WO2012118074A1 - Flux - Google Patents

Flux Download PDF

Info

Publication number
WO2012118074A1
WO2012118074A1 PCT/JP2012/054928 JP2012054928W WO2012118074A1 WO 2012118074 A1 WO2012118074 A1 WO 2012118074A1 JP 2012054928 W JP2012054928 W JP 2012054928W WO 2012118074 A1 WO2012118074 A1 WO 2012118074A1
Authority
WO
WIPO (PCT)
Prior art keywords
acid
flux
organic
solder
imidazole derivative
Prior art date
Application number
PCT/JP2012/054928
Other languages
English (en)
Japanese (ja)
Inventor
智洋 山亀
健吾 大田
Original Assignee
千住金属工業株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 千住金属工業株式会社 filed Critical 千住金属工業株式会社
Publication of WO2012118074A1 publication Critical patent/WO2012118074A1/fr

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/362—Selection of compositions of fluxes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
    • B23K35/025—Pastes, creams, slurries
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3601—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with inorganic compounds as principal constituents

Definitions

  • the present invention relates to a flux mixed with solder powder, and particularly relates to a flux containing no halide.
  • solder paste used for assembling electronic equipment is a soldering material produced by mixing solder powder and flux. Soldering using solder paste is performed by applying the solder paste to the soldered parts such as printed circuit boards and terminals and mounting the parts on the soldered parts where the solder paste is applied. This is done by heating the substrate in a heating furnace called a reflow furnace to melt the solder.
  • soldering materials such as solder paste, tin-lead eutectic solder, which was excellent in good solderability and reliability after soldering, was used.
  • solder paste tin-lead eutectic solder
  • efforts to reduce the burden on the environment are also progressing rapidly.
  • lead-free solder that does not contain lead is the mainstream alloy.
  • the flux used for soldering has the effect of chemically removing the metal oxides present on the surface of the solder and the metal to be soldered at the temperature at which the solder melts, and enabling the movement of metal elements at the boundary between the two.
  • a flux an intermetallic compound is formed between the solder and the base material, and a strong bond can be obtained.
  • a halide is added as an activator in order to improve solderability (see, for example, Patent Document 1). Solderability was improved by the addition of halides. In addition, even in a solder paste using a lead-free solder alloy, a halide is added to the flux in order to improve solderability. By adding halides, the solderability of lead-free solder with poor solderability has been improved, and a flux having high quality and high reliability has been realized by controlling the blending amount.
  • solder alloys containing lead even when the halogen is completely removed from the flux, the wettability of the solder can be obtained and the desired solderability can be ensured by adding the organic oxide.
  • the solderability of the lead-free solder alloy that does not contain lead is impaired.
  • Test method Flux is dropped on a copper plate, and a 1.75mm ⁇ lead-free solder ball (composition Sn-3.0Ag-0.5Cu) is placed on it, and heated for 30 seconds on a hot plate set at 250 ° C to melt the solder. Let me. At this time, the solder spreading rate is evaluated as A when 70% or more, B as 60 to 70%, C as 50 to 60%, and D as 50% or less.
  • the spread ratio is a value obtained by measuring the solder height after soldering and subtracting the ratio of the solder height after soldering to the ball diameter before soldering from 1.
  • Patent Document 1 if a halide is added, wettability is improved, but a halogen-free flux cannot be realized. Moreover, since an isocyanate compound is reactive, the solder paste produced
  • An object of the present invention is to provide a flux capable of improving solderability without adding a halogen.
  • the present inventors have found a combination of an organic acid acting as an activator and an imidazole derivative or an organic amine, and that solderability in lead-free solder is improved without adding a halide as an activator. I found it.
  • the present invention is a flux in which an organic acid and an imidazole derivative or an organic amine are added in a combination acting as an activator instead of a halide and mixed with a solder powder not containing lead to produce a solder paste.
  • the organic acid is preferably glutaric acid, adipic acid, azelaic acid, glycolic acid, diglycolic acid, picolinic acid or 2-phenylsuccinic acid.
  • the imidazole derivative or organic amine is 2-methylimidazole, 2-ethyl It is preferably either imidazole, 2-phenylimidazole, or diphenylguanidine.
  • the addition amount of the organic acid is preferably 0.5 to 5.0%, and the addition amount of the imidazole derivative or the organic amine is preferably 0.5 to 3.0%.
  • % is the mass%.
  • an organic acid and an imidazole derivative or an organic amine are copper, brass, white or nickel as the material to be joined, or a combination in which a lead-free solder has wettability with respect to a plurality of materials. Selected.
  • the flux of the present invention by adding a specific organic acid and a specific imidazole derivative or organic amine in combination, the wettability during soldering is improved even with a solder paste mixed with a solder powder not containing lead. .
  • solderability in lead-free solder is improved without adding halide as an activator, and wettability equivalent to the case of using a flux added with halogen can be obtained. realizable.
  • the flux of the present embodiment is mixed with lead-free solder powder to produce a solder paste.
  • the flux of the present embodiment includes a combination of a specific organic acid and a specific imidazole derivative or organic amine as an activator, and substantially does not include a halide.
  • a specific organic acid and a specific imidazole derivative or organic amine coexist in the flux, it is assumed that the organic amine increases the reaction rate of the organic acid, and it is considered that the wettability of the solder is promoted.
  • solder paste in which an organic acid, a flux containing an imidazole derivative or organic amine, and a solder powder that does not contain lead are mixed, the wettability of the solder during soldering is limited to the organic acid and the imidazole derivative or organic It depends on the combination with the amine, the amount of each substance to be combined, and the relationship with the material to be joined. And the combination of the specific organic acid from which desired wettability is obtained, and the specific imidazole derivative or organic amine exists according to the material to join.
  • the specific organic acid is preferably glutaric acid, adipic acid, azelaic acid, glycolic acid, diglycolic acid, picolinic acid, or 2-phenylsuccinic acid.
  • the specific imidazole derivative or organic amine is preferably any one of 2-methylimidazole, 2-ethylimidazole, 2-phenylimidazole, and diphenylguanidine.
  • the addition amount of the specific organic acid is preferably 0.5 to 5.0%, and the addition amount of the specific imidazole derivative or organic amine is preferably 0.5 to 3.0%. % Is% by mass unless otherwise specified.
  • solder paste with a mixture of a specific organic acid, a flux added in combination with a specific imidazole derivative or organic amine, and a solder powder that does not contain lead improves the wettability during soldering and is lead-free. Solderability in solder is improved without adding halide to the flux.
  • Test method in addition to copper (Cu), brass (Cu-Zn), white (Cu-Zn-Ni), and nickel (Ni) are selected as materials to be joined.
  • an electrode such as a printed circuit board is often copper.
  • some mechanical parts such as shielding plates mounted on the substrate by soldering are made of brass or white.
  • the lead of the electronic component is nickel-plated.
  • a flux having the above-mentioned composition is dropped on a copper plate, a brass plate, a white plate and a nickel plate, and a 1.75 mm ⁇ lead-free solder ball (composition Sn-3.0Ag-0.5Cu ) And heat for 30 seconds on a hot plate set at 250 ° C to dissolve the solder and verify the solder wettability.
  • the solder spreading ratio representing the wettability of the solder is evaluated as A for 70% or more, B for 60 to 70%, C for 50 to 60%, and D for 50% or less.
  • Tables 3 to 6 The results of the solder spreading ratio are shown in Tables 3 to 6 below.
  • Table 3 shows the result of the solder spreading rate when the joining target is copper
  • Table 4 shows the result of the solder spreading rate when the joining target is brass
  • Table 5 shows the result of the solder spreading rate when the bonding target is white
  • Table 6 shows the result of the solder spreading rate when the bonding target is nickel.
  • the organic acid is glycolic acid, picolinic acid, diglycolic acid, adipic acid, 2-phenylsuccinic acid, glutaric acid, azelaic acid, and imidazole.
  • a flux in which any one of 2-methylimidazole, 2-ethylimidazole, 2-phenylimidazole and diphenylguanidine is added as a system derivative or organic amine good wettability can be obtained without adding a halide. I understand that.
  • the organic acid is selected from glycolic acid, picolinic acid, adipic acid, 2-phenylsuccinic acid, glutaric acid, and azelaic acid.
  • the fluxes that are added in combination with any one of 2-methylimidazole, 2-ethylimidazole, and diphenylguanidine as an imidazole derivative or organic amine, good wettability can be obtained without adding a halide. I understand that.
  • a flux of the above composition is dropped on a copper plate, a brass plate, a white plate and a nickel plate, and a 1.75 mm ⁇ lead-free solder ball (composition Sn-3.0Ag-0.5Cu ) And heat for 30 seconds on a hot plate set at 250 ° C to dissolve the solder and verify the solder wettability.
  • the solder spreading ratio representing the wettability of the solder is evaluated as A for 70% or more, B for 60 to 70%, C for 50 to 60%, and D for 50% or less.
  • Tables 8 to 11 The results of the solder spreading ratio are shown in Tables 8 to 11 below.
  • Table 8 shows the result of the spreading rate of the solder when the joining target is copper
  • Table 9 shows the result of the spreading rate of the solder when the joining target is brass
  • Table 10 shows the result of the solder spreading rate when the bonding target is white
  • Table 11 shows the result of the solder spreading rate when the bonding target is nickel.
  • any organic acid any of glycolic acid, picolinic acid, diglycolic acid, adipic acid, 2-phenylsuccinic acid, glutaric acid, azelaic acid, and imidazole It has been found that it is preferable to add any one of 2-methylimidazole, 2ethylimidazole, 2phenylimidazole, and diphenylguanidine as a system derivative or organic amine. It was also found that the amount of organic acid added is preferably 0.5 to 5.0%, and the amount of imidazole derivative or organic amine added is preferably 0.5 to 3.0%.
  • the flux of the present invention can realize a halogen-free flux, it can be applied to lead-free solder to meet the demand for environmental measures.

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

La présente invention se rapporte à un flux pouvant améliorer l'aptitude au brasage sans l'ajout d'un halogène. La présente invention est un flux auquel sont ajoutés un acide organique et un dérivé d'imidazole ou une amine organique en tant que combinaison qui sert d'activateur à la place d'un halogénure, et le flux est mélangé à une poudre de brasage sans plomb pour produire une pâte à braser. L'acide organique est de préférence n'importe quel acide parmi l'acide glutarique, l'acide adipique, l'acide azélaïque, l'acide glycolique, l'acide diglycolique, l'acide picolinique ou l'acide 2-phénylsuccinique, et la quantité ajoutée de celui-ci est de préférence comprise entre 0,5 et 5,0 % en masse. Le dérivé d'imidazole ou l'amide organique est de préférence n'importe quel composant parmi le 2-méthylimidazole, le 2-éthylimidazole, le 2-phénylimidazole ou le diphénylguanidine, et la quantité ajoutée de celui-ci est de préférence comprise entre 0,5 et 3,0 % en masse.
PCT/JP2012/054928 2011-03-02 2012-02-28 Flux WO2012118074A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2011045775 2011-03-02
JP2011-045775 2011-03-02

Publications (1)

Publication Number Publication Date
WO2012118074A1 true WO2012118074A1 (fr) 2012-09-07

Family

ID=46758005

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2012/054928 WO2012118074A1 (fr) 2011-03-02 2012-02-28 Flux

Country Status (1)

Country Link
WO (1) WO2012118074A1 (fr)

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103084755A (zh) * 2013-01-31 2013-05-08 广东普赛特电子科技股份有限公司 一种共混改性的无卤助焊膏及其制备方法
JP2013169557A (ja) * 2012-02-20 2013-09-02 Tamura Seisakusho Co Ltd はんだ組成物およびその製造方法、並びにプリント配線基板
JP2015160234A (ja) * 2014-02-27 2015-09-07 株式会社タムラ製作所 フラックス組成物、はんだ組成物およびプリント配線基板
JP2017064784A (ja) * 2015-09-30 2017-04-06 株式会社タムラ製作所 はんだ組成物および電子基板
WO2018084072A1 (fr) * 2016-11-07 2018-05-11 株式会社弘輝 Flux, composition de brasure et procédé de production de corps lié
CN108472771A (zh) * 2016-01-15 2018-08-31 千住金属工业株式会社 助焊剂
JP2019122982A (ja) * 2018-01-16 2019-07-25 千住金属工業株式会社 フラックス及びソルダペースト
CN111001965A (zh) * 2019-10-28 2020-04-14 东莞市吉田焊接材料有限公司 一种有铅锡膏助焊剂及其制备方法与锡膏
WO2020083529A1 (fr) * 2018-10-24 2020-04-30 Alpha Assembly Solutions Inc. Solutions de brasage à basse température pour substrats polymères, cartes de circuits imprimés et autres applications d'assemblage
JP2020192554A (ja) * 2019-05-27 2020-12-03 千住金属工業株式会社 はんだペースト及びフラックス
JP2020192557A (ja) * 2019-05-27 2020-12-03 千住金属工業株式会社 フラックス及びはんだペースト
JP2020192553A (ja) * 2019-05-27 2020-12-03 千住金属工業株式会社 はんだペースト及びフラックス
JP2020192558A (ja) * 2019-05-27 2020-12-03 千住金属工業株式会社 フラックス及びはんだペースト
US11833620B2 (en) 2018-01-16 2023-12-05 Senju Metal Industry Co., Ltd. Flux and solder paste

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06312291A (ja) * 1993-04-30 1994-11-08 Hitachi Chem Co Ltd フラックス組成物及びフラックス組成物の製造方法
JPH1085984A (ja) * 1996-09-10 1998-04-07 Aoki Metal:Kk はんだ付け用フラックス及びやに入りはんだ
JP2005528224A (ja) * 2002-05-30 2005-09-22 フライズ メタルズ インコーポレイテッド はんだ付け用ペースト及び融剤
JP2008100262A (ja) * 2006-10-19 2008-05-01 Nof Corp はんだ付け用フラックス組成物およびはんだペースト
JP2008110392A (ja) * 2006-10-31 2008-05-15 Harima Chem Inc はんだ付け用フラックスおよびはんだペースト組成物

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06312291A (ja) * 1993-04-30 1994-11-08 Hitachi Chem Co Ltd フラックス組成物及びフラックス組成物の製造方法
JPH1085984A (ja) * 1996-09-10 1998-04-07 Aoki Metal:Kk はんだ付け用フラックス及びやに入りはんだ
JP2005528224A (ja) * 2002-05-30 2005-09-22 フライズ メタルズ インコーポレイテッド はんだ付け用ペースト及び融剤
JP2008100262A (ja) * 2006-10-19 2008-05-01 Nof Corp はんだ付け用フラックス組成物およびはんだペースト
JP2008110392A (ja) * 2006-10-31 2008-05-15 Harima Chem Inc はんだ付け用フラックスおよびはんだペースト組成物

Cited By (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013169557A (ja) * 2012-02-20 2013-09-02 Tamura Seisakusho Co Ltd はんだ組成物およびその製造方法、並びにプリント配線基板
CN103084755A (zh) * 2013-01-31 2013-05-08 广东普赛特电子科技股份有限公司 一种共混改性的无卤助焊膏及其制备方法
JP2015160234A (ja) * 2014-02-27 2015-09-07 株式会社タムラ製作所 フラックス組成物、はんだ組成物およびプリント配線基板
JP2017064784A (ja) * 2015-09-30 2017-04-06 株式会社タムラ製作所 はんだ組成物および電子基板
CN106825994A (zh) * 2015-09-30 2017-06-13 株式会社田村制作所 焊料组合物及电子基板
CN108472771A (zh) * 2016-01-15 2018-08-31 千住金属工业株式会社 助焊剂
CN108472771B (zh) * 2016-01-15 2019-05-28 千住金属工业株式会社 助焊剂
US11571772B2 (en) 2016-01-15 2023-02-07 Senju Metal Industry Co., Ltd. Flux
WO2018084072A1 (fr) * 2016-11-07 2018-05-11 株式会社弘輝 Flux, composition de brasure et procédé de production de corps lié
JP7063630B2 (ja) 2018-01-16 2022-05-09 千住金属工業株式会社 フラックス及びソルダペースト
JP2019122982A (ja) * 2018-01-16 2019-07-25 千住金属工業株式会社 フラックス及びソルダペースト
US11833620B2 (en) 2018-01-16 2023-12-05 Senju Metal Industry Co., Ltd. Flux and solder paste
WO2020083529A1 (fr) * 2018-10-24 2020-04-30 Alpha Assembly Solutions Inc. Solutions de brasage à basse température pour substrats polymères, cartes de circuits imprimés et autres applications d'assemblage
CN112912204A (zh) * 2018-10-24 2021-06-04 阿尔法装配解决方案公司 用于聚合物基板、印刷电路板及其他接合应用的低温焊接溶液
JP2022502265A (ja) * 2018-10-24 2022-01-11 アルファ・アセンブリー・ソリューションズ・インコーポレイテッドAlpha Assembly Solutions Inc. ポリマー基板、プリント回路板及び他の接合用途のための低温はんだ付け溶液
JP2020192553A (ja) * 2019-05-27 2020-12-03 千住金属工業株式会社 はんだペースト及びフラックス
JP2020192558A (ja) * 2019-05-27 2020-12-03 千住金属工業株式会社 フラックス及びはんだペースト
JP2020192557A (ja) * 2019-05-27 2020-12-03 千住金属工業株式会社 フラックス及びはんだペースト
JP2020192554A (ja) * 2019-05-27 2020-12-03 千住金属工業株式会社 はんだペースト及びフラックス
CN111001965A (zh) * 2019-10-28 2020-04-14 东莞市吉田焊接材料有限公司 一种有铅锡膏助焊剂及其制备方法与锡膏

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