WO2012148197A2 - 신규한 화합물 반도체 및 그 활용 - Google Patents
신규한 화합물 반도체 및 그 활용 Download PDFInfo
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- WO2012148197A2 WO2012148197A2 PCT/KR2012/003254 KR2012003254W WO2012148197A2 WO 2012148197 A2 WO2012148197 A2 WO 2012148197A2 KR 2012003254 W KR2012003254 W KR 2012003254W WO 2012148197 A2 WO2012148197 A2 WO 2012148197A2
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- 150000001875 compounds Chemical class 0.000 title claims abstract description 75
- 239000004065 semiconductor Substances 0.000 title claims abstract description 74
- 229910052763 palladium Inorganic materials 0.000 claims abstract description 14
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 11
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- 239000000126 substance Substances 0.000 claims abstract description 9
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- 229910052684 Cerium Inorganic materials 0.000 claims abstract description 7
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- 229910052691 Erbium Inorganic materials 0.000 claims abstract description 7
- 229910052693 Europium Inorganic materials 0.000 claims abstract description 7
- 229910052688 Gadolinium Inorganic materials 0.000 claims abstract description 7
- 229910052689 Holmium Inorganic materials 0.000 claims abstract description 7
- 229910052779 Neodymium Inorganic materials 0.000 claims abstract description 7
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- 229910052772 Samarium Inorganic materials 0.000 claims abstract description 7
- 229910052771 Terbium Inorganic materials 0.000 claims abstract description 7
- 229910052775 Thulium Inorganic materials 0.000 claims abstract description 7
- 229910052769 Ytterbium Inorganic materials 0.000 claims abstract description 7
- 229910052788 barium Inorganic materials 0.000 claims abstract description 7
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- 229910052707 ruthenium Inorganic materials 0.000 claims abstract description 7
- 229910052706 scandium Inorganic materials 0.000 claims abstract description 7
- 229910052709 silver Inorganic materials 0.000 claims abstract description 7
- 229910052712 strontium Inorganic materials 0.000 claims abstract description 7
- 229910052718 tin Inorganic materials 0.000 claims abstract description 7
- 229910052719 titanium Inorganic materials 0.000 claims abstract description 7
- 229910052720 vanadium Inorganic materials 0.000 claims abstract description 7
- 229910052727 yttrium Inorganic materials 0.000 claims abstract description 7
- 229910052765 Lutetium Inorganic materials 0.000 claims abstract description 4
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- 229910004613 CdTe Inorganic materials 0.000 description 1
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- 229910000530 Gallium indium arsenide Inorganic materials 0.000 description 1
- NLDMNSXOCDLTTB-UHFFFAOYSA-N Heterophylliin A Natural products O1C2COC(=O)C3=CC(O)=C(O)C(O)=C3C3=C(O)C(O)=C(O)C=C3C(=O)OC2C(OC(=O)C=2C=C(O)C(O)=C(O)C=2)C(O)C1OC(=O)C1=CC(O)=C(O)C(O)=C1 NLDMNSXOCDLTTB-UHFFFAOYSA-N 0.000 description 1
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
- B01J27/00—Catalysts comprising the elements or compounds of halogens, sulfur, selenium, tellurium, phosphorus or nitrogen; Catalysts comprising carbon compounds
- B01J27/02—Sulfur, selenium or tellurium; Compounds thereof
- B01J27/057—Selenium or tellurium; Compounds thereof
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
- C01B19/00—Selenium; Tellurium; Compounds thereof
- C01B19/002—Compounds containing, besides selenium or tellurium, more than one other element, with -O- and -OH not being considered as anions
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
- B01J23/00—Catalysts comprising metals or metal oxides or hydroxides, not provided for in group B01J21/00
- B01J23/08—Catalysts comprising metals or metal oxides or hydroxides, not provided for in group B01J21/00 of gallium, indium or thallium
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
- B01J23/00—Catalysts comprising metals or metal oxides or hydroxides, not provided for in group B01J21/00
- B01J23/38—Catalysts comprising metals or metal oxides or hydroxides, not provided for in group B01J21/00 of noble metals
- B01J23/54—Catalysts comprising metals or metal oxides or hydroxides, not provided for in group B01J21/00 of noble metals combined with metals, oxides or hydroxides provided for in groups B01J23/02 - B01J23/36
- B01J23/56—Platinum group metals
- B01J23/62—Platinum group metals with gallium, indium, thallium, germanium, tin or lead
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
- B01J23/00—Catalysts comprising metals or metal oxides or hydroxides, not provided for in group B01J21/00
- B01J23/70—Catalysts comprising metals or metal oxides or hydroxides, not provided for in group B01J21/00 of the iron group metals or copper
- B01J23/74—Iron group metals
- B01J23/75—Cobalt
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/0248—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies
- H01L31/0256—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by the material
- H01L31/0264—Inorganic materials
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/80—Constructional details
- H10N10/85—Thermoelectric active materials
- H10N10/851—Thermoelectric active materials comprising inorganic compositions
- H10N10/852—Thermoelectric active materials comprising inorganic compositions comprising tellurium, selenium or sulfur
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- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2002/00—Crystal-structural characteristics
- C01P2002/50—Solid solutions
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- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2006/00—Physical properties of inorganic compounds
- C01P2006/40—Electric properties
Definitions
- the present invention relates to a novel compound semiconductor material that can be used for solar cells, thermoelectric materials and the like, a method for producing the same, and a use thereof.
- Compound A semiconductor is a compound which acts as a semiconductor by combining two or more elements rather than a single element such as silicon or germanium.
- Various kinds of such compound semiconductors are currently developed and used in various fields.
- a compound semiconductor may be used in a thermoelectric conversion element using a Peltier effect, a light emitting element such as a light emitting diode or a laser diode using the photoelectric conversion effect, and a solar cell.
- thermoelectric conversion element may be applied to thermoelectric conversion power generation, thermoelectric conversion cooling, etc.
- thermoelectric conversion power generation uses a thermoelectric power generated by providing a temperature difference to the thermoelectric conversion element, and converts thermal energy into electrical energy. to be.
- thermoelectric conversion element The energy conversion efficiency of such a thermoelectric conversion element depends on ZT, which is a figure of merit value of the thermoelectric conversion material.
- ZT is determined according to Seebeck coefficient, electrical conductivity and thermal conductivity, and more specifically, is proportional to the square of the Seebeck coefficient and electrical conductivity and inversely proportional to the thermal conductivity. Therefore, in order to increase the energy conversion efficiency of the thermoelectric conversion element, it is necessary to develop a thermoelectric conversion material having a high Seebeck coefficient or high electrical conductivity or low thermal conductivity.
- the solar cell is mainly a tandem solar cell in which a silicon solar cell using a single element of silicon, a compound semiconductor solar cell using a compound semiconductor, and two or more solar cells having different bandgap energy are stacked. And the like.
- compound semiconductor solar cells use compound semiconductors in the light absorption layer that absorbs sunlight to generate electron-hole pairs.
- group III-V compound semiconductors such as GaAs, InP, GaAlAs, GaInAs, CdS, CdTe, Group II-VI compound semiconductors, such as ZnS, the group I-III-VI compound semiconductor represented by CuInSe 2 , etc. can be used.
- the light absorbing layer of the solar cell is required to be excellent in long-term electrical and optical stability, high in photoelectric conversion efficiency, and to easily control band gap energy or conductivity by changing composition or doping.
- requirements such as manufacturing cost and yield must also be satisfied.
- many conventional compound semiconductors do not meet all of these requirements together.
- thermoelectric conversion materials such as thermoelectric conversion materials, solar cells, etc. of thermoelectric conversion elements
- thermoelectrics using the same It aims at providing a conversion element, a solar cell, etc.
- the present inventors have succeeded in synthesizing the compound semiconductor represented by the following formula (1) after repeated studies on the compound semiconductor, and the compound is a thermoelectric conversion material of a thermoelectric conversion element, a light absorbing layer of a solar cell, or the like. It was confirmed that it can be used to complete the present invention.
- M is Ca, Sr, Ba, Ti, V, Cr, Mn, Cu, Zn, Pd, Ag, Cd, Sc, Y, La, Ce, Pr, Nd, Sm, Eu, Gd, Tb At least one selected from the group consisting of Dy, Ho, Er, Tm, Yb and Lu, A is at least any one selected from the group consisting of Fe, Ni, Ru, Rh, Pd, Ir, and Pt, and X Is at least one selected from the group consisting of Si, Ga, Ge, and Sn, and 0 ⁇ x ⁇ 1, 0 ⁇ y ⁇ 1, 0 ⁇ m ⁇ 1, 0 ⁇ n ⁇ 9 and 0 ⁇ z ⁇ 2.
- x is 0 ⁇ x ⁇ 0.5.
- x is 0 ⁇ x ⁇ 0.25.
- y is 0 ⁇ y ⁇ 0.5.
- y is 0 ⁇ y ⁇ 0.25.
- x and y may be 0 ⁇ x + y ⁇ 1.
- n and z may be 0 ⁇ n + z ⁇ 9.
- m is 0 ⁇ m ⁇ 1.
- m in Chemical Formula 1 is 0 ⁇ m ⁇ 0.5.
- m in Formula 1 is 0 ⁇ m ⁇ 0.1.
- the compound semiconductor manufacturing method according to the present invention for achieving the above object, In, Co, Sb and Te, Ca, Sr, Ba, Ti, V, Cr, Mn, Cu, Zn, Pd, Ag, Cd, Sc, Y, La, Ce, Pr, Nd, Sm, Eu, Gd, Tb, Dy, Ho, Er, Tm, Yb and Lu, any one selected from the group consisting of two or more elements thereof or oxides thereof Mixing the; And a method for producing a compound semiconductor represented by the formula (1) comprising the step of heat-treating the mixture formed in the mixing step.
- the mixture formed in the mixing step further includes any one selected from the group consisting of Fe, Ni, Ru, Rh, Pd, Ir and Pt or two or more elements thereof or oxides thereof.
- the mixture formed in the mixing step may further include any one selected from the group consisting of Si, Ga, Ge, and Sn or two or more elements thereof or oxides thereof.
- the heat treatment temperature is 400 °C to 800 °C.
- the heat treatment step may include two or more heat treatment steps.
- thermoelectric conversion element according to the present invention for achieving the above object includes the compound semiconductor described above.
- the solar cell according to the present invention for achieving the above object includes the compound semiconductor described above.
- a novel compound semiconductor material is provided.
- such a novel compound semiconductor can be used as another material in place of or in addition to the conventional compound semiconductor.
- thermoelectric conversion performance of the compound semiconductor is good, it can be usefully used in the thermoelectric conversion element.
- the compound semiconductor according to the present invention can be used as a thermoelectric conversion material of the thermoelectric conversion element.
- a compound semiconductor may be used in a solar cell.
- the compound semiconductor according to the present invention can be used as a light absorption layer of a solar cell.
- the compound semiconductor may be used in an IR window, an infrared sensor, a magnetic element, a memory, etc. for selectively passing infrared rays.
- 3 is a graph showing ZT values according to temperature changes of compound semiconductors of Examples and Comparative Examples prepared according to the present invention.
- the present invention provides a novel compound semiconductor represented by the following formula (1).
- M is Ca, Sr, Ba, Ti, V, Cr, Mn, Cu, Zn, Pd, Ag, Cd, Sc, Y, La, Ce, Pr, Nd, Sm, Eu, Gd, Tb At least one selected from the group consisting of Dy, Ho, Er, Tm, Yb and Lu, A is at least any one selected from the group consisting of Fe, Ni, Ru, Rh, Pd, Ir, and Pt, and X Is at least one selected from the group consisting of Si, Ga, Ge, and Sn, and 0 ⁇ x ⁇ 1, 0 ⁇ y ⁇ 1, 0 ⁇ m ⁇ 1, 0 ⁇ n ⁇ 9 and 0 ⁇ z ⁇ 2.
- x is 0 ⁇ x ⁇ 0.5.
- x is 0 ⁇ x ⁇ 0.25.
- y is 0 ⁇ y ⁇ 0.5.
- y is 0 ⁇ y ⁇ 0.25.
- x and y may be 0 ⁇ x + y ⁇ 1.
- n and z may be 0 ⁇ n + z ⁇ 9.
- m is 0 ⁇ m ⁇ 1.
- m in Chemical Formula 1 is 0 ⁇ m ⁇ 0.5.
- m in Formula 1 is 0 ⁇ m ⁇ 0.1.
- the compound semiconductor represented by Formula 1 may include a part of the secondary phase, the amount may vary depending on the heat treatment conditions.
- the compound semiconductors described above include In, Co, Sb, and Te, Ca, Sr, Ba, Ti, V, Cr, Mn, Cu, Zn, Pd, Ag, Cd, Sc, Y, La, Ce, Pr, Nd Forming a mixture comprising at least one element selected from the group consisting of Sm, Eu, Gd, Tb, Dy, Ho, Er, Tm, Yb and Lu or an oxide thereof; And heat-treating the mixture.
- the mixture may further include any one selected from the group consisting of Fe, Ni, Ru, Rh, Pd, Ir, and Pt, or two or more elements thereof or oxides thereof.
- the mixture may further include any one selected from the group consisting of Si, Ga, Ge, and Sn or two or more elements thereof or oxides thereof.
- each raw material mixed in the mixture forming step may be in powder form, but the present invention is not necessarily limited to the specific type of such mixed raw material.
- the heat treatment step may be performed while flowing a gas such as Ar, He, N 2 , which contains a part of hydrogen or does not include hydrogen, in a vacuum.
- the heat treatment temperature may be 400 °C to 800 °C.
- the heat treatment temperature may be 450 °C to 700 °C. More preferably, the heat treatment temperature may be 500 °C to 650 °C.
- the heat treatment step may include two or more heat treatment steps.
- the mixture formed in the step of forming the mixture that is, mixing the raw materials, may be subjected to a first heat treatment at a first temperature, and then to a second heat treatment at a second temperature.
- some heat treatment steps of the plurality of heat treatment steps may be performed in the mixture forming step of mixing the raw materials.
- the heat treatment step may include three heat treatment steps of a first heat treatment step, a second heat treatment step, and a third heat treatment (sintering) step.
- the first heat treatment step may be performed at a temperature range of 400 ° C. to 600 ° C.
- the second heat treatment step and the third heat treatment step may be performed at a temperature range of 600 ° C. to 800 ° C.
- FIG. the first heat treatment step may be performed during the mixture formation step of mixing the raw materials, and the second heat treatment step and the third heat treatment step may be sequentially performed thereafter.
- thermoelectric conversion element according to the present invention may include the compound semiconductor described above. That is, the compound semiconductor according to the present invention can be used as a thermoelectric conversion material of the thermoelectric conversion element.
- the compound semiconductor according to the present invention has a large ZT which is a figure of merit of a thermoelectric conversion material.
- the Seebeck coefficient and electrical conductivity are high, and the thermal conductivity is low, so the thermoelectric conversion performance is excellent. Therefore, the compound semiconductor according to the present invention can be usefully used in a thermoelectric conversion element in place of or in addition to a conventional thermoelectric conversion material.
- the solar cell according to the present invention may include the compound semiconductor described above. That is, the compound semiconductor according to the present invention can be used as a light absorbing layer of solar cells, in particular solar cells.
- the solar cell can be manufactured in a structure in which a front transparent electrode, a buffer layer, a light absorbing layer, a back electrode, a substrate, and the like are sequentially stacked from the side where sunlight is incident.
- the bottommost substrate may be made of glass, and the back electrode formed on the entire surface may be formed by depositing a metal such as Mo.
- the light absorbing layer may be formed by stacking the compound semiconductor according to the present invention on the back electrode by an electron beam deposition method, a sol-gel method, or a pulsed laser deposition (PLD) method.
- PLD pulsed laser deposition
- a front transparent electrode may be formed on the buffer layer by a layered film of ZnO or ZnO and ITO by sputtering or the like.
- the solar cell according to the present invention may be variously modified.
- stacked the solar cell using the compound semiconductor which concerns on this invention as a light absorption layer can be manufactured.
- stacked in this way can use the solar cell using silicon or another known compound semiconductor.
- the band gap of the compound semiconductor of the present invention by changing the band gap of the compound semiconductor of the present invention, a plurality of solar cells using compound semiconductors having different band gaps as light absorbing layers can be laminated.
- the band gap of the compound semiconductor according to the present invention can be controlled by changing the composition ratio of the constituent elements constituting the compound, in particular Te.
- the compound semiconductor according to the present invention may be applied to an infrared window (IR window) or an infrared sensor for selectively passing infrared rays.
- IR window infrared window
- infrared sensor for selectively passing infrared rays.
- Co, Zn, Sb and Te were prepared as reagents, and these were mixed well using mortar to prepare a mixture of In 0.25 Zn 0.1 Co 4 Sb 11 Te in a pellet form.
- the mixed material was put in a silica tube and vacuum sealed and heated at 650 ° C. for 36 hours, but the temperature rise time was 1 hour 30 minutes to obtain In 0.25 Zn 0.1 Co 4 Sb 11 Te powder.
- Example 1 For the sintered cylinder, ZEM-3 (Ulvac-Rico, Inc) was used to measure the electrical conductivity and the Seebeck coefficient of the sample at predetermined temperature intervals. At this time, the measurement result of the electrical conductivity ( ⁇ ) is shown in FIG. 1 as Example 1. FIG. And, by calculating the ZT value using each of the above measured values, the results are shown in Figure 3 as Example 1.
- Co, Zn, Cd, Sb and Te were prepared as reagents, and these were mixed well using mortar to prepare a mixture of In 0.25 Zn 0.1 Cd 0.1 Co 4 Sb 11 Te in pellet form.
- the mixed materials were put in a silica tube and vacuum sealed and heated at 650 ° C. for 36 hours, but the temperature rising time was 1 hour 30 minutes to obtain In 0.25 Zn 0.1 Cd 0.1 Co 4 Sb 11 Te powder.
- Example 2 For the sintered cylinder, ZEM-3 (Ulvac-Rico, Inc) was used to measure the electrical conductivity and the Seebeck coefficient of the sample at predetermined temperature intervals. At this time, the measurement result of the electrical conductivity is shown in Figure 1 as Example 2. And, by calculating the ZT value using each of the above measured values, the results are shown in Figure 3 as Example 2.
- Example 3 For the sintered cylinder, ZEM-3 (Ulvac-Rico, Inc) was used to measure the electrical conductivity and the Seebeck coefficient of the sample at predetermined temperature intervals. At this time, the measurement result of the electrical conductivity is shown in Fig. 1 as Example 3. And, by calculating the ZT value using each of the above measured values, the results are shown in Figure 3 as Example 3.
- Co, Sb was prepared as a reagent, and these were mixed well using mortar to prepare a mixture of In 0.25 Co 4 Sb 12 composition in pellet form.
- the mixed material was heated at 675 ° C. for 36 hours while flowing H 2 (1.94%) and N 2 gas, and the temperature rising time was 1 hour 30 minutes.
- the comparative sample thus synthesized was molded into a cylinder having a diameter of 4 mm and a length of 15 mm, and another part was formed into a disc having a diameter of 10 mm and a thickness of 1 mm, and then pressurized to 200 MPa using CIP. The resultant was then placed in a quartz tube and vacuum sintered for 12 hours.
- the thermal conductivity of the sample was measured using TC-7000 (Ulvac-Rico, Inc), and the results are shown in FIG. 2 as a comparative example.
- the compound semiconductors of Examples 1 to 3 according to the present invention have a higher electrical conductivity ⁇ over the entire temperature measurement section than the compound semiconductor of the comparative example.
- the compound semiconductors of Examples 1 to 3 according to the present invention have a very high ZT value as compared to the compound semiconductors of the Comparative Examples.
- the higher the temperature, the compound semiconductor of the Example shows a greater difference from the compound semiconductor of the comparative example.
- the electrical conductivity is high, the thermal conductivity is low, and the ZT value is large as compared with the conventional compound semiconductor of the comparative example according to each embodiment of the present invention. Therefore, the compound semiconductor according to the embodiment of the present invention can be said to have excellent thermoelectric conversion performance, and thus can be very usefully used as a thermoelectric conversion material.
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Abstract
Description
Claims (14)
- 하기 화학식 1로 표시되는 화합물 반도체.<화학식 1>InxMyCo4-mAmSb12-n-zXnTez상기 화학식 1에서, M은 Ca, Sr, Ba, Ti, V, Cr, Mn, Cu, Zn, Pd, Ag, Cd, Sc, Y, La, Ce, Pr, Nd, Sm, Eu, Gd, Tb, Dy, Ho, Er, Tm, Yb 및 Lu으로 이루어진 군으로부터 선택된 적어도 어느 하나 이상이고, A는 Fe, Ni, Ru, Rh, Pd, Ir 및 Pt로 이루어진 군으로부터 선택된 적어도 어느 하나 이상이며, X는 Si, Ga, Ge 및 Sn으로 이루어진 군으로부터 선택된 적어도 어느 하나 이상이고, 0<x<1, 0<y<1, 0≤m≤1, 0≤n<9 및 0<z≤2이다.
- 제1항에 있어서,상기 화학식 1의 x는, 0<x≤0.5인 것을 특징으로 하는 화합물 반도체.
- 제1항에 있어서,상기 화학식 1의 y는, 0<y≤0.5인 것을 특징으로 하는 화합물 반도체.
- 제1항에 있어서,상기 화학식 1의 x 및 y는, 0<x+y≤1인 것을 특징으로 하는 화합물 반도체.
- 제1항에 있어서,상기 화학식 1의 n 및 z는, 0<n+z<9인 것을 특징으로 하는 화합물 반도체.
- 제1항에 있어서,상기 화학식 1의 m은, 0<m≤0.5인 것을 특징으로 하는 화합물 반도체.
- 제1항에 있어서,상기 화학식 1의 m은, 0<m≤0.1인 것을 특징으로 하는 화합물 반도체.
- In, Co, Sb 및 Te와, Ca, Sr, Ba, Ti, V, Cr, Mn, Cu, Zn, Pd, Ag, Cd, Sc, Y, La, Ce, Pr, Nd, Sm, Eu, Gd, Tb, Dy, Ho, Er, Tm, Yb 및 Lu으로 이루어진 군으로부터 선택된 어느 하나 또는 이들 중 2종 이상의 원소 또는 그 산화물을 포함하는 혼합물을 형성하는 단계; 및상기 혼합물을 열처리하는 단계를 포함하는 제1항의 화합물 반도체의 제조 방법.
- 제8항에 있어서,상기 혼합물은, Fe, Ni, Ru, Rh, Pd, Ir 및 Pt로 이루어진 군으로부터 선택된 어느 하나 또는 이들 중 2종 이상의 원소 또는 그 산화물을 더 포함하는 것을 특징으로 하는 화합물 반도체의 제조 방법.
- 제8항에 있어서,상기 혼합물은, Si, Ga, Ge 및 Sn으로 이루어진 군으로부터 선택된 어느 하나 또는 이들 중 2종 이상의 원소 또는 그 산화물을 더 포함하는 것을 특징으로 하는 화합물 반도체의 제조 방법.
- 제8항에 있어서,상기 열처리 단계는, 400℃ 내지 800℃에서 수행되는 것을 특징으로 하는 화합물 반도체의 제조 방법.
- 제8항에 있어서,상기 열처리 단계는, 둘 이상의 열처리 단계를 포함하는 것을 특징으로 하는 화합물 반도체의 제조 방법.
- 제1항에 따른 화합물 반도체를 포함하는 열전 변환 소자.
- 제1항에 따른 화합물 반도체를 포함하는 태양 전지.
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