WO2012169384A1 - Composition de résine pour masque d'électrodéposition et circuit imprimé multicouche - Google Patents

Composition de résine pour masque d'électrodéposition et circuit imprimé multicouche Download PDF

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Publication number
WO2012169384A1
WO2012169384A1 PCT/JP2012/063669 JP2012063669W WO2012169384A1 WO 2012169384 A1 WO2012169384 A1 WO 2012169384A1 JP 2012063669 W JP2012063669 W JP 2012063669W WO 2012169384 A1 WO2012169384 A1 WO 2012169384A1
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WO
WIPO (PCT)
Prior art keywords
plating resist
wiring board
resin
printed wiring
resin composition
Prior art date
Application number
PCT/JP2012/063669
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English (en)
Japanese (ja)
Inventor
柴田　大介
邑田　勝人
Original Assignee
太陽ホールディングス株式会社
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Filing date
Publication date
Application filed by 太陽ホールディングス株式会社 filed Critical 太陽ホールディングス株式会社
Publication of WO2012169384A1 publication Critical patent/WO2012169384A1/fr

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0166—Polymeric layer used for special processing, e.g. resist for etching insulating material or photoresist used as a mask during plasma etching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
    • H05K3/0032—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material
    • H05K3/0038—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material combined with laser drilling through a metal layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0047—Drilling of holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards

Definitions

  • the present invention relates to a resin composition for plating resist and a multilayer printed wiring board, and more specifically, the through hole is divided by the resin composition for plating resist useful for forming a partial through hole and the partial plating resist in the through hole.
  • the present invention relates to a multilayer printed wiring board having a partial through hole.
  • a printed wiring board is a circuit board in which a conductor pattern for connecting parts is formed by printing on the surface of an insulating substrate, or on the surface and inside, and electronic components are arranged at predetermined locations. Soldering is performed.
  • a conductor pattern for connecting parts is formed by printing on the surface of an insulating substrate, or on the surface and inside, and electronic components are arranged at predetermined locations. Soldering is performed.
  • Multi-layer printed wiring boards are laminated with insulating layers composed of insulating resin and conductor layers printed with conductor patterns alternately in order to cope with increased mounting density of components and complicated circuit wiring. It has been done.
  • the plurality of conductor layers penetrate through the layers and are connected by through holes plated with a conductive material.
  • the through-hole is formed by laminating an insulating layer and a conductor layer, drilling a hole with a drill or the like, and then plating, and the entire through-hole is plated with a conductive substance by the plating process.
  • conductive material is plated up to the part unnecessary for the connection of the desired conductor layer, which may interfere with the integrity of signal transmission, and it is more complicated by dividing the through hole.
  • Patent Document 1 discloses a multilayer printed wiring board having a subcomposite structure having a nonconductive dielectric layer sandwiched between conductive layers, the conductive layer including a gap filled with a plating resist, Discloses a multilayer printed wiring board in which a via structure divided by plating a conductive material on a portion without the plating resist is formed.
  • the plating resist in Patent Document 1 is a hydrophobic insulating material such as silicon resin, polyethylene resin, fluorocarbon resin, polyurethane resin, and acrylic resin. In Patent Document 1, it is said that the hydrophobic insulating material exerts a plating resist action by preventing the catalyst species necessary for plating from being deposited.
  • Patent Document 1 does not describe an example in which a plating resist is manufactured, and it is unclear whether a good result can be actually obtained. In addition, a problem is pointed out in terms of reliability during long-term use because of the adhesion between the hydrophobic insulating material used and the conductive layer or non-conductive dielectric layer. Further, in Patent Document 1, it is said that the deposition of the catalyst seed (seed) is prevented by the hydrophobicity of the plating resist. However, the deposition cannot be completely prevented, and the post-treatment is performed when a small amount of deposition occurs. It is disclosed that residual deposits need to be removed by operation. Therefore, further improvement of the plating resist in the hole has been demanded.
  • an object of the present invention is to provide a plating resist resin composition useful for forming a partial through hole and a multilayer printed wiring board having a partial through hole in which the through hole is divided by using this composition.
  • the resin composition for plating resist of the present invention is a resin composition for plating resist used as a part of an interlayer insulating layer of a multilayer printed wiring board in which interlayer insulating layers and conductor layers are alternately laminated.
  • the resin composition excluding the solvent contains 30 to 90% by mass of titanium oxide.
  • the resin composition for a plating resist of the present invention preferably contains an epoxy resin and a phenol resin as resin components.
  • the resin composition for plating resist of the present invention is a resin composition for plating resist used as a part of an interlayer insulating layer of a multilayer printed wiring board in which interlayer insulating layers and conductor layers are alternately laminated. And 30 to 90% by mass of titanium oxide based on the resin solid content.
  • the resin composition for a plating resist of the present invention preferably contains an epoxy resin and a phenol resin as resin components.
  • the multilayer printed wiring board according to the present invention is the multilayer printed wiring board in which the interlayer insulating layers and the conductor layers are alternately laminated, and the layers are electrically connected through the through holes. At least one of the interlayer insulating layer and the conductor layer is provided.
  • a cured product layer of a resin composition for a plating resist containing 30 to 90% by mass of titanium oxide based on the resin solid content is formed in a portion exposed to the through hole between layers, and the through hole is partially plated through. It constitutes a hall.
  • the through hole has a partially plated through hole structure in which portions other than the plating resist portion are plated with copper.
  • the resin composition for plating resist includes an epoxy resin and a phenol resin as resin components.
  • the content of titanium oxide is preferably 30 to 90 parts by mass with respect to 100 parts by mass of the cured product of the resin composition for plating resist.
  • the method for producing a multilayer printed wiring board according to the present invention includes a step of multilayering by heating and pressing a wiring substrate having a plating resist layer containing titanium oxide at a predetermined position on a substrate on which circuit wiring is formed. , Forming a through-hole opening with a drill or a laser so as to penetrate the plating resist portion for the multilayered wiring board; and A process of performing desmear treatment; A process of plating, It is characterized by providing.
  • the present invention it is possible to provide a plating resist resin composition useful for forming a partial through hole and a multilayer printed wiring board having a partial through hole in which the through hole is divided using this composition.
  • a plating resist resin composition useful for forming a partial through hole and a multilayer printed wiring board having a partial through hole in which the through hole is divided using this composition.
  • FIG. 1 is a schematic cross-sectional view showing a through-hole formation process of a printed wiring board using the resin composition for a plating resist of the present invention.
  • FIG. 2 is a schematic cross-sectional view showing a through hole forming process of a conventional printed wiring board.
  • the resin composition for a plating resist of the present invention is a resin composition for a plating resist used as a part of an interlayer insulating layer of a multilayer printed wiring board in which an interlayer insulating layer and a conductor layer are alternately laminated. It is characterized by containing 30 to 90% by mass of titanium oxide based on the solid content.
  • the multilayer printed wiring board of the present invention is characterized in that a through-hole is provided with a plating resist portion formed by curing a resin composition for plating resist containing titanium oxide.
  • FIG. 1 (A) a wiring board having a conductor layer and an insulating layer and a wiring board coated and dried with the resin composition for plating resist of the present invention are heated and pressed through a prepreg. A multilayer printed wiring board such as 1 (B) is produced.
  • FIG. 1 (C) a through hole opening is formed with a drill as shown in FIG. 1 (C)
  • desmear treatment is performed, and then electroless / electrolytic copper plating is performed, a through hole is formed as shown in FIG. 1 (D). Is done.
  • FIG. 1C shows a state in which the drill returns upward after penetrating the drill. The same applies to FIG. 2C below.
  • the plating resist portion formed by curing the resin composition for plating resist of the present invention is exposed on the inner wall of the through hole, and the plating hole is not plated on the surface of the plating resist portion. It is divided and a partial through hole can be formed.
  • the partial (plating) through hole is a through hole in which the through hole is electrically divided by a plating resist portion existing in the through hole.
  • FIG. 2 (A) the printed wiring boards not coated with the resin composition for plating resist of the present invention are heated and pressed through a prepreg, as shown in FIG. 2 (B). A conventional multilayer printed wiring board is produced.
  • electroless / electrolytic copper plating is performed, as shown in FIG. 2 (D). The whole is plated and a through hole is formed.
  • each component will be specifically described.
  • the resin composition for plating resist according to the present invention is a resin composition containing titanium oxide.
  • titanium oxide acts as a plating resist by inhibiting the activity of catalyst nuclei such as palladium necessary for plating.
  • known ones can be used, and any of anatase type, rutile type, and brucite type may be used.
  • the content of titanium oxide in the plating resist resin composition is 30 to 90% by mass, preferably 40 to 80% by mass in the resin composition excluding the solvent. If it is less than 30% by mass, plating may be deposited, and if it exceeds 90% by mass, it may be difficult to adjust to a paste or to print.
  • the content of titanium oxide in the plating resist in the printed wiring board according to the present invention is preferably 30 to 90 parts by mass with respect to 100 parts by mass of the cured product obtained by curing the resin composition for plating resist. 40 to 80 parts by mass is more preferable.
  • any resin can be used as long as it is used as an insulating layer in a multilayer printed wiring board.
  • a resin include a thermosetting resin, a thermoplastic resin, and a photosensitive resin. These resins may be used alone or in combination of two or more.
  • thermosetting resin examples include an epoxy resin, a polyimide resin, a phenol resin, and a thermosetting polyphenylene ether (PPE).
  • epoxy resin examples include cresol novolac type resin, bisphenol A type epoxy resin, bisphenol F type epoxy resin, phenol novolac type epoxy resin, alkylphenol novolak type epoxy resin, biphenol F type epoxy resin, naphthalene type epoxy resin, dicyclopentadiene.
  • polyimide resin examples include polyimide “Rika Coat SN20” and “Rika Coat PN20” manufactured by Shin Nippon Rika Co., Ltd.
  • a linear polyimide obtained by reacting a bifunctional hydroxyl group-terminated polybutadiene, a diisocyanate compound and a tetrabasic acid anhydride JP 2006-37083 A
  • a polysiloxane skeleton-containing polyimide JP 2002-12667 A
  • modified polyimides such as JP-A 2000-319386).
  • phenol resin examples include novolac type phenol resins such as phenol novolak resin, cresol novolak resin, bisphenol A novolak resin, unmodified resole phenol resin, oil-modified resole phenol resin modified with paulownia oil, linseed oil, walnut oil, etc.
  • novolac type phenol resins such as phenol novolak resin, cresol novolak resin, bisphenol A novolak resin, unmodified resole phenol resin, oil-modified resole phenol resin modified with paulownia oil, linseed oil, walnut oil, etc.
  • Type phenol resin biphenyl aralkyl type phenol resin and the like.
  • the phenol resin can also be used as a curing agent for a thermosetting resin.
  • thermosetting polyphenylene ether reactive functional groups such as carboxyl group, epoxy group, amino group, hydroxyl group, and anhydrous dicarboxyl group may be grafted or copolymerized on a part or all of polyphenylene ether or polyphenylene ether.
  • reactive functional groups such as carboxyl group, epoxy group, amino group, hydroxyl group, and anhydrous dicarboxyl group may be grafted or copolymerized on a part or all of polyphenylene ether or polyphenylene ether. Examples include modified polyphenylene ether introduced.
  • thermosetting resin when used, it is preferable to contain a curing agent.
  • the curing agent include imidazole-based curing agents such as 2-ethyl-4-methylimidazole (2E4MZ), 2-phenylimidazole (2PZ), 2-phenyl-4-methyl-5-hydroxymethylimidazole (2P4MHZ), diethylenetriamine, Amine-based curing agents such as triethylenetetramine, tetraethylenepentamine, pentaethylenehexamine, metaxylenediamine, isophoronediamine, norbornenediamine, 1,3-bisaminomethylcyclohexane, N-aminoethylpiperazine, polyamide, vinylphenol, aralkyl Type phenol resins, phenol phenyl aralkyl resins, phenol biphenyl aralkyl resins, etc., phenolic curing agents, phthalic anhydride, tetrahydrophthalic acid, hexa
  • the content of the curing agent is preferably 0.5 to 20 parts by mass with respect to 100 parts by mass of the thermosetting resin component. If the amount of the curing agent is less than 0.5 parts by mass, the resin composition may be insufficiently cured, and even if the amount exceeds 20 parts by mass, an effect commensurate with the amount may not be obtained.
  • Thermoplastic resins include fluororesins such as polytetrafluoroethylene (PTFE), polyethylene terephthalate (PET), polysulfone (PSF), polyphenylene sulfide (PPS), thermoplastic polyphenylene ether (PPE), polyether sulfone (PES). ), Polyetherimide (PEI), polyphenylene sulfone (PPES), tetrafluoroethylene hexafluoropropylene copolymer (FEP), tetrafluoroethylene perfluoroalkoxy copolymer (PFA), polyethylene naphthalate (PEN) , Polyether ether ketone (PEEK), polyolefin resin and the like can be used.
  • fluororesins such as polytetrafluoroethylene (PTFE), polyethylene terephthalate (PET), polysulfone (PSF), polyphenylene sulfide (PPS), thermoplastic polyphenylene ether
  • a resin composite can also be used.
  • an epoxy resin-PES, an epoxy resin-PSF, an epoxy resin-PPS, an epoxy resin-PPES, etc. can be used as a resin composite of a thermosetting resin and a thermoplastic resin.
  • Examples of the photosensitive resin include photosensitive polyimide obtained by adding a photosensitive group to the polyimide precursor (a).
  • Examples of the photosensitive polyimide include JP-A-54-145794, JP-B-55-030207, JP-B-55-041422, JP-A-59-160140, JP-A-03-170547, Examples thereof include those described in JP-A-03-186847, JP-A-61-118424, JP-A-11-52569, JP-A-10-316751, and JP-A-6-295063.
  • the resin composition for plating resist according to the present invention preferably contains a thermosetting resin, and more preferably contains an epoxy resin or a phenol resin.
  • the resin composition may further contain a solvent, a diluent, a curing accelerator, a thickener, an antifoaming agent, a leveling agent, a coupling agent, a flame retardant, a photopolymerization initiator, and the like as necessary. Good.
  • the through-hole opening is formed so as to penetrate the plating resist portion.
  • a through hole is formed by plating the through hole opening.
  • the partial through hole is obtained by electrically dividing the through hole by the plating resist portion.
  • the conductor layer in the multilayer printed wiring board of the present invention is a circuit pattern formed of a conductor such as copper, nickel, tin, gold, or an alloy thereof.
  • the circuit pattern can be formed by any known method, for example, a subtractive method or an additive method.
  • the interlayer insulating layer in the multilayer printed wiring board of the present invention may be composed of any material as long as it is used as an insulating layer of the multilayer printed wiring board, preferably a resin composition Is obtained by curing.
  • the resin composition may be a liquid or a sheet.
  • the multilayer printed wiring board of the present invention may have a core substrate.
  • the core substrate is a substrate serving as a base for forming the conductive layer and the interlayer insulating layer in the multilayer printed wiring board, and serves as a core material.
  • the material serving as the base of the core substrate include glass epoxy materials, ceramics, and metal core substrates obtained by impregnating a glass cloth or the like with a thermosetting resin such as an epoxy resin.
  • plating In the multilayer printed wiring board of the present invention, portions other than the plating resist in the opening for through holes are coated with a conductive substance by plating.
  • the plating process is performed by electroless plating, and if necessary, electrolytic plating may be further performed thereafter.
  • the catalyst core for electroless plating include palladium, tin, silver, gold, platinum, copper and nickel, or a combination thereof, preferably palladium.
  • the electroless plating include electroless copper plating, electroless nickel plating, electroless nickel-tungsten alloy plating, electroless tin plating, and electroless gold plating, and electroless copper plating is preferable.
  • the thickness of the electroless plating is preferably 0.1 to 5 ⁇ m.
  • a method for producing a multilayer printed wiring board according to the present invention includes a wiring substrate having a plating resist layer formed by applying and drying a plating resist resin composition containing titanium oxide at a predetermined position on a substrate on which circuit wiring is formed. For example, a step of multilayering by heating and pressing through an epoxy prepreg, and a step of forming a through-hole opening by a drill or a laser so as to penetrate the plating resist portion for the multilayered wiring board, The method includes a step of performing a desmear process and a step of performing a plating process.
  • the prepreg is a sheet obtained by impregnating a base material such as a glass cloth with a varnish such as an epoxy resin composition, a bismaleimide triazine resin composition, a polyimide resin composition, etc., and then drying by heating and semi-curing it.
  • a varnish such as an epoxy resin composition, a bismaleimide triazine resin composition, a polyimide resin composition, etc.
  • Hitachi Chemical Examples include MCL-E-67, MCL-I-671, and the like.
  • Heating press The heating press can be performed using a known method.
  • the pressing conditions are preferably 20 to 60 kg / cm 2 at 150 to 200 ° C.
  • the desmear treatment can be performed by a known method. For example, it can be carried out using an oxidizing agent composed of an aqueous solution such as chromic acid or permanganate, or may be treated by oxygen plasma, a mixed plasma of CF 4 and oxygen, corona discharge, or the like.
  • an oxidizing agent composed of an aqueous solution such as chromic acid or permanganate, or may be treated by oxygen plasma, a mixed plasma of CF 4 and oxygen, corona discharge, or the like.
  • Circoposit MLB conditioner 211 Rohm and Haas, 200 ml / l
  • Circoposit Z Rosm and Haas, 100 ml / l
  • Circposit MLB promoter 213A Circposit and Haas, 100 ml / l
  • Circposit MLB promoter 213B Circposit MLB promoter 213B
  • cleaner conditioner process After desmear treatment, as a cleaner conditioner process, it is immersed in cleaner securigant P500 (manufactured by Atotech, 40 ml / l) at 50 ° C. for 5 minutes, and then as a pre-dip process, pre-dip neogant B (manufactured by Atotech, 20 ml / l) And a mixture of sulfuric acid (1 ml / l) at 25 ° C.
  • cleaner securigant P500 manufactured by Atotech, 40 ml / l
  • pre-dip neogant B manufactured by Atotech, 20 ml / l
  • sulfuric acid (1 ml / l
  • activator Neogant 834 Conch (Atotech, 40 ml / l) and sodium hydroxide (4 g / l)
  • activator Neogant 834 Conch (Atotech, 40 ml / l) and sodium hydroxide (4 g / l)
  • reducer Neogant WA manufactured by Atotech, 5 ml / l
  • boric acid 25 g / l
  • Basic Solution Print Gantt MSK manufactured by Atotech, 80 l / l
  • Copper Solution Print Gantt MSK Atotech, 40 ml / l
  • Reducer Cu Atotech, 14 ml / l
  • Stabilizer Print Gantt MSK Atotech, 3 ml / l It was immersed at 10 ° C. for 10 minutes, and then dried at 100 ° C. for 30 minutes with a hot air circulating dryer.
  • the pickling cleaner is immersed in a mixed solution of pickling cleaner FR (manufactured by Atotech, 100 ml / l) and sulfuric acid (100 ml / l) for 1 minute at 30 ° C. It was immersed in sulfuric acid (100 ml / l) at 25 ° C. for 1 minute, and finally copper (II) sulfate pentahydrate (80 ml / l), sulfuric acid (200 ml / l), chlorine (50 mg / l) as a copper sulfate electroplating step.
  • pickling cleaner FR manufactured by Atotech, 100 ml / l
  • sulfuric acid 100 ml / l
  • sulfuric acid 100 ml / l
  • sulfuric acid 100 ml / l
  • chlorine 50 mg / l
  • An additive Kaparaside HL (manufactured by Atotech, 10 ml / l) and a correction agent Kaparaside GS (manufactured by Atotech, 0.1 ml / l) are immersed at 23 ° C. for 60 minutes (current density 1 A / dm 2 ). Then, it was dried at 150 ° C. for 60 minutes with a hot air circulating dryer.
  • ⁇ The resist portion in the through hole is not plated.
  • ⁇ The resist portion in the through hole is partially plated.
  • X The resist part in a through hole is plated.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

L'invention concerne une composition de résine pour un masque d'électrodéposition qui est avantageuse pour former des trous traversants partiels, et un circuit imprimé multicouche qui possède un trou traversant partiel obtenu en divisant un trou traversant en utilisant la composition. La composition de résine pour un masque d'électrodéposition est utilisée en tant que portion d'une couche d'isolation inter-couches d'un circuit imprimé multicouche obtenu en appliquant alternativement des couches d'isolation inter-couches et des couches conductrices, et elle est caractérisée en ce qu'elle contient 30 à 90 % massiques d'oxyde de titane par rapport aux résines solides.
PCT/JP2012/063669 2011-06-07 2012-05-28 Composition de résine pour masque d'électrodéposition et circuit imprimé multicouche WO2012169384A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2011-127444 2011-06-07
JP2011127444A JP2012256636A (ja) 2011-06-07 2011-06-07 めっきレジスト用樹脂組成物および多層プリント配線板

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WO2012169384A1 true WO2012169384A1 (fr) 2012-12-13

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Publication number Priority date Publication date Assignee Title
TWI788471B (zh) 2018-01-16 2023-01-01 日商太陽油墨製造股份有限公司 熱硬化性樹脂組成物、其硬化物及印刷配線板
JP7478659B2 (ja) 2018-03-30 2024-05-07 太陽ホールディングス株式会社 硬化性樹脂組成物、その硬化物およびプリント配線板

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63162775A (ja) * 1986-12-26 1988-07-06 Somar Corp 無電解メツキ用レジストインキ
JPH0192376A (ja) * 1987-09-30 1989-04-11 Somar Corp 無電解メッキ用レジストインキ
JPH01129080A (ja) * 1987-11-14 1989-05-22 Somar Corp 無電解メッキ用レジストインキ
JPH09316173A (ja) * 1996-05-31 1997-12-09 Nippon Kayaku Co Ltd 樹脂組成物及びその硬化物
JP2003298243A (ja) * 2002-04-03 2003-10-17 Mitsubishi Gas Chem Co Inc 多層プリント配線板
JP2008116910A (ja) * 2006-08-18 2008-05-22 Sanei Kagaku Kk レジストパターンの形成方法
JP2010266768A (ja) * 2009-05-18 2010-11-25 Sanyo Chem Ind Ltd 感光性樹脂組成物
JP2011040530A (ja) * 2009-08-10 2011-02-24 Yonezawa Dia Electronics Kk プリント配線板及びその製造方法

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63162775A (ja) * 1986-12-26 1988-07-06 Somar Corp 無電解メツキ用レジストインキ
JPH0192376A (ja) * 1987-09-30 1989-04-11 Somar Corp 無電解メッキ用レジストインキ
JPH01129080A (ja) * 1987-11-14 1989-05-22 Somar Corp 無電解メッキ用レジストインキ
JPH09316173A (ja) * 1996-05-31 1997-12-09 Nippon Kayaku Co Ltd 樹脂組成物及びその硬化物
JP2003298243A (ja) * 2002-04-03 2003-10-17 Mitsubishi Gas Chem Co Inc 多層プリント配線板
JP2008116910A (ja) * 2006-08-18 2008-05-22 Sanei Kagaku Kk レジストパターンの形成方法
JP2010266768A (ja) * 2009-05-18 2010-11-25 Sanyo Chem Ind Ltd 感光性樹脂組成物
JP2011040530A (ja) * 2009-08-10 2011-02-24 Yonezawa Dia Electronics Kk プリント配線板及びその製造方法

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