TW201130036A - A local plasma confinement and pressure control arrangement and methods thereof - Google Patents

A local plasma confinement and pressure control arrangement and methods thereof

Info

Publication number
TW201130036A
TW201130036A TW99129272A TW99129272A TW201130036A TW 201130036 A TW201130036 A TW 201130036A TW 99129272 A TW99129272 A TW 99129272A TW 99129272 A TW99129272 A TW 99129272A TW 201130036 A TW201130036 A TW 201130036A
Authority
TW
Taiwan
Prior art keywords
pressure control
peripheral ring
ring
arrangement
methods
Prior art date
Application number
TW99129272A
Other languages
Chinese (zh)
Other versions
TWI524416B (en
Inventor
Rajinder Dhindsa
Mike Kellog
Babak Kadkodyan
Andrew Bailey
Original Assignee
Lam Res Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lam Res Corp filed Critical Lam Res Corp
Publication of TW201130036A publication Critical patent/TW201130036A/en
Application granted granted Critical
Publication of TWI524416B publication Critical patent/TWI524416B/en

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  • Plasma Technology (AREA)
  • Drying Of Semiconductors (AREA)

Abstract

An arrangement for performing pressure control in a processing chamber is discussed. The arrangement includes a peripheral ring configured at least for surrounding a confined chamber volume that is configured for sustaining a plasma for etching the substrate during substrate processing. The peripheral ring includes a plurality of slots that is configured at least for exhausting processed byproduct gas from the confined chamber volume during substrate processing. The arrangement also includes a conductive control ring that is positioned next to the peripheral ring and is configured to include plurality of slots. The pressure control is achieved by moving the conductive control ring relative to the peripheral ring such that a first slot on the peripheral ring and a second slot on the conductive control ring are offset with respect to one another in a range of zero offset to full offset.
TW099129272A 2009-08-31 2010-08-31 A local plasma confinement and pressure control arrangement and methods thereof TWI524416B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US23866509P 2009-08-31 2009-08-31

Publications (2)

Publication Number Publication Date
TW201130036A true TW201130036A (en) 2011-09-01
TWI524416B TWI524416B (en) 2016-03-01

Family

ID=50180094

Family Applications (1)

Application Number Title Priority Date Filing Date
TW099129272A TWI524416B (en) 2009-08-31 2010-08-31 A local plasma confinement and pressure control arrangement and methods thereof

Country Status (1)

Country Link
TW (1) TWI524416B (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI550711B (en) * 2011-11-16 2016-09-21 蘭姆研究公司 System, method and apparatus of a wedge-shaped parallel plate plasma reactor for substrate processing
TWI624895B (en) * 2015-12-21 2018-05-21 Advanced Micro Fab Equip Inc Plasma confinement ring, plasma processing device and substrate processing method

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI550711B (en) * 2011-11-16 2016-09-21 蘭姆研究公司 System, method and apparatus of a wedge-shaped parallel plate plasma reactor for substrate processing
TWI624895B (en) * 2015-12-21 2018-05-21 Advanced Micro Fab Equip Inc Plasma confinement ring, plasma processing device and substrate processing method

Also Published As

Publication number Publication date
TWI524416B (en) 2016-03-01

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