WO2012110849A3 - ヒートシンク付きカードコネクタ - Google Patents

ヒートシンク付きカードコネクタ Download PDF

Info

Publication number
WO2012110849A3
WO2012110849A3 PCT/IB2011/003365 IB2011003365W WO2012110849A3 WO 2012110849 A3 WO2012110849 A3 WO 2012110849A3 IB 2011003365 W IB2011003365 W IB 2011003365W WO 2012110849 A3 WO2012110849 A3 WO 2012110849A3
Authority
WO
WIPO (PCT)
Prior art keywords
card
housing
top panel
cover member
panel part
Prior art date
Application number
PCT/IB2011/003365
Other languages
English (en)
French (fr)
Other versions
WO2012110849A2 (ja
Inventor
裕司 内藤
冨田　光洋
Original Assignee
モレックス インコーポレイテド
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by モレックス インコーポレイテド filed Critical モレックス インコーポレイテド
Priority to US13/991,450 priority Critical patent/US9048553B2/en
Priority to CN201180059017.9A priority patent/CN103299490B/zh
Publication of WO2012110849A2 publication Critical patent/WO2012110849A2/ja
Publication of WO2012110849A3 publication Critical patent/WO2012110849A3/ja

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/46—Bases; Cases
    • H01R13/502—Bases; Cases composed of different pieces
    • H01R13/506—Bases; Cases composed of different pieces assembled by snap action of the parts

Landscapes

  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)

Abstract

【課題】簡素な構成でありながらカードの発生する熱を速やかに除去することができ、小型で、製造が容易であり、コストが低く、信頼性が高くなるようにする。 【解決手段】端子部材を備えるカードを収容するハウジングと、該ハウジングに取付けられ、前記カードの端子部材と接触する接続端子と、前記ハウジングに取付けられ、該ハウジングとの間にカード収容空間を形成するカバー部材とを有し、基板に取付けられるカード用コネクタであって、前記カバー部材は、天板部と、該天板部の側縁から立設する複数の側板部と、該側板部の下端縁から延出する固定片とを備え、該固定片のうちの少なくとも一つは、前記基板に配設された伝熱用パッドに接続され、前記天板部は、前記カード収容空間内に収容されたカードの上面と接触し、前記カードから前記天板部への熱伝達を向上させる熱伝達向上部を備える。
PCT/IB2011/003365 2010-12-07 2011-12-06 ヒートシンク付きカードコネクタ WO2012110849A2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
US13/991,450 US9048553B2 (en) 2010-12-07 2011-12-06 Card socket with heat sink
CN201180059017.9A CN103299490B (zh) 2010-12-07 2011-12-06 具有散热器的卡连接器

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2010-272638 2010-12-07
JP2010272638A JP5657363B2 (ja) 2010-12-07 2010-12-07 カード用コネクタ

Publications (2)

Publication Number Publication Date
WO2012110849A2 WO2012110849A2 (ja) 2012-08-23
WO2012110849A3 true WO2012110849A3 (ja) 2012-12-06

Family

ID=46505218

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/IB2011/003365 WO2012110849A2 (ja) 2010-12-07 2011-12-06 ヒートシンク付きカードコネクタ

Country Status (4)

Country Link
US (1) US9048553B2 (ja)
JP (1) JP5657363B2 (ja)
CN (1) CN103299490B (ja)
WO (1) WO2012110849A2 (ja)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2816439B1 (en) * 2013-04-22 2018-10-03 Huawei Device Co., Ltd. Device for preventing deformation of communication card
US9329643B2 (en) 2013-06-17 2016-05-03 Michael R. Tobias Apparatus for holding a semiconductor module
TWI627803B (zh) * 2017-04-24 2018-06-21 Use the grounding pin of the grounding piece to reduce the signal interference between the two rows of terminals
US11079820B2 (en) 2019-01-15 2021-08-03 Microsoft Technology Licensing, Llc Method and apparatus for improving removable storage performance
US11520311B2 (en) * 2019-07-25 2022-12-06 Microsoft Technology Licensing, Llc High performance removable storage devices

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020031948A1 (en) * 1999-12-28 2002-03-14 Kaori Yasufuku Connector for module
US20070097625A1 (en) * 2005-11-01 2007-05-03 Foxconn Technology Co., Ltd. Printed circuit board with a heat dissipation device

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6124976U (ja) * 1984-07-20 1986-02-14 株式会社明電舎 高周波電流伝送用継手
JPH0638179U (ja) * 1992-10-23 1994-05-20 エスエムケイ株式会社 メモリカード用コネクタ
JPH0638180U (ja) * 1992-10-27 1994-05-20 エスエムケイ株式会社 メモリカード用コネクタ
JP2001185307A (ja) * 1999-12-28 2001-07-06 Jst Mfg Co Ltd モジュール用コネクタ
JP4299427B2 (ja) * 2000-01-14 2009-07-22 富士通コンポーネント株式会社 カードコネクタ
JP3546180B2 (ja) * 2000-12-27 2004-07-21 日本圧着端子製造株式会社 通信モジュール用コネクタおよび通信モジュールの接続構造
TWM303477U (en) * 2006-04-24 2006-12-21 Hon Hai Prec Ind Co Ltd Slide switch
TWM307212U (en) * 2006-06-05 2007-03-01 Hon Hai Prec Ind Co Ltd Electrical card connector
JP4913026B2 (ja) 2007-12-13 2012-04-11 ホシデン株式会社 カードコネクタ
JP4962871B2 (ja) * 2008-07-01 2012-06-27 山一電機株式会社 カード用コネクタ
JP2010218955A (ja) * 2009-03-18 2010-09-30 Yamaichi Electronics Co Ltd カードコネクタ
JP2011028389A (ja) * 2009-07-22 2011-02-10 Panasonic Electric Works Co Ltd メモリカードソケット
JP2012113984A (ja) * 2010-11-25 2012-06-14 Molex Inc カード用コネクタ
JP5714313B2 (ja) * 2010-11-29 2015-05-07 モレックス インコーポレイテドＭｏｌｅｘ Ｉｎｃｏｒｐｏｒａｔｅｄ カード用コネクタ

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020031948A1 (en) * 1999-12-28 2002-03-14 Kaori Yasufuku Connector for module
US20070097625A1 (en) * 2005-11-01 2007-05-03 Foxconn Technology Co., Ltd. Printed circuit board with a heat dissipation device

Also Published As

Publication number Publication date
US9048553B2 (en) 2015-06-02
JP2012123976A (ja) 2012-06-28
CN103299490A (zh) 2013-09-11
JP5657363B2 (ja) 2015-01-21
US20130295792A1 (en) 2013-11-07
CN103299490B (zh) 2016-04-06
WO2012110849A2 (ja) 2012-08-23

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