WO2014090125A1 - 一种组合物及其用于制备金刚石线锯的方法 - Google Patents

一种组合物及其用于制备金刚石线锯的方法 Download PDF

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Publication number
WO2014090125A1
WO2014090125A1 PCT/CN2013/088895 CN2013088895W WO2014090125A1 WO 2014090125 A1 WO2014090125 A1 WO 2014090125A1 CN 2013088895 W CN2013088895 W CN 2013088895W WO 2014090125 A1 WO2014090125 A1 WO 2014090125A1
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WIPO (PCT)
Prior art keywords
shielding film
diamond
wire saw
organic
embryonic
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Application number
PCT/CN2013/088895
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English (en)
French (fr)
Inventor
刘纯辉
Original Assignee
长沙岱勒新材料科技有限公司
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Publication of WO2014090125A1 publication Critical patent/WO2014090125A1/zh

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Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23DPLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
    • B23D65/00Making tools for sawing machines or sawing devices for use in cutting any kind of material
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23DPLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
    • B23D61/00Tools for sawing machines or sawing devices; Clamping devices for these tools
    • B23D61/18Sawing tools of special type, e.g. wire saw strands, saw blades or saw wire equipped with diamonds or other abrasive particles in selected individual positions
    • B23D61/185Saw wires; Saw cables; Twisted saw strips
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D15/00Electrolytic or electrophoretic production of coatings containing embedded materials, e.g. particles, whiskers, wires
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02Electroplating of selected surface areas
    • C25D5/022Electroplating of selected surface areas using masking means
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00Electroplating characterised by the article coated
    • C25D7/06Wires; Strips; Foils
    • C25D7/0607Wires

Definitions

  • the present invention relates to the field of light-cured wire saws, and in particular to a composition, and to a composition for preparing a diamond wire saw using the foregoing composition. method.
  • Hard and brittle materials include various silicon crystals, quartz crystals, sapphire, cemented carbide, and ceramic materials. Hard and brittle materials are mostly non-conductors or semiconductors, and generally have high hardness, high brittleness, high wear resistance, high corrosion resistance, high oxidation resistance, high electrical resistivity, high temperature resistance, and non-magnetic properties. Due to the special properties of brittle and hard materials, higher requirements are imposed on the processing technology of brittle and hard materials.
  • Cutting is the main step in the processing of brittle hard materials.
  • the cutting methods mainly include diamond saw blade cutting, ribbon tool cutting, laser beam cutting and so on. These cutting methods have the advantages of high efficiency, low cost, narrow slit, no damage, no environmental pollution, etc.
  • the diamond saw blade cutting device has the advantages of convenient operation, high efficiency, good processing quality, etc., but the noise is large, and only one single Sheet cutting, low efficiency, poor blade rigidity, limited size of the object to be cut, the saw blade is prone to wobble and deviation during the cutting process, resulting in poor parallelism of the workpiece being cut.
  • the strip tool has a small sawing edge, a fast sawing speed, low tool material consumption and low noise, but it requires regular material and cannot be cut in multiple pieces.
  • a diamond wire saw is a cutting tool made by consolidating high hardness and high wear resistance diamond particles on a steel wire substrate. Diamond wire saws can be made to different diameters and lengths as needed; they can be mounted on different equipment to form different processing methods, such as reciprocating cycle (saw frame), high speed band saw, single wire cutting and multi-wire cutting, etc. .
  • Electroplated diamond wire saws are especially suitable for cutting silicon crystals, precious sapphire, magnetic materials, ceramics, crystals and other hard and brittle materials because of their narrow slits, high cutting efficiency and economical environmental protection.
  • the diamond wire saw is usually prepared by depositing a layer of metal on the wire embryo by electroplating and consolidating the diamond particles in the deposited metal.
  • the metal coating is a binder and the diamond particles are used for cutting.
  • the prior art adopts the common composite electrodeposition sand method, the diamond arrangement is disorderly and irregular, the diamond cutting utilization rate is low, the cutting surface line marks are deep, and the processing precision dimensional deviation is large.
  • the present invention aims to provide a composition and a method for preparing the same for a diamond wire saw, which solves the problems of irregular diamond arrangement, uneven wire diameter, poor processing precision, and low utilization rate of diamond cutting in the prior art. problem.
  • a composition comprising 85 to 95% by weight of ethyl cyanoacrylate, 3 to 8 wt% of a tackifier, 1 to 3 wt% of a stabilizer, 2 ⁇ 4wt% of polymerization inhibitor.
  • the tackifier is a rosin resin
  • the stabilizer is a tribasic lead sulfate
  • the polymerization inhibitor is tert-butyl catechol.
  • Another aspect of the present invention also provides a method of preparing a diamond wire saw, comprising the steps of: coating a shielding film: coating the aforementioned composition on the surface of the embryonic wire, and subjecting the composition to the surface of the embryo by a curing step Forming an organic shielding film having regular pores to obtain an embryonic line having an organic shielding film; plating: bonding the diamond particles to the pores of the embryonic wire having the organic shielding film by electroplating to obtain a diamond wire saw having an organic shielding film; Shielding film: A diamond wire saw with an organic shielding film is immersed in an organic solvent to remove the organic shielding film to obtain a diamond wire saw.
  • the reinforced plating The diamond wire saw is firstly subjected to a reinforced plating step to obtain a diamond wire saw.
  • the embryonic line is a steel wire having a diameter of 0.12 to 0.44 mm; the diameter of the diamond particles is 6 to 60 ⁇ m, and the thickness of the organic shielding film is 1 to 5 ⁇ m.
  • the cleaning step further comprises the steps of degreasing the embryonic wire and the diamond particles in a strong alkali solution, rinsing and then performing a descaling step in the strong acid solution, and then performing a coating step.
  • the strong alkali solution is 5-10% by weight of NaOH solution
  • the strong acid solution is 2 ⁇ 5 ⁇ % of aqua regia.
  • the curing temperature of the curing step is 80 to 100 °C.
  • the organic solvent in the step of removing the organic shielding film is acetone.
  • the electroplating step is to electroplate the diamond particles at a temperature of 5 to 20 m/min at 40 to 50 ° C, so that the diamond is regularly arranged in the unshielded embryonic space gap.
  • the invention has the following beneficial effects:
  • the composition provided by the invention can form a stable organic shielding film on the surface of the adherend when it is coated on the surface of the adherend, and can protect the surface of the adherend from the external environment. .
  • the organic shielding film can be removed at room temperature, and the cleaning is convenient.
  • the invention applies the composition to the preparation of a diamond wire saw, and forms an organic shielding film with regular pores on the surface of the diamond wire saw.
  • the diamond particles are only bonded to the embryonic line with pores, so that the obtained diamond is obtained.
  • the wire saw has a regular arrangement of diamonds, a wire diameter hook, and a high cutting performance.
  • the diamond particles can be regularly arranged, and the density of the diamond particles can be adjusted by controlling the gap of the organic shielding film; the regular arrangement of the diamond wire saw has higher cutting utilization rate, shallow line marks, and processing. Higher precision.
  • the present invention has other objects, features and advantages.
  • Fig. 1 is a schematic flow chart of a preferred embodiment of the present invention
  • Fig. 2 is an SEM view of a diamond wire saw according to a preferred embodiment of the present invention
  • Fig. 3 is an SEM view of a diamond wire saw of a comparative example of the present invention.
  • DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The embodiments of the present invention are described in detail below with reference to the accompanying drawings.
  • One aspect of the present invention provides a composition comprising 85 to 95% of ethyl cyanoacrylate, 3 to 8 wt% of a tackifier, 1 to 3 wt% of a stabilizer, and 2 to 4 wt% of a polymerization inhibitor.
  • Agent. Ethyl cyanoacrylate is an instant adhesive with a freezing point of -16.9 ° C. It can be solidified rapidly at normal temperature. However, it is chemically unstable and easy to polymerize. It is prone to polyaddition in the presence of trace amounts of water in the air. The reaction cures quickly. In order to improve ethyl cyanoacrylate The stability of the composition prevents premature polymerization.
  • the present invention adds a stabilizer and a polymerization inhibitor to the composition to rapidly cure the composition at normal temperature.
  • the present invention also adds a tackifier to the composition, and the tackifier wets the bonding surface by surface diffusion, so that between the composition and the adherend The bond strength is enhanced.
  • the composition combined according to the foregoing formula when applied to the surface of the adherend, forms a stable organic shielding film on the surface of the adherend, and can protect the surface of the adherend from the external environment. At the same time, the organic shielding film can be removed at room temperature, and the cleaning is convenient.
  • the invention applies the composition to the preparation of a diamond wire saw, and forms an organic shielding film with regular pores on the surface of the diamond wire saw.
  • the diamond particles are only bonded to the embryonic line with pores, so that the prepared
  • the diamond wire saw has a regular diamond arrangement, a wire diameter hook, and a high cutting performance. If the content of the tackifier is too high, the organic shielding film is difficult to remove; if the content of the binder is too low, the bonding strength between the organic shielding film and the adherend is low, and it is easy to fall off. If the content of the stabilizer and the polymerization inhibitor is too low, the chemical properties of the composition are unstable and are easily polymerized together, resulting in failure to form an organic shielding film.
  • the composition comprises 90% of ethyl cyanoacrylate, 5 wt% of a tackifier, 2% of a stabilizer, and 3% by weight of a polymerization inhibitor
  • the chemical properties of the composition are more stable and bonded.
  • the tackifier is a rosin resin
  • the stabilizer is a tribasic lead sulfate
  • the polymerization inhibitor is tert-butyl catechol.
  • the polymerization inhibitor is tert-butyl catechol, which has good inhibition effect at normal temperature. When the temperature is high, no inhibition effect is produced, and the composition can be cured into an organic shielding film.
  • the tackifier is a rosin resin, which has similar solubility to ethyl cyanoacrylate and has a good tackifying effect.
  • the stabilizer uses tribasic lead sulfate to improve the stability of ethyl ⁇ -cyanoacrylate at room temperature.
  • Another aspect of the present invention also provides a method of preparing a diamond wire saw, comprising the steps of: coating a shielding film: coating the aforementioned composition on the surface of the embryonic wire, and subjecting the composition to the surface of the embryo by a curing step Forming an organic shielding film having regular pores to obtain an embryonic line having an organic shielding film; plating: bonding the diamond particles to the pores of the embryonic wire having the organic shielding film by electroplating to obtain a diamond wire saw having an organic shielding film; Shielding film: A diamond wire saw with an organic shielding film is immersed in an organic solvent to remove the organic shielding film to obtain a diamond wire saw.
  • the reinforced plating The diamond wire saw is firstly subjected to a reinforced plating step to obtain a diamond wire saw.
  • the invention solves the technical problem of irregular diamond arrangement, uneven wire diameter, poor processing precision and low utilization rate of diamond cutting in the prior art, and an organic shielding film is brushed on the surface of the embryo wire, and the organic shielding film has certain The regular voids are then firmly bonded to the surface of the embryonic line by a curing step. Since the surface of the wire saw has an organic shielding film, the diamond can only adhere to the gap of the organic shielding film during the electroplating process, and cannot adhere to the organic shielding film, so that the diamond particles are regularly distributed around the embryonic line, and Electroplated diamond wire saw with regular diamond arrangement, wire diameter hook and high cutting performance.
  • the organic shielding film is not destroyed or dissolved in the diamond sand and the reinforcing process, thereby preventing the plating solution from being contaminated. Then, the organic shielding film around the diamond wire saw is dissolved by an organic solvent, and the bonding force between the diamond particles and the embryonic wire is not affected, and the residual amount of the organic shielding film is small.
  • the diamond wire saw is firstly subjected to a reinforced plating step to obtain an electroplated diamond wire saw, and the diamond particles can be firmly bonded to the surface of the embryonic wire to further enhance the bonding force between the diamond and the embryo.
  • the diamond particles can be regularly arranged, and the density of the diamond particles can be adjusted by controlling the gap of the organic shielding film; the regularly arranged diamond wire saw has higher cutting utilization rate, shallow line marks, and processing. Higher precision.
  • the embryonic line is a steel wire of 0.12 to 0.44 mm; the diameter of the diamond particles is 6 to 60 ⁇ m, and the thickness of the organic shielding film is 1 to 5 ⁇ m.
  • the foregoing preparation method further includes a washing step of performing a degreasing step of the embryonic wire and the diamond particles in a strong alkali solution, performing a descaling step in the strong acid solution after the rinsing, and then performing a coating step.
  • the cleaning step of the embryonic wire and the diamond particles is performed to remove the impurities on the diamond particles and the surface of the embryonic wire, so that the organic shielding film is better bonded to the surface of the embryonic wire, and at the same time, the bonding force of the diamond particles with the embryonic wire during the electroplating process is ensured.
  • the strong alkali solution is 5-10% NaOH solution
  • the strong acid solution is 2 ⁇ 5 ⁇ % aqua regia, which is not corrosive to the embryonic wire and the diamond wire saw, and does not affect the performance of the embryonic wire and the diamond particles. Ensure the removal of oil stains and rust on the surface of the embryo and diamond particles.
  • the curing temperature of the curing step is 80 to 100 ° C, which can cause the polymerization inhibitor in the composition to lose the polymerization inhibitory effect, and the composition can be rapidly solidified on the surface of the embryonic line to form a stable organic shielding film to ensure the organic shielding film.
  • the organic solvent in the step of removing the organic shielding film is acetone. Each component in the organic shielding film can be dissolved in the acetone solution, and the organic shielding film can be quickly dissolved and removed at normal temperature, and the removal effect is good.
  • the electroplating step is to electroplate the embryo with the organic shielding film at a temperature of 5 to 20 m/min through the upper sand channel at 40 to 50 ° C to arrange the diamond regularly in the unshielded space. Due to the low temperature during the electroplating process and the high sanding speed, the organic shielding film will not be destroyed or dissolved during the diamond sanding and reinforcement process. If the temperature is too high and the sanding speed is too slow, the organic shielding film is broken, and the regularly distributed diamond particles cannot be plated on the surface of the embryonic wire.
  • Example 1 Composition 1 comprised 95% of ethyl cyanoacrylate, 3 wt% of a tackifier, 1 wt% of a stabilizer, and 2 wt% of a polymerization inhibitor.
  • composition 1 Coating composition 1 on the surface of a clean steel wire and heating to 80 ° C, so that composition 1 forms an organic shielding film having a regular pore thickness of ⁇ on the surface of the embryonic line to obtain an organic shielding film.
  • Steel wire
  • the steel wire with the organic shielding film is passed through the plating tank at a speed of 20 m/min at 40 ° C, so that the clean diamond is regularly arranged in the unshielded pores of the steel wire to obtain a diamond wire with an organic shielding film. saw.
  • Example 2 Composition 2 comprised 90% by weight of ethyl cyanoacrylate, 5% by weight of a tackifier, 2% by weight of a stabilizer, and 3% by weight of a polymerization inhibitor.
  • the diamond particles with a particle size of 40 ⁇ 50 ⁇ are degreased with 10% NaOH aqueous solution, rinsed with water, and then washed with 5% aqua regia to remove surface impurities to obtain clean diamond particles.
  • a steel wire having a diameter of 0.25 mm is taken as an embryonic line, and the embryonic wire is degreased in a 5 wt% alkali solution. 2 wt% pickling and rust removal treatment to obtain a clean rigid line.
  • the composition 2 is coated on the surface of a clean steel wire, and heated to 90 ° C, so that the composition 2 forms an organic shielding film having a regular pore thickness of 3 ⁇ m on the surface of the embryonic line to obtain an organic shielding film.
  • Steel wire. (4) The steel wire with the organic shielding film is passed through the plating tank at a rate of 10 m/min at 45 ° C, so that the clean diamond is regularly arranged in the unshielded pores of the steel wire to obtain a diamond wire with an organic shielding film. saw. (5) A diamond wire saw having an organic shielding film is placed in acetone to remove the organic shielding film to obtain a diamond wire saw.
  • Example 3 comprised 85 % by weight of ethyl cyanoacrylate, 8 % by weight of a tackifier, 3 % by weight of a stabilizer, and 4 % by weight of a polymerization inhibitor.
  • the diamond particles with a particle size of 50 ⁇ 60 ⁇ are degreased with 10% NaOH aqueous solution, rinsed with water, and then washed with 5% aqua regia to remove surface impurities to obtain clean diamond particles.
  • a steel wire having a diameter of 0.44 mm is taken as an embryonic line, and the embryonic line is degreased in a 5 wt% alkali solution. 2 wt% pickling and rust removal treatment to obtain a clean rigid line.
  • the composition 3 is coated on the surface of a clean steel wire, and heated to 100 ° C, so that the composition 3 forms an organic shielding film having a regular pore thickness of 5 ⁇ m on the surface of the embryonic line to obtain an organic shielding film.
  • Steel wire
  • the steel wire with the organic shielding film is passed through the plating tank at a speed of 5 m/min at 50 ° C, and the clean diamond is regularly arranged in the unshielded pores of the steel wire to obtain a diamond wire with an organic shielding film. saw.
  • a diamond wire saw having an organic shielding film is placed in an acetone organic solvent to remove the organic shielding film to obtain a diamond wire saw.
  • Fig. 2 is an SEM view of the diamond wire saw of the first embodiment.
  • the diamond wire saw prepared by the method of the present invention has the diamond particles regularly arranged on the surface of the wire saw and the wire diameters are hooked.
  • 3 is an SEM view of the diamond wire saw of Comparative Example 1.
  • the diamond wire saw prepared according to the method of Comparative Example 1 has irregularly arranged diamond particles on the surface of the wire saw, and the wire diameter is not uniform, and some The place is too thick, and some places are too thin.

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  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
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Abstract

本发明提供了一种组合物及其用于制备金刚石线锯的方法。该方法包括85~95wt%的α氰基丙烯酸乙酯、3~8wt%的增粘剂、1~3wt%的稳定剂、2~4wt%的阻聚剂。解决了现有技术中金刚石排列不规则、线径不均匀、加工精度差,金刚石切割利用率低的技术问题。

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一种组合物及其用于制备金刚石线锯的方法 技术领域 本发明涉及光固化线锯的领域, 特别地, 涉及一种组合物, 还涉及一种将前述组 合物用于制备金刚石线锯的方法。 背景技术 硬脆材料包括各种硅晶体、 石英晶体、 蓝宝石、 硬质合金和陶瓷材料等。 硬脆材 料大多为非导电体或半导体, 通常具有高硬度、 高脆性、 高耐磨性、 高抗蚀性、 高抗 氧化性、 高电阻率、 耐高温、 不导磁等性能。 由于脆硬材料的特殊性能, 对脆硬材料 的加工技术提出了更高要求。 切割是对脆硬材料加工的主要步骤, 切割方法主要有金 刚石锯片切割、 带状工具切割、 激光束切割等。 这些切割方法具有高效率、 低成本、 切缝窄、 无损伤、 无环境污染等优点; 其中金刚石锯片切割设备具有操作方便、 效率 高、 加工质量好等优点, 但噪音较大, 只能单片切割, 效率低, 刀片刚性差, 被切割 对象尺寸大小受限, 切割过程中锯片易产生振摆、 跑偏, 导致被切割工件的平行度差。 带状工具切割的锯口小, 锯切速度快, 刀具材料消耗小、 噪音小等优点, 但它要求原 料规整, 且不能进行多片切割。 激光束切割的适用范围较广, 但切割深度有限, 若采 用大功率激光器, 则激光与工件间产生的高温等离子体会明显降低加工效率, 增加熔 融物的排出难度, 且设备投资费用昂贵。 金刚石线锯是将高硬度、 高耐磨性的金刚石颗粒固结在钢丝基体上面制成的一种 切割工具。 金刚石线锯可以根据需要制成不同的直径和长度; 可以安装在不同的设备 上形成不同的加工方式, 如往复循环 (锯架) 式、 高速带锯式、 单线切割式和多线切割 式等。 电镀金刚石线锯因其切缝窄, 切割效率高和经济环保等优势, 特别适用于切割 硅晶体, 蓝宝石、 磁性材料、 陶瓷、 水晶等贵重的硬脆材料切割加工。 金刚石线锯制备方法通常是采用电镀的方法在金属丝胚线上沉积一层金属, 并在 沉积的金属内固结金刚石颗粒。 金属镀层是结合剂, 金刚石颗粒用于切削加工。 现有 技术采用普通复合电沉积上砂法, 金刚石排列杂乱不规则, 金刚石切割利用率较低, 切割表面线痕较深, 加工精度尺寸偏差较大。 发明内容 本发明目的在于提供一种组合物及其用于制备金刚石线锯的方法, 以解决现有技 术中金刚石排列不规则、线径不均勾、加工精度差, 金刚石切割利用率低的技术问题。 为实现上述目的, 根据本发明的一个方面, 提供了一种组合物, 包括 85~95wt% 的 α氰基丙烯酸乙酯、 3~8wt%的增粘剂、 l~3wt%的稳定剂、 2~4wt%的阻聚剂。 进一步地, 包括 90^%的 α氰基丙烯酸乙酯, 5wt%的增粘剂、 2wt%的稳定剂、 3wt%的阻聚剂。 进一步地, 增粘剂为松香树脂; 稳定剂为三盐基硫酸铅; 阻聚剂为叔丁基邻苯二 酚。 本发明的另一方面还提供了一种金刚石线锯的制备方法, 包括以下步骤: 涂覆屏蔽膜: 将前述的组合物涂覆在胚线的表面, 通过固化步骤使组合物在胚线 表面形成具有规则孔隙的有机屏蔽膜, 得到具有有机屏蔽膜的胚线; 电镀: 将金刚石颗粒通过电镀结合到具有有机屏蔽膜的胚线的孔隙处, 得到具有 有机屏蔽膜的金刚石线锯; 去除有机屏蔽膜: 将具有有机屏蔽膜的金刚石线锯浸泡在有机溶剂中除去有机屏 蔽膜得到金刚石线锯初品; 加固电镀: 将金刚石线锯初品进行加固电镀步骤得到金刚石线锯。 进一步地, 胚线为直径 0.12~0.44mm的钢线; 金刚石颗粒的粒径为 6~60μηι, 有 机屏蔽膜的厚度为 1~5μηι。 进一步地, 还包括清洗步骤, 清洗步骤为将胚线和金刚石颗粒在强碱溶液中进行 除油步骤, 漂洗后再在强酸溶液中进行除锈步骤, 然后进行涂覆步骤。 进一步地, 强碱溶液为 5~10wt%的NaOH溶液, 强酸溶液为 2~5^%的王水。 进一步地, 固化步骤的固化温度为 80~100°C。 进一步地, 去除有机屏蔽膜步骤中有机溶剂为丙酮。 进一步地, 电镀步骤为将金刚石颗粒, 在 40~50°C下以 5~20m/min速度进行电镀 上砂, 使金刚石规则的排列在未屏蔽的胚线空隙处。 本发明具有以下有益效果: 本发明提供的组合物, 当其涂覆在被粘物表面时, 可在被粘物表面形成稳定的有 机屏蔽膜, 可以保护被粘物表面不受外部环境的干扰。 同时有机屏蔽膜可在常温下去 除, 清洁方便。 本发明将组合物应用于金刚石线锯的制备, 可在金刚石线锯表面形成 规则孔隙的有机屏蔽膜, 在电镀过程中, 金刚石颗粒仅粘结在具有孔隙的胚线上, 使 制得的金刚石线锯的金刚石规则排列、 线径均勾、 具有高切割性能。 本发明提供的金刚石线锯的制备方法, 金刚石颗粒可规则排列, 金刚石颗粒的密 度可以通过控制有机屏蔽膜的间隙进行调整;规则排列的金刚石线锯切割利用率更高, 线痕较浅, 加工精度更高。 除了上面所描述的目的、特征和优点之外, 本发明还有其它的目的、特征和优点。 下面将参照图, 对本发明作进一步详细的说明。 附图说明 构成本申请的一部分的附图用来提供对本发明的进一步理解, 本发明的示意性实 施例及其说明用于解释本发明, 并不构成对本发明的不当限定。 在附图中: 图 1是本发明优选实施例的流程示意图; 图 2是本发明优选实施例的金刚石线锯 SEM图; 图 3是本发明对比例的金刚石线锯 SEM图。 具体实施方式 以下结合附图对本发明的实施例进行详细说明, 但是本发明可以由权利要求限定 和覆盖的多种不同方式实施。 本发明的一个方面提供了一种组合物, 包括 85~95^%的 α氰基丙烯酸乙酯、 3~8wt%的增粘剂、 l~3wt%的稳定剂、 2~4wt%的阻聚剂。 α氰基丙烯酸乙酯是一种瞬 间胶黏剂, 凝固点为 -16.9°C, 在常温下可以迅速凝固; 但是化学性质不稳定, 易聚合, 在空气中有微量水存在下, 容易发生加聚反应迅速固化。 为了提高 α氰基丙烯酸乙酯 的稳定性, 防止其过早聚合, 本发明在组合物中加入了稳定剂和阻聚剂, 使组合物在 常温下迅速固化。 同时, 为了增强组合物与被粘结物的结合力, 本法明还在组合物中 加入了增粘剂, 增粘剂通过表面扩散润湿粘结表面, 使组合物和被粘物之间的粘结强 度增强。 按照前述配方组合而成的组合物, 当其涂覆在被粘物表面时, 可在被粘物表面形 成稳定的有机屏蔽膜, 可以保护被粘物表面不受外部环境的干扰。 同时有机屏蔽膜可 在常温下去除, 清洁方便。 本发明将组合物应用于金刚石线锯的制备, 可在金刚石线 锯表面形成含规则孔隙的有机屏蔽膜, 在电镀过程中, 金刚石颗粒仅粘结在具有孔隙 的胚线上, 使制得的金刚石线锯的金刚石规则排列、 线径均勾、 具有高切割性能。 若 增粘剂的含量过高, 则有机屏蔽膜难以去除; 若粘结剂的含量过低, 则有机屏蔽膜与 被粘物的结合力较低, 易脱落。 若稳定剂和阻聚剂的含量过低, 则组合物的化学性质 不稳定, 容易聚合在一起, 导致不能形成有机屏蔽膜。 进一步地, 当组合物包含 90^%的 α氰基丙烯酸乙酯, 5wt%的增粘剂、 2^%的 稳定剂、 3wt%的阻聚剂时, 组合物的化学性质更稳定,粘结性能更好, 屏蔽效果更佳。 进一步地, 增粘剂为松香树脂; 稳定剂为三盐基硫酸铅; 阻聚剂为叔丁基邻苯二 酚。 阻聚剂采用叔丁基邻苯二酚, 在常温下阻聚效果好, 当温度较高时, 便不产生阻 聚效果, 使组合物能固化成有机屏蔽膜。 增粘剂为松香树脂, 与 α氰基丙烯酸乙酯的 溶解度相似, 增粘效果好。 稳定剂采用三盐基硫酸铅, 可提高 α氰基丙烯酸乙酯在常 温下的稳定性。 本发明的另一方面还提供了一种金刚石线锯的制备方法, 包括以下步骤: 涂覆屏蔽膜: 将前述的组合物涂覆在胚线的表面, 通过固化步骤使组合物在胚线 表面形成具有规则孔隙的有机屏蔽膜, 得到具有有机屏蔽膜的胚线; 电镀: 将金刚石颗粒通过电镀结合到具有有机屏蔽膜的胚线的孔隙处, 得到具有 有机屏蔽膜的金刚石线锯; 去除有机屏蔽膜: 将具有有机屏蔽膜的金刚石线锯浸泡在有机溶剂中除去有机屏 蔽膜得到金刚石线锯初品; 加固电镀: 将金刚石线锯初品进行加固电镀步骤得到金刚石线锯。 本发明为了解决现有技术中金刚石排列不规则、 线径不均勾、 加工精度差, 金刚 石切割利用率低的技术问题, 在胚线表面刷一层有机屏蔽膜, 该有机屏蔽膜具有一定 规则的空隙, 然后通过固化步骤使有机屏蔽膜牢固的粘结在胚线的表面。 由于线锯表 面具有有机屏蔽膜, 在电镀过程中, 金刚石只能粘附在有机屏蔽膜的空隙中, 而不能 粘附在有机屏蔽膜上,使金刚石颗粒规则的分布在胚线的周围,得到金刚石规则排列、 线径均勾、 高切割性能的电镀金刚石线锯。 同时在电镀过程中, 由于电镀温度低, 电 镀时间短, 有机屏蔽膜在金刚石上砂和加固过程总不会被破坏或溶解, 防止电镀液污 染。 然后用有机溶剂将金刚石线锯周围的有机屏蔽膜溶解掉, 不影响金刚石颗粒与胚 线的结合力, 有机屏蔽膜的残留量小。 将金刚石线锯初品进行加固电镀步骤得到电镀 金刚石线锯, 金刚石颗粒可以牢固的粘结在胚线的表面, 进一步增强金刚石与胚线的 结合力。 按照本发明的方法制备的金刚石线锯, 金刚石颗粒可规则排列, 金刚石颗粒 的密度可以通过控制有机屏蔽膜的间隙进行调整; 规则排列的金刚石线锯切割利用率 更高, 线痕较浅, 加工精度更高。 进一步地, 胚线为 0.12~0.44mm的钢线; 金刚石颗粒的粒径为 6~60μηι, 有机屏 蔽膜的厚度为 1~5μηι。 进一步地, 前述制备方法还包括清洗步骤, 清洗步骤为将胚线和金刚石颗粒在强 碱溶液中进行除油步骤, 漂洗后再在强酸溶液中进行除锈步骤, 然后进行涂覆步骤。 对胚线和金刚石颗粒进行清洗步骤, 除去金刚石颗粒和胚线表面的杂质, 使有机屏蔽 膜更好地粘结在胚线表面, 同时保证金刚石颗粒在电镀过程中与胚线的结合力。 进一步地, 强碱溶液为 5~10^%的 NaOH溶液, 强酸溶液为 2~5^%的王水, 对 胚线和金刚石线锯没有腐蚀性, 不影响胚线和金刚石颗粒的性能, 能保证去除胚线和 金刚石颗粒表面的油渍、 污锈。 进一步地, 固化步骤的固化温度为 80~100°C, 可以使组合物中的阻聚剂失去阻聚 效果, 组合物能在胚线表面迅速固化, 形成稳定的有机屏蔽膜, 保证有机屏蔽膜和胚 线的结合力。 进一步地, 去除有机屏蔽膜步骤中有机溶剂为丙酮。 有机屏蔽膜中各组分均能溶 于丙酮溶液中, 在常温下可迅速将有机屏蔽膜溶解去除, 去除效果好。 进一步地, 电镀步骤为将具有有机屏蔽膜的胚线在 40~50°C下以 5~20m/min速度 通过上砂槽进行电镀上砂, 使金刚石规则的排列在未屏蔽的空隙处。 由于电镀过程中 温度较低, 上砂速度快, 有机屏蔽膜在金刚石上砂和加固过程中不会被破坏或溶解。 若温度过高, 上砂速度过慢, 则有机屏蔽膜被破坏, 无法在胚线表面镀覆规则分布的 金刚石颗粒。 实施例 以下是实施例中所用的原料和仪器均为市售。 实施例 1 组合物 1包括 95^%的 α氰基丙烯酸乙酯、 3wt%的增粘剂、 lwt%的稳定剂、 2wt% 的阻聚剂。
( 1 )、取粒度为 10 20μηι的金刚石颗粒和直径为 0.12mm的钢线,经过 10% NaOH 水溶液去油, 清水漂洗, 然后, 用 5%王水酸洗, 除去表面杂质得到干净的金刚石颗粒 和钢线。
(2)、 将组合物 1涂覆在干净的钢线表面, 加热至 80°C, 使组合物 1在胚线表面 形成具有规则孔隙的厚度为 Ιμηι的有机屏蔽膜, 得到具有有机屏蔽膜的钢线。
(3 )、将具有有机屏蔽膜的钢线在 40°C下以 20m/min速度通过电镀槽, 使干净的 金刚石规则的排列在钢线中未屏蔽的孔隙处得到具有有机屏蔽膜的金刚石线锯。
(4)、 将具有有机屏蔽膜的金刚石线锯放置在丙酮中除去有机屏蔽膜得到金刚石 线锯初品。 (5 )、 将金刚石线锯初品进行加固电镀步骤得到金刚石线锯。 实施例 2 组合物 2包括 90^%的 α氰基丙烯酸乙酯、 5wt%的增粘剂、 2wt%的稳定剂、 3wt% 的阻聚剂。
( 1 )、 取粒度为 40~50μηι的金刚石颗粒经过 10% NaOH水溶液去油, 清水漂洗, 然后, 用 5%王水酸洗, 除去表面杂质得到干净的金刚石颗粒。
(2)取直径为 0.25mm的钢线作为胚线, 将胚线在 5wt%碱溶液中除油 2wt%酸洗 除锈活化处理得到干净的刚线。
(3 )、 将组合物 2涂覆在干净的钢线表面, 加热至 90°C, 使组合物 2在胚线表面 形成具有规则孔隙的厚度为 3μηι的有机屏蔽膜, 得到具有有机屏蔽膜的钢线。 (4)、将具有有机屏蔽膜的钢线在 45°C下以 lOm/min速度通过电镀槽, 使干净的 金刚石规则的排列在钢线中未屏蔽的孔隙处得到具有有机屏蔽膜的金刚石线锯。 ( 5 )、 将具有有机屏蔽膜的金刚石线锯放置在丙酮中除去有机屏蔽膜得到金刚石 线锯初品。
( 6)、 将金刚石线锯初品进行加固电镀步骤得到金刚石线锯。 实施例 3 组合物 3包括 85^%的 α氰基丙烯酸乙酯、 8wt%的增粘剂、 3wt%的稳定剂、 4wt% 的阻聚剂。
( 1 )、 取粒度为 50~60μηι的金刚石颗粒经过 10%NaOH水溶液去油, 清水漂洗, 然后, 用 5%王水酸洗, 除去表面杂质得到干净的金刚石颗粒。
(2)取直径为 0.44mm的钢线作为胚线, 将胚线在 5wt%碱溶液中除油 2wt%酸洗 除锈活化处理得到干净的刚线。
( 3 )、 将组合物 3涂覆在干净的钢线表面, 加热至 100°C, 使组合物 3在胚线表 面形成具有规则孔隙的厚度为 5μηι的有机屏蔽膜, 得到具有有机屏蔽膜的钢线。
(4)、 将具有有机屏蔽膜的钢线在 50°C下以 5m/min速度通过电镀槽, 使干净的 金刚石规则的排列在钢线中未屏蔽的孔隙处得到具有有机屏蔽膜的金刚石线锯。 ( 5 )、 将具有有机屏蔽膜的金刚石线锯放置在丙酮有机溶剂中除去有机屏蔽膜得 到金刚石线锯初品。
( 6)、 将金刚石线锯初品进行加固电镀步骤得到金刚石线锯。 对比例 1 在钢线表面不涂覆有机屏蔽膜, 其余方法按照实施例 1进行。 对比例 2 在钢线表面不涂覆有机屏蔽膜, 其余方法按照实施例 2进行。 对比例 3 在钢线表面不涂覆有机屏蔽膜, 其余方法按照实施例 3进行, 采用实施例 1~3和对比例 1~3的金刚石线锯对 850x850x320mm的多晶硅锭进行 开方, 在显微镜下检测多晶硅锭的切痕。 对实施例 1~3和对比例 1~3的金刚石线锯进行拉伸破断力检测。 对实施例 1~3和对比例 1~3的金刚石线锯的直径进行测量。 对实施例 1~3和对比例 1~3的金刚石线锯进行切割效率检测, 检测方法按照: 将 实施例 1~3和对比例 1~3的金刚石线锯, 以线速度为 2.5m/s, 给进速度为 0.5mm/min, 以水为冷却介质, 对直径为 100mm的硅棒进行 250min的切割, 考察固化线锯对硅棒 的切割效率。 将实施例 1~3和对比例 1~3金刚石线锯的切痕、 拉伸破断力和线径的检 测结果列于表 1中。
Figure imgf000009_0001
从表 1的实验结果可知, 按照本发明的方法制备的金刚石线锯, 多晶硅的切痕明 显低于未按照本发明方法处理的金刚石线锯, 加工精度明显提高; 同时线径的偏差较 小, 实施例 1~3的金刚石线锯其拉伸破断力和切割效率明显高于对比例 1~3。 图 2为实施例 1的金刚石线锯的 SEM图,从图中可知,按照本发明的方法制备的 金刚石线锯, 其线锯表面的金刚石颗粒规则排列, 线径均勾。 图 3为对比例 1的金刚石线锯的 SEM图,从图中可知,按照对比例 1的方法制备 的金刚石线锯, 其线锯表面的金刚石颗粒排列不规则, 线径不均勾, 有的地方过粗, 有的地方过细。 以上所述仅为本发明的优选实施例而已, 并不用于限制本发明, 对于本领域的技 术人员来说, 本发明可以有各种更改和变化。 凡在本发明的精神和原则之内, 所作的 任何修改、 等同替换、 改进等, 均应包含在本发明的保护范围之内。

Claims

权 利 要 求 书
1. 一种组合物, 其特征在于, 包括 85~95Wt%的α氰基丙烯酸乙酯、 3~8wt%的增 粘剂、 l~3wt%的稳定剂、 2~4wt%的阻聚剂。
2. 根据权利要求 1所述的组合物,其特征在于,包括 90wt%的 a氰基丙烯酸乙酯, 5wt%的增粘剂、 2wt%的稳定剂、 3wt%的阻聚剂。
3. 根据权利要求 1所述的组合物, 其特征在于, 所述增粘剂为松香树脂; 所述稳 定剂为三盐基硫酸铅; 所述阻聚剂为叔丁基邻苯二酚。
4. 一种制备金刚石线锯的方法, 其特征在于, 包括以下步骤:
涂覆屏蔽膜:将权利要求 1至 3任意一项所述的组合物涂覆在胚线的表面, 通过固化步骤使组合物在胚线表面形成具有规则孔隙的有机屏蔽膜, 得到具有 有机屏蔽膜的胚线;
电镀:将金刚石颗粒通过电镀结合到所述具有有机屏蔽膜的胚线的孔隙处, 得到具有有机屏蔽膜的金刚石线锯;
去除有机屏蔽膜: 将所述具有有机屏蔽膜的金刚石线锯浸泡在有机溶剂中 除去有机屏蔽膜得到金刚石线锯初品;
加固电镀: 将所述金刚石线锯初品进行加固电镀步骤得到金刚石线锯。
5. 根据权利要求 4所述的方法, 其特征在于, 所述胚线为直径 0.12~0.44mm的钢 线; 所述金刚石颗粒的粒径为 6~60μηι, 所述有机屏蔽膜的厚度为 1~5μηι。
6. 根据权利要求 4所述的方法, 其特征在于, 还包括清洗步骤, 所述清洗步骤为 将胚线和金刚石颗粒在强碱溶液中进行除油步骤, 漂洗后再在强酸溶液中进行 除锈步骤, 然后进行所述涂覆步骤。
7. 根据权利要求 6所述的方法, 其特征在于, 所述强碱溶液为 5~10Wt%的 NaOH 溶液, 所述强酸溶液为 2~5^%的王水。
8. 根据权利要求 4 所述的方法, 其特征在于, 所述固化步骤的固化温度为 80~10(TC。
9. 根据权利要求 4所述的方法, 其特征在于, 所述去除有机屏蔽膜步骤中所述有 机溶剂为丙酮。
10. 根据权利要求 4所述的方法,其特征在于,所述电镀步骤为将所述金刚石颗粒, 在 40~50°C下以 5~20m/min速度进行电镀上砂, 使金刚石规则地排列在未屏蔽 的胚线空隙处。
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