WO2013014994A1 - レーザ加工装置およびレーザ加工制御装置 - Google Patents
レーザ加工装置およびレーザ加工制御装置 Download PDFInfo
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- WO2013014994A1 WO2013014994A1 PCT/JP2012/062109 JP2012062109W WO2013014994A1 WO 2013014994 A1 WO2013014994 A1 WO 2013014994A1 JP 2012062109 W JP2012062109 W JP 2012062109W WO 2013014994 A1 WO2013014994 A1 WO 2013014994A1
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- processing
- laser
- reflected light
- machining
- workpiece
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- 238000003754 machining Methods 0.000 title claims abstract description 87
- 239000000835 fiber Substances 0.000 claims abstract description 29
- 230000005540 biological transmission Effects 0.000 claims abstract description 28
- 238000012545 processing Methods 0.000 claims description 239
- 239000000463 material Substances 0.000 claims description 51
- 238000012360 testing method Methods 0.000 claims description 35
- 238000000034 method Methods 0.000 claims description 17
- 238000001514 detection method Methods 0.000 claims description 9
- 238000005259 measurement Methods 0.000 claims description 4
- 238000005553 drilling Methods 0.000 claims description 3
- 238000012544 monitoring process Methods 0.000 abstract description 4
- 230000035515 penetration Effects 0.000 description 20
- 230000033228 biological regulation Effects 0.000 description 15
- 230000005856 abnormality Effects 0.000 description 14
- 238000010586 diagram Methods 0.000 description 5
- 230000007547 defect Effects 0.000 description 4
- 230000003287 optical effect Effects 0.000 description 4
- 230000000149 penetrating effect Effects 0.000 description 4
- 239000000284 extract Substances 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 238000012937 correction Methods 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 239000010410 layer Substances 0.000 description 2
- 238000002310 reflectometry Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910001209 Low-carbon steel Inorganic materials 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 235000012489 doughnuts Nutrition 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/0665—Shaping the laser beam, e.g. by masks or multi-focusing by beam condensation on the workpiece, e.g. for focusing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/03—Observing, e.g. monitoring, the workpiece
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/03—Observing, e.g. monitoring, the workpiece
- B23K26/032—Observing, e.g. monitoring, the workpiece using optical means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
Definitions
- the present invention relates to a laser processing apparatus and a laser processing control apparatus that reduce processing defects.
- a reflected light detection sensor is arranged on the processing object and the reflected light is measured by the reflected light detection sensor. For example, when laser light is incident obliquely with respect to the surface of the workpiece, detection is possible due to the position of the reflected light detection sensor, except when the incident angle of the laser light is always determined. A large angle dependency occurs in the amount of reflected light. In order to avoid this, it is necessary to arrange a belt-like sensor in a donut shape so as to surround the optical axis of the incident laser beam, and the apparatus configuration becomes complicated. Further, there is a method in which a reflected light detection sensor is disposed at a position spatially separated from the optical axis, and laser light is incident perpendicularly to the surface of the workpiece (for example, see Patent Document 1).
- the reflected light amount takes the maximum value, and the angle increases.
- the amount of reflected light is small. For this reason, in the above-mentioned conventional technique in which the reflected light detection sensor is arranged at a position spatially separated from the optical axis, there is a problem that it is difficult to obtain high measurement accuracy with respect to the reflected light amount .
- the present invention has been made in view of the above, and obtains a laser processing apparatus and a laser processing control apparatus that accurately determine whether or not appropriate laser processing can be performed based on the amount of reflected light detected with high accuracy. With the goal.
- the present invention provides a transmission fiber that transmits a laser beam emitted from a laser oscillator, and a laser beam transmitted from the transmission fiber.
- a processing head that irradiates the main surface in a direction perpendicular to the main surface and that is reflected by the processing object in a direction coaxial with the laser light, and a reflected light transmitted from the transmission fiber.
- the present invention based on the amount of reflected light reflected in the coaxial direction with the laser beam by the workpiece, it is determined whether or not the workpiece is in accordance with the laser machining processing conditions. Since the determination is made at the start, it is possible to accurately determine whether or not appropriate laser processing can be performed based on the amount of reflected light detected with high accuracy.
- FIG. 1 is a diagram illustrating a configuration of a laser processing apparatus according to the first embodiment.
- FIG. 2 is a block diagram illustrating a configuration of a control device provided in the laser processing apparatus according to the first embodiment.
- FIG. 3 is a flowchart showing a processing procedure of the laser processing apparatus.
- FIG. 4 is an example of a time chart showing changes in the amount of reflected light.
- FIG. 5 is a diagram showing the reflectance for each material.
- FIG. 1 is a diagram illustrating a configuration of a laser processing apparatus according to the first embodiment.
- the laser processing apparatus 100 is an apparatus that cuts a workpiece W (such as a plate-like member) with laser light, and includes a laser oscillator 4, a transmission fiber 2, a processing head 3, and a control device 1.
- the laser oscillator 4 oscillates a laser beam L (for example, a solid-state laser) that can be transmitted through a fiber and sends it to the transmission fiber 2.
- the transmission fiber 2 has one end connected to the laser oscillator 4 and the other end connected to the machining head 3.
- the transmission fiber 2 transmits the laser light L from the laser oscillator 4 to the machining head 3 and transmits the reflected light Re reflected by the workpiece W to the laser oscillator 4 side.
- the machining head 3 irradiates the workpiece W with the laser light L transmitted through the transmission fiber 2.
- the processing head 3 has a condensing lens that condenses the laser light L, and condenses the laser light L on the workpiece W by the condensing lens. Thereby, the processing head 3 irradiates the laser beam L transmitted from the transmission fiber 2 in a direction perpendicular to the main surface of the processing target W.
- the processing head 3 sends the reflected light Re reflected by the processing object W in the coaxial direction with the laser light L to the transmission fiber 2.
- the machining head 3 is disposed at a position perpendicular to the workpiece W (coaxial with the optical path).
- the laser oscillator 4 has a reflected light monitor unit (reflected light amount detection unit) 10, and the reflected light monitor unit 10 detects the reflected light amount of the reflected light Re.
- the control device 1 controls the laser oscillator 4 and the processing drive unit (processing head 3 and a mounting table described later) of the laser processing device 100. Based on the amount of reflected light, the control device 1 according to the present embodiment has a processing object having a desired material and plate thickness (processing conditions (for example, laser output, frequency, duty, processing gas type, processing gas). It is determined whether or not the object to be processed is in accordance with pressure, focal position, nozzle gap, etc.). In other words, the control device 1 determines whether the processing conditions are correct based on the amount of reflected light.
- processing conditions for example, laser output, frequency, duty, processing gas type, processing gas
- the workpiece W is a member mainly made of metal, for example.
- the workpiece W is laser-processed in a state of being fixed to a mounting table (not shown) that can move in a plane perpendicular to the irradiation direction of the laser light L.
- processing the processing target W processing conditions corresponding to the processing target W are selected.
- the control device 1 determines that the workpiece W according to the machining condition is not placed on the mounting table, the machining condition is corrected or the workpiece W is exchanged.
- the laser light L oscillated from the laser oscillator 4 passes through the transmission fiber 2 and the processing head 3 and is irradiated onto the processing object W.
- a part of the reflected light Re generated at this time passes through the processing head 3 and the transmission fiber 2 and is returned to the reflected light monitor unit 10 to measure the reflected light amount. Since the reflected light Re is collected by the processing head 3 and returned to the reflected light monitor unit 10, a wide range of reflected light Re can be returned to the reflected light monitor unit 10. As a result, the reflected light monitor unit 10 It is possible to obtain a high signal amount of the reflected light Re.
- FIG. 2 is a block diagram illustrating a configuration of a control device provided in the laser processing apparatus according to the first embodiment.
- a control device 1 laser processing control device included in the laser processing apparatus 100 includes a processing information input unit 11A, a reflected light amount input unit 11B, a processing program storage unit 12M, a specified range storage unit 13M, a determination control unit 14, and a plate thickness determination unit. 15, a material determination unit 16, a processing control unit 17, an instruction output unit 18, and a determination result output unit 19.
- the processing information input unit 11A inputs information used when processing the workpiece W. Specifically, the machining information input unit 11A inputs a machining program and sends it to the machining program storage unit 12M. Further, the processing information input unit 11A has a specified range of reflected light amount used for material determination of the workpiece W (hereinafter referred to as a reflected light amount specified range) and a specified range of piercing penetration time used for plate thickness determination of the workpiece W. (Hereinafter referred to as a penetrating time prescribed range) is input and sent to the prescribed range storage unit 13M.
- a specified range of reflected light amount used for material determination of the workpiece W hereinafter referred to as a reflected light amount specified range
- a specified range of piercing penetration time used for plate thickness determination of the workpiece W (Hereinafter referred to as a penetrating time prescribed range) is input and sent to the prescribed range storage unit 13M.
- the reflected light amount defining range is an allowable range of the reflected light amount
- the penetrating time defining range is an allowable range of the piercing penetrating time.
- the piercing time takes 7 seconds for a plate thickness of 12 mm, 10 seconds for a plate thickness of 16 mm, and 15 seconds for a plate thickness of 19 mm.
- the reflected light amount input unit 11B inputs the reflected light amount measured by the reflected light monitor unit 10 of the laser oscillator 4 and sends it to the material determining unit 16 and the plate thickness determining unit 15.
- the machining program storage unit 12M is a memory or the like that stores a machining program.
- the machining program here is a program used for laser machining of the workpiece W, and includes a machining position, a machining order, machining conditions, and the like.
- the specified range storage unit 13M is a memory or the like that stores the reflected light amount specified range and the penetration time specified range.
- the reflectance on the workpiece W with respect to the laser light L is determined by the physical property value (material) of the workpiece W.
- material material
- the defined range storage unit 13M stores a reflected light amount defined range and a penetrating time defined range for each processing condition (for each workpiece W).
- the specified range storage unit 13M stores information that associates the processing conditions with the reflected light amount prescribed range, and information that associates the processing conditions with the penetration time prescribed range.
- the determination control unit 14 creates instruction information to be sent to the laser oscillator 4 and the processing head 3 when performing plate thickness determination and material determination of the workpiece W.
- the determination control unit 14 extracts a region (non-product region) that is not used for product processing from the region on the workpiece W.
- the determination control unit 14 reads a machining program from the machining program storage unit 12M, and extracts a non-product area based on the machining position set in the machining program. Further, the determination control unit 14 reads out the machining conditions from the machining program.
- the processing conditions are processing conditions used when processing the workpiece W.
- the processing conditions are, for example, the laser output value of the laser beam L used at the start of processing (piercing) or during processing (cutting), the moving speed of the processing head 3, and the like. Below, the case where the processing conditions at the time of a process start are the processing conditions (piercing conditions) regarding piercing is demonstrated.
- the determination control unit 14 causes the laser oscillator 4 and the machining head 3 to perform a laser machining test (test machining) at any position (test position) in the non-product area under the piercing condition used at the start of machining.
- the determination control unit 14 sends instruction information for test processing to be sent to the laser oscillator 4 and the processing head 3 to the instruction output unit 18.
- the determination control unit 14 based on the determination results from the plate thickness determination unit 15 and the material determination unit 16, the processing start instruction to the processing control unit 17 (processing start instruction to the product area) and the determination result output unit 19.
- the judgment result output instruction to is performed.
- the determination control unit 14 receives a normal determination result (determination result indicating that the workpiece W according to the processing condition is mounted on the mounting table) from the plate thickness determination unit 15 or the material determination unit 16. In the case where it comes, a processing start instruction is sent to the processing control unit 17.
- the determination control unit 14 instructs the determination result output unit 19 to output the normal determination result when the normal determination result is received from the plate thickness determination unit 15 or the material determination unit 16.
- the determination control unit 14 obtains an abnormality determination result (determination result indicating that the workpiece W according to the processing condition is not placed on the mounting table) from the plate thickness determining unit 15 or the material determining unit 16.
- the determination result output unit 19 is instructed to output the abnormality determination result.
- the plate thickness determination unit 15 reads the penetration time specified range corresponding to the processing condition from the specified range storage unit 13M based on the processing condition extracted by the determination control unit 14. The plate thickness determination unit 15 determines the plate thickness of the workpiece W for each processing condition based on the change in the amount of reflected light after the start of test processing.
- the plate thickness determination unit 15 has a timer 31 that measures the time from when test processing is started until the amount of reflected light falls to a predetermined value (threshold value). The time measured by the timer 31 and the specified range storage unit The penetration time regulation range read from 13M is compared. During piercing, there is a predetermined amount of reflected light, but if the workpiece W penetrates by piercing, the amount of reflected light is drastically reduced. For this reason, as the threshold value of the reflected light amount, a value slightly larger than the reflected light amount detected when piercing is completed (hereinafter referred to as the piercing completion threshold value) is set and stored in advance in the specified range storage unit 13M or the like. deep. The piercing completion threshold is set for each processing condition.
- the plate thickness determination unit 15 has the correct plate thickness (the workpiece W having a plate thickness corresponding to the processing conditions is mounted on the mounting table.
- the normality determination result regarding the plate thickness is sent to the determination control unit 14.
- the plate thickness determination unit 15 If the time measured by the timer 31 is outside the specified penetration time range, the plate thickness determination unit 15 has an incorrect plate thickness (a workpiece W having a plate thickness different from the plate thickness according to the processing conditions is loaded). The abnormality determination result regarding the plate thickness is sent to the determination control unit 14.
- the material determination unit 16 reads the reflected light amount regulation range corresponding to the machining condition from the regulation range storage unit 13M based on the machining condition extracted by the judgment control unit 14. The material determination unit 16 determines the material of the workpiece W for each processing condition based on the amount of reflected light immediately after the start of piercing.
- the material determination unit 16 compares the reflected light amount sent from the reflected light monitor unit 10 with the reflected light amount specified range read from the specified range storage unit 13M.
- the material determination unit 16 is a correct material if the amount of reflected light transmitted from the reflected light monitor unit 10 is within the prescribed range of the amount of reflected light (the workpiece W of the material according to the processing conditions is placed on the mounting table.
- the normality determination result regarding the material is sent to the determination control unit 14.
- the material determination unit 16 is the wrong material (the workpiece W having a material different from the material according to the processing conditions). And the abnormality determination result regarding the material is sent to the determination control unit 14.
- the machining control unit 17 When the machining control unit 17 receives a machining start instruction from the determination control unit 14, the machining control unit 17 reads the machining program in the machining program storage unit 12 ⁇ / b> M and sends the machining instruction to the instruction output unit 18. Thereby, the laser processing to the product area
- the instruction output unit 18 sends the instruction information (control instruction) sent from the machining control unit 17 or the determination control unit 14 to the laser oscillator 4 or the machining head 3.
- the determination result output unit 19 displays a normal determination result or an abnormality determination result sent from the determination control unit 14 on a display device (for example, a liquid crystal monitor).
- FIG. 3 is a flowchart showing a processing procedure of the laser processing apparatus.
- the laser processing apparatus 100 performs test processing on the workpiece W, and determines that the workpiece W having a thickness or material according to the processing conditions is mounted on the mounting table. Product processing is performed on the object W.
- the laser processing apparatus 100 starts laser processing on the workpiece W from the test processing (step S10).
- the determination control unit 14 reads a machining program from the machining program storage unit 12M, and extracts a non-product area based on the machining position set in the machining program. Furthermore, the determination control unit 14 reads out the machining conditions from the machining program, and reads out the piercing conditions from the machining conditions. Then, the determination control unit 14 causes the laser oscillator 4 and the processing head 3 to perform test processing at any position in the non-product region under piercing conditions. Therefore, the determination control unit 14 sends test processing instruction information to be sent to the laser oscillator 4 and the processing head 3 to the instruction output unit 18. As a result, instruction information for test processing is sent from the instruction output unit 18 to the laser oscillator 4 and the processing head 3.
- Laser light L corresponding to the piercing condition for test processing is emitted from the laser oscillator 4.
- the laser beam L is irradiated onto the workpiece W via the transmission fiber 2 and the machining head 3.
- a part of the reflected light Re reflected by the workpiece W is sent to the reflected light monitoring unit 10 via the processing head 3 and the transmission fiber 2.
- the reflected light monitor unit 10 sends the measured amount of reflected light to the control device 1.
- the reflected light amount input unit 11 ⁇ / b> B of the control device 1 sends the reflected light amount to the material determining unit 16 and the plate thickness determining unit 15.
- the determination control unit 14 reads the processing conditions from the processing program and sends them to the material determination unit 16 and the plate thickness determination unit 15.
- the material determination unit 16 reads the reflected light amount regulation range 51 corresponding to the processing conditions from the regulation range storage unit 13M.
- the material determination unit 16 determines whether or not the reflected light amount is within the reflected light amount regulation range 51 based on the reflected light amount immediately after the start of piercing (step S30). If the reflected light amount sent from the reflected light monitor unit 10 is outside the reflected light amount regulation range 51 (No at Step S30), the material determination unit 16 places a workpiece W of a material that does not correspond to the processing conditions. It determines with having been mounted on the mounting base. Then, the material determination unit 16 sends an abnormality determination result regarding the material to the determination control unit 14.
- the determination control unit 14 When the determination control unit 14 receives the abnormality determination result from the material determination unit 16, the processing is stopped or the processing conditions are corrected (step S40). At this time, the determination control unit 14 outputs an abnormality determination result regarding the material to the determination result output unit 19. Thereby, the determination result output part 19 displays the abnormality determination result regarding a material on a display apparatus.
- the determination control unit 14 When stopping machining, the determination control unit 14 outputs a machining stop instruction to the instruction output unit 18. As a result, a machining stop instruction is sent from the instruction output unit 18 to the laser oscillator 4 and the machining head 3, and the operations of the laser oscillator 4 and the machining head 3 are stopped. Thereafter, the user of the laser processing apparatus 100 replaces the processing target W with an appropriate processing target W according to the processing conditions.
- the machining conditions are modified by the user of the laser machining apparatus 100. Specifically, the processing conditions are corrected to processing conditions (such as the laser output value of the laser beam L and the moving speed of the processing head 3) according to the material of the processing target W mounted on the mounting table.
- the modified machining conditions are input from the machining information input unit 11A and sent to the machining program storage unit 12M. Then, a new machining condition after correction is set in the machining program.
- the surface of the workpiece W may be oxidized or the surface of the workpiece W may be rough.
- the processing condition may be modified to a processing condition according to the surface state of the processing target W.
- steps S10 to S40 are repeated until the amount of reflected light sent from the reflected light monitor unit 10 falls within the reflected light amount regulation range 51. If the reflected light amount sent from the reflected light monitoring unit 10 falls within the reflected light amount regulation range 51 (step S30, Yes), the material determination unit 16 places the processing object W of the material according to the processing conditions on the mounting table. It is determined that it is placed on the top. Then, the material determination unit 16 sends a normal determination result regarding the material to the determination control unit 14.
- test processing is continued (step S50).
- the laser light L corresponding to the test processing piercing condition is continuously emitted from the laser oscillator 4, and the piercing penetration process to the workpiece W is performed (step S60).
- the emission of the laser light L and the measurement of the amount of reflected light are continued until the piercing penetration process to the workpiece W is completed.
- the plate thickness determining unit 15 reads the penetration time defining range 52 corresponding to the machining conditions from the defined range storage unit 13M based on the machining conditions extracted by the determination control unit 14.
- the timer 31 of the plate thickness determination unit 15 measures the time from the start of test processing until the amount of reflected light falls to the piercing completion threshold.
- the plate thickness determination unit 15 compares the time measured by the timer 31 with the penetration time specified range 52 read from the specified range storage unit 13M (step S70).
- the plate thickness determination unit 15 places a workpiece W having a plate thickness different from the plate thickness according to the processing conditions. It determines with having been mounted on the mounting base. Then, the plate thickness determination unit 15 sends an abnormality determination result related to the plate thickness to the determination control unit 14.
- the determination control unit 14 When the determination control unit 14 receives the abnormality determination result from the plate thickness determination unit 15, the processing is stopped or the processing conditions are corrected (step S80). At this time, the determination control unit 14 outputs an abnormality determination result regarding the plate thickness to the determination result output unit 19. Thereby, the determination result output part 19 displays the abnormality determination result regarding plate
- step S40 When the machining is stopped, the workpiece W is replaced with an appropriate workpiece W according to the machining conditions by the same process as described in step S40.
- new machining conditions are set in the machining program by the same process as described in step S40.
- steps S50 to S80 are repeated until the time measured by the timer 31 falls within the penetration time regulation range 52.
- the determination control unit 14 selects a position not used in the test processing in the non-product area as the next test position. Then, the determination control unit 14 causes the laser oscillator 4 and the processing head 3 to perform test processing at the selected test position under the piercing condition. In other words, the test processing is performed by changing the position of the test processing.
- the plate thickness determination unit 15 places the workpiece W having a plate thickness according to the processing conditions on the mounting table. It is determined that Then, the plate thickness determining unit 15 sends a normal determination result regarding the plate thickness to the determination control unit 14.
- the machining control unit 17 starts product machining on the workpiece W (step S90).
- the normality determination result machining start instruction
- the machining control unit 17 reads the machining program in the machining program storage unit 12 ⁇ / b> M and sends a machining instruction to the instruction output unit 18. send.
- FIG. 4 is an example of a time chart showing changes in the amount of reflected light.
- the material determination unit 16 compares the reflected light amount s1 with the reflected light amount regulation range 51, and confirms the consistency of the processing condition (material). Subsequently, when the piercing penetration is completed at time t2, the laser beam L is emitted, but this laser beam L passes through the through hole of the workpiece W. For this reason, the laser beam L is hardly reflected from the workpiece W, and as a result, the amount of reflected light decreases to s3 near zero.
- the piercing completion threshold value is slightly larger than s3 here.
- the timer 31 of the plate thickness determination unit 15 measures the time (time from time t1 to time t2) from when test processing is started until the amount of reflected light falls to the piercing completion threshold.
- the plate thickness determining unit 15 compares the time from the time t1 to the time t2 (for example, 0.1 second to several seconds) with the penetration time defining range 52, and confirms the consistency of the processing conditions (plate thickness). .
- the case has been described where test processing is performed under the processing conditions when starting processing of the workpiece W, but processing conditions for test processing may be prepared in advance.
- the case where the material determination and the plate thickness determination are performed based on the reflected light amount when the test processing is performed on the non-product area has been described.
- the reflected light amount when actually starting the product processing is described.
- material determination and plate thickness determination may be performed.
- the laser beam L is irradiated to the first processing position set in the processing program, and the material determination and the plate thickness determination are performed based on the reflected light amount and the piercing penetration time at the first processing position.
- the control of the laser oscillator 4 and the machining head 3 is continued using the machining program.
- machining stop or machining condition correction is performed.
- the laser processing apparatus 100 is not limited to the cutting of the processing target W, and may perform drilling of the processing target W.
- the workpiece W is not limited to a single-layer plate-like member, and may be a plate-like member (for example, a printed board) composed of a plurality of layers. In this case, the material and the plate thickness may be determined for each layer.
- the machining conditions are automatically selected based on the amount of reflected light and the piercing penetration time during piercing. May be.
- piercing is performed under the processing conditions for testing without setting the processing conditions for product processing, and then the processing conditions for product processing are set based on the amount of reflected light and piercing penetration time during piercing. Is done.
- a minute change in the reflected light amount at the time of cutting processing may be detected from the reflected light amount at the time of piercing processing, and the processing conditions corresponding to the detected change may be selected.
- a plurality of processing conditions are prepared in accordance with changes in the amount of reflected light. The processing conditions are automatically changed based on the change in the amount of reflected light.
- a control program used when performing a machining test may be included in the machining program. In this case, test processing and product processing are performed using the processing program. Further, in the present embodiment, the case where the laser light L and the reflected light Re are transmitted by one transmission fiber 2 has been described. However, the transmission fiber 2 for the laser light L and the transmission fiber 2 for the reflected light Re are You may provide in the laser processing apparatus 100. FIG.
- the processing object W since it is determined whether or not the processing object W is the processing object W according to the processing conditions based on the amount of reflected light, the processing object W and the processing conditions are determined. It is possible to accurately determine whether or not the correspondence relationship is appropriate. Therefore, it is possible to prevent laser processing of the wrong workpiece W or laser processing under inappropriate processing conditions. In other words, since a mismatch between the machining condition and the workpiece W is detected based on the amount of reflected light, it is possible to reduce the occurrence of machining defects (machining errors).
- the reflected light amount is detected coaxially during piercing using the machining head 3 arranged coaxially with the laser beam L, the reflected light amount can be detected with higher accuracy as the plate thickness of the workpiece W increases. Further, since the plate thickness of the workpiece W is determined based on the piercing penetration time, it is possible to accurately determine whether the workpiece W is the desired workpiece W according to the processing conditions. It becomes. Further, since the material of the workpiece W is determined based on the amount of reflected light at the start of piercing, it is accurately determined whether or not the workpiece W is a desired workpiece W according to the processing conditions. Is possible.
- the product processing on the workpiece W is performed using the machining program. As a result, the occurrence of processing defects can be reduced.
- the laser processing apparatus and the laser processing control apparatus according to the present invention are suitable for reducing processing defects.
- Control apparatus Transmission fiber 3 Processing head 4 Laser oscillator 10 Reflected light monitor part 11A Processing information input part 11B Reflected light quantity input part 12M Processing program memory
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Abstract
Description
図1は、実施の形態1に係るレーザ加工装置の構成を示す図である。レーザ加工装置100は、例えば、加工対象物W(板状部材など)をレーザ光によって切断する装置であり、レーザ発振器4、伝送ファイバ2、加工ヘッド3、制御装置1を備えている。
2 伝送ファイバ
3 加工ヘッド
4 レーザ発振器
10 反射光モニタ部
11A 加工情報入力部
11B 反射光量入力部
12M 加工プログラム記憶部
13M 規定範囲記憶部
14 判定制御部
15 板厚判定部
16 材質判定部
17 加工制御部
100 レーザ加工装置
L レーザ光
Re 反射光
W 加工対象物
Claims (8)
- レーザ発振器から出射されるレーザ光をファイバ伝送する伝送ファイバと、
前記伝送ファイバから送られてくる前記レーザ光を加工対象物の主面に対して垂直方向に照射するとともに、前記加工対象物によって前記レーザ光と同軸方向に反射された反射光を前記伝送ファイバに送る加工ヘッドと、
前記伝送ファイバから送られてくる前記反射光の反射光量を検出する反射光量検出部と、
前記レーザ発振器および前記加工ヘッドを制御する制御装置と、
を備え、
前記制御装置は、
前記加工対象物がレーザ加工の加工条件に応じたものであるか否かを、前記反射光量に基づいて、レーザ加工の開始時に判定する判定部を有することを特徴とするレーザ加工装置。 - 前記反射光量検出部は、前記加工対象物への穴あけ加工であるピアシングの際に前記反射光量を検出し、
前記判定部は、前記ピアシングの際に検出された反射光量に基づいて、前記加工対象物が前記加工条件に応じたものであるか否かを判定することを特徴とする請求項1に記載のレーザ加工装置。 - 前記判定部は、前記ピアシングを開始してから前記反射光量が所定値に下がるまでの間に計測された計測時間と、予め記憶しておいた計測時間に関する第1の規定範囲と、を比較し、比較結果に基づいて、前記加工対象物が加工条件に応じた板厚であるか否かを判定することを特徴とする請求項1または2に記載のレーザ加工装置。
- 前記判定部は、前記ピアシングの開始時に検出された反射光量と、予め記憶しておいた反射光量に関する第2の規定範囲と、を比較し、比較結果に基づいて、前記加工対象物が加工条件に応じた材質であるか否かを判定することを特徴とする請求項1~3のいずれか1つに記載のレーザ加工装置。
- レーザ発振器から出射されて伝送ファイバによってファイバ伝送されたレーザ光を加工ヘッドが加工対象物の主面に対して垂直方向に照射し、前記加工対象物によって前記レーザ光と同軸方向に反射光が反射された際に、前記加工ヘッドおよび前記伝送ファイバを介して送られてくる前記反射光の反射光量が検出されると、前記反射光量が入力される入力部と、
前記反射光量に関する規定範囲を記憶する第1の記憶部と、
前記加工対象物の製品領域の加工位置およびレーザ加工の開始時に用いる加工条件を含んだ加工プログラムを記憶する第2の記憶部と、
前記レーザ発振器および前記加工ヘッドを、前記加工プログラムを用いて制御する第1の制御部と、
前記加工対象物が前記加工条件に応じたものであるか否かを、前記加工条件で前記加工対象物にレーザ光を照射した場合に前記入力部に入力される反射光量と前記記憶部に記憶されている規定範囲との比較結果に基づいて判定する判定部と、
を備えることを特徴とするレーザ加工制御装置。 - 前記判定部は、前記加工対象物への穴あけ加工であるピアシングの際に検出された反射光量に基づいて、前記加工対象物が前記加工条件に応じたものであるか否かを判定することを特徴とする請求項5に記載のレーザ加工制御装置。
- 前記加工対象物のうち製品領域以外の非製品領域に前記レーザ光をテスト照射するよう、前記レーザ発振器および前記加工ヘッドを制御する第2の制御部をさらに備え、
前記第2の制御部は、前記加工位置に基づいて前記非製品領域内の何れかの位置にレーザ光をテスト照射するテスト位置を設定するとともに、前記テスト位置に前記加工条件で前記レーザ光をテスト照射するよう、前記レーザ発振器および前記加工ヘッドを制御し、
前記判定部は、前記テスト位置での反射光量を用いて、前記加工対象物が前記加工条件に応じたものであるか否かを判定し、
前記第1の制御部は、前記加工対象物が前記加工条件に応じたものであると判定された後、前記加工プログラムを用いて前記加工対象物へのレーザ加工を開始することを特徴とする請求項5または6に記載のレーザ加工制御装置。 - 前記第1の制御部は、前記加工プログラムに設定されている最初の加工位置に前記加工条件で前記レーザ光を照射させ、
前記判定部は、前記最初の加工位置に前記加工条件で前記レーザ光が照射された際の反射光量を用いて、前記加工対象物が前記加工条件に応じたものであるか否かを判定し、
前記第1の制御部は、前記加工対象物が前記加工条件に応じたものであると判定された後、前記加工プログラムを用いて前記加工対象物へのレーザ加工を継続することを特徴とする請求項5または6に記載のレーザ加工制御装置。
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---|---|---|---|---|
DE102017106241A1 (de) | 2016-03-30 | 2017-10-05 | Fanuc Corporation | Laserbearbeitungsvorrichtung mit vorbearbeitungssteuerung und laserbearbeitungsverfahren |
DE102017107499A1 (de) | 2016-04-08 | 2017-10-12 | Fanuc Corporation | Laserbearbeitungsvorrichtung und Laserbearbeitungsverfahren zum Durchführen von Laserbearbeitung während eines Steuerns von reflektiertem Licht |
DE102017110211A1 (de) | 2016-05-17 | 2017-11-23 | Fanuc Corporation | Einrichtung zur Laserbearbeitung und Verfahren zur Laserbearbeitung zum Durchführen von Laserbearbeitung während eines Kontrollierens von reflektiertem Licht |
JP2017209692A (ja) * | 2016-05-24 | 2017-11-30 | 株式会社アマダホールディングス | 工作機械 |
JP2022534573A (ja) * | 2019-05-29 | 2022-08-02 | トルンプフ ヴェルクツォイクマシーネン エス・エー プルス コー. カー・ゲー | レーザによる自動材料認識 |
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Publication number | Priority date | Publication date | Assignee | Title |
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Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06312283A (ja) * | 1993-04-28 | 1994-11-08 | Toyo Denshi Kk | レーザー加工装置 |
JPH07128247A (ja) * | 1993-10-29 | 1995-05-19 | Hoya Corp | 材料識別装置並びにレーザ加工装置及びレーザ成膜配線装置 |
JPH0810976A (ja) * | 1994-06-24 | 1996-01-16 | Mitsubishi Electric Corp | ピアス加工完了判定方法,それを用いたレーザ加工機およびそのレーザ加工方法 |
JP2001314992A (ja) * | 2000-05-01 | 2001-11-13 | Amada Co Ltd | レーザ加工方法およびその装置 |
JP2002239771A (ja) * | 2001-02-08 | 2002-08-28 | Amada Co Ltd | Yagレーザトーチ |
JP2006150373A (ja) * | 2004-11-25 | 2006-06-15 | Laserfront Technologies Inc | レーザ加工装置及びレーザ加工方法 |
JP2009142860A (ja) * | 2007-12-14 | 2009-07-02 | Miyachi Technos Corp | レーザ加工モニタリング装置及びレーザ加工装置 |
JP2010110796A (ja) * | 2008-11-07 | 2010-05-20 | Miyachi Technos Corp | レーザ加工モニタリング方法および装置 |
JP2010125521A (ja) * | 2008-12-01 | 2010-06-10 | Disco Abrasive Syst Ltd | レーザ加工装置 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2720744B2 (ja) * | 1992-12-28 | 1998-03-04 | 三菱電機株式会社 | レーザ加工機 |
US6777641B2 (en) | 2002-04-16 | 2004-08-17 | W.A. Whitney Co. | Method and apparatus for laser piercing and cutting metal sheet and plate |
JP2005118808A (ja) * | 2003-10-15 | 2005-05-12 | Disco Abrasive Syst Ltd | レーザー加工装置 |
TWI382795B (zh) * | 2005-03-04 | 2013-01-11 | Hitachi Via Mechanics Ltd | A method of opening a printed circuit board and an opening device for a printed circuit board |
GB2458304A (en) * | 2008-03-13 | 2009-09-16 | Gsi Group Ltd | Process Monitoring |
CN102056703B (zh) * | 2008-06-04 | 2013-07-24 | 三菱电机株式会社 | 激光加工装置及激光加工方法 |
JP2010214452A (ja) | 2009-03-18 | 2010-09-30 | Sharp Corp | レーザ加工方法、レーザ加工装置及び多層プリント配線板 |
-
2012
- 2012-05-11 CN CN201280003277.9A patent/CN103153522B/zh active Active
- 2012-05-11 JP JP2012551020A patent/JP5269260B1/ja active Active
- 2012-05-11 WO PCT/JP2012/062109 patent/WO2013014994A1/ja active Application Filing
- 2012-05-11 US US13/877,762 patent/US9463529B2/en active Active
- 2012-05-11 EP EP12818022.1A patent/EP2737970B1/en active Active
Patent Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06312283A (ja) * | 1993-04-28 | 1994-11-08 | Toyo Denshi Kk | レーザー加工装置 |
JPH07128247A (ja) * | 1993-10-29 | 1995-05-19 | Hoya Corp | 材料識別装置並びにレーザ加工装置及びレーザ成膜配線装置 |
JPH0810976A (ja) * | 1994-06-24 | 1996-01-16 | Mitsubishi Electric Corp | ピアス加工完了判定方法,それを用いたレーザ加工機およびそのレーザ加工方法 |
JP2001314992A (ja) * | 2000-05-01 | 2001-11-13 | Amada Co Ltd | レーザ加工方法およびその装置 |
JP2002239771A (ja) * | 2001-02-08 | 2002-08-28 | Amada Co Ltd | Yagレーザトーチ |
JP2006150373A (ja) * | 2004-11-25 | 2006-06-15 | Laserfront Technologies Inc | レーザ加工装置及びレーザ加工方法 |
JP2009142860A (ja) * | 2007-12-14 | 2009-07-02 | Miyachi Technos Corp | レーザ加工モニタリング装置及びレーザ加工装置 |
JP2010110796A (ja) * | 2008-11-07 | 2010-05-20 | Miyachi Technos Corp | レーザ加工モニタリング方法および装置 |
JP2010125521A (ja) * | 2008-12-01 | 2010-06-10 | Disco Abrasive Syst Ltd | レーザ加工装置 |
Non-Patent Citations (1)
Title |
---|
See also references of EP2737970A4 * |
Cited By (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102017106241A1 (de) | 2016-03-30 | 2017-10-05 | Fanuc Corporation | Laserbearbeitungsvorrichtung mit vorbearbeitungssteuerung und laserbearbeitungsverfahren |
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US10363630B2 (en) | 2016-04-08 | 2019-07-30 | Fanuc Corporation | Laser processing apparatus and laser processing method for performing laser processing while controlling reflected light |
DE102017107499B4 (de) * | 2016-04-08 | 2020-11-19 | Fanuc Corporation | Laserbearbeitungsverfahren, das in einer Laserbearbeitungsvorrichtung durchgeführt wird, die einen Laserstrahl aus einem Bearbeitungskopf zu einem Werkstück aussendet, während das reflektierte Licht des ausgesendeten Laserstrahls geregelt wird, sowie zugehörige Laserbearbeitungsvorrichtung |
DE102017110211A1 (de) | 2016-05-17 | 2017-11-23 | Fanuc Corporation | Einrichtung zur Laserbearbeitung und Verfahren zur Laserbearbeitung zum Durchführen von Laserbearbeitung während eines Kontrollierens von reflektiertem Licht |
US10537964B2 (en) | 2016-05-17 | 2020-01-21 | Fanuc Corporation | Laser machining apparatus and laser machining method for performing laser machining while controlling reflected light |
DE102017110211B4 (de) * | 2016-05-17 | 2020-10-15 | Fanuc Corporation | In einer einrichtung zur laserbearbeitung durchgeführtes verfahren zur laserbearbeitung so wie einrichtung zur laserbearbeitung |
JP2017209692A (ja) * | 2016-05-24 | 2017-11-30 | 株式会社アマダホールディングス | 工作機械 |
JP2022534573A (ja) * | 2019-05-29 | 2022-08-02 | トルンプフ ヴェルクツォイクマシーネン エス・エー プルス コー. カー・ゲー | レーザによる自動材料認識 |
JP7379542B2 (ja) | 2019-05-29 | 2023-11-14 | トルンプフ ヴェルクツォイクマシーネン エス・エー プルス コー. カー・ゲー | レーザによる自動材料認識 |
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