WO2013023597A1 - 基板的激光修复装置以及激光修复方法 - Google Patents

基板的激光修复装置以及激光修复方法 Download PDF

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Publication number
WO2013023597A1
WO2013023597A1 PCT/CN2012/080173 CN2012080173W WO2013023597A1 WO 2013023597 A1 WO2013023597 A1 WO 2013023597A1 CN 2012080173 W CN2012080173 W CN 2012080173W WO 2013023597 A1 WO2013023597 A1 WO 2013023597A1
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Prior art keywords
laser
light
substrate
pattern
electrode
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PCT/CN2012/080173
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English (en)
French (fr)
Inventor
赵海生
白国晓
杨魏松
Original Assignee
北京京东方光电科技有限公司
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Application filed by 北京京东方光电科技有限公司 filed Critical 北京京东方光电科技有限公司
Priority to US13/699,567 priority Critical patent/US9291839B2/en
Publication of WO2013023597A1 publication Critical patent/WO2013023597A1/zh

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    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting

Definitions

  • Embodiments of the present invention relate to a laser repairing apparatus for a substrate and a laser repairing method. Background technique
  • the substrate in the liquid crystal display includes an electrode layer, which is specifically divided into a gate layer, a source layer, a drain layer, and the like. After the electrode layer is fabricated, there is often excess residue.
  • the excess residue herein refers to the portion of the excess conductive layer that is used to form the normal electrode pattern after the electrode layer is formed. These excess residues destroy the normal electrode pattern, as shown in Figure 1.
  • the laser is used to cut off excess residue, and the portion is cut into a normal electrode pattern.
  • the existing repair method is to cut a little bit with a small laser beam. If you want to repair the electrode in Figure 1, you need to cut a lot of lines to cut out the normal electrode pattern, and precisely adjust the position of the laser beam every time you cut it, which is equivalent to the operator drawing the electrode pattern with a little laser.
  • the inventors have found in the process of implementing the present invention that the prior art has at least the following problems:
  • the existing repair method requires the operator to cut many times, and the position of the laser beam is precisely adjusted for each cut, resulting in the speed of repairing the electrode. Too slow technical problem. Summary of the invention
  • One embodiment of the present invention discloses a laser repairing apparatus for a substrate, comprising: a laser emitter; and a light-transmitting sheet with a light-shielding pattern, wherein the laser light emitted by the laser emitter is used to cut excess residue of the electrode on the substrate
  • the light-transmitting sheet is located between the laser emitter and the substrate, and the light-shielding pattern on the light-transmissive sheet has the same shape as that of the upper electrode of the substrate, and the size is a predetermined ratio.
  • Another embodiment of the present invention discloses a laser repairing method for a substrate, comprising: selecting a light-transmitting sheet with a light-shielding pattern according to a pattern of electrodes on a substrate to be repaired, wherein the light-shielding pattern and the pattern of the electrodes The shape is the same and the size is a predetermined ratio; the light transmissive sheet is placed on the laser Between the emitter and the substrate; adjusting a position of the light transmissive sheet or the substrate, causing the light shielding pattern to be projected onto the substrate and the electrode under the laser light emitted by the laser emitter The pattern is coincident; and the laser emitter emits laser light to the excess residue on the electrode.
  • Figure 1 is a schematic view of excess residue on the electrode
  • FIG. 2 is a schematic structural view of a laser repairing apparatus for a substrate according to an embodiment of the present invention
  • FIG. 3 is a schematic view showing a light shielding pattern of a light-transmitting sheet in a laser repairing apparatus for a substrate according to an embodiment of the present invention
  • FIG. 4 is a schematic diagram of dividing a target area into a plurality of sub-areas in a laser repairing method for a substrate according to an embodiment of the present invention. detailed description
  • an embodiment of the present invention provides a laser repairing apparatus for a substrate, including a laser emitter 1 and a light-transmitting sheet 2 with a light-shielding pattern.
  • the laser light emitted by the laser emitter 1 is used to cut excess residue of the electrodes on the substrate 3.
  • the light-transmitting sheet 2 is located between the laser emitter 1 and the substrate 3, and the light-shielding pattern on the light-transmitting sheet 2 (shown in Fig. 3) is the same as the pattern shape of the electrodes on the substrate 3, and is sized to a predetermined ratio.
  • the light-transmitting sheet 2 may be located on the optical path of the laser light emitted from the laser reflector 1 and reaching the substrate.
  • the light shielding pattern on the light transmissive sheet 2 has the same shape as the electrode pattern on the substrate 3 and has a predetermined ratio example.
  • the light transmissive sheet 2 is placed between the laser emitter 1 and the substrate 3 and the light transmissive sheet 2 is adjusted to be in a proper position, so that the pattern of the light shielding pattern projected onto the substrate 3 under the laser light coincides with the pattern of the electrodes. For example, when the laser light emitted by the laser emitter 1 has an appropriate divergence angle, the ratio of the distance from the laser emitter 1 to the light-transmitting sheet 2 to the distance from the laser emitter 1 to the substrate 3 can be made equal to that on the light-transmitting sheet 2.
  • the ratio of the light-shielding pattern to the size of the electrode pattern is made, the pattern in which the light-shielding pattern is projected onto the substrate 3 under the laser light is superposed on the pattern of the electrode.
  • the light-transmitting sheet can be attached to the substrate, and the ratio of the size of the light-shielding pattern to the size of the electrode pattern is 1:1.
  • the light-transmissive sheet does not need to cover all of the electrode patterns, and the projection of the light-shielding pattern under the laser light may only coincide with the partial portion of the electrode pattern, and the excess remains in this portion. That is to say, the entire area of the light-shielding pattern projected onto the substrate under the laser completely covers the excess residue.
  • the laser light emitted from the laser emitter 1 is irradiated onto the substrate only through the light-transmitting sheet having the light-shielding pattern without being irradiated to a region other than the light-transmitting sheet to prevent damage of the laser to the normal electrode pattern.
  • the laser light When the laser light is emitted, the laser light is blocked by the light-shielding pattern. Since the pattern projected onto the substrate by the light-shielding pattern coincides with the pattern of the electrode, the portion of the laser that is blocked corresponds to the electrode pattern on the substrate 3, so that the normal image does not break normally. Electrode pattern. The other part of the laser passes through the light-transmitting sheet 2, which corresponds to the blank portion of the electrode pattern on the substrate 3, and the excess residue on the electrode is also present in this portion, so that the laser can cut off excess residue.
  • the light-transmitting sheet 2 can protect the normal electrode pattern from being destroyed by the laser, and emit the laser to other portions where excess residue is present, thereby realizing the position of cutting excess residue without requiring multiple adjustments of the laser, which significantly improves the position. Fix the speed of the electrode. Therefore, the technical problem of the prior art repairing the electrode is too slow.
  • the embodiment of the present invention uses the light shielding pattern to ensure that the cut pattern is the same as the normal pattern of the electrode, so the accuracy of the repair is also improved. And success rate.
  • a light transmissive sheet converter 4 is further included for converting the light transmissive sheet 2 with different light shielding patterns.
  • a laser repair device is used to repair a variety of different electrode patterns, such as electrode patterns for the gate, source, and drain, so a light transmissive sheet 2 with various shading patterns is required.
  • the translucent sheet converter 4 can convert the corresponding light transmissive sheet 2 according to different electrode patterns.
  • the light transmissive sheet converter 4 can also be used to adjust the position of the light transmissive sheet 2 such that the pattern of the light shielding pattern projected onto the substrate under the laser light coincides with the pattern of the electrodes.
  • the substrate 3 can be fixed first, and the light-transmitting sheet 2 can be adjusted according to the position of the substrate 3. In this case, adjusting the transparent sheet 2 and the substrate 3 The process of location is more convenient and more accurate.
  • the lens 5 disposed at the transmitting end of the laser emitter 1 is further included. Since the electrode pattern on the substrate is relatively fine, it is magnified several times or several times by the lens 5 to find the specific position of the excess residue, and the light-transmitting sheet 2 is adjusted.
  • the lens 5 is disposed at the transmitting end of the laser emitter 1, which can minimize the difference between the observation point and the emission point, and ensure the accuracy of the repair. The laser will pass through the lens 5 when it is emitted, but the lens 5 does not affect the laser.
  • This embodiment is basically the same as Embodiment 1, and the difference is that the light-transmitting sheet is disposed on the lens.
  • the lens is disposed at the emitting end of the laser emitter 1, and the light transmitting sheet is attached to the lens of the lens.
  • the laser passes through the lens, it passes through the light-transmissive sheet to achieve the repair of the electrode pattern. This eliminates the need for a light transmissive sheet converter, making the laser repair unit smaller and more space efficient.
  • lenses with different shading patterns can be replaced to match the shading pattern to the electrode pattern.
  • Embodiments of the present invention also provide a laser repairing method for a substrate, including:
  • the light-transmitting sheet with the light-shielding pattern is selected, wherein the light-shielding pattern has the same shape as the pattern of the electrode to be repaired, and the size is a predetermined ratio.
  • the light transmissive sheet is placed between the laser emitter and the substrate.
  • the laser emitter emits laser light to the excess residue on the electrode.
  • the above S1 to S3 can be completed by the light-transmissive sheet converter, because the light-shielding pattern on the selected light-transmissive sheet has the same shape as the electrode pattern on the substrate, and the light-transmitting sheet is placed on the laser emitter and the substrate by using the transparent sheet conversion. between.
  • the position of the light-transmissive sheet may be adjusted by the light-transmissive sheet converter such that the pattern of the light-shielding pattern projected onto the substrate under the laser light coincides with the pattern of the electrode.
  • the ratio of the distance from the laser emitter to the light-transmitting sheet to the distance from the laser emitter to the substrate can be equal to the size of the light-shielding pattern and the electrode pattern on the light-transmitting sheet.
  • the ratio of the light-shielding pattern under the laser is coincident with the pattern of the electrodes.
  • the entire area of the light-shielding pattern on the light-transmissive sheet projected onto the substrate under the laser light can completely cover the excess residue to be removed.
  • the light-transmissive sheet can protect the normal electrode pattern from being destroyed by the laser, and emit the laser to other portions where excess residue is present, thereby realizing the cutting of excess residue without requiring multiple adjustments of the laser position, and significantly improving the repair.
  • the speed of the electrode Therefore, the technical problem of the prior art repairing the electrode is too slow.
  • the embodiment of the present invention uses the light shielding pattern to ensure that the cut pattern is the same as the normal pattern of the electrode, so the accuracy of the repair is also improved. And success rate.
  • the laser repairing device of the substrate provided by the embodiment of the present invention has the same technical features as the above-described embodiment of the present invention, the same technical effect can be produced and the same technical problem can be solved.
  • the embodiment of the present invention is basically the same as Embodiment 3, and differs in step S4, that is, the laser emitter emits laser light to the excess residue on the electrode.
  • the step S4 in this embodiment specifically includes: S401: setting a plurality of laser beams having different cross-sectional areas.
  • the area of the selected laser beam i.e., the area of the spot on which the laser beam is irradiated on the substrate
  • the excess residue is only slightly larger than the excess residue
  • the laser emitter emits the selected laser beam to the excess residue on the electrode.
  • the light-transmissive sheet protects the normal electrode pattern from being destroyed by the laser, and causes the laser to be emitted to other portions where excess remains, thereby realizing the position where the excess residue is cut without requiring multiple adjustments of the laser.
  • the repair can be completed by only one laser emission, which significantly improves the speed of repairing the electrode, thus solving the technical problem of the prior art repairing the electrode too slowly.
  • the embodiment of the present invention uses the light shielding pattern to ensure that the cut pattern is the same as the normal pattern of the electrode, so the accuracy of the repair is also improved. And success rate.
  • the embodiment of the present invention is basically the same as Embodiment 3, and differs in step S4, that is, the laser emitter emits laser light to the excess residue on the electrode.
  • the step S4 specifically includes:
  • S411 Set a fixed area laser beam.
  • the area of the laser beam should be as small as possible so as to control the total amount of light emitted by the laser by the number of times the laser is emitted, and the shape of the laser beam is, for example, square. That is, the area of the spot on which the laser beam is irradiated onto the substrate is smaller than the area remaining excessively.
  • S412 A target area is arranged around the remaining four on the electrode, so that the entire excess remains in the target area.
  • the operator can frame the target area on the operation interface by using the mouse, and the shape of the target area i or is, for example, a square.
  • S413 Dividing the target area into a plurality of sub-areas, each sub-area having an area equal to or smaller than a spot area of the set laser beam irradiated onto the substrate.
  • the target area and the laser beam are both square, the target area is divided into a plurality of sub-areas in units of the area of one laser beam.
  • the side length of the target area is not necessarily an integral multiple of the side length of the laser beam, so the area of the sub-area located at the corner will be smaller than the area of the laser beam.
  • the laser emitter sequentially emits a laser beam to each sub-area.
  • the light-transmissive sheet protects the normal electrode pattern from being destroyed by the laser, and causes the laser to be emitted to other portions where excess remains, thereby realizing the position where the excess residue is cut without requiring multiple adjustments of the laser. It is only necessary to continuously launch the same laser beam to complete the repair, which significantly improves the speed of repairing the electrode, thus solving the technical problem that the prior art repairing the electrode is too slow.
  • the embodiment of the present invention uses the light shielding pattern to ensure that the cut pattern is the same as the normal pattern of the electrode, so the accuracy of the repair is also improved. And success rate.
  • the lens 5 disposed at the front end of the laser emitter 1 increases the beam diameter of the passing laser beam, affecting the repair accuracy.
  • the lens 5 can be disposed on one side of the light exit of the laser emitter 1, which not only reduces the diameter of the laser beam, but also detects the residual position and detects the residual effect through the lens.

Abstract

本发明实施例公开了一种基板的激光修复装置以及激光修复方法。该激光修复装置包括激光发射器；以及带有遮光图案的透光片，其中所述激光发射器发射的激光用于切割基板上电极的多余残留，所述透光片位于所述激光发射器与所述基板之间，以及所述透光片上的遮光图案与所述基板上电极的图案形状相同、且大小成预定比例。

Description

基板的激光修复装置以及激光修复方法 技术领域
本发明的实施例涉及一种基板的激光修复装置以及激光修复方法。 背景技术
随着电子技术的不断发展， 液晶显示器已成为常见的显示设备。 液晶显 示器中的基板包括电极层， 具体分为栅极层、 源极层和漏极层等。 在电极层 制作完成后， 经常会有多余残留。 这里的多余残留是指形成电极层后， 用于 形成正常电极图案之外的多余导电层部分。 这些多余残留破坏了正常的电极 图案， 如图 1所示。
针对这一情况， 通常釆用激光切割的方法进行修复， 也就是利用激光切 割掉多余残留， 并且将该部分切割成正常的电极图案。 现有的修复方法是， 利用很小的激光束一点一点进行切割。 如果要修复图 1中的电极， 就需要切 割很多线条才能切割出正常的电极图案， 而且每次切割都要精确调整激光束 的位置， 相当于操作人员用激光一点一点画出电极图案。
本发明人在实现本发明的过程中发现， 现有技术至少存在以下问题： 现 有的修复方法需要操作人员切割很多次， 而且每次切割都要精确调整激光束 的位置， 导致修复电极的速度太慢的技术问题。 发明内容
本发明的一个实施例公开了一种基板的激光修复装置， 包括： 激光发射 器； 以及带有遮光图案的透光片， 其中所述激光发射器发射的激光用于切割 基板上电极的多余残留， 所述透光片位于所述激光发射器与所述基板之间， 以及所述透光片上的遮光图案与所述基板上电极的图案形状相同、 且大小成 预定比例。
本发明的另一个实施例公开了一种基板的激光修复方法， 包括： 根据待 修复的基板上电极的图案， 选取带有遮光图案的透光片， 其中所述遮光图案 与所述电极的图案形状相同、 且大小成预定比例； 将所述透光片放置于激光 发射器与所述基板之间； 调节所述透光片或所述基板的位置， 使所述遮光图 案在所述激光发射器发射的激光下投影到所述基板上的图案与所述电极的图 案重合； 以及所述激光发射器向所述电极上的多余残留发射激光。 附图说明
为了更清楚地说明本发明实施例的技术方案， 下面将对实施例的附图作 简单地介绍，显而易见地，下面描述中的附图仅仅涉及本发明的一些实施例， 而非对本发明的限制。
图 1为电极上的多余残留的示意图；
图 2 为本发明的一个实施例所提供的基板的激光修复装置的结构示意 图；
图 3为本发明的一个实施例所提供的基板的激光修复装置中透光片的遮 光图案的示意图； 以及
图 4为本发明的一个实施例所提供的基板的激光修复方法中将目标区域 分成若干子区域的示意图。 具体实施方式
为使本发明实施例的目的、 技术方案和优点更加清楚， 下面将结合本发 明实施例的附图，对本发明实施例的技术方案进行清楚、 完整地描述。显然， 所描述的实施例是本发明的一部分实施例， 而不是全部的实施例。 基于所描 述的本发明的实施例， 本领域普通技术人员在无需创造性劳动的前提下所获 得的所有其他实施例， 都属于本发明保护的范围。
实施例 1 :
如图 2所示， 本发明实施例提供了一种基板的激光修复装置， 包括激光 发射器 1和带有遮光图案的透光片 2。 激光发射器 1发射的激光用于切割基 板 3上电极的多余残留。 透光片 2位于激光发射器 1与基板 3之间， 且透光 片 2上的遮光图案（如图 3所示）与基板 3上电极的图案形状相同、 且大小 成预定比例。 例如， 透光片 2可以位于从激光反射器 1发出并到达所述基板 的激光的光路上。
透光片 2上的遮光图案与基板 3上的电极图案形状相同且大小成预定比 例。 将透光片 2放置于激光发射器 1与基板 3之间并调节所述透光片 2使之 位于合适位置， 可以使遮光图案在激光下投影到基板 3上的图案与电极的图 案重合。 例如， 在激光发射器 1发射的激光具有适当的发散角度时， 可以使 在激光发射器 1到透光片 2的距离与激光发射器 1到基板 3的距离之比等于 透光片 2上的遮光图案与电极图案的大小之比时， 使遮光图案在激光下投影 到基板 3上的图案与电极的图案重合。 当然， 极限情况下可以将透光片贴附 于基板上， 则遮光图案的尺寸与电极图案的尺寸之间的比例关系为 1 :1。 此 夕卜， 透光片并不需要覆盖全部的电极图案， 也可以使遮光图案在激光下的投 影只与电极图案的局部重合， 并保证多余残留在这一部分之内。 也就是说， 遮光图案在激光下投影到基板上的整个区域范围完全覆盖多余残留。 另外， 激光发射器 1发射的激光仅通过带有遮光图案的透光片照射到基板上， 而不 会照射到透光片之外的区域， 以防止激光对正常电极图案的损坏。
发射激光时， 激光会被遮光图案挡住一部分， 由于遮光图案投影到基板 上的图案与电极的图案重合， 因此， 激光被挡住的部分恰好与基板 3上的电 极图案相对应， 所以不会破坏正常的电极图案。 另一部分激光则顺利通过透 光片 2, 这一部分与基板 3上电极图案的空白部分相对应， 并且电极上的多 余残留也存在于这一部分， 所以激光就能够切割掉多余残留。
综上所述， 透光片 2能够保护正常的电极图案不被激光破坏， 并且使激 光发射到存在多余残留的其他部分， 实现了切割多余残留而不需要多次调整 激光的位置， 显著提高了修复电极的速度。 因此， 解决了现有技术修复电极 的速度太慢的技术问题。 除此之外， 相比于现有技术由操作人员一点一点切 割的方法， 本发明实施例利用遮光图案来保证切割出的图案与电极正常的图 案一样， 所以还提高了修复的精确度和成功率。
本发明实施例中， 还包括透光片转换器 4, 用于转换带有不同遮光图案 的透光片 2。 一套激光修复装置会用来修复多种不同的电极图案， 例如栅极、 源极、 漏极的电极图案， 所以就要配备带有各种遮光图案的透光片 2。 透光 片转换器 4可根据不同的电极图案， 来转换相应的透光片 2。
透光片转换器 4还可以用于调整透光片 2的位置， 以使遮光图案在激光 下投影到基板上的图案与电极的图案重合。 这样就可以先将基板 3固定， 再 根据基板 3的位置调整透光片 2。 在这种情况下， 调整透光片 2与基板 3相 对位置的过程更为方便， 也更为精确。
本发明实施例中， 还包括设置于激光发射器 1的发射端的镜头 5。 因为 基板上的电极图案比较精细， 所以利用镜头 5将其放大数倍或数十倍， 以便 于找出多余残留的具体位置，并调整透光片 2。将镜头 5设置于激光发射器 1 的发射端， 能够尽量减少观察点与发射点的位差， 保证修复的精度。 激光发 射时会穿过镜头 5 , 但是镜头 5并不会对激光造成影响。
实施例 2:
本实施例与实施例 1基本相同， 其不同点在于： 透光片设置于镜头上。 作为一个优选方案， 镜头设置在激光发射器 1的发射端， 透光片贴在镜头的 镜片上。 当激光穿过镜头时， 也就穿过了透光片， 实现电极图案的修复。 这 样可以省去透光片转换器， 使激光修复装置的体积更小， 更加节省空间。 对 于不同的电极图案， 则可以更换带有不同遮光图案的镜头， 使遮光图案与电 极图案相匹配。
实施例 3:
本发明的实施例还提供了一种基板的激光修复方法， 包括：
S1 : 根据待修复的基板上电极的图案， 选取带有遮光图案的透光片， 其 中遮光图案与待修复的电极的图案形状相同、 且大小成预定比例。
S2: 将透光片放置于激光发射器与基板之间。
S3: 调节透光片或基板的位置， 使遮光图案在激光发射器发射的激光下 投影到基板上的图案与电极的图案重合。
S4: 激光发射器向电极上的多余残留发射激光。
上述 S1至 S3均可由透光片转换器来完成， 因为所选的透光片上的遮光 图案与基板上的电极图案形状相同， 并且利用透光片转换将透光片放置于激 光发射器与基板之间。 另外， 可以利用透光片转换器调节透光片的位置， 以 使遮光图案在激光下投影到基板上的图案与电极的图案重合。 例如， 在激光 器所发射的激光具有适当的发散角的情况下， 可以使激光发射器到透光片的 距离与激光发射器到基板的距离之比等于透光片上的遮光图案与电极图案的 大小之比， 并使遮光图案在激光下的投影与电极的图案重合。 发射激光时， 激光会被遮光图案挡住一部分， 由于遮光图案在激光下投影到基板上的图案 与基板上的电极图案相对应， 所以不会破坏正常的电极图案。 另一部分激光 则顺利通过透光片， 这一部分与基板上电极的空白部分相对应， 并且电极上 的多余残留也存在于这一部分， 所以激光就能够切割掉多余残留。
另外， 在本实施例中， 例如， 透光片上遮光图案在所述激光下投影到基 板上的整个区域范围可以完全覆盖要去除的多余残留。
综上所述， 透光片能够保护正常的电极图案不被激光破坏， 并且使激光 发射到存在多余残留的其他部分， 实现了切割多余残留而不需要多次调整激 光的位置， 显著提高了修复电极的速度。 因此， 解决了现有技术修复电极的 速度太慢的技术问题。 除此之外， 相比于现有技术由操作人员一点一点切割 的方法， 本发明实施例利用遮光图案来保证切割出的图案与电极正常的图案 一样， 所以还提高了修复的精确度和成功率。
由于本发明实施例与上述本发明实施例所提供的基板的激光修复装置具 有相同的技术特征， 所以也能产生相同的技术效果， 解决相同的技术问题。
实施例 4:
本发明实施例与实施例 3基本相同， 其不同点在于步骤 S4 , 即， 激光发 射器向电极上的多余残留发射激光。 本实施例中的该步骤 S4具体包括： S401 : 设置多种具有不同截面面积的激光束。
S402: 根据电极上多余残留的面积， 选取一种激光束。
具体地， 所选激光束的面积（即， 激光束照射在基板上的光斑面积）只 需稍大于多余残留， 使激光束将残留图案完全覆盖即可。
S403: 激光发射器向电极上的多余残留发射所选的激光束。
透光片能够保护正常的电极图案不被激光破坏， 并且使激光发射到存在 多余残留的其他部分， 实现了切割多余残留而不需要多次调整激光的位置。 只需发射一次激光就能完成修复， 显著提高了修复电极的速度， 故而解决了 现有技术修复电极的速度太慢的技术问题。 除此之外， 相比于现有技术由操 作人员一点一点切割的方法， 本发明实施例利用遮光图案来保证切割出的图 案与电极正常的图案一样， 所以还提高了修复的精确度和成功率。
实施例 5:
本发明实施例与实施例 3基本相同， 其不同点在于步骤 S4 , 即， 激光发 射器向电极上的多余残留发射激光。 本实施例中该步骤 S4具体包括：
S411 : 设置一种固定面积的激光束。 具体地， 该激光束面积应当尽量小， 以便于利用发射该激光的次数来控 制激光发射的光的总量， 并且该激光束的形状例如为方形。 也就是说， 使该 激光束照射到基板上的光斑面积小于多余残留的面积。
S412: 在电极上多余残留的四周围出一个目标区域， 使多余残留的整体 全部位于目标区域之内。
具体地， 操作人员可利用鼠标在操作界面上框出目标区域， 并且目标区 i或的形 例如为方形。
S413: 将目标区域分为若干子区域， 每个子区域的面积等于或小于所设 定的激光束照射到所述基板上的光斑面积。
具体地， 如图 4所示， 因为目标区域和激光束都是方形， 因此以一个激 光束的面积为单位， 将目标区域分为若干个子区域。 但是目标区域的边长不 一定是激光束边长的整数倍， 所以位于边角处的子区域的面积会小于激光束 的面积。
S414: 激光发射器依次向每个子区域发射激光束。
透光片能够保护正常的电极图案不被激光破坏， 并且使激光发射到存在 多余残留的其他部分， 实现了切割多余残留而不需要多次调整激光的位置。 只需连续发射同一种激光束就能完成修复， 显著提高了修复电极的速度， 故 而解决了现有技术修复电极的速度太慢的技术问题。 除此之外， 相比于现有 技术由操作人员一点一点切割的方法， 本发明实施例利用遮光图案来保证切 割出的图案与电极正常的图案一样， 所以还提高了修复的精确度和成功率。
在具体应用中， 由于对于激光光束的直径要求尽可能的小， 而设置于激 光发射器 1前端的镜头 5会使得经过的激光束的光束直径增加， 影响修复精 度。 该镜头 5能设在激光发射器 1出光口的一侧， 不但可以减小激光光束的 直径， 也可以通过该镜头检测残余的位置和检测修复残余的效果。
以上所述， 仅为本发明的具体实施方式， 但本发明的保护范围并不局限 于此， 任何熟悉本技术领域的技术人员在本发明揭露的技术范围内， 可轻易 想到的变化或替换， 都应涵盖在本发明的保护范围之内。 因此， 本发明的保 护范围应以权利要求的保护范围为准。

Claims

权利要求书
1、 一种基板的激光修复装置， 包括：
激光发射器； 以及
带有遮光图案的透光片，
其中所述激光发射器发射的激光用于切割基板上电极的多余残留， 所述透光片位于所述激光发射器与所述基板之间， 以及
所述透光片上的遮光图案与所述基板上电极的图案形状相同、 且大小成 预定比例。
2、根据权利要求 1所述的激光修复装置，其中所述透光片位于从所述激 光发射器发出并到达所述基板的激光的光路上。
3、根据权利要求 1所述的激光修复装置，还包括透光片转换器， 用于转 换带有不同遮光图案的透光片。
4、根据权利要求 3所述的激光修复装置，其中所述透光片转换器能够调 节所述透光片在所述激光器与所述基板之间的位置， 以使所述透光片上的遮 光图案在所述激光发射器发射的激光下投影到所述基板上的图案与所述电极 的图案重合。
5、根据权利要求 1所述的激光修复装置，还包括设置于所述激光发射器 的发射端或激光发射器一侧的镜头。
6、根据权利要求 5所述的激光修复装置，其中所述镜头设置于所述激光 发射器的发射端， 且所述透光片设置于所述镜头上。
7、 一种基板的激光修复方法， 包括：
根据待修复的基板上电极的图案， 选取带有遮光图案的透光片， 其中所 述遮光图案与所述电极的图案形状相同、 且大小成预定比例；
将所述透光片放置于激光发射器与所述基板之间；
调节所述透光片或所述基板的位置， 使所述遮光图案在所述激光发射器 发射的激光下投影到所述基板上的图案与所述电极的图案重合； 以及
所述激光发射器向所述电极上的多余残留发射激光。
8、 根据权利要求 7所述的激光修复方法， 其中
所述遮光图案在所述激光下投影到所述基板上的整个区域范围完全覆盖 所述多余残留。
9、根据权利要求 7所述的激光修复方法，其中所述激光发射器向所述电 极上的多余残留发射激光的步骤包括：
设置多种具有不同截面面积的激光束；
根据所述电极上多余残留的面积， 选取一种激光束； 以及
所述激光发射器向所述电极上的多余残留发射所选的激光束。
10、 根据权利要求 9所述的激光修复方法， 其中选取所述一种激光束以 使所述激光束照射在所述基板上的光斑面积完全覆盖所述多余残留。
11、 根据权利要求 7所述的激光修复方法， 其中所述激光发射器向所述 电极上的多余残留发射激光的步骤包括：
设置激光束， 使其照射到所述基板上的光斑面积小于所述多余残留的面 积；
在所述电极上多余残留的四周围出一个目标区域， 使所述多余残留的整 体全部位于所述目标区域之内；
将所述目标区域分为若干子区域， 每个所述子区域的面积等于或小于所 述激光束照射到所述基板的光斑面积； 以及
所述激光发射器依次向每个所述子区域发射所述激光束。
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