WO2012066921A1 - パターン修正装置およびそれに用いられる加湿ユニット - Google Patents

パターン修正装置およびそれに用いられる加湿ユニット Download PDF

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Publication number
WO2012066921A1
WO2012066921A1 PCT/JP2011/074913 JP2011074913W WO2012066921A1 WO 2012066921 A1 WO2012066921 A1 WO 2012066921A1 JP 2011074913 W JP2011074913 W JP 2011074913W WO 2012066921 A1 WO2012066921 A1 WO 2012066921A1
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WO
WIPO (PCT)
Prior art keywords
substrate
nozzle
inkjet nozzle
pattern correction
hole
Prior art date
Application number
PCT/JP2011/074913
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English (en)
French (fr)
Japanese (ja)
Inventor
小池　孝誌
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Ntn株式会社
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Publication date
Application filed by Ntn株式会社 filed Critical Ntn株式会社
Priority to KR1020137010545A priority Critical patent/KR20130132421A/ko
Publication of WO2012066921A1 publication Critical patent/WO2012066921A1/ja

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/225—Correcting or repairing of printed circuits
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J9/00—Apparatus or processes specially adapted for the manufacture, installation, removal, maintenance of electric discharge tubes, discharge lamps, or parts thereof; Recovery of material from discharge tubes or lamps
    • H01J9/02—Manufacture of electrodes or electrode systems
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J9/00—Apparatus or processes specially adapted for the manufacture, installation, removal, maintenance of electric discharge tubes, discharge lamps, or parts thereof; Recovery of material from discharge tubes or lamps
    • H01J9/02—Manufacture of electrodes or electrode systems
    • H01J9/14—Manufacture of electrodes or electrode systems of non-emitting electrodes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/17—Post-manufacturing processes
    • H05K2203/173—Adding connections between adjacent pads or conductors, e.g. for modifying or repairing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
    • H05K3/125—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing by ink-jet printing

Definitions

  • the present invention relates to a pattern correcting device and a humidifying unit used therefor, and more particularly, to a pattern correcting device that corrects a defective portion of a pattern formed on the surface of a substrate and a humidifying unit used therefor.
  • Ink jet devices include a piezoelectric type, a heating type, and an electrostatic suction type. Since the electrostatic suction type ink jet device can draw a finer pattern, various devices have been conventionally proposed (for example, see Japanese Patent Application Laid-Open No. 2-225052 (Patent Document 1)).
  • fine wiring is formed on the surface of the glass substrate of the liquid crystal display. If there is a disconnection location (open defect portion) in the wiring, the disconnection location is corrected by discharging conductive ink (correction liquid) from the inkjet nozzle to the disconnection location (for example, Japanese Patent Application Laid-Open No. 11-233009 ( Patent Document 2), Japanese Patent Application Laid-Open No. 2004-134596 (Patent Document 3)).
  • Patent Document 2 Japanese Patent Application Laid-Open No. 11-233009
  • Patent Document 3 Japanese Patent Application Laid-Open No. 2004-134596
  • the ink discharged from the electrostatic suction type ink jet device is charged, if the substrate surface is charged with static electricity, the substrate and the ink repel each other and the ink diverges (scatters), and the correction unit A lot of scattered objects are generated around. For this reason, there is a method in which the ink jet device and the substrate are housed in a thermostatic chamber, and the inside of the thermostatic chamber is maintained in a high humidity atmosphere to discharge charges accumulated on the substrate surface (for example, WO 2005/014289 pamphlet (patent document) 4)).
  • a main object of the present invention is to provide a pattern correcting apparatus capable of accurately correcting a defective portion with a simple configuration even when the substrate surface is charged, and a humidifying unit used therefor. It is.
  • the pattern correction device is a pattern correction device for correcting a defective portion of a pattern formed on the surface of a substrate, and locally increases the humidity of the defective portion and the vicinity thereof, thereby increasing the static electricity of the defective portion and the vicinity thereof.
  • a humidifying unit that removes the static electricity, and an electrostatic suction type inkjet nozzle that discharges droplets of the correction liquid to the defective portion from which static electricity has been removed by the humidifying unit.
  • the humidifying unit includes a hollow member having a through-hole into which the tip of the inkjet nozzle is inserted, and a water absorbing member provided in the hollow member and capable of absorbing and releasing water for humidification. The vapor
  • the hollow member includes a cylindrical member, and the water absorbing member is provided on the inner wall of the cylindrical member.
  • the tip of the inkjet nozzle protrudes toward the substrate side by a predetermined distance from the end surface of the cylindrical member.
  • a notch for observing a defective portion from the outside of the cylindrical member is formed at the end of the cylindrical member on the substrate side.
  • a fixing member for fixing the base end portion of the inkjet nozzle is further provided, and the humidification unit is provided so as to be detachable from the fixing member.
  • a cylindrical protective cover provided so as to be movable in the longitudinal direction of the inkjet nozzle between the inkjet nozzle and the cylindrical member, and when the humidifying unit is attached / detached, the protective cover is held at the first position. Then, when the front end of the inkjet nozzle is covered with the protective cover and the humidification unit is used, a holding member is provided that holds the protective cover in the second position and exposes the front end of the inkjet nozzle from the protective cover.
  • the hollow member is disposed with a bottom surface having a predetermined gap with respect to the surface of the substrate, a container having a first hole formed in the bottom, and a second hole is formed. And a lid for closing the opening of the container.
  • the through hole includes first and second holes, and the water absorbing member is provided in the container.
  • the tip of the inkjet nozzle protrudes toward the substrate by a predetermined distance from the bottom of the container.
  • the inner diameter of the first hole is the same as the inner diameter of the second hole.
  • the inner diameter of the first hole is larger than the inner diameter of the second hole.
  • the container and the lid are formed with notches for communicating with the first and second holes and for observing the defect.
  • the humidification unit is provided so as to be replaceable.
  • the discarding plate is inserted between the inkjet nozzle and the substrate and discarded.
  • the first driving means for retracting the throwing plate from between the ink jet nozzle and the substrate the ink jet nozzle is raised as the throwing plate is inserted between the ink jet nozzle and the substrate, and the ink jet nozzle And a copying mechanism that lowers the ink jet nozzle as the throwing plate is retracted from between the substrates.
  • the shielding plate for shielding between the humidifying unit and the substrate, and when increasing the humidity in the defective portion and the vicinity thereof, the shielding plate is retracted to a position away from between the humidifying unit and the substrate, and the defect is detected.
  • a second driving means for inserting a shielding plate between the humidification unit and the substrate is provided.
  • the humidifying unit is a pattern correcting apparatus including an electrostatic suction type inkjet nozzle that discharges droplets of correcting liquid to a defective portion of a pattern formed on a surface of a substrate.
  • a humidifying unit that locally increases the humidity of the defective portion and removes static electricity in the vicinity thereof, a hollow member having a through-hole into which the tip of the inkjet nozzle is inserted, and provided in the hollow member for humidification And a water absorbing member capable of absorbing and releasing water. The water vapor discharged from the water absorbing member is supplied to the defective portion and the vicinity thereof through the through hole.
  • a hollow member having a through hole into which the tip of the inkjet nozzle is inserted, and a water absorbing member provided in the hollow member and capable of absorbing and discharging water for humidification
  • the water vapor discharged from the water absorbing member is supplied to the defective portion and the vicinity thereof through the through hole. Therefore, even when the substrate surface is charged, static electricity in the defective portion and the vicinity thereof can be locally removed, and the defective portion can be accurately corrected with a simple configuration.
  • FIG. 1 It is sectional drawing which shows the principal part of the pattern correction apparatus used as the foundation of this invention. It is a figure which illustrates the board
  • FIG. It is sectional drawing which shows the other example of a change of Embodiment 1.
  • FIG. 10 is a sectional view taken along line XX in FIG. 9. It is B arrow line view of FIG. It is a figure which shows the detailed structure of the coating device shown in FIG.
  • FIG. 13 is a sectional view taken along line XIII-XIII in FIG. 12. It is C arrow directional view of FIG.
  • FIG. 15 is a flowchart showing an operation of the coating apparatus shown in FIGS. 7 to 14.
  • FIG. It is sectional drawing which shows the principal part of the pattern correction apparatus by Embodiment 3 of this invention. It is sectional drawing which shows operation
  • FIG. 10 is a cross-sectional view showing a modified example of the third embodiment.
  • FIG. 20 is a diagram showing another modification example of the third embodiment. It is a figure which shows the whole structure of the pattern correction apparatus by Embodiment 4 of this invention.
  • FIG. 10 is a diagram illustrating a modification example of the fourth embodiment.
  • FIG. 20 is a diagram showing another modification example of the fourth embodiment.
  • FIG. 1 is a cross-sectional view showing the main part of a pattern correction apparatus that is the basis of the present invention.
  • the pattern correction apparatus includes an electrostatic suction type inkjet nozzle 1.
  • the correction ink 2 is injected into the nozzle 1.
  • An electrode 3 is provided in the nozzle 1
  • a counter electrode 4 is provided at a position away from the tip of the nozzle 1 by a predetermined distance, and a substrate 5 to be corrected is disposed on the surface of the counter electrode 4 on the nozzle 1 side. Is done.
  • a pulse voltage is applied between the electrodes 3 and 4
  • the droplet 2 a of the correction ink 2 is ejected from the tip of the nozzle 1, and the charged droplet 2 a is attached (landed) on the surface of the substrate 5.
  • FIG. 2A is a diagram illustrating the configuration of the substrate 5.
  • the substrate 5 includes an insulating substrate 6 such as a glass substrate.
  • a plurality of conductive patterns (wirings) 7 are formed in parallel at predetermined intervals. It is assumed that one of the plurality of conductive patterns 7 has an open defect portion 7a.
  • a normal conductive pattern 7 exists on one side (upper side in the figure) and the other side (lower side in the figure) of the open defect portion 7a.
  • FIG. 1 When the droplet 2a of the correction ink 2 is ejected while moving the tip of the nozzle 1 from the end of the conductive pattern 7 on one side to the end of the conductive pattern 7 on the other side via the open defect portion 7a, FIG. As shown in (b), a belt-like correction ink layer 2A is formed so as to cover the open defect portion 7a.
  • the correction ink 2 for example, a conductive nano ink containing metal nanoparticles such as gold and silver is used.
  • the correction ink layer 2A When the correction ink layer 2A is baked, the correction ink layer 2A exhibits conductivity, and the conductive pattern 7 on one side and the conductive pattern 7 on the other side of the open defect portion 7a are electrically connected. In this way, the open defect portion 7a is corrected.
  • such a pattern correction device is installed in a clean room. Since the inside of the clean room is managed at a room temperature of about 20 ° C. and a humidity of 50% or less, it becomes an environment where static electricity tends to be generated by drying. In such a low humidity environment, the insulating substrate 6 made of a highly insulating material (for example, glass or resin) that has high surface resistance and is easily charged with static electricity using the electrostatic suction type inkjet nozzle 1 is used. When the correction ink 2 is ejected on the surface, it becomes difficult to obtain a good correction ink layer 2A due to the influence of static electricity.
  • a highly insulating material for example, glass or resin
  • the state of generation of static electricity is different between the exposed portion of the insulating substrate 6 and the surface of the conductive pattern 7. That is, the position where the conductive pattern 7 does not exist and the portion where the conductive pattern 7 is lost and the insulating substrate 6 is exposed have high surface resistance and are easily charged with static electricity. On the contrary, the surface of the conductive pattern 7 has a low resistance and easily discharges charged static electricity into the atmosphere, so that it is not easily affected by static electricity.
  • the droplet 2a of the correction ink 2 is ejected from the electrostatic suction type inkjet nozzle 1 to the open defect portion 7a, the droplet 2a is repelled by the static electricity accumulated on the exposed surface of the insulating substrate 6, and immediately below the nozzle 1.
  • the ink is attracted to the surrounding conductive pattern 7 and is applied to the surface of the conductive pattern 7 or the boundary between the conductive pattern 7 and the insulating substrate 6 (regions A1 to A4 in FIG. 2A).
  • Two droplets 2a adhere (land).
  • a phenomenon occurs in which the droplets 2a diverge and form a mist and scatter on the surface of the substrate 5.
  • Patent Document 4 in order to solve this problem, the substrate 5 and the entire inkjet apparatus are accommodated in a thermostatic chamber, and the charge stored on the surface of the substrate 5 is discharged while maintaining the constant temperature chamber in a high humidity atmosphere. .
  • this method has problems such as an increase in size and complexity of the apparatus as described above.
  • a precision device such as a positioning stage that is mounted with the inkjet nozzle 1 and moved to a correction position is placed in a thermostatic chamber and placed in a high-humidity atmosphere, a sensor, a motor, a bearing portion, etc. included in the positioning stage
  • a sensor, a motor, a bearing portion, etc. included in the positioning stage
  • an adverse effect on the pattern may be considered.
  • the conductive pattern 7 has been miniaturized, and there is also a conductive pattern 7 having a line width of 5 ⁇ m or less.
  • the present invention solves the problems of such a pattern correction apparatus.
  • FIG. 3 is a cross-sectional view showing a main part of the pattern correction apparatus according to Embodiment 1 of the present invention.
  • the pattern correction apparatus includes an inkjet nozzle 1 and a humidification unit 8.
  • the humidifying unit 8 is provided with a cylindrical humidifying member (water absorbing member) 10 that absorbs water inside a cylindrical hollow container 9.
  • a porous chamber sheet capable of absorbing and releasing humidifying water is used.
  • the upper end surface 9a of the hollow container 9 is fixed to the lower end surface 11a of the fixing member 11 for fixing the inkjet nozzle 1 by a detachable method.
  • a fixing method a method using a magnetic attraction force (not shown) or a fixing method using a screw may be used.
  • the base end portion of the inkjet nozzle 1 is inserted into a hole formed in the central portion of the lower end surface 11 a of the fixing member 11.
  • the tip of the ink jet nozzle 1 passes through the hole of the hollow container 9, and the tip protrudes from the lower end surface 9b of the hollow container 9 by a predetermined distance W2-W1 on the substrate 5 side.
  • the fixing member 11 When the correction ink 2 is ejected from the inkjet nozzle 1 to the open defect portion 7a, the fixing member 11 is lowered so that the tip of the inkjet nozzle 1 and the substrate 5 maintain a minute gap W1.
  • the gap W1 is, for example, 100 ⁇ m.
  • the lower end surface 9b of the hollow container 9 and the substrate 5 face each other with a minute gap W2 (for example, 200 ⁇ m).
  • a minute gap W2 for example, 200 ⁇ m.
  • the open defect part 7a and its vicinity are locally humidified with the humidification unit 8 which consists of the hollow container 9 and the humidification member 10, the pattern correction apparatus and the whole board
  • substrate 5 were accommodated in the thermostat.
  • the open defect portion 7a can be accurately corrected with a simple configuration.
  • FIG. 4A is a cross-sectional view showing a modified example of the first embodiment, and is a diagram contrasted with FIG. FIG. 4B is a view as seen from an arrow A in FIG. 4 (a) and 4 (b), in this modification, a notch 9c is formed at the lower end of the hollow container 9.
  • the notch 9c is formed to observe the discharge state and application state of the correction ink 2 to the open defect portion 7a from the outside of the hollow container 9.
  • the hollow container 9 is provided with two notches 9c, and the open defect portion 7a is irradiated with illumination light through the one notch 9c, and the other notch From 9c, the ejection state and application state of the correction ink 2 to the open defect portion 7a are observed.
  • the same effect as in the first embodiment can be obtained, and the open defect portion 7a can be accurately corrected while observing the discharge state and application state of the correction ink 2 to the open defect portion 7a.
  • the number of notches 9c may be one.
  • FIG. 5 is a cross-sectional view showing another modification of the first embodiment, and is a diagram contrasted with FIG.
  • the humidifying unit 8 is provided so as to be detachable from the fixing member 11.
  • the tip is delicate, and therefore it is desirable to protect the tip of the nozzle 1 so as not to be damaged when the humidifying unit 8 is attached or detached. Therefore, in this modification, a protective cover 12 that protects the tip of the inkjet nozzle 1 is provided in the fixed member 11.
  • FIG. 5 shows a state where the protective cover 12 is lowered to protect the tip of the inkjet nozzle 1.
  • FIG. 6 shows a state in which the protective cover 12 is raised after the humidifying unit 8 is mounted, and the tip of the nozzle 1 is opposed to the open defective portion 7a, and the correction ink 2 can be ejected.
  • the protective cover 12 is formed in a cylindrical shape, and the nozzle 1 is inserted into the protective cover 12.
  • the protective cover 12 is inserted into a hole 11 b formed in the central portion of the lower end surface of the fixing member 11.
  • the base end portion of the nozzle 1 is inserted into the hole at the center of the bottom of the hole 11 b of the fixing member 11.
  • a magnet (not shown) is fixed to the fixing member 11, and the fixing member 11 is detachable by the magnetic attraction force of the magnet.
  • a Z table (not shown) that can advance and retract in the vertical direction with respect to the substrate 5. It is attached to.
  • a lever 13 is fixed to the side surface of the protective cover 12.
  • the lever 13 is inserted into a long hole 11 c formed in the side wall of the hole 11 b of the fixing member 11.
  • the lever 13 is provided so as to be movable in the vertical direction in the long hole 11c.
  • An annular groove 12b is formed on the outer periphery of the upper end portion of the protective cover 12, and an annular groove 12c is formed on the outer periphery of the lower end portion of the protective cover 12.
  • a plunger 14 is provided on the side wall at the lower end of the hole 11 b of the fixing member 11.
  • the ball 14a (or cylinder) of the plunger 14 is urged in a direction perpendicular to the outer peripheral surface of the protective cover 12 by a spring 14b.
  • the protective cover 12 When the sphere 14a enters the groove 12b, as shown in FIG. 5, the protective cover 12 is fixed at the lower position, and the tip of the nozzle 1 is covered and protected by the protective cover 12.
  • the protective cover 12 When the sphere 14a enters the groove 12c, as shown in FIG. 6, the protective cover 12 is fixed at the upper position, the tip of the nozzle 1 is exposed, and the correction ink 2 can be ejected.
  • the tip of the nozzle 1 can be protected by moving the protective cover 12 up and down with respect to the inkjet nozzle 1, the fixing member 11 to which the nozzle 1 is attached is not shown when the humidifying unit 8 is attached or detached. It is possible to prevent the nozzle 1 from being damaged when being attached to and detached from the shaft.
  • FIG. 7 is a cross-sectional view showing the main part of the pattern correction apparatus according to the second embodiment of the present invention, and is a figure compared with FIG. In FIG. 7, in this pattern correcting device, the nozzle 1 and the disc-shaped discarding plate 15 face each other with the humidifying unit 8 attached to the fixing member 11. In addition, a motor 16 that rotates the thrown-off plate 15 by a predetermined angle is provided.
  • FIG. 7 shows a state in which the tip of the inkjet nozzle 1 and the upper surface of the throwing plate 15 face each other with a certain gap.
  • the correction ink 2 is discharged from the tip of the nozzle 1 onto the surface of the discarding plate 15, thereby preventing the substrate 5 from being contaminated with the correction ink 2 and preventing the tip of the nozzle 1 from being clogged.
  • the discarding plate 15 is made of metal and grounded, no static electricity is generated on the discarding plate 15 and the discharged ink 2 droplet 2a does not diverge, so the surface of the discarding plate 15 is humidified. do not have to.
  • the surface of the discarding board 15 is an insulator like glass, it is preferable to apply an antistatic agent in order to reduce the surface resistance. For example, when a siloxane-based antistatic agent is thrown away and applied to the surface of the striking plate 15, a thin film of glass-like material is formed. Since the thin film adsorbs moisture in the atmosphere, the surface resistance of the thrown-off plate 15 is reduced and charging is prevented.
  • the discarding plate 15 and the humidifying unit 8 are opposed to each other with a minute gap, and the humidifying unit 8 is disposed below the nozzle 1. 15 surfaces are locally humidified. For this reason, the discarding correction ink 2 lands on the surface of the discarding plate 15 without divergence.
  • the discarding plate 15 is retracted in the horizontal direction and the ink jet nozzle 1 is lowered to leave a gap between the tip of the nozzle 1 and the surface of the substrate 5. Is set to a predetermined value. In this state, the droplet 2a of the correction ink 2 is discharged from the tip of the nozzle 1, and the correction ink layer 2A is formed while the nozzle 1 and the substrate 5 are relatively moved.
  • the nozzle 1 is lowered and confronted with the substrate 5, and a little waiting time is allowed to be discharged after the surface humidity of the substrate 5 including the defective portion 7a becomes high (after stabilization). Good.
  • FIG. 9 to 11 are diagrams showing a detailed configuration of the coating apparatus of the pattern correction apparatus.
  • FIG. 9 is a front view of the coating apparatus
  • FIG. 10 is a sectional view taken along line XX of FIG.
  • FIG. 11 is a view taken in the direction of arrow B in FIG. 9 to 11 show a state in which the discarding plate is opposed to the ink jet nozzle 1 to which the correction ink 2 is applied with a gap W3 therebetween, and the discarding operation is possible.
  • the gap W3 is approximately the same as the gap W1 described above.
  • 12 to 14 show a state in which the discarding plate 15 is retracted sideways, the inkjet nozzle 1 is lowered, and the nozzle 1 and the substrate 5 face each other with a gap W1. In this state, the correction ink 2 can be applied to the substrate 5.
  • 12 is a front view of the coating apparatus of the pattern correction apparatus
  • FIG. 13 is a cross-sectional view taken along line XIII-XIII in FIG. 12
  • FIG. 14 is a view taken in the direction of arrow C in FIG.
  • the base plate 17 that supports the entire coating apparatus is provided vertically, the slide portion 18 a of the linear motion guide bearing 18 is fixed to the surface of the base plate 17, and the slide portion of the linear motion guide bearing 19 is fixed to the back surface of the base plate 17. 19a is fixed.
  • the slide portion 18a of the linear motion guide bearing 18 is disposed vertically, and the slide portion 19a of the linear motion guide bearing 19 is disposed horizontally.
  • a Z table 20 having an L-shaped cross section is fixed to the rail portion 18 b of the linear motion guide bearing 18. Accordingly, the Z table 20 is supported by the linear motion guide bearing 18 so as to be able to advance and retract in the vertical direction with respect to the base plate 17.
  • a roller 21 is fixed to the projecting end of the Z table 20, and a plurality of magnets 22 are embedded on one side surface thereof.
  • An X table 23 is fixed to the rail portion 19 b of the linear motion guide bearing 19. Therefore, the X table 23 is supported by the linear motion guide bearing 19 so as to be able to advance and retract in the horizontal direction with respect to the base plate 17.
  • the base end portion of the inkjet nozzle 1 is held by the fixing member 11.
  • a plurality of magnets 24 are embedded in one end surface of the fixing member 11.
  • the fixing member 11 is attached to the Z table 20 by the attractive force of the magnet 22 and the magnet 24. Since the magnets 22 and 24 are arranged so as to be shifted from each other, when the fixing member 11 is mounted on the Z table 20, the fixing member 11 is attracted downward, and its end surface 11c is the upper surface 20a of the Z table 20. To be positioned.
  • the motor 16 is fixed to the lower end of the X table 23, and the rotation shaft of the motor 16 is fixed to the center of the disc-shaped discarding plate 15.
  • the motor 16 By rotating the discarding plate 15 by a predetermined angle by the motor 16, the discarding position of the ink 2 can be changed little by little.
  • the throwing plate 15 is opposed to a certain gap W3 directly below the nozzle 1, and the throwing is performed on the surface of the throwing plate 15 at the time of throwing.
  • the discarding plate 15 is rotated in advance by a predetermined angle before being discarded.
  • the roller 21 fixed to the Z table 20 is in contact with the upper end portion of the X table 23.
  • a copying surface (cam surface) having a horizontal portion 23 a and an inclined portion 23 b is formed at the upper end portion of the X table 23.
  • the height position of the nozzle 1 in the vertical direction is determined by the contact position between the roller 21 and the X table 23.
  • a driving device 25 for example, an air cylinder or a direct acting solenoid actuator
  • a driving device 25 for moving the X table 23 is fixed to the base plate 17, and its output shaft is connected to the X table 23.
  • the output shaft of the driving device 25 expands and contracts in the horizontal direction.
  • the discarding plate 15 When the discarding is completed and the discarding plate 15 is rotated at a predetermined angle, the discarding plate 15 is retracted and the nozzle 1 is lowered by operating the driving device 25. Instead of rotating the discarding plate 15 after discarding, the discarding plate 15 is rotated when drawing on the defective portion 7a is completed, so that the time from the discarding to the start of drawing is shortened. May be.
  • the discarding plate 15 can be retracted and the nozzle 1 can be lowered in a short time, and it is possible to prevent the ink 2 from becoming highly viscous in the nozzle 1 and being unable to be ejected.
  • the retreating plate 15 is retracted and the nozzle 1 is lowered by a series of operations, an operation error in which the nozzle 1 and the retreating plate 15 collide can be avoided.
  • the fixing member 11 is installed after the distance from the end surface 11c of the fixing member 11 to the tip of the nozzle 1 is set to a reference value using an observation optical system such as a magnifying glass, the end surface 11c of the fixing member 11 is discarded.
  • the distance to the striking plate 15 is constant, and the gap between the tip of the nozzle 1 and the surface of the discard striking plate 15 can be set to a predetermined value. For this reason, it is possible to prevent the tip of the nozzle 1 from coming into contact with the discarding plate 15 and being damaged.
  • FIG. 15 is a flowchart showing the operation of the pattern correction apparatus.
  • the coating apparatus is moved to the drawing position (S1), and the correction ink 2 is discarded (S2).
  • the discarding plate 15 is retracted and the nozzle 1 is lowered (S3).
  • the correction ink 2 is ejected while the humidity is stable, and the correction ink layer 2A is drawn (S5).
  • the discarding plate 15 is rotated by a small angle (S6), and the discarding plate 15 is returned to the lower side of the nozzle 1 (S7).
  • movement is complete
  • the correction ink layer 2A generated on the substrate 5 is subjected to a curing process or a baking process after the coating process is completed. Thereafter, if the substrate 5 is used for water cleaning, the influence of local humidification on the substrate 5 is negligible. Further, the humidifying period is only during ink application (drawing), and local humidification is not performed on the surface of the substrate 5 during standby, so that the influence on the substrate 5 can be minimized.
  • FIGS. 9 and 12 are diagrams showing the main part of the pattern correction apparatus according to the second embodiment of the present invention, and are compared with FIGS. 9 and 12, respectively.
  • FIG. 16 shows a standby state
  • FIG. 17 shows a drawable state.
  • this pattern correction apparatus is different from the second embodiment in that the humidifying unit 8 is replaced with a humidifying unit 26.
  • the humidification unit 26 includes a thin bottomed rectangular parallelepiped container 30, a rectangular lid 31, and a rectangular parallelepiped humidifying member 32 that has absorbed water for humidification. .
  • the humidifying member 32 is accommodated in the container 30, and the opening of the container 30 is closed by a lid 31. Holes 31 a, 32 a, and 30 a are formed in the central portion of the lid 31, the central portion of the humidifying member 32, and the central portion of the container 30, respectively.
  • the center lines of the holes 31a, 32a, and 30a coincide with each other, and the holes 31a, 32a, and 30a constitute one through hole.
  • the tip of the inkjet nozzle 1 is inserted into and removed from this through hole.
  • a screw hole 33 is formed in the corner of the lid 31.
  • the humidification unit 26 is fixed so as to be detachable from a support plate 28 fixed to the base plate 17 of the coating apparatus.
  • a bolt 29 that can be turned by hand is fixed by being screwed into a screw hole 33 provided in the humidifying unit 26.
  • the humidification unit 26 may be detachably provided using the magnet's attractive force, and the method for fixing the humidification unit 26 is not limited.
  • the humidification unit 26 is always placed close to the substrate 5.
  • the gap between the bottom surface of the container 30 and the surface of the substrate 5 is set to about 1 to 5 mm, for example. Since the defective portion 7a and the vicinity thereof are locally humidified when the nozzle 1 is positioned above the defective portion 7a, the defective portion 7a has already been removed when the throwing plate 15 is retracted and the nozzle 1 is lowered. And the vicinity thereof is moderately humidified, and static electricity accumulated on the surface of the substrate 5 has already been discharged. Therefore, the standby step (S4) in the flowchart shown in FIG. 15 may be omitted. In the third embodiment, the same effect as in the first and second embodiments can be obtained.
  • the hole 30a of the bottom of the container 30 is formed larger than the other holes 31a and 32a, and the area
  • the humidifying unit 26 may be in close proximity to the substrate 5 even during standby.
  • the normal surface of the substrate 5 is continuously humidified. If the humidification time becomes long, dew condensation is locally generated on the surface of the substrate 5, and it is assumed that the substrate 5 is adversely affected. Therefore, as shown in FIGS. 16 and 17, a shielding plate 35 may be provided between the bottom surface of the humidifying unit 26 and the substrate 5.
  • the shielding plate 35 is inserted between the humidifying unit 26 and the substrate 5 when the surface of the substrate 5 does not need to be humidified.
  • the shielding plate 35 is inserted between the humidifying unit 26 and the substrate 5. It is evacuated to a position out of the space. For example, the shielding plate 35 can be moved together with the retreating operation of the discarding plate 15, and the shielding plate 35 is connected to the X table 23 as shown in FIGS. 16 and 17.
  • FIG. 21 is a perspective view showing the overall configuration of a pattern correction apparatus 40 according to Embodiment 4 of the present invention.
  • a chuck 42 is provided at the center of a surface plate 41, and the substrate 5 to be corrected is fixed to the chuck 42.
  • a gantry type XY stage 43 is mounted on the surface plate 41.
  • the XY stage 43 includes an X-axis stage 43a and a gate-shaped Y-axis stage 43b.
  • the Y-axis stage 43b is provided so as to straddle the chuck 42, and moves in the Y-axis direction in the drawing.
  • the X-axis stage 43a is mounted on the Y-axis stage 43b and moves in the X direction in the figure.
  • the Z axis stage 44 that can move in the vertical direction is mounted on the X axis stage 43a.
  • an observation optical system 45 On the Z-axis stage 44, an observation optical system 45, an objective lens 46, a laser 47, a coating device 48, and a baking device 50 are mounted.
  • each of the observation optical system 45, the laser 47, the coating device 48, and the baking device 50 is moved above a desired position on the surface of the substrate 5. It is possible to make it.
  • the observation optical system 45 is used for observing a defective portion 7 a of the pattern on the substrate 5 through the objective lens 46.
  • the laser 47 irradiates the defect on the substrate 5 with a laser beam via the observation optical system 45 and the objective lens 46, shapes the defect shape by laser ablation, or the correction ink 2 that is excessively attached to the defect and its periphery.
  • the coating device 48 includes an inkjet nozzle 1 that ejects the correction ink 2 and a humidifying unit 8 that locally humidifies the surface of the substrate 5 and can be easily attached and detached.
  • a discarding plate 15 for receiving the correction ink 2 discarded by the nozzle 1 may be provided in the coating device 48 as necessary.
  • the coating device 48 is fixed to the Z-axis stage 44 via a Z-axis stage 49 that can advance and retract in the vertical direction.
  • the coating device 48 may be directly fixed to the Z-axis stage 44 or may be fixed to something other than the Z-axis stage 44.
  • the baking device 50 is used for baking the correction ink 2 applied to the substrate 5.
  • the stages 43a, 43b, and 44 are controlled to position the optical axes of the observation optical system 45 and the objective lens 46 at the open defect portion 7a, and the open defect portion 7a is observed.
  • the defect portion 7a is irradiated with laser light from the laser 47 to shape the defect portion 7a so as to be easily corrected.
  • the stages 43a, 43b, and 44 are controlled to position the tip of the inkjet nozzle 1 above the defective portion 7a, and as described in the first to third embodiments, the defective portion 7a and the vicinity thereof are humidified.
  • the droplet 2a of the correction ink 2 is ejected to the defect portion 7a, and the correction ink layer 2A is formed on the defect portion 7a.
  • stages 43a, 43b, and 44 are controlled to position the baking device 50 above the correction ink layer 2A, and the correction ink layer 2A is baked to generate a conductive pattern.
  • FIG. 22 is a diagram showing a modification example of the pattern correction device.
  • the Z-axis stage 49 is replaced with an XYZ stage 51.
  • the XYZ stage 51 includes an X axis stage 52, a Z axis stage 53, and a Y axis stage 54.
  • the X-axis stage 52 moves the coating device 48 in the X-axis direction.
  • the Z-axis stage 53 moves the X-axis stage 52 in the Z-axis direction.
  • the Y-axis stage 54 moves the Z-axis stage 53 in the Y-axis direction.
  • the XYZ stage 51 is operated to insert the coating device 48 between the objective lens 46 and the substrate 5, and the correction ink is inserted into the defect portion 7a. 2 can be applied, and the relative movement of the large XY stage 43 is omitted at the time of application.
  • the defect portion 7a observed by the observation optical system 45 is relatively moved and positioned below the coating device 48, and then the XYZ stage 51 is controlled and corrected.
  • a method of applying ink 2 may be used.
  • FIG. 23 is a diagram illustrating another modification of the pattern correction apparatus.
  • the coating device 48 is fixed to an objective lens switch (XY stage) 55 that switches the magnification of the objective lens 46.
  • the objective lens switching unit 55 is mounted, for example, on the Z-axis stage 44 in FIG.
  • the objective lens switching unit 55 includes a movable plate 56 that is movable in the horizontal direction (XY direction).
  • a plurality of objective lenses 46 having different magnifications are mounted on the lower surface of the movable plate 56.
  • a through hole 56 a is opened in the movable plate 56 corresponding to each objective lens 46.
  • the optical axis of each objective lens 46 passes vertically through the center of the hole 56a.
  • the coating device 48 is mounted on the lower surface of the movable plate 56 together with a plurality of objective lenses 46. Therefore, by controlling the objective lens switching unit 55, the coating device 48 can be moved above the defective portion 7a. Since the method of applying the correction ink 2 using the coating device 48 is the same as the method described above, the description thereof will not be repeated. In this modified example, the XYZ stage 51 in the modified example of FIG. 22 can be omitted, so that the apparatus configuration is simplified. In addition, since the coating device 48 is arranged at a position close to the position where the objective lens 46 is observing the defective portion 7a, the moving time of the coating device 48 is shortened and the correction tact time is shortened.
  • a distance sensor (height sensor) 57 for measuring the distance between the objective lens switching unit 55 and the substrate 5 may be mounted on the objective lens switching unit 55.
  • the image observed by the observation optical system 45 is based on the position of the Z-axis stage 44 at the focus (focus) position, the retreating plate 15 is retracted and the nozzle 1 is lowered in this state (focus state). Further, the position of the coating device 48 is fixed so that the gap between the nozzle 1 and the substrate 5 becomes a constant value.
  • the nozzle 1 moves down to the stopper position as the throwing plate 15 moves.
  • the tip of the nozzle 1 is in contact with the substrate 5.
  • the nozzle 1 can be selected depending on the magnification of the objective lens 46 selected at the start of application even when the focus position is used as a reference.
  • the distance from the tip of the substrate to the substrate 5 is slightly different. For this reason, possibility that the front-end
  • a distance sensor 57 for measuring the distance to the substrate 5 in a non-contact manner is provided in the objective lens switching device 55.
  • the Z-axis stage 44 is controlled based on the distance to the substrate 5 measured by the distance sensor 57, and the vertical position of the objective lens switching unit 55 is finely adjusted.
  • the area humidified at the time of defect correction is in a very small range including the defect portion 7a. Because it is limited, it is possible to minimize the influence on precision equipment. Moreover, since the humidification unit 8 (26) is easily mounted in the coating device 48, it can be replaced periodically, leading to a reduction in maintenance time.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Coating Apparatus (AREA)
  • Manufacturing Of Printed Wiring (AREA)
PCT/JP2011/074913 2010-11-18 2011-10-28 パターン修正装置およびそれに用いられる加湿ユニット WO2012066921A1 (ja)

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JPWO2014188579A1 (ja) * 2013-05-24 2017-02-23 ヤマハ発動機株式会社 塗布試行装置、ディスペンサおよび電子部品実装装置

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JP2007128983A (ja) * 2005-11-01 2007-05-24 Ricoh Co Ltd 導電パターン形成装置及び表示装置
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JP2007128983A (ja) * 2005-11-01 2007-05-24 Ricoh Co Ltd 導電パターン形成装置及び表示装置
JP2007191701A (ja) * 2005-12-20 2007-08-02 Konica Minolta Holdings Inc インクジェット記録方法
JP2007175605A (ja) * 2005-12-27 2007-07-12 Fuji Xerox Co Ltd 液滴吐出装置

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KR20130132421A (ko) 2013-12-04
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JP5491363B2 (ja) 2014-05-14
JP2012109445A (ja) 2012-06-07

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