90 can be adsorbed by the adsorption conveyor 2.
  • the plurality of nozzles 31 are components for discharging the liquid 91 and cause a jet of the liquid 91 to be generated.
  • Each of these nozzles 31 is connected to a discharge pump (not shown) via a pipe (not shown).
  • the nozzle 31 is disposed on the right side of the plurality of stacked wafers 90 in the drawing, and the liquid is directed toward the end surfaces 93 of the plurality of wafers 90.
  • 91 is provided in a posture for jetting.
  • Each of the nozzles 31 can eject a liquid 91 having a flat shape in the stacking direction of the wafer 90 (not shown).
  • the flow rate of the liquid 91 discharged from the nozzle 31 is, for example, about 9 L / min.
  • the nozzle 311 is arranged at the center in the y1-y2 direction
  • the nozzle 312 is adjacent to the nozzle 311
  • the nozzle 313 is arranged at the outermost side in the y1-y2 direction.
  • the nozzle 311 ejects the liquid 91 toward the center of the end surface 93 of the wafer Wf in the y1-y2 direction (the direction in which the end surface 93 of the wafer 90 extends).
  • the position where the jet flow from the nozzle 311 hits the end surface 93 of the wafer 90 is a position corresponding to several sheets (about 5 to 6 sheets) from the uppermost one of the plurality of wafers 90.
  • the direction in which the nozzle 311 ejects the liquid 91 coincides with the direction x1.
  • the nozzle 312 is disposed at a position overlapping the end surface 93 of the wafer 90 in the y1-y2 direction. Further, as shown in FIG.
  • the nozzle 312 is disposed in the same direction as the nozzle 311 in the stacking direction of the wafer 90.
  • the nozzle 312 ejects the liquid 91 toward a portion near one end of the end surface 93 of the wafer 90.
  • the position at which the jet flow from the nozzle 312 hits the end surface 93 of the wafer 90 is a position of several sheets (about 5 to 6 sheets) from the uppermost one of the plurality of wafers 90.
  • the direction in which the nozzle 312 ejects the liquid 91 also coincides with the direction x1.
  • the nozzle 313 is disposed outside the end face 93 of the wafer 90 in the y1-y2 direction. As shown in FIG. 16, the nozzle 313 is arranged higher than the nozzles 311 and 312 in the stacking direction of the wafer 90. The nozzle 313 ejects the liquid 91 slightly upward toward one end of the end surface 93 of the wafer 90. Preferably, the nozzle 313 may eject the liquid 91 toward the upper side of the uppermost one of the plurality of wafers 90 and so that the jet flow from the nozzle 313 reaches the adsorption conveyor 2. The ejection direction of the liquid 91 by the nozzle 313 is at an angle of, for example, 15 to 20 degrees with respect to the in-plane direction of the wafer 90.
  • the sponge roller 32 is a roller whose surface is made of sponge.
  • the sponge roller 32 is disposed rightward in the drawing with respect to the stacked wafers 90 just below the suction conveyor 2.
  • the sponge roller 32 is connected to a motor (not shown), for example, and is rotatable.
  • the sponge roller 32 is fixed to the suction conveyor 2 by a bracket.
  • the heater 41 is immersed in the liquid 91 and is disposed, for example, near the wall surface of the wafer tank 1.
  • a liquid heating one is used as the heater 41.
  • the heater 41 is connected to the heater control unit 43 via a cable, and its driving is controlled by an electric signal from the heater control unit 43.
  • the temperature sensor 42 is immersed in the liquid 91 and is disposed, for example, near the wall surface of the wafer tank 1.
  • a thermistor for measuring a liquid temperature can be employed.
  • An output signal from the temperature sensor 42 is transmitted to the heater control unit 43 via a cable.
  • the heater control unit 43 is for supplying driving power to the heater 41, and is provided outside the wafer tank 1.
  • the heater control unit 43 includes a control circuit that controls driving of the heater 41 in accordance with an electrical signal from the temperature sensor 42. Examples of the control by the heater control unit 43 include so-called feedback control that controls the driving of the heater 41 so that the temperature measured by the temperature sensor 42 falls within a predetermined temperature range.
  • the relay conveyor 5 is disposed above the liquid level 92 on the downstream side of the suction conveyor 2.
  • the relay conveyor 5 receives the wafer 90 sucked by the procedure described later from the suction conveyor 2.
  • the loading conveyor 6 is arranged on the downstream side of the relay conveyor 5.
  • the loading conveyor 6 is used to load the wafer 90 received from the relay conveyor 5 into the stacker 7.
  • the stacker 7 is for storing a plurality of wafers 90 one by one, and has a plurality of pockets 71 arranged in parallel to each other in the vertical direction.
  • the wafer 90 is sent from the loading conveyor 6, the wafer 90 is loaded into a pocket 71.
  • the stacker 7 is raised by one step of the pocket 71 by lifting means (not shown). As a result, the next wafer 90 can be loaded.
  • FIG. 19 to FIG. 25 the table 81 and the support member 82 are not shown for convenience of understanding. However, in reality, a plurality of wafers 90 are mounted on the table 81 and guided to the support member 82. The following steps are performed as they are.
  • the suction section 221 of the endless belt 22 is positioned immediately above the stacked wafers 90.
  • the distance between the upper surface of the uppermost wafer 90 and the wafer suction surface 223 of the suction conveyor 2 is, for example, 15 to 35 mm.
  • the suction section 221 is in this position, the one provided in the compartments 231 and 232 of the plurality of holes 235 of the vacuum box 23 overlaps the suction section 221.
  • the valve unit 27 the compartments 231 and 232 and the pump 26 are connected, and the compartment 233 and the pump 26 are shut off.
  • the pump 26 is driven, and the internal pressure of the compartments 231 and 232 is set to a negative pressure.
  • the temperature of the liquid 91 is set to about 30 to 50 degrees in advance by driving the heater 41.
  • the liquid 91 is ejected from the plurality of nozzles 31 toward the end surface 93 of the wafer 90 at a predetermined discharge pressure (see FIGS. 16 to 18). Due to the discharge pressure from the nozzle 31, the liquid 91 enters between the wafers 90 or on the uppermost part of the wafer 90 at a part where the liquid 91 is sprayed. Then, as shown in FIG. 20, the plurality of wafers 90 including the uppermost wafer 90 are lifted so that a gap is formed between them. The uppermost wafer 90 is close to the suction section 221 (wafer suction surface 223) of the endless belt 22.
  • the endless belt 22 is rotated counterclockwise by driving the roller 21.
  • the attracted wafer 90 is slid rightward in the figure.
  • the sponge roller 32 is rotated counterclockwise.
  • the slidable wafer 90 passes through the sponge roller 32 in order from the tip while contacting the wafer 90.
  • a resistance force is applied to the wafer 90 in the direction opposite to the sliding direction. If two wafers 90 that were positioned at the uppermost position and the wafer 90 that was immediately below the uppermost wafer 90 were mistakenly taken, the lower wafer 90 can be removed by this resistance force.
  • the surfactant mixed in the liquid 91 favorably promotes the penetration of the liquid 91 between the two wafers 90.
  • the ejection of the liquid 91 from the nozzle 31 is stopped, but the following series of steps may be continued without stopping the ejection of the liquid 91 from the nozzle 31.
  • the suction section 221 moves from a position overlapping the compartments 231 and 232 to a position overlapping the compartments 232 and 233.
  • the valve unit 27 by switching the valve unit 27, the compartments 232 and 233 and the pump 26 are connected, and the compartment 231 and the pump 26 are shut off.
  • the internal pressure of the compartments 232 and 233 becomes negative, and the compartment 231 is released from the state where the internal pressure becomes a strong negative pressure.
  • the endless belt 22 is further rotated. Then, the sucked wafer 90 slides further to the right and is delivered to the relay conveyor 5. In the state shown in the figure, the adsorption section 221 overlaps only the compartment 233. At this time, by switching the valve unit 27, the compartment 233 and the pump 26 are connected, and the compartments 231 and 232 and the pump 26 are shut off.
  • the wafer 90 is loaded into the stacker 7 via the relay conveyor 5 and the loading conveyor 6.
  • the suction conveyor 2 is brought into the state shown in FIG. 19 again by rotating the endless belt 22 and switching the valve unit 27.
  • the lifter 12 raises the stacked wafers 90 by a height corresponding to the thickness of the single wafer 90, so that the next wafer 90 can be adsorbed.
  • a plurality of stacked wafers 90 can be transferred one by one and loaded into the stacker 7.
  • the number of wafers 90 mounted on the mounting table 81 is about several.
  • the liquid 91 ejected from the nozzle 31 toward the end surface 93 of the wafer 90 also enters the space 815 of the mounting table 81 on which the wafer 90 is placed. Therefore, even if there are several wafers 90, they are lifted up so that a gap is generated between them. Thereafter, almost all the wafers 90 mounted on the mounting table 81 can be loaded into the stacker 7 through the same process as described above.
  • the plurality of wafers 90 are in a wet state because, for example, a cutting process using a wire saw is followed by a cleaning process and an adhesive dissolving process. When these wet wafers 90 are placed in the atmosphere, they stick to each other and it is difficult to separate them one by one.
  • the plurality of wafers 90 stacked in the liquid 91 the plurality of wafers 90 including the uppermost wafer 90 is ejected by ejecting the liquid 91 onto the end surfaces 93 of the wafers 90. A gap is created between the two.
  • the nozzle 31 is arranged as shown in FIGS. 16 and 17 and the direction of the liquid 91 ejected from the nozzle 31 is adjusted, so that a gap is formed between the plurality of wafers 90. It is easy to cause.
  • the present embodiment it is easier to create a gap between more wafers 90 than in the case where the nozzle 311 is not provided, and the wafers 90 can be floated faster. I was able to.
  • the plurality of wafers 90 can be floated more reliably than in the case where the nozzle 312 or the nozzle 313 is not provided.
  • nozzles 311, 312, and 313 it is not always necessary to dispose any of the nozzles 311, 312, and 313 as the nozzle 31.
  • the nozzle 31 only the nozzles 311 and 312 may be arranged, only the nozzles 311 and 313 may be arranged, or only the nozzles 312 and 313 may be arranged.
  • only the nozzle 311, only the nozzle 312, or only the nozzle 313 may be disposed as the nozzle 31.
  • All the nozzles 31 can eject a liquid 91 having a flat shape in the stacking direction of the wafers 90. This also facilitates the formation of a gap between the plurality of wafers 90.
  • the plurality of wafers 90 are guided by the support member 82.
  • the movement of the plurality of wafers 90 in the direction x1 is restricted by the pair of movement restricting portions 821 and 822. Therefore, even if the liquid 91 is ejected from the nozzle 31 toward the direction x1 with respect to the wafer 90, there is little possibility that the wafer 90 is displaced in the direction x1 due to the force of the liquid 91.
  • Such a configuration is suitable for accurately adsorbing the wafer 90 at the uppermost position.
  • the movement of the wafer 90 in the direction y1 and the direction y2 is restricted by the pair of movement restriction parts 823 and 824.
  • the pair of movement restricting portions 821 and 822 is an example of a separate plate-like member, but the pair of movement restricting portions 821 and 822 are two portions of an integral member. It doesn't matter.
  • the size L2 of the suction conveyor 2 in the y1-y2 direction is smaller than the separation distance L1 between the movement restricting portions 821 and 822. Therefore, as illustrated in FIG. 26, the suction conveyor 2 can move in the stacking direction of the plurality of wafers 90 without being obstructed by the movement restricting portions 821 and 822. This is suitable for bringing the suction conveyor 2 closer to the uppermost one of the plurality of wafers 90. For this reason, the uppermost wafer 90 is more easily sucked by the suction conveyor 2.
  • the suction conveyor 2 that slides the wafer 90 If the suction conveyor 2 that slides the wafer 90 is used, the sucked wafers 90 can be smoothly retracted from directly above the plurality of stacked wafers 90. At this time, there is little possibility that the plurality of wafers 90 are greatly disturbed.
  • the plurality of wafers 90 are stacked so that the upper surface of the wafer 90 is parallel to the wafer suction surface 223 of the suction conveyor 2. For this reason, the suction force by the suction conveyor 2 acts substantially evenly on the entire surface of the uppermost wafer 90 that has been lifted by the liquid jet from the nozzle 31. Such a configuration is suitable for accurately adsorbing the wafer 90 at the uppermost position. Further, since the wafer suction surface 223 is inclined so that the front side in the sliding direction of the wafer 90 (right side in the figure) is higher, it is suitable for efficiently transporting the wafer 90 in a short movement process.
  • the nozzle 31 is disposed on the front side of the wafer 90 in the sliding direction (right side in the drawing) with respect to the plurality of wafers 90, and ejects the liquid 91 toward the end surface 93 of the stacked wafers 90. That is, the liquid 91 is ejected from the nozzle 31 in the direction opposite to the sliding direction of the wafer 90. Therefore, although the wafer 90 located at the uppermost position receives a force that moves forward in the sliding direction from the suction conveyor 2, the wafer 90 immediately below the wafer 90 located at the uppermost position is ejected from the nozzle 31. The liquid 91 receives a force in the direction opposite to the sliding direction. Thereby, it is possible to prevent the wafer 90 immediately below the wafer 90 positioned at the top from being mistakenly carried.
  • the liquid 91 in which the plurality of wafers 90 are immersed is heated by the heater 41 and is set to a temperature higher than room temperature. Since the liquid 91 has a property that its viscosity decreases when heated, it is promoted that the liquid 91 enters between adjacent wafers 90. As a result, the wafer 90 positioned at the uppermost position among the plurality of wafers 90 can be easily separated from the wafer 90 adjacent immediately below the wafer 90, and the uppermost wafer 90 can be picked up appropriately.
  • compartments 231, 232, and 233 those that do not overlap with the adsorption section 221 are sequentially blocked from the pump 26, so that the wafer 90 other than the wafer Wf to be adsorbed by a part other than the adsorption section 221 is erroneously adsorbed. Can be prevented.
  • a space 815 is formed in the mounting table 81.
  • the wafer 90 positioned at the uppermost position is Can maintain a floating state. Therefore, it is not necessary to lift the wafer 90 again after returning to the state where the wafer 90 is not lifted. As a result, the efficiency of the wafer transfer process can be improved.
  • the wafer transfer method and the wafer transfer apparatus according to the present invention are not limited to the above-described embodiments.
  • the specific configurations of the wafer transfer method and the wafer transfer apparatus according to the present invention can be varied in design in various ways.

Abstract

L'invention concerne un procédé de transport de tranche consistant à : évacuer le liquide vers les surfaces d'extrémité des tranches (90), de façon à produire un espace entre des tranches (90) adjacentes quelconques parmi des tranches (90) empilées les unes sur les autres dans un liquide ; et prélever au moins la tranche la plus haute (90) parmi les tranches (90) avec l'espace produit. La configuration permet aux tranches (90) d'être séparées une à une sans utiliser de main d'œuvre après la découpe, par exemple, avec des fils hélicoïdaux.
PCT/JP2010/062303 2009-07-24 2010-07-22 Procédé de transport de tranche et dispositif de transport de tranche WO2011010683A1 (fr)

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KR1020117029322A KR101370578B1 (ko) 2009-07-24 2010-07-22 웨이퍼 반송방법 및 웨이퍼 반송장치
CN201080033609.9A CN102473666B (zh) 2009-07-24 2010-07-22 晶片输送方法和晶片输送装置

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JP2009173210A JP2011029390A (ja) 2009-07-24 2009-07-24 ウエハ搬送方法およびウエハ搬送装置
JP2009173508A JP2011029401A (ja) 2009-07-24 2009-07-24 ウエハ搬送方法およびウエハ搬送装置
JP2009-173508 2009-07-24
JP2009-173210 2009-07-24
JP2009211484A JP2011061120A (ja) 2009-09-14 2009-09-14 ウエハ搬送方法およびウエハ搬送装置
JP2009-211484 2009-09-14

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WO2013024741A1 (fr) * 2011-08-12 2013-02-21 株式会社 安永 Dispositif de séparation de tranches, et procédé de fabrication de tranches mettant en œuvre celui-ci
EP2874183A1 (fr) * 2013-11-15 2015-05-20 mechatronic Systemtechnik GmbH Dispositif destiné au moins à vidanger un récipient de transport

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WO2008068943A1 (fr) * 2006-12-06 2008-06-12 Mimasu Semiconductor Industry Co., Ltd. Procédé de séparation de tranche submergée, et appareil de séparation de tranche submergée

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DE102007061410A1 (de) * 2007-12-11 2009-06-18 Gebr. Schmid Gmbh & Co. Verfahren und Vorrichtung zum Vereinzeln von Wafern von einem Waferstapel

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JP2003292160A (ja) * 2002-04-01 2003-10-15 Hitachi Kiden Kogyo Ltd ガラス基板の取り出し装置
WO2008068943A1 (fr) * 2006-12-06 2008-06-12 Mimasu Semiconductor Industry Co., Ltd. Procédé de séparation de tranche submergée, et appareil de séparation de tranche submergée

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WO2013024741A1 (fr) * 2011-08-12 2013-02-21 株式会社 安永 Dispositif de séparation de tranches, et procédé de fabrication de tranches mettant en œuvre celui-ci
EP2874183A1 (fr) * 2013-11-15 2015-05-20 mechatronic Systemtechnik GmbH Dispositif destiné au moins à vidanger un récipient de transport
WO2015071475A1 (fr) * 2013-11-15 2015-05-21 Mechatronic Systemtechnik Gmbh Procédé permettant au moins de vider un contenant de transport
US9978624B2 (en) 2013-11-15 2018-05-22 Mechatronic Systemtechnik Gmbh Device for at least emptying a transport container

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CN102473666A (zh) 2012-05-23
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KR20120025510A (ko) 2012-03-15

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