WO2012144103A1 - Élément inducteur feuilleté et procédé de fabrication de celui-ci - Google Patents

Élément inducteur feuilleté et procédé de fabrication de celui-ci Download PDF

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Publication number
WO2012144103A1
WO2012144103A1 PCT/JP2011/076987 JP2011076987W WO2012144103A1 WO 2012144103 A1 WO2012144103 A1 WO 2012144103A1 JP 2011076987 W JP2011076987 W JP 2011076987W WO 2012144103 A1 WO2012144103 A1 WO 2012144103A1
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WO
WIPO (PCT)
Prior art keywords
conductive pattern
layer
inductor
multilayer
magnetic
Prior art date
Application number
PCT/JP2011/076987
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English (en)
Japanese (ja)
Inventor
家田章弘
大坪喜人
Original Assignee
株式会社村田製作所
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社村田製作所 filed Critical 株式会社村田製作所
Publication of WO2012144103A1 publication Critical patent/WO2012144103A1/fr

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
    • H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
    • H01F41/041—Printed circuit coils
    • H01F41/046—Printed circuit coils structurally combined with ferromagnetic material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type 
    • H01F17/0006—Printed inductances
    • H01F17/0013—Printed inductances with stacked layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type 
    • H01F17/0006—Printed inductances
    • H01F2017/0066—Printed inductances with a magnetic layer

Definitions

  • the present invention relates to a multilayer inductor element in which an inductor is formed on a laminate in which at least a plurality of magnetic layers are laminated, and a method for manufacturing the same.
  • FIG. 1 is a cross-sectional view of a multilayer inductor element described in Patent Document 1.
  • a circular coil 102 is formed in a magnetic body portion 101, and a conductor forming the circular coil 102 and the magnetic body portion 101 are not in direct contact with each other.
  • the circumferential coil 102 is provided with a gap 103 around it, so that the stress in the peripheral portion of the circumferential coil 102 can be relieved, and the influence on the magnetic body portion 101 is not affected.
  • the magnetic body portion 101 maintains the magnetic characteristics of the original magnetic material, and the deterioration of the inductance and impedance due to internal stress is eliminated, so that the multilayer inductor element described in Patent Document 1 has a high inductance, a high Impedance is realized.
  • an object of the present invention is to provide a multilayer inductor element and a manufacturing method capable of increasing the inductance value without increasing the manufacturing process.
  • a multilayer inductor element includes a multilayer body in which sheet layers including a plurality of magnetic bodies are laminated, and a conductive pattern that forms an inductor provided between the layers of the multilayer body.
  • a first conductive pattern in an open loop shape provided between the layers of the stacked body, and along the first conductive pattern at a distance from the first conductive pattern in the same layer as the first conductive pattern And an open-loop second conductive pattern that is electrically connected to the first conductive pattern at both ends.
  • the inductor is formed by the first and second conductive patterns arranged in two rows (or more) with an interval (gap) therebetween.
  • a air gap can be formed in the magnetic path, the direct current superposition characteristics of the inductor can be improved, and stress relaxation of the magnetic layer can be achieved.
  • gap is not required.
  • a multilayer inductor element includes a laminate in which sheet layers including a plurality of magnetic bodies are laminated, an open-loop conductive pattern provided between the laminates to form an inductor, and the conductive pattern And a ceramic paste pattern provided along the first conductive pattern at an interval with respect to the conductive pattern.
  • a gap is formed by providing a ceramic paste pattern (preferably a magnetic paste containing a magnetic material) at a distance from the conductive pattern, thereby improving the DC superposition characteristics of the inductor, The body layer is stress-relieved.
  • This ceramic paste pattern is generally provided in order to improve the coplanarity (flatness) of the multilayer inductor element, and the gap can be provided without increasing a special process for providing the gap.
  • the ceramic paste pattern includes a magnetic material.
  • the conductive pattern is provided on a sheet layer including the plurality of magnetic bodies of the multilayer body, and is connected in the stacking direction of the multilayer substrate to form one inductor. It may be configured.
  • one inductor is formed from a conductive pattern provided on a sheet layer including a plurality of magnetic bodies, a multilayer inductor element having a higher inductance value can be obtained.
  • the inductance value of the multilayer inductor element can be increased without increasing the number of manufacturing steps.
  • FIG. 2 is a schematic cross-sectional view of a multilayer inductor element.
  • the upper side of the paper is the upper surface side of the multilayer inductor element 1 and the lower side of the paper is the lower surface side of the multilayer inductor element.
  • the multilayer inductor element 1 is used in, for example, a non-insulated DC-DC converter or a step-down converter mounted on a mobile phone or the like.
  • the multilayer inductor element 1 includes a multilayer body 2 in which a total of 14 magnetic layers 4 and non-magnetic layer 5 ceramic green sheets are laminated.
  • the first layer, the second layer, the seventh layer, the thirteenth layer, and the fourteenth layer counted from the upper surface (upper side of the sheet) of the laminate 2 are the nonmagnetic layer 5, and the other layers are the magnetic layers. 4
  • each layer is provided on the upper surface of each layer (magnetic layer 4 or nonmagnetic layer 5) of the laminate 2, the laminate 2 shown in FIG.
  • Each layer is formed so that its upper surface is on the lower side.
  • the upper surface of the first layer is on the lower side and is joined to the lower surface of the second layer.
  • the magnetic layer 4 is composed mainly of a ferrite containing nickel, zinc, and copper and a ceramic material, for example.
  • the nonmagnetic layer 5 is mainly composed of ferrite containing iron, zinc, and copper and a ceramic material.
  • the inductor 3 has a conductive conductive pattern 30 made of Ag provided on a part of the ceramic green sheets constituting the multilayer body 2, and a via-hole conductor (not shown) is formed with the lamination direction of the multilayer body 2 as an axial direction. Via a spiral connection.
  • the conductive pattern 30 is provided on the upper surfaces (lower sides in the drawing) of the third layer, the fifth layer, the seventh layer, the ninth layer, and the eleventh layer of the stacked body 2.
  • An external electrode (not shown) is formed on the first nonmagnetic material layer 5 which is the uppermost layer of the multilayer body 2, and an IC (Integrated Circuit) 10 a and capacitors 10 b and 10 c are mounted on the external electrode.
  • IC Integrated Circuit
  • the multilayer inductor element becomes an electronic component module (such as a DC-DC converter or a step-down converter).
  • a terminal electrode (not shown) is formed on the 14th nonmagnetic layer 5 which is the lowest layer of the multilayer body 2, and the multilayer inductor element 1 is shipped as an electronic component module to this terminal electrode. Thereafter, an electronic component module is mounted in the product manufacturing process of the electronic device. That is, it becomes a terminal electrode to be connected to a land electrode or the like on the mounting substrate side.
  • the non-magnetic layer 5 of the seventh layer substantially functions as a magnetic gap, and the DC superposition characteristic can be improved by adopting a configuration in which the magnetic gap is provided in the middle of the inductor 3, so that the inductor 3 in the heavy load region can be improved.
  • the inductance value can be improved.
  • the nonmagnetic layer 5 in this embodiment has a lower thermal shrinkage rate than the magnetic layer 4. Therefore, by sandwiching the magnetic layer 4 having a relatively high thermal contraction rate with the nonmagnetic layer 5 having a relatively low thermal contraction rate, the entire element can be compressed by firing to improve the strength. .
  • FIG. 3 is a schematic diagram showing the conductive pattern 30 constituting the inductor 3.
  • FIG. 3 is a top view of one of the layers (for example, the third layer) of the stacked body 2 provided with the conductive pattern 30.
  • Other layers provided with the conductive pattern 30 are the same as in FIG. 3 and are electrically connected via via-hole conductors formed in the respective layers.
  • 2 is a cross-sectional view taken along the line II-II in FIG.
  • the conductive pattern 30 has two conductive patterns 31 and 32 formed in an open loop shape with the substantially central portion of the layer (the magnetic layer 4 in FIG. 3) as the center.
  • the conductive patterns 31 and 32 are provided with a slit-shaped gap 33 therebetween, and are electrically connected at both ends of the open loop.
  • Via hole conductors 34 and 35 are formed at both ends, and are electrically connected to the conductive pattern 30 of the other layer.
  • the conductive patterns 30 of the respective layers are spirally connected to form one inductor 3.
  • the widths of the two conductive patterns 31 and 32 are determined by determining the width of the conductive pattern 30 and dividing the determined width into two. For example, when a single conductive pattern having no gap 33 is provided in each layer of the multilayer body 2 to form an inductor of a multilayer inductor element as in the prior art, a necessary width (for example, 100 ⁇ m) of the conductive pattern is required. When determined, the width of each of the two conductive patterns 31 and 32 is determined to be a value obtained by dividing the determined width into two (for example, 50 ⁇ m).
  • the inductor 3 is provided with the air gap 33 between the two rows of the conductive patterns 31 and 32, that is, in the magnetic path, the magnetic flux density of the inductor 3 is unlikely to be excessive.
  • a predetermined inductance value can be obtained even in the load region. That is, the direct current superimposition characteristic of the inductor 3 can be improved.
  • the magnetic sheet is generally harder than the dielectric sheet and has a property of not easily deforming even when the sheet is pressed, the space formed between the conductive patterns 31 and 32 is not easily filled with the magnetic sheet.
  • the air gap 33 for increasing the inductance value of the inductor 3 is formed by providing the conductive patterns 31 and 32, a process for forming the air gap 33, for example, a process of printing carbon or the like and flying it by firing. Is not required separately.
  • the gap 33 between the conductive patterns 31 and 32 has a width that is not buried by the conductive patterns 31 and 32 due to the pressure when the laminate 2 is crimped.
  • the width of the gap 33 is preferably 35 to 250 ⁇ m.
  • the relationship between the width of the gap 33 and the thickness of the layer is not limited to this, and can be changed as appropriate.
  • the gap 33 is not filled with the conductive patterns 31 and 32. However, even if the gap 33 is buried, the conductive patterns 31 and 32 are electrically connected to each other at the end portions. The characteristics are not greatly affected. Therefore, the unusable multilayer inductor element 1 is not wasted.
  • the multilayer inductor element is manufactured by the following process.
  • an alloy (conductive paste) containing Ag or the like is applied on the ceramic green sheets to be the magnetic layer 4 and the nonmagnetic layer 5 to form a conductive pattern that forms the inductor 3 and the like.
  • the alloy is applied so that the conductive patterns 31, 32 that are conductive at both ends are formed at a predetermined interval. Thereby, after each layer is pressure-bonded and fired, a gap 33 is formed between the conductive patterns 31 and 32.
  • each ceramic green sheet is laminated. That is, in order from the lower surface side, a ceramic green sheet to be the nonmagnetic layer 5, a ceramic green sheet to be the magnetic layer 4, a ceramic green sheet to be the nonmagnetic layer 5, a ceramic green sheet to be the magnetic layer 4, and Ceramic green sheets to be the nonmagnetic layer 5 are laminated and subjected to temporary pressure bonding. Thereby, the mother laminated body before baking is formed.
  • the thickness of each layer is adjusted by adjusting the number of ceramic green sheets or the thickness of each sheet.
  • an electrode paste whose main component is silver is applied to the surface of the formed mother laminate to form external electrodes and terminal electrodes, and then fired. Thereby, the fired mother laminated body is obtained.
  • the multilayer inductor element 1 thus manufactured becomes an electronic component module by mounting electronic components such as the IC 10a and the capacitors 10b and 10c.
  • the gap 33 for improving the DC superposition characteristics of the inductor 3 is formed by forming the conductive patterns 31 and 32 in the manufacturing process, a special process for forming the gap 33 is performed. There is no need to do extra.
  • FIG. 4 is a schematic cross-sectional view of a multilayer inductor element having a conductive pattern in which no gap is formed.
  • the conductive patterns 30 formed in the fifth layer and the ninth layer have gaps 33, but the conductive patterns 30A formed in the third layer, the seventh layer, and the eleventh layer are , Does not have voids. In this way, by mixing conductive patterns without providing a gap, the inductance value of the inductor 3 can be adjusted.
  • FIG. 5 is a schematic diagram showing another example of the conductive pattern constituting the inductor 3.
  • one conductive pattern 36 is formed in an open loop shape around the substantially central portion of the layer 2 (magnetic layer 4 in FIG. 5).
  • the conductive pattern 36 is formed with via-hole conductors 37 and 38 at both ends, and is electrically connected to the conductive patterns in the other layers. As a result, the conductive patterns of the respective layers are spirally connected to form one inductor 3.
  • ceramic patterns 40 are formed along the conductive patterns 36 at intervals.
  • the ceramic pattern 40 is preferably formed by applying a ceramic paste containing a magnetic material.
  • the space between the conductive pattern 36 and the ceramic pattern 40 has the same function as the gap 33 described in the above embodiment.
  • the ceramic pattern 40 is generally provided in order to eliminate unevenness caused by forming the conductive pattern 36 and to improve the coplanarity (flatness) of the multilayer inductor element.
  • the gap is provided using the ceramic pattern 40 that is not for providing the gap, the gap can be provided without increasing the number of special steps. Further, in the case of FIG. 5, since the diameter of the inductor is not reduced in comparison with the case of FIG. 3, a higher impedance value can be obtained without changing the impedance value.
  • the ceramic pattern 40 instead of the ceramic pattern 40, another resin pattern may be used.
  • the ceramic pattern 40 is preferably formed after the conductive pattern 36 is formed.

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Coils Or Transformers For Communication (AREA)

Abstract

L'invention concerne un élément inducteur feuilleté permettant d'augmenter la valeur de l'inductance sans augmenter le nombre des étapes de fabrication, ainsi qu'un procédé de fabrication de l'élément inducteur feuilleté. Un élément inducteur feuilleté (1) comprend un corps feuilleté (2) possédant des couches de matériau magnétique (4) et des couches de matériau non magnétique (5) feuilletés; et des motifs conducteurs en forme de boucle ouverte (30) qui sont placés entre les couches du corps feuilleté (2) et qui forment des inducteurs (3). Chacun des motifs conducteurs (30) possède des motifs conducteurs (31, 32) dans la couche de matériau magnétique (4) ou la couche de matériau non magnétique (5), lesdits motifs conducteurs (31, 32) étant formés en respectant un intervalle tel qu'un vide (33) est formé.
PCT/JP2011/076987 2011-04-19 2011-11-24 Élément inducteur feuilleté et procédé de fabrication de celui-ci WO2012144103A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2011-092922 2011-04-19
JP2011092922 2011-04-19

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WO2012144103A1 true WO2012144103A1 (fr) 2012-10-26

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Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013033941A (ja) * 2011-07-29 2013-02-14 Samsung Electro-Mechanics Co Ltd 積層型インダクタ及びその製造方法
WO2014069050A1 (fr) * 2012-11-01 2014-05-08 株式会社村田製作所 Bobine d'induction stratifiée
JP2014150096A (ja) * 2013-01-31 2014-08-21 Toko Inc 積層型電子部品
JP2018506321A (ja) * 2015-01-09 2018-03-08 ストライカー・コーポレイション 力制御ロボットのための分離式力／トルクセンサアセンブリ
CN111128517A (zh) * 2018-10-30 2020-05-08 Tdk株式会社 层叠线圈部件
US20200312536A1 (en) * 2019-04-01 2020-10-01 Samsung Electro-Mechanics Co., Ltd. Coil component

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04354109A (ja) * 1991-05-30 1992-12-08 Taiyo Yuden Co Ltd 積層チップインダクタの製造方法
JP2004080023A (ja) * 2002-07-30 2004-03-11 Sumitomo Special Metals Co Ltd 積層型インダクタ
JP2008166385A (ja) * 2006-12-27 2008-07-17 Tdk Corp 積層インダクタの製造方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04354109A (ja) * 1991-05-30 1992-12-08 Taiyo Yuden Co Ltd 積層チップインダクタの製造方法
JP2004080023A (ja) * 2002-07-30 2004-03-11 Sumitomo Special Metals Co Ltd 積層型インダクタ
JP2008166385A (ja) * 2006-12-27 2008-07-17 Tdk Corp 積層インダクタの製造方法

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013033941A (ja) * 2011-07-29 2013-02-14 Samsung Electro-Mechanics Co Ltd 積層型インダクタ及びその製造方法
US9041506B2 (en) 2011-07-29 2015-05-26 Samsung Electro-Mechanics Co., Ltd. Multilayer inductor and method of manufacturing the same
WO2014069050A1 (fr) * 2012-11-01 2014-05-08 株式会社村田製作所 Bobine d'induction stratifiée
JPWO2014069050A1 (ja) * 2012-11-01 2016-09-08 株式会社村田製作所 積層型インダクタ素子
US9601253B2 (en) 2012-11-01 2017-03-21 Murata Manufacturing Co., Ltd. Laminated-type inductance device
JP2014150096A (ja) * 2013-01-31 2014-08-21 Toko Inc 積層型電子部品
JP2018506321A (ja) * 2015-01-09 2018-03-08 ストライカー・コーポレイション 力制御ロボットのための分離式力／トルクセンサアセンブリ
CN111128517A (zh) * 2018-10-30 2020-05-08 Tdk株式会社 层叠线圈部件
US20200312536A1 (en) * 2019-04-01 2020-10-01 Samsung Electro-Mechanics Co., Ltd. Coil component
US11631531B2 (en) * 2019-04-01 2023-04-18 Samsung Electro-Mechanics Co., Ltd. Coil component

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