WO2012157375A1 - 回路接続材料、回路部材の接続構造及び回路部材の接続構造の製造方法 - Google Patents

回路接続材料、回路部材の接続構造及び回路部材の接続構造の製造方法 Download PDF

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Publication number
WO2012157375A1
WO2012157375A1 PCT/JP2012/059804 JP2012059804W WO2012157375A1 WO 2012157375 A1 WO2012157375 A1 WO 2012157375A1 JP 2012059804 W JP2012059804 W JP 2012059804W WO 2012157375 A1 WO2012157375 A1 WO 2012157375A1
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Prior art keywords
circuit
conductive particles
connection material
core
adhesive composition
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PCT/JP2012/059804
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English (en)
French (fr)
Japanese (ja)
Inventor
孝 中澤
藤縄　貢
竹村　賢三
由祐 飯島
Original Assignee
日立化成工業株式会社
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Application filed by 日立化成工業株式会社 filed Critical 日立化成工業株式会社
Priority to CN201280023903.0A priority Critical patent/CN103548207B/zh
Priority to BR112013029413-2A priority patent/BR112013029413B1/pt
Priority to JP2013515048A priority patent/JP6146302B2/ja
Priority to KR1020137027238A priority patent/KR101899185B1/ko
Publication of WO2012157375A1 publication Critical patent/WO2012157375A1/ja

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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R11/00—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
    • H01R11/01—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts characterised by the form or arrangement of the conductive interconnection between the connecting locations
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
    • C09J175/04—Polyurethanes
    • C09J175/14—Polyurethanes having carbon-to-carbon unsaturated bonds
    • C09J175/16—Polyurethanes having carbon-to-carbon unsaturated bonds having terminal carbon-to-carbon unsaturated bonds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/16—Solid spheres
    • C08K7/18—Solid spheres inorganic
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0218—Composite particles, i.e. first metal coated with second metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10681—Tape Carrier Package [TCP]; Flexible sheet connector

Definitions

  • the present invention relates to a circuit connection material, a circuit member connection structure, and a method of manufacturing the circuit member connection structure.
  • thermosetting resin such as an epoxy resin having excellent adhesiveness and high reliability is used (for example, see Patent Document 1).
  • a curing agent such as an epoxy resin, a phenol resin having reactivity with the epoxy resin, and a thermal latent catalyst for promoting the reaction between the epoxy resin and the curing agent are generally used.
  • the heat latent catalyst is an important factor for determining the curing temperature and curing rate of the adhesive, and various compounds are used from the viewpoint of storage stability at room temperature and curing rate during heating.
  • a radical curable adhesive composed of a radical polymerizable compound such as an acrylate derivative or a methacrylate derivative and a peroxide which is a radical polymerization initiator has attracted attention.
  • the radical curable adhesive can be cured at a low temperature in a short time (see, for example, Patent Documents 2 to 4).
  • FPD liquid crystal panels
  • PWB printed wiring boards
  • TCP tape carrier package
  • COF chip on flex
  • a circuit connection material is used for connection between a flexible printed wiring board (Flexible Printed Circuits, hereinafter referred to as “FPC” in some cases) in the field of FPD and PWB, and the circuit is generally subjected to gold plating.
  • the circuit board structure is mainly a multi-layer structure, and via holes and through holes are provided in the vicinity of the connection portion in order to release heat at the time of connection. For this reason, a sufficient amount of time is required to give the amount of heat to the connecting portion, and a short-time connection is required from the viewpoint of improving production efficiency.
  • the fast-curing radical-curing adhesive used to connect FPC and PWB in the FPD field can be cured in a short time, but it is gold-plated when applied to an OSP-treated substrate.
  • the connection resistance tends to increase as compared with the case where it is applied to another substrate.
  • epoxy resin anion-curing adhesives that have been used for general purposes in applications that do not require fast-curing connections show good adhesion to OSP-treated substrates, but reflow for soldering.
  • the connection resistance tends to increase after passing through the furnace.
  • the present invention provides a circuit connection material that can be cured in a short time and gives sufficiently high connection reliability when applied to an OSP-treated substrate, and a circuit member connection structure using the circuit connection material. It aims at providing the manufacturing method of the connection structure of a circuit member.
  • the present inventors have found that the increase in connection resistance when the above-mentioned curable adhesive is used is that the OSP film itself is non-conductive and that the reflow furnace is used for soldering.
  • the following invention was completed by obtaining the knowledge that the OSP film on the circuit board was hardened by passing through the above.
  • the present invention is a circuit connecting material for electrically connecting opposing circuit electrodes, and includes an adhesive composition and conductive particles, and the conductive particles are made of a metal having a Vickers hardness of 300 to 1000.
  • a lumpy body having an average particle diameter of 5 to 20 ⁇ m and having irregularities formed on the surface of the conductive particle, the core body having a core body and an outermost layer made of a noble metal covering the surface of the core body Provide material.
  • the present invention is also a circuit connection material for electrically connecting opposing circuit electrodes, containing an adhesive composition and conductive particles, the conductive particles comprising a core made of nickel,
  • a circuit connection material which is a massive particle having an average particle diameter of 5 to 20 ⁇ m and having irregularities formed on the surface of a conductive particle, having an outermost layer made of a noble metal covering the surface of a core.
  • the circuit connection material of the present invention can be cured in a short time by containing the conductive particles as described above together with the adhesive composition, and has good connection reliability even for an OSP-treated substrate. Can show gender.
  • the conductive particles in the circuit connecting material of the present invention preferably have a height difference of 70 nm to 2 ⁇ m in the unevenness. If the difference in height between the irregularities is in the above range, it is easy to penetrate the OSP film of the circuit electrode, and it is easy to suppress an increase in connection resistance.
  • the adhesive composition preferably includes a radical polymerizable substance and a curing agent that generates free radicals upon heating.
  • the adhesive composition in the circuit connection material of the present invention contains an epoxy resin and a latent curing agent, the connection reliability of the circuit member connection structure can be further improved.
  • circuit connection material of the present invention it is preferable that at least one of the facing circuit electrodes has a film containing an imidazole compound.
  • the circuit connection material of the present invention contains the conductive particles as described above together with the adhesive composition, thereby obtaining good connectivity in a short connection time even when the circuit electrode has a film containing an imidazole compound. It becomes possible.
  • a first circuit member having a first circuit electrode formed on the main surface of the first circuit board, a second circuit electrode formed on the main surface of the second circuit board, A second circuit member disposed so that the two circuit electrodes are opposed to the first circuit electrode, and the first circuit board and the second circuit board.
  • a circuit member connection structure comprising: a circuit connection portion that connects the first circuit member and the second circuit member so that the circuit electrodes are electrically connected to each other.
  • a circuit member connection structure that is a cured product of the film-like circuit connection material of the present invention is provided.
  • At least one of the first and second circuit electrodes has a coating containing an imidazole compound.
  • the circuit member connection structure of the present invention can obtain good connectivity even in a shorter connection time because the circuit connection portion is a cured product of the circuit connection material of the present invention.
  • the circuit member connection structure of the present invention since the surface of the circuit electrode is formed by a film made of a material containing an imidazole compound, the circuit electrode is protected from oxidation and good solderability can be obtained. it can.
  • the connection structure of the present invention has sufficiently high adhesive strength and connection reliability because the circuit members are connected to each other by the circuit connection material of the present invention.
  • the present invention provides a first circuit member in which a first circuit electrode is formed on a main surface of a first circuit board, and a second circuit electrode in which a second circuit electrode is formed on a main surface of a second circuit board.
  • 2 circuit members are arranged so that the first circuit electrode and the second circuit electrode face each other, and the film-like circuit connecting material is provided between the first circuit electrode and the second circuit electrode which are arranged to face each other.
  • a circuit comprising a step of heating and pressurizing the whole in a state of interposing the first circuit member and the second circuit member so that the first and second circuit electrodes are electrically connected to each other.
  • a method for manufacturing a connection structure for members is provided.
  • the manufacturing method of the circuit member connection structure of the present invention has a shorter connection time by interposing the circuit connection material of the present invention between the first circuit electrode and the second circuit electrode, and heating and pressing. However, it is possible to obtain a circuit member connection structure having good connectivity.
  • the present invention is an adhesive containing an adhesive composition and conductive particles, and the conductive particles are a core composed of a metal having a Vickers hardness of 300 to 1000 and a noble metal covering the surface of the core.
  • a circuit connection for electrically connecting opposing circuit electrodes of an adhesive having a surface layer and having an average particle size of 5 to 20 ⁇ m and having irregularities formed on the surface of the conductive particles It relates to application as a material.
  • the present invention is an adhesive containing an adhesive composition and conductive particles, and the conductive particles have a core made of nickel and an outermost layer made of a noble metal that covers the surface of the core.
  • Application of the adhesive as a circuit connection material for electrically connecting opposing circuit electrodes, which are aggregated particles having an average particle diameter of 5 to 20 ⁇ m, and the surface of the conductive particles is uneven. About.
  • the present invention is an adhesive containing an adhesive composition and conductive particles, and the conductive particles are a core composed of a metal having a Vickers hardness of 300 to 1000 and a noble metal covering the surface of the core.
  • a circuit connection for electrically connecting opposing circuit electrodes of an adhesive having a surface layer and having an average particle size of 5 to 20 ⁇ m and having irregularities formed on the surface of the conductive particles The application relates to the production of materials.
  • the present invention is an adhesive containing an adhesive composition and conductive particles, and the conductive particles have a core made of nickel and an outermost layer made of a noble metal that covers the surface of the core.
  • Manufacturing of circuit connection materials for electrically connecting opposing circuit electrodes of adhesive which are aggregated particles having an average particle diameter of 5 to 20 ⁇ m, and the surface of the conductive particles is uneven. For application.
  • a circuit connection material, a circuit member connection structure, and a circuit member connection structure that can be cured in a short time and give high connection reliability when applied to an OSP-treated substrate.
  • a manufacturing method can be provided.
  • the circuit connection material according to the present embodiment is an adhesive used for electrically connecting circuit electrodes.
  • FIG. 1 is a cross-sectional view showing an embodiment of a circuit connecting material. As shown in FIG. 1, the circuit connection material 1 includes a resin layer 3 and a plurality of conductive particles 8 dispersed in the resin layer 3 and has a film shape.
  • the conductive particle 8 has a core made of a metal having a Vickers hardness of 300 to 1000, and an outermost layer made of a noble metal covering the core, and is a massive particle having a plurality of irregularities formed on the surface of the conductive particle. It is.
  • the conductive particles 8 are massive particles having a core made of nickel and an outermost layer made of a noble metal covering the core, and having a plurality of irregularities formed on the surface of the conductive particles.
  • the unevenness on the surface of the conductive particles is derived from the unevenness on the surface of the core described later.
  • FIG. 2 is an SEM image showing an example of the appearance of the conductive particles
  • FIG. 3 is an SEM image showing an example of an enlarged surface of the conductive particles.
  • the electroconductive particle of this embodiment is not a spherical shape but a massive particle
  • Such conductive particles 8 easily penetrate the non-conductive OSP film of the circuit electrode and easily suppress an increase in connection resistance. Therefore, a circuit member connection structure having excellent connection reliability can be produced using the circuit connection material 1 containing the conductive particles 8.
  • the core of the conductive particle 8 is at least one selected from transition metals such as nickel, chromium, molybdenum, manganese, cobalt, iron, manganese, vanadium, titanium, platinum, iridium, osmium, tungsten, tantalum, niobium, zirconium, and palladium. It is preferable that it is comprised with the metal of this, and it is more preferable that it is comprised with nickel.
  • transition metals such as nickel, chromium, molybdenum, manganese, cobalt, iron, manganese, vanadium, titanium, platinum, iridium, osmium, tungsten, tantalum, niobium, zirconium, and palladium. It is preferable that it is comprised with the metal of this, and it is more preferable that it is comprised with nickel.
  • the Vickers hardness of the metal constituting the core is 300 to 1000, more preferably 400 to 800, and still more preferably 500 to 700. If the core has a Vickers hardness of less than 300, the conductive particles 8 are likely to be deformed, and the OSP film on the electrode tends to be excluded, and if it exceeds 1000, the conductive particles 8 are difficult to be deformed. It becomes difficult to secure a sufficient contact area to give the property.
  • the nucleus has irregularities on its surface.
  • irregularities can be formed on the surface of the conductive particles.
  • the method for forming irregularities on the surface of the nucleus is not particularly limited.
  • the nucleus is nickel, the nickel ore is reacted with carbon monoxide at room temperature by the carbonyl method to form a nickel carbonyl complex, Furthermore, by heating at 100 ° C. or higher, carbon monoxide can be desorbed and nickel having irregularities formed on the surface can be obtained.
  • the difference in height between the irregularities formed on the surface of the conductive particles 8 is preferably 70 nm to 2 ⁇ m, more preferably 90 nm to 1.5 ⁇ m, and still more preferably 120 nm to 1 ⁇ m. If the difference in height between the irregularities is 70 nm or more, it tends to bite into the circuit electrode having the OSP film, and the connection resistance after the reliability test tends to be suppressed. Moreover, when the difference in height between the projections and depressions is within 2 ⁇ m, the adhesive composition hardly remains at the root of the projections in the projections and depressions, and the connection resistance after the reliability test tends to be suppressed.
  • the average particle diameter of the conductive particles 8 is 5 to 20 ⁇ m, preferably 8 to 20 ⁇ m, and more preferably 8 to 15 ⁇ m. If the average particle size is less than 5 ⁇ m, the resin layer 3 cures before the conductive particles 8 come into contact with the electrode. If the average particle size exceeds 20 ⁇ m, the radius of curvature of the conductive particles 8 is large. Exclusion is reduced, and in either case, electrical continuity is difficult to obtain.
  • the average particle diameter of the conductive particles defined in the present application is a measurement value obtained by observing the conductive particles (n number of 50) from the SEM image. For example, the longest particle diameter portion and the shortest particle diameter portion Can be calculated by averaging.
  • the outermost layer of the conductive particles 8 is made of a noble metal and is preferably made of at least one metal selected from noble metals such as gold, silver, platinum, palladium, rhodium, iridium, ruthenium, osmium, etc., and is made of gold or platinum. More preferably, it is more preferably composed of gold.
  • the thickness of the outermost layer of the conductive particles 8 is preferably 0.03 to 0.4 ⁇ m, and more preferably 0.08 to 0.2 ⁇ m.
  • the entire surface of the nucleus is preferably covered with an outermost layer made of a noble metal. However, a part of the nucleus, for example, unevenness on the surface of the nucleus is not covered by the outermost layer without departing from the effect of the present invention. It may be exposed.
  • the blending amount of the conductive particles 8 in the circuit connection material 1 is appropriately set depending on the application, but is usually 100 parts by volume of the adhesive composition (that is, the portion of the resin layer 3 other than the conductive particles 8 in the circuit connection material 1). On the other hand, it is in the range of 0.1 to 30 parts by volume. Furthermore, from the viewpoint of preventing short circuit between adjacent circuit electrodes on the same circuit board, the blending amount of the conductive particles 8 is more preferably 0.1 to 10 parts by volume.
  • the adhesive composition forming the resin layer 3 can contain a curing agent that generates free radicals and a radical polymerizable substance.
  • the circuit connection material 1 can contain an adhesive composition containing a curing agent that generates free radicals and a radical polymerizable substance, and the conductive particles 8.
  • the circuit connection material 1 is heated, a crosslinked structure is formed in the adhesive composition by polymerization of the radical polymerizable substance, and a cured product of the circuit connection material 1 is formed.
  • the circuit connection material 1 functions as a radical curable adhesive.
  • the curing agent that generates free radicals used in the circuit connection material 1 is a substance that decomposes by heating a peroxide compound, an azo compound, or the like to generate free radicals.
  • the target connection temperature, connection time, pot life It is selected as appropriate.
  • the blending amount is preferably 0.05 to 10% by mass, based on the total mass of the circuit connection material 1, and is preferably 0.1 to 5% by mass (0.05 to 10% with 100% by mass as the total mass of the circuit connection material 1). Part by mass, preferably 0.1 to 5 parts by mass).
  • the curing agent that generates free radicals can be selected from diacyl peroxide, peroxydicarbonate, peroxyester, peroxyketal, dialkyl peroxide, hydroperoxide, and the like. Further, in order to suppress corrosion of the connection terminals of the circuit member, it is preferably selected from peroxyesters, dialkyl peroxides, and hydroperoxides, and more preferably selected from peroxyesters that provide high reactivity. .
  • diacyl peroxide examples include 2,4-dichlorobenzoyl peroxide, 3,5,5, -trimethylhexanoyl peroxide, octanoyl peroxide, lauroyl peroxide, stearoyl peroxide, succinic peroxide, and benzoyl.
  • peroxydicarbonates examples include di-n-propyl peroxydicarbonate, diisopropyl peroxydicarbonate, bis (4-tert-butylcyclohexyl) peroxydicarbonate, and di-2-ethoxymethoxyperoxydicarbonate. Di (2-ethylhexylperoxy) dicarbonate, dimethoxybutylperoxydicarbonate and di (3-methyl-3-methoxybutylperoxy) dicarbonate.
  • peroxyesters examples include 1,1,3,3-tetramethylbutylperoxyneodecanoate, 1-cyclohexyl-1-methylethylperoxynodecanoate, and t-hexylperoxyneodecane.
  • peroxyketals examples include 1,1-bis (t-hexylperoxy) -3,3,5-trimethylcyclohexane, 1,1-bis (t-hexylperoxy) cyclohexane, 1,1-bis. (T-Butylperoxy) -3,3,5-trimethylcyclohexane, 1,1- (t-butylperoxy) cyclododecane and 2,2-bis- (t-butylperoxy) decane.
  • dialkyl peroxides examples include ⁇ , ⁇ ′bis (t-butylperoxy) diisopropylbenzene, dicumyl peroxide, 2,5-dimethyl-2,5-di (t-butylperoxy) hexane and t -Butylcumyl peroxide.
  • hydroperoxides examples include diisopropylbenzene hydroperoxide and cumene hydroperoxide.
  • curing agents that generate free radicals can be used alone or in combination, and may be used in combination with a decomposition accelerator, an inhibitor, and the like.
  • a decomposition accelerator an inhibitor
  • the radical polymerizable substance used for the circuit connecting material 1 is a substance having a functional group that is polymerized by radicals, and examples thereof include acrylates, methacrylates, maleimide compounds, citraconic imide resins, and nadiimide resins.
  • the blending amount of the radical polymerizable substance is preferably 20 to 50 parts by mass, and more preferably 30 to 40 parts by mass, with the total mass of the circuit connecting material 1 being 100 parts by mass.
  • the radical polymerizable substance can be used in any state of a monomer and an oligomer, and a monomer and an oligomer can be used in combination.
  • Examples of the acrylate include, for example, methyl acrylate, ethyl acrylate, isopropyl acrylate, isobutyl acrylate, ethylene glycol diacrylate, diethylene glycol diacrylate, trimethylol propane triacrylate, tetramethylol methane tetraacrylate, 2-hydroxy-1,3-diaacryloxypropane, 2,2-bis [4- (acryloxymethoxy) phenyl] propane, 2,2-bis [4- (acryloxypolyethoxy) phenyl] propane, dicyclo Examples include pentenyl acrylate, tricyclodecanyl acrylate, tris (acryloyloxyethyl) isocyanurate, and urethane acrylate.
  • a polymerization inhibitor such as hydroquinone or methyl ether hydroquinone may be used as necessary.
  • a polymerization inhibitor such as hydroquinone or methyl ether hydroquinone may be used as necessary.
  • it has a dicyclopentenyl group and / or a tricyclodecanyl group and / or a triazine ring, since heat resistance improves, it is preferable.
  • maleimide compound examples include those containing at least two maleimide groups in the molecule, such as 1-methyl-2,4-bismaleimidebenzene, N, N′-m-phenylenebismaleimide, N, N ′.
  • -P-phenylene bismaleimide N, N'-m-toluylene bismaleimide, N, N'-4,4-biphenylene bismaleimide, N, N'-4,4- (3,3'-dimethylbiphenylene) Bismaleimide, N, N′-4,4- (3,3′-dimethyldiphenylmethane) bismaleimide, N, N′-4,4- (3,3′-diethyldiphenylmethane) bismaleimide, N, N′- 4,4-diphenylmethane bismaleimide, N, N′-4,4-diphenylpropane bismaleimide, N, N′-3,3′-diphenylsulfone bismale N, N
  • the citraconic imide resin is obtained by polymerizing a citraconic imide compound having at least one citraconic imide group in the molecule.
  • the citraconic imide compound include phenyl citraconic imide, 1-methyl-2,4 -Biscitraconimide benzene, N, N'-m-phenylene biscitraconimide, N, N'-p-phenylene biscitraconimide, N, N'-4,4-biphenylenebiscitraconimide, N, N'-4 , 4- (3,3-Dimethylbiphenylene) biscitraconimide, N, N′-4,4- (3,3-dimethyldiphenylmethane) biscitraconimide, N, N′-4,4- (3,3- Diethyldiphenylmethane) biscitraconimide, N, N′-4,4-diphenylmethanebiscitraconimide, N'-4,4-
  • the nadiimide resin is obtained by polymerizing a nadiimide compound having at least one nadiimide group in the molecule.
  • the nadiimide compound include phenyl nadiimide, 1-methyl-2,4-bisnadiimidebenzene, N, N′-m-phenylenebisnadiimide, N, N′-p-phenylenebisnadiimide, N, N′-4,4-biphenylenebisnadiimide, N, N′-4,4- (3,3-dimethyl Biphenylene) bisnadiimide, N, N′-4,4- (3,3-dimethyldiphenylmethane) bisnadiimide, N, N′-4,4- (3,3-diethyldiphenylmethane) bisnadiimide, N, N′-4,4 -Diphenylmethane bisnadiimi
  • the circuit connection material 1 may contain other components in addition to the curing agent that generates free radicals and the radical polymerizable substance.
  • a thermoplastic resin and a thermosetting resin can be contained.
  • thermoplastic resin polyethylene resin, polyimide resin, polyvinyl chloride resin, polyphenylene oxide resin, polyvinyl butyral resin, polyvinyl formal resin, polyamide resin, polyester resin, phenoxy resin, polystyrene resin, xylene resin, polyurethane resin, etc. can be used. .
  • thermoplastic resin a hydroxyl group-containing resin having a Tg (glass transition temperature) of 40 ° C. or more and a molecular weight of 10,000 or more can be preferably used.
  • a phenoxy resin can be suitably used.
  • the phenoxy resin can be obtained by reacting a bifunctional phenol with epihalohydrin until it has a high molecular weight or by polyaddition reaction of a bifunctional epoxy resin with a bifunctional phenol.
  • thermosetting resins examples include urea resins, melamine resins, phenol resins, xylene resins, epoxy resins, polyisocyanate resins, and the like.
  • thermoplastic resin and the thermosetting resin preferably have a functional group such as a hydroxyl group because the adhesiveness is improved, and may be modified with an epoxy group-containing elastomer or a radical polymerizable functional group. Those modified with a radically polymerizable functional group are preferred because the heat resistance is improved.
  • the weight average molecular weight of the thermoplastic resin is preferably 10,000 or more from the viewpoint of film-forming properties, but if it is 1,000,000 or more, the mixing property tends to deteriorate.
  • regulated by this application means what was measured using the analytical curve by a standard polystyrene by the gel permeation chromatography method (GPC) according to the following conditions.
  • the adhesive composition (resin layer 3) can contain an epoxy resin and a latent curing agent in place of the curing agent that generates free radicals and the radical polymerizable substance.
  • the circuit connection material 1 can contain an adhesive composition containing an epoxy resin and a latent curing agent, and the conductive particles 8. When the circuit connection material 1 is heated, a crosslinked structure is formed in the adhesive composition by curing of the epoxy resin, and a cured product of the circuit connection material 1 is formed. In this case, the circuit connecting material 1 functions as an epoxy curable adhesive.
  • Typical epoxy resins include bisphenol type epoxy resins that are glycidyl ethers of bisphenols such as bisphenol A, F, and AD, and epoxy novolac resins derived from phenol novolac or cresol novolac.
  • Other examples include naphthalene type epoxy resins having a naphthalene skeleton, glycidylamine type epoxy resins, glycidyl ester type epoxy resins, alicyclic epoxy resins and heterocyclic epoxy resins. These are used individually or in mixture of 2 or more types.
  • bisphenol type epoxy resins are preferred because they are widely available in grades with different molecular weights, and adhesiveness and reactivity can be arbitrarily set.
  • bisphenol type epoxy resins bisphenol F type epoxy resins are particularly preferable.
  • the viscosity of the bisphenol F type epoxy resin is low, and the fluidity of the circuit connecting material 1 can be easily set over a wide range by using it in combination with a phenoxy resin.
  • the bisphenol F-type epoxy resin also has an advantage that it is easy to give good adhesiveness to the circuit connecting material 1.
  • an epoxy resin having an impurity ion (Na + , Cl ⁇ etc.) concentration or hydrolyzable chlorine of 300 ppm or less to prevent electron migration.
  • the latent curing agent may be a compound that reacts with the epoxy resin and is incorporated into the crosslinked structure, or may be a catalytic curing agent that accelerates the curing reaction of the epoxy resin. Both can be used in combination.
  • catalytic curing agent examples include an anionic polymerization latent curing agent that promotes anionic polymerization of an epoxy resin and a cationic polymerization latent curing agent that promotes cationic polymerization of an epoxy resin.
  • anionic polymerization type latent curing agent examples include imidazole series, hydrazide series, trifluoroboron-amine complex, amine imide, polyamine salt, dicyandiamide, and modified products thereof.
  • the imidazole-based anionic polymerization latent curing agent is formed, for example, by adding imidazole or a derivative thereof to an epoxy resin.
  • a photosensitive onium salt mainly used is an aromatic diazonium salt, an aromatic sulfonium salt, or the like
  • an aromatic diazonium salt mainly used is an aromatic diazonium salt, an aromatic sulfonium salt, or the like
  • an aliphatic sulfonium salt that is activated by heating to cure the epoxy resin.
  • This type of curing agent is preferred because it has the feature of fast curability.
  • the blending amount of the latent curing agent is preferably 30 to 60 parts by mass and more preferably 40 to 55 parts by mass with respect to 100 parts by mass of the epoxy resin.
  • the blending amount of the latent curing agent is 30 parts by mass or more, the tightening force on the adherend due to curing shrinkage of the circuit connection material 1 is difficult to decrease. As a result, the contact between the conductive particles 8 and the circuit electrode is maintained, and the connection resistance after the reliability test tends to be suppressed.
  • the tightening force does not become too strong. There is a tendency.
  • the circuit connection material 1 is an epoxy resin adhesive
  • the film-forming material when the liquid is solidified and the constituent composition is made into a film shape, facilitates the handling of the film and imparts mechanical properties that do not easily tear, crack, or stick.
  • the film can be handled in a normal state (normal temperature and pressure).
  • thermoplastic resin As the film forming material, the above-described thermoplastic resin can be used, and it is preferable to use a phenoxy resin because of excellent adhesiveness, compatibility, heat resistance, and mechanical strength.
  • the phenoxy resin is a resin obtained by reacting a bifunctional phenol and epihalohydrin until they are polymerized, or by polyaddition of a bifunctional epoxy resin and a bifunctional phenol.
  • the phenoxy resin contains 1 mol of a bifunctional phenol and 0.985 to 1.015 mol of epihalohydrin in the presence of a catalyst such as an alkali metal hydroxide at a temperature of 40 to 120 ° C. in a non-reactive solvent. It can be obtained by reacting.
  • a catalyst such as an alkali metal compound, an organophosphorus compound, or a cyclic amine compound, an amide, ether, ketone, lactone, alcohol, or the like having a boiling point of 120 ° C. or higher.
  • a product obtained by polyaddition reaction by heating to 50 to 200 ° C. in an organic solvent under a reaction solid content of 50% by mass or less is preferable.
  • Bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol AD type epoxy resin, and bisphenol S type epoxy resin can be used as the bifunctional epoxy resin.
  • Bifunctional phenols have two phenolic hydroxyl groups, and examples thereof include bisphenol compounds such as hydroquinones, bisphenol A, bisphenol F, bisphenol AD, and bisphenol S.
  • the phenoxy resin may be modified with a radical polymerizable functional group.
  • a phenoxy resin can be used individually by 1 type or in mixture of 2 or more types.
  • the circuit connection material 1 can also contain a filler, a softening material, an accelerator, an anti-aging agent, a colorant, a flame retardant, a thixotropic agent, a coupling agent, isocyanates, and the like.
  • a filler is preferable because it improves connection reliability and the like. If the maximum diameter of the filler is less than the particle diameter of the conductive particles 8, it can be used, and the blending amount is preferably in the range of 5 to 60% by volume. If it is 5 to 60% by volume, the effect of improving the reliability is easily maintained.
  • a vinyl group, an acrylic group, an amino group, an epoxy group, and an isocyanate group-containing material are preferable from the viewpoint of improving adhesiveness.
  • a polymerization inhibitor such as hydroquinone or methyl ether hydroquinone may be used as necessary.
  • the circuit connecting material of the present embodiment is an adhesive used for electrically connecting circuit electrodes as described above.
  • the adhesive of the present embodiment is an adhesive containing an adhesive composition and conductive particles, and the conductive particles have a core made of a metal having a Vickers hardness of 300 to 1000, and the surface of the core. It is a massive particle having an average particle diameter of 5 to 20 ⁇ m and having an outermost layer made of a noble metal to be coated, and irregularities are formed on the surface of the conductive particle.
  • This adhesive can be applied as a circuit connection material for electrically connecting opposing circuit electrodes. Moreover, it can apply for manufacture of the circuit connection material for electrically connecting the circuit electrodes which oppose.
  • the adhesive of the present embodiment is an adhesive containing an adhesive composition and conductive particles, and the conductive particles are the core composed of nickel and a noble metal covering the surface of the core.
  • the surface particles are massive particles having an average particle diameter of 5 to 20 ⁇ m, and the surface of the conductive particles is uneven.
  • This adhesive can be applied as a circuit connection material for electrically connecting opposing circuit electrodes. Moreover, it can apply for manufacture of the circuit connection material for electrically connecting the circuit electrodes which oppose.
  • the circuit connection material 1 is a connection structure in which circuit components having one or more circuit electrodes (connection terminals) such as chip parts such as semiconductor chips, resistor chips and capacitor chips, and printed wiring boards are connected to each other. It is suitably used to form
  • FIG. 4 is a cross-sectional view showing an embodiment of a circuit member connection structure.
  • a circuit member connection structure 100 shown in FIG. 4 includes a first circuit board 11 and a first circuit member 10 having a first circuit electrode 13 formed on the main surface thereof, and a second circuit board 21. And a second circuit member 20 having a second circuit electrode 23 formed on the main surface thereof and disposed so that the second circuit electrode 23 and the first circuit electrode 13 face each other.
  • the connection part 1a interposed between the first circuit member 10 and the second circuit member 20 is provided.
  • the connection part 1 a is a cured product formed by curing the circuit connection material 1 and includes conductive particles 8.
  • the connecting portion 1a bonds the first circuit member 10 and the second circuit member 20 so that the first circuit electrode 13 and the second circuit electrode 23 facing each other are electrically connected. .
  • the first circuit electrode 13 and the second circuit electrode 23 facing each other are electrically connected via the conductive particles 8. Even when the connecting portion 1 a does not contain the conductive particles 8, the first circuit electrode 13 and the second circuit electrode 23 can be electrically connected via the circuit connecting material 1.
  • the first circuit board 11 is a resin film containing at least one resin selected from the group consisting of polyester terephthalate, polyethersulfone, epoxy resin, acrylic resin and polyimide resin.
  • the first circuit electrode 13 is formed of a material having conductivity that can function as an electrode (preferably at least one selected from the group consisting of gold, silver, tin, platinum group metals, and indium-tin oxide). Has been.
  • the second circuit board 21 is a multilayer wiring board formed of an insulating substrate such as silicon, gallium, arsenic, or the like of semiconductor chips, glass, ceramics, glass / epoxy composite, or plastic.
  • the second circuit electrode 23 includes a conductor portion 23 a and a coating 23 b that forms a portion of the surface of the circuit electrode 23 that is in contact with the connection portion 1 a.
  • the coating 23 b is formed by unevenness formed on the surface of the conductive particles 8. It is preferable to be penetrated and electrically connected.
  • the conductor portion 23a is formed of a material having conductivity that allows the circuit electrode 23 to function as an electrode (preferably at least one selected from the group consisting of gold, silver, tin, platinum group metals, and indium-tin oxide). Has been.
  • the coating 23b is a coating made of a material containing an organic resin, and preferably contains an organic resin such as an imidazole compound.
  • the coating 23b is formed by subjecting the second circuit board 21 to an OSP (Organic Solderability Preservative) treatment.
  • OSP treatment is a method for treating a substrate, also called a water-soluble preflux, and generally an OSP film is formed by treating a substrate with a solution containing an imidazole compound.
  • a film containing an imidazole compound is a film formed by bonding complexes formed from an imidazole derivative and a metal to each other on the electrode surface.
  • the film containing the imidazole compound can be formed by subjecting the substrate on which the circuit electrode is formed to an OSP treatment with a solution containing the imidazole compound.
  • a benzimidazole derivative is preferably used from the viewpoint of heat resistance.
  • the OSP treatment is, for example, as commercially available, trade name Tuff Ace F2, F2 (LX) manufactured by Shikoku Kasei Co., Ltd., or Docoat GVII manufactured by Sanwa Laboratory Co., Ltd., or Enthone. It can be carried out using Entec Entek 106A, 106A (X), or Mec Seal CL-5824S, CL-5018, CL-5018S manufactured by Mec Co., Ltd.
  • the circuit connection material according to the present embodiment can be used for connection of a circuit member in which at least one of the first and second circuit electrodes has a film made of a material containing an organic resin.
  • the first circuit electrode 13 includes the conductor portion 13 a and the circuit electrode 13. It may have a coating 13b that forms a portion of the surface that contacts the connecting portion 1a, and the coating 13b of the first circuit electrode 13 is also penetrated by the irregularities formed on the surface of the conductive particles 8 to be electrically connected. It is preferable.
  • the coating 13b is formed by the same method as the coating 23b.
  • the second circuit member on which the second circuit electrode is formed is disposed so that the first circuit electrode and the second circuit electrode face each other, and the first circuit electrode and the second circuit electrode that are disposed to face each other.
  • the first circuit member and the second circuit electrode are electrically connected to each other by heating and pressurizing the whole with the film-like circuit connection material of the present embodiment interposed therebetween.
  • the circuit member connection structure 100 includes, for example, a first circuit member 10, the above-described film-like circuit connection material 1, and a second circuit member 20, and a first circuit electrode 13 and a second circuit electrode.
  • the first circuit member 10 is electrically connected to the first circuit electrode 13 and the second circuit electrode 23 by heating and pressurizing the laminated body laminated in this order so as to oppose each other.
  • the second circuit member 20 are obtained by the manufacturing method.
  • the circuit connection material 1 formed on a support film is bonded to the second circuit member 20 by heating and pressurizing and temporarily bonding the circuit connection material 1.
  • the first circuit member 10 can be placed while being aligned so that the circuit electrodes face each other to prepare a laminate.
  • the conditions for heating and pressurizing the laminate are appropriately adjusted so that the circuit connecting material is cured and sufficient adhesive strength is obtained according to the curability of the composition in the circuit connecting material. Moreover, according to the composition in a circuit connection material, it can also connect by light irradiation.
  • the substrate included in the circuit member constituting the connection structure may be a semiconductor chip such as silicon and gallium / arsenic, and an insulating substrate such as glass, ceramics, glass / epoxy composite, and plastic.
  • circuit connection material (1-1) Preparation of each component constituting adhesive composition “Perhexa25O”: 2,5-dimethyl-2,5-di (2-ethylhexanoyl) hexane (Japan) (Product name) “UN5500”: Urethane acrylate oligomer (trade name, manufactured by Negami Kogyo) “DCP-A”: dicyclopentadiene type diacrylate (product name, manufactured by Toagosei Co., Ltd.) “M-215”: Isocyanuric acid EO-modified diacrylate (product name) “P-2M”: 2-methacryloyloxyethyl acid phosphate (trade name, manufactured by Kyoeisha Chemical Co., Ltd.) “HX3941HP”: an anionic polymerization type latent curing agent-containing epoxy resin (containing 35% by mass of an imidazole microcapsule type curing agent, product name, manufactured by Asahi Kas
  • Conductive particle A a core composed of Ni particles having a plurality of irregularities formed on the surface, and an outermost layer composed of gold formed by applying gold plating to the core
  • Conductive particles having an average particle diameter of 10 ⁇ m were prepared.
  • conductive particle B an average particle diameter of 10 ⁇ m having a core made of Ni particles having a plurality of irregularities formed on the surface and an outermost layer made of gold formed by palladium plating on the core.
  • Conductive particles were prepared.
  • conductive particles C conductive particles having an average particle diameter of 10 ⁇ m were prepared, which had a core made of spherical Ni particles and an outermost layer made of gold formed by plating the core with gold. .
  • conductive particles D conductive particles having an average particle diameter of 10 ⁇ m having a core made of spherical Ni particles and an outermost layer made of gold formed by applying gold plating to the core were prepared. Further, as “conductive particles E”, conductive particles having an average particle diameter of 10 ⁇ m having only nuclei composed of Ni particles having irregularities formed on the surface were prepared. As “conductive particles F”, conductive particles having an average particle diameter of 10 ⁇ m having only nuclei that are spherical Ni particles were prepared.
  • the core composed of Ni particles having a plurality of irregularities formed on the surface reacts nickel ore with carbon monoxide in an environment of 25 ° C. to form a nickel carbonyl complex. This was obtained by heating to desorb carbon monoxide (carbonyl method).
  • Example 2 A film-like circuit connection material was obtained in the same manner as in Example 1 except that 10 parts by mass of the conductive particles B were used as the conductive particles.
  • Example 3 A film-like circuit connecting material was obtained in the same manner as in Example 1 except that 20 parts by mass of the conductive particles A were used as the conductive particles.
  • This mixed solution was applied onto a PET film with an applicator and dried with hot air at 70 ° C. for 10 minutes to obtain a film-like circuit connecting material having a resin layer thickness of 35 ⁇ m.
  • Example 5 A film-like circuit connection material was obtained in the same manner as in Example 4 except that 10 parts by mass of the conductive particles B were used as the conductive particles.
  • Example 6 A film-like circuit connection material was obtained in the same manner as in Example 4 except that 20 parts by mass of the conductive particles A were used as the conductive particles.
  • Example 1 A film-like circuit connection material was obtained in the same manner as in Example 1 except that 10 parts by mass of the conductive particles C were used as the conductive particles.
  • Example 2 A film-like circuit connection material was obtained in the same manner as in Example 1 except that 10 parts by mass of the conductive particles D were used as the conductive particles.
  • Example 3 A film-like circuit connection material was obtained in the same manner as in Example 1 except that 10 parts by mass of the conductive particles E were used as the conductive particles.
  • Example 4 A film-like circuit connection material was obtained in the same manner as in Example 1 except that 10 parts by mass of the conductive particles F were used as the conductive particles.
  • Example 5 A film-like circuit connection material was obtained in the same manner as in Example 4 except that 10 parts by mass of the conductive particles C were used as the conductive particles.
  • Example 6 A film-like circuit connection material was obtained in the same manner as in Example 4 except that 10 parts by mass of the conductive particles D were used as the conductive particles.
  • Example 7 A film-like circuit connection material was obtained in the same manner as in Example 4 except that 10 parts by mass of the conductive particles E were used as the conductive particles.
  • Tables 1 and 2 show the compositions of the circuit connecting materials of Examples 1 to 6 and Comparative Examples 1 to 8 in terms of parts by mass (in terms of nonvolatile content).
  • connection resistance value between circuits including the circuit connection part of the produced connection structure was measured by a four-terminal method using a digital multimeter.
  • the connection resistance was measured immediately after the connection, after performing a high temperature and high humidity treatment in a constant temperature and humidity chamber of 85 ° C. and 85% RH for 1000 hours, and a thermal shock test of ⁇ 40 ° C. to + 100 ° C. for 1000 cycles.
  • Each measurement was performed after The range in which the connection resistance by the 4-terminal method after the reliability test was 100 m ⁇ or less was judged to be good. The results are shown in Table 3.
  • circuit connection materials of Examples 1 to 6 had a small increase in connection resistance and excellent connection reliability both after the high temperature and high humidity treatment and after the thermal shock test.
  • circuit connection materials of Comparative Examples 1 to 8 exhibited a connection resistance exceeding 100 m ⁇ both after the high temperature and high humidity treatment and after the thermal shock test, and were inferior in connection reliability.
  • a circuit connection material, a circuit member connection structure, and a circuit member connection structure that can be cured in a short time and give high connection reliability when applied to an OSP-treated substrate.
  • a manufacturing method can be provided.
  • SYMBOLS 1 Circuit connection material, 1a ... Connection part, 3 ... Resin layer, 8 ... Conductive particle, 10 ... 1st circuit member, 11 ... 1st circuit board, 13 ... 1st circuit electrode, 20 ... 2nd Circuit member, 21 ... second circuit board, 23 ... second circuit electrode, 23a ... conductor portion, 23b ... coating, 100 ... connection structure of circuit members.
PCT/JP2012/059804 2011-05-18 2012-04-10 回路接続材料、回路部材の接続構造及び回路部材の接続構造の製造方法 WO2012157375A1 (ja)

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JPWO2012157375A1 (ja) 2014-07-31
JP2017073386A (ja) 2017-04-13
CN103548207A (zh) 2014-01-29
KR101899185B1 (ko) 2018-09-14
KR20140019380A (ko) 2014-02-14
CN107254264B (zh) 2019-07-09
CN107254264A (zh) 2017-10-17

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