WO2012133196A1 - Procédé pour la production de feuille d'étanchéité de cellule solaire - Google Patents

Procédé pour la production de feuille d'étanchéité de cellule solaire Download PDF

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Publication number
WO2012133196A1
WO2012133196A1 PCT/JP2012/057531 JP2012057531W WO2012133196A1 WO 2012133196 A1 WO2012133196 A1 WO 2012133196A1 JP 2012057531 W JP2012057531 W JP 2012057531W WO 2012133196 A1 WO2012133196 A1 WO 2012133196A1
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WIPO (PCT)
Prior art keywords
sheet
solar cell
temperature
resin composition
encapsulant
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PCT/JP2012/057531
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English (en)
Japanese (ja)
Inventor
岡善之
中原誠
佐藤誠
一ノ宮崇
Original Assignee
東レ株式会社
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Application filed by 東レ株式会社 filed Critical 東レ株式会社
Priority to KR1020137024913A priority Critical patent/KR20140010961A/ko
Priority to CN201280014497.1A priority patent/CN103442880B/zh
Publication of WO2012133196A1 publication Critical patent/WO2012133196A1/fr

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
    • H01L31/042—PV modules or arrays of single PV cells
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
    • B29C59/04—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing using rollers or endless belts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
    • H01L31/042—PV modules or arrays of single PV cells
    • H01L31/048—Encapsulation of modules
    • H01L31/0481—Encapsulation of modules characterised by the composition of the encapsulation material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C71/00—After-treatment of articles without altering their shape; Apparatus therefor
    • B29C71/02—Thermal after-treatment
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy

Definitions

  • the present invention relates to a method for producing a solar cell encapsulant sheet.
  • the present invention relates to a method for producing a sheet suitably used for producing a solar cell encapsulant sheet having a small heat shrinkage and having a clear protrusion formed on the surface.
  • a solar cell is a solar cell sealing material sheet (hereinafter referred to as a sealing material sheet) between a light-receiving surface protective material typified by a glass substrate and a back surface protective material called a back sheet. The cell is sealed.
  • a sealing material sheet a solar cell sealing material sheet between a light-receiving surface protective material typified by a glass substrate and a back surface protective material called a back sheet. The cell is sealed.
  • Crystalline silicon solar cells which are mainstream as solar cell modules, are generally manufactured as follows. First, a glass substrate, a sealing material sheet, a solar battery cell (silicon power generation element), a sealing material sheet, and a back sheet are laminated in this order.
  • This sealing material sheet is generally composed of an ethylene-vinyl acetate copolymer (hereinafter referred to as EVA). Subsequently, this laminated body is heated under vacuum with a vacuum laminator, and the sealing material sheet is heated and melted to be cured by crosslinking. In this way, a solar cell module in which the constituent members are bonded without bubbles is manufactured.
  • EVA ethylene-vinyl acetate copolymer
  • the solar cell module since the solar cell module is used for a long time after manufacturing, its reliability is extremely important. Typical defects that occur in a solar cell module that has been used for a long period of time include peeling between the solar cells and the sealing material sheet, poor appearance such as swelling, and a corresponding decrease in the amount of power generation. The reason for these malfunctions is not necessarily clarified, but studies have been made from the raw material side constituting the encapsulant sheet. For example, a method of adjusting the viscosity of EVA constituting the encapsulant sheet (Patent Document 2) and a method of adding a silane coupling agent to improve the adhesive strength between the solar battery cell and the encapsulant sheet (Patent Document) 3) etc. are being studied.
  • Patent Document 6 after forming an embossed shape on the surface of a sheet in the manufacturing process (hereinafter referred to as a process sheet), the process sheet is annealed. Therefore, when the process sheet is sufficiently heated to reduce the heat shrinkage of the encapsulant sheet, the embossed shape formed on the surface of the process sheet is broken by the heating. Conversely, if the heating of the process sheet is loosened in order to maintain the embossed shape, the annealing process becomes insufficient. As described above, in the manufacturing method of Patent Document 6, it is very difficult to achieve both reduction in heat shrinkage and clear formation of an embossed shape.
  • the encapsulant sheet composed of EVA often contains a cross-linking agent, and the molding temperature of the process sheet becomes low, so that a lot of residual distortion remains in the process sheet.
  • the residual strain is often not uniform in the width direction of the wide process sheet.
  • an object of the present invention is to provide a production method capable of forming a clear embossed shape on the surface of the encapsulant sheet while sufficiently reducing the heat shrinkage of the encapsulant sheet.
  • the method for producing a solar cell encapsulant sheet of the present invention is characterized in that the following step (a), step (b) and step (c) are performed in this order.
  • a solar cell encapsulant sheet having a small heat shrinkage and a clear embossed shape can be efficiently produced at low cost.
  • FIG. 1 is a schematic diagram showing an example of a method for producing a solar cell encapsulant sheet of the present invention.
  • FIG. 2 is a schematic diagram showing an example of a conventional method for producing a solar cell encapsulant sheet.
  • FIG. 3 is a diagram for explaining a method of measuring the height of the protrusions of the solar cell encapsulant sheet having protrusions formed on one side.
  • FIG. 4 is a diagram for explaining a method for measuring the height of the protrusions of the solar cell encapsulant sheet having protrusions formed on both sides.
  • FIG. 5 is a diagram illustrating the length D of the bottom side of the protrusion.
  • FIG. 1 is a schematic diagram showing one embodiment of the production method of the present invention.
  • Step (a) is a step of forming a raw material resin into a sheet and cooling it to obtain a process sheet.
  • the step (a) is referred to as a film forming step.
  • the film forming process in FIG. 1 includes an extruder 11 that melts and kneads the raw resin and additives at high temperature, a gear pump 31 that reduces the pressure fluctuation of the resin and stabilizes the thickness of the sheet, and the kneaded molten resin into the sheet.
  • a die 12 to be extruded into a shape and polishing rollers 13a, 13b and 13c for cooling and solidifying the extruded high-temperature process sheet to form a solid process sheet are installed.
  • a single screw extruder or a twin screw extruder can be used as the extruder 11.
  • the use of a twin screw extruder is preferred from the viewpoints of productivity, kneadability of resin and additive, and the like.
  • a single screw extruder since the inside of the extruder is filled with resin, the pressure fluctuation at the die portion at the tip of the extruder is relatively small, and therefore it is not always necessary to install a quantitative supply device such as the gear pump 31. .
  • a twin screw extruder is used, the inside of the extruder is not filled, and therefore it is preferable to install a quantitative supply device such as a gear pump 31 between the extruder and the die.
  • the raw material resin and the additive to be charged into the extruder 11 may be mixed in advance using a mixer or a blender, or may be individually charged. Moreover, you may use the method etc. which side-feed an additive from the middle of an extruder, or add with an injection pump etc., if it is a liquid additive.
  • the temperature at which the raw material resin and the additive are kneaded depends on the type and viscosity of the resin used, but is preferably in the range of (melting point of raw material resin + 10 ° C.) to (melting point of raw material resin + 60 ° C.).
  • the melting point is an endothermic peak value temperature when the temperature is raised at 10 ° C./min in differential scanning calorimetry (DSC).
  • DSC differential scanning calorimetry
  • an organic peroxide is often contained as an additive in order to crosslink EVA. Therefore, it should be noted that the organic peroxide is kneaded without being decomposed as much as possible.
  • the resin temperature is preferably in the range of 80 to 130 ° C., for example, in the case of EVA having a melting point of about 70 ° C. More preferably, it is in the range of 100 to 120 ° C. If it is less than 80 degreeC, kneadability becomes inadequate and the uniform dispersibility of an additive may fall. As a result, the appearance of the encapsulant sheet may be deteriorated. When it exceeds 130 ° C., when an organic peroxide is blended, the organic peroxide is decomposed, the quality of the sealing material sheet is not stabilized, and the continuous productivity may be lowered.
  • the molten resin kneaded by melting the raw resin and the additive in the extruder 11 or the like is extruded into a sheet shape using the die 12.
  • a T die, a circular die, or the like can be used. Since a flat die has a wide shape in accordance with the sheet width to be extruded, it becomes a T shape when attached to an extruder, and is collectively called a T die.
  • the residence time and flow rate differ in the die width direction in the T die, problems such as uneven thickness and uneven thickness in the width direction occur when the process sheet is heated in step (b). It's easy to do.
  • a cylindrical circular die is a cylindrical die for extruding a resin into a cylindrical shape and cutting it into a sheet shape, and the physical properties in the width direction of the sheet tend to be relatively uniform.
  • the process sheet extruded using the die 12 is formed into a sheet shape by polishing rollers 13a, 13b, and 13c.
  • the polishing roller is a process sheet conveying apparatus composed of a plurality of rollers for simultaneously pressing the molten resin between a pair of rollers and shaping the sheet thickness and surface properties.
  • Each configured roller includes a mechanism that adjusts the temperature to a temperature suitable for cooling and shaping of the molten resin, and a mechanism that adjusts the gap between the rollers and the pressure.
  • the temperature of the cooling water is preferably adjusted in the range of 0 to 30 ° C.
  • the thickness of the silicon rubber on the surface of the polishing roller 13a is 3 to 10 mm. It is preferably 4 to 8 mm.
  • the thickness of the silicon rubber is less than 3 mm, the transfer of the textured pattern becomes insufficient, and the process sheet may adhere to a free roller or the like for conveying the process sheet. If the thickness of the silicon rubber exceeds 10 mm, the heat from the molten resin is stored on the rubber surface, and the resin may stick to the roller.
  • the heater 16 for heating the process sheet is not particularly limited as long as it can heat the process sheet, and a known method such as a ceramic heater, a stainless steel heater, or a sheath heater can be used.
  • a known method such as a ceramic heater, a stainless steel heater, or a sheath heater can be used.
  • the method of heating the sheet with infrared rays is preferable because the sheet can be heated uniformly in the thickness direction of the sheet.
  • heating with a heat medium such as hot air or steam, a method of contacting with a heated roll, or the like can also be preferably used. These heating methods may be used alone or in combination of several methods.
  • the conveyance roller 17 for conveying the process sheet is excellent in releasability in order to convey the heated process sheet.
  • fluorocarbon resins such as polytetrafluoroethylene, perfluoroethylene propene copolymer, and perfluoroalkoxyalkane are coated on metal rollers that have uneven surfaces by embossing or thermal spraying of compounds such as metals and metal oxides. You may use the roller which did. Or you may use the roller which wound the paper, the film, etc. which performed the releasable coating process on the surface of the metal roller.
  • These means for imparting releasability need not be particularly limited, and conventionally known methods can be used.
  • the heater 16 and the transport roller 17 are installed in the annealing furnace 15 and the contact with the outside air is minimized as the temperature in the furnace is stabilized and the heat treatment of the process sheet is stabilized. Moreover, it is one of the preferable aspects to supply hot air into a furnace in order to stabilize the temperature in a furnace uniformly.
  • nip rollers 14 upstream of the annealing furnace 15 as necessary.
  • Providing the nip roller 14 is preferable because the influence of the annealing process on the film forming process can be blocked. Specifically, shrinkage when heating the process sheet can be prevented from affecting the film forming process, and the supply of the process sheet to the annealing process can be stabilized.
  • the distance between the annealing furnace 15 and the embossing roller 20 is preferably as short as possible.
  • a plurality of sheet take-out rollers 18 can be installed, but it is preferable that the number is less, and it is preferable that the number be at most 3 or less, and more preferably 1 or 2.
  • the annealing process heating is performed until the maximum temperature of at least one surface of the process sheet reaches a temperature equal to or higher than the melting point of the resin composition constituting the surface portion.
  • the surface on the heated side is embossed in the next step (c).
  • the “resin composition constituting the surface portion” is a resin composition constituting the process sheet
  • the process sheet is a laminated sheet in which a plurality of layers are laminated. In this case, it is a resin composition constituting the layer on the surface on the heated side.
  • the maximum surface temperature is within the temperature range of (the melting point of the resin composition constituting the heated surface portion + 5 ° C.) to (the melting point of the resin composition constituting the heated surface portion + 35 ° C.). preferable. If the temperature during the annealing process becomes too high, the process sheet may adhere to the transport roller, the flatness may deteriorate, or wrinkles may occur in the next process (c) due to these reasons.
  • the highest surface temperature in the annealing process is preferably in the range of 76 to 106 ° C.
  • Step (c) is a step of embossing the process sheet that has been brought to a high temperature state by heating in the annealing process to form an embossed shape on the surface of the process sheet.
  • an embossing roller 20, an embossing counter roller 19, and a cooling roller 21 for forming an embossed shape on the process sheet are provided.
  • this step (c) is referred to as an embossing step.
  • the surface of the embossing roller 20 is engraved with the embossed shape inverted corresponding to the embossed shape desired to be formed on the process sheet. What is necessary is just to determine the emboss shape formed in a process sheet
  • the engraving pattern applied to the surface of the embossing roller can be a hemispherical shape, a triangular pyramid shape, a quadrangular pyramid shape, a hexagonal pyramid shape, a conical shape such as a conical shape, or a trapezoidal shape with a flat top.
  • the pattern in which these shapes were mixed may be sufficient.
  • a hemispherical shape and / or a quadrangular pyramid shape are preferable.
  • “hemispherical and quadrangular pyramid” means sculpture with a pattern in which hemispherical and quadrangular pyramid are mixed.
  • a hemispherical shape is preferable in that concentrated load is not easily applied when the encapsulant sheet is pressed against the solar battery cell, and the load can be uniformly dispersed. Further, a quadrangular pyramid shape is preferable in that unevenness of reflected light of the encapsulant sheet hardly occurs and the surface quality is excellent. And since both hemispherical and quadrangular pyramid features can be produced, a pattern in which hemispherical and quadrangular pyramid shapes are mixed is also preferable. When the hemispherical shape and the quadrangular pyramid shape are mixed, the ratio of each may be arbitrarily determined according to which feature is to be obtained. Particularly preferably, all are hemispherical patterns.
  • the engraving depth of the emboss roller is preferably in the range of 65 to 350 ⁇ m, although it depends on the thickness of the process sheet.
  • the depth of engraving of the embossing roller is the distance from the center of the embossing roller to the surface of the embossing roller (the part not engraved) and the deepest of the engraving recess (the valley part) from the center of the embossing roller. Indicates the difference from the distance to the part.
  • the depth of this sculpture is indicated by the maximum height Pz ( ⁇ m) measured using a surface roughness measuring machine in accordance with JIS B0601 (2001).
  • the surface of the embossing roller is preferably further recessed with a depth of 1 to 20 ⁇ m.
  • minute projections are formed on the surface of the sheet.
  • the slipperiness of the sheet is improved and handling is facilitated, and light is scattered by minute projections, and the whiteness of the sheet is improved, so that it is easy to inspect adhered foreign matters and the like.
  • Such a minute depression can be easily formed by carrying out a known blasting process after engraving the embossing roller surface.
  • the depth of the minute recess can be adjusted by the particle size at the time of blasting and the pressure condition.
  • the embossing counter roller 19 facing the embossing roller is preferably a rubber roller wrapped around a metal roller in order to improve transferability of the embossing roller surface to the engraving process sheet.
  • the type of rubber is not particularly limited, such as silicone rubber, nitrile rubber, and chloroprene rubber, but rubber having a type A hardness in the range of 65 to 85 ° in accordance with JIS K 6253-2006 is preferable. Even if the angle is less than 65 ° or exceeds 85 °, the transfer property of the embossed shape may be deteriorated.
  • silicon rubber is most preferable because of its good releasability from a process sheet that is easily adhered at high temperatures.
  • the temperature of the surface heated in the annealing process of the process sheet supplied to the embossing roller is set to (melting point of the resin composition constituting this surface ⁇ 10 ° C.) to (of the resin composition constituting this surface). (Melting point + 20 ° C.). If it is less than (the melting point of the resin composition ⁇ 10 ° C.), the transferability of the embossed shape is lowered. If it exceeds (the melting point of the resin composition + 20 ° C.), the temperature of the process sheet in the annealing process becomes too high, and wrinkles and the like are likely to occur in the annealing process. For example, when the surface layer is made of EVA resin having a melting point of 71 ° C., the surface temperature during embossing is in the range of 61 to 91 ° C.
  • the pressing pressure of the embossing roller 20 is preferably set so that the linear pressure applied to the process sheet is in the range of 150 to 500 N / cm. More preferably, it is in the range of 200 to 450 N / cm. If the linear pressure is less than 150 N / cm, the embossed shape transferability may be lowered. If an attempt is made to apply a linear pressure exceeding 500 N / cm, it is necessary to increase the size of the equipment, and in this case, the life of the opposing rubber roller is reduced.
  • a linear pressure of about 100 N / cm is sufficient even if the pressing pressure of the embossing roller 13b 'is high. This is because the temperature of the resin extruded from the T die is, for example, in the range of 100 to 120 ° C. when EVA resin having a melting point of 71 ° C. is used. It is estimated that a pressure of about 100 N / cm is sufficient.
  • embossing is performed within the temperature range of (melting point of resin composition ⁇ 10 ° C.) to (melting point of resin composition + 20 ° C.).
  • the linear pressure is preferably 150 N / cm or more.
  • the linear pressure said by this invention is the value which remove
  • the process sheet is held by the embossing roller 20 in order to improve the transferability of the embossed shape.
  • the hugging angle to the embossing roller is preferably in the range of 30 to 270 °. If only shallow embossing is to be applied, the hugging angle may be less than 30 °. However, in order to give a deep and well-defined embossing, it is preferable to set the hugging angle to 30 ° or more.
  • the hugging angle can be simply calculated from the ratio between the arc length of the portion where the process sheet 32 is in contact with the embossing roller 20 and the circumference of the embossing roller. For example, when the hugging angle is 90 °, it means that the process sheet is in contact with a portion corresponding to 1 ⁇ 4 of the circumference of the embossing roller.
  • the process sheet After releasing the process sheet from the embossing roller, the process sheet is cooled by the cooling roller 21, and the surface temperature of the process sheet is quickly lowered to near room temperature.
  • the process sheet 32 is adjusted to a desired width by a defect inspection and then rolled into a roll shape by a winder or the like. Or cut into a cut sheet having a desired length and used for manufacturing a solar cell module.
  • the encapsulant sheet preferably has an independent protrusion having a height of 60 to 300 ⁇ m on the surface.
  • the air remaining between the encapsulant sheet and the solar cells is multi-directional during vacuum lamination when manufacturing a solar cell module. It is possible to efficiently remove the bubbles and suppress the generation of bubbles. Furthermore, it is possible to disperse the pressing force of the encapsulant sheet to the solar battery cells and suppress the occurrence of cell cracking.
  • the shape of the surface of the sealing material sheet is not an independent protrusion but a continuous groove shape, deaeration in a direction perpendicular to the groove becomes insufficient, and the remaining air becomes bubbles. Further, when the height of the protrusion is 300 ⁇ m or less, the concentration of the load on the top of the protrusion during vacuum lamination is suppressed, and the solar battery cell can be prevented from cracking.
  • the “independent protrusion” refers to a protrusion having a bottom length D to be described later in the range of 70 to 6000 ⁇ m when attention is paid to the bottom surface of the protrusion.
  • the independent protrusions are sandwiched between flat plates, applied with a pressure of 50 kPa in the thickness direction and compressed to deform the protrusions, and when the area where the tops of the protrusions contact the flat plate expands, It is preferable that a gap of 20 to 800 ⁇ m is secured between the two regions derived from the protrusions.
  • the independent protrusion preferably has a ratio (T / D) of the protrusion height (T) to the base length (D) of 0.05 to 0.80. More preferably, it is 0.15 to 0.80. If the T / D ratio is less than 0.05, the cushioning property of the encapsulant sheet may be insufficient. When the T / D ratio exceeds 0.80, a concentrated load on the top of the protrusion occurs, and cell cracking may occur.
  • the height T of the protrusion is measured as follows. First, the case where there is a protrusion on one side will be described. The surface of the encapsulant sheet having the protrusions is referred to as A surface, and the surface having no protrusion is referred to as B surface. As shown in FIG.
  • the distance from the apex of the protrusion on the A surface to the B surface is Tmax, and the distance from the portion having no protrusion on the A surface to the B surface is Tmin.
  • Tmax the distance from the portion having no protrusion on the A surface to the B surface
  • Tmin the distance from the portion having no protrusion on the A surface to the B surface.
  • Tmax the distance from the portion having no protrusion on the A surface to the B surface.
  • Tmin The difference between Tmax and Tmin is the height T of the protrusion.
  • the distance from the apex of the protrusion on the A surface to the portion without the protrusion on the B surface is TAmax
  • the distance from the apex of the protrusion on the B surface to the portion without the protrusion on the A surface is TBmax
  • the distance from the portion having no protrusion to the portion having no protrusion on the B surface is defined as Tmin.
  • the difference between TAmax and Tmin is the height TA of the projection on the A surface
  • the difference between TBmax and Tmin is the height TB of the projection on the B surface.
  • the length of the bottom of the protrusion is the outer diameter D of the protrusion shown in FIG.
  • Desirable protrusion height T is 60 to 300 ⁇ m as described above.
  • the length of the base D of the protrusion is preferably 75 to 1200 ⁇ m, more preferably 75 to 400 ⁇ m.
  • the length of the base D of the protrusion is preferably 375 to 6000 ⁇ m, more preferably 375 to 2000 ⁇ m.
  • the number of independent protrusions is preferably 40 to 2300 per 1 cm 2 area on one side of the sheet. More preferably, it is 40 to 1100. If the number of independent protrusions is less than 40 / cm 2 , cell cracks or bubbles may occur. If it exceeds 2300 pieces / cm 2 , the T / D ratio increases, and cell cracking may occur due to the concentrated load on the top of the protrusion.
  • the “sheet flow direction” is a direction in which the process sheet flows in the manufacturing process of the sealing material sheet.
  • vacuuming is performed without applying pressure to the sealing material sheet until the sealing material sheet is sufficiently melted, and the sealing material sheet is melted and removed. Do care.
  • the encapsulant sheet contracts, and as a result, cell cracks and displacement occur.
  • the heat shrinkage rate in the sheet flow direction is 30. It was found that the cell cracking can be further suppressed if it is at most%.
  • the state where the inside of the vacuum laminator is reproduced is a state where the process sheet is left in 80 ° warm water.
  • the heat shrinkage rate in the direction orthogonal to the flow direction of the sheet is not particularly limited because it is minute compared to the flow direction, but is preferably 5% or less.
  • the shape of the independent protrusion is preferably a hemispherical shape, a pyramid shape such as a triangular pyramid, a quadrangular pyramid, a hexagonal pyramid, or a cone, or a trapezoidal shape in which the tops thereof are flattened.
  • a hemispherical shape and / or a quadrangular pyramid shape are preferable.
  • “hemispherical and quadrangular pyramid” means a surface shape in which hemispherical protrusions and quadrangular pyramidal protrusions are mixed.
  • a hemispherical shape is preferable in that a concentrated load on the solar battery cell is difficult to be applied and the load can be uniformly dispersed when the pressure is applied to the solar battery cell. Further, a quadrangular pyramid shape is also preferable in that unevenness of reflected light hardly occurs and the surface quality is excellent. And since both hemispherical and quadrangular pyramid features can be obtained, a shape in which a hemispherical shape and a quadrangular pyramid shape are mixed is also preferable. When the hemispherical shape and the quadrangular pyramid shape are mixed, the ratio of each may be arbitrarily determined according to which feature is to be obtained. Particularly preferably, all are hemispherical patterns.
  • the sealing material sheet of the present invention preferably further has a protrusion having a height of 1 to 15 ⁇ m on the surface having an independent protrusion.
  • Such fine protrusions can be achieved by the manufacturing method of the present invention in which embossing is performed after the annealing step.
  • embossing is performed after the annealing step.
  • large protrusions with a height of several tens of ⁇ m may remain on the sheet even after the heat treatment, but they are very small with a height of several ⁇ m. The protrusion disappears with the heat treatment.
  • the height of the minute protrusion is a numerical value measured as follows.
  • the surface of the sheet is photographed at a magnification of 400 using a well-known laser microscope such as a laser microscope VK-X100 manufactured by Keyence Corporation in accordance with JIS B0601 (2001).
  • a well-known laser microscope such as a laser microscope VK-X100 manufactured by Keyence Corporation in accordance with JIS B0601 (2001).
  • the Rz value when the cutoff value is 0.080 mm is defined as the height of the minute protrusion.
  • the repulsive stress of the sheet when the surface having the projection of the encapsulant sheet is compressed 100 ⁇ m in the thickness direction is used. adopt.
  • the repulsive stress at which cell cracking is suppressed is preferably 70 kPa or less.
  • the above repulsive stress is a sealing material sheet using a compression test apparatus having a resolution of 5 ⁇ m or less as a compression displacement and 100 Pa or less as a compression load, and a flat pressure terminal at a pressure rate of 0.02 mm / s. It is obtained by measuring the repulsive stress (kPa) of the sheet when the surface having the protrusions is pressed 100 ⁇ m in the thickness direction.
  • the repulsive stress of the encapsulant sheet is 70 kPa or less, the solar cell can be prevented from cracking by laminating the surface having the protrusion so as to be in contact with the solar cell and performing vacuum lamination.
  • the shape of the surface opposite to the surface having the projection of the encapsulant sheet is not particularly limited, but it is about 2 to 10 ⁇ m in height from the viewpoint of preventing adhesion of the encapsulant sheet when manufacturing the solar cell module. It is preferable to have minute protrusions.
  • the thickness of the sealing material sheet is preferably 50 to 1500 ⁇ m. More preferably, it is 100 to 1000 ⁇ m, particularly preferably 200 to 800 ⁇ m. If it is less than 50 ⁇ m, the cushioning property of the solar cell encapsulant sheet may be poor, or a problem may occur from the viewpoint of workability. On the other hand, if the thickness exceeds 1500 ⁇ m, a decrease in productivity and a decrease in adhesion may be a problem.
  • the thickness of a sealing material sheet is the distance from the vertex of a permite
  • the encapsulant sheet is used in the production method of the present invention. It is preferable to manufacture.
  • the resin composition which comprises a sealing material sheet contains polyolefin resin.
  • Polyolefin resins include homopolypropylene, copolymers with other monomers based on propylene, polypropylene resins such as ethylene-propylene-butene terpolymers, low density polyethylene, ultra low density polyethylene, straight Examples thereof include chain-type low-density polyethylene, medium-density polyethylene, high-density polyethylene, polyethylene resins such as copolymers with other monomers mainly composed of ethylene, and polyolefin-based thermoplastic elastomers.
  • Examples of the copolymer with other monomers mainly composed of ethylene include an ethylene- ⁇ -olefin copolymer and an ethylene-unsaturated monomer copolymer.
  • ⁇ -olefin ethylene, propylene, 1-butene, isobutylene, 1-pentene, 2-methyl-1-butene, 3-methyl-1-butene, 1-hexene, 1-heptane, 1 -Octene, 1-nonene, 1-decene and the like.
  • Examples of the unsaturated monomer include vinyl acetate, acrylic acid, methacrylic acid, methyl acrylate, methyl methacrylate, ethyl acrylate, and vinyl alcohol.
  • these polyolefin resins are copolymerized or modified in a small amount using a silane compound, a carboxylic acid, a glycidyl compound, or the like, if necessary.
  • ethylene vinyl acetate copolymer ethylene methyl methacrylate copolymer
  • low density polyethylene ethylene vinyl acetate copolymer
  • the content of the copolymer component is preferably in the range of 15 to 40% by mass.
  • the resin composition constituting the sealing material sheet contains an organic peroxide. Any organic peroxide can be used as long as it decomposes at a temperature of 100 ° C. or higher to generate radicals.
  • the temperature at which the solar cell encapsulant sheet is produced, the solar cell What is necessary is just to select in consideration of the heating and laminating temperature at the time of producing a module, the storage stability of the crosslinking agent itself, and the like. In particular, those having a decomposition temperature of 70 hours or more with a half-life of 10 hours are preferred.
  • organic peroxides examples include 1,1-di (t-hexylperoxy) cyclohexane, n-butyl 4,4-di- (t-butylperoxy) valerate, 2,5-dimethyl- 2,5-di (t-butylperoxy) hexane, di-t-butyl peroxide, di-t-hexyl peroxide, 2,5-dimethyl-2,5-di (t-butylperoxy) hexyne-3 Disuccinic acid peroxide, di (4-t-butylcyclohexyl) peroxydicarbonate, 1,1,3,3-tetramethylbutylperoxy-2-ethylhexanoate, t-hexylperoxy-2-ethylhexa Noate, t-butylperoxy-2-ethylhexanoate, t-hexylperoxyisopropyl monocarbonate, di (4-t-
  • organic peroxides may be used in combination of two or more.
  • the content of these organic peroxides is preferably 0.1 to 5 parts by mass with respect to 100 parts by mass of the polyolefin resin.
  • the amount is more preferably 0.1 to 3 parts by mass, particularly preferably 0.2 to 2 parts by mass. If the content of the organic peroxide is less than 0.1 part by mass, the polyolefin resin may not be crosslinked. Even if the content exceeds 5 parts by mass, the content effect is low, and undecomposed organic peroxide may remain in the encapsulant sheet, which may cause deterioration over time.
  • the resin composition constituting the encapsulant sheet may further contain a crosslinking aid, a silane coupling agent, a light stabilizer, an ultraviolet absorber, an antioxidant, and the like.
  • the crosslinking aid is a polyfunctional monomer having a plurality of unsaturated bonds in the molecule and reacts with the active radical compound generated by the decomposition of the organic peroxide to uniformly and efficiently crosslink the polyolefin resin. Used for.
  • crosslinking aids examples include triallyl isocyanurate, triallyl cyanurate, trimethylolpropane tri (meth) acrylate, pentaerythritol tri (meth) acrylate, tris [(meth) acryloyloxyethyl] isocyanurate, Dimethylolpropane tetra (meth) acrylate, pentaerythritol tetra (meth) acrylate, pentaerythritol ethoxytetra (meth) acrylate, dipentaerystol penta (meth) acrylate, dipentaerystol hexa (meth) acrylate, divinylbenzene, etc. Can be mentioned.
  • These crosslinking aids may be used alone or in combination of two or more.
  • “(meth) acrylate” means “acrylate or methacrylate”.
  • crosslinking aids triallyl isocyanurate and trimethylolpropane tri (meth) acrylate are particularly preferable.
  • the content in the case of adding these crosslinking aids is preferably 0 to 5 parts by mass with respect to 100 parts by mass of the polyolefin resin.
  • the amount is more preferably 0.1 to 3 parts by mass, particularly preferably 0.3 to 3 parts by mass. Even if the content exceeds 5 parts by mass, the effect is only slightly improved, which causes a cost increase.
  • alkoxysilane compounds having a functional group include methacryloxy group-containing alkoxysilane compounds such as ⁇ -methacryloxypropylmethyldimethoxysilane, ⁇ -methacryloxypropyltrimethoxysilane, ⁇ -methacryloxypropylmethyldiethoxysilane, and ⁇ -methacryloxypropyltrimethoxysilane.
  • Acryloxy group-containing alkoxysilane compounds such as ⁇ -acryloxypropyltrimethoxysilane, ⁇ -glycidoxypropyltrimethoxysilane, ⁇ -glycidoxypropyltriethoxysilane, ⁇ - (3,4-epoxycyclohexyl) ethyl
  • Epoxy group-containing alkoxysilane compounds such as trimethoxysilane, mercapto group-containing alkoxysilane compounds such as ⁇ -mercaptopropyltrimethoxysilane and ⁇ -mercaptopropyltriethoxysilane
  • Ureido group-containing alkoxysilane compounds such as ⁇ -ureidopropyltriethoxysilane, ⁇ -ureidopropyltrimethoxysilane, ⁇ -isocyanatopropyltriethoxysilane, ⁇ -isocyanatopropyltrimethoxysilane
  • benzophenone ultraviolet absorber examples include 2,2′-dihydroxy-4,4′-di (hydroxymethyl) benzophenone, 2,2′-dihydroxy-4,4′-di (2-hydroxyethyl) benzophenone, 2,2'-dihydroxy-3,3'-dimethoxy-5,5'-di (hydroxymethyl) benzophenone, 2,2'-dihydroxy-3,3'-dimethoxy-5,5'-di (2-hydroxy Ethyl) benzophenone, 2,2′-dihydroxy-3,3′-di (hydroxymethyl) -5,5′-dimethoxybenzophenone, 2,2′-dihydroxy-3,3′-di (2-hydroxyethyl)- Examples include 5,5′-dimethoxybenzophenone and 2,2-dihydroxy-4,4-dimethoxybenzophenone.
  • benzotriazole ultraviolet absorber examples include 2- [2′-hydroxy-5 ′-(hydroxymethyl) phenyl] -2H-benzotriazole, 2- [2′-hydroxy-5 ′-(2-hydroxyethyl). ) Phenyl] -2H-benzotriazole, 2- [2'-hydroxy-5 '-(3-hydroxypropyl) phenyl] -2H-benzotriazole, 2- [2'-hydroxy-3'-methyl-5'- (Hydroxymethyl) phenyl] -2H-benzotriazole, 2- [2′-hydroxy-3′-methyl-5 ′-(2-hydroxyethyl) phenyl] -2H-benzotriazole, 2- [2′-hydroxy- 3′-methyl-5 ′-(3-hydroxypropyl) phenyl] -2H-benzotriazole, 2- [2′-hydroxy- '-T-butyl-5'-(hydroxymethyl) phenyl] -2H-benzotriazole
  • triazine ultraviolet absorbers examples include 2- (2-hydroxy-4-hydroxymethylphenyl) -4,6-diphenyl-s-triazine, 2- (2-hydroxy-4-hydroxymethylphenyl) -4, 6-bis (2,4-dimethylphenyl) -s-triazine, 2- [2-hydroxy-4- (2-hydroxyethyl) phenyl] -4,6-diphenyl-s-triazine, 2- [2-hydroxy -4- (2-hydroxyethyl) phenyl] -4,6-bis (2,4-dimethylphenyl) -s-triazine, 2- [2-hydroxy-4- (2-hydroxyethoxy) phenyl] -4, 6-diphenyl-s-triazine, 2- [2-hydroxy-4- (2-hydroxyethoxy) phenyl] -4,6-bis (2,4-dimethylphenyl) -S-triazine, 2- [2-hydroxy-4- (3-hydroxypropoxy) phenyl] -4
  • salicylic acid ultraviolet absorber examples include phenyl salicylate, p-tert-butylphenyl salicylate, p-octylphenyl salicylate and the like.
  • cyanoacrylate ultraviolet absorber examples include 2-ethylhexyl-2-cyano-3,3′-diphenyl acrylate, ethyl-2-cyano-3,3′-diphenyl acrylate, and the like.
  • benzophenone-based ultraviolet absorbers are most preferable from the viewpoints of the ultraviolet absorption effect and coloring of the ultraviolet absorber itself.
  • 0.05 to 3 parts by mass is preferable with respect to 100 parts by mass of the polyolefin resin. More preferably, it is 0.05 to 2.0 parts by mass.
  • the content is less than 0.05 parts by mass, the content effect is low, and when it exceeds 3 parts by mass, a coloring tendency occurs.
  • the resin composition which comprises a sealing material sheet contains a light stabilizer further.
  • the light stabilizer captures radical species that are harmful to the polymer and prevents the generation of new radicals.
  • a hindered amine light stabilizer is preferably used as the light stabilizer.
  • Hindered amine light stabilizers include bis (2,2,6,6-tetramethyl-1 (octyloxy) -4-piperidinyl) ester, 1,1-dimethylethyl hydroperoxide and octane produced by reaction with decanedioic acid 70% by mass of a product and 30% by mass of polypropylene, bis (1,2,2,6,6-pentamethyl-4-piperidyl) [[3,5-bis (1,1-dimethylethyl) -4-hydroxy Phenyl] methyl] butyl malonate, bis (1,2,2,6,6-pentamethyl-4-piperidyl) sebacate and methyl-1,2,2,6,6-pentamethyl-4-piperidyl sebacate mixture, bis (2,2,6,6-tetramethyl-4-piperidyl) sebacate, tetrakis (2,2,6,6-tetramethyl-4-piperidyl ) -1,2,3,4-butanetetracar
  • hindered amine light stabilizers include bis (1,2,2,6,6-pentamethyl-4-piperidyl) sebacate and methyl-1,2,2,6,6-pentamethyl-4-piperidyl seba. It is preferred to use a mixture of ketates, as well as methyl-4-piperidyl sebacate, bis (2,2,6,6-tetramethyl-4-piperidyl) sebacate. Moreover, it is preferable to use a hindered amine light stabilizer having a melting point of 60 ° C. or higher.
  • the content is preferably 0.05 to 3.0 parts by mass with respect to 100 parts by mass of the polyolefin resin. More preferably, it is 0.05 to 1.0 part by mass. If the content is less than 0.05 parts by mass, the stabilizing effect is insufficient, and even if the content exceeds 3.0 parts by mass, coloring and cost increase are caused.
  • an antioxidant a flame retardant, a flame retardant aid, a plasticizer, a lubricant, a colorant, and the like may be included as necessary within the range not impairing the effects of the present invention.
  • the solar cell module is composed of a light-receiving surface protective material, a back surface protective material, and a layer in which the solar cells are sealed with a sealing material sheet disposed between the light-receiving surface protective agent and the back surface protective material.
  • a sealing material sheet used here, you may use the sealing material sheet obtained by the manufacturing method of this invention, and use the sealing material sheet which has the permite
  • the encapsulant sheet obtained by the production method of the present invention has small heat shrinkage when the above-structured materials are laminated and integrated. Therefore, the residual stress at the time of molding between the solar battery cell and the encapsulant sheet, between the light-receiving surface protective material and the encapsulant sheet, and between the back surface protector and the encapsulant sheet is small, and long-term durability Becomes an excellent solar cell module.
  • the sealing material sheet having independent protrusions on the surface described above can disperse the pressing force to the solar battery cells when the materials having the above-mentioned configuration are laminated and integrated, the solar battery cells and the sealing material Residual stress between the sheet and the sheet can be reduced. In addition, no bubbles remain in the sealing material. Therefore, the solar cell module is excellent in durability over a long period of time.
  • Thickness of sheet The 20-point thickness of the molded encapsulant sheet was measured in the width direction to obtain an average thickness.
  • a thickness gauge (type 547-301) manufactured by Mitutoyo Corporation was used.
  • the thickness of the sealing material sheet was measured by measuring the distance from the top of the protrusion to the surface opposite to the surface having the protrusion when the protrusion was formed only on one side of the sealing material sheet. When protrusions were formed on both surfaces of the encapsulant sheet, the distance from the top of the protrusion on one surface to the top of the protrusion on the opposite surface was measured.
  • T ( ⁇ m) Tmax ⁇ Tmin (i)
  • Tmin the distance from the apex of the protrusion on the A surface to the portion without the protrusion on the B surface.
  • TA ( ⁇ m) TAmax ⁇ Tmin (ii)
  • TB ( ⁇ m) TBmax ⁇ Tmin (iii).
  • Pattern depth of embossing roller The surface of the embossing roller was measured under the measurement conditions of a standard length of 20 mm, a load of 0.75 mN, and a measurement speed of 0.3 mm / s in accordance with JIS B0601 (2001). The measurement was performed by using a small surface roughness measuring device SJ401 manufactured by Mitutoyo Corporation and a diamond stylus having a cone of 60 ° and a tip curvature radius of 2 ⁇ m. This measured value was taken as the pattern depth Pz value ( ⁇ m) of the embossing roller.
  • Heat shrinkage rate A flat square test piece having a side of 120 mm was cut out from the encapsulant sheet. On this test piece, two parallel straight lines (5 cm) in the TD direction were drawn at a distance of 100 mm at the center in the TD direction during production. And the mark was attached
  • Bottom length of protrusion (D) The surface having the protrusions on the sheet is observed with a stereomicroscope, and the base length (D) is measured.
  • the shape of the bottom surface of the protrusion is a polygon such as a triangle or a hexagon, or an ellipse, the diameter of the smallest perfect circle including the shape was measured.
  • the sealing material sheet was laminated so that the surface having the protrusions was in contact with the solar battery cell.
  • This laminate was vacuum laminated under the conditions of a temperature of 145 ° C., evacuation for 30 seconds, pressing for 1 minute, and pressure holding for 10 minutes to produce a solar cell module.
  • the obtained solar cell module was photographed with a solar cell EL image inspection device, and a light emission image was taken, and the total crack length (mm) of the cell crack portion was measured. This test was repeated three times to obtain the average value of the total crack length.
  • Example 1 A solar cell encapsulant sheet was prepared according to the production method shown in FIG. 1.
  • the resin composition consisting of 1 part by mass was supplied to the extruder 11 set at 80 ° C.
  • the kneaded resin composition was extruded from a T-die 12 connected to an extruder 11 and maintained at 105 ° C.
  • the T die used had a lip width of 1300 mm and a lip gap of 0.8 mm.
  • the resin composition thus extruded was cooled and solidified by polishing rollers 13a, 13b, and 13c maintained at 20 ° C. to form a sheet.
  • seat at the time of discharging from T die was 107 degreeC. At this time, the width of the process sheet was 1150 mm, the thickness was 450 ⁇ m, and the conveyance speed was 10 m / min.
  • the heat shrinkage rate and emboss transfer rate of the obtained solar cell encapsulant sheet were evaluated. The results are shown in Table 1. As shown in Table 1, a solar cell encapsulant sheet having a very small heat shrinkage and an embossed pattern clearly transferred was obtained.
  • Example 3 A sealing material sheet was prepared in the same manner as in Example 1 except that the hot air temperature in step (b) was 80 ° C., the heater temperature was 300 ° C., the residence time in the furnace was 30 seconds, and the linear pressure was 450 N / cm. did. Since the surface temperature of the process sheet was further lowered, the heat shrinkage rate was slightly increased and the emboss transfer rate was slightly lowered, but the heat shrinkage rate was very small as in Example 1 and the embossed pattern was clearly transferred. A solar cell encapsulant sheet was obtained.
  • Example 4 A sealing material sheet was prepared in the same manner as in Example 3 except that the linear pressure in the step (c) was 200 N / cm. Although the emboss transfer rate was slightly low, a solar cell encapsulant sheet in which the emboss pattern was clearly transferred as in Example 3 was obtained.
  • Example 5 A sheet was prepared in the same manner as in Example 1 except that the hot air temperature in the step (b) was 110 ° C., the residence time in the furnace was 27 seconds, and the linear pressure in the step (c) was 200 N / cm. Since the surface temperature of the process sheet increased, the solar cell encapsulant sheet with a very small heating shrinkage and a clear emboss transfer rate was obtained.
  • Example 6 A sealing material sheet was prepared in the same manner as in Example 5 except that the hugging angle to the embossing roller in the step (c) was 45 °. The embossing transfer rate was slightly shallow due to the shallow hugging angle, but the sheet had a good appearance.
  • the solar cell encapsulant sheets prepared in Examples 1 to 7 had a low heat shrinkage rate and a high emboss transfer rate, and the emboss shape was clearly transferred.
  • a solar cell module was created by a conventionally known method. At the time of module creation, problems such as cell displacement, cell cracking, and air bubbles were introduced. I did not.
  • Comparative Example 1 since the temperature during annealing and the sheet temperature at the entrance of the embossing roller 20 were both low, the heat shrinkage rate was large and the embossing transfer rate was low. In Comparative Example 3, since the space between the annealing furnace outlet and the embossing roller inlet was widened, the sheet temperature was lowered and the embossing transfer rate was lowered. In Comparative Example 4, since the sheet surface temperature in the annealing furnace was low, the heat shrinkage rate could not be sufficiently reduced. In Comparative Example 2, the process sheet was wound around the embossing roller, and a sample could not be obtained.
  • Comparative Example 5 since the annealing treatment time was short, the heat shrinkage of the solar cell encapsulant sheet could not be sufficiently reduced.
  • Comparative Examples 6 and 7 the embossed shape was given by the polishing roller, so the embossed shape was clear. However, when trying to reduce the heat shrinkage, the embossed shape collapsed, and when trying to maintain the embossed shape, the heat shrinkage was reduced. could not.
  • the kneaded resin composition was extruded from a T die connected to a twin screw extruder and held at 105 ° C.
  • the lip width of the T die was 1300 mm, and the lip gap was 0.8 mm.
  • the EVA sheet was cooled and solidified by a polishing roll maintained at 20 ° C.
  • the sheet temperature when the EVA sheet was discharged from the T die was 107 ° C.
  • the sheet width was 1150 mm
  • the sheet thickness was 450 ⁇ m
  • the sheet conveyance speed was 10 m / min.
  • annealing treatment and embossing were continuously performed.
  • the embossing process is performed by embossing the sheet taken out of the annealing furnace with an embossing roller having a pattern depth of 180 ⁇ m, a diameter of 460 ⁇ m and 450 hemispherical concave engraving patterns / cm 2, and a hardness of 75 °. This was carried out by passing it between opposed rollers wound with a thickness of 10 mm.
  • Sheet surface temperature at the annealing furnace entrance 23 ° C
  • Hot air temperature 93 ° C
  • Maximum temperature of sheet surface in annealing furnace 90 ° C
  • Sheet surface temperature at annealing furnace outlet 90 ° C
  • Sheet residence time in the annealing furnace 28 seconds
  • Sheet speed at the outlet of the annealing furnace 15: 9.6 m / min
  • Sheet surface temperature at the embossing roller entrance 78 ° C
  • Embossed roller linear pressure 350 N / cm Hang angle to emboss roller: 120 °.
  • the heat shrinkage rate, rebound stress, cell cracking property during module production, and the number of bubbles of the obtained encapsulant sheet were evaluated.
  • the results are shown in Table 3.
  • the sheet was a sealing material sheet having a small sheet heat shrinkage ratio and having few cell cracks and bubbles during module production.
  • Example 9 The embossing roller in step (c) was sealed in the same manner as in Example 8 except that the embossing roller was changed to an embossing roller having a pattern depth of 120 ⁇ m, a diameter of 460 ⁇ m, and 450 hemispherical concave engraving patterns / cm 2. A material sheet was created. As shown in Table 3, the obtained encapsulant sheet was a encapsulant sheet having a small sheet heat shrinkage ratio and few cell cracks and bubbles during module production.
  • Example 10 The embossing roller in the step (c) was sealed in the same manner as in Example 8 except that the embossing roller was changed to an embossing roller having a pattern depth of 300 ⁇ m, a diameter of 460 ⁇ m, and 450 hemispherical concave engraving patterns / cm 2.
  • a material sheet was created.
  • the obtained encapsulant sheet was a encapsulant sheet having a small sheet heat shrinkage ratio and few cell cracks and bubbles during module production.
  • Example 11 The embossing roller in the step (c) was sealed in the same manner as in Example 8 except that the embossing roller was changed to an embossing roller having a pattern depth of 300 ⁇ m and a diameter of 330 ⁇ m and a hemispherical concave engraving pattern of 980 pieces / cm 2.
  • a material sheet was created.
  • the obtained encapsulant sheet was a encapsulant sheet having a small sheet heat shrinkage ratio and few cell cracks and bubbles during module production.
  • Example 12 In the same manner as in Example 8, except that the embossing roller in the step (c) was changed to an embossing roller having a pattern depth of 180 ⁇ m, an outer diameter of 460 ⁇ m and a rectangular pyramid-shaped concave engraving pattern of 840 pieces / cm 2.
  • a sealing material sheet was prepared. As shown in Table 3, the obtained encapsulant sheet was a encapsulant sheet having a small sheet heat shrinkage rate and few bubbles, although some cell cracking during module production occurred.
  • Example 13 A sealing material sheet was prepared in the same manner as in Example 8 except that the annealing was not performed and the sheet surface temperature was heated to 90 ° C. with an infrared heater and embossing was performed. As shown in Table 3, the obtained encapsulant sheet was a encapsulant sheet with a small number of bubbles, although the sheet had a large heat shrinkage rate and cell cracking occurred slightly during module production.
  • Example 14 A sealing material sheet was prepared in the same manner as in Example 8 except that the EVA resin was changed to an EVA resin having a melt flow rate of 10 g / 10 min. As shown in Table 3, the obtained encapsulant sheet was a encapsulant sheet having a small sheet heat shrinkage rate and few bubbles, although some cell cracking during module production occurred.
  • Example 15 In the same manner as in Example 8, except that the embossing roller in the step (c) was changed to an embossing roller having a pattern depth of 180 ⁇ m, an outer peripheral diameter of 2000 ⁇ m, and 45 pyramidal concave engraving patterns / cm 2.
  • a sealing material sheet was prepared. As shown in Table 3, the obtained encapsulant sheet was a encapsulant sheet with a small number of bubbles, although the sheet heat shrinkage rate was small and cell cracking during module production was slightly generated.
  • the sealing material sheet which implemented by annealing method by the method similar to Example 8 was created, and it used for evaluation.
  • the obtained encapsulant sheet was a encapsulant sheet in which the heat shrinkage rate of the sheet was small, but a large number of cell cracks and bubbles were generated during module production.
  • Example 8 except that the embossing roller in the step (c) was changed to an embossing roller having a pattern depth of 180 ⁇ m and an engraving pattern of a semicircular groove (groove width 460 ⁇ m) continuous in the rotation direction of the roll.
  • a sealing material sheet was prepared in the same manner.
  • the obtained encapsulant sheet was a encapsulant sheet having a small sheet heat shrinkage rate and few cell cracks during module production, but having many bubbles.
  • the embossing roller in the step (c) was sealed in the same manner as in Example 8 except that the embossing roller was changed to an embossing roller having a pattern depth of 180 ⁇ m and a diameter of 150 ⁇ m and a hemispherical concave engraving pattern of 4500 pieces / cm 2.
  • a material sheet was created.
  • the obtained encapsulant sheet was a encapsulant sheet having a small sheet heat shrinkage rate and a small number of bubbles, but many cell cracks during module production.
  • step (c) The embossing roller in step (c) was sealed in the same manner as in Example 8 except that the embossing roller was changed to an embossing roller having a pattern depth of 180 ⁇ m, a diameter of 3800 ⁇ m, and 7 hemispherical concave engraving patterns / cm 2.
  • a material sheet was created. As shown in Table 4, the obtained encapsulant sheet had a small sheet heat shrinkage rate, but was a encapsulant sheet with many cell cracks and bubbles during module production.

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Abstract

La présente invention concerne un procédé pour la production d'une feuille d'étanchéité de cellule solaire, le procédé comprenant la réalisation des étapes suivantes (a), (b), et (c) dans cet ordre: une étape (a) dans laquelle une composition de résine qui a été fondue par chauffage est transformée en une feuille et ensuite refroidie pour obtenir une feuille en bande; une étape (b) dans laquelle au moins une surface de la feuille en bande obtenue dans l'étape (a) est chauffée pendant 22-55 secondes pour élever, durant ce chauffage, la température de cette surface à une température non inférieure au point de fusion de la composition de résine qui constitue cette surface; et une étape (c) dans laquelle la surface de la feuille en bande qui a été chauffée dans l'étape (b) est faite pour avoir une température dans une plage spécifique et un cylindre de gaufrage est subséquemment pressé contre cette surface pour former une image en relief dans la surface. Donc, une feuille d'étanchéité de cellule solaire qui souffre peu de retrait thermique et dans laquelle une image en relief distincte a été formée peut être produite avec efficacité à faible coût.
PCT/JP2012/057531 2011-03-31 2012-03-23 Procédé pour la production de feuille d'étanchéité de cellule solaire WO2012133196A1 (fr)

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CN113214556A (zh) * 2021-05-20 2021-08-06 深圳市金露兴科技有限公司 一种防护级密封薄膜配方及其生产工艺
US11167465B2 (en) 2017-09-26 2021-11-09 Davis-Standard, Llc Casting apparatus for manufacturing polymer film

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Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010222545A (ja) * 2009-03-25 2010-10-07 Asahi Kasei E-Materials Corp 樹脂封止シートの製造方法及び樹脂封止シート
JP2010232311A (ja) * 2009-03-26 2010-10-14 Sekisui Chem Co Ltd 太陽電池用封止シート
JP2011020375A (ja) * 2009-07-16 2011-02-03 C I Kasei Co Ltd 低収縮性樹脂フィルムの製造方法
JP2011077256A (ja) * 2009-09-30 2011-04-14 Sekisui Chem Co Ltd 太陽電池用接着シートの製造方法
JP2011116014A (ja) * 2009-12-02 2011-06-16 Asahi Kasei E-Materials Corp 太陽電池封止シートの製造方法
JP2011151284A (ja) * 2010-01-25 2011-08-04 C I Kasei Co Ltd 太陽電池モジュール用封止フィルムおよびその製造方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20090139564A1 (en) * 2005-09-30 2009-06-04 Toray Industries , Inc., A Corporation Sealing Film for Photovoltaic Cell Module and Photovoltaic Module
CN101826568B (zh) * 2009-03-03 2016-06-22 C.I.化成株式会社 低伸缩性树脂膜及其制造方法以及制造装置

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010222545A (ja) * 2009-03-25 2010-10-07 Asahi Kasei E-Materials Corp 樹脂封止シートの製造方法及び樹脂封止シート
JP2010232311A (ja) * 2009-03-26 2010-10-14 Sekisui Chem Co Ltd 太陽電池用封止シート
JP2011020375A (ja) * 2009-07-16 2011-02-03 C I Kasei Co Ltd 低収縮性樹脂フィルムの製造方法
JP2011077256A (ja) * 2009-09-30 2011-04-14 Sekisui Chem Co Ltd 太陽電池用接着シートの製造方法
JP2011116014A (ja) * 2009-12-02 2011-06-16 Asahi Kasei E-Materials Corp 太陽電池封止シートの製造方法
JP2011151284A (ja) * 2010-01-25 2011-08-04 C I Kasei Co Ltd 太陽電池モジュール用封止フィルムおよびその製造方法

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11167465B2 (en) 2017-09-26 2021-11-09 Davis-Standard, Llc Casting apparatus for manufacturing polymer film
US11173644B2 (en) 2017-09-26 2021-11-16 Davis-Standard, Llc Casting apparatus for manufacturing polymer film
CN111645312A (zh) * 2019-03-04 2020-09-11 世联株式会社 压花加工模具、压花加工装置以及压花加工方法
CN113214556A (zh) * 2021-05-20 2021-08-06 深圳市金露兴科技有限公司 一种防护级密封薄膜配方及其生产工艺

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