WO2012138063A3 - 비전도성 물질의 패터닝 처리 방식을 이용한 전착 다이아몬드 와이어 쏘우 및 그 제조 방법 - Google Patents

비전도성 물질의 패터닝 처리 방식을 이용한 전착 다이아몬드 와이어 쏘우 및 그 제조 방법 Download PDF

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Publication number
WO2012138063A3
WO2012138063A3 PCT/KR2012/001943 KR2012001943W WO2012138063A3 WO 2012138063 A3 WO2012138063 A3 WO 2012138063A3 KR 2012001943 W KR2012001943 W KR 2012001943W WO 2012138063 A3 WO2012138063 A3 WO 2012138063A3
Authority
WO
WIPO (PCT)
Prior art keywords
manufacturing
conductive materials
wire
wire saw
diamond wire
Prior art date
Application number
PCT/KR2012/001943
Other languages
English (en)
French (fr)
Other versions
WO2012138063A2 (ko
Inventor
이세광
성낙주
김태봉
Original Assignee
이화다이아몬드공업(주)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 이화다이아몬드공업(주) filed Critical 이화다이아몬드공업(주)
Priority to EP12768219.3A priority Critical patent/EP2695973B1/en
Priority to JP2014503587A priority patent/JP5710067B2/ja
Priority to US14/009,879 priority patent/US9776306B2/en
Priority to CN2012800173828A priority patent/CN103476972A/zh
Publication of WO2012138063A2 publication Critical patent/WO2012138063A2/ko
Publication of WO2012138063A3 publication Critical patent/WO2012138063A3/ko

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
    • B24D18/0018—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for by electrolytic deposition
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
    • B23D61/00—Tools for sawing machines or sawing devices; Clamping devices for these tools
    • B23D61/18—Sawing tools of special type, e.g. wire saw strands, saw blades or saw wire equipped with diamonds or other abrasive particles in selected individual positions
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
    • B23D61/00—Tools for sawing machines or sawing devices; Clamping devices for these tools
    • B23D61/18—Sawing tools of special type, e.g. wire saw strands, saw blades or saw wire equipped with diamonds or other abrasive particles in selected individual positions
    • B23D61/185—Saw wires; Saw cables; Twisted saw strips
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
    • B23D65/00—Making tools for sawing machines or sawing devices for use in cutting any kind of material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/06—Grinders for cutting-off
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D13/00—Electrophoretic coating characterised by the process
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D15/00—Electrolytic or electrophoretic production of coatings containing embedded materials, e.g. particles, whiskers, wires
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02—Electroplating of selected surface areas
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02—Electroplating of selected surface areas
    • C25D5/022—Electroplating of selected surface areas using masking means
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C25D7/0607—Wires

Abstract

와이어에 다이아몬드 지립을 전착하는 공정에 앞서, 다이아몬드 지립의 전착이 배제되어야 할 와이어의 외주면을 따라 비전도성 물질을 선행적으로 패터닝 처리하여 제조 공정을 효율적으로 개선할 수 있는 비전도성 물질의 패터닝 처리 방식을 이용한 전착 다이아몬드 와이어 쏘우 및 그 제조 방법에 관하여 개시한다. 본 발명의 바람직한 실시예에 따르면, 와이어의 주입 시 와이어의 외주면에 대해 복수의 방향에서 마스킹 액을 인쇄하여 패터닝 처리하는 단계와, 패터닝 처리된 영역을 제외한 와이어의 외주면 잔부 영역에 다이아몬드 지립을 전착하는 단계를 포함한다.
PCT/KR2012/001943 2011-04-05 2012-03-19 비전도성 물질의 패터닝 처리 방식을 이용한 전착 다이아몬드 와이어 쏘우 및 그 제조 방법 WO2012138063A2 (ko)

Priority Applications (4)

Application Number Priority Date Filing Date Title
EP12768219.3A EP2695973B1 (en) 2011-04-05 2012-03-19 Method for manufacturing an electrodeposited diamond wire saw
JP2014503587A JP5710067B2 (ja) 2011-04-05 2012-03-19 非伝導性物質のパターニング処理方式を用いた電着ダイヤモンドワイヤーソー及びその製造方法
US14/009,879 US9776306B2 (en) 2011-04-05 2012-03-19 Method for manufacturing an electrodeposited diamond wire saw using patterned non-conductive materials
CN2012800173828A CN103476972A (zh) 2011-04-05 2012-03-19 用于使用图案化的不导电材料来制造电镀金刚石线锯的方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2011-0031177 2011-04-05
KR1020110031177A KR101121254B1 (ko) 2011-04-05 2011-04-05 비전도성 물질의 패터닝 처리 방식을 이용한 전착 다이아몬드 와이어 쏘우 제조 방법

Publications (2)

Publication Number Publication Date
WO2012138063A2 WO2012138063A2 (ko) 2012-10-11
WO2012138063A3 true WO2012138063A3 (ko) 2013-03-07

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2012/001943 WO2012138063A2 (ko) 2011-04-05 2012-03-19 비전도성 물질의 패터닝 처리 방식을 이용한 전착 다이아몬드 와이어 쏘우 및 그 제조 방법

Country Status (7)

Country Link
US (1) US9776306B2 (ko)
EP (1) EP2695973B1 (ko)
JP (1) JP5710067B2 (ko)
KR (1) KR101121254B1 (ko)
CN (1) CN103476972A (ko)
MY (1) MY165665A (ko)
WO (1) WO2012138063A2 (ko)

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KR101121254B1 (ko) 2011-04-05 2012-03-22 이화다이아몬드공업 주식회사 비전도성 물질의 패터닝 처리 방식을 이용한 전착 다이아몬드 와이어 쏘우 제조 방법
CN102828212B (zh) * 2012-09-12 2014-10-15 南京航空航天大学 空间立体布局式快速复合电刷镀金刚石线锯装置
KR101506910B1 (ko) * 2012-09-27 2015-03-30 티디케이가부시기가이샤 이방성 도금 방법 및 박막 코일
CN103031012B (zh) * 2012-12-14 2016-06-15 长沙岱勒新材料科技股份有限公司 一种组合物及其用于制备金刚石线锯的方法
CN103882500B (zh) * 2014-04-04 2016-03-02 山东大学 磨粒群节块状排布的电镀线锯丝的制作方法及装置
CN106273008A (zh) * 2015-06-02 2017-01-04 江苏友和工具有限公司 电镀金刚石绳锯制备工艺
US11504783B2 (en) 2017-09-28 2022-11-22 Saint-Gobain Abrasives, Inc. Abrasive article and method of forming
CN110181698B (zh) * 2019-04-25 2021-04-23 南京大学连云港高新技术研究院 一种结构稳固式金刚石线及其制备方法
CN112428443A (zh) * 2021-01-27 2021-03-02 天津市镍铠表面处理技术有限公司 环形线锯及其制作方法
CN113275659B (zh) * 2021-04-25 2022-03-08 江苏聚成金刚石科技有限公司 一种超细高强度合金钨丝金刚石线锯及其制备方法
CN113857950A (zh) * 2021-09-13 2021-12-31 泰兴市中博钻石科技股份有限公司 一种非镀衣金钢石线连继生产工艺
CN114540901B (zh) * 2022-01-27 2023-09-26 隆基绿能科技股份有限公司 一种金刚线及其制备方法
CN114986405B (zh) * 2022-06-28 2023-10-24 泰科材料技术(广州)有限公司 一种超细磨料颗粒有序排布方法

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Also Published As

Publication number Publication date
JP5710067B2 (ja) 2015-04-30
WO2012138063A2 (ko) 2012-10-11
KR101121254B1 (ko) 2012-03-22
CN103476972A (zh) 2013-12-25
EP2695973B1 (en) 2017-10-18
JP2014509957A (ja) 2014-04-24
US9776306B2 (en) 2017-10-03
EP2695973A2 (en) 2014-02-12
EP2695973A4 (en) 2014-12-17
MY165665A (en) 2018-04-18
US20140246005A1 (en) 2014-09-04

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