WO2013005285A1 - 吸着式ヒートポンプの制御方法、情報処理システム及び制御装置 - Google Patents
吸着式ヒートポンプの制御方法、情報処理システム及び制御装置 Download PDFInfo
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- WO2013005285A1 WO2013005285A1 PCT/JP2011/065259 JP2011065259W WO2013005285A1 WO 2013005285 A1 WO2013005285 A1 WO 2013005285A1 JP 2011065259 W JP2011065259 W JP 2011065259W WO 2013005285 A1 WO2013005285 A1 WO 2013005285A1
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
- H05K7/20936—Liquid coolant with phase change
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B17/00—Sorption machines, plants or systems, operating intermittently, e.g. absorption or adsorption type
- F25B17/08—Sorption machines, plants or systems, operating intermittently, e.g. absorption or adsorption type the absorbent or adsorbent being a solid, e.g. salt
- F25B17/083—Sorption machines, plants or systems, operating intermittently, e.g. absorption or adsorption type the absorbent or adsorbent being a solid, e.g. salt with two or more boiler-sorbers operating alternately
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B49/00—Arrangement or mounting of control or safety devices
- F25B49/04—Arrangement or mounting of control or safety devices for sorption type machines, plants or systems
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B49/00—Arrangement or mounting of control or safety devices
- F25B49/04—Arrangement or mounting of control or safety devices for sorption type machines, plants or systems
- F25B49/046—Operating intermittently
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20363—Refrigerating circuit comprising a sorber
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/20836—Thermal management, e.g. server temperature control
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02A—TECHNOLOGIES FOR ADAPTATION TO CLIMATE CHANGE
- Y02A30/00—Adapting or protecting infrastructure or their operation
- Y02A30/27—Relating to heating, ventilation or air conditioning [HVAC] technologies
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
- Y02B30/00—Energy efficient heating, ventilation or air conditioning [HVAC]
Definitions
- the present invention relates to a control method, an information processing system, and a control device for an adsorption heat pump.
- An object of the present invention is to provide an adsorption heat pump control method, an information processing system, and a control apparatus that can efficiently operate an adsorption heat pump even if the temperature of a heat source that supplies heat used for adsorbent regeneration is large.
- a control method for an adsorption heat pump that joins the heat medium discharged from a plurality of electronic devices and supplies the heat medium to the adsorption heat pump, the method being provided to the plurality of electronic devices
- a flow rate adjustment unit that can individually adjust the flow rate of the heat medium, a temperature sensor that individually detects the temperature of the heat medium discharged from the plurality of electronic devices, and a control unit are provided, and the output of the temperature sensor
- the control unit controls the flow rate adjustment unit so that the temperatures of the heat medium discharged from the plurality of electronic devices are the same.
- a transfer pump that transfers a heat medium, a branch portion that branches a flow path of the heat medium transferred from the transfer pump, and a flow path branched by the branch portion ,
- a plurality of electronic devices each having a heat medium flow path through which the heat medium flows, and a heat medium merged at the merge part
- An adsorption heat pump supplied to the plurality of electronic devices, a flow rate adjusting unit capable of individually adjusting a flow rate of the heat medium supplied to the plurality of electronic devices, and a temperature of the heat medium discharged from the plurality of electronic devices individually
- a control unit that inputs a signal from the temperature sensor and controls the flow rate adjustment unit so that the temperature of the heat medium discharged from the plurality of electronic devices is the same.
- a transfer pump that transfers a heat medium, a branch portion that branches a flow path of the heat medium transferred from the transfer pump, and a flow branched by the branch portion.
- a plurality of electronic devices each having a heat medium flow path through which the heat medium flows, and a heat merged at the merge part
- a control device for an electronic device system having individually detected temperature sensors, wherein the flow rate is set so that the temperature of the heat medium discharged from the plurality of electronic devices is the same by inputting a signal from the temperature sensor Control to control the adjustment unit Location is provided.
- the adsorption heat pump can be operated efficiently even if the temperature change of the heat source supplying the heat used for the regeneration of the adsorbent is large.
- FIG. 1 is a schematic diagram illustrating an example of an adsorption heat pump.
- FIG. 2 is a schematic diagram for explaining a control method of the adsorption heat pump according to the embodiment.
- FIG. 3 is a flowchart illustrating a process of adjusting the flow rate of the cooling water passing through the electronic device according to the temperature of the heat medium discharged from the electronic device.
- FIG. 4 is a flowchart illustrating a process of switching between the adsorption process and the regeneration process in accordance with the temperature of the heat medium (hot water) supplied to the adsorber.
- FIG. 5 is a graph showing the change over time in the temperature of the heat medium on the inlet side and the outlet side of the adsorber.
- FIG. 6 is a figure showing the outline of the control method of the adsorption heat pump concerning an embodiment.
- FIG. 7 is a diagram illustrating a problem when the flow rate of the heat medium flowing into the electronic device is the same.
- FIG. 8 is a diagram illustrating a problem when the adsorption process and the regeneration process are switched when the junction temperature of the CPU reaches the upper limit value.
- FIG. 9 is a diagram for explaining the outline of the apparatus used in the experiment.
- FIG. 10 is a diagram showing the results of examining the conditions under which the CPU junction temperature Tj does not exceed the upper limit value (75 ° C.), assuming that the load factor of the CPU of the server is 100%.
- FIG. 11 is a diagram summarizing the experimental conditions of cases 1 to 3.
- FIG. 11 is a diagram summarizing the experimental conditions of cases 1 to 3.
- FIG. 12 is a diagram showing the change over time of the temperature of the heat medium on the inlet side and the outlet side of the adsorber in case 1.
- FIG. 13 is a diagram showing the change over time in the temperature of the cooling water on the inlet side and the outlet side of the cooling water coil piping of the evaporator.
- 14 (a) to 14 (c) are graphs showing changes over time in the surface temperatures of the CPU and the heater in case 1.
- FIG. FIG. 15 is a diagram illustrating the change over time in the temperature of the heat medium on the heat medium discharge side of the server and the simulated server.
- FIG. 16 is a diagram showing a cold heat generation result under each condition of cases 1 to 3.
- FIG. 1 is a schematic diagram showing an example of an adsorption heat pump.
- the adsorption heat pump 10 includes an evaporator 11, a condenser 12 disposed above the evaporator 11, and an adsorber 13 a disposed in parallel between the evaporator 11 and the condenser 12. , 13b.
- the space in the adsorption heat pump 10 is decompressed to about 1/100 atm, for example.
- the evaporator 11 is provided with a cooling water coil pipe 11a through which the cooling water passes and a spray nozzle (not shown) for spraying a liquid refrigerant (for example, water) toward the cooling water coil pipe 11a.
- a liquid refrigerant for example, water
- a heat transfer pipe 14 and an adsorbent (desiccant) 15 are provided in each of the adsorbers 13a and 13b.
- An on-off valve 16 a is disposed between the adsorber 13 a and the evaporator 11
- an on-off valve 16 b is disposed between the adsorber 13 b and the evaporator 11.
- the adsorbent 15 for example, activated carbon, silica gel or zeolite is used.
- the condenser 12 is provided with a cooling water coil pipe 12a through which cooling water passes.
- An on-off valve 17a is disposed between the condenser 12 and the adsorber 13a, and an on-off valve 17b is disposed between the condenser 12 and the adsorber 13b.
- the on-off valve 16a between the evaporator 11 and the adsorber 13a and the on-off valve 17b between the adsorber 13b and the condenser 12 are both open. Further, it is assumed that the on-off valve 16b between the evaporator 11 and the adsorber 13b and the on-off valve 17a between the adsorber 13a and the condenser 12 are both closed.
- cooling water is supplied to the heat transfer pipe 14 of one adsorber 13a, and hot water heated by heat discharged from the electronic device is supplied to the heat transfer pipe 14 of the other adsorber 13b. To do. Furthermore, water is used as the refrigerant sprayed into the evaporator 11.
- the water vapor (gaseous refrigerant) generated in the evaporator 11 enters the adsorber 13a through the open on-off valve 16a. And it cools with the cooling water which passes the inside of the heat-transfer piping 14, returns to a liquid, and is adsorbed by the adsorbent 15 of the adsorber 13a.
- the regeneration process for regenerating (drying) the adsorbent 15 is performed in the other adsorber 13b. That is, in the adsorber 13 b, the refrigerant (water) adsorbed by the adsorbent 15 is heated by hot water passing through the heat transfer pipe 14 to become gas (water vapor) and is detached from the adsorbent 15. The refrigerant separated from the adsorbent 15 enters the condenser 12 through the open / close valve 17b.
- Cooling water is supplied to the cooling water coil pipe 12 a in the condenser 12.
- cooling water discharged from the adsorber 13a may be used.
- the water vapor (gaseous refrigerant) that has entered the condenser 12 from the adsorber 13b is condensed around the cooling water coil pipe 12a to become a liquid. This liquid is transferred to the evaporator 11 by a pump (not shown) and sprayed toward the cooling water coil pipe 11a.
- the adsorbers 13a and 13b perform an adsorption process and a regeneration process at regular intervals. That is, the on-off valves 16a, 16b, 17a, and 17b repeat opening and closing at regular intervals, and cooling water and hot water are alternately supplied to the heat transfer pipes 14 of the adsorbers 13a and 13b at regular intervals. In this way, the adsorption heat pump 10 operates continuously.
- the temperature of the hot water greatly varies depending on the operating state of the electronic equipment. For this reason, as described above, in the method of simply switching between the adsorption process and the regeneration process at regular time intervals, the adsorbent 15 is shifted to the adsorption process before it can be sufficiently regenerated, or conversely, the regeneration of the adsorbent 15 is completed. However, it may not be possible to move to the adsorption process. As a result, the operating efficiency of the adsorption heat pump 10 decreases.
- FIG. 2 is a schematic diagram for explaining a control method of the adsorption heat pump according to the embodiment. This embodiment will also be described with reference to FIG.
- the adsorption heat pump 10 includes an evaporator 11, a condenser 12, and adsorbers 13a and 13b.
- a cooling water coil pipe 11 a is disposed in the evaporator 11, and a cooling water coil pipe 12 a is disposed in the condenser 12.
- a heat transfer pipe 14 and an adsorbent 15 are arranged in the adsorbers 13a and 13b, respectively.
- the cooling water coil pipe 11 a of the evaporator 11 of the adsorption heat pump 10 is connected to the evaporator cooling water flow path 21.
- the evaporator cooling water flow path 21 is provided with a cooling water storage tank 31 in which cooling water is stored, and a pump 32 that circulates the cooling water between the cooling water storage tank 31 and the evaporator 11.
- the cooling water stored in the cooling water storage tank 31 is used, for example, for cooling an indoor air conditioner, an electronic device, a power source, or the like.
- the cooling water coil pipe 12 a of the condenser 12 is connected to the condenser cooling water flow path 22.
- the condenser cooling water flow path 22 is provided with a chiller unit 33 that circulates the cooling water with the condenser 12 while maintaining the temperature of the cooling water at a predetermined temperature.
- the adsorber cooling water flow path 34 is a flow path for supplying cooling water to the adsorbers 13a and 13b.
- the adsorber cooling water flow path 34 is provided with a chiller unit 35 that transfers the cooling water while keeping the temperature of the cooling water constant.
- the adsorber cooling water flow path 34 is provided with switching valves 36a and 36b. These switching valves 36a and 36b operate in response to a signal from the control unit 30 and switch the flow path so that the cooling water returns to the chiller unit 35 through one of the adsorbers 13a and 13b.
- the electronic device cooling water channel 37 is a channel that cools the electronic devices 41a, 41b, and 41c and supplies the adsorbers 13a and 13b with cooling water (hot water) whose temperature has increased.
- the electronic device cooling water flow path 37 is provided with a pump 38 and switching valves 39a and 39b.
- the cooling water passing through the electronic device cooling water flow path 37 is also referred to as a heat medium.
- a liquid other than water may be used as the heat medium.
- the heat medium discharged from the pump 38 is branched by the branching portion 40a, passes through a plurality (three in FIG. 2) of electronic devices 41a, 41b, and 41c, and cools the electronic devices 41a, 41b, and 41c. Then, the heat medium (hot water) whose temperature has increased by cooling the electronic devices 41a, 41b, and 41c is discharged from the electronic devices 41a, 41b, and 41c, and merges at the junction 40b.
- each of the electronic devices 41a, 41b, and 41c is equipped with one or more CPUs (Central Processing Unit), each of which is equipped with a cold plate, and the inside of the cold plate is heated. It is assumed that the medium passes.
- the CPU is an example of a semiconductor component, and other semiconductor components or other electronic components may be cooled with a heat medium.
- the switching valves 39a and 39b operate in response to a signal from the control unit 30 and switch the flow path so that the heat medium joined at the joining unit 40b returns to the pump 38 through one of the adsorbers 13a and 13b.
- the switching valves 36a and 36b of the adsorber cooling water flow path 34 and the switching valves 39a and 39b of the electronic device cooling water flow path 37 are driven exclusively. That is, when the adsorber 13a is connected to the adsorber cooling water channel 34, the adsorber 13b is connected to the electronic device cooling water channel 37, and when the adsorber 13b is connected to the electronic device cooling water channel 37, the adsorber. 13 b is connected to the adsorber cooling water flow path 34.
- control part 30 also performs switching of the on-off valves 16a, 16b, 17a, and 17b in the adsorption heat pump 10 simultaneously with switching of the switching valves 36a, 36b, 39a, and 39b.
- the cooling water passing through the condenser 12 is cooled by the chiller unit 33, but the cooling water discharged from the adsorber (adsorber 13 a or 13 b) that is performing the adsorption process is the condenser 12. You may make it return to the chiller unit 35 through.
- Temperature sensors 42a, 42b, 42c, flow control valves (proportional control valves) 43a, 43b, 43c, and flow meters 44a, 44b, 44c are provided on the heat medium inlet side of the electronic devices 41a, 41b, 41c, respectively. It has been.
- a pump capable of adjusting the flow rate may be arranged.
- the temperature measurement value of the heat medium by the temperature sensors 42a, 42b, and 42c and the flow rate measurement value of the heat medium by the flow meters 44a, 44b, and 44c are transmitted to the control unit 30. Further, the opening degree of the flow rate adjusting valves 43a, 43b, and 43c is changed by a signal from the control unit 30. A heat medium having a flow rate according to the opening degree of the flow rate adjusting valves 43a, 43b, and 43c flows through the electronic devices 41a, 41b, and 41c.
- Temperature sensors 45a, 45b, and 45c are disposed on the heat medium outlet side of the electronic devices 41a, 41b, and 41c, respectively. Temperature measurement values obtained by these temperature sensors 45 a, 45 b, 45 c are also transmitted to the control unit 30.
- the CPUs in the electronic devices 41a, 41b, and 41c have temperature sensors 46a, 46b, and 46c that detect junction temperatures, and the measured values of the junction temperatures by the temperature sensors 46a, 46b, and 46c are also included. It is transmitted to the control unit 30.
- a temperature sensor may be mounted on the surface of the CPU.
- temperature sensors 47a and 47b for detecting the temperature of the heat medium supplied to the heat transfer pipe 14 are provided at the inlets of the heat transfer pipe 14 of the adsorbers 13a and 13b. Temperature values measured by these temperature sensors 47 a and 47 b are also transmitted to the control unit 30.
- the control unit 30 is exemplified in FIG. 3 and FIG. 4 according to the temperature of the heat medium (hot water) discharged from each electronic device 41a, 41b, 41c and the temperature of the heat medium supplied to the adsorbers 13a, 13b. Perform processing simultaneously.
- the heat medium hot water
- FIG. 3 is a flowchart illustrating a process for adjusting the flow rate of the cooling water passing through each electronic device 41a, 41b, 41c according to the temperature of the heat medium discharged from each electronic device 41a, 41b, 41c.
- the adsorber 13a is connected to the electronic device cooling water flow path 37 via the switching valves 39a and 39b, and the adsorber 13b is connected to the adsorber cooling water flow path 34 via the switching valves 36a and 36b.
- step S11 the control unit 30 acquires the temperature of the heat medium discharged from the electronic devices 41a, 41b, and 41c, that is, the temperature measurement value by the temperature sensors 45a, 45b, and 45c.
- step S12 the control unit 30 determines whether or not the temperature of the heat medium discharged from each electronic device 41a, 41b, 41c is the same.
- the process returns to step S11 and continues.
- step S12 determines in step S12 that the temperatures of the heat medium discharged from the electronic devices 41a, 41b, and 41c are not the same
- the process proceeds to step S13.
- step S13 the control unit 30 adjusts the opening degree of the flow rate adjusting valves 43a, 43b, and 43c so that the temperature of the heat medium discharged from each electronic device 41a, 41b, and 41c becomes the same.
- the control unit 30 when adjusting the opening degree of the flow rate adjusting valves 43a, 43b, and 43c, the control unit 30 sets the flow rate adjusting valve based on the heat medium flow rate in the electronic device having the highest temperature of the discharged heat medium. The opening degree of 43a, 43b, 43c is determined.
- the temperature of the heat medium discharged from the electronic device 41a is higher than the temperature of the heat medium discharged from the other electronic devices 41b, 41c when the flow rate adjusting valves 43a, 43b, 43c have the same opening degree.
- the control unit 30 opens the flow rate adjustment valves 43b and 43c so that the temperature of the heat medium discharged from the other electronic devices 41b and 41c is the same as the temperature of the heat medium discharged from the electronic device 41a. Adjust the degree.
- FIG. 4 is a flowchart for explaining a process of switching between the adsorption process and the regeneration process in accordance with the temperature of the heat medium (hot water) supplied to the adsorbers 13a and 13b.
- step S21 the control unit 30 acquires the temperature of the heat medium supplied to the adsorber 13a performing the regeneration process from the temperature sensor 47a.
- step S22 the control unit 30 acquires the junction temperature of each CPU, that is, the temperature measurement value by the temperature sensors 46a, 46b, and 46c.
- step S23 the control unit 30 predicts the time (hereinafter referred to as “target arrival time”) for the temperature of the heat medium supplied to the adsorber 13a to reach a preset target temperature.
- the target temperature is a temperature required to regenerate the adsorbent 15 and is set according to the type of the adsorbent 15.
- a database is used for predicting the target arrival time.
- This database is created including the relationship between the CPU load factor, CPU junction temperature (or surface temperature), heat medium flow rate and heat medium temperature, and target arrival time, as will be described in an experimental example described later. Has been.
- the control unit 30 extracts the CPU having the highest load factor among the load factors of the CPUs mounted on the electronic devices 41a, 41b, and 41c. Then, referring to the database, the target arrival time is predicted from the load factor of the CPU.
- step S24 the control unit 30 makes the temperature of the heat medium supplied to the adsorber 13a reach the target temperature at the target arrival time, and the junction temperatures of all the CPUs exceed the above-described upper limit value.
- the discharge amount (total flow rate of the heat medium) of the pump 38 is adjusted so as not to be present.
- the aforementioned database is referred to for adjusting the discharge amount of the pump 38.
- step S25 the control unit 30 determines whether or not the temperature of the heat medium supplied to the adsorber 13a has reached the target temperature. If the determination is negative, the process returns to step S21 to continue the process.
- step S25 if it is determined in step S25 that the target temperature has been reached, the process proceeds to step S26.
- the control unit 30 drives the on-off valves 16a, 16b, 17a, 17b and the switching valves 36a, 36b, 39a, 39b to switch between the adsorption process and the regeneration process. Then, it returns to step S21 and repeats the above-mentioned process.
- junction temperature and surface temperature of the CPU can be estimated from the flow rate and temperature of the heat medium by using the database, the flow rate of the heat medium in each flow path is not directly measured.
- the adsorption process and the regeneration process can be switched by measuring the temperature.
- FIG. 5 is a diagram showing the change over time in the temperature of the heat medium on the inlet side (IN) and the outlet side (OUT) of the adsorbers 13a and 13b, with time on the horizontal axis and temperature on the vertical axis. .
- the electronic devices 41a to 41d Is supplied with a relatively low temperature heat medium (cooling water).
- This heat medium is gradually heated by the CPU (heat source) in the electronic devices 41a to 41d while circulating between the electronic devices 41a to 41d and the adsorption heat pump 10 (adsorber 13a or adsorber 13b). Rises. When the temperature of the heat medium reaches the target temperature (55 ° C. in this example), the regeneration process and the adsorption process are switched.
- FIG. 6 is a diagram showing an outline of the control method of the adsorption heat pump according to the present embodiment.
- four electronic devices 41a to 41d are arranged in the electronic device cooling flow path 37, and flow rate adjusting valves 43a to 43d are respectively provided on the heat medium inlet side of these electronic devices 41a to 41d. It is assumed that it is arranged.
- the junction temperature Tj of the CPU is equal to or lower than the upper limit value (75 ° C. in this example), and the temperature of the heat medium (warm water) on the heat medium outlet side of the electronic devices 41a to 41d is the same.
- the opening degree of each of the flow rate adjusting valves 43a to 41d and the flow rate of the pump 38 are adjusted.
- the power consumption of the electronic device 41a is 150W
- the power consumption of the electronic device 41b is 100W
- the power consumption of the electronic device 41c is 50W
- the power consumption of the electronic device 41d is 0W.
- the power consumption of each of the electronic devices 41a to 41d is related to the CPU load factor, and the power consumption increases as the CPU load factor increases.
- Each of the electronic devices 41a to 41d generates heat proportional to the power consumption.
- the flow rate of the heat medium flowing to the electronic device 41a is 1.0 L (liter) / min
- the flow rate of the heat medium flowing to the electronic device 41b is 0.6 L / min
- the flow rate of the heat medium flowing to the electronic device 41c is 0.3 L.
- the flow rate of the heat medium flowing through the electronic device 41d is 0 L / min.
- the temperature of the heat medium discharged from each operating electronic device is made the same by reducing the flow rate of the cooling water in the electronic device with less power consumption.
- a decrease in the temperature of the heat medium supplied to the adsorption heat pump 10 can be suppressed.
- the discharge amount of the pump 38 is adjusted so that the junction temperature of each CPU does not exceed the upper limit value, it is possible to avoid a malfunction or failure of the CPU.
- FIG. 7 is a diagram illustrating a problem when the flow rate of the heat medium flowing into the electronic devices 41a to 41d is the same.
- the adsorption process and the regeneration process are switched.
- the temperature of the heat medium discharged from each of the electronic devices 41a to 41d is the operating state of the electronic devices 41a to 41d.
- Dependent In this case, if switching between the adsorption process and the regeneration process is not performed until the temperature of the heat medium supplied to the adsorption heat pump 10 reaches 55 ° C., an electronic apparatus having a high CPU load factor (in the example of FIG. 7, an electronic apparatus is used). In 41a), the junction temperature of the CPU may exceed the upper limit (75 ° C.).
- FIG. 8 is a diagram for explaining a problem when the adsorption process and the regeneration process are switched when the junction temperature of the CPU reaches the upper limit value.
- the flow rate of the heat medium flowing into each of the electronic devices 41a to 41d is the same (1.0 L / min, and at least one of the plurality of CPUs has an upper junction temperature value (75 ° C.).
- the adsorption process and the regeneration process are switched, and in this case, the adsorption process and the regeneration process may be switched before the temperature of the heat medium supplied to the adsorption heat pump 10 is sufficiently increased.
- the temperature of the heat medium supplied to the adsorption heat pump 10 when the junction temperature Tj of the CPU of the electronic device 41a reaches 75 ° C. is 53.9 ° C. At this temperature, the adsorbent in the adsorbers 13a and 13b may not be sufficiently regenerated (dried).
- FIG. 9 is a diagram for explaining the outline of the apparatus used in the experiment.
- the same components as those in FIG. A chiller unit 51 is arranged in the evaporator cooling water flow path 21 instead of the cooling water storage tank and the pump 32 illustrated in FIG.
- the set temperature T L of the chiller unit 51 was 18 ° C.
- the set temperature T M of the chiller units 33 and 35 was 25 ° C.
- one server 53 (RX300 S6 manufactured by Fujitsu Limited) and two simulated servers 54 were used as electronic devices.
- the server 53 is equipped with two CPUs 55 fitted with cold plates, and the heat medium is discharged out of the server 53 through the cold plates in order.
- Temperature sensors 61 for measuring the temperature of the heat medium are disposed on the heat medium inlet side and the outlet side of the cold plate attached to the CPU 55, respectively.
- a temperature sensor 62 that measures the surface temperature of the CPU 55 is disposed between the CPU 55 and the cold plate.
- the simulated server 54 On the other hand, in the simulated server 54, three ceramic heaters 56 (MS-1000 manufactured by Sakaguchi Electric Heat Co., Ltd.) were arranged in place of the CPU, and cold plates were also attached to these heaters 56. The heat medium is discharged out of the simulation server 54 through the cold plates in order.
- the simulated server 54 is also provided with a temperature sensor 61 that measures the temperature of the heat medium on the heat medium inlet side and the outlet side of the cold plate attached to each heater 56, and a temperature sensor 63 that measures the temperature of the heater 56. .
- the size of the adsorption heat pump 10 used in the experiment is 450 mm ⁇ 200 mm ⁇ 500 mm, and the inside is reduced to about 1/100 atm.
- a heat exchanger having a size of 120 mm ⁇ 240 mm ⁇ 30 mm was disposed in the evaporator 11, the condenser 12, and the adsorbers 13 a and 13 b of the adsorption heat pump 10. Fins are provided at a pitch of 1 mm in pipes (cooling water pipes or heat transfer pipes) in these heat exchangers.
- the heat exchangers of the adsorbers 13a and 13b are filled with activated carbon (manufactured by Kureha Corporation) having a particle diameter of 400 ⁇ m as an adsorbent.
- the adsorption heat pump 10 is filled with 400 g of water as a refrigerant.
- CPU 1 is a CPU disposed upstream in the heat medium flow direction
- CPU 2 is a CPU disposed downstream in the heat medium flow direction.
- the junction temperature Tj of the CPU 2 exceeds the upper limit value, and when the flow rate of the heat medium is 1.3 L / min or more, the junction temperature Tj of the CPUs 1 and 2 is reached. Does not reach the upper limit.
- the temperature of the heat medium (warm water) discharged from the server 53 becomes the target temperature (55 ° C.) when the junction temperature Tj of the CPU 2 reaches the upper limit value.
- the temperature difference ⁇ T of the heat medium between the heat medium inlet side and the outlet side of the server 53 was 1.9 ° C.
- the surface temperature of the CPU 2 was 61 ° C.
- the time from the start of flow until the junction temperature of the CPU 2 reaches the upper limit was about 1300 seconds.
- the flow rate of the heat medium flowing through each simulation server 54 was controlled so that the temperature difference ⁇ T of the heat medium between the heat medium inlet side and the outlet side of the simulation server 54 became 1.9 ° C.
- the total output of the ceramic heater 56 was set to 460 W (case 1), 360 W (case 2), or 270 W (case 3), and the adsorption heat pump 10 was operated. The conditions at this time are collectively shown in FIG.
- FIG. 12 shows changes over time in the temperature of the heat medium on the inlet side (IN) and the outlet side (OUT) of the adsorbers 13a and 13b in case 1.
- FIG. 13 shows changes with time of the temperature of the cooling water on the inlet side (IN) and the outlet side (OUT) of the cooling water coil pipe 11a of the evaporator 11.
- FIG. 13 shows that a temperature difference always occurs between the inlet side (IN) and the outlet side (OUT) of the cooling water coil pipe 11a of the evaporator 11 during the regeneration process. This means that a cold output is continuously obtained.
- FIGS. 14 (a) to 14 (c) show changes over time in the surface temperatures of the CPU and the heater in case 1.
- the heater 1 is a heater arranged on the upstream side in the heat medium flow direction among the three heaters mounted on the simulation server 54 (simulation servers 1 and 2).
- the heater 2 is a heater arranged in the center, and the heater 3 is a heater arranged on the downstream side.
- the surface temperature of the heat source (CPU or heater) can be maintained at 61 ° C. or lower in both the server and the simulated servers 1 and 2.
- FIG. 15 is a diagram showing the change over time in the temperature of the heat medium on the heat medium discharge side of the server and the simulated server. As shown in FIG. 15, the heat medium temperature on the heat medium discharge side of the server and the simulated server changes in the same manner.
- FIG. 16 is a diagram showing the results of cold heat generation under the conditions of cases 1 to 3 described above. As shown in FIG. 16, even if the output of the heat source changes, a cold output is obtained under all conditions, and even if the output of the server (electronic device) fluctuates, the upper limit value of the junction temperature is not exceeded. A stable cold output was obtained. In all cases 1 to 3, the coefficient of performance (COP) was as good as 0.57 to 0.59.
- a similar experiment may be performed by changing the CPU load factor, and the optimum condition may be stored in the control unit 30 as a database for each CPU load factor.
- the adsorption heat pump 10 can be operated more efficiently according to the change in the CPU load factor.
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Abstract
Description
図2は、実施形態に係る吸着式ヒートポンプの制御方法を説明する模式図である。なお、本実施形態においても、図1を参照して説明する。
以下、実施形態に係る吸着式ヒートポンプの制御方法の効果を実験により確認した結果について説明する。
Claims (17)
- 複数の電子機器から排出される熱媒体を合流させて吸着式ヒートポンプに供給する吸着式ヒートポンプの制御方法であって、
前記複数の電子機器に供給される前記熱媒体の流量を個別に調整可能な流量調整部と、前記複数の電子機器から排出される前記熱媒体の温度を個別に検出する温度センサと、制御部とを設け、
前記温度センサの出力に基づいて、前記制御部が前記複数の電子機器から排出される前記熱媒体の温度が同じになるように前記流量調整部を制御することを特徴とする吸着式ヒートポンプの制御方法。 - 前記吸着式ヒートポンプは、液体の冷媒を気体に替える蒸発器と、前記気体の冷媒を吸着する吸着剤が配置された第1の吸着器及び第2の吸着器とを有し、
前記制御部は、前記吸着式ヒートポンプに供給される前記熱媒体の温度が予め設定された目標温度になるたびに切替バルブを制御して、前記熱媒体を前記第1の吸着器及び前記第2の吸着器に交互に通流させることを特徴とする請求項1に記載の吸着式ヒートポンプの制御方法。 - 前記制御部は、前記電子機器に搭載された半導体部品のジャンクション温度又は表面温度が予め設定された上限値を超えないように、前記複数の電子機器に供給される前記熱媒体の総流量を制御することを特徴とする請求項2に記載の吸着式ヒートポンプの制御方法。
- 前記制御部は、前記半導体部品の負荷率に応じて前記複数の電子機器に供給される前記熱媒体の総流量を制御することを特徴とする請求項3に記載の吸着式ヒートポンプの制御方法。
- 前記制御部は、前記ヒートポンプに供給される前記熱媒体の温度が前記目標温度に到達するときに前記半導体部品のジャンクション温度又は表面温度が前記上限値に到達するように、前記複数の電子機器に供給される前記熱媒体の総流量を制御することを特徴とする請求項3に記載の吸着式ヒートポンプの制御方法。
- 熱媒体を移送する移送ポンプと、
前記移送ポンプから移送された前記熱媒体の流路を分岐する分岐部と、
前記分岐部で分岐された流路が合流する合流部と、
前記分岐部と前記合流部との間にそれぞれ配置されて前記熱媒体が通流する熱媒体流路を備えた複数の電子機器と、
前記合流部で合流した熱媒体が供給される吸着式ヒートポンプと、
前記複数の電子機器に供給される前記熱媒体の流量を個別に調整可能な流量調整部と、
前記複数の電子機器から排出される前記熱媒体の温度を個別に検出する温度センサと、
前記温度センサから信号を入力し、前記複数の電子機器から排出される前記熱媒体の温度が同じとなるように前記流量調整部を制御する制御部と
を有することを特徴とする情報処理システム。 - 前記吸着式ヒートポンプは、
液体の冷媒を気体に替える蒸発器と、
前記気体の冷媒を吸着する吸着剤が配置された第1の吸着器及び第2の吸着器とを有し、
前記制御部は、前記合流部で合流した前記熱媒体が予め設定された目標温度になるたびに切替バルブを制御して前記熱媒体を前記第1の吸着器及び前記第2の吸着器に交互に通流させることを特徴とする請求項6に記載の情報処理システム。 - 前記制御部は、前記電子機器に搭載された半導体部品のジャンクション温度又は表面温度が予め設定された上限値を超えないように、前記複数の電子機器に供給される前記熱媒体の総流量を制御することを特徴とする請求項7に記載の情報処理システム。
- 前記制御部は、前記半導体部品の負荷率に応じて前記複数の電子機器に供給される前記熱媒体の総流量を制御することを特徴とする請求項8に記載の情報処理システム。
- 前記制御部は、前記合流部で合流した前記熱媒体が予め設定された目標温度に到達するときに前記半導体部品のジャンクション温度又は表面温度が前記上限値に到達するように、前記複数の電子機器に供給される前記熱媒体の総流量を制御することを特徴とする請求項8に記載の情報処理システム。
- 前記制御部は、前記半導体部品の負荷率のデータと、前記電子機器を通流する前記熱媒体の流量のデータと、前記電子機器の熱媒体入口側及び出口側における熱媒体の温度差のデータとを含むデータベースを記憶していることを特徴とする請求項8に記載の情報処理システム。
- 熱媒体を移送する移送ポンプと、
前記移送ポンプから移送された前記熱媒体の流路を分岐する分岐部と、
前記分岐部で分岐された流路が合流する合流部と、
前記分岐部と前記合流部との間にそれぞれ配置されて前記熱媒体が通流する熱媒体流路を備えた複数の電子機器と、
前記合流部で合流した熱媒体が供給される吸着式ヒートポンプと、
前記複数の電子機器に供給される前記熱媒体の流量を個別に調整可能な流量調整部と、
前記複数の電子機器から排出される前記熱媒体の温度を個別に検出する温度センサとを有する情報処理システムの制御装置であって、
前記温度センサから信号を入力し、前記複数の電子機器から排出される前記熱媒体の温度が同じとなるように前記流量調整部を制御することを特徴とする制御装置。 - 前記合流部で合流した前記熱媒体が予め設定された目標温度になるたびに切替バルブを制御して前記熱媒体を前記吸着式ヒートポンプ内の第1の吸着器及び第2の吸着器に交互に通流させることを特徴とする請求項12に記載の制御装置。
- 前記電子機器に搭載された半導体部品のジャンクション温度又は表面温度が予め設定された上限値を超えないように、前記複数の電子機器に供給される前記熱媒体の総流量を制御することを特徴とする請求項13に記載の制御装置。
- 前記半導体部品の負荷率に応じて前記複数の電子機器に供給される前記熱媒体の総流量を制御することを特徴とする請求項14に記載の制御装置。
- 前記合流部で合流した前記熱媒体が予め設定された目標温度に到達するときに前記半導体部品のジャンクション温度又は表面温度が前記上限値に到達するように、前記複数の電子機器に供給される前記熱媒体の総流量を制御することを特徴とする請求項14に記載の制御装置。
- 前記半導体部品の負荷率のデータと、前記電子機器を通流する前記熱媒体の流量のデータと、前記電子機器の熱媒体入口側及び出口側における熱媒体の温度差のデータとを含むデータベースを記憶していることを特徴とする請求項14に記載の制御装置。
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EP11868987.6A EP2730860B1 (en) | 2011-07-04 | 2011-07-04 | Method for controlling adsorption heat pump, information processing system, and control device |
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CN113853094A (zh) * | 2020-06-28 | 2021-12-28 | 鸿富锦精密电子(天津)有限公司 | 数据中心冷却系统及控制该系统的冷却方法 |
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