CN108736258A - 利用接地片的接地脚降低双排端子间信号干扰的连接器 - Google Patents
利用接地片的接地脚降低双排端子间信号干扰的连接器 Download PDFInfo
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/648—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding
- H01R13/652—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding with earth pin, blade or socket
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- H—ELECTRICITY
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- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/71—Coupling devices for rigid printing circuits or like structures
- H01R12/72—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures
- H01R12/722—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures coupling devices mounted on the edge of the printed circuits
- H01R12/724—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures coupling devices mounted on the edge of the printed circuits containing contact members forming a right angle
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- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
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- H01R13/658—High frequency shielding arrangements, e.g. against EMI [Electro-Magnetic Interference] or EMP [Electro-Magnetic Pulse]
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- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/648—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding
- H01R13/658—High frequency shielding arrangements, e.g. against EMI [Electro-Magnetic Interference] or EMP [Electro-Magnetic Pulse]
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- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
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- H01R13/6581—Shield structure
- H01R13/6585—Shielding material individually surrounding or interposed between mutually spaced contacts
- H01R13/6586—Shielding material individually surrounding or interposed between mutually spaced contacts for separating multiple connector modules
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- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
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Abstract
本发明是一种利用接地片的接地脚降低双排端子间信号干扰的连接器,包括一绝缘座体、多支第一端子、多支第二端子及一接地片,该等第一及第二端子分别嵌设于该绝缘座体上邻近顶部及底部的位置,且接地片嵌设于绝缘座体内对应该等端子之间的位置,该等第一端子及第二端子的焊接部能沿水平方向排列且焊接至一电路板上,且该电路板上对应于两排端子之间的位置形成有一间隔区域,该接地片上延伸设有至少一接地脚,该接地脚焊接至该间隔区域内邻近中间的位置,以在两排端子之间形成屏蔽效果,有效防止两排端子间发生信号相互干扰的问题。
Description
技术领域
本发明是一种利用接地片的接地脚降低双排端子间信号干扰的连接器,尤指在接地片上设一接地脚,该接地脚延伸至两排端子的焊接部之间,以形成屏蔽作用,提升传输效果的连接器结构。
背景技术
信号连接器(Connector)泛指所有应用在电子信号及电源上的连接组件及其附属配件,是所有信号的桥梁,其质量会对电流与信号传输的可靠度产生影响,且也与电子系统运作息息相关。随着电子技术的日益发达,信号连接器已成为各类电子装置在进行数据传输及与其他外围设备连接时不可或缺的配备。在众多连接器的传输规格中,又以通用串行总线(Universal Serial Bus,以下简称USB)最为普及。
目前,USB规格已即将全面进入USB 3.1,且为了提升传输速度、传输信号类型及插拔便利性,业界还进一步推出「Type-C连接器」,Type-C的连接器结构有一个重大的变化,即「构型上下对称」,使用者将无须特别辨识出插头的正反面,而可任意地插入对应的插座中,让使用上更为直觉。然而,为了达成正反面均可插接的功能,Type-C连接器内必须配置两组相同的连接端子,此外,为了防止两组端子上的信号相互干扰,在连接器内部还必须设置一接地片,以隔开两组端子。
然而,在当前业界均以「轻薄短小」为主流设计电子装置的情势下,USB 3.1的Type-C连接器的此一规格条件,将会对生产、组装流程产生新的困难与挑战。尤其,在结构缩减后,端子之间的距离势必更为接近,致使前述接地片并无法完善地屏蔽两组端子,因此,如何针对连接器结构再做改良,即成为本发明在此亟欲解决的重要课题。
发明内容
有鉴于现有Type-C连接器在缩减体积后,两排端子之间仍可能会产生信号干扰的问题,发明人凭借着多年来的业界研发经验,经过多次的研究、改良与测试后,终于设计出本发明的一种利用接地片的接地脚降低双排端子间信号干扰的连接器,期能在不大幅影响成本的前提下,有效改善连接器的效能。
本发明的一目的,是提供一种利用接地片的接地脚降低双排端子间信号干扰的连接器,至少包括一绝缘座体、多支第一端子、多支第二端子及一接地片,该等第一端子嵌设于该绝缘座体上邻近顶部的位置、该等第二端子嵌设于该绝缘座体的上邻近底部的位置、该接地片则嵌设于该绝缘座体内对应于该等第一端子及该等第二端子间的部位,该连接器的特征在于:该等第一端子的后端分别设有一第一焊接部,该等第一焊接部沿水平方向排列,且其自由端分别能被焊接至一电路板上的第一接点;该等第二端子的后端分别设有一第二焊接部,该等第二焊接部也沿水平方向排列,且其自由端分别能被焊接至该电路板上的第二接点,以使该等第二焊接部能与对应的该等第一焊接部间分别保持一间隔距离,该电路板上对应于该等第一焊接部及第二焊接部间的区域则形成有一间隔区域;该接地片的后端设有至少一第一接地脚,该第一接地脚的一端与该接地片相连接,其自由端则延伸至该等第一焊接部及第二焊接部之间,且能被焊接至该电路板上的间隔区域内,该第一接地脚与该间隔区域的两侧保持有一预定距离。如此,通过该接地片所延伸出的接地脚,即能如同一屏蔽层,有效降低该等端子在传输信号时产生的相互干扰,从而提升连接器的整体传输稳定性。。
为便贵审查员能对本发明的技术特征有更进一步的认识与理解,兹举实施例配合图式,详细说明如下:
附图说明
图1是本发明的连接器的外观示意图;
图2是本发明的绝缘座体的后侧示意图;
图3是本发明的两组端子、接地片及电路板的爆炸图;及
图4是本发明的连接器所对应的电路板平面图。
【符号说明】
连接器 1
外壳 11
容置空间 110
绝缘座体 12
第一端子 13
第一焊接部 131
第二端子 14
第二焊接部 141
接地片 15
第一接地脚 151
第二接地脚 152
距离 D1、D2
电路板 P
间隔区域 P10
第一接点 P11
第一高频接点 P111
第二接点 P12
第二高频接点 P121
第一接地孔 P13
第二接地孔 P14
具体实施方式
发明人在研究过程中发现,现有的Type-C连接器,其接地片多是由「侧边」与金属壳搭接,而未朝后延伸至两排端子的焊接部位,意即,两排端子间的焊接部位之间并无屏蔽,因此,发明人乃思及,若能利用这被忽略的空间,设计屏蔽结构,则应即能有效改善信号传输效能。
本发明是一种利用接地片的接地脚降低双排端子间信号干扰的连接器1,请参阅图1~4所示,该连接器1至少包括一外壳11、一绝缘座体12、多支第一端子13、多支第二端子14及一接地片15,其中,该外壳11内设有一容置空间110,以供容置该绝缘座体12,在此要特别一提,该绝缘座体12可由射出成形方式,包覆住该等端子13、14及接地片15,也可由多组胶体分别射出成形包覆各该端子13、14及接地片15后,再嵌卡组装而成,其组装或成形方式并非本发明的限制要件。
请参阅图2~4所示,在本实施例中,该等第一端子13的中段部能以嵌插或射出成形方式,嵌设于该绝缘座体12上邻近顶部的位置,且该等第一端子13的后端分别设有一第一焊接部131;该等第二端子14则能以嵌插或射出成形方式,先设于一胶体内后,再被嵌设于该绝缘座体12的上邻近底部的位置,且该该等第二端子14的后端分别设有一第二焊接部141;该接地片15嵌设于该绝缘座体12内对应于该等第一端子13及该等第二端子14间的部位。
该等焊接部131、141能焊接至一电路板P上,图4为电路板P的平面图,该电路板P上沿水平方向分别设有两排接点,分别为多个第一接点P11及多个第二接点P12。该等第一焊接部131沿水平方向排列,且其自由端分别能被焊接至第一接点P11;该等第二焊接部141也沿水平方向排列,且其自由端分别能被焊接至该电路板P上的第二接点P12,以在该等焊接部131、141被焊接至电路板P上后,该等第二焊接部141能与对应的该等第一焊接部131间分别保持一间隔距离,且该电路板P上对应于该等第一焊接部131及第二焊接部141间的区域则形成有一间隔区域P10,该间隔区域P10的宽度即为该等接点P11、P12的整排宽度。
该接地片15的后端设有至少一第一接地脚151,该第一接地脚151的一端与该接地片15相连接,其自由端则延伸至该等第一焊接部131及第二焊接部141之间,且能被焊接至该电路板P上的间隔区域P10内,该第一接地脚151与该间隔区域P10的两侧保持有一预定距离。
如此,由于该第一接地脚151位于两排端子13、14的该等焊接部131、141之间,故,该第一接地脚151将能在该等对应的焊接部131、141间形成一屏蔽效果,防止两排端子13、14的焊接部131、141间发生信号相互干扰的问题。发明人在测试过程中,更发现该第一接地脚151的自由端与该间隔区域P10的两侧需保持有一预定距离,据此,始能充分发挥其屏蔽效果。
根据Type-C连接器的规格,该等第一端子13中还包括二对第一高频端子,该等第二端子14中则包括两对第二高频端子,为便于描述其相对位置,兹以图4的电路板P平面图进行说明:该等第一高频端子及第二高频端子分别焊接至图4中深色区块的第一高频接点P111及第二高频接点P121上,该等第一高频端子及该等第二高频端子的焊接部位置(即,第一高频接点P111及第二高频接点P121的位置)是相互对应,且该第一接地脚151的自由端焊接至该间隔区域P10内对应于该等第一高频端子及该等第二高频端子之间的位置,据此,将能进一步隔绝该等高频端子间的信号干扰。
举例而言,当该等第一高频接点P111及第二高频接点P121的位置如图4所示时,该第一接地脚151的自由端与该间隔区域P10的两侧的距离D1介于0.05~2.9厘米为佳(最佳值为0.3~0.5厘米之间);此外,在本实施例中,该等第一接点P11及第二接点P12间的距离D2介于0.3厘米~5厘米之间,如此,其面积始能供焊接该第一接地脚151,而不会与其他接点P11、P12相短路,优选范围则为0.90厘米~5厘米之间。
根据测试结果,当该第一接地脚151被焊接至该间隔区域P10内对应于该等高频端子(高频接点P111、P121)之间的位置时,无论是在特征阻抗(Simulated Characteristicimpedance)、插入损耗(Simulated insertion loss)、返回损耗(Simulated return loss)等数据上均优于现有结构(即,接地片并未延伸至焊接位置的连接器),且在高频信号传输时,也完全不会产生近端串音(Simulated NEXT)的问题。
此外,在图1~4所示的图式中,该等端子13、14采用贴片式(Surface MountTechnology,SMT)焊接至该电路板P上,但是,实际操作上,该等端子13、14也可通过插板式(Dual-In line Package,DIP),焊接至该电路板P上的穿孔中,且该电路板P之间隔区域P10内设有至少一第一接地孔P13,该第一接地脚151的自由端穿过该第一接地孔P13,并通过焊料(如:锡膏)焊接至该电路板P上。
又,在本实施例中,其中,该接地片15上设有两支第一接地脚151,且还设有两个第二接地脚152,各该第二接地脚152的自由端则能焊接至该电路板P上邻近该间隔区域P10的两侧的位置,以进一步提升屏蔽效果。同理,该电路板P上邻近该间隔区域P10的两侧的位置可分别设置一第二接地孔P14,令该第二接地脚152的自由端穿过该第二接地孔P14,并通过焊料(如:锡膏)焊接至该电路板P上。
此外,复请参阅图4所示,为简化焊接工序、并提升接地效果,该电路板P中位于最两侧的第一接点P11及第二接点P12(属于接地接点),还能分别与相邻的该第二接地孔P14一并焊接,形成短路,令接地效果更为完善。
以上所述,仅为本发明的若干优选实施例,但是,本发明的技术特征并不局限于此,凡本技术领域技术人员,在参酌本发明的技术内容后,所能轻易思及的等效变化,均应不脱离本发明的保护范畴。
Claims (10)
1.一种利用接地片的接地脚降低双排端子间信号干扰的连接器,至少包括一绝缘座体、多支第一端子、多支第二端子及一接地片,该等第一端子嵌设于该绝缘座体上邻近顶部的位置、该等第二端子嵌设于该绝缘座体的上邻近底部的位置、该接地片则嵌设于该绝缘座体内对应于该等第一端子及该等第二端子间的部位,该连接器的特征在于:
该等第一端子的后端分别设有一第一焊接部,该等第一焊接部沿水平方向排列,且其自由端能分别被焊接至一电路板上的第一接点;
该等第二端子的后端分别设有一第二焊接部,该等第二焊接部也沿水平方向排列,且其自由端是能分别被焊接至该电路板上的第二接点,以使该等第二焊接部能与对应的该等第一焊接部间分别保持一间隔距离,该电路板上对应于该等第一焊接部及第二焊接部间的区域则形成有一间隔区域;及
该接地片的后端设有至少一第一接地脚,该第一接地脚的自由端能延伸至该等第一焊接部及第二焊接部之间,且能被焊接至该电路板上的间隔区域内,该第一接地脚与该间隔区域的两侧保持有一预定距离。
2.如权利要求1所述的连接器,其中,该等第一端子中包括二对第一高频端子,该等第二端子中则包括两对第二高频端子,该等第一高频端子及该等第二高频端子的焊接部位置相互对应,且该第一接地脚的自由端焊接至该间隔区域内对应于该等第一高频端子及该等第二高频端子之间的位置。
3.如权利要求2所述的连接器,其中,该第一接地脚的自由端与该间隔区域的两侧的距离介于0.05厘米~2.9厘米之间。
4.如权利要求3所述的连接器,其中,该第一接地脚的自由端与该间隔区域的两侧的距离介于0.3厘米~0.5厘米之间。
5.如权利要求4所述的连接器,其中,该等第一接点及第二接点间的距离介于0.3厘米~5厘米之间。
6.如权利要求5所述的连接器,其中,该等第一接点及第二接点间的距离介于0.90厘米~5厘米之间。
7.如权利要求6所述的连接器,其中,该电路板的间隔区域内设有至少一第一接地孔,该第一接地脚的自由端穿过该第一接地孔,并通过焊料焊接至该电路板上。
8.如权利要求7所述的连接器,其中,该接地片上设有两支该第一接地脚。
9.如权利要求8所述的连接器,其中,该接地片上还设有两个第二接地脚,各该第二接地脚的自由端被焊接至该电路板上邻近该间隔区域的两侧的位置。
10.如权利要求9所述的连接器,其中,该电路板上邻近该间隔区域的两侧的位置分别设有一第二接地孔,该第二接地脚的自由端穿过该第二接地孔,并通过焊料焊接至该电路板上。
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