WO2012138063A2 - 비전도성 물질의 패터닝 처리 방식을 이용한 전착 다이아몬드 와이어 쏘우 및 그 제조 방법 - Google Patents
비전도성 물질의 패터닝 처리 방식을 이용한 전착 다이아몬드 와이어 쏘우 및 그 제조 방법 Download PDFInfo
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- WO2012138063A2 WO2012138063A2 PCT/KR2012/001943 KR2012001943W WO2012138063A2 WO 2012138063 A2 WO2012138063 A2 WO 2012138063A2 KR 2012001943 W KR2012001943 W KR 2012001943W WO 2012138063 A2 WO2012138063 A2 WO 2012138063A2
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- WIPO (PCT)
- Prior art keywords
- wire
- diamond
- electrodeposited
- circumferential surface
- outer circumferential
- Prior art date
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
- B24D18/0018—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for by electrolytic deposition
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
- B23D61/00—Tools for sawing machines or sawing devices; Clamping devices for these tools
- B23D61/18—Sawing tools of special type, e.g. wire saw strands, saw blades or saw wire equipped with diamonds or other abrasive particles in selected individual positions
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
- B23D61/00—Tools for sawing machines or sawing devices; Clamping devices for these tools
- B23D61/18—Sawing tools of special type, e.g. wire saw strands, saw blades or saw wire equipped with diamonds or other abrasive particles in selected individual positions
- B23D61/185—Saw wires; Saw cables; Twisted saw strips
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
- B23D65/00—Making tools for sawing machines or sawing devices for use in cutting any kind of material
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B27/00—Other grinding machines or devices
- B24B27/06—Grinders for cutting-off
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D13/00—Electrophoretic coating characterised by the process
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D15/00—Electrolytic or electrophoretic production of coatings containing embedded materials, e.g. particles, whiskers, wires
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/02—Electroplating of selected surface areas
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/02—Electroplating of selected surface areas
- C25D5/022—Electroplating of selected surface areas using masking means
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/06—Wires; Strips; Foils
- C25D7/0607—Wires
Definitions
- the present invention relates to an electrodeposited diamond wire saw using a patterning process of a non-conductive material and a method for manufacturing the same, and in particular, facilitates the manufacturing process of the diamond wire saw used for semiconductor cutting processing such as silicon ingot, sapphire wafer, etc. It also relates to technology that can reduce manufacturing costs and improve product quality.
- Wire sawing is a method that can perform not only cutting processing of silicon ingots, sapphire wafers, etc., but also grinding processing using a wire saw provided by protruding a plurality of diamond abrasive grains on the wire or such a wire. .
- the wire uses a high tensile strength metal material, steel wire, nickel wire, nichrome wire, and the like, for example, a variety of other materials may be used.
- Electrodeposited diamond wire saw is manufactured by electrodepositing diamond abrasive grains around the outer peripheral surface along the longitudinal direction of such a wire.
- An object of the present invention is to pre-pattern the non-conductive material along the outer circumferential surface of the wire, followed by electrodeposition of the diamond abrasive grains, so that the diamond abrasive grains can be electrodeposited only in the non-conductive material section, thereby improving process efficiency and manufacturing.
- the present invention provides an electrodeposition diamond wire saw and a method of manufacturing the same, which can reduce the unit cost and improve product quality.
- Another object of the present invention is to provide an electrodeposition diamond wire saw and a method of manufacturing the same, in which a diamond abrasive grain is easily electrodeposited after a patterning process by spraying a masking liquid in a plurality of directions at the same time as the wire is injected. .
- Another object of the present invention is a method of coating the entire surface of the wire with a non-conductive material, and then patterning through an exposure and etching process, after which electrodeposited diamond wire saws and a method of easily electrodepositing diamond abrasive grains and their manufacture In providing a method.
- Still another object of the present invention is to attach a patterned non-conductive tape having a perforation hole to a wire in a specific section in which diamond abrasive grains are to be electrodeposited to a wire surface, thereby electrodepositing diamond abrasive grains in a manner that can be easily electrodeposited.
- a diamond wire saw and a method of manufacturing the same are provided.
- the printing of the masking liquid is arranged such that a plurality of print nozzles have the same sandwiched angle with respect to the outer circumferential surface of the wire, and the predetermined pattern path is formed on the outer circumferential surface of the wire to be injected. It is preferable to print the masking liquid.
- the printing of the masking liquid may be implemented by an inkjet method.
- the outer peripheral surface remainder region of the wire on which the diamond abrasive grains are electrodeposited is preferably formed to have a spiral shape along the length direction of the wire.
- step (a) the printing of the masking liquid, a single print nozzle is spaced apart from the outer peripheral surface of the wire, the masking liquid along a predetermined pattern path on the outer peripheral surface of the wire that rotates at the same time as the injection It is preferable that the printing cycle of the print nozzle is controlled in such a manner that the printing is performed.
- the front coating the outer peripheral surface of the wire with a masking liquid (a) the front coating the outer peripheral surface of the wire with a masking liquid; (b) exposing and patterning the wire with the masking liquid overcoated in a predetermined pattern and performing etching; And (c) electrodepositing diamond abrasive grains on the remaining portion of the outer circumferential surface of the wire except for the patterned region, thereby providing an electrodeposition diamond wire saw.
- the exposure is preferably made in a manner of irradiating UV light.
- the method for patterning the outer circumferential surface of the wire by attaching the masking tape, in advance forming a plurality of perforation holes in a spiral shape along the longitudinal direction of the wire to the masking tape The method may be used to attach the masking tape on which the perforation hole is formed to the outer circumferential surface of the wire.
- the method for patterning the outer circumferential surface of the wire by attaching the masking tape the masking tape is attached to the outer circumferential surface of the wire in a spiral shape along the longitudinal direction of the wire Manner may be used.
- a non-conductive material pattern is formed in some sections of the outer peripheral surface of the wire, diamond abrasive grains are electrodeposited in the remaining sections of the outer peripheral surface of the wire to provide an electrode.
- diamond abrasive grains are electrodeposited in the remaining sections of the outer peripheral surface of the wire to provide an electrode. Can be.
- the non-conductive material may be formed as a spiral trajectory along the length direction of the wire.
- the diamond abrasive grains may be formed in a spiral trajectory along the length direction of the wire.
- the inventor's electrodeposited diamond wire saw and its manufacturing method prior to the process of electrodepositing the diamond abrasive grains on the wire, by pre-patterning the non-conductive material along the outer circumferential surface of the wire to be electrodeposited diamond abrasive grains in advance, By improving the efficiency, it is possible to reduce the manufacturing cost, improve the product quality, thereby having an advantageous effect that can improve the product competitiveness.
- the present invention presents four preferred embodiments as preferred examples of the above nonconductive material patterning process.
- the masking liquid is sprayed in a plurality of directions with respect to the outer circumferential surface of the wire by an inkjet method to pattern the diamond abrasive grains.
- the wire is rotated at the time of injection of the wire, and the masking liquid is sprayed by the inkjet method in only one direction to pattern the diamond abrasive grains.
- the front surface of the wire is coated with a non-conductive material, followed by patterning through exposure and etching, followed by electrodeposition of diamond abrasive grains.
- the fourth embodiment is a form in which a diamond abrasive grain is electrodeposited after a patterning process is performed by attaching a non-conductive tape having a perforation hole to a wire only in a specific section where the diamond abrasive grain is electrodeposited with respect to the wire surface.
- FIG. 1 is a flow chart showing a method for manufacturing an electrodeposited diamond wire saw using a patterning treatment method of a non-conductive material according to a first embodiment of the present invention
- FIG. 2 is a flowchart illustrating a method for manufacturing an electrodeposited diamond wire saw using a patterning treatment method of a non-conductive material according to a first embodiment of the present invention
- FIG. 3 is a flow chart showing a method of manufacturing an electrodeposited diamond wire saw using a patterning treatment method of a non-conductive material according to a second embodiment of the present invention
- FIG. 4 is a flowchart illustrating a method for manufacturing an electrodeposited diamond wire saw using a patterning treatment method of a non-conductive material according to a second embodiment of the present invention
- FIG. 5 is a flowchart showing a method of manufacturing an electrodeposited diamond wire saw using a patterning treatment method of a non-conductive material according to a third embodiment of the present invention
- FIG. 6 is a flowchart illustrating a method for manufacturing an electrodeposited diamond wire saw using a patterning treatment method of a non-conductive material according to a third embodiment of the present invention
- FIG. 7 is a flowchart illustrating a method of manufacturing an electrodeposited diamond wire saw using a patterning treatment method of a non-conductive material according to a fourth embodiment of the present invention.
- FIG. 8 is a flowchart illustrating a method for manufacturing an electrodeposited diamond wire saw using a patterning treatment method of a non-conductive material according to a fourth embodiment of the present invention.
- Wire sawing uses wire saws to cut and grind various metal workpieces such as aluminum (Al), copper (Cu), gold (Au), silver (Ag), etc., as well as chip packages, plastics and resins in recent years. It is a technique which extends the range of the workpiece
- the wire saw consists of a structure including a high tension wire and abrasive grains electrodeposited along the outer circumferential surface thereof.
- the wire is made of a material such as steel wire, nickel wire, nichrome wire, and the like
- the abrasive grain is made of a material having excellent hardness and machinability such as diamond, silicon carbide (SiC) and the like.
- Electrodeposited diamond wire saws are widely used in semiconductor cutting operations such as silicon ingots and sapphire wafers.
- 1 is a flow chart showing a method for manufacturing an electrodeposited diamond wire saw using a patterning treatment method of a non-conductive material according to a first embodiment of the present invention.
- 2 is a flowchart illustrating a method of manufacturing an electrodeposited diamond wire saw using a patterning treatment method of a non-conductive material according to a first embodiment of the present invention.
- FIG. 2 is a schematic diagram illustrating a process for more specifically identifying a method for manufacturing an electrodeposited diamond wire saw according to the first embodiment of the present invention to be described with reference to FIG. 1.
- the masking liquid is printed on the outer circumferential surface of the wire in a predetermined pattern form for the efficiency of the electrodeposition process.
- the masking liquid is sprayed in a plurality of directions (three directions in the drawing) with respect to the outer circumferential surface of the wire 110 injected in one direction, and is printed.
- a plurality of print nozzles (not shown) can be used.
- the printing nozzle at this time is a structure which print-processes the masking liquid on the outer peripheral surface of the wire 110 by the inkjet system, and can use any form as long as it is a commonly used inkjet printing nozzle.
- a plurality of printing nozzles are formed at the same included angle with respect to the outer circumferential surface of the wire 110.
- the included angles may be composed of three composed of 120 °, and the number of the present invention is Do not limit the category.
- the outer circumferential surface of the wire 110 may be patterned.
- the patterning path may follow the path set by the user before the manufacturing process, and the pattern path may be set slightly differently according to the shape of the electrodeposited diamond wire saw of the target shape to be manufactured.
- the masking liquid is patterned on the outer circumferential surface of the wire after the present step ST110, except for the section in which the diamond abrasive grains are to be electrodeposited in the step to be described later.
- This step ST120 is a step of electrodepositing diamond abrasive grains along the outer circumferential surface of the wire other than the patterned section in the previous step.
- Electrodeposition of the diamond abrasive grains may be carried out in such a way that the diamond abrasive grains contained in the nickel plating solution are attached to the wires together when the nickel is electroplated on the wires, and may be performed in various known manners.
- a patterning process using a masking liquid is performed except for a section in which the diamond abrasive grains 120 are electrodeposited on the outer circumferential surface of the wire 110.
- the remaining area of the outer circumferential surface of the wire 110 where the diamond abrasive grains 120 are electrodeposited that is, the area where the patterning is not processed in the previous step ST110, has a spiral shape along the length direction of the wire 110. It can be seen that it has a continuous trajectory.
- diamond abrasive grains may be electrodeposited on the wire along a uniform and precise spiral trajectory as shown in FIG.
- the first embodiment of the present invention includes only two levels of detailed configuration, so that in the manufacture of electrodeposited diamond wire saws, the management of the manufacturing process is easy and the cost is easy. Brings the effect of savings and man-hours.
- 3 is a flow chart showing a method of manufacturing an electrodeposited diamond wire saw using a patterning treatment method of a non-conductive material according to a second embodiment of the present invention.
- 4 is a flowchart illustrating a method of manufacturing an electrodeposited diamond wire saw using a patterning treatment method of a non-conductive material according to a second embodiment of the present invention.
- FIG. 4 is a diagram illustrating a process for more specifically confirming the electrodeposition diamond wire saw manufacturing method according to the second embodiment of the present invention to be described with reference to FIG. 3. See also parallel.
- a masking liquid is printed on the outer circumferential surface of the wire in a predetermined pattern form for the efficiency of the electrodeposition process.
- the second embodiment of the present invention differs from the above-described first embodiment in that the masking liquid is printed in one direction with respect to the outer circumferential surface of the wire to be rotated.
- the wire 110 injected in one direction rotates.
- the masking liquid is sprayed in one direction with respect to the outer circumferential surface of the rotating wire 110 and is printed.
- a printing nozzle can be used, and an inkjet method can be used similarly to the first embodiment described above.
- Masking liquid may be printed after injection from a print nozzle spaced from the outer circumferential surface of the rotationally injected wire 110 and disposed on only one side. In order to be printed along a predetermined pattern path, the printing cycle of the print nozzle may be controlled. desirable.
- the masking liquid can be printed on the outer peripheral surface of the wire along the pattern path set by the user.
- the pattern path set by the user may be set slightly differently according to the shape of the electrodeposited diamond wire saw of the target shape to be manufactured.
- the masking liquid is patterned on the outer circumferential surface of the wire having finished this step ST210 for all sections except for the section in which the diamond abrasive grains are to be electrodeposited in the steps to be described later.
- This step ST220 is a step of electrodepositing diamond abrasive grains along the outer circumferential surface of the wire other than the patterned section in the previous step.
- the patterning process using the masking liquid is performed except for the section in which the diamond abrasive grains 120 are electrodeposited on the outer circumferential surface of the wire 110.
- the remaining area of the outer circumferential surface of the wire 110 to which the diamond abrasive grains 120 are electrodeposited that is, the area where the patterning is not processed in the previous step ST210, has a spiral shape in the longitudinal direction of the wire 110. It can be confirmed that it has a trajectory.
- the process of the present step ST220 may be performed in the same or similar manner to the diamond abrasive electrode deposition step ST120 of the first embodiment described above with reference to FIG. 1.
- 5 is a flowchart illustrating a method of manufacturing an electrodeposited diamond wire saw using a patterning treatment method of a non-conductive material according to a third embodiment of the present invention.
- 6 is a flowchart illustrating a method for manufacturing an electrodeposited diamond wire saw using a patterning treatment method of a non-conductive material according to a third embodiment of the present invention.
- FIG. 6 is a diagram illustrating a process for more specifically confirming the electrodeposition diamond wire saw manufacturing method according to the third embodiment of the present invention to be described with reference to FIG. 5. See also parallel.
- This step (ST310) is a step of completely coating the outer peripheral surface of the wire with a masking liquid.
- the process of completely coating the outer circumferential surface of the wire with the masking liquid has a meaning as a preceding process for treating the masking liquid on the outer circumferential surface of the wire in a predetermined pattern by a photomasking technique of a step to be described later.
- FIG. 6A a process operation diagram for completely coating the outer circumferential surface of the wire 110 with a masking liquid is disclosed.
- the entering wire 110 is immersed in the container in which the masking liquid is stored to coat the masking liquid on the outer circumferential surface of the wire 110 sufficiently.
- the coating method shown in (a) of FIG. 6 is one preferred embodiment of the present invention, and the present invention does not need to be limited to such a coating method.
- This step ST320 is a step of exposing and etching the wire 110 coated with the masking liquid in a predetermined pattern in the previous step and performing a patterning process.
- the masking liquid is exposed to a pattern set on the front-coated wire 110 and subjected to etching to perform a predetermined patterning on the outer circumferential surface, which may be said to be the same as or similar to a kind of photomasking method. Since the photomasking method is well known in the semiconductor or LCD process, unnecessary description thereof will be omitted.
- the exposure process in this step may be made by irradiating UV light. After exposure in a predetermined pattern, etching is performed, and patterning is performed on the outer circumferential surface of the wire.
- the patterned shape appears to be a pattern of a plurality of rectangular shapes alternately formed spaced apart from each other up and down, but these specific shapes do not limit the scope of the present invention.
- This step ST330 is a step of electrodepositing diamond abrasive grains along the outer circumferential surface of the wire other than the patterned section in the previous step.
- the diamond abrasive grains 120 are electrodeposited in a section other than a portion where the non-conductive material remaining after the exposure and etching in the previous step is coated.
- the diamond abrasive grains 120 may be evenly electrodeposited on the outer circumferential surface of the wire 110 through the remaining section other than the portion where the masking liquid is coated.
- the outer peripheral surface remainder region of the wire 110 to which the diamond abrasive grains 120 are electrodeposited has a spiral-shaped continuous trajectory along the length direction of the wire 110.
- the electrodeposited diamond wire saw according to the present invention may have a uniform cutting or polishing quality in the entire length range.
- the process of the present step (ST330) may be carried out the same or similar to the diamond abrasive grain step (ST120, ST220) of the first and second embodiments described above with reference to FIGS.
- FIG. 7 is a flowchart illustrating a method of manufacturing an electrodeposited diamond wire saw using a patterning treatment method of a non-conductive material according to a fourth embodiment of the present invention.
- 8 is a flowchart illustrating a method of manufacturing an electrodeposited diamond wire saw using a patterning treatment method of a non-conductive material according to a fourth embodiment of the present invention.
- FIG. 8 is a diagram illustrating a process for more specifically confirming the electrodeposition diamond wire saw manufacturing method according to the fourth embodiment of the present invention to be described with reference to FIG. 7. See also parallel.
- Patterning process step by attaching masking tape (ST410)
- This step ST410 is a step of patterning a non-conductive material on the wire by attaching a masking tape to the outer circumferential surface of the wire.
- the method of patterning the non-conductive material at this stage is characterized by being different from the first, second and third embodiments of the present invention.
- the non-conductive material is patterned by a method in which a masking tape made in the form of a tape is wound around the outer circumferential surface of the wire and not attached to the wire.
- This step ST410 may again include two embodiments.
- a masking tape having a plurality of perforation holes formed on a section where diamond abrasive grains are to be electrodeposited in advance is wound and attached in the longitudinal direction of the wire 110.
- the plurality of drilling holes may be formed in a spiral shape on the masking tape in advance.
- the diamond abrasive grains 120 may be electrodeposited through the plurality of drilling holes.
- the masking tape is inclinedly wound in a spiral form along the outer circumferential surface of the wire except for a section in which diamond abrasive grains are to be electrodeposited in advance.
- the masking tape does not need to form a separate punched hole in advance.
- step ST420 when the patterning process is performed by the attachment of the masking tape in the previous step, diamond abrasive grains are electrodeposited on the outer circumferential surface of the wire through a hole or a spaced gap.
- the diamond abrasive grains 120 are electrodeposited in the plurality of drilling holes provided in the spiral-like arrangement in the masking tape.
- This step ST430 is a finishing step of removing the masking tape after diamond abrasive grains are electrodeposited and formed along the outer circumferential surface of the wire through the above-described steps ST410 and ST420.
- the diamond abrasive grains 120 are regularly electrodeposited in a spiral shape along the longitudinal direction on the outer circumferential surface of the wire 110.
- Electrodeposited diamond wire saws produced in this way can have a uniformly improved cutting or polishing quality over the entire length range.
- the non-conductive material is patterned on the surface section of the wire to which electrodeposition of the diamond abrasive grains should be excluded.
- the manufacturing process of the electrodeposited diamond wire saw can be efficiently presented, the manufacturing cost can be reduced, and the quality of the product can be improved through a uniform manufacturing process.
- the present invention presents four preferred embodiments as preferred examples of the above nonconductive material patterning process.
- the masking liquid is sprayed in a plurality of directions with respect to the outer circumferential surface of the wire by an inkjet method to pattern the diamond abrasive grains.
- the wire is rotated at the time of injection of the wire, and the masking liquid is sprayed by the inkjet method in only one direction to pattern the diamond abrasive grains.
- the front surface of the wire is coated with a non-conductive material, followed by patterning through exposure and etching, followed by electrodeposition of diamond abrasive grains.
- the fourth embodiment is a form in which a diamond abrasive grain is electrodeposited after a patterning process is performed by attaching a non-conductive tape having a perforation hole to a wire only in a specific section where the diamond abrasive grain is electrodeposited with respect to the wire surface.
- the process automation of the manufacturing process of the electrodeposited diamond wire saw can be made, there is an advantage that is suitable for mass production of improved products through the reduction of the man-hour.
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Abstract
Description
Claims (17)
- (a) 와이어의 주입 시 상기 와이어의 외주면에 대해 복수의 방향에서 마스킹 액을 인쇄하여 패터닝 처리하는 단계; 및(b) 상기 패터닝 처리된 영역을 제외한 상기 와이어의 외주면 잔부 영역에 다이아몬드 지립(abrasive particle)을 전착(electroplating)하는 단계;를 포함하는 것을 특징으로 하는 전착 다이아몬드 와이어 쏘우 제조 방법.
- 제 1 항에 있어서,상기 (a) 단계에서,상기 마스킹 액의 인쇄는,상기 와이어의 외주면에 대향하여 복수개의 인쇄 노즐이 상호 동일한 끼인각을 가지도록 배치되어,주입되는 상기 와이어의 외주면 상으로 미리 정해진 패턴 경로를 따라 상기 마스킹 액을 인쇄하는 것을 특징으로 하는 전착 다이아몬드 와이어 쏘우 제조 방법.
- 제 2 항에 있어서,상기 마스킹 액의 인쇄는,잉크젯 방식으로 구현되는 것을 특징으로 하는 전착 다이아몬드 와이어 쏘우 제조 방법.
- 제 1 항에 있어서,상기 (b) 단계에서,상기 다이아몬드 지립이 전착되는 상기 와이어의 외주면 잔부 영역은, 상기 와이어의 길이 방향을 따라 스파이럴(spiral) 형상을 갖도록 형성되는 것을 특징으로 하는 전착 다이아몬드 와이어 쏘우 제조 방법.
- (a) 와이어의 주입 시, 상기 와이어가 회전하는 동시에 상기 와이어의 외주면에 대해 일 방향으로 마스킹 액을 인쇄하여 패터닝을 처리하는 단계; 및(b) 상기 패터닝 처리된 영역을 제외한 상기 와이어의 외주면 잔부 영역에 다이아몬드 지립을 전착하는 단계;를 포함하는 것을 특징으로 하는 전착 다이아몬드 와이어 쏘우 제조 방법.
- 제 5 항에 있어서,상기 (a) 단계에서,상기 마스킹 액의 인쇄는,상기 와이어의 외주면에 대향하여 단일의 인쇄 노즐이 이격 배치되되,주입과 동시에 회전하는 상기 와이어의 외주면 상으로 미리 정해진 패턴 경로를 따라 상기 마스킹 액이 인쇄되도록, 상기 인쇄 노즐의 인쇄 주기가 조절되는 방식에 의해 이루어지는 것을 특징으로 하는 전착 다이아몬드 와이어 쏘우 제조 방법.
- 제 6 항에 있어서,상기 마스킹 액의 인쇄는,잉크젯 방식으로 구현되는 것을 특징으로 하는 전착 다이아몬드 와이어 쏘우 제조 방법.
- 제 5 항에 있어서,상기 (b) 단계에서,상기 다이아몬드 지립이 전착되는 상기 와이어의 외주면 잔부 영역은, 상기 와이어의 길이 방향을 따라 스파이럴(spiral) 형상을 갖도록 형성되는 것을 특징으로 하는 전착 다이아몬드 와이어 쏘우 제조 방법.
- (a) 와이어의 외주면을 마스킹 액으로 전면 코팅하는 단계;(b) 상기 마스킹 액이 전면 코팅된 상기 와이어를 미리 정해진 패턴으로 노광을 주고 에칭을 실시하여 패터닝 처리하는 단계; 및(c) 상기 패터닝 처리된 영역을 제외한 상기 와이어의 외주면 잔부 영역에 다이아몬드 지립을 전착하는 단계;를 포함하는 것을 특징으로 하는 전착 다이아몬드 와이어 쏘우 제조 방법.
- 제 9 항에 있어서,상기 (b) 단계에서,상기 노광은, UV광을 조사하는 방식으로 이루어지는 것을 특징으로 하는 전착 다이아몬드 와이어 쏘우 제조 방법.
- 제 9 항에 있어서,상기 (c) 단계에서,상기 다이아몬드 지립이 전착되는 상기 와이어의 외주면 잔부 영역은, 상기 와이어의 길이 방향을 따라 스파이럴(spiral) 형상을 갖도록 형성되는 것을 특징으로 하는 전착 다이아몬드 와이어 쏘우 제조 방법.
- (a) 와이어의 외주면을 따라 미리 정해진 패턴으로 마스킹 테이프를 부착하여 패터닝 처리하는 단계;(b) 상기 패터닝 처리된 영역을 제외한 상기 와이어의 외주면 잔부 구간에 다이아몬드 지립을 전착하는 단계; 및(c) 부착된 상기 마스킹 테이프를 상기 와이어로부터 제거하는 단계;를 포함하는 것을 특징으로 하는 전착 다이아몬드 와이어 쏘우 제조 방법.
- 제 12 항에 있어서,상기 (a) 단계에서,상기 마스킹 테이프를 부착하여 상기 와이어의 외주면을 패터닝 처리하는 방법은,상기 마스킹 테이프에 미리 복수개의 천공홀을 상기 와이어의 길이 방향을 따라 스파이럴(spiral) 형상으로 배열 형성하고, 상기 천공홀이 형성된 상기 마스킹 테이프를 상기 와이어의 외주면에 부착하는 방식으로 이루어지는 것을 특징으로 하는 전착 다이아몬드 와이어 쏘우 제조 방법.
- 제 12 항에 있어서,상기 (a) 단계에서,상기 마스킹 테이프를 부착하여 상기 와이어의 외주면을 패터닝 처리하는 방법은,상기 와이어의 길이 방향을 따라 스파이럴 형상의 궤적으로 상기 와이어의 외주면에 대해 상기 마스킹 테이프를 부착하는 방식으로 이루어지는 것을 특징으로 하는 전착 다이아몬드 와이어 쏘우 제조 방법.
- 와이어의 외주면 중 일부 구간에 비전도성 물질 패턴이 형성되어 있으며,상기 와이어 외주면 중 나머지 구간에 다이아몬드 지립이 전착되어 있는 것을 특징으로 하는 전착 다이아몬드 와이어 쏘우.
- 제15항에 있어서,상기 비전도성 물질은상기 와이어의 길이 방향을 따라 스파이럴 형상의 궤적으로 형성되어 있는 것을 특징으로 하는 전착 다이아몬드 와이어 쏘우.
- 제15항에 있어서,상기 다이아몬드 지립은 상기 와이어의 길이 방향을 따라 스파이럴 형상의 궤적으로 형성되어 있는 것을 특징으로 하는 전착 다이아몬드 와이어 쏘우.
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US14/009,879 US9776306B2 (en) | 2011-04-05 | 2012-03-19 | Method for manufacturing an electrodeposited diamond wire saw using patterned non-conductive materials |
JP2014503587A JP5710067B2 (ja) | 2011-04-05 | 2012-03-19 | 非伝導性物質のパターニング処理方式を用いた電着ダイヤモンドワイヤーソー及びその製造方法 |
EP12768219.3A EP2695973B1 (en) | 2011-04-05 | 2012-03-19 | Method for manufacturing an electrodeposited diamond wire saw |
CN2012800173828A CN103476972A (zh) | 2011-04-05 | 2012-03-19 | 用于使用图案化的不导电材料来制造电镀金刚石线锯的方法 |
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KR1020110031177A KR101121254B1 (ko) | 2011-04-05 | 2011-04-05 | 비전도성 물질의 패터닝 처리 방식을 이용한 전착 다이아몬드 와이어 쏘우 제조 방법 |
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US (1) | US9776306B2 (ko) |
EP (1) | EP2695973B1 (ko) |
JP (1) | JP5710067B2 (ko) |
KR (1) | KR101121254B1 (ko) |
CN (1) | CN103476972A (ko) |
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EP2695973B1 (en) | 2017-10-18 |
EP2695973A2 (en) | 2014-02-12 |
KR101121254B1 (ko) | 2012-03-22 |
CN103476972A (zh) | 2013-12-25 |
US9776306B2 (en) | 2017-10-03 |
MY165665A (en) | 2018-04-18 |
EP2695973A4 (en) | 2014-12-17 |
WO2012138063A3 (ko) | 2013-03-07 |
JP5710067B2 (ja) | 2015-04-30 |
US20140246005A1 (en) | 2014-09-04 |
JP2014509957A (ja) | 2014-04-24 |
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