TWI627803B - Use the grounding pin of the grounding piece to reduce the signal interference between the two rows of terminals - Google Patents

Use the grounding pin of the grounding piece to reduce the signal interference between the two rows of terminals Download PDF

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TWI627803B
TWI627803B TW106113619A TW106113619A TWI627803B TW I627803 B TWI627803 B TW I627803B TW 106113619 A TW106113619 A TW 106113619A TW 106113619 A TW106113619 A TW 106113619A TW I627803 B TWI627803 B TW I627803B
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grounding
terminals
connector
circuit board
soldering
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TW106113619A
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TW201840070A (zh
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De-Zhi Zeng
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Priority to TW106113619A priority Critical patent/TWI627803B/zh
Priority to CN201710809496.0A priority patent/CN108736258A/zh
Priority to US15/700,227 priority patent/US10069247B1/en
Priority to KR1020170123866A priority patent/KR101986902B1/ko
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Publication of TWI627803B publication Critical patent/TWI627803B/zh
Publication of TW201840070A publication Critical patent/TW201840070A/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/648—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding  
    • H01R13/652—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding   with earth pin, blade or socket
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H01R12/72—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures
    • H01R12/722—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures coupling devices mounted on the edge of the printed circuits
    • H01R12/724—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures coupling devices mounted on the edge of the printed circuits containing contact members forming a right angle
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/46—Bases; Cases
    • H01R13/502—Bases; Cases composed of different pieces
    • H01R13/508—Bases; Cases composed of different pieces assembled by a separate clip or spring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/64—Means for preventing incorrect coupling
    • H01R13/641—Means for preventing incorrect coupling by indicating incorrect coupling; by indicating correct or full engagement
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/648—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding  
    • H01R13/658—High frequency shielding arrangements, e.g. against EMI [Electro-Magnetic Interference] or EMP [Electro-Magnetic Pulse]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/648—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding  
    • H01R13/658—High frequency shielding arrangements, e.g. against EMI [Electro-Magnetic Interference] or EMP [Electro-Magnetic Pulse]
    • H01R13/6581—Shield structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/648—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding  
    • H01R13/658—High frequency shielding arrangements, e.g. against EMI [Electro-Magnetic Interference] or EMP [Electro-Magnetic Pulse]
    • H01R13/6581—Shield structure
    • H01R13/6585—Shielding material individually surrounding or interposed between mutually spaced contacts
    • H01R13/6586—Shielding material individually surrounding or interposed between mutually spaced contacts for separating multiple connector modules
    • H01R13/6587—Shielding material individually surrounding or interposed between mutually spaced contacts for separating multiple connector modules for mounting on PCBs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R24/00—Two-part coupling devices, or either of their cooperating parts, characterised by their overall structure
    • H01R24/60—Contacts spaced along planar side wall transverse to longitudinal axis of engagement
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R24/00—Two-part coupling devices, or either of their cooperating parts, characterised by their overall structure
    • H01R24/60—Contacts spaced along planar side wall transverse to longitudinal axis of engagement
    • H01R24/62—Sliding engagements with one side only, e.g. modular jack coupling devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/02—Soldered or welded connections
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F13/00—Interconnection of, or transfer of information or other signals between, memories, input/output devices or central processing units
    • G06F13/38—Information transfer, e.g. on bus
    • G06F13/42—Bus transfer protocol, e.g. handshake; Synchronisation
    • G06F13/4282—Bus transfer protocol, e.g. handshake; Synchronisation on a serial bus, e.g. I2C bus, SPI bus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/7005—Guiding, mounting, polarizing or locking means; Extractors
    • H01R12/7011—Locking or fixing a connector to a PCB
    • H01R12/707—Soldering or welding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/46—Bases; Cases
    • H01R13/502—Bases; Cases composed of different pieces
    • H01R13/506—Bases; Cases composed of different pieces assembled by snap action of the parts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/66—Structural association with built-in electrical component
    • H01R13/665—Structural association with built-in electrical component with built-in electronic circuit
    • H01R13/6658—Structural association with built-in electrical component with built-in electronic circuit on printed circuit board
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R2107/00—Four or more poles

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  • Details Of Connecting Devices For Male And Female Coupling (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)

Abstract

本發明係一種利用接地片之接地腳降低雙排端子間訊號干擾之連接器，包括一絕緣座體、複數支第一端子、複數支第二端子及一接地片，該等第一及第二端子係分別嵌設於該絕緣座體上鄰近頂部及底部之位置，且接地片係嵌設於絕緣座體內對應該等端子之間的位置，其特徵在於，該等第一端子及第二端子之焊接部能沿水平方向排列且焊接至一電路板上，且該電路板上對應於兩排端子之間的位置係形成有一間隔區域，該接地片上延伸設有至少一接地腳，該接地腳係焊接至該間隔區域內鄰近中間的位置，以在兩排端子之間形成屏蔽效果，有效防止兩排端子間發生訊號相互干擾的問題。

Description

利用接地片之接地腳降低雙排端子間訊號干擾之連接器
本發明係一種利用接地片之接地腳降低雙排端子間訊號干擾之連接器，尤指在接地片上設一接地腳，該接地腳係延伸至兩排端子之焊接部之間，以形成屏蔽作用，提昇傳輸效果之連接器結構。
按，訊號連接器(Connector)泛指所有應用在電子訊號及電源上的連接元件及其附屬配件，是所有訊號的橋樑，其品質會對電流與訊號傳輸的可靠度產生影響，且亦與電子系統運作息息相關。隨著電子技術的日益發達，訊號連接器已成為各類電子裝置在進行資料傳輸及與其他週邊設備連接時不可或缺的配備。在眾多連接器的傳輸規格中，又以通用序列匯流排(Universal Serial Bus，以下簡稱USB)最為普及。
目前，USB規格已即將全面進入USB 3.1，且為了提昇傳輸速度、傳輸訊號類型及插拔便利性，業界尚進一步推出「Type-C連接器」，Type-C的連接器結構有一個重大的變化，即「構型上下對稱」，使用者將無須特別辨識出插頭的正反面，而可任意地插入對應的插座中，讓使用上更為直覺。然而，為了達成正反面皆可插接的功能，Type-C連接器內必須配置兩組相同的連接端子，此外，為了防止兩組端子上的訊號相互干擾，在連接器內部尚必須設置一接地片，以隔開兩組端子。
然而，在當前業界皆以「輕薄短小」為主流設計電子裝置的情勢下，USB 3.1之Type-C連接器的此一規格條件，將會對生產、組裝流程產生新的困難與挑戰。尤其，在結構縮減後，端子之間的距離勢必更為接近，致使前述接地片並無法完善地屏蔽兩組端子，因此，如何針對連接器結構再做改良，即成為本發明在此亟欲解決的重要課題。
有鑑於習知Type-C連接器在縮減體積後，兩排端子之間仍可能會產生訊號干擾的問題，發明人憑藉著多年來的業界研發經驗，經過多次的研究、改良與測試後，終於設計出本發明之一種利用接地片之接地腳降低雙排端子間訊號干擾之連接器，期能在不大幅影響成本的前提下，有效改善連接器之效能。
本發明之一目的，係提供一種利用接地片之接地腳降低雙排端子間訊號干擾之連接器，至少包括一絕緣座體、複數支第一端子、複數支第二端子及一接地片，該等第一端子係嵌設於該絕緣座體上鄰近頂部之位置、該等第二端子係嵌設於該絕緣座體之上鄰近底部之位置、該接地片則係嵌設於該絕緣座體內對應於該等第一端子及該等第二端子間的部位，該連接器之特徵係在於：該等第一端子之後端分別設有一第一焊接部，該等第一焊接部係沿水平方向排列，且其自由端係分別能被焊接至一電路板上之第一接點；該等第二端子之後端分別設有一第二焊接部，該等第二焊接部亦沿水平方向排列，且其自由端係分別能被焊接至該電路板上之第二接點，以使該等第二焊接部能與對應之該等第一焊接部間分別保持一間隔距離，該電路板上對應於該等第一焊接部及第二焊接部間之區域則形成有 一間隔區域；該接地片之後端設有至少一第一接地腳，該第一接地腳之一端係與該接地片相連接，其自由端則延伸至該等第一焊接部及第二焊接部之間，且能被焊接至該電路板上之間隔區域內，該第一接地腳與該間隔區域之兩側保持有一預定距離。如此，透過該接地片所延伸出之接地腳，即能如同一屏蔽層，有效降低該等端子在傳輸訊號時產生的相互干擾，從而提昇連接器的整體傳輸穩定性。
為便 貴審查委員能對本發明之技術特徵有更進一步的認識與理解，茲舉實施例配合圖式，詳細說明如下：
〔習知〕
無
〔本發明〕
1‧‧‧連接器
11‧‧‧外殼
110‧‧‧容置空間
12‧‧‧絕緣座體
13‧‧‧第一端子
131‧‧‧第一焊接部
14‧‧‧第二端子
141‧‧‧第二焊接部
15‧‧‧接地片
151‧‧‧第一接地腳
152‧‧‧第二接地腳
D1、D2‧‧‧距離
P‧‧‧電路板
P10‧‧‧間隔區域
P11‧‧‧第一接點
P111‧‧‧第一高頻接點
P12‧‧‧第二接點
P121‧‧‧第二高頻接點
P13‧‧‧第一接地孔
P14‧‧‧第二接地孔
第1圖係本發明之連接器之外觀示意圖；第2圖係本發明之絕緣座體之後側示意圖；第3圖係本發明之兩組端子、接地片及電路板之爆炸圖；及第4圖係本發明之連接器所對應之電路板平面圖。
發明人在研究過程中發現，習知的Type-C連接器，其接地片多係由「側邊」與金屬殼搭接，而未朝後延伸至兩排端子的焊接部位，意即，兩排端子間之焊接部位之間並無屏蔽，因此，發明人乃思及，若能利用這被忽略的空間，設計屏蔽結構，則應即能有效改善訊號傳輸效能。
本發明係一種利用接地片之接地腳降低雙排端子間訊號干擾之連接器1，請參閱第1~4圖所示，該連接器1至少包括一外殼11、一絕緣座體12、複數支第一端子13、複數支第二端子14及一接地片15，其中， 該外殼11內設有一容置空間110，以供容置該絕緣座體12，在此要特別一提者，該絕緣座體12可由射出成形方式，包覆住該等端子13、14及接地片15，亦可由多組膠體分別射出成形包覆各該端子13、14及接地片15後，再嵌卡組裝而成，其組裝或成形方式並非本發明之限制要件。
請參閱第2~4圖所示，在本實施例中，該等第一端子13之中段部能以嵌插或射出成形方式，嵌設於該絕緣座體12上鄰近頂部之位置，且該等第一端子13之後端分別設有一第一焊接部131；該等第二端子14則能以嵌插或射出成形方式，先設於一膠體內後，再被嵌設於該絕緣座體12之上鄰近底部之位置，且該該等第二端子14之後端分別設有一第二焊接部141；該接地片15係嵌設於該絕緣座體12內對應於該等第一端子13及該等第二端子14間的部位。
該等焊接部131、141係能焊接至一電路板P上，第4圖為電路板P之平面圖，該電路板P上沿水平方向分別設有兩排接點，分別為複數個第一接點P11及複數個第二接點P12。該等第一焊接部131係沿水平方向排列，且其自由端係分別能被焊接至第一接點P11；該等第二焊接部141亦沿水平方向排列，且其自由端係分別能被焊接至該電路板P上之第二接點P12，以在該等焊接部131、141被焊接至電路板P上後，該等第二焊接部141能與對應之該等第一焊接部131間分別保持一間隔距離，且該電路板P上對應於該等第一焊接部131及第二焊接部141間之區域則形成有一間隔區域P10，該間隔區域P10之寬度即為該等接點P11、P12之整排寬度。
該接地片15之後端設有至少一第一接地腳151，該第一接地腳151之一端係與該接地片15相連接，其自由端則延伸至該等第一焊接部 131及第二焊接部141之間，且能被焊接至該電路板P上之間隔區域P10內，該第一接地腳151與該間隔區域P10之兩側保持有一預定距離。
如此，由於該第一接地腳151係位於兩排端子13、14之該等焊接部131、141之間，故，該第一接地腳151將能在該等對應之焊接部131、141間形成一屏蔽效果，防止兩排端子13、14之焊接部131、141間發生訊號相互干擾的問題。發明人在測試過程中，更發現該第一接地腳151之自由端與該間隔區域P10之兩側需保持有一預定距離，據此，始能充分發揮其屏蔽效果。
根據Type-C連接器之規格，該等第一端子13中尚包括二對第一高頻端子，該等第二端子14中則包括二對第二高頻端子，為便於描述其相對位置，茲以第4圖之電路板P平面圖進行說明：該等第一高頻端子及第二高頻端子係分別焊接至第4圖中深色區塊之第一高頻接點P111及第二高頻接點P121上，該等第一高頻端子及該等第二高頻端子之焊接部位置(即，第一高頻接點P111及第二高頻接點P121之位置)係相互對應，且該第一接地腳151之自由端係焊接至該間隔區域P10內對應於該等第一高頻端子及該等第二高頻端子之間的位置，據此，將能進一步隔絕該等高頻端子間的訊號干擾。
舉例而言，當該等第一高頻接點P111及第二高頻接點P121之位置如第4圖所示時，該第一接地腳151之自由端與該間隔區域P10之兩側的距離D1係介於0.05~2.9釐米為佳(最佳值為0.3~0.5釐米之間)；此外，在本實施例中，該等第一接點P11及第二接點P12間的距離D2係介於0.3釐米~5釐米之間，如此，其面積始能供焊接該第一接地腳151，而不會與其他 接點P11、P12相短路，較佳範圍則為0.90釐米~5釐米之間。
根據測試結果，當該第一接地腳151被焊接至該間隔區域P10內對應於該等高頻端子(高頻接點P111、P121)之間的位置時，無論是在特徵阻抗(Simulated Characteristic impedance)、插入損耗(Simulated insertion loss)、返回損耗(Simulated return loss)等數據上皆優於習知結構(即，接地片並未延伸至焊接位置之連接器)，且在高頻訊號傳輸時，亦完全不會產生近端串音(Simulated NEXT)的問題。
此外，在第1~4圖所示之圖式中，該等端子13、14係採用貼片式(Surface Mount Technology，SMT)焊接至該電路板P上，惟，實際施作上，該等端子13、14亦可透過插板式(Dual-In line Package，DIP)，焊接至該電路板P上之穿孔中，且該電路板P之間隔區域P10內設有至少一第一接地孔P13，該第一接地腳151之自由端係穿過該第一接地孔P13，並透過焊料(如：錫膏)焊接至該電路板P上。
又，在本實施例中，其中，該接地片15上設有二支第一接地腳151，且尚設有二第二接地腳152，各該第二接地腳152之自由端則能焊接至該電路板P上鄰近該間隔區域P10之兩側的位置，以進一步提昇屏蔽效果。同理，該電路板P上鄰近該間隔區域P10之兩側的位置可分別設置一第二接地孔P14，令該第二接地腳152之自由端係穿過該第二接地孔P14，並透過焊料(如：錫膏)焊接至該電路板P上。
此外，復請參閱第4圖所示，為簡化焊接工序、並提昇接地效果，該電路板P中位於最兩側的第一接點P11及第二接點P12(係屬於接地接點)，尚能分別與相鄰之該第二接地孔P14一併焊接，形成短路，令接地 效果更為完善。
以上所述，僅為本發明之若干較佳實施例，惟，本發明之技術特徵並不侷限於此，凡相關技術領域之人士，在參酌本發明之技術內容後，所能輕易思及之等效變化，均應不脫離本發明之保護範疇。

Claims (10)

  1. 一種利用接地片之接地腳降低雙排端子間訊號干擾之連接器，至少包括一絕緣座體、複數支第一端子、複數支第二端子及一接地片，該等第一端子係嵌設於該絕緣座體上鄰近頂部之位置、該等第二端子係嵌設於該絕緣座體之上鄰近底部之位置、該接地片則係嵌設於該絕緣座體內對應於該等第一端子及該等第二端子間的部位，該連接器之特徵係在於：該等第一端子之後端分別設有一第一焊接部，該等第一焊接部係沿水平方向排列，且其自由端係能分別被焊接至一電路板上之第一接點；該等第二端子之後端分別設有一第二焊接部，該等第二焊接部亦沿水平方向排列，且其自由端係能分別被焊接至該電路板上之第二接點，以使該等第二焊接部能與對應之該等第一焊接部間分別保持一間隔距離，該電路板上對應於該等第一焊接部及第二焊接部間之區域則形成有一間隔區域；及該接地片之後端設有至少一第一接地腳，該第一接地腳之自由端能延伸至該等第一焊接部及第二焊接部之間，且能被焊接至該電路板上之間隔區域內，該第一接地腳與該間隔區域之兩側保持有一預定距離。
  2. 如請求項1所述之連接器，其中，該等第一端子中包括二對第一高頻端子，該等第二端子中則包括二對第二高頻端子，該等第一高頻端子及該等第二高頻端子之焊接部位置係相互對應，且該第一接地腳之自由端係焊接至該間隔區域內對應於該等第一高頻端子及該等第二高頻端子之間的位置。
  3. 如請求項2所述之連接器，其中，該第一接地腳之自由端與該間隔區域之兩側的距離係介於0.05釐米~2.9釐米之間。
  4. 如請求項3所述之連接器，其中，該第一接地腳之自由端與該間隔區域 之兩側的距離係介於0.3釐米~0.5釐米之間。
  5. 如請求項4所述之連接器，其中，該等第一接點及第二接點間的距離係介於0.3釐米~5釐米之間。
  6. 如請求項5所述之連接器，其中，該等第一接點及第二接點間的距離係介於0.90釐米~5釐米之間。
  7. 如請求項6所述之連接器，其中，該電路板之間隔區域內設有至少一第一接地孔，該第一接地腳之自由端係穿過該第一接地孔，並透過焊料焊接至該電路板上。
  8. 如請求項7所述之連接器，其中，該接地片上設有二支該第一接地腳。
  9. 如請求項8所述之連接器，其中，該接地片上尚設有二第二接地腳，各該第二接地腳之自由端係被焊接至該電路板上鄰近該間隔區域之兩側的位置。
  10. 如請求項9所述之連接器，其中，該電路板上鄰近該間隔區域之兩側的位置分別設有一第二接地孔，該第二接地腳之自由端係穿過該第二接地孔，並透過焊料焊接至該電路板上。
TW106113619A 2017-04-24 2017-04-24 Use the grounding pin of the grounding piece to reduce the signal interference between the two rows of terminals TWI627803B (zh)

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TW106113619A TWI627803B (zh) 2017-04-24 2017-04-24 Use the grounding pin of the grounding piece to reduce the signal interference between the two rows of terminals
CN201710809496.0A CN108736258A (zh) 2017-04-24 2017-09-08 利用接地片的接地脚降低双排端子间信号干扰的连接器
US15/700,227 US10069247B1 (en) 2017-04-24 2017-09-11 Connector capable of reducing signal interference between two rows of terminals by grounding pin of grounding plate
KR1020170123866A KR101986902B1 (ko) 2017-04-24 2017-09-26 접지 판의 접지 핀에 의해 두 줄의 단자 사이의 신호 간섭을 감소시킬 수 있는 커넥터

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