WO2013018426A1 - Procédé de fabrication d'un module laser et dispositif de préhension de fibre optique utilisé dans ce dernier - Google Patents

Procédé de fabrication d'un module laser et dispositif de préhension de fibre optique utilisé dans ce dernier Download PDF

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Publication number
WO2013018426A1
WO2013018426A1 PCT/JP2012/063727 JP2012063727W WO2013018426A1 WO 2013018426 A1 WO2013018426 A1 WO 2013018426A1 JP 2012063727 W JP2012063727 W JP 2012063727W WO 2013018426 A1 WO2013018426 A1 WO 2013018426A1
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WIPO (PCT)
Prior art keywords
optical fiber
light
hand
laser module
semiconductor laser
Prior art date
Application number
PCT/JP2012/063727
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English (en)
Japanese (ja)
Inventor
小川　弘晋
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株式会社フジクラ
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Publication of WO2013018426A1 publication Critical patent/WO2013018426A1/fr

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    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/36—Mechanical coupling means
    • G02B6/3616—Holders, macro size fixtures for mechanically holding or positioning fibres, e.g. on an optical bench
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/023—Mount members, e.g. sub-mount members
    • H01S5/02325—Mechanically integrated components on mount members or optical micro-benches
    • H01S5/02326—Arrangements for relative positioning of laser diodes and optical components, e.g. grooves in the mount to fix optical fibres or lenses
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4202—Packages, e.g. shape, construction, internal or external details for coupling an active element with fibres without intermediate optical elements, e.g. fibres with plane ends, fibres with shaped ends, bundles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0225—Out-coupling of light
    • H01S5/02251—Out-coupling of light using optical fibres

Definitions

  • the present invention relates to a method for manufacturing a laser module capable of manufacturing a highly reliable laser module even when a semiconductor laser element that outputs light of high intensity is mounted, and an optical fiber hand used therefor About.
  • Laser modules in which laser light output from a semiconductor laser element is output via an optical fiber are known.
  • This laser module generally includes a laser mount and a fiber mount disposed on a base, a semiconductor laser element fixed on the laser mount, and an optical fiber fixed on the fiber mount. The relative positions of the light output portion of the semiconductor laser element and the end portion of the optical fiber are accurately matched. Then, light output from the semiconductor laser element enters the core from the end of the optical fiber.
  • the optical fiber may be fixed to the bonding pad formed on the upper surface of the fiber mount by solder.
  • the glass material forming the optical fiber has poor solder wettability, and it is difficult to directly fix the solder to the glass forming the optical fiber. For this reason, when fixing an optical fiber with solder, the position corresponding to the bonding pad of an optical fiber is coat
  • the light output from the semiconductor laser element tends to be coupled and propagated not only to the core of the optical fiber but also to the cladding.
  • the light propagating through the clad reaches the position where the metallization layer is provided, and at least a part of the light is absorbed by the metallization layer and converted into heat.
  • a laser module that outputs high intensity light from a semiconductor laser element.
  • a semiconductor laser element that oscillates light in a multimode is generally used.
  • the intensity of the output light is increased. If it is lowered, the peak position of the light may be different from the peak position when the light intensity is high. For this reason, when manufacturing a laser module, there is a demand for aligning an optical fiber by outputting high intensity light from a semiconductor laser element.
  • the optical fiber is aligned, the light output from the semiconductor laser element propagates through the cladding and is converted into heat by the metallization layer as described above.
  • the amount of heat generated in the metallized layer is large, which may cause the metallized layer to be oxidized or the optical fiber to be damaged. Therefore, if high intensity light is incident on the optical fiber from the semiconductor laser element and the optical fiber is aligned, the reliability of the semiconductor laser module may be impaired. On the other hand, when the intensity of light output from the semiconductor laser element is lowered, as described above, the peak position of the light output from the semiconductor laser element is different from that when high intensity light is output. There is a possibility that the center position is shifted, and the reliability of the semiconductor laser module may be impaired.
  • the present invention provides a laser module manufacturing method capable of manufacturing a highly reliable laser module and an optical fiber used therefor even when a semiconductor laser element that outputs high intensity light is mounted.
  • the purpose is to provide a hand.
  • a method for manufacturing a laser module according to the present invention includes an optical fiber in which a clad is exposed at a predetermined distance from one end and a metallized layer is provided on a part of the exposed outer peripheral surface of the clad. And a preparation step of preparing a laser module body having a semiconductor laser element and a fiber mount on which the optical fiber is mounted, and the optical fiber so that the metallized layer is disposed at a predetermined position on the fiber mount.
  • the placement step of gripping the one end side of the optical fiber from the metallized layer by the optical fiber hand The light output from the semiconductor laser element is input from the one end of the optical fiber, and the front An alignment step of aligning the optical fiber so that the light is most input to the core of the optical fiber, and the refractive index of the contact member in contact with the optical fiber in the optical fiber hand is:
  • the light wavelength is equal to or greater than the refractive index of the cladding.
  • the laser module manufactured by this laser module manufacturing method fixes the optical fiber on the fiber mount by soldering the metallized layer of the optical fiber. And since the contact member in contact with the optical fiber is equal to or higher than the refractive index of the clad at the wavelength of the light output from the semiconductor laser element, the light propagating through the clad is in the portion held by the optical fiber hand, Easy to propagate to optical fiber hand. Therefore, even when light output from the semiconductor laser element is input to the cladding from one end of the optical fiber and propagates, at least a part of this light is transmitted from the cladding to the optical fiber before reaching the metallization layer. Propagate to the hand.
  • the gripping step may be performed before the placement step, or the gripping step may be performed during the placement step.
  • the semiconductor laser element may oscillate the light in a multimode.
  • the contact member is preferably elastically deformed.
  • the portion in contact with the optical fiber is elastically deformed, the contact member can be properly adhered to the optical fiber. For this reason, the light which propagates a clad can be appropriately propagated by the hand for optical fibers, and it can suppress more that a metallizing layer heat-generates.
  • the contact member is made of silicon resin.
  • Silicone resin has a high Young's modulus and a strong force to return to its original shape even when deformed. Therefore, even when a large number of laser modules are manufactured, deterioration of the optical fiber hand can be reduced.
  • silicon resin can be obtained at low cost and the refractive index can be easily adjusted, so that it depends on the wavelength of light output from the semiconductor laser element and the refractive index of the cladding at this light wavelength.
  • an optical fiber hand having a contact member having an appropriate refractive index can be easily prepared, and an increase in manufacturing cost can be suppressed.
  • the contact member is preferably provided on a support member made of glass.
  • a support member made of glass By providing the elastically deforming contact member on the support member made of glass, it is possible to prevent the contact member from being inappropriately deformed after gripping the optical fiber, and to adjust the position of the optical fiber more appropriately. It can be carried out.
  • the light propagating from the optical fiber to the contact member can further propagate to the support member, and unnecessary light can be further away from the optical fiber. For this reason, even when light propagating from the optical fiber to the optical fiber hand is converted into heat, the heat generation position can be further away from the optical fiber, further preventing damage to the optical fiber due to heat. can do.
  • the refractive index of the support member is equal to or higher than the refractive index of the contact member at the wavelength of the light.
  • an optical fiber hand used for manufacturing a laser module in which light output from a semiconductor laser element is output via an optical fiber, and the refractive index of a contact member that contacts the optical fiber.
  • the refractive index of a contact member that contacts the optical fiber.
  • it is equal to or higher than the refractive index of the clad of the optical fiber.
  • unnecessary light propagating through the cladding can propagate to the contact member. Therefore, at least a part of unnecessary light propagating through the cladding can be removed. For this reason, when manufacturing a laser module, even if the optical fiber is aligned so that light is input from the semiconductor laser element to the optical fiber and the intensity of the light input to the core is maximized, By holding the optical fiber with the optical fiber hand, unnecessary heat generation due to light propagating through the cladding can be suppressed.
  • the contact member may be elastically deformed, and in this case, the contact member may be made of silicon resin. Further, the contact member may be provided on a support member made of glass. In this case, the refractive index of the support member is equal to or higher than the refractive index of the contact member at the wavelength of the light. It is good to be done.
  • a highly reliable laser module can be provided while optical fiber alignment can be performed even when a semiconductor laser element that outputs high-intensity light is mounted.
  • a method of manufacturing a laser module that can be manufactured and an optical fiber hand used therefor are provided.
  • FIG. 3 is a diagram showing a part of a laser module manufactured according to an embodiment of the present invention.
  • the laser module 1 is disposed on a base 20, a laser mount 40 disposed on the base 20, a semiconductor laser element 45 disposed on the laser mount 40, and the base 20.
  • the main structure includes a laser module main body MB having a fiber mount 30 and an optical fiber 10 soldered onto the fiber mount 30 with a solder 50.
  • the laser module 1 outputs laser light output from the semiconductor laser element 45 to the outside through an optical fiber 10.
  • the laser module 1 is housed in a housing (not shown) made of metal or the like except for a part of the optical fiber 10.
  • the base 20 is comprised from the plate-shaped member made from a metal or a ceramic, for example.
  • the metal is not particularly limited, and examples thereof include copper and copper tungsten.
  • the ceramic as is not particularly limited, and examples thereof include aluminum nitride (AlN) or aluminum oxide (Al 2 O 3) or the like.
  • the base 20 may be comprised from a part of housing
  • the laser mount 40 disposed on the base 20 has a substantially rectangular parallelepiped shape, and is fixed on the base 20 with a solder material (not shown).
  • the material constituting the laser mount 40 is not particularly limited, and examples thereof include ceramics such as AlN and Al 2 O 3. Among them, AlN is preferable from the viewpoint of excellent thermal conductivity. Further, when the base 20 and the laser mount 40 are made of the same material, the base 20 and the laser mount 40 may be formed by integral molding.
  • the semiconductor laser element 45 is fixed on the laser mount 40 with a solder material (not shown).
  • a plurality of semiconductor layers are stacked, and a resonator structure is formed by these semiconductor layers. Then, a laser beam having a wavelength of, for example, 900 nm band is output from the surface of the semiconductor laser element 45 on the optical fiber 10 side.
  • the semiconductor laser element 45 of the present embodiment is configured to oscillate light in a multimode in the horizontal direction so that the intensity of the output light is increased.
  • Such a semiconductor laser element 45 generally has a small number of oscillation modes when the current flowing through the element is small, the light radiation pattern is unstable, the light peak position is not constant, and the current flowing through the element is As it increases, the number of modes increases and the light emission pattern stabilizes.
  • the fiber mount 30 disposed on the base 20 has a substantially rectangular parallelepiped shape, and is fixed on the base 20 with a solder material (not shown).
  • the material constituting the fiber mount 30 is not particularly limited, and examples thereof include the same material as the laser mount 40. Further, when the base 20 and the fiber mount 30 are made of the same material, the base 20 and the fiber mount 30 may be formed by integral molding.
  • a bonding pad 33 having a substantially rectangular outer shape is provided on the upper surface of the fiber mount 30, .
  • the bonding pad 33 is configured so that solder can be fixed.
  • a titanium (Ti) layer is laminated on the fiber mount 30 side, and a platinum (Pt) layer is laminated on the Ti layer.
  • a gold (Au) layer is laminated on the Pt layer, and the surface of this Au layer is the surface opposite to the fiber mount 30 side of the bonding pad 33.
  • the solder 50 is fixed on the bonding pad 33.
  • Examples of the solder 50 include gold-tin eutectic solder, and examples of the ratio of Au to tin (Sn) include Au 80% -Sn 20% and Au 10% -Sn 90%.
  • the melting point of the solder 50 is about 280 degrees.
  • FIG. 2 is a view showing the structure of a cross section perpendicular to the longitudinal direction of the optical fiber 10.
  • the optical fiber 10 includes a core 11 and a clad 12 that surrounds the outer peripheral surface of the core 11.
  • the refractive index of the cladding 12 is lower than the refractive index of the core 11, and the core 11 is made of quartz (glass) to which a dopant for increasing the refractive index such as germanium is added, for example. It consists of pure quartz with no dopant added.
  • the cladding 12 is covered with a coating layer made of an ultraviolet curable resin or the like outside the casing (not shown).
  • the end of the optical fiber 10 is tapered to have a function as a lens.
  • the tapered end of the optical fiber 10 is directed to the output surface of the semiconductor laser element 45, and the laser beam output from the semiconductor laser element 45 is arranged to be input to the core 11. .
  • the optical fiber 10 fixed to the solder 50 is covered with a metallized layer 15, and the metallized layer 15 is fixed to the solder 50.
  • the metallized layer 15 is configured to be easily wetted and fixed to the solder 50.
  • the structure of the metallized layer 15 is not particularly limited, but is composed of a laminate of an Ni layer and an Au layer, the Ni layer covers the outer peripheral surface of the cladding 12, and the Au layer covers the outer peripheral surface of the Ni layer. Yes.
  • the thicknesses of the Ni layer and the Au layer are not particularly limited. For example, the Ni layer is 2 ⁇ m to 3 ⁇ m, and the Au layer is 0.1 ⁇ m to 0.2 ⁇ m.
  • the surface of the metallized layer 15 is preferably Au in order to prevent oxidation and improve wettability.
  • the Ni layer on the optical fiber side is formed as a base layer in order to improve the adhesion of Au to quartz.
  • laser light is output from the semiconductor laser element 45 by supplying electric power from the outside (not shown).
  • the wavelength of the output laser light is, for example, the 900 nm band.
  • the output laser light is input to the core 11 of the optical fiber 10, propagates through the core 11, and is output to the outside of the laser module 1.
  • the laser light when laser light is input to the optical fiber 10, the laser light is input to the core 11 as described above, but refraction at the end face of the optical fiber 10 and deviation of the optical axis in the optical fiber 10 and the semiconductor laser element 45.
  • a part of the laser light may be input to the clad 12 as leakage light.
  • the leaked light mainly propagates through the clad 12 and reaches a portion where the optical fiber 10 is covered with the metallized layer 15, and at least a part of the leaked light is absorbed by the metalized layer 15 and is heated. Converted. The heat generated at this time is released to the outside through the solder 50, the fiber mount 30, and the base 20.
  • FIG. 3 is a flowchart showing the steps of the method for manufacturing the laser module 1 of FIG.
  • the manufacturing method of the laser module 1 includes the preparation step P1 for preparing the optical fiber 10 and the laser module main body MB, the arrangement step P2 for arranging the optical fiber 10 at a predetermined position, and the optical fiber 10.
  • a gripping process P3 for gripping the optical fiber 10 with the optical fiber hand an alignment process P4 for aligning the optical fiber 10 in a state where the optical fiber 10 is gripped with the optical fiber hand, and the optical fiber 10 on the fiber mount 30.
  • a soldering process P5 for soldering.
  • preparing the laser module main body MB first, at least the base 20, the fiber mount 30, the laser mount 40, and the semiconductor laser element 45 are prepared.
  • a bonding pad 33 is provided on the upper surface of the fiber mount 30.
  • the bonding pad 33 may be provided by a film forming process such as vapor deposition, sputtering, or plating.
  • the lower surface of the fiber mount 30 is soldered to the base 20 with solder (not shown), and the fiber mount 30 is fixed to the base 20.
  • the laser mount 40 is soldered and fixed to the base 20 with solder (not shown), and the semiconductor laser element 45 is fixed on the laser mount 40 with solder material (not shown).
  • the base 20 to which the fiber mount 30 and the laser mount 40 are fixed is fixed to the inner surface of the casing.
  • the fiber mount 30 and the laser mount 40 are fixed in the housing as the base 20 by the same method as the above-described fixing method.
  • the metallized layer 15 having the same length as the region to be soldered to the bonding pad 33 is provided.
  • the length of the soldered region is considered to be the same as the width along the longitudinal direction of the optical fiber 10 in the bonding pad 33 when the optical fiber 10 is soldered to the bonding pad 33 as shown in FIG. It ’s fine. Therefore, in this case, the metallized layer 15 may be provided so that the length of the metallized layer 15 is equivalent to the width of the bonding pad 33 along the longitudinal direction of the optical fiber 10.
  • the metallization layer 15 is preferably provided by a plating method, for example, when it is a laminate of a Ni layer and an Au layer. This is because according to the plating method, the metallized layer 15 can be provided with a more uniform thickness on the side surface of the optical fiber 10 having a circular cross section perpendicular to the length direction.
  • the clad 12 is exposed for a predetermined distance from one end, and the optical fiber 10 in which the metallized layer 15 is provided on a part of the outer peripheral surface of the exposed clad 12, and the semiconductor laser element 45 and the optical fiber 10 are provided.
  • a laser module body MB having a fiber mount 30 to be mounted is prepared.
  • FIG. 4 is a diagram showing a state after the placement step P2.
  • the optical fiber 10 is disposed so that the metallized layer 15 is positioned on the bonding pad 33 on the fiber mount 30.
  • a part of the optical fiber 10 is placed from the outside of the housing so that a portion where the cladding 12 of the optical fiber 10 is exposed is inside the housing. Introduce into the body.
  • the optical fiber 10 is arranged so that the metallized layer 15 is arranged at a predetermined position on the fiber mount 30.
  • FIG. 5 is a diagram showing a part of this optical fiber hand.
  • the optical fiber hand 70 is provided on each surface of the pair of support members 71R and 71L and the support members 71R and 71L, and a pair of contact members 72R that come into contact with the optical fiber 10. 72L.
  • the contact members 72R and 72L are elastically deformable, and have a refractive index equal to or higher than the refractive index of the cladding 12 at the wavelength of light output from the semiconductor laser element 45.
  • Examples of the material of the contact members 72R and 72L include silicon resin.
  • the cladding 12 is made of pure quartz to which no dopant is added as described above, the refractive index of the cladding 12 is 1.45.
  • the silicon resin contains, for example, a halogen element. The refractive index may be adjusted to 1.45 or more.
  • the contact members 72R and 72L are made of silicon resin, so that the wavelength of light output from the semiconductor laser element 45, According to the refractive index of the cladding 12 at the wavelength of this light, it is easy to easily prepare an optical fiber hand having a contact member having an appropriate refractive index. Further, notches 73R and 73L having a substantially semicircular shape in cross section are formed on the facing surfaces of the contact members 72R and 72L facing each other so that the optical fiber 10 can be accommodated. .
  • the outer diameter of the optical fiber 10 is preferably slightly smaller than the outer diameter of the cladding 12 of the optical fiber 10.
  • the support members 71R and 71L that support the contact members 72R and 72L are made of a material that does not deform so much. Further, the side on which the contact member 72L of the one support member 71L is provided has two surfaces that are substantially perpendicular to each other, and a rectangular notch 75 is formed by these surfaces. Accordingly, the contact member 72L has thin portions Pa and Pb formed on the surfaces of the support member 71L that are substantially perpendicular to each other. In addition, the surface of the other support member 71R on the side where the contact member 72R is provided has a substantially flat shape. Accordingly, the contact member 72R has a portion Pc formed to be thin.
  • the contact members 72R and 72L are formed thin, the contact members 72R and 72L cannot be deformed so much. For this reason, the contact members 72R and 72L are formed in three thin portions, so that the optical fiber 10 can be prevented from becoming unstable when the optical fiber 10 is gripped as described later.
  • Each of the support members 71R and 71L is preferably formed of a light transmissive material. Further, the support members 71R and 71L have a refractive index of the contact member at the wavelength of light output from the semiconductor laser element 45. It is preferable that it is more than the refractive index of 72R and 72L. Glass (quartz) can be mentioned as a material constituting the light transmissive support members 71R and 71L, and a material constituting the support members 71R and 71L having a refractive index higher than that of the contact members 72R and 72L is germanium. Glass (quartz) to which is added.
  • a photothermal conversion member made of stainless steel or the like may be provided on the opposite side of the support members 71R and 71L from the side where the contact members 72R and 72L are provided. preferable.
  • This photothermal conversion member is omitted in the figure.
  • ceramic and stainless steel can be mentioned as a material which comprises support member 71R, 71L.
  • the support members 71R and 71L are moved by a mechanism (not shown) in the direction indicated by the broken line arrow in FIG. 5 to hold the optical fiber 10 as shown in FIG.
  • the semiconductor laser element 45 side one end side
  • the optical fiber 10 is sandwiched and held by the optical fiber hand 70 so that the clad 12 contacts the contact members 72R and 72L.
  • the contact members 72R and 72L are elastically deformed, the optical fiber 10 is stably held because the support members 71R and 71L are not deformed so much while the optical fiber 10 is prevented from being damaged.
  • the silicon resin has a high Young's modulus and a strong force to return to its original shape even when deformed, a large number of laser modules 1 are manufactured when the contact members 72R and 72L are made of silicon resin as described above. Therefore, even when the gripping is performed many times, the deterioration of the optical fiber hand 70 can be reduced.
  • this process may be performed before arrangement
  • the laser module main body MB is housed in a housing (not shown) as described above, a portion where the cladding 12 of the optical fiber 10 is exposed is introduced into the housing, and then the optical fiber hand 70 is used.
  • the optical fiber 10 may be held so that the metallized layer 15 is positioned on the bonding pad 33 after that. In this way, as shown in FIG. 6, the metallized layer 15 is positioned on the bonding pad 33 and the optical fiber 10 is held by the optical fiber hand 70.
  • the position of the optical fiber 10 is roughly adjusted so that one end portion of the optical fiber 10 and the emitting portion of the semiconductor laser element 45 face each other.
  • This adjustment is performed by moving and adjusting the position of the optical fiber hand 70 as indicated by the solid line arrow in FIG.
  • this adjustment may be performed during the above-described arrangement process. Further, there is a case where it is moved in a direction other than that indicated by the solid line arrow.
  • the position of the optical fiber 10 is adjusted so that one end of the optical fiber 10 and the emitting part of the semiconductor laser element 45 are opposed to each other, so that light is input to the optical fiber 10.
  • the optical fiber 10 is not accurately aligned and light does not enter the core 11 in the most appropriate state.
  • the optical fiber 10 is aligned so that light with high intensity is output from the optical fiber 10. By doing so, the light output from the semiconductor laser element 45 can be most appropriately input to the core 11 of the optical fiber 10.
  • the light output from the semiconductor laser element 45 is also input to the cladding 12 of the optical fiber 10.
  • the light input to the clad 12 propagates through the clad 12 and reaches a portion held by the optical fiber hand 70.
  • the contact members 72R and 72L of the optical fiber hand 70 have a refractive index equal to or higher than that of the cladding 12, the light propagating through the cladding 12 and reaching the portion gripped by the optical fiber hand 70 is obtained. At least a portion propagates from the cladding 12 to the contact members 72R and 72L.
  • the light propagating through the cladding 12 leaves the optical fiber 10.
  • the light passing through the portion of the clad 12 held by the optical fiber hand 70 reaches the portion where the metallized layer 15 is provided, and part of the light is absorbed by the metallized layer 15 and becomes heat. However, since at least part of the light has already propagated to the optical fiber hand 70, the amount of heat generated in the metallized layer 15 is small.
  • the metallized layer 15 and the like are prevented from being damaged by heat, and the optical fiber 10 is aligned.
  • FIG. 8 is a view of the soldering process P ⁇ b> 5 as viewed along the longitudinal direction of the optical fiber 10. As shown in FIG. 8, the solder is heated by irradiation with laser light L. Although the laser beam L may be directly irradiated on the solder 50, the fiber mount 30 is irradiated as shown in FIG.
  • the bonding pad 33 is heated by heat conduction from the heated portion of the fiber mount 30, and this heat is further conducted to the solder 50, so that the solder 50 melts.
  • the molten solder 50 wets and spreads over the entire exposed surface of the bonding pad 33 and adheres to the bonding pad 33 and also wets and adheres to the metallized layer 15 so as to wind up the metallized layer 15 of the optical fiber 10. Then, after the irradiation of the laser beam L is completed, the melted solder 50 is solidified, and the optical fiber 10 is fixed to the fiber mount 30 to obtain the laser module 1 shown in FIG.
  • this step is preferably performed in an inert gas atmosphere from the viewpoint of preventing the solder 50 from being oxidized.
  • the contact members 72R and 72L that are in contact with the cladding 12 of the optical fiber 10 have the cladding 12 at the wavelength of the light output from the semiconductor laser element 45. Therefore, light easily propagates from the clad 12 to the optical fiber hand 70. Since the semiconductor laser element 45 side is held by the optical fiber hand 70 from the metallized layer 15 of the optical fiber 10, the light output from the semiconductor laser element 45 is input to the cladding 12 from one end of the optical fiber 10. Even when propagating, at least part of the light propagates from the clad 12 to the optical fiber hand 70 before reaching the metallized layer 15.
  • the portion where the optical fiber hand 70 comes into contact with the optical fiber 10 transmits light. Occurs at a distance from 10. Therefore, the optical fiber 10 can be prevented from being damaged by the heat generated by the optical fiber hand 70.
  • the optical fiber hand 70 is appropriately deformed as long as the refractive index of the contact member in contact with the optical fiber 10 is equal to or higher than the refractive index of the cladding 12 at the wavelength of the light output from the semiconductor laser element 45. Can do.
  • FIG. 9 is a diagram showing a structure of a first modification of the optical fiber hand 70.
  • cutouts 75R and 75L having a semicircular cross section are formed in the support members 71R and 71L, respectively.
  • the contact members 72R and 72L are formed with a constant thickness on the opposing surfaces of the support members 71R and 71L that form the cutouts 75R and 75L, and are substantially semicircular as in the above embodiment.
  • Notches 73R and 73L are formed. According to such an optical fiber hand 70a, since the contact members 72R and 72L have a constant thickness, when gripping the optical fiber 10, the force applied to the optical fiber 10 from the contact members 72R and 72L is equalized. Can be.
  • FIG. 10 is a diagram showing a structure of a second modification of the optical fiber hand 70.
  • the support members 71R and 71L have the same configuration as in the above embodiment, and the support members 71R and 71L correspond to the contact members 72R and 72L in the above embodiment, respectively. It is the form which serves as. Therefore, in this modification, the contact member is not elastically deformed.
  • the contact member is not elastically deformed in the optical fiber hand 70b having such a configuration, when the optical fiber 10 is gripped, the contact area between the optical fiber 10 and the contact member is small, but in the portion where the optical fiber 10 and the contact member are in contact with each other, The light propagating through the clad 12 propagates to the optical fiber hand 70b.
  • the contact member is not elastically deformed, so that the optical fiber 10 can be stably held.
  • FIG. 11 is a view showing a structure of a third modification of the optical fiber hand 70.
  • the support members 71R and 71L have substantially the same configuration as that of the first modification, but the diameters of the semicircular cutouts 75R and 75L are The outer diameter of the clad 12 of the optical fiber 10 is the same.
  • each support member 71R and 71L serves as each contact member 72R and 72L of the said 1st modification. Therefore, in this modified example, the contact member is not elastically deformed as in the second modified example.
  • the optical fiber hand 70c having such a configuration, since the contact member is not elastically deformed, the optical fiber 10 can be stably held, and the contact member has a wide area with the clad 12 of the optical fiber 10. Since it can contact, the light which propagates the clad 12 efficiently can propagate to the optical fiber hand 70c.
  • the contact member of the optical fiber hand is the portions Pa, Pb, and Pc, and the thickness is zero, and the support members 71R and 71L are exposed at these portions Pa, Pb, and Pc. Also good. By comprising in this way, the optical fiber 10 can be hold
  • a method for manufacturing a laser module capable of manufacturing a highly reliable laser module even when a semiconductor laser element that outputs light with high intensity is mounted In addition, an optical fiber hand used therefor is provided, and can be applied to manufacture of a pumping light source and the like used in a fiber laser device.

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electromagnetism (AREA)
  • Semiconductor Lasers (AREA)
  • Optical Couplings Of Light Guides (AREA)

Abstract

La présente invention se rapporte à un procédé de fabrication d'un module laser de sorte à pouvoir fabriquer un module laser très fiable, et à un dispositif de préhension de fibre optique qui est utilisé dans le procédé de fabrication. Le procédé de fabrication d'un module laser (1) comprend : une étape de préparation (P1) consistant à préparer une fibre optique (10) au cours de laquelle une couche métallisée (15) est agencée à une partie d'une gaine (12), et un corps principal de module laser (MB) qui comprend un élément laser à semi-conducteur (45) ; une étape d'agencement (P2) consistant à agencer la fibre optique (10) ; une étape de préhension (P3) consistant à saisir, à l'aide d'un dispositif de préhension de fibre optique (70), la fibre optique (10) au niveau d'un point davantage vers une extrémité de cette dernière qu'au niveau de la couche métallisée (15) de cette dernière ; et une étape d'alignement (P4) consistant à aligner la fibre optique (10) de telle sorte que la lumière provenant de l'élément laser à semi-conducteur (45) soit dirigée vers la fibre optique (10) et qu'une grande partie de la lumière soit dirigée vers l'âme (11) de la fibre optique (10). L'indice de réfraction des éléments de contact (72R, 72L) du dispositif de préhension de fibre optique (70) qui viennent en contact avec la fibre optique (10), est égal ou supérieur à l'indice de réfraction de la gaine (12) à la longueur d'onde de la lumière sortie de l'élément laser à semi-conducteur (45).
PCT/JP2012/063727 2011-07-29 2012-05-29 Procédé de fabrication d'un module laser et dispositif de préhension de fibre optique utilisé dans ce dernier WO2013018426A1 (fr)

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JP2011166377A JP2013030651A (ja) 2011-07-29 2011-07-29 レーザモジュールの製造方法、及び、それに用いる光ファイバ用ハンド
JP2011-166377 2011-07-29

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Citations (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6026909A (ja) * 1983-07-25 1985-02-09 Nec Corp 光ファイバ付半導体レーザ装置
JPS6316684A (ja) * 1986-07-09 1988-01-23 Fujitsu Ltd 光半導体装置組立方法
JPS63125909A (ja) * 1986-11-15 1988-05-30 Oki Electric Ind Co Ltd 光フアイバ付半導体レ−ザ装置
JPS63138308A (ja) * 1986-12-01 1988-06-10 Oki Electric Ind Co Ltd 光ファイバー半田接続方法
JPS6419311A (en) * 1987-07-14 1989-01-23 Oki Electric Ind Co Ltd Manufacture of semiconductor laser device with optical fiber and its package
JPS6450589A (en) * 1987-08-21 1989-02-27 Fujitsu Ltd Semiconductor laser module with external resonator
JPH02211411A (ja) * 1989-02-13 1990-08-22 Fujitsu Ltd 光結合系の調整方法
JPH03137606A (ja) * 1989-10-24 1991-06-12 Fujitsu Ltd 光軸合わせ方法
JPH03206406A (ja) * 1990-08-17 1991-09-09 Nec Corp 光ファイバ付半導体レーザ装置の製造方法
JPH04291213A (ja) * 1991-03-19 1992-10-15 Fujikura Ltd 迷光除去装置
JPH10133054A (ja) * 1996-10-31 1998-05-22 Lucent Technol Inc 光導波路を含む物品
JP2007322493A (ja) * 2006-05-30 2007-12-13 Miyachi Technos Corp 光ファイバ保持装置及びファイバレーザ加工装置
JP2010530552A (ja) * 2007-06-13 2010-09-09 ジーエスアイ グループ リミテッド 光ファイバからの出力を伝達するシステム

Patent Citations (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6026909A (ja) * 1983-07-25 1985-02-09 Nec Corp 光ファイバ付半導体レーザ装置
JPS6316684A (ja) * 1986-07-09 1988-01-23 Fujitsu Ltd 光半導体装置組立方法
JPS63125909A (ja) * 1986-11-15 1988-05-30 Oki Electric Ind Co Ltd 光フアイバ付半導体レ−ザ装置
JPS63138308A (ja) * 1986-12-01 1988-06-10 Oki Electric Ind Co Ltd 光ファイバー半田接続方法
JPS6419311A (en) * 1987-07-14 1989-01-23 Oki Electric Ind Co Ltd Manufacture of semiconductor laser device with optical fiber and its package
JPS6450589A (en) * 1987-08-21 1989-02-27 Fujitsu Ltd Semiconductor laser module with external resonator
JPH02211411A (ja) * 1989-02-13 1990-08-22 Fujitsu Ltd 光結合系の調整方法
JPH03137606A (ja) * 1989-10-24 1991-06-12 Fujitsu Ltd 光軸合わせ方法
JPH03206406A (ja) * 1990-08-17 1991-09-09 Nec Corp 光ファイバ付半導体レーザ装置の製造方法
JPH04291213A (ja) * 1991-03-19 1992-10-15 Fujikura Ltd 迷光除去装置
JPH10133054A (ja) * 1996-10-31 1998-05-22 Lucent Technol Inc 光導波路を含む物品
JP2007322493A (ja) * 2006-05-30 2007-12-13 Miyachi Technos Corp 光ファイバ保持装置及びファイバレーザ加工装置
JP2010530552A (ja) * 2007-06-13 2010-09-09 ジーエスアイ グループ リミテッド 光ファイバからの出力を伝達するシステム

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