WO2012157375A1 - 回路接続材料、回路部材の接続構造及び回路部材の接続構造の製造方法 - Google Patents

回路接続材料、回路部材の接続構造及び回路部材の接続構造の製造方法 Download PDF

Info

Publication number
WO2012157375A1
WO2012157375A1 PCT/JP2012/059804 JP2012059804W WO2012157375A1 WO 2012157375 A1 WO2012157375 A1 WO 2012157375A1 JP 2012059804 W JP2012059804 W JP 2012059804W WO 2012157375 A1 WO2012157375 A1 WO 2012157375A1
Authority
WO
WIPO (PCT)
Prior art keywords
circuit
conductive particles
connection material
core
adhesive composition
Prior art date
Application number
PCT/JP2012/059804
Other languages
English (en)
French (fr)
Japanese (ja)
Inventor
孝 中澤
藤縄　貢
竹村　賢三
由祐 飯島
Original Assignee
日立化成工業株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日立化成工業株式会社 filed Critical 日立化成工業株式会社
Priority to JP2013515048A priority Critical patent/JP6146302B2/ja
Priority to BR112013029413-2A priority patent/BR112013029413B1/pt
Priority to KR1020137027238A priority patent/KR101899185B1/ko
Priority to CN201280023903.0A priority patent/CN103548207B/zh
Publication of WO2012157375A1 publication Critical patent/WO2012157375A1/ja

Links

Images

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R11/00—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
    • H01R11/01—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts characterised by the form or arrangement of the conductive interconnection between the connecting locations
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
    • C09J175/04—Polyurethanes
    • C09J175/14—Polyurethanes having carbon-to-carbon unsaturated bonds
    • C09J175/16—Polyurethanes having carbon-to-carbon unsaturated bonds having terminal carbon-to-carbon unsaturated bonds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/16—Solid spheres
    • C08K7/18—Solid spheres inorganic
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0218—Composite particles, i.e. first metal coated with second metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10681—Tape Carrier Package [TCP]; Flexible sheet connector

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Inorganic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Physics & Mathematics (AREA)
  • Conductive Materials (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
  • Combinations Of Printed Boards (AREA)
  • Non-Insulated Conductors (AREA)
  • Adhesive Tapes (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Wire Bonding (AREA)
PCT/JP2012/059804 2011-05-18 2012-04-10 回路接続材料、回路部材の接続構造及び回路部材の接続構造の製造方法 WO2012157375A1 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2013515048A JP6146302B2 (ja) 2011-05-18 2012-04-10 回路接続材料、回路部材の接続構造及び回路部材の接続構造の製造方法
BR112013029413-2A BR112013029413B1 (pt) 2011-05-18 2012-04-10 Material de ligação de circuito, estrutura de ligação de elementos de circuito e método de fabricação de estrutura de ligação de elementos de circuito
KR1020137027238A KR101899185B1 (ko) 2011-05-18 2012-04-10 회로 접속 재료, 회로 부재의 접속 구조 및 회로 부재의 접속 구조의 제조 방법
CN201280023903.0A CN103548207B (zh) 2011-05-18 2012-04-10 电路连接材料、电路部件的连接结构以及电路部件的连接结构的制造方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2011111831 2011-05-18
JP2011-111831 2011-05-18

Publications (1)

Publication Number Publication Date
WO2012157375A1 true WO2012157375A1 (ja) 2012-11-22

Family

ID=47176716

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2012/059804 WO2012157375A1 (ja) 2011-05-18 2012-04-10 回路接続材料、回路部材の接続構造及び回路部材の接続構造の製造方法

Country Status (5)

Country Link
JP (2) JP6146302B2 (ko)
KR (1) KR101899185B1 (ko)
CN (2) CN103548207B (ko)
BR (1) BR112013029413B1 (ko)
WO (1) WO2012157375A1 (ko)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015140409A (ja) * 2014-01-29 2015-08-03 日立化成株式会社 接着剤組成物、接着剤組成物を用いた電子部材、及び半導体装置の製造方法

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018042701A1 (ja) 2016-08-30 2018-03-08 日立化成株式会社 接着剤組成物
JP2018145418A (ja) * 2017-03-06 2018-09-20 デクセリアルズ株式会社 樹脂組成物、樹脂組成物の製造方法、及び構造体
US11355469B2 (en) 2017-12-28 2022-06-07 Showa Denko Materials Co., Ltd. Connection structure and method for producing same
WO2019131668A1 (ja) * 2017-12-28 2019-07-04 日立化成株式会社 希土類メタルボンド磁石の製造方法及び希土類メタルボンド磁石
WO2019142791A1 (ja) * 2018-01-17 2019-07-25 日立化成株式会社 接着剤組成物、接続構造体及びその製造方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63308880A (ja) * 1987-06-11 1988-12-16 Sony Chem Corp 異方性導電接着体
WO2009057612A1 (ja) * 2007-10-31 2009-05-07 Hitachi Chemical Company, Ltd. 回路接続材料及び回路部材の接続構造
JP2009277769A (ja) * 2008-05-13 2009-11-26 Hitachi Chem Co Ltd 回路接続材料及びそれを用いた回路部材の接続構造

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2610900B2 (ja) 1987-10-27 1997-05-14 ソニーケミカル 株式会社 熱硬化型異方性導電接着シート及びその製造方法
JP4289319B2 (ja) 1997-03-31 2009-07-01 日立化成工業株式会社 回路接続材料並びに回路端子の接続構造及び接続方法
JPH10273626A (ja) * 1997-03-31 1998-10-13 Hitachi Chem Co Ltd 回路接続材料及び回路板の製造法
JP3587859B2 (ja) 1997-03-31 2004-11-10 日立化成工業株式会社 回路接続材料並びに回路端子の接続構造及び接続方法
JP2000182691A (ja) * 1998-12-17 2000-06-30 Hitachi Chem Co Ltd 回路の接続部材及びこれを用いた接続方法
JP4590732B2 (ja) 2000-12-28 2010-12-01 日立化成工業株式会社 回路接続材料及びそれを用いた回路板の製造方法、回路板
US6548175B2 (en) * 2001-01-11 2003-04-15 International Business Machines Corporation Epoxy-siloxanes based electrically conductive adhesives for semiconductor assembly and process for use thereof
JP4860163B2 (ja) * 2005-02-15 2012-01-25 積水化学工業株式会社 導電性微粒子の製造方法
JP2006245453A (ja) * 2005-03-07 2006-09-14 Three M Innovative Properties Co フレキシブルプリント回路基板の他の回路基板への接続方法
CN101529574A (zh) * 2006-10-31 2009-09-09 日立化成工业株式会社 电路连接结构体
WO2008105355A1 (ja) * 2007-02-26 2008-09-04 Sekisui Chemical Co., Ltd. 導電性微粒子及び異方性導電材料
JP4872949B2 (ja) * 2007-10-12 2012-02-08 日立化成工業株式会社 回路接続材料及びそれを用いた回路部材の接続構造
CN101836265B (zh) * 2007-10-22 2012-07-25 日本化学工业株式会社 包覆导电性粉体和使用该粉体的导电性粘合剂
KR20090054198A (ko) * 2007-11-26 2009-05-29 쓰리엠 이노베이티브 프로퍼티즈 캄파니 점착 시트의 제조방법 및 이에 의한 점착 시트
JP2009277776A (ja) 2008-05-13 2009-11-26 Sharp Corp 半導体装置及びその製造方法
WO2010125966A1 (ja) * 2009-04-28 2010-11-04 日立化成工業株式会社 異方導電粒子

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63308880A (ja) * 1987-06-11 1988-12-16 Sony Chem Corp 異方性導電接着体
WO2009057612A1 (ja) * 2007-10-31 2009-05-07 Hitachi Chemical Company, Ltd. 回路接続材料及び回路部材の接続構造
JP2009277769A (ja) * 2008-05-13 2009-11-26 Hitachi Chem Co Ltd 回路接続材料及びそれを用いた回路部材の接続構造

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015140409A (ja) * 2014-01-29 2015-08-03 日立化成株式会社 接着剤組成物、接着剤組成物を用いた電子部材、及び半導体装置の製造方法

Also Published As

Publication number Publication date
BR112013029413B1 (pt) 2021-08-10
CN103548207A (zh) 2014-01-29
BR112013029413A2 (pt) 2017-01-31
CN107254264B (zh) 2019-07-09
CN107254264A (zh) 2017-10-17
KR20140019380A (ko) 2014-02-14
JP2017073386A (ja) 2017-04-13
JP6146302B2 (ja) 2017-06-14
CN103548207B (zh) 2017-10-27
KR101899185B1 (ko) 2018-09-14
JPWO2012157375A1 (ja) 2014-07-31

Similar Documents

Publication Publication Date Title
JP5716763B2 (ja) 回路接続材料及びそれを用いた回路部材の接続構造
JP4293187B2 (ja) 回路接続材料、これを用いたフィルム状回路接続材料、回路部材の接続構造及びその製造方法
JP5247968B2 (ja) 回路接続材料、及びこれを用いた回路部材の接続構造
JP4737177B2 (ja) 回路接続構造体
JP5067355B2 (ja) 回路接続材料及び回路部材の接続構造
JP2017073386A (ja) 回路接続材料、回路部材の接続構造及び回路部材の接続構造の製造方法
JPWO2008140094A1 (ja) 回路接続材料及び回路部材の接続構造
JP2013055058A (ja) 回路接続材料、及び回路部材の接続構造
JP5176139B2 (ja) 回路接続材料及びそれを用いた回路部材の接続構造
JP2009277769A (ja) 回路接続材料及びそれを用いた回路部材の接続構造
JP4872949B2 (ja) 回路接続材料及びそれを用いた回路部材の接続構造
JP2007224228A (ja) 回路接続材料並びに回路端子の接続構造体及び接続方法
JPWO2009017001A1 (ja) 回路部材の接続構造
JP2011100605A (ja) 回路接続材料及び、これを用いた回路部材の接続構造
JP4154919B2 (ja) 回路接続材料及びそれを用いた回路端子の接続構造
JP4844461B2 (ja) 回路接続材料及びそれを用いた回路端子の接続構造
JP2011105861A (ja) 回路接続材料及び接続構造体
WO2012137335A1 (ja) 回路接続材料及びその使用並びに接続構造体及びその製造方法
JP2009275079A (ja) 回路接続材料及びそれを用いた回路部材の接続構造
JP2011054988A (ja) 回路接続材料
JP2011119154A (ja) 接続方法及び接続構造体
JP4400674B2 (ja) 回路接続材料及びそれを用いた回路端子の接続構造
JP5365666B2 (ja) 回路接続材料並びに回路端子の接続構造体及び接続方法
JP5387592B2 (ja) 回路接続材料、及び回路部材の接続構造の製造方法

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 12786300

Country of ref document: EP

Kind code of ref document: A1

ENP Entry into the national phase

Ref document number: 2013515048

Country of ref document: JP

Kind code of ref document: A

ENP Entry into the national phase

Ref document number: 20137027238

Country of ref document: KR

Kind code of ref document: A

NENP Non-entry into the national phase

Ref country code: DE

REG Reference to national code

Ref country code: BR

Ref legal event code: B01A

Ref document number: 112013029413

Country of ref document: BR

122 Ep: pct application non-entry in european phase

Ref document number: 12786300

Country of ref document: EP

Kind code of ref document: A1

ENP Entry into the national phase

Ref document number: 112013029413

Country of ref document: BR

Kind code of ref document: A2

Effective date: 20131114