WO2013012226A3 - Cmp 패드 컨디셔너 - Google Patents

Cmp 패드 컨디셔너 Download PDF

Info

Publication number
WO2013012226A3
WO2013012226A3 PCT/KR2012/005649 KR2012005649W WO2013012226A3 WO 2013012226 A3 WO2013012226 A3 WO 2013012226A3 KR 2012005649 W KR2012005649 W KR 2012005649W WO 2013012226 A3 WO2013012226 A3 WO 2013012226A3
Authority
WO
WIPO (PCT)
Prior art keywords
pad conditioner
cmp pad
cutting tip
tip pattern
substrate
Prior art date
Application number
PCT/KR2012/005649
Other languages
English (en)
French (fr)
Other versions
WO2013012226A2 (ko
Inventor
이세광
이주한
Original Assignee
이화다이아몬드공업 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 이화다이아몬드공업 주식회사 filed Critical 이화다이아몬드공업 주식회사
Priority to CN201280035966.8A priority Critical patent/CN103688344B/zh
Priority to JP2014521548A priority patent/JP5843120B2/ja
Priority to DE112012003037.0T priority patent/DE112012003037B4/de
Priority to US14/233,489 priority patent/US10166653B2/en
Publication of WO2013012226A2 publication Critical patent/WO2013012226A2/ko
Publication of WO2013012226A3 publication Critical patent/WO2013012226A3/ko

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/12—Dressing tools; Holders therefor

Abstract

본 발명은 기판과, 상기 기판의 적어도 일면에 형성되는 절삭팁 패턴을 갖는 CMP 패드 컨디셔너에 관한 것으로서, 보다 구체적으로는 절삭팁 패턴의 구조를 개선하여 생산성이 향상 및 미세한 절삭팁 패턴의 강도와 안전성을 충분히 보장할 수 있는 구조의 절삭팁 패턴을 갖는 CMP 패드 컨디셔너에 관한 것이다.
PCT/KR2012/005649 2011-07-18 2012-07-16 Cmp 패드 컨디셔너 WO2013012226A2 (ko)

Priority Applications (4)

Application Number Priority Date Filing Date Title
CN201280035966.8A CN103688344B (zh) 2011-07-18 2012-07-16 Cmp 垫调整器
JP2014521548A JP5843120B2 (ja) 2011-07-18 2012-07-16 Ｃｍｐパッドコンディショナー
DE112012003037.0T DE112012003037B4 (de) 2011-07-18 2012-07-16 Konditionierer für CMP-Pads
US14/233,489 US10166653B2 (en) 2011-07-18 2012-07-16 CMP pad conditioner

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
KR20110070924 2011-07-18
KR10-2011-0070924 2011-07-18
KR1020120066596A KR101339722B1 (ko) 2011-07-18 2012-06-21 Ｃｍｐ 패드 컨디셔너
KR10-2012-0066596 2012-06-21

Publications (2)

Publication Number Publication Date
WO2013012226A2 WO2013012226A2 (ko) 2013-01-24
WO2013012226A3 true WO2013012226A3 (ko) 2013-06-13

Family

ID=47839682

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2012/005649 WO2013012226A2 (ko) 2011-07-18 2012-07-16 Cmp 패드 컨디셔너

Country Status (7)

Country Link
US (1) US10166653B2 (ko)
JP (1) JP5843120B2 (ko)
KR (2) KR101339722B1 (ko)
CN (1) CN103688344B (ko)
DE (1) DE112012003037B4 (ko)
TW (1) TWI523734B (ko)
WO (1) WO2013012226A2 (ko)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9452509B2 (en) * 2013-06-28 2016-09-27 Taiwan Semiconductor Manufacturing Company, Ltd. Sapphire pad conditioner
TWI548486B (zh) * 2013-07-29 2016-09-11 The method of manufacturing a dresser of the polishing pad sapphire discs
US20160194625A1 (en) 2013-09-03 2016-07-07 Moderna Therapeutics, Inc. Chimeric polynucleotides
JP6453666B2 (ja) * 2015-02-20 2019-01-16 東芝メモリ株式会社 研磨パッドドレッサの作製方法
JP2018032745A (ja) * 2016-08-24 2018-03-01 東芝メモリ株式会社 ドレッサー、ドレッサーの製造方法、及び半導体装置の製造方法
KR102581481B1 (ko) 2016-10-18 2023-09-21 삼성전자주식회사 화학적 기계적 연마 방법, 반도체 소자의 제조 방법, 및 반도체 제조 장치
TWI681843B (zh) * 2017-12-01 2020-01-11 詠巨科技有限公司 拋光墊修整方法
KR102078342B1 (ko) 2018-08-17 2020-02-19 동명대학교산학협력단 접촉 영역의 조절이 가능한 다이아몬드 컨디셔너
KR102229135B1 (ko) * 2018-11-16 2021-03-18 이화다이아몬드공업 주식회사 개별 절삭팁 부착형 cmp 패드 컨디셔너 및 그 제조방법
JP7368492B2 (ja) * 2019-04-09 2023-10-24 インテグリス・インコーポレーテッド ディスクのセグメント設計
CN115870875B (zh) * 2022-12-08 2024-04-12 西安奕斯伟材料科技股份有限公司 一种用于研磨硅片的研磨盘及研磨设备

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003175465A (ja) * 2001-12-11 2003-06-24 Mitsubishi Materials Corp ダイヤモンドコーティング切削工具
KR20060085338A (ko) * 2005-01-24 2006-07-27 강준모 패드 컨디셔너 및 그 제조 방법
KR20100033911A (ko) * 2008-09-22 2010-03-31 프리시젼다이아몬드 주식회사 다이아몬드 막이 코팅된 ｃｍｐ 컨디셔너 및 그 제조방법
KR20100110989A (ko) * 2009-04-06 2010-10-14 신한다이아몬드공업 주식회사 Ｃｍｐ 패드 컨디셔너 및 그 제조방법

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6439986B1 (en) 1999-10-12 2002-08-27 Hunatech Co., Ltd. Conditioner for polishing pad and method for manufacturing the same
KR100387954B1 (ko) 1999-10-12 2003-06-19 (주) 휴네텍 연마패드용 컨디셔너와 이의 제조방법
DE10044425C2 (de) * 2000-09-08 2003-01-09 Siemens Ag Verfahren zur Herstellung einer Leuchstoffschicht
US8398466B2 (en) * 2006-11-16 2013-03-19 Chien-Min Sung CMP pad conditioners with mosaic abrasive segments and associated methods
TW200726582A (en) * 2005-10-04 2007-07-16 Mitsubishi Materials Corp Rotary tool for processing flexible materials
US20080153398A1 (en) * 2006-11-16 2008-06-26 Chien-Min Sung Cmp pad conditioners and associated methods
TW200841996A (en) 2007-04-24 2008-11-01 Creating Nano Technologies Inc Polishing pad conditioner
JP2010069612A (ja) * 2008-08-20 2010-04-02 Mitsubishi Materials Corp 半導体研磨布用コンディショナー、半導体研磨布用コンディショナーの製造方法及び半導体研磨装置
JP2010125587A (ja) * 2008-12-01 2010-06-10 Mitsubishi Materials Corp 半導体研磨布用コンディショナー及びその製造方法
KR101072384B1 (ko) * 2009-11-30 2011-10-11 이화다이아몬드공업 주식회사 Ｃｍｐ 패드용 컨디셔너의 제조방법
KR101091030B1 (ko) * 2010-04-08 2011-12-09 이화다이아몬드공업 주식회사 감소된 마찰력을 갖는 패드 컨디셔너 제조방법
WO2012122186A2 (en) * 2011-03-07 2012-09-13 Entegris, Inc. Chemical mechanical planarization pad conditioner

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003175465A (ja) * 2001-12-11 2003-06-24 Mitsubishi Materials Corp ダイヤモンドコーティング切削工具
KR20060085338A (ko) * 2005-01-24 2006-07-27 강준모 패드 컨디셔너 및 그 제조 방법
KR20100033911A (ko) * 2008-09-22 2010-03-31 프리시젼다이아몬드 주식회사 다이아몬드 막이 코팅된 ｃｍｐ 컨디셔너 및 그 제조방법
KR20100110989A (ko) * 2009-04-06 2010-10-14 신한다이아몬드공업 주식회사 Ｃｍｐ 패드 컨디셔너 및 그 제조방법

Also Published As

Publication number Publication date
WO2013012226A2 (ko) 2013-01-24
US10166653B2 (en) 2019-01-01
JP2014522739A (ja) 2014-09-08
KR101430580B1 (ko) 2014-08-18
JP5843120B2 (ja) 2016-01-13
KR20130124274A (ko) 2013-11-13
CN103688344A (zh) 2014-03-26
DE112012003037B4 (de) 2021-10-14
TW201309416A (zh) 2013-03-01
DE112012003037T5 (de) 2014-04-24
CN103688344B (zh) 2016-11-09
KR101339722B1 (ko) 2013-12-10
KR20130010432A (ko) 2013-01-28
TWI523734B (zh) 2016-03-01
US20140154960A1 (en) 2014-06-05

Similar Documents

Publication Publication Date Title
WO2013012226A3 (ko) Cmp 패드 컨디셔너
WO2012134174A3 (ko) 전도성 구조체， 터치패널 및 이의 제조방법
WO2013087073A3 (de) Substrat mit einer strukturierten oberfläche sowie verfahren zu dessen herstellung sowie verfahren zur bestimmung der benetzungseigenschaften davon
CA143385S (en) Tire
CA144271S (en) Vehicle
WO2013046060A9 (en) Paper and methods of making paper
EP4290000A3 (en) Article of footwear
WO2013012608A3 (en) Polishing pad with aperture
CA144274S (en) Automobile
CA144548S (en) Tire
CA139779S (en) Drive wheel
WO2012177735A3 (en) Cutting elements for earth-boring tools, earth-boring tools including such cutting elements, and methods of forming such cutting elements for earth-boring tools
WO2014060099A3 (en) Microspheres
WO2012166472A3 (en) Production of propene
CA144547S (en) Tire
EP2888105A4 (en) MATERIAL FOR CARDBOARD, CUT, OR SUBSTRATE
CA143889S (en) Earphone
CA143961S (en) Tire
WO2014063670A3 (de) Verfahren zur herstellung einer nanoporösen schicht auf einem substrat
WO2013037480A8 (en) Track pad
WO2013188432A3 (en) Asymmetric catalysts
WO2012088004A3 (en) Cmp pad conditioning tool
WO2014040866A3 (en) Mirror
CA143403S (en) Metal plate
EP2546862A4 (en) SOURCE OF PARTICLES AND APPARATUS USING THE SOURCE OF PARTICLES

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 12815098

Country of ref document: EP

Kind code of ref document: A2

ENP Entry into the national phase

Ref document number: 2014521548

Country of ref document: JP

Kind code of ref document: A

WWE Wipo information: entry into national phase

Ref document number: 14233489

Country of ref document: US

WWE Wipo information: entry into national phase

Ref document number: 1120120030370

Country of ref document: DE

Ref document number: 112012003037

Country of ref document: DE

122 Ep: pct application non-entry in european phase

Ref document number: 12815098

Country of ref document: EP

Kind code of ref document: A2