WO2013005493A1 - 発光デバイス用セルの製造方法及び発光デバイスの製造方法 - Google Patents
発光デバイス用セルの製造方法及び発光デバイスの製造方法 Download PDFInfo
- Publication number
- WO2013005493A1 WO2013005493A1 PCT/JP2012/063318 JP2012063318W WO2013005493A1 WO 2013005493 A1 WO2013005493 A1 WO 2013005493A1 JP 2012063318 W JP2012063318 W JP 2012063318W WO 2013005493 A1 WO2013005493 A1 WO 2013005493A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- glass
- light emitting
- light
- emitting device
- cell
- Prior art date
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
- B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B23/00—Re-forming shaped glass
- C03B23/20—Uniting glass pieces by fusing without substantial reshaping
- C03B23/203—Uniting glass sheets
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C27/00—Joining pieces of glass to pieces of other inorganic material; Joining glass to glass other than by fusing
- C03C27/06—Joining glass to glass by processes other than fusing
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
- C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
- C09K11/88—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing selenium, tellurium or unspecified chalcogen elements
- C09K11/881—Chalcogenides
- C09K11/883—Chalcogenides with zinc or cadmium
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/005—Processes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0041—Processes relating to semiconductor body packages relating to wavelength conversion elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/505—Wavelength conversion elements characterised by the shape, e.g. plate or foil
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/507—Wavelength conversion elements the elements being in intimate contact with parts other than the semiconductor body or integrated with parts other than the semiconductor body
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- General Chemical & Material Sciences (AREA)
- Geochemistry & Mineralogy (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Life Sciences & Earth Sciences (AREA)
- Inorganic Chemistry (AREA)
- Ceramic Engineering (AREA)
- Led Device Packages (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
Description
(発光デバイス1の構成)
図1は、第1の実施形態において製造する発光デバイスの略図的斜視図である。図2は、第1の実施形態において製造する発光デバイスの略図的平面図である。図3は、図2の線III-IIIにおける略図的断面図である。
図4、図5及び図7は、第1の実施形態における発光デバイス用セルの製造工程を説明するための略図的平面図である。図6は、図5の線VI-VIにおける略図的断面図である。
図8は、第2の実施形態における発光デバイス用セルの製造工程を説明するための略図的平面図である。図9は、第2の実施形態における発光デバイス用セルの製造工程を説明するための略図的平面図である。
10…セル
10a…内部空間
10b…連通孔
11…発光材料
12,13…ガラス板
14…融着部
15…封止材
21,24…ガラス板母材
22、22a、22b…ガラスリボン
23、23a、23b…ガラスペースト層
25…融着部構成部材
26…融着部
30…セル母材
L1,L2…カッティングライン
Claims (7)
- 間隔をおいて互いに対向して配された一対のガラス板と、前記一対のガラス板の周縁部間に配されており、前記一対のガラス板のそれぞれに融着しているガラス製の融着部とを備える発光デバイス用セルの製造方法であって、
間隔をおいて互いに対向して配された一対のガラス板母材の間にガラス製の融着部構成部材を格子状に設ける工程と、
前記融着部構成部材と前記一対のガラス板母材のそれぞれとを融着させることにより、格子状の融着部を有するセル母材を作製する工程と、
前記格子状の融着部の行方向及び列方向のそれぞれに沿って前記セル母材を切断することにより、前記発光デバイスを複数作製する工程と、
を備え、
前記格子状の融着部構成部材の第1の方向に沿って延びる部分をガラスリボンにより構成し、第2の方向に沿って延びる部分をガラスペーストにより構成する、発光デバイス用セルの製造方法。 - 前記一対のガラス板母材の一方の上に、前記ガラスリボンを前記第1の方向に沿って配置すると共に、前記ガラスペーストを前記第2の方向に沿って塗布することにより前記融着部構成部材を形成する、請求項1に記載の発光デバイス用セルの製造方法。
- 前記ガラスペーストを前記ガラスリボンの上にも塗布する、請求項2に記載の発光デバイス用セルの製造方法。
- 前記ガラスペーストを前記ガラスリボンの上には塗布しない、請求項2に記載の発光デバイス用セルの製造方法。
- 請求項1~4のいずれか一項に記載の発光デバイス用セルの製造方法により複数の発光デバイス用セルを作製する工程と、
前記複数の発光デバイス用セルのそれぞれに発光材料を注入する工程と、
を備える、発光デバイスの製造方法。 - 前記発光材料として無機蛍光体を用いる、請求項5に記載の発光デバイスの製造方法。
- 前記無機蛍光体として、量子ドットを用いる、請求項6に記載の発光デバイスの製造方法。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US14/128,637 US8993367B2 (en) | 2011-07-01 | 2012-05-24 | Method for producing cell for light-emitting device and method for producing light-emitting device |
KR20137033093A KR20140038455A (ko) | 2011-07-01 | 2012-05-24 | 발광 디바이스용 셀의 제조 방법 및 발광 디바이스의 제조 방법 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011147329A JP5724685B2 (ja) | 2011-07-01 | 2011-07-01 | 発光デバイス用セルの製造方法及び発光デバイスの製造方法 |
JP2011-147329 | 2011-07-01 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2013005493A1 true WO2013005493A1 (ja) | 2013-01-10 |
Family
ID=47436851
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2012/063318 WO2013005493A1 (ja) | 2011-07-01 | 2012-05-24 | 発光デバイス用セルの製造方法及び発光デバイスの製造方法 |
Country Status (5)
Country | Link |
---|---|
US (1) | US8993367B2 (ja) |
JP (1) | JP5724685B2 (ja) |
KR (1) | KR20140038455A (ja) |
TW (1) | TW201304213A (ja) |
WO (1) | WO2013005493A1 (ja) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5724684B2 (ja) * | 2011-07-01 | 2015-05-27 | 日本電気硝子株式会社 | 発光デバイス用セル及び発光デバイス |
KR102294837B1 (ko) * | 2013-08-16 | 2021-08-26 | 삼성전자주식회사 | 광학 부품을 제조하는 방법, 광학 부품, 및 그것을 포함하는 제품 |
JP6237355B2 (ja) * | 2014-03-07 | 2017-11-29 | 日本電気硝子株式会社 | ガラスセル、機能デバイス及び機能デバイスの製造方法 |
JP6221914B2 (ja) * | 2014-04-11 | 2017-11-01 | 日本電気硝子株式会社 | 発光デバイスの製造方法 |
WO2017002783A1 (ja) * | 2015-06-29 | 2017-01-05 | 富士フイルム株式会社 | 機能性フィルムおよび機能性フィルムの製造方法 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005093681A (ja) * | 2003-09-17 | 2005-04-07 | Toyoda Gosei Co Ltd | 発光装置 |
JP2008041626A (ja) * | 2006-08-10 | 2008-02-21 | Mimaki Denshi Buhin Kk | 色変換板 |
JP2008108835A (ja) * | 2006-10-24 | 2008-05-08 | Harison Toshiba Lighting Corp | 半導体発光装置及びその製造方法 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN100511732C (zh) | 2003-06-18 | 2009-07-08 | 丰田合成株式会社 | 发光器件 |
WO2009011922A1 (en) | 2007-07-18 | 2009-01-22 | Qd Vision, Inc. | Quantum dot-based light sheets useful for solid-state lighting |
TW201002126A (en) * | 2007-12-21 | 2010-01-01 | Du Pont | Encapsulation assembly for electronic devices |
US8568184B2 (en) * | 2009-07-15 | 2013-10-29 | Apple Inc. | Display modules |
-
2011
- 2011-07-01 JP JP2011147329A patent/JP5724685B2/ja not_active Expired - Fee Related
-
2012
- 2012-05-24 WO PCT/JP2012/063318 patent/WO2013005493A1/ja active Application Filing
- 2012-05-24 KR KR20137033093A patent/KR20140038455A/ko active IP Right Grant
- 2012-05-24 US US14/128,637 patent/US8993367B2/en not_active Expired - Fee Related
- 2012-06-26 TW TW101122863A patent/TW201304213A/zh unknown
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005093681A (ja) * | 2003-09-17 | 2005-04-07 | Toyoda Gosei Co Ltd | 発光装置 |
JP2008041626A (ja) * | 2006-08-10 | 2008-02-21 | Mimaki Denshi Buhin Kk | 色変換板 |
JP2008108835A (ja) * | 2006-10-24 | 2008-05-08 | Harison Toshiba Lighting Corp | 半導体発光装置及びその製造方法 |
Also Published As
Publication number | Publication date |
---|---|
JP5724685B2 (ja) | 2015-05-27 |
KR20140038455A (ko) | 2014-03-28 |
US20140162387A1 (en) | 2014-06-12 |
TW201304213A (zh) | 2013-01-16 |
JP2013016311A (ja) | 2013-01-24 |
US8993367B2 (en) | 2015-03-31 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP5737011B2 (ja) | 発光デバイス、発光デバイス用セル及び発光デバイスの製造方法 | |
JP5724684B2 (ja) | 発光デバイス用セル及び発光デバイス | |
JP5724685B2 (ja) | 発光デバイス用セルの製造方法及び発光デバイスの製造方法 | |
KR102362017B1 (ko) | 파장 변환 부재의 제조 방법 | |
WO2015174127A1 (ja) | 発光デバイス及びその製造方法 | |
WO2015190242A1 (ja) | 発光デバイス | |
TW201624775A (zh) | 用於發光二極體之顏色轉換基板及其製造方法 | |
WO2015160105A1 (ko) | 발광 다이오드의 색변환용 기판 및 그 제조방법 | |
JP2012186436A (ja) | 蛍光体封入用毛細管の製造方法及び波長変換部材の製造方法 | |
KR102040975B1 (ko) | 마이크로 led 디스플레이용 색변환 구조체의 제조 방법 | |
JP5701635B2 (ja) | 発光ダイオードの製造方法 | |
JP2018049185A (ja) | 波長変換部材及び発光装置 | |
WO2015194297A1 (ja) | 発光デバイス、波長変換部材及び波長変換部材の製造方法 | |
JP6015446B2 (ja) | 発光デバイス用セル、発光デバイス及び発光デバイス用セルの製造方法 | |
CN112567539A (zh) | 板状部件的制造方法和层叠体 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 12807190 Country of ref document: EP Kind code of ref document: A1 |
|
ENP | Entry into the national phase |
Ref document number: 20137033093 Country of ref document: KR Kind code of ref document: A |
|
WWE | Wipo information: entry into national phase |
Ref document number: 14128637 Country of ref document: US |
|
NENP | Non-entry into the national phase |
Ref country code: DE |
|
122 | Ep: pct application non-entry in european phase |
Ref document number: 12807190 Country of ref document: EP Kind code of ref document: A1 |