WO2012123226A3 - Bauteil, insbesondere als bestandteil eines schalt- oder steuergerätes - Google Patents

Bauteil, insbesondere als bestandteil eines schalt- oder steuergerätes Download PDF

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Publication number
WO2012123226A3
WO2012123226A3 PCT/EP2012/052964 EP2012052964W WO2012123226A3 WO 2012123226 A3 WO2012123226 A3 WO 2012123226A3 EP 2012052964 W EP2012052964 W EP 2012052964W WO 2012123226 A3 WO2012123226 A3 WO 2012123226A3
Authority
WO
WIPO (PCT)
Prior art keywords
switchgear
control device
component
constituent part
moulding compound
Prior art date
Application number
PCT/EP2012/052964
Other languages
English (en)
French (fr)
Other versions
WO2012123226A2 (de
Inventor
Michael VOGELGESANG
Original Assignee
Robert Bosch Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Robert Bosch Gmbh filed Critical Robert Bosch Gmbh
Publication of WO2012123226A2 publication Critical patent/WO2012123226A2/de
Publication of WO2012123226A3 publication Critical patent/WO2012123226A3/de

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/0025—Preventing defects on the moulded article, e.g. weld lines, shrinkage marks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/0046—Details relating to the filling pattern or flow paths or flow characteristics of moulding material in the mould cavity
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C2045/14852—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles incorporating articles with a data carrier, e.g. chips
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C2045/1486—Details, accessories and auxiliary operations
    • B29C2045/14934—Preventing penetration of injected material between insert and adjacent mould wall
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14336—Coating a portion of the article, e.g. the edge of the article
    • B29C45/14418—Sealing means between mould and article
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00—Other particular articles
    • B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
    • B29L2031/3406—Components, e.g. resistors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00—Other particular articles
    • B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
    • B29L2031/3425—Printed circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/563—Encapsulation of active face of flip-chip device, e.g. underfilling or underencapsulation of flip-chip, encapsulation preform on chip or mounting substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09036—Recesses or grooves in insulating substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09909—Special local insulating pattern, e.g. as dam around component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1305—Moulding and encapsulation
    • H05K2203/1316—Moulded encapsulation of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1305—Moulding and encapsulation
    • H05K2203/1327—Moulding over PCB locally or completely

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Casings For Electric Apparatus (AREA)
  • Switch Cases, Indication, And Locking (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

Die Erfindung betrifft ein Bauteil (10), insbesondere als Bestandteil eines Schaltoder Steuergerätes, mit einem Grundkörper (15), der von einer aus Kunststoff bestehenden Moldmasse (11) teilweise umspritzt ist, wobei der Grundkörper (15) wenigstens einen Bereich (12) aufweist, der frei von Moldmasse (11) ausgebildet ist. Erfindungsgemäß ist es vorgesehen, dass der Bereich (12) auf dem Grundkörper (15) wenigstens bereichsweise von einer Struktur (20) umgeben ist, die den Zutritt von Moldmasse (11) in Richtung des von Moldmasse (11) freien Bereichs (12) verhindert.
PCT/EP2012/052964 2011-03-11 2012-02-22 Bauteil, insbesondere als bestandteil eines schalt- oder steuergerätes WO2012123226A2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102011005442A DE102011005442A1 (de) 2011-03-11 2011-03-11 Bauteil, insbesondere als Bestandteil eines Schalt- oder Steuergerätes
DE102011005442.1 2011-03-11

Publications (2)

Publication Number Publication Date
WO2012123226A2 WO2012123226A2 (de) 2012-09-20
WO2012123226A3 true WO2012123226A3 (de) 2013-04-04

Family

ID=45755349

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2012/052964 WO2012123226A2 (de) 2011-03-11 2012-02-22 Bauteil, insbesondere als bestandteil eines schalt- oder steuergerätes

Country Status (3)

Country Link
DE (1) DE102011005442A1 (de)
TW (1) TW201306682A (de)
WO (1) WO2012123226A2 (de)

Citations (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01123426A (ja) * 1987-11-07 1989-05-16 Sanken Electric Co Ltd 樹脂封止型電子部品の製造方法
JPH01220466A (ja) * 1988-02-26 1989-09-04 Mitsui High Tec Inc リードフレーム及び該リードフレームを使った半導体装置の製造方法
JPH01285319A (ja) * 1988-05-12 1989-11-16 Sumitomo Electric Ind Ltd モールド金型
DE4241333A1 (en) * 1991-12-09 1993-06-17 Mitsubishi Electric Corp Semiconductor sensor for flow meter - contains semiconducting chip with sensor element contg. flow detector element with heating and temp. sensitive elements.
JPH09219470A (ja) * 1996-02-09 1997-08-19 Toshiba Corp 半導体装置
JPH1093228A (ja) * 1996-09-18 1998-04-10 Sumitomo Wiring Syst Ltd プリント回路基板およびその製造方法
JPH1154686A (ja) * 1997-08-04 1999-02-26 Mitsubishi Electric Corp リードフレームおよびこれを用いた半導体パッケージ
US5923959A (en) * 1997-07-23 1999-07-13 Micron Technology, Inc. Ball grid array (BGA) encapsulation mold
KR20010069063A (ko) * 2000-01-12 2001-07-23 윤종용 접착성 댐-바를 갖는 리드프레임
EP1672972A1 (de) * 2004-12-16 2006-06-21 Hitachi, Ltd. Elektronische Schaltungsanordnung und Verfahren zu deren Herstellung.
EP1677583A1 (de) * 2005-01-04 2006-07-05 Hitachi, Ltd. Elektronische Steuereinheit und deren Verfahren
EP1903845A2 (de) * 2006-09-20 2008-03-26 Delphi Technologies, Inc. Gehäuse für elektronische Geräte und Herstellungsverfahren für Gehäuse für elektronische Geräte
JP2010062429A (ja) * 2008-09-05 2010-03-18 Fujitsu Microelectronics Ltd 半導体装置及びその製造方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3951779B2 (ja) * 2002-04-10 2007-08-01 株式会社デンソー プリント回路板およびその製造方法
TWI221343B (en) * 2003-10-21 2004-09-21 Advanced Semiconductor Eng Wafer structure for preventing contamination of bond pads during SMT process and process for the same

Patent Citations (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01123426A (ja) * 1987-11-07 1989-05-16 Sanken Electric Co Ltd 樹脂封止型電子部品の製造方法
JPH01220466A (ja) * 1988-02-26 1989-09-04 Mitsui High Tec Inc リードフレーム及び該リードフレームを使った半導体装置の製造方法
JPH01285319A (ja) * 1988-05-12 1989-11-16 Sumitomo Electric Ind Ltd モールド金型
DE4241333A1 (en) * 1991-12-09 1993-06-17 Mitsubishi Electric Corp Semiconductor sensor for flow meter - contains semiconducting chip with sensor element contg. flow detector element with heating and temp. sensitive elements.
JPH09219470A (ja) * 1996-02-09 1997-08-19 Toshiba Corp 半導体装置
JPH1093228A (ja) * 1996-09-18 1998-04-10 Sumitomo Wiring Syst Ltd プリント回路基板およびその製造方法
US5923959A (en) * 1997-07-23 1999-07-13 Micron Technology, Inc. Ball grid array (BGA) encapsulation mold
JPH1154686A (ja) * 1997-08-04 1999-02-26 Mitsubishi Electric Corp リードフレームおよびこれを用いた半導体パッケージ
KR20010069063A (ko) * 2000-01-12 2001-07-23 윤종용 접착성 댐-바를 갖는 리드프레임
EP1672972A1 (de) * 2004-12-16 2006-06-21 Hitachi, Ltd. Elektronische Schaltungsanordnung und Verfahren zu deren Herstellung.
EP1677583A1 (de) * 2005-01-04 2006-07-05 Hitachi, Ltd. Elektronische Steuereinheit und deren Verfahren
EP1903845A2 (de) * 2006-09-20 2008-03-26 Delphi Technologies, Inc. Gehäuse für elektronische Geräte und Herstellungsverfahren für Gehäuse für elektronische Geräte
JP2010062429A (ja) * 2008-09-05 2010-03-18 Fujitsu Microelectronics Ltd 半導体装置及びその製造方法

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
DATABASE WPI Section EI Week 200204, Derwent World Patents Index; Class U11, AN 2002-032599, XP002690960, "LEAD FRAME WITH ADHESIVE DAM-BARS" *

Also Published As

Publication number Publication date
TW201306682A (zh) 2013-02-01
WO2012123226A2 (de) 2012-09-20
DE102011005442A1 (de) 2012-09-13

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