WO2012086278A1 - 異方性導電接着フィルム、接続構造体及びその製造方法 - Google Patents

異方性導電接着フィルム、接続構造体及びその製造方法 Download PDF

Info

Publication number
WO2012086278A1
WO2012086278A1 PCT/JP2011/071580 JP2011071580W WO2012086278A1 WO 2012086278 A1 WO2012086278 A1 WO 2012086278A1 JP 2011071580 W JP2011071580 W JP 2011071580W WO 2012086278 A1 WO2012086278 A1 WO 2012086278A1
Authority
WO
WIPO (PCT)
Prior art keywords
anisotropic conductive
terminal
conductive particles
adhesive film
flexible substrate
Prior art date
Application number
PCT/JP2011/071580
Other languages
English (en)
French (fr)
Japanese (ja)
Inventor
雄太 荒木
剛志 田巻
浅栄 高林
朋之 石松
Original Assignee
ソニーケミカル＆インフォメーションデバイス株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ソニーケミカル＆インフォメーションデバイス株式会社 filed Critical ソニーケミカル＆インフォメーションデバイス株式会社
Priority to KR1020127011026A priority Critical patent/KR101410185B1/ko
Priority to CN201180004885.7A priority patent/CN102668251B/zh
Publication of WO2012086278A1 publication Critical patent/WO2012086278A1/ja
Priority to HK12112615.6A priority patent/HK1171871A1/zh

Links

Images

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/10—Adhesives in the form of films or foils without carriers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C08K2003/0862—Nickel
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/16—Solid spheres
    • C08K7/18—Solid spheres inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/314—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive layer and/or the carrier being conductive
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/50—Additional features of adhesives in the form of films or foils characterized by process specific features
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/023—Hard particles, i.e. particles in conductive adhesive at least partly penetrating an electrode

Definitions

  • the present invention provides an anisotropic conductive adhesive film for anisotropic conductive connection between a terminal of a flexible substrate and a terminal of a rigid substrate, and the terminals of the flexible substrate and the rigid substrate are different from each other using the anisotropic conductive adhesive film.
  • the present invention relates to a connection structure that is isotropically conductively connected and a method for manufacturing the same.
  • the conductive particles of the anisotropic conductive adhesive film in which the conductive particles are dispersed in the binder resin composition the conductive particles themselves are deformed by heat and pressure treatment during anisotropic conductive connection.
  • it is widely used to form an electroless nickel thin film on the surface of the resin core particles and, if necessary, an electroless gold flash plating thin film (Patent) Reference 1).
  • connection structure obtained by anisotropic conductive connection between a terminal of a flexible substrate and a terminal of a rigid substrate such as a glass substrate using an anisotropic conductive adhesive film containing such conductive particles is different.
  • Patent Document 2 a connection structure obtained by anisotropic conductive connection between a terminal of a flexible substrate and a terminal of a rigid substrate using the anisotropic conductive adhesive film described in Patent Document 1 is described in Patent Document 2.
  • indentation of the terminal is observed from the side of the flexible substrate, the conductive particles are too flexible, and the conductive particles do not sufficiently penetrate into the terminal of the flexible substrate, so that there is no indentation that can be observed on the terminal. It was.
  • connection resistance increases and connection reliability may decrease.
  • An object of the present invention is to solve the above-described problems of the prior art, and is obtained by anisotropic conductive connection between a terminal of a flexible substrate and a terminal of a rigid substrate using an anisotropic conductive adhesive film. Further, it is intended to allow the connection structure to observe the indentation of the terminal from the flexible substrate side and to ensure good connection reliability even when stored in a high temperature and high humidity environment.
  • the present inventors have made the conductive particles of the anisotropic conductive adhesive film not the terminals of the rigid substrate but the flexible substrate. It has been found that the above-mentioned object can be achieved by sufficiently biting into the terminal, and the present invention has been completed.
  • the present invention is an anisotropic conductive adhesive film for anisotropic conductive connection between a terminal of a flexible substrate and a terminal of a rigid substrate, in which conductive particles are dispersed in a binder resin composition.
  • the conductive conductive adhesive film when the particle diameter of the conductive particles after the anisotropic conductive connection is A and the gap between the terminal of the flexible substrate and the terminal of the rigid substrate is B, 100 ⁇ (AB)
  • the conductive particles have a particle diameter of 4 ⁇ m or more and a compression hardness of 4500 kgf / mm 2 or more so that the indentation rate defined by / A is 40% or more, and the maximum diameter of the conductive particles is a
  • the anisotropic conductive adhesive film is characterized in that when the minimum diameter is b, the sphericity of the conductive particles represented by a / b is 5 or less.
  • the present invention provides a connection structure in which terminals of a flexible substrate and terminals of a rigid substrate are anisotropically conductively connected via an anisotropic conductive adhesive film in which conductive particles are dispersed in a binder resin composition.
  • the conductive particles of the anisotropic conductive adhesive film to be sandwiched between the terminals of the flexible substrate and the rigid substrate have a particle diameter of 4 ⁇ m or more and a compression hardness of 4500 kgf / mm 2 or more.
  • the conductivity is set so that the indentation rate defined by 100 ⁇ (AB) / A is 40% or more.
  • Particles are flexible substrates It provides a connection structure characterized in that bite into the terminal.
  • the present invention is a method for manufacturing the above-described connection structure, wherein the anisotropic conductive adhesive film of the present invention is temporarily attached to a terminal of a rigid substrate, and the anisotropic conductive adhesive film is sandwiched between the rigid conductive substrates.
  • the flexible substrate is arranged so that the terminals of the flexible substrate correspond to the terminals of the substrate, the particle diameter of the conductive particles after the anisotropic conductive connection is A, and between the terminals of the flexible substrate and the rigid substrate Heating and pressing the anisotropic conductive adhesive film with a heating bonder from the flexible substrate side so that the indentation rate defined by 100 ⁇ (AB) / A is 40% or more when the gap is B
  • anisotropic conductive connection is performed.
  • the particle diameter, compression hardness, and sphericity of the conductive particles are limited to specific ranges, respectively. Therefore, when the particle diameter of the conductive particles in the connection structure after anisotropic conductive connection is A, and the gap between the terminal of the flexible substrate and the terminal of the rigid substrate is B, 100 ⁇ (AB) ) / A, the indentation rate can be 40% or more. Therefore, the indentation of the terminal can be observed from the flexible substrate side of the connection structure, and good connection reliability can be ensured even when stored in a high temperature and high humidity environment.
  • the anisotropic conductive adhesive film of the present invention is made of a resin substrate such as polyimide, polyester, polyamide, polysulfone, a terminal of a flexible substrate in which copper wiring, aluminum wiring, etc. are formed, and a glass substrate, ceramic substrate, glass epoxy
  • a glass substrate is mentioned in terms of transparency.
  • a semiconductor chip or the like may be mounted on the flexible substrate or the rigid substrate. Further, the terminals of each substrate may be plated with gold as necessary.
  • the particle diameter of the conductive particles 1 after anisotropic conductive connection is A
  • the gap between the terminal 3 of the rigid substrate 2 and the terminal 5 of the flexible substrate 4 is B.
  • the indentation rate defined by 100 ⁇ (AB) / A is 40% or more, preferably 60% or more.
  • the indentation of a terminal can be observed from the flexible substrate side, and it can be made not to increase the connection resistance of the anisotropic conductive connection part by an anisotropic conductive adhesive film under a thermal humidity test.
  • the indentation rate is 0% (when AB is 0)
  • the indentation rate is 100% (when B is 0)
  • the particle diameter of the conductive particles constituting the anisotropic conductive adhesive film of the present invention is 4 ⁇ m or more, preferably 6 ⁇ m or more, because if the particle diameter is too small, it becomes difficult to make indentations on the terminals of the flexible substrate.
  • the upper limit of the particle diameter can be appropriately determined according to the pitch and thickness variation of the terminals to be connected, but is preferably 15 ⁇ m or less.
  • a more preferable particle diameter range is 6 to 10 ⁇ m.
  • the compression hardness of the conductive particles used in the present invention is 4500 kgf / mm 2 or more, preferably 6000 kgf / mm 2 or more because if the compression hardness of the conductive particles is too low, it becomes difficult to make indentations on the terminals of the flexible substrate. Moreover, since there exists a tendency for connection reliability to fall when too high, 7000 kgf / mm ⁇ 2 > or less is desirable.
  • the compression hardness is synonymous with the compression strength at the time of 10% compression displacement, and can be measured using a general micro compression tester.
  • the conductive particles used in the present invention have a sphericity of 5 or less when the maximum diameter obtained by observation with a metal microscope is a and the minimum diameter is b. It exhibits a sphericity, preferably a sphericity of 3 or less. This is because if the sphericity exceeds 5, the connection reliability tends to decrease. If the maximum diameter a is too small, indentation tends to be difficult to develop, and if it is too large, anisotropic conductivity tends to decrease. Therefore, the maximum diameter a is preferably 4 to 15 ⁇ m, more preferably 6 to 10 ⁇ m.
  • the minimum diameter b is too small, indentation tends to be difficult to develop, and if it is too large, anisotropic conductivity tends to decrease, so it is preferably 4 to 15 ⁇ m, more preferably 6 to 10 ⁇ m.
  • the sphericity is logically always 1 or more.
  • Examples of the conductive particles having the properties described above include nickel, cobalt, silver, copper, gold, palladium, solder and other metal particles, divinylbenzene-based resin, benzoguanamine resin and other resin particles on the surface thereof. Those having an electroless plating film formed thereon can be applied.
  • a binder resin composition used for a known anisotropic conductive adhesive film can be employed.
  • it can be composed of a film-forming resin, a liquid epoxy compound (curing component) or an acrylic monomer (curing component), a curing agent, a silane coupling agent, and the like.
  • the film-forming resin examples include phenoxy resin, epoxy resin, unsaturated polyester resin, saturated polyester resin, urethane resin, butadiene resin, polyimide resin, polyamide resin, polyolefin resin, and the like. be able to.
  • a phenoxy resin can be preferably used from the viewpoint of film forming property, workability, and connection reliability.
  • liquid epoxy compound examples include bisphenol A type epoxy compounds, bisphenol F type epoxy compounds, novolac type epoxy compounds, modified epoxy compounds thereof, alicyclic epoxy compounds, and the like. Can do.
  • curing agent examples include anionic curing agents such as polyamines and imidazoles, cationic curing agents such as sulfonium salts, and latent curing agents such as phenolic curing agents.
  • Acrylic monomers include methyl (meth) acrylate, ethyl (meth) acrylate, isopropyl (meth) acrylate, isobutyl (meth) acrylate, ethylene glycol (meth) acrylate, ethylene glycol di (meth) acrylate, diethylene glycol di (meth) acrylate , Trimethylolpropane tri (meth) acrylate, tetramethylolmethane tetra (meth) acrylate, and the like.
  • the curing agent radiation polymerization initiator
  • examples of the curing agent include organic peroxides and azobisbutyronitrile.
  • silane coupling agent examples include an epoxy silane coupling agent and an acrylic silane coupling agent. These silane coupling agents are mainly alkoxysilane derivatives.
  • a filler In the binder resin composition, a filler, a softening agent, an accelerator, an anti-aging agent, a colorant (pigment, dye), an organic solvent, an ion catcher agent, and the like can be blended as necessary.
  • the content of the conductive particles in the anisotropic conductive adhesive film of the present invention is too small, the connection reliability is lowered, and if it is too large, the anisotropic conductivity is lowered. Therefore, the content is preferably 0.3 to 30% by mass. More preferably, it is 5 to 10% by mass.
  • the thickness of the anisotropic conductive adhesive film of the present invention is not particularly limited, but is usually 10 to 45 ⁇ m.
  • the anisotropic conductive adhesive of the present invention can be prepared by charging a binder resin composition component and conductive particles into a stirring vessel and mixing them according to a conventional method.
  • connection structure of the present invention manufactured using the anisotropic conductive film of the present invention will be described.
  • connection structure of the present invention the terminal of the flexible substrate and the terminal of the rigid substrate as described above are anisotropic through an anisotropic conductive adhesive film in which conductive particles are dispersed in a binder resin composition.
  • a conductively connected connection structure characterized in that the anisotropic conductive film of the present invention is used as an anisotropic conductive adhesive film to be sandwiched between a terminal of a flexible substrate and a terminal of a rigid substrate.
  • the particle diameter of the conductive particles after anisotropic conductive connection is A, and between the terminals of the flexible substrate and the rigid substrate.
  • the conductive particles bite into the terminals of the flexible substrate so that the indentation rate defined by 100 ⁇ (AB) / A is 40% or more, preferably 60% or more. It has a structure. In this case, in order to facilitate observation of the indentation of the conductive particles from the flexible substrate, it is preferable that the conductive particles do not bite into the terminals of the rigid substrate.
  • connection structure of the present invention examples include a liquid crystal display device, an organic EL display device, a solar cell module, an LED lighting device, and the like.
  • connection structure of the present invention can be manufactured as described below.
  • the anisotropic conductive adhesive film of the present invention is temporarily attached on a terminal of a rigid substrate according to a conventional method.
  • a flexible substrate is arrange
  • anisotropic conductive connection is performed by heating and pressing the anisotropic conductive adhesive film with a heating bonder from the flexible substrate side.
  • the particle diameter of the conductive particles after anisotropic conductive connection is A and the gap between the terminal of the flexible substrate and the terminal of the rigid substrate is B, 100 ⁇ (AB) / A
  • Anisotropic conductive connection is performed in consideration of the blending composition of the binder resin composition, the material of the conductive particles, the surface state of the terminal, and the like so that the defined indentation rate is 40% or more. Thereby, the connection structure of the present invention can be obtained.
  • the indentation rate can be controlled by adjusting the heating and pressing conditions at the time of anisotropic conductive connection. For example, the indentation rate can be increased by lowering the heating temperature or increasing the pressure. Conversely, the indentation rate can be lowered by increasing the heating temperature or decreasing the pressure. Moreover, it can also adjust by selecting raw materials, such as a flexible substrate, a rigid substrate, those terminals, and electroconductive particle. Moreover, it can also adjust combining them.
  • Examples 1 to 13 and Comparative Examples 2 to 5 Preparation of conductive particles 100 g of nickel particles having an average particle size shown in Table 1 were stirred in an aqueous solution of hydrochloric acid 50 mL / L for 5 minutes. The nickel particles that had been filtered and washed once with repulp water were charged with 1 L (pH 6, temperature 60 ° C.) of an aqueous solution containing EDTA-4Na (10 g / L) and citric acid-2Na (10 g / L). Added to the reaction vessel with stirring.
  • the mixed solution is filtered, and the filtrate is washed with repulp water three times, and then dried using hot air at 100 ° C. to form an electroless gold plating thin film having a thickness of about 10 to 20 nm on the nickel powder surface. Sex particles were obtained.
  • the average particle diameter of the conductive particles can be approximated to the average particle diameter of the raw material nickel particles because the electroless gold-plated thin film is very thin.
  • the average particle diameter of the nickel particles is a particle diameter at a point where the cumulative mass corresponds to 50% when the particle size distribution is measured by a laser diffraction scattering method (measuring device: Microtrac MT3100, Nikkiso Co., Ltd.).
  • the sphericity of the conductive particles is obtained by photographing the conductive particles using a metal microscope (MX51, Olympus Corporation), obtaining the maximum diameter a and the minimum diameter b of the particles, and calculating a / b as the sphericity. Calculated. The obtained results are shown in Table 1.
  • anisotropic conductive adhesive film 5 parts by mass of conductive particles, 22 parts by mass of phenoxy resin (YP-50, Nippon Kasei Manufacturing Co., Ltd.), 5 parts by mass of dicyclopentadiene dimethacrylate (DCP, Shin-Nakamura Chemical Co., Ltd.), urethane acrylate (M-1600, Toagosei Co., Ltd.) 10 parts by mass, acrylic rubber (SG-80H, Nagase ChemteX Corporation) 5 parts by mass, phosphorus-containing methacrylate (PM2, Nippon Kayaku Co., Ltd.) 1 part by mass, 2 parts by mass of a diacyl peroxide initiator (Nyper BW, NOF Corporation) and 50 parts by mass of toluene were mixed, and the resulting mixture was applied to a release sheet so that the dry thickness was 35 ⁇ m, and 80 ° C. Was dried for 5 minutes to obtain an anisotropic conductive adhesive film.
  • phenoxy resin YP
  • anisotropic conductive adhesive film polyimide flexible substrate (polyimide thickness 38 ⁇ m, copper wiring pitch 200 ⁇ m, wiring height 8 ⁇ m) and printed wiring board (FR-4 grade, Panasonic Corporation: copper wiring pitch 200 ⁇ m) And a wiring height of 35 ⁇ m) were subjected to anisotropic conductive connection under the heating and pressing conditions of 170 ° C., 4 MPa, and 5 seconds to prepare a connection structure.
  • the cross section of the anisotropic conductive connection portion of the obtained connection structure is polished, and the particle diameter A and the inter-wiring gap B (inter-terminal gap between which conductive particles are sandwiched) are measured with a metal microscope.
  • the obtained results are shown in Table 1.
  • connection resistance of the obtained connection structure when stored for 500 hours in a high-temperature and high-humidity environment at a temperature of 85 ° C. and a humidity of 85% was measured, and the connection reliability was evaluated according to the following criteria.
  • the obtained results are shown in Table 1.
  • the evaluation result is desirably A or B.
  • connection portion of the connection structure is wired from the flexible substrate side using conductive particles.
  • the indentation of (terminal) was observed and the indentation state was evaluated according to the following criteria.
  • the obtained results are shown in Table 1.
  • the evaluation result is desirably A or B.
  • the indentation is caused by the deformation of the flexible substrate.
  • Comparative Example 1 A palladium catalyst was supported on the divinylbenzene resin particles (5 g) having an average particle diameter of 8 ⁇ m by an immersion method. Next, an electroless nickel plating solution (pH 12, plating solution temperature 50 ° C.) prepared from nickel sulfate hexahydrate, sodium hypophosphite, sodium citrate, triethanolamine and thallium nitrate is applied to the resin particles. Electroless nickel plating was performed, and nickel-coated resin core particles having a nickel plating layer (10 to 20 nm thick) formed on the surface were obtained as conductive particles.
  • an electroless nickel plating solution pH 12, plating solution temperature 50 ° C.
  • the obtained nickel-coated resin core particles were subjected to electroless gold plating in the same manner as in Example 1 to obtain Ni—Au-coated resin core particles as conductive particles.
  • the average particle diameter, compression hardness, and sphericity were determined in the same manner as in Example 1, and the obtained results are shown in Table 1.
  • the anisotropic conductive adhesive film was produced similarly to Example 1, the indentation rate of electroconductive particle was calculated
  • connection reliability was evaluated as C.
  • the indentation state evaluation was C because the average particle diameter of the conductive particles used was as small as 3 ⁇ m.
  • the indentation state evaluation was C because the indentation rate of the conductive particles was as low as 35%.
  • the anisotropic conductive adhesive film of the present invention limits the particle diameter, compression hardness, and sphericity of the conductive particles used to specific ranges. Therefore, when the particle diameter of the conductive particles in the connection structure after anisotropic conductive connection is A, and the gap between the terminal of the flexible substrate and the terminal of the rigid substrate is B, 100 ⁇ (AB) ) / A, the indentation rate can be 40% or more. Therefore, the indentation of the terminal can be observed from the flexible substrate side of the connection structure, and good connection reliability can be ensured even when stored in a high temperature and high humidity environment. Therefore, the anisotropic conductive adhesive film of the present invention is useful for anisotropic conductive connection between a flexible substrate and a rigid substrate.
PCT/JP2011/071580 2010-12-24 2011-09-22 異方性導電接着フィルム、接続構造体及びその製造方法 WO2012086278A1 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
KR1020127011026A KR101410185B1 (ko) 2010-12-24 2011-09-22 이방성 도전 접착 필름, 접속 구조체 및 그 제조 방법
CN201180004885.7A CN102668251B (zh) 2010-12-24 2011-09-22 各向异性导电粘合膜、连接结构体及其制备方法
HK12112615.6A HK1171871A1 (zh) 2010-12-24 2012-12-06 各向異性導電粘合膜、連接結構體及其製備方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2010-288005 2010-12-24
JP2010288005A JP6061443B2 (ja) 2010-12-24 2010-12-24 異方性導電接着フィルム、接続構造体及びその製造方法

Publications (1)

Publication Number Publication Date
WO2012086278A1 true WO2012086278A1 (ja) 2012-06-28

Family

ID=44014451

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2011/071580 WO2012086278A1 (ja) 2010-12-24 2011-09-22 異方性導電接着フィルム、接続構造体及びその製造方法

Country Status (5)

Country Link
JP (1) JP6061443B2 (zh)
KR (1) KR101410185B1 (zh)
CN (1) CN102668251B (zh)
HK (1) HK1171871A1 (zh)
WO (1) WO2012086278A1 (zh)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015003935A (ja) * 2011-10-20 2015-01-08 日立化成株式会社 接着剤組成物並びに接続構造体及びその製造方法
WO2013085485A1 (en) 2011-12-05 2013-06-13 Adaptive Spectrum And Signal Alignment, Inc. Systems and methods for traffic aggregation on multiple wan backhauls and multiple distinct lan networks
CN104342058B (zh) * 2014-10-25 2016-08-24 深圳飞世尔新材料股份有限公司 一种光固化异方性导电膜的制备方法
WO2016089414A1 (en) 2014-12-04 2016-06-09 Adaptive Spectrum And Signal Alignment, Inc Method and apparatus for predicting successful dsl line optimization
TWI774640B (zh) 2015-01-13 2022-08-21 日商迪睿合股份有限公司 凸塊形成用膜、半導體裝置及其製造方法、以及連接構造體
CN107534231B (zh) * 2015-05-27 2020-04-14 迪睿合株式会社 各向异性导电性膜及连接构造体
JP6659247B2 (ja) * 2015-06-16 2020-03-04 デクセリアルズ株式会社 接続体、接続体の製造方法、検査方法
CN105070351A (zh) * 2015-06-30 2015-11-18 苏州纳微科技有限公司 一种柔韧导电微球及其应用

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09312176A (ja) * 1996-05-23 1997-12-02 Hitachi Chem Co Ltd 接続部材および該接続部材を用いた電極の接続構造並びに接続方法
JPH11134935A (ja) * 1997-10-29 1999-05-21 Sekisui Finechem Co Ltd 導電性微粒子、異方性導電接着剤及び導電接続構造体
JP2002124128A (ja) * 2000-10-16 2002-04-26 Sony Chem Corp 接着剤、及び、接着フィルム
WO2009063827A1 (ja) * 2007-11-12 2009-05-22 Hitachi Chemical Company, Ltd. 回路接続材料、及び回路部材の接続構造

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3486346B2 (ja) * 1998-07-16 2004-01-13 ソニーケミカル株式会社 ベアチップ実装構造
JP3379456B2 (ja) * 1998-12-25 2003-02-24 ソニーケミカル株式会社 異方導電性接着フィルム
JP3738655B2 (ja) * 2000-03-31 2006-01-25 ソニーケミカル株式会社 異方性導電接着材料及び接続方法
JP2008091843A (ja) * 2006-10-04 2008-04-17 Takatori Corp 基板の圧着状態検査装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09312176A (ja) * 1996-05-23 1997-12-02 Hitachi Chem Co Ltd 接続部材および該接続部材を用いた電極の接続構造並びに接続方法
JPH11134935A (ja) * 1997-10-29 1999-05-21 Sekisui Finechem Co Ltd 導電性微粒子、異方性導電接着剤及び導電接続構造体
JP2002124128A (ja) * 2000-10-16 2002-04-26 Sony Chem Corp 接着剤、及び、接着フィルム
WO2009063827A1 (ja) * 2007-11-12 2009-05-22 Hitachi Chemical Company, Ltd. 回路接続材料、及び回路部材の接続構造

Also Published As

Publication number Publication date
JP6061443B2 (ja) 2017-01-18
HK1171871A1 (zh) 2013-04-05
CN102668251A (zh) 2012-09-12
KR101410185B1 (ko) 2014-06-19
KR20120099424A (ko) 2012-09-10
JP2011068913A (ja) 2011-04-07
CN102668251B (zh) 2015-04-29

Similar Documents

Publication Publication Date Title
JP6061443B2 (ja) 異方性導電接着フィルム、接続構造体及びその製造方法
JP5476280B2 (ja) 重合体粒子
US8932716B2 (en) Conductive particle, and anisotropic conductive film, bonded structure, and bonding method
TWI398880B (zh) Circuit connection material and circuit connection structure
TWI502608B (zh) 導電性粒子、異向性導電薄膜及接合體以及連接方法
WO2010125965A1 (ja) 回路接続材料、これを用いたフィルム状回路接続材料、回路部材の接続構造及び回路部材の接続方法
KR102649655B1 (ko) 접착제 조성물
TWI385676B (zh) An anisotropic conductive material, a connecting structure, and a method for manufacturing the same
JP2011040189A (ja) 導電性粒子、異方性導電材料及び接続構造体
US10177465B2 (en) Electrically conductive material
KR101886909B1 (ko) 이방성 도전 접속 재료, 접속 구조체, 접속 구조체의 제조 방법 및 접속 방법
JP2011060502A (ja) 絶縁粒子付き導電性粒子、異方性導電材料及び接続構造体
JP2012209097A (ja) 異方性導電材料及び接続構造体
JP5310750B2 (ja) 異方性導電フィルム
JP6870618B2 (ja) 回路接続用接着剤組成物及び構造体
JP2010159328A (ja) 導電性粒子、異方性導電材料及び接続構造体
JP2019044043A (ja) 回路接続用接着剤組成物及び構造体
JP2017063033A (ja) 導電性粒子、導電フィルム、接続構造体及び接続構造体の製造方法
TWI814761B (zh) 接著劑膜
TWI719054B (zh) 連接構造體之製造方法、導電性粒子、導電膜及連接構造體
TW201833941A (zh) 接著劑膜
TWI740807B (zh) 導電材料、連接構造體、及連接構造體之製造方法
JPWO2020009238A1 (ja) 絶縁性粒子付き導電性粒子、導電材料及び接続構造体

Legal Events

Date Code Title Description
ENP Entry into the national phase

Ref document number: 20127011026

Country of ref document: KR

Kind code of ref document: A

121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 11850891

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 11850891

Country of ref document: EP

Kind code of ref document: A1