WO2012091406A3 - 배기 유체 처리 장치 - Google Patents
배기 유체 처리 장치 Download PDFInfo
- Publication number
- WO2012091406A3 WO2012091406A3 PCT/KR2011/010150 KR2011010150W WO2012091406A3 WO 2012091406 A3 WO2012091406 A3 WO 2012091406A3 KR 2011010150 W KR2011010150 W KR 2011010150W WO 2012091406 A3 WO2012091406 A3 WO 2012091406A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- process chamber
- fluid
- pipe
- plasma
- processing exhaust
- Prior art date
Links
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F01—MACHINES OR ENGINES IN GENERAL; ENGINE PLANTS IN GENERAL; STEAM ENGINES
- F01N—GAS-FLOW SILENCERS OR EXHAUST APPARATUS FOR MACHINES OR ENGINES IN GENERAL; GAS-FLOW SILENCERS OR EXHAUST APPARATUS FOR INTERNAL COMBUSTION ENGINES
- F01N3/00—Exhaust or silencing apparatus having means for purifying, rendering innocuous, or otherwise treating exhaust
- F01N3/08—Exhaust or silencing apparatus having means for purifying, rendering innocuous, or otherwise treating exhaust for rendering innocuous
- F01N3/0892—Electric or magnetic treatment, e.g. dissociation of noxious components
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01D—SEPARATION
- B01D53/00—Separation of gases or vapours; Recovering vapours of volatile solvents from gases; Chemical or biological purification of waste gases, e.g. engine exhaust gases, smoke, fumes, flue gases, aerosols
- B01D53/32—Separation of gases or vapours; Recovering vapours of volatile solvents from gases; Chemical or biological purification of waste gases, e.g. engine exhaust gases, smoke, fumes, flue gases, aerosols by electrical effects other than those provided for in group B01D61/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01D—SEPARATION
- B01D2257/00—Components to be removed
- B01D2257/20—Halogens or halogen compounds
- B01D2257/202—Single element halogens
- B01D2257/2025—Chlorine
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01D—SEPARATION
- B01D2257/00—Components to be removed
- B01D2257/20—Halogens or halogen compounds
- B01D2257/202—Single element halogens
- B01D2257/2027—Fluorine
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01D—SEPARATION
- B01D2257/00—Components to be removed
- B01D2257/20—Halogens or halogen compounds
- B01D2257/204—Inorganic halogen compounds
- B01D2257/2047—Hydrofluoric acid
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01D—SEPARATION
- B01D2258/00—Sources of waste gases
- B01D2258/02—Other waste gases
- B01D2258/0216—Other waste gases from CVD treatment or semi-conductor manufacturing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01D—SEPARATION
- B01D2259/00—Type of treatment
- B01D2259/80—Employing electric, magnetic, electromagnetic or wave energy, or particle radiation
- B01D2259/818—Employing electrical discharges or the generation of a plasma
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05H—PLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
- H05H1/00—Generating plasma; Handling plasma
- H05H1/24—Generating plasma
- H05H1/2406—Generating plasma using dielectric barrier discharges, i.e. with a dielectric interposed between the electrodes
- H05H1/2443—Generating plasma using dielectric barrier discharges, i.e. with a dielectric interposed between the electrodes the plasma fluid flowing through a dielectric tube
- H05H1/246—Generating plasma using dielectric barrier discharges, i.e. with a dielectric interposed between the electrodes the plasma fluid flowing through a dielectric tube the plasma being activated using external electrodes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05H—PLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
- H05H2245/00—Applications of plasma devices
- H05H2245/10—Treatment of gases
- H05H2245/17—Exhaust gases
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Analytical Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- General Chemical & Material Sciences (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Combustion & Propulsion (AREA)
- General Engineering & Computer Science (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Fluid Mechanics (AREA)
- Physical Or Chemical Processes And Apparatus (AREA)
- Treating Waste Gases (AREA)
- Drying Of Semiconductors (AREA)
- Chemical Vapour Deposition (AREA)
Abstract
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP11852372.9A EP2659946B1 (en) | 2010-12-27 | 2011-12-27 | Apparatus for processing exhaust fluid |
JP2013547330A JP2014508029A (ja) | 2010-12-27 | 2011-12-27 | 排気流体処理装置 |
US13/976,328 US9494065B2 (en) | 2010-12-27 | 2011-12-27 | Apparatus for processing exhaust fluid |
CN201180063273.5A CN104220145B (zh) | 2010-12-27 | 2011-12-27 | 用于处理排放流体的装置 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-2010-0135260 | 2010-12-27 | ||
KR1020100135260A KR101230513B1 (ko) | 2010-12-27 | 2010-12-27 | 배기 유체 처리 장치 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2012091406A2 WO2012091406A2 (ko) | 2012-07-05 |
WO2012091406A3 true WO2012091406A3 (ko) | 2012-08-23 |
Family
ID=46383683
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/KR2011/010150 WO2012091406A2 (ko) | 2010-12-27 | 2011-12-27 | 배기 유체 처리 장치 |
Country Status (6)
Country | Link |
---|---|
US (1) | US9494065B2 (ko) |
EP (1) | EP2659946B1 (ko) |
JP (1) | JP2014508029A (ko) |
KR (1) | KR101230513B1 (ko) |
CN (1) | CN104220145B (ko) |
WO (1) | WO2012091406A2 (ko) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101453860B1 (ko) * | 2013-05-31 | 2014-10-22 | 한국기계연구원 | 플라즈마 히터 |
CN106165062A (zh) * | 2014-04-16 | 2016-11-23 | 清洁要素技术有限公司 | 处理制程设备发生的废气的等离子体反应器 |
WO2015160057A1 (ko) * | 2014-04-16 | 2015-10-22 | 주식회사 클린팩터스 | 공정설비에서 발생되는 배기가스 처리 플라즈마 반응기 |
KR101557880B1 (ko) * | 2014-07-07 | 2015-10-13 | (주)클린팩터스 | 배기유체 처리용 저압 플라즈마 반응장치 |
JP6371738B2 (ja) * | 2015-05-28 | 2018-08-08 | 株式会社東芝 | 成膜装置 |
KR101732048B1 (ko) * | 2015-07-07 | 2017-05-02 | (주)클린팩터스 | 공정설비에서 발생되는 배기가스 처리 플라즈마 반응기 |
KR101926658B1 (ko) | 2017-03-15 | 2018-12-07 | 이인철 | 반도체 챔버용 펌프 시스템 |
US20190078204A1 (en) * | 2017-09-12 | 2019-03-14 | Applied Materials, Inc. | Tubular electrostatic device |
KR101999646B1 (ko) | 2018-11-15 | 2019-07-12 | 이인철 | 반도체 챔버용 펌프 시스템 |
KR102197144B1 (ko) * | 2019-03-29 | 2021-01-05 | 유한회사 더프라임솔루션 | 아킹현상을 방지하는 저온 플라즈마 배출가스 입자상 물질 저감 장치 |
JP7494059B2 (ja) | 2020-08-27 | 2024-06-03 | キオクシア株式会社 | 排気配管装置 |
KR102376859B1 (ko) * | 2020-09-28 | 2022-03-22 | 주식회사 플랜 | 반도체 제조 설비의 배기 유체 처리 시스템 및 방법 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06178914A (ja) * | 1992-12-14 | 1994-06-28 | Mitsubishi Heavy Ind Ltd | 排ガス処理装置 |
KR20060095594A (ko) * | 2005-02-28 | 2006-09-01 | 엄환섭 | 반도체 세정 폐가스 제거를 위한 플라즈마 스크러버 |
KR20100027383A (ko) * | 2008-09-02 | 2010-03-11 | (주)트리플코어스코리아 | 저압 및 대기압 플라즈마를 이용한 폐가스 제거 시스템 |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2569739B2 (ja) | 1988-07-12 | 1997-01-08 | 三菱電機株式会社 | 酸素原子発生方法および装置 |
US6685803B2 (en) * | 2001-06-22 | 2004-02-03 | Applied Materials, Inc. | Plasma treatment of processing gases |
JP3607890B2 (ja) * | 2001-11-22 | 2005-01-05 | 東芝三菱電機産業システム株式会社 | オゾン発生器 |
TWI232467B (en) * | 2001-11-30 | 2005-05-11 | Mitsui Chemicals Inc | Paste for circuit connection, anisotropic conductive paste and uses thereof |
TW497986B (en) | 2001-12-20 | 2002-08-11 | Ind Tech Res Inst | Dielectric barrier discharge apparatus and module for perfluorocompounds abatement |
JP2003282465A (ja) | 2002-03-26 | 2003-10-03 | Hitachi Ltd | 半導体装置の製造方法 |
JP2004223365A (ja) | 2003-01-21 | 2004-08-12 | Rohm Co Ltd | ガス処理装置 |
JP2004237162A (ja) * | 2003-02-04 | 2004-08-26 | Seiko Epson Corp | ガス処理装置および半導体装置の製造方法 |
JP2005240634A (ja) | 2004-02-25 | 2005-09-08 | Toyota Motor Corp | 排ガス浄化プラズマリアクター |
CN1724117B (zh) * | 2004-06-29 | 2012-10-03 | 三菱电机株式会社 | 挥发性有机化合物处理装置 |
JP4466422B2 (ja) * | 2004-06-29 | 2010-05-26 | 三菱電機株式会社 | 揮発性有機化合物処理装置 |
JP2006029212A (ja) * | 2004-07-15 | 2006-02-02 | Toyota Motor Corp | 排ガス浄化装置 |
JP4270090B2 (ja) * | 2004-09-28 | 2009-05-27 | トヨタ自動車株式会社 | 排ガス浄化装置 |
JP2007044628A (ja) * | 2005-08-10 | 2007-02-22 | Osaka Prefecture Univ | 半導体プロセス用排ガス処理方法及び処理装置 |
GB0521944D0 (en) * | 2005-10-27 | 2005-12-07 | Boc Group Plc | Method of treating gas |
KR100675752B1 (ko) * | 2006-09-14 | 2007-01-30 | (주) 씨엠테크 | 플라즈마 반응기 |
DE102008041657A1 (de) | 2008-08-28 | 2010-03-04 | Robert Bosch Gmbh | Verfahren zum Verkleben von Bauteilen unter Ausbildung einer temperaturbeständigen Klebstoffschicht |
JP4955027B2 (ja) * | 2009-04-02 | 2012-06-20 | クリーン・テクノロジー株式会社 | 排ガス処理装置における磁場によるプラズマの制御方法 |
-
2010
- 2010-12-27 KR KR1020100135260A patent/KR101230513B1/ko active IP Right Grant
-
2011
- 2011-12-27 CN CN201180063273.5A patent/CN104220145B/zh active Active
- 2011-12-27 WO PCT/KR2011/010150 patent/WO2012091406A2/ko active Application Filing
- 2011-12-27 US US13/976,328 patent/US9494065B2/en active Active
- 2011-12-27 EP EP11852372.9A patent/EP2659946B1/en active Active
- 2011-12-27 JP JP2013547330A patent/JP2014508029A/ja active Pending
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06178914A (ja) * | 1992-12-14 | 1994-06-28 | Mitsubishi Heavy Ind Ltd | 排ガス処理装置 |
KR20060095594A (ko) * | 2005-02-28 | 2006-09-01 | 엄환섭 | 반도체 세정 폐가스 제거를 위한 플라즈마 스크러버 |
KR20100027383A (ko) * | 2008-09-02 | 2010-03-11 | (주)트리플코어스코리아 | 저압 및 대기압 플라즈마를 이용한 폐가스 제거 시스템 |
Also Published As
Publication number | Publication date |
---|---|
CN104220145B (zh) | 2016-12-07 |
US20140004009A1 (en) | 2014-01-02 |
US9494065B2 (en) | 2016-11-15 |
KR20120073482A (ko) | 2012-07-05 |
KR101230513B1 (ko) | 2013-02-06 |
EP2659946B1 (en) | 2018-08-15 |
EP2659946A4 (en) | 2014-09-17 |
EP2659946A2 (en) | 2013-11-06 |
WO2012091406A2 (ko) | 2012-07-05 |
CN104220145A (zh) | 2014-12-17 |
JP2014508029A (ja) | 2014-04-03 |
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