TW201240736A - Pattern correction device and humidifying unit for use in the same - Google Patents

Pattern correction device and humidifying unit for use in the same Download PDF

Info

Publication number
TW201240736A
TW201240736A TW100141015A TW100141015A TW201240736A TW 201240736 A TW201240736 A TW 201240736A TW 100141015 A TW100141015 A TW 100141015A TW 100141015 A TW100141015 A TW 100141015A TW 201240736 A TW201240736 A TW 201240736A
Authority
TW
Taiwan
Prior art keywords
substrate
nozzle
pattern
ink
hole
Prior art date
Application number
TW100141015A
Other languages
Chinese (zh)
Other versions
TWI566840B (en
Inventor
Takashi Koike
Original Assignee
Ntn Toyo Bearing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ntn Toyo Bearing Co Ltd filed Critical Ntn Toyo Bearing Co Ltd
Publication of TW201240736A publication Critical patent/TW201240736A/en
Application granted granted Critical
Publication of TWI566840B publication Critical patent/TWI566840B/en

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/22Secondary treatment of printed circuits
    • H05K3/225Correcting or repairing of printed circuits
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/22Secondary treatment of printed circuits
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05CAPPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C5/00Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J9/00Apparatus or processes specially adapted for the manufacture, installation, removal, maintenance of electric discharge tubes, discharge lamps, or parts thereof; Recovery of material from discharge tubes or lamps
    • H01J9/02Manufacture of electrodes or electrode systems
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J9/00Apparatus or processes specially adapted for the manufacture, installation, removal, maintenance of electric discharge tubes, discharge lamps, or parts thereof; Recovery of material from discharge tubes or lamps
    • H01J9/02Manufacture of electrodes or electrode systems
    • H01J9/14Manufacture of electrodes or electrode systems of non-emitting electrodes
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/10Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/17Post-manufacturing processes
    • H05K2203/173Adding connections between adjacent pads or conductors, e.g. for modifying or repairing
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/10Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1241Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
    • H05K3/125Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing by ink-jet printing

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Coating Apparatus (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

This humidifying unit (8) for a pattern modification device includes a cylindrically shaped hollow vessel (9) into which the tip part of an inkjet nozzle (1) is inserted and a humidifying member (10) that is provided on the inside wall of the hollow vessel (9) and can absorb and release water for humidification. Water vapor of water released from the humidifying member (10) is supplied to a defect part (7a) and the proximity thereof. Therefore, even if a substrate (5) surface has an electrostatic charge, the static electricity of the defect part (7a) and the proximity thereof can be locally eliminated.

Description

201240736 四、指定代表圖: (一) 本案指定代表圖為:第(3)圖。 (二) 本代表圖之元件符號簡單說明: I :噴墨噴嘴; r 4 :對向電極; 5 :基板; 7 :導電性圖案 7 a :斷開缺陷部; 8 :加濕單元; 9 :中空容器; 9a :上端面; 9b :下端面; 1 〇 :加濕構件; II :固定構件; ,201240736 IV. Designated representative map: (1) The representative representative of the case is: (3). (2) A brief description of the components of the representative diagram: I: inkjet nozzle; r4: counter electrode; 5: substrate; 7: conductive pattern 7a: disconnected defect; 8: humidifying unit; Hollow container; 9a: upper end surface; 9b: lower end surface; 1 〇: humidifying member; II: fixing member;

Ua :下端面;Ua: lower end face;

Wl、W2 :間隙。 五、本案若有鱗式時,請揭示最能齡發明舰的化學式 益。 六、發明說明: 【發明所屬之技術領域】 。。本發明係關於圖案修正裝置以及該裝置所使用之加濕 單,尤其係關於修正形成在基板表面的圖案的缺陷部的圖 案修正裝置、及該裝置所使用之加濕單元。 【先前技術】 使用喷墨裝置而在基板表面描繪圖案的方法與其他描 繪方法相比,墨水的利用效率高、且可簡化作業製程,因 此近來被利用在各種領域。此外,喷墨裝置係有壓電型、 201240736 加熱型、靜電吸引型等。靜電吸引型的噴墨裝置係可指綠 更為微細的圖案,因此自以往以來已有各種裝置被提出(參 照例如日本特開平2-225052號公報(專利文獻丨))。 此外,在液晶顯示器、電漿顯示器、EL顯示器等平板 顯示器的領域中,伴隨著近年來的晝面大型化、高精細化, 形成在玻璃基板上的配線(電極)或液晶彩色濾光片等存 在缺陷的機率變高,為了達成良率提升而使用喷墨裝置的 圖案修正方法已被提出多數個。 例如在液S日顯示盗的玻璃基板表面形成有微細的配 線。若在該配線存在有斷線部位(斷開缺陷部)時,由噴墨 噴嘴對斷線部位吐出導電性墨水(修正液)來修正斷線部位 (參照例如日本特開平u_233()09號公報(專利文獻2)、日本 特開2004-1 34596號公報(專利文獻3))。 此外,由靜電吸引型的喷墨裝置所吐出的墨水帶電, 因此若基板表面帶有靜電時,基板與墨水互斥而使墨水發 散(飛散),在修正部周圍發生多數飛散物。因此,有一種 方法係將喷墨裝置及基板收容在恒溫槽,將恒溫室内維持 在南濕度環境空氣而使積存在基板表面的電荷放電(參照 例如國際公開第2005-014289號小冊(專利文獻4))。 (先前技術文獻) (專利文獻) (專利文獻1)曰本特開平2-225052號公報 (專利文獻2)日本特開平1^233009號公報 (專利文獻3)日本特開2004-134596號公報 3 201240736 (專利文獻4)國際公開第2〇〇5_〇14289號小冊 【發明内容】 (發明所欲解決之課題) 但是,在最近的平板顯示器的製造製程中,存在有超 過3mx3m的大小的基板,將 ^ ^ ^ 如上所不之大型的基板全體放入 恒溫槽内導致裝置大型化, 而且愷溫槽的控制亦變得繁 雜,故較不理想。此外,若 、 溫槽内而置放在高濕度環境 但 時亦會有在圖案修正 裝置所包含的定位載台等精密機器發生不良影響之虞。 因此、’本^月之主要目的在提供一種即使基板表面帶 亦可以簡單構成來正確修正缺陷部的圖案修正裝置、 及該裝置所使用之加濕單元。 (解決課題之手段) 本發明之圖案修正裝置係修正形成在基板表面的圖宰 的缺陷部的圖案修正裝置,其包括:局部提高缺陷部及並 附近的濕度,將缺陷部及其附近的靜電去除的加濕單元; 由加濕單元來去除靜電的缺陷部吐出修正液的液滴 啥黑π 型的喷墨喷嘴〇加濕單元係包含:具有供插入 喷墨喷嘴的前端部的貫穿孔的中空構件;及設在令空構件 内’可進行加濕用的水的吸收及放出的水吸收構件,由 吸收構件所被放出的水的蒸氣係、透過貫穿孔而被供 陷部及其附近。 主缺 較佳為中工構件係包含筒構件’水吸收構件係設在筒 4 201240736 構件的内壁。 而且較佳為喷墨喷嘴的前端係比筒構件的端面朝向基 板側突出預先設定的距離。 而且較佳為在筒構件的基板侧的端部係形成有用以由 筒構件的外側觀察缺陷部的缺口部。 而且較佳為另外包括固定喷墨噴嘴的基端部的固定構 件,加濕單元係設為可相對固定構件作安裝卸除。 而且較佳為另外包括:設成可在喷墨喷嘴與筒構件之 間朝喷墨噴嘴的長邊方向移動的筒狀保護蓋;及若加渴單 :作安裝卸除時,將保護蓋保持在第i位置而藉由保護蓋覆 蓋喷墨噴嘴的前端冑,若使用加濕單元時,將保護蓋保持 在第2位置而使喷墨噴嘴的前端部由保護蓋露出的保持構 件0 而且較佳為中空構件係包含:對基板的表面形成所預 先:又疋的間隙而配置其底面,在其底部形成有第1孔的容 器’及形成第2孔’將容器的開口部關閉的蓋部。貫穿孔係 包含第1及第2孔,水吸收構件係被設在容器内。 而且較佳為噴墨喷嘴的前端係比容器的底面朝向基板 側突出預先設定的距離。 而且較佳為第1孔的内徑係與第2孔的内徑相同。 而且較佳為第1孔的内徑係大於第2孔的内徑。 而且較佳為在容器及蓋部係形成有與第丨及第2孔相連 通而用以觀察缺陷部的缺口部。 而且較佳為加濕單元係設為可替換。 201240736 而且較佳為另外包括·•桩 入“ +里卜 L括才妾又藉由喷墨噴嘴所被無用注 入的吐出墨水的無用注入板; .^ 硬仃〇正墨水之無用注入的 ,,,、用/入動作時係在喷墨喷 ,如卜、 土喟哭與基板之間插入無用注入 板,在無用注入動彳丨& & #,# & > 乍束後係使無用注入板由喷墨喷嘴 與基板之間退避的第丨驅動手 又’及蚁者在喷墨喷嘴與基板 無用注人板,使喷墨喷嘴上升,隨著無用注入 板由喷墨喷嘴與基板之間退避而使噴墨噴嘴下降的追隨機 構。 而且較佳為包括:用以遮蔽加濕單元與基板之間的遮 蔽板;若提高缺陷部及其附近的濕度時,使遮蔽板退避至 脫離加濕單元與基板之間的位置,若不需要提高缺陷部及 其附近的濕度時,即在加濕單元與基板之間插入遮蔽板的 第2驅動手段。 此外,本發明之加濕單元係在包括對形成在基板表面 的圖案的缺p£3部吐出修正液的液滴的靜電吸引型的喷墨喷 嘴的圖案修正裝置中’局部提高缺陷部及其附近的濕度, 而將缺陷部及其附近的靜電去除的加濕單元,其包含:具 有供插入喷墨喷嘴的前端部的貫穿孔的中空構件;及設在 中空構件内’可進行加濕用的水的吸收及放出的水吸收構 件。由水吸收構件所被放出的水的蒸氣係透過貫穿孔而被 供給至缺陷部及其附近。 (發明效果) 在本發明之圖案修正裝置及加濕單元中,係設有:具 有供插入喷墨喷嘴的前端部的貫穿孔的中空構件;及設在 201240736 中空構件内’可進行加濕用的水的吸收及放出的水吸收構 件’由水吸收構件所被放出的水的蒸氣係透過貫穿孔而被 供給至缺陷部及其附近。因此,即使在基板表面帶電的情 形下,亦可局部去除缺陷部及其附近的靜電,可以簡單構 成來正確修正缺陷部。 【實施方式] 第1圖係顯示作為本案發明之基礎之圖案修正裝置之 主要部位的剖面圖。在第1圖中,該圖案修正裝置係包括靜 電吸引型的喷墨噴嘴卜在喷嘴丨内注入修正墨水2。而且在 喷嘴1内設置電極3 ’在由喷嘴i的前端離預定距離的位置設 置對向電極4 ’在對向電極4的噴嘴丨側的表面上配置修正對 象的基板5。若對電極3、4間施加脈衝電壓時,由噴嘴^的 前端吐出修正墨水2的液滴2a,已帶電的液滴2a會附著 彈)在基板5的表面。 第2圖(a)係例示基板5之構成圖。在第2圖(3)中,基板 5係包含如玻璃基板般的絕緣基板6。在絕緣基板㈣表二係 以預定間隔平行形成有複數個導電性圖案(配線)7。在福數 個導電性圖案7之中的丨個導電性圖 部7a。 军7係存在有斷開缺陷 在斷開缺陷部73的—方側(在冑令為上側 (在圖中為下側)係存在有正常的導電性圖案7。若—⑨ 嘴1的前端由一方側的導雷性圓安7认& 面使喷 73而…… 端部透過斷開缺陷部 7a而移動至另—方側的導電性圖案 47吐出修正 201240736 墨水2的液滴2a時,如第2圖(b)所示,以覆蓋斷開缺陷部7a 的方式形成帶狀的修正墨水層2A。以修正墨水2而言,係使 用例如包含金、銀等金屬奈米粒子的導電性奈米墨水。若 將修正墨水層2A進行燒成,修正墨水層以係呈現導電性, 使斷開缺陷部7a的一方側的導電性圖案7與另一方側的導 電性圖案7作電性連接。如上所示,修正斷開缺陷部。 但是,如上所示之圖案修正裝置係被設置在清淨室 内巧淨至内係被官理成室溫2 0 °C前後、濕度5 0 %以下,因 此形成為乾燥而容易發生靜電的環境。在如上所示之低濕 度的環境下,若對使用靜電吸引型的喷墨喷嘴丨而由表面電 阻高而容易帶靜電的絕緣性高的材質(例如玻璃或樹脂)所 形成的絕緣基板6的表面吐出修正墨水2時,因靜電影響而 不易獲得良好的修正墨水層2A。 此外,若為在絕緣基板6上形成有導電性圖案7的基板 5,在絕緣基板6的表面露出的部分與導電性圖案7的表面, 靜電發生狀況並不同。亦即,未存在有導電性圖案7的位置 或導電性圖案7缺損而露出絕緣基板6的部分係表面電阻高 而容易帶靜電。相反地’導電性圖案7的表面係電阻低、而 容易將所帶有的靜電放電至大氣巾,因此不易受到靜電影 響。 / 例如,若由靜電吸引型的喷墨喷嘴!對斷開缺陷部h 吐出修正墨水2的液滴2a時’藉由積存在所露出的絕緣基板 6表面的靜電使液滴2a彈開而並未著彈在喷嘴}的正下方, 被吸引至周圍的導電性圖案7,而使佟 1之修正墨水2的液滴2a附 201240736 J"著彈)在導電性圖案7的表面或導電性圖案7與絕緣基板 6白勺交界部(第2圖( _v、m _ vaj的&域A1〜A4)。或者亦會發生液滴2a I散而形成為霧狀 粉狀而飛散在基板5表面的現象。如上所示, 在乾燥環壇下,# Α 1 & 對包3南電阻的絕緣材質的基板6吐出修 土夂2寺未獲得穩定的描繪性,不易修正斷開缺陷部7a 的可能性會變高。 文獻4中,為解決該問題,將基板$與喷墨裝置 f體收容在恒溫槽内,而將恒溫室内維持為高濕度環境空 乳而使積存在基板5表面的電荷放電。但是,在該方法中, 如上所述會有導致裝置大型化、複雜化等問題。此外, 將如上所不之大型恒溫槽設置在清淨室内並不理相。此 外’裝載喷墨噴嘴i等而使其移動至修正位置的定位’載台等 精密機器被配置在恒溫槽内,若被置放於高濕度環境空氣 下時,會有對疋位載台所包含的咸制哭 1 i 3的砍測盗 '電動機、軸承部Wl, W2: gap. 5. If there is a scale in this case, please reveal the chemical formula of the ship of the most inventor. 6. Description of the invention: [Technical field to which the invention pertains]. . The present invention relates to a pattern correcting device and a humidifying unit used therefor, and more particularly to a pattern correcting device for correcting a defective portion of a pattern formed on a surface of a substrate, and a humidifying unit used in the device. [Prior Art] A method of drawing a pattern on a surface of a substrate using an ink jet device has higher ink utilization efficiency and simplifies the work process than other drawing methods, and thus has recently been utilized in various fields. Further, the ink jet device is of a piezoelectric type, a 201240736 heating type, an electrostatic attraction type or the like. In the case of the inkjet device of the electrostatic attraction type, it is possible to refer to a green finer pattern. Therefore, various devices have been proposed in the past (see, for example, Japanese Laid-Open Patent Publication No. Hei 2-225052 (Patent Document No.)). In addition, in the field of flat panel displays such as liquid crystal displays, plasma displays, and EL displays, wiring (electrodes) or liquid crystal color filters formed on glass substrates have been increasing in size and high definition in recent years. The probability of occurrence of defects becomes high, and a pattern correction method using an inkjet device for achieving improvement in yield has been proposed. For example, a fine wiring is formed on the surface of the glass substrate which is stolen on the liquid S. When there is a disconnection portion (breaking of the defective portion) in the wiring, the inkjet nozzle discharges the conductive ink (correction liquid) to the disconnection portion to correct the disconnection portion (see, for example, JP-A-233() (Patent Document 2), JP-A-2004-1 34596 (Patent Document 3)). Further, since the ink ejected by the electrostatic attraction type ink jet device is charged, when the surface of the substrate is electrostatically charged, the substrate and the ink repel each other to cause the ink to diverge (scatter), and a large amount of scattered matter occurs around the correction portion. Therefore, there is a method of accommodating the ink jet apparatus and the substrate in a constant temperature bath, and maintaining the temperature in the south humidity environment in the constant temperature chamber to discharge the electric charge accumulated on the surface of the substrate (refer to, for example, International Publication No. 2005-014289 (Patent Document) 4)). (PRIOR ART DOCUMENT) (Patent Document 1) Japanese Laid-Open Patent Publication No. Hei No. Hei. No. Hei. No. Hei. 201240736 (Patent Document 4) International Publication No. 2〇5289 No. 14289 [Explanation] (Problems to be Solved by the Invention) However, in the recent manufacturing process of flat panel displays, there are more than 3 mx 3 m. In the substrate, the large-sized substrate of the above-mentioned large-sized substrate is placed in the thermostatic chamber to increase the size of the device, and the control of the temperature-increasing groove is complicated, which is not preferable. In addition, if it is placed in a high-humidity environment in a temperature tank, it may have an adverse effect on a precision machine such as a positioning stage included in the pattern correction device. Therefore, the main object of the present invention is to provide a pattern correcting device which can be easily configured to correct a defective portion even if the surface of the substrate is provided, and a humidifying unit used in the device. (Means for Solving the Problem) The pattern correction device according to the present invention is a pattern correction device for correcting a defect portion of a figure formed on a surface of a substrate, comprising: partially improving a defect portion and a humidity in the vicinity thereof, and electrostatically disposing the defect portion and its vicinity a humidifying unit that is removed; a droplet that removes static electricity by the humidifying unit, and a liquid droplet that discharges the correction liquid. The black ink π type inkjet nozzle 〇 humidifying unit includes a through hole for inserting a front end portion of the inkjet nozzle. a hollow member; and a water absorbing member provided in the hollow member for absorbing and releasing water for humidification, the vapor portion of the water discharged from the absorbing member, and the through hole and the vicinity thereof are trapped . Preferably, the main structural member comprises a tubular member, and the water absorbing member is attached to the inner wall of the member of the cylinder 4 201240736. Further, it is preferable that the front end of the ink jet nozzle protrudes from the end surface of the tubular member toward the substrate side by a predetermined distance. Further, it is preferable that a notch portion for observing the defective portion from the outer side of the tubular member is formed at the end portion on the substrate side of the tubular member. Further preferably, the fixing member further includes a fixing member for fixing the base end portion of the ink jet nozzle, and the humidifying unit is provided to be attachable and detachable with respect to the fixing member. Further preferably, the method further includes: providing a cylindrical protective cover that is movable between the inkjet nozzle and the tubular member toward the longitudinal direction of the inkjet nozzle; and, if the thirsty sheet is used for mounting and removing, retaining the protective cover At the ith position, the front end 胄 of the inkjet nozzle is covered by the protective cover, and when the humidifying unit is used, the protective cover is held at the second position, and the front end portion of the ink jet nozzle is exposed by the protective cover 0 and is Preferably, the hollow member includes a container in which a bottom surface of the substrate is formed with a predetermined gap and a bottom surface, a container having a first hole formed at a bottom portion thereof, and a lid portion forming a second hole to close the opening of the container. . The through hole system includes the first and second holes, and the water absorbing member is provided in the container. Further, it is preferable that the front end of the ink jet nozzle protrudes from the bottom surface of the container toward the substrate side by a predetermined distance. Further, it is preferable that the inner diameter of the first hole is the same as the inner diameter of the second hole. Further, it is preferable that the inner diameter of the first hole is larger than the inner diameter of the second hole. Further, it is preferable that the container and the lid portion are formed with a notch portion that communicates with the second and second holes to observe the defective portion. Further, it is preferable that the humidifying unit be replaced. 201240736 It is also preferable to additionally include a non-use injection plate for injecting ink which is injected by the ink jet nozzle without using the inkjet nozzle; , when using / in action is in the inkjet spray, such as Bu, soil crying and inserting a useless injection plate between the substrate, after the useless injection &&&#,#&> The useless injection plate is driven by the third drive between the inkjet nozzle and the substrate, and the ant is used in the inkjet nozzle and the substrate without the use of the injection plate, so that the inkjet nozzle rises, with the use of the inkjet nozzle and the substrate. And a follow-up mechanism for retracting the ink-jet nozzle, and preferably includes: a shielding plate for shielding the humidifying unit from the substrate; and if the humidity of the defect portion and the vicinity thereof is increased, the shielding plate is retracted to be separated The position between the humidifying unit and the substrate is a second driving means for inserting a shielding plate between the humidifying unit and the substrate if it is not necessary to increase the humidity in the defect portion and the vicinity thereof. Further, the humidifying unit of the present invention is Including the formation on the surface of the substrate In the pattern correction device of the electrostatic attraction type inkjet nozzle in which the droplets of the correction liquid are discharged, the portion of the pattern is improved, and the humidity in the vicinity of the defect portion and the vicinity thereof is removed. The wet unit includes: a hollow member having a through hole for inserting a tip end portion of the inkjet nozzle; and a water absorbing member provided in the hollow member to absorb and release water for humidification. The steam of the released water is supplied to the defective portion and the vicinity thereof through the through hole. (Effect of the invention) The pattern correction device and the humidifying unit of the present invention are provided with a front end portion for inserting the ink jet nozzle The hollow member of the through hole; and the water absorbing member provided in the hollow member at the 201240736 hollow body for absorbing and releasing the water for humidification is supplied to the vapor of the water discharged from the water absorbing member through the through hole. Therefore, even when the surface of the substrate is charged, the static electricity in the defect portion and its vicinity can be partially removed, and the defective portion can be accurately corrected. [Embodiment] Fig. 1 is a cross-sectional view showing a main part of a pattern correction device which is the basis of the present invention. In Fig. 1, the pattern correction device includes an electrostatic attraction type inkjet nozzle which is injected into a nozzle 丨. The ink 2 is corrected. Further, the electrode 3 is provided in the nozzle 1 at a position away from the tip end of the nozzle i by a predetermined distance. The counter electrode 4' is disposed on the surface of the counter electrode 4 on the nozzle side of the counter electrode 4. When a pulse voltage is applied between the electrodes 3 and 4, the droplet 2a of the correction ink 2 is discharged from the tip end of the nozzle 2, and the charged droplet 2a adheres to the surface of the substrate 5. Fig. 2(a) shows the substrate In Fig. 2 (3), the substrate 5 includes an insulating substrate 6 such as a glass substrate. In the insulating substrate (4), a plurality of conductive patterns (wirings) 7 are formed in parallel at predetermined intervals. One of the plurality of conductive patterns 7 is a plurality of conductive patterns 7a. There is a disconnection defect in the military 7 system on the side of the broken defect portion 73 (the upper side (in the figure is the lower side) has a normal conductive pattern 7. If the front end of the nozzle 9 is When the conductive material pattern 47 that has moved to the other side by the breakage defect portion 7a is discharged, the liquid crystal 2a of the ink 2 is corrected, and the liquid droplet 2a of the ink 2 is corrected. As shown in Fig. 2(b), the strip-shaped correction ink layer 2A is formed so as to cover the broken defect portion 7a. For the correction ink 2, for example, conductivity including metal nanoparticles such as gold or silver is used. When the correction ink layer 2A is fired, the ink layer is corrected to exhibit electrical conductivity, and the conductive pattern 7 on one side of the broken defect portion 7a is electrically connected to the conductive pattern 7 on the other side. As shown above, the defective portion is corrected. However, the pattern correction device as described above is installed in the clean room to be cleaned to the inside and outside of the room temperature at 20 ° C, and the humidity is below 50%. Formed as an environment that is dry and prone to static electricity. In the low humidity ring as shown above When the correction ink 2 is discharged from the surface of the insulating substrate 6 formed of a material having a high surface resistance and a high insulating material (for example, glass or resin) having an electrostatic attraction type ink jet nozzle 丨, the static electricity is discharged. In addition, it is not easy to obtain a good correction ink layer 2A. Further, in the case where the substrate 5 on which the conductive pattern 7 is formed on the insulating substrate 6, the portion exposed on the surface of the insulating substrate 6 and the surface of the conductive pattern 7 are electrostatically generated. In other words, the portion where the conductive pattern 7 is absent or the conductive pattern 7 is not damaged, and the portion where the insulating substrate 6 is exposed has a high surface resistance and is likely to be electrostatically charged. Conversely, the surface resistance of the conductive pattern 7 is low. It is easy to discharge the electrostatic discharge to the air towel, so it is less susceptible to static electricity. / For example, if the inkjet nozzle of the electrostatic attraction type is used, the droplet 2a of the correction ink 2 is discharged to the defective portion h. The static electricity accumulated on the surface of the exposed insulating substrate 6 causes the liquid droplet 2a to bounce off and is not sucked directly under the nozzle}, and is attracted to the surrounding conductive pattern 7 to correct the 佟1 The droplet 2a of the water 2 is attached to the surface of the conductive pattern 7 or the interface between the conductive pattern 7 and the insulating substrate 6 in the droplet 2a of the water 2 (Fig. 2 (_v, m_vaj & field A1 to A4) Or the phenomenon that the droplets 2a are scattered and formed into a misty powder and scattered on the surface of the substrate 5. As shown above, under the dry ring, # Α 1 & When the substrate 6 is ejected, the repairing soil 2 temple does not have stable descriptive properties, and it is difficult to correct the broken defect portion 7a. In order to solve this problem, the substrate $ and the ink jet device f are housed in the substrate 4. In the thermostatic chamber, the constant temperature chamber is maintained as a high-humidity environment, and the electric charge accumulated on the surface of the substrate 5 is discharged. However, in this method, as described above, there are problems such as an increase in size and complexity of the apparatus. In addition, the large-sized constant temperature bath as described above is not disposed in the clean room. In addition, the precision machine such as the 'positioning of the inkjet nozzle i and the like to move it to the correction position' is placed in a constant temperature bath. If it is placed in a high-humidity atmosphere, it will be included in the clamp stage. Salty crying 1 i 3 cut test thief 'motor, bearing department

等精密機器造成不良影孿之虎 L 〜#之虞。此外,亦考慮到依基板5 的種類,會發生對圖案的不良影響。 此外’近年來,隨著平柘甚 十販員不态的大型化、高精細化, 導電性圖案7的微細化不斷進展, 呵琨展而亦有線寬5 #πι以下的導 電性圆案7。為了修正如上所 丁义导電1±圖案7的斷開缺陷 部7a,必須減小喷嘴1的噴射口肉僻 貝对内徑而減小液滴2a。在若減 小噴嘴1的喷射口内徑時,利用 才〗用壓力或熱而擠出修正墨水2 的吐出方法中’係不易吐出墨水。囡 垦求因此,必須使用靜電吸 引型的喷墨噴嘴卜本案發明係 解决如上所不之圖案修正裝 置的問題點者。 201240736 (實施形態l) 第3圖係顯示本發明之實施形態1之圖案修正裝置之主 要部位的剖面圖。在第3圖中,該圖案修正裝置係包括噴墨 喷嘴1與加濕單元8。加濕單元8係在圓筒狀的中空容器9的 内側設置吸收水的圓筒狀的加濕構件(水吸收構件)10者。 以加濕構件1 〇而言,係使用可進行加濕用的水的吸收及放 出的多孔室薄片等。 中空容器9的上端面9a係以可相對固定喷墨喷嘴j的固 定構件11的下端面11 a作安裝卸除的方法來進行固定。以固 定方法而言,可為利用未圖示的磁石的吸引力的方法、或 藉由螺絲所為之固定方法,方法不拘。 喷墨喷嘴1的基端部係被插嵌在形成於固定構件11之 下鈿面11 a的中央部的孔洞。喷墨喷嘴1的前端部係貫穿中 空容器9的孔洞,其前端係比中空容器9的下端面此朝向基 板5側突出預定距離W2_Wi。 °喷墓噴嘴1對斷開缺陷部7 a吐出修正墨水2時,以 喷墨噴嘴1的刖端與基板5保持微小間隙W1的方式使固定構 件11下降。間隙W1為例如1〇〇 " m。此時,巾空容器9的下端 面9b與基板5係以微小間隙W2(例如⑽“ m)而相面對。藉 藉由基板5表面之中的斷開缺陷部7a及其附近與中空容 裔9所包圍的空間係形成為大致密閉的狀態。因此,藉由由 ^ ..·、構件1 G所破放出的水蒸氣,空間内的濕度會局部變 门而去除斷開缺陷部73及其附近的靜電。若在該狀態下 夕墨水2,修正墨水2的液滴2a不會受到靜電影響, 10 201240736 而正確者彈在斷開缺陷部7a。因此,可正確修正斷開缺陷 部7a。 在該實施形態1中’係藉由由中空容器9及加濕構件i 〇 所構成的加濕單元8來將斷開缺陷部7a及其附近局部加 濕’因此與將圖案修正裝置及基板5全體收容在恒溫槽的習 知技術相比’可以簡單構成來正確修正斷開缺陷部7a。 第4圖(a)係顯示實施形態1之變更例的剖面圖,與第3 圖作對比的圖。此外,第4圖(b)為第4圖(〇的八箭視圖。在 第4圖(a)(b)中,在該變更例中係在中空容器9的下端部形 成有缺口部9c。該缺口部9c係形成為用以由中空容器9的外 側觀察對斷開缺陷部7 a之修正墨水2的吐出狀況及塗佈狀 況。 為了常時觀察由喷墨喷嘴1被吐出修正墨水2的狀態, 必須要有裝設有微透鏡的攝影機及照明,但是若存在有覆 蓋喷墨喷嘴1的前端的加濕單元8時,加濕單元8會成為觀察 的障礙。 因此’如第4圖(a)所示’在中空容器9設置2個缺口部 9c,透過一方缺口部9c而對斷開缺陷部7a照射照明光,由 另一方缺口部9c觀察對斷開缺陷部7a之修正墨水2的吐出 狀況及塗佈狀況。 在該變更例中’除了獲得與實施形態1相同的效果以 外,可一面觀察對斷開缺陷部7a的修正墨水2的吐出狀況及 塗佈狀況’一面正確修正斷開缺陷部7a。 其中’在攝影機側有落射照明的功能,若即使以落射 11 201240736 照明亦可充分觀察,則缺口部9 c亦可為1個。 第5圖係顯不實施形態丨之其他變更例的剖面圖,為與 第3圖作對比的圖。在第5圖中,在該變更例中,加濕單元8 係設置為可相對固定構件丨丨作安裝卸除。若使用前端愈來 愈細的玻璃毛細管作為喷墨喷嘴丨,由於其前端微細,因此 較佳為以當將加濕單元8作安裝卸除時不會損傷喷嘴丨的前 端的方式進行保護。因&,在該變更例中,係將保護喷墨 喷嘴1的前端的保護蓋12配備在固定構件丨丨内。 在第5圖中係顯示使保護蓋丨2下降而保護喷墨喷嘴丄的 月’J端的狀態。而第6圖係顯示裝設加濕單元8後,使保護蓋 12上升而使喷嘴i的前端與斷開缺陷部7a相面對的狀態,且 顯示可吐出修正墨水2的狀態。 保4蓋12係形成為筒狀,在保護蓋12内插入有喷嘴工。 保護蓋12係被内插在形成於固定構件丨丨之下端面的中央部 的孔洞11 b。喷嘴1的基端部係插嵌在固定構件丨丨的孔洞^ 的底部的+央部的孔。在固定構件n固接有磁石(未圖 不),藉由該磁石的磁氣吸引力,固定構件丨丨係形成為安裝 卸除自如,例如被裝設在可相對基板5以垂直方向作進退的 Z平台(未圖示)。 在保護蓋12的側面係固定有桿件13。該桿件13係被插 入在形成於固定構件11之孔洞Π b的側壁的長孔丨1 c。桿件 13係以可在長孔Uc内朝向上下方向移動的方式而設。若以 手使桿件13朝上下方向移動時,保護蓋12係相對固定構件 11在長孔11c的範圍内朝上下方向移動。 12 201240736 在保護蓋12的上端部的外周形成環狀溝槽12b,在保護 蓋12的下端部的外周形成環狀溝槽12c。在固定構件u的孔 洞1 lb的下端部的側壁設有柱塞14。柱塞14的球14a(或圓 筒)係藉由彈簧14b而相對保護蓋12的外周面呈垂直方向被 彈壓。藉由球14a進入至溝槽12b或12c,保護蓋12係被固定 在上側的位置或下側的位置。 若球14a進入至溝槽12b時,如第5圖所示,保護蓋12 係在下側的位置被固定,喷嘴i的前端係由保護蓋丨2覆蓋來 加以保護。若球14a進入至溝槽12c時,如第6圖所示,保護 蓋12係在上側的位置被固定,喷嘴】的前端會露出而可吐出 修正墨水2。 可藉由相對噴墨喷嘴丨使保護蓋丨2以上下作進退來保 護噴嘴1的前端,因此在加濕單元8安裝卸除時,或將裝設 有喷嘴1的固定構件u安裝卸除在未圖示的z軸時防止喷嘴 1發生損傷。 、 、其中,雖然亦考慮由喷嘴1的下側蓋上獨立的帽蓋來加 以保護’但是此時假想使帽蓋衝撞到喷嘴】的前端的情形。 相對於此,僅將保護蓋12朝上下方向移動,即可保護喷嘴 卜因此亦不會發生喷嘴1與保護蓋12的衝撞,操作性良好。 (實施形態2) a第7圖係顯示本發明之實施形態2之圖案修正裝置之主 要部位的剖面圖’與第6圖作對比的圖' 圖案修正梦番木,圆甲,在任亥 態下,噴嘴係在將加濕單元8裝設在固定構件η的狀 、 ”圓板狀的無用注入板15相面對。此外,包括 13 201240736 使無用注入板15每次以預定角度作旋轉驅動的電動機16。 在第7圖中係顯示喷墨喷嘴1的前端與無用注入板15的 上面具有一定間隙而呈面對的狀態^在該狀態下由喷嘴丄 的則端對無用注入板15的表面吐出修正墨水2,藉此防止基 板5被修正墨水2所污染,並且使喷嘴1的前端不會堵塞而使 墨水塗佈穩定化。通常,修i墨水2的無用;主入較佳為在將 修正墨水2吐出至基板5的表面的瞬前進行。 若以金屬形成無用注入板15而進行接地,在無用注/ 板15並未發生靜電,不會有所吐出的墨水2的液滴h發散白 It形因此並不需要將無用注入板1 5的表面加濕。此外, 若無用注入板15的表面為如玻璃般的絕緣體時,為了降伯 其表面電阻’以塗佈靜電防止劑為佳。例如若將矽氧烷, 的靜電防止劑塗佈在無用注入板15的表面時,會形成如, 璃般的物質的薄膜。該薄膜會吸附大氣中的水分因此矣 用注入板15的表面電阻會降低而防止帶電。 /、中’即使在無用注入板! 5的冑電防止不充分的情升 下,亦為無用注入板15與加濕單元8係具有微小間隙而相玉 對,加濕單元8係將位於喷嘴!下方的無用注入板i5的表$ 局部加濕。因此’無用注入的修正墨水2不會發散,而著彈 在無用注入板15的表面。 此外,在未進行修正的待機時,係料第7圖所示狀 ',加濕單元8的中空容器9的下端面此係與無用注入板厂 具而相面對’因此抑制加濕單以 1 0的乾燥。 稱评 14 201240736 進行修正墨水2的無用注入之後,如第8圖所示, 無用注入;^ 1 i 儿 朝輪向退避’並且使喷墨喷嘴1下降,將喷嘴 Y的別端與基板5的表面之間的間隙設定為預定值。在該狀 心中*噴嘴1的前端吐出修正墨水2的液滴2a,並且一面 將喷嘴1與基板5作相對移動-面形成修正墨水層2A。 甘 中 八’亦可在將喷嘴1下降而與基板5相面對的狀態丁 稍微留置待機時間,包含缺陷部7a的基板5的表面濕度變高 之後(呈穩定之後)再進行吐出。 接著,更加詳細說明圖案修正裝置的塗佈裝置。第9 圖至第11圖係顯示圖案修正裝置之塗佈裝置的詳細構成 圖’尤其’第9圖為塗佈裝置的正面圖,第i。圖為第9圖之 X_X線剖面圖,第11圖為第10圖之B箭視圖。在第9圖至第u 圖中係顯示在塗佈修正墨水2的噴墨喷嘴1的正下方,無用 注入板隔著間隙W3相面對,可進行無用注入動作的狀態。 其中’間隙W3係與前述間隙W1為相同程度。 此外,在第12圖至第14圖中係顯示無用注入板15以橫 向退避,並且喷墨噴嘴丨下降,噴嘴i與基板5隔著間隙Μ 相面對的狀態。可在該狀態下對基板5塗佈修正墨水2。第 12圖為圖案修正裝置之塗佈裝置的正面圖,第13圖為第u 圖之ΧΙΙΙ-ΧΙΠ線剖面圖,第丨4圖為第13圖之c箭視圖。 首先,使用第9圖至第11圖,說明塗佈裝置的構成。支 持塗佈裝置全體的基板17係垂直設置,在基板17的表面固 定有直動導引軸承18的滑動部18a,在基板丨7的背面固定有 直動導引軸承19的滑動部1 9a。直動導引軸承18的滑動部 15 201240736 18a係垂直配置,直動導引軸承丨9的滑動部i 9a係水平配置。 在直動導引軸承18的軌條部igb固定有剖面l字型的Z 平台2 0。因此,Z平台2 0係以可藉由直動導引軸承丨8而相對 基板1 7以上下方向作進退的方式予以支持。此外在z平台 2 0犬出的端部固定有滾筒21,在其一側面埋設有複數磁石 22。在直動導引軸承19的軌條部19b係固定有χ平台23。因 此’X平台23係以可藉由直動導引軸承19而相對基板17以水 平方向作進退的方式予以支持。 噴墨噴嘴1的基端部係被保持在固定構件丨卜在固定構 件11的-端面埋設有複數磁石24。固定構件11係藉由磁石 22與磁石24的吸引力而被裝設在ζ平台2〇。磁石22與磁石24 係錯開中心來作配置,目此將固定構件u裝設在ζ平台2〇 時,固定構件11係被吸引至下方,其端面lie被按廢在Ζ平 台20的上面20a而作定位。 在X平台23的下端固定右雷叙地 有電動機16,電動機16的旋轉軸 係被固定在圓板狀的無用注入杯丄 ,入扳15的中央。藉由電動機16 使無用注入板15每次旋轉預宕痒 w 丁貝疋角度,藉此可每次稍微改變 墨水2的無用注入位置。在嗜峰]认τ 社貰嘴1的正下方隔著一定的間隙 W3面對無用注入板15,在進扞i田、+ ^ 琨仃無用注入時,在無用注入板 15的表面進行無用注入。所無用注入的墨水2被層積而與噴 嘴1相接觸,以不會損傷噴嘴1的前端的方式,在預先進行 無用注人前’紐無用注人板15旋轉預定角度。 被固定在Z平台2 0的滾簡9 !技 苟21係與X平台23的上端部相抵 接。在X平台23的上端部係形成 ^ 、有水平部23a與傾斜部 16 201240736 23b的追隨面(凸輪面)。因此,噴嘴丄的垂直方向的高度位 置係由滾筒21與叉平台23的抵接位置決定。使χ平台23朝向 水平方向移動’而改變滾筒2mx平台23的抵接位置,藉此 可同時進行無用注入板15的退避與喷嘴丨的下降叫吏X平二 23移動的驅動裝置25(例如空氣汽缸或直動螺線管致動^ 係被固^在基板17,其輸出軸係、與X平台23相連結。驅動裝 置25的輸出軸係朝向水平方向作伸縮。 若在第9圖之狀態下’噴嘴1進行墨水2的無用注入時, 墨水2著彈在無用注入板15上。在無用注入結束後,使電動 機16的旋轉軸旋轉預定角度,而使無用注入板15旋轉預定 角度’以備下次的益用注入夕田 ,,,、用王入之用。假設不使無用注入板丄5 旋轉而經常在相同位置執杆i 仃‘、.、用/主入時,所無用注入的墨 尺2的液滴2a會堆積而與噴鳴”的前端相接冑,而有喷嘴1 發生損傷之虞。但是’ #由包括使無用注入板邮轉的功 月匕可使》玄虞慮/肖失。在無用注入結束,且無用注入板15 的旋‘預疋角度結束的時點,藉由驅動裝置25的操作來執 行無用注入板15的退避與噴嘴1的下降。其中,亦可在對缺 1^3部7 a的描繪結走gi nj. z- 來的4點使無用注入板15旋轉,來取代在 無用注入後使益用注入姑1 ζ 用庄入板15旋轉,而縮短從無用注入至描 繪開始的時間。 接著°兒月伴奴著X平台23的移動,Z平台20下降的製 私右藉由驅動裝置25的操作而使χ平台23作水平移動時, 初期係呈滾筒21與X平a ”沾u τ * 十σ U的水平部23a相抵接的狀態,因 此Z平台20並未下降,僅右A 00 ± 牛1皇有台23朝向水平方向移動。該 201240736 狀態係由喷嘴1的正下方持續至無用注入板15離開為止。之 後,若滾筒開始抵接於x平台23的傾斜部饥時,z平台2〇 係藉由直動導引轴承18而以其本身重量而開始下降在z 平台2G的突出部接觸到純17的上部料點停止下降。第 12圖至第14圖係顯示z平台2〇下降而停止的狀態。 藉由形成為如上所示之構成,即使為丨個驅動裝置Μ, 亦可進行水平方向與垂直方向的2軸驅動,而可實現裝置簡 化。此外’藉此’可在短時間内進行無用注人板15的退避 -、喷嘴1的下降,可防止墨水2在喷嘴丨内的黏度變高而無法 吐出。此外,由於以一連串動作進行無用注入板15的退避 與喷嘴1的下降’因此可回避喷嘴i與無用注入板15發生衝 撞的錯誤操作。 其中,若使用放大鏡等觀察光學系統,將由固定構件 11的端面11c至喷嘴丨的前端的距離設定為基準值之後再設 置固定構件11 ’固定構件11的端面11c與無用注入板15的距 離係成為一定,可將喷嘴1的前端與無用注入板15的表面的 間隙設定為預定值。因此’可防止喷嘴i的前端接觸無用注 入板1 5而受到損傷。 第15圖係顯示該圖案修正裝置之動作的流程圖。若接 文對基板5的描繪指令時,使塗佈裝置移動至描繪位置 (si),進行修正墨水2的無用注入(S2)。接著,使無用注入 板15退避,並且使噴嘴丨下降(S3)。之後’待機至基板5表 面之中的缺陷部7a及其附近被加濕為止(S4)。在濕度穩定 的狀態下吐出修正墨水2而描繪修正墨水層2A(S5)。修正墨 18 201240736 微小角度 藉此結束 水層2A的描繪一結束,使無用注入板i5旋轉 (S6),使無用注入板15恢復至喷嘴i的下方(s7) 1次塗佈動作。 對於生成於基板5的修正墨水層2A,在塗佈製程έ士束後 施行硬化處理或燒成處理。之後,若為進行基板5之水洗淨 的用途,對基板5的局部加濕的影響係成為可忽%的程产。 此外’進行加濕的期間係、僅在墨水塗佈(騎)時,在待又機 時,並未進行對基板5表面的局部加濕,因此可將對基板5 的影響止於最小限度。 (實施形態3) 第16圖及第Π圖係顯示本發明之實施形態2之圖案修 正裝置之主要部位圖,物與第9圖及第12圖作對比的 圖。第16圖係顯示待機狀態,第17圖係顯示可描繪的狀態。 在第16圖及第17圖中,該圖案修正裝置與實施形態2不同之 處在於加濕單元8以加濕單元26予以置換。 第18圖(a)⑻係顯示加濕單元_構成圖,第18圖㈦ 係第18圖⑷之xvniB-XVIIIB線剖_。在川圖(a)(b) 中,加濕單元26係包含:薄型有底的長方體狀容器30;長 方形狀的蓋部31 ’·及吸收供加濕之用的水的長方體狀的加 濕構件32。加濕構件32係被收容在容器则,容器3〇的開 口部係藉由蓋部31進行閉蓋。在蓋31的中央部、加濕構件 32的中央部、及容器30的中央部係分別形成有孔…、仏' 3〇a。孔31a、32a、30a的中心線係相一 3 0 a係構成1個貫穿孔。在該貫穿孔係插 致,孔 31a、32a、 入拔出喷墨噴嘴1 19 201240736 的前端部。此外,在蓋部31的角隅形成有螺絲孔33。 加濕單元26係以可在被固定在塗佈裝置的基板1?的支 持板28作安裝卸除的方式予以固定。在第16圖及第η圖 中,藉由將可用手轉動的螺栓29與設在加濕單元26的螺絲 孔33相螺合而加以固定。其中,亦可利用磁石的吸引力而 以可安裝卸除的方式設置加濕單元26 ’加濕單元26的固定 方法不拘。 加濕單元26係常時近接基板5來作配置。容器3〇的底面 與基板5的表面之間隙係被設定為例如1〜5随左右。在喷嘴 1對位在缺陷部7a的上方的階段,使缺陷部7a及其附近被局 4加濕,因此當將無用注入板1 5退避而將喷嘴1下降時,缺 陷部7a及其附近已經被適度加濕,積存在基板5表面的靜電 已經被放電。因此,亦可省略第15圖所示之流程圖之待機 製程(S4)。在該實施形態3中,亦可得與實施形態丨、2相同 的效果。 其中’為了使加濕能力提升’亦可如第丨9圖所示,將 容器30底部的孔3〇a形成為大於其他孔31a、32a,而設置基 板5與加濕構件32直接面對的區域。 此外,在本實施形態3中,為了進行第4圖(a)(b)所示 之斜向觀察’必須加大孔30a、31a、32a的直徑。但是,若 加大孔30a、31a、32a的直徑,將缺陷部73及其附近局部加 濕會變得較為困難。因此,在第2 〇圖之變更例中,由容器 30的側面與孔30a、31a、32a相連通的直線狀缺口部34係被 形成在容器30、蓋31、及加濕構件32。該缺口部34成為攝 20 201240736 影機或照明的光路,可觀察對缺陷部7a的修正墨水2的吐出 狀況或塗佈狀況。 此外’在本實施形態3中,在待機時亦有加濕單元26 與基板5近接面對的情形,此時’將正常的基板以面持續 局部加濕。若加濕時間變長時’亦假想在基板5表面局部發 生結露’而會在基板5發生不良影響。因此,如第16圖及第 17圖所示,亦可在加濕單元26的底面與基板5之間設置遮蔽 板35。遮蔽板35係在不需要將基板5的表面加料,被插入 在加濕單元26與基板5之間,在必須將基板5的表面加濕 時,則退避至脫離加濕單元26與基板5之間的位置。例如, 遮蔽板35係與無用注入板15的退避動作-起移動,如第16 圖及第17圖所示,遮蔽板35係與χ平台_連結。 (實施形態4) 第21圖係顯示本發明$眘# ^ & 4如/3之貝施形態4之圖案修正裝置4〇 之全體構成的斜視圖。在第21圖中,在該圖案修正裝置40 中’在定板41的中央部設有夾且4 對象的基仏 有丈」2’在失具42固定有修正 此外,在定板41裝載有支架型㈣載台…_ 係包含X軸載台43續門型的Y軸載台働。Y軸載台43b:以 跨越爽具42的方式而設,朝向= 台43a係被裝載於γ軸載台他,朝向圖中的乂方向移動 在X軸載台他裝載有可朝上下方向移動的z 44。在Z軸載台44裝載有觀察光學系統45 口 47、塗佈裝置48、及燒成梦物鏡46、雷射 燒成裝置50。错由控制乂軸裁台“a、γ 201240736 轴載台43b、及Z軸載台44,可使觀察光學系統45、雷射47、 塗佈裝置48、燒成裝置50的各個朝向基板5表面的所希望位 置的上方移動。 觀察光學系統45係使用在用以透過接物鏡46來觀察基 板5上的圖案的缺陷部以等。雷射47係使用在用以透過觀察 光學系統45及接物鏡46而對基板5上的缺陷照射雷射光,藉 由雷射㈣來將該缺陷形狀進行整形,或將多餘附著在^ 陷及其周圍的修正墨水2去除。塗佈裝置48係包含:吐出修 正墨水2的喷墨喷嘴1;將基板5表面局部加濕,可容易安裝 卸除的加濕單元8。 、 此外,亦可視需|而設置用以接受藉由嗔嘴^被益用 注入至塗佈裝置48内的修正墨水2的無用注入板15。在該例 中,塗佈裝置48係、透過可朝上下方向進退的z轴載台49而被 固定在Z軸載台44。塗佈裝置48可直接固定在Z軸載台44, 亦可固定在Z轴載台44以外者。此外,燒成裝置5G係被使用 在用以將被塗佈在基板5的修正墨水2進行燒成。 接著’說明該圖案修正裝置之動作。首先控制載台 43a ' 43b、44 ’將觀察光學系統45及接物鏡“的光轴定位 在斷開缺陷部7a 來觀察斷開缺陷部7a。若必須進行缺陷 部7 a的形狀整形時 係由雷射47對缺陷部7a照射雷射光而 將缺陷部7a整形成容易修正的形狀。 接著,控制載台, OL ,, 4如、43b、44,將噴墨喷嘴丨的前端定 位在缺陷部7a的上方,如 如貫%形態1〜3中之說明所示,在 將缺陷部7 a及其附近進行加 濕的狀態下對缺陷部7a吐出修 22 201240736 正墨水2的液滴2a,而在缺陷部7a形成修正墨水層2a。 接者,控制載台43a、43b、44,將燒成裝置5〇定位在 修正墨水層2A的上方,將修正墨水層以進行燒成而生成導 電性的導電性圖案。 第22圖係顯示圖案修正裝置之變更例圖。在該變更例 中,Z軸載台49以XYZ載台51予以置換。χγζ載台51係包含X 軸載台52、Ζ軸載台53及Υ轴載台54。χ轴載台52係使塗佈裝 置48朝向X軸方向移動。ζ軸載台53係使χ軸載台52朝向ζ軸 方向移動。Υ軸載台54係使ζ軸載台53朝向γ軸方向移動。 此時,亦可―面使用觀察光學系統45觀察斷開缺陷部 7a’ -面操作ΧΥΖ載台51,將塗佈|置48插入在接物⑽ 與基板5之間,而在缺陷部7a塗佈修正墨水2,在塗佈時係 省略大型的XY載台43的相對移動。 其中,亦可為未將塗佈裝置48放入至接物鏡46的正下 方,而使以觀察光學系統45所觀察到的缺陷部。作相對移 動而定位在塗佈裝置48的下方之後,再控制XYZ載台51來塗 佈修正墨水2的方式。 第23圖係顯示圖案修正裝置之其他變更例圖。在該變 更例中,在進行接物鏡46的倍率切換的接物鏡切換器(χγ 載台)55固定塗佈裝置48。接物鏡切換器55係被裝載於例如 第21圖之Ζ軸載台44。接物鏡切換器55係包含可朝水平方向 (ΧΥ方向)移動的可動板56。在可動板56的下面裝載有倍率 彼此不同的複數接物鏡46。在可動板56係與各接物鏡Μ相 對應形成有貫穿孔56a的開口。各接物鏡46的光軸係垂直貫 23 201240736 穿孔56a的中心。控制接物鏡切換器55,使所希望倍率的接 物鏡46的光轴與觀察光學系統45的光轴相一致,藉此可以 所希望的倍率觀察缺陷部7a。 塗佈裝置48係連同複數接物鏡46 _起裝載在可動板56 的下面。因此,可藉由控制接物鏡切換器55,來使塗佈裝 置48移動至缺陷部7a的上方。使用塗佈裝置48的修正墨水2 的塗佈方法係與前述方法相同,因此不再重覆其說明。在 該變更例中,係、可省略為第22圖之變更例的m載台51,因 此簡化裝置構成。此外,在離以接物鏡46觀察缺陷部㈣ 位置為較近的位置配置有塗佈裝置48,因此縮短塗佈裝置 48的移動時間’而縮短修正工作時間小 此外,亦可將測;t接物鏡切換器55與基板5的距離的距 離感測器(高度感測器)57裝載在接物鏡切換㈣。通f, 以利用觀察光學系統45所觀察的畫像位於焦點(聚焦)位置 =Z轴載台44的位置為基準,當在該狀態(聚焦狀態)下進行 …、用注入板15的退避及嗔嘴1 & :政+ 避贺嘴1的下降0夺,以喷嘴1與基板5 之間隙成為-定值的方式固定塗佈裝置侧位置。 但是,隨著基板5大型化,侖T0 , 取八1化愈不易水平維持基板5,其 = 的平坦度會變差’因此伴隨著無用注入板⑽移動, :下降至擋止件位置時,假想噴嘴1的前端會接觸到基 板5的情形。此外,由於在倍 ^ w 羊彼此不同的複數接物鏡46 的Z轴聚焦位置具有差里, _ # 因此即使在以聚焦位置為基準的 :二’亦依在開始塗佈時所被選擇的接物鏡⑽倍率, 由噴嘴1的前端至基板5的距離係稍微不同。因此,喷嘴丨 24 201240736 的刖與基板5相接觸的 含 散焦狀態下進行|用、、主入二:或者,在以人工在 …’板15的移動與嘴嘴1的下降的情 形下’亦同樣地有喷嘴i與基板5相接觸的可 較不理 想。 因此’為了避免基板5與噴嘴i的接觸或衝撞,在接物 ,切換器55設置以非接觸測定至基板5的距離的距離感測 Γ7。在進行伴隨噴嘴1下降的操作之前,根據以距離感測 Γ斤']疋到的至基板5的距離,來控制Ζ軸載台44,而將 接物鏡切換器55的上下方向的位置進行微調整。 # τ即&在塗佈裝置48的附近有精密機器,例 如距離感測器57、接物鏡46、接物鏡切換㈣等缺陷修 正時所加濕的區域係被限定在包含缺陷部&的微小範圍, 因此可使得對精密機器的影響止於最小限度。此外,加谭 早謂26)係安裝却除容易地|設在塗佈裝置_,因此可 進仃定期替換,可使維護時間縮短。 本次所揭示之實施形態應理解為均僅為例示,而非且 :制性者。本發明之範圍係藉由申請專利範圍來顯示,而 1上述說明,包含與中請專利範圍為均等的涵義及範圍内 的所有變更。 【圖式簡單說明】 第1圖係顯示作為本案發明之基礎之圖案修正裝置之 主要部位的剖面圖。 第2圖(a)(b)係例示修正對象之基板的圖。 201240736 之主 第3圖係顯示本發明之實施形態1之圖案修正裝置 要部位的剖面圖。 、 第4圖(a)(b)係顯示實施形態1之變更例圖。 第5圖係顯示實施形態1之其他變更例的剖面圖 第6圖係顯示第5圖所示之保護蓋之使用方法 叩剖面 圖 第7圖係顯示本發明之實施形態2之圖案修正裝置 要部位的剖面圖。 第8圖係顯示第7圖所示之圖案修正裝置之動作 之主 圖 的剖面 第9圖係顯示第7圖所示之塗佈裝置之詳細構成圖。 第1 0圖係顯示第9圖之X-X線剖面圖。 第11圖係顯示第1 〇圖之B箭視圖。 第1 2圖係顯示第8圖所示之塗佈裝置之詳細構成圖。 第1 3圖係第丨2圖之X丨π -X丨丨丨線剖面圖。 第14圖係第13圖之c箭視圖。 第15圖係顯示第7圖〜第14圖所示之塗佈裝置之^ ,,^ I動作 的流程圖。 之 第1 6圖係顯示本發明之實施形態3之圖案修正裝置 主要部位的剖面圖。 的剖 第17圖係顯示第16圖所示之圖案修正裝置之動作 面圖 圖 第18圖(a)(b)係顯示第1 6圖所示之加濕單元之 構成 26 201240736 第1 9圖係顯示實施形態3之變更例的剖面圖。 第20圖係顯示實施形態3之其他變更例圖。 第21圖係顯示本發明之實施形態4之圖案修正裝置之 全體構成圖。 〆 、 第2 2圖係顯示實施形態4之變更例圖。 第23圖係顯示實施形態4之α 【主要元件符號說明】 1 .喷墨噴嘴; 2a :液滴; 3 :電極; 5 :基板; 7 :導電性圖案; 8、26 :加濕單元 9a :上端面; 9c、34 :缺 口部; 11 :固定構件; 11 b :孔洞; 12 :保護蓋; 13 :桿件; 14a :球 2 :修正墨水; 2A :修正墨水層; 4 :對向電極; 6 :絕緣基板; 7a :斷開缺陷部; 9 :中空容器; 9b :下端面; 10、3 2 :加濕構件; I la :下端面; II c :長孔; 12b、12c :溝槽; 14 .柱塞, 14b :彈簧; 16 :電動機; 1 5 :無用注入板; 1 7 .基板, 18、19: 18 a ' 19 a :滑動部 18、19:直動導5丨軸承 18b' 19b.執條部; 27 201240736 20 : Z平台; 21 :滾筒; 23 : X平台; 23b :傾斜部; 28 :支持板; 30 :容器; 31 :蓋部; 35 :遮蔽板; 41 :定板; 43 : XY載台; 43b、54 : Y軸載台; 45 :觀察光學系統; 47 :雷射; 50 :燒成裝置; 5 5 :接物鏡切換器; 56a :貫穿孔;Such a precision machine caused a bad impact on the tiger L ~ #虞. Further, it is also considered that depending on the type of the substrate 5, adverse effects on the pattern may occur. In addition, in recent years, with the large-scale and high-definition of the flats and the tenths of the traders, the miniaturization of the conductive pattern 7 has been progressing, and the conductive round case with the cable width of 5 #πι is also being developed. . In order to correct the breakage defect portion 7a of the above-described conduction 1±pattern 7, it is necessary to reduce the ejection orifice of the nozzle 1 to reduce the droplet 2a with respect to the inner diameter. When the inner diameter of the ejection opening of the nozzle 1 is reduced, it is not easy to discharge the ink by the method of discharging the correction ink 2 by pressure or heat. Therefore, it is necessary to use an electrostatic suction type ink jet nozzle. The invention of the present invention solves the problem of the pattern correction device as described above. 201240736 (Embodiment 1) FIG. 3 is a cross-sectional view showing a main part of a pattern correction device according to Embodiment 1 of the present invention. In Fig. 3, the pattern correcting means includes an ink jet nozzle 1 and a humidifying unit 8. The humidifying unit 8 is provided with a cylindrical humidifying member (water absorbing member) 10 that absorbs water inside the cylindrical hollow container 9. In the humidifying member 1 ,, a porous chamber sheet which can absorb and release water for humidification is used. The upper end surface 9a of the hollow container 9 is fixed by attaching and detaching the lower end surface 11a of the fixing member 11 to which the ink jet nozzle j is fixed. The fixing method may be a method using an attractive force of a magnet (not shown) or a fixing method by a screw. The base end portion of the ink jet nozzle 1 is inserted into a hole formed in the central portion of the lower jaw surface 11a of the fixing member 11. The front end portion of the ink jet nozzle 1 penetrates the hole of the hollow container 9, and the front end thereof protrudes toward the substrate 5 side by a predetermined distance W2_Wi from the lower end surface of the hollow container 9. When the blasting nozzle 1 discharges the correction ink 2 to the broken defect portion 7a, the fixing member 11 is lowered so that the end of the inkjet nozzle 1 and the substrate 5 are kept at a small gap W1. The gap W1 is, for example, 1 〇〇 " m. At this time, the lower end surface 9b of the empty container 9 faces the substrate 5 with a small gap W2 (for example, (10) "m). By the broken defect portion 7a in the surface of the substrate 5 and its vicinity and the hollow volume The space surrounded by the ninth is formed in a substantially sealed state. Therefore, the moisture in the space is partially changed by the water vapor discharged from the member 1 G to remove the broken defect portion 73 and Static electricity in the vicinity. If the ink 2 is in this state, the droplet 2a of the correction ink 2 is not affected by static electricity, and 10 201240736 is correct, and the defective portion 7a is broken. Therefore, the broken defect portion 7a can be correctly corrected. In the first embodiment, the humidifying unit 8 composed of the hollow container 9 and the humidifying member i ' is partially humidified by the decomposing portion 7a and its vicinity. Therefore, the pattern correcting device and the substrate are provided. (5) A cross-sectional view showing a modified example of the first embodiment, which is a simple cross-sectional view of the first embodiment, is shown in Fig. 4(a), and is compared with the third figure. Fig. 4, Fig. 4(b) is the 4th figure (the eight-arrow view of the 。. In the modified example, in the modified example, a notch portion 9c is formed in the lower end portion of the hollow container 9. The notch portion 9c is formed to be used for obstructing the defective portion from the outside of the hollow container 9. 7 a correction of the discharge state and application state of the ink 2. In order to constantly observe the state in which the correction ink 2 is discharged by the inkjet nozzle 1, it is necessary to have a camera and illumination equipped with a microlens, but if there is a cover ink When the humidifying unit 8 at the tip end of the nozzle 1 is used, the humidifying unit 8 becomes an obstacle to observation. Therefore, as shown in Fig. 4(a), two notch portions 9c are provided in the hollow container 9, and the one notch portion 9c is passed through. Irradiation light is applied to the broken defect portion 7a, and the discharge state and the application state of the correction ink 2 to the broken defect portion 7a are observed by the other notch portion 9c. In this modified example, the same effect as in the first embodiment is obtained. In addition, it is possible to correct the disconnection defect portion 7a while observing the discharge state and the application state of the correction ink 2 of the disconnected defective portion 7a. "There is a function of epi-illumination on the camera side, even if it is illuminated by the projection 11 201240736. Fully In view of the above, the notch portion 9c may be one. Fig. 5 is a cross-sectional view showing another modification of the embodiment, and is a view in comparison with Fig. 3. In Fig. 5, the modification is shown in Fig. 5. The humidifying unit 8 is provided to be attachable and detachable with respect to the fixing member. If a glass capillary which is thinner and thinner at the front end is used as the ink jet nozzle 丨, since the front end is fine, it is preferable to humidify The unit 8 is protected from damage to the front end of the nozzle 时 when it is attached and detached. In this modification, the protective cover 12 that protects the front end of the inkjet nozzle 1 is placed in the fixing member 。. In Fig. 5, the state in which the protective cover 丨 2 is lowered to protect the month 'J end of the ink jet nozzle 。 is shown. In the sixth embodiment, after the humidifying unit 8 is installed, the protective cover 12 is raised to bring the tip end of the nozzle i into contact with the broken defect portion 7a, and the state in which the correction ink 2 can be discharged is displayed. The cover 4 is formed in a tubular shape, and a nozzle is inserted into the protective cover 12. The protective cover 12 is inserted into a hole 11b formed in a central portion of the lower end surface of the fixing member. The base end portion of the nozzle 1 is inserted into the hole of the + central portion of the bottom of the hole ^ of the fixing member. A magnet (not shown) is fixed to the fixing member n, and the fixing member is formed to be detachably attached and detached by the magnetic attraction force of the magnet, for example, it is installed in the vertical direction with respect to the substrate 5 Z platform (not shown). A lever member 13 is fixed to the side of the protective cover 12. The rod member 13 is inserted into the long hole 丨 1 c formed in the side wall of the hole Π b of the fixing member 11. The rod member 13 is provided to be movable in the vertical direction in the long hole Uc. When the lever member 13 is moved in the vertical direction by the hand, the protective cover 12 is moved in the vertical direction with respect to the fixing member 11 within the range of the long hole 11c. 12 201240736 An annular groove 12b is formed on the outer periphery of the upper end portion of the protective cover 12, and an annular groove 12c is formed on the outer periphery of the lower end portion of the protective cover 12. A plunger 14 is provided on the side wall of the lower end portion of the hole 1 lb of the fixing member u. The ball 14a (or the cylinder) of the plunger 14 is biased in the vertical direction with respect to the outer peripheral surface of the protective cover 12 by the spring 14b. By the ball 14a entering the groove 12b or 12c, the protective cover 12 is fixed at the upper side position or the lower side position. When the ball 14a enters the groove 12b, as shown in Fig. 5, the protective cover 12 is fixed at the lower side, and the front end of the nozzle i is covered by the protective cover 2 to be protected. When the ball 14a enters the groove 12c, as shown in Fig. 6, the protective cover 12 is fixed at the upper position, and the tip end of the nozzle is exposed to discharge the correction ink 2. The front end of the nozzle 1 can be protected by advancing and retracting the protective cover 2 against the ink jet nozzle ,. Therefore, when the humidifying unit 8 is attached or detached, or the fixing member u to which the nozzle 1 is mounted is attached and detached, When the z-axis is not shown, the nozzle 1 is prevented from being damaged. Further, it is considered that the front end of the nozzle 1 is covered with a separate cap to protect the front end of the nozzle, but the cap is supposed to collide with the nozzle. On the other hand, by merely moving the protective cover 12 in the vertical direction, the nozzle can be protected, and therefore the collision between the nozzle 1 and the protective cover 12 does not occur, and the operability is good. (Embodiment 2) FIG. 7 is a cross-sectional view showing a main portion of the pattern correction device according to Embodiment 2 of the present invention, which is compared with FIG. 6 and a pattern correction dream, a round armor, in a state of the sea. The nozzle faces the disk-shaped unnecessary injection plate 15 in which the humidifying unit 8 is attached to the fixing member η. In addition, 13 201240736 is used to rotate the unnecessary injection plate 15 at a predetermined angle each time. The motor 16 is shown in Fig. 7 in a state in which the front end of the ink jet nozzle 1 and the upper surface of the unnecessary injection plate 15 are faced with a certain gap. In this state, the end of the nozzle is the surface of the unnecessary injection plate 15 The correction ink 2 is discharged, thereby preventing the substrate 5 from being contaminated by the correction ink 2, and the front end of the nozzle 1 is not clogged to stabilize the ink application. Generally, the ink 2 is useless; the main input is preferably Correction of the ink 2 is discharged to the surface of the substrate 5. The grounding is performed by forming the unnecessary injection plate 15 with metal, and no static electricity is generated in the unnecessary injection/plate 15, and the droplets h of the discharged ink 2 are not dissipated. White It shape does not need to be useless The surface of the injection plate 15 is humidified. Further, if the surface of the injection plate 15 is a glass-like insulator, it is preferable to apply an antistatic agent to reduce the surface resistance of the plate 15. For example, if a buffer is used, When the static electricity prevention agent is applied to the surface of the unnecessary injection plate 15, a film of a material such as a glass is formed, and the film adsorbs moisture in the atmosphere, so that the surface resistance of the injection plate 15 is lowered to prevent charging. In the case of 'useless injection plate! 5's electric power to prevent insufficient rise, the useless injection plate 15 and the humidification unit 8 have a small gap, and the humidification unit 8 will be located below the nozzle! The table of the useless injection plate i5 is locally humidified. Therefore, the 'injectable correction ink 2 does not diverge, and the shot is on the surface of the unnecessary injection plate 15. In addition, in the standby without correction, the figure 7 is As shown in the figure, the lower end surface of the hollow container 9 of the humidifying unit 8 is faced with the useless injection plate factory. Therefore, the drying of the humidifying unit is suppressed by 10%. Comment 14 201240736 Performing the useless injection of the correction ink 2 After that, as shown in Figure 8. Useless injection; ^ 1 i the wheel retreats ' and the ink jet nozzle 1 is lowered, and the gap between the other end of the nozzle Y and the surface of the substrate 5 is set to a predetermined value. In the center of the heart * the front end of the nozzle 1 is spouted The droplet 2a of the ink 2 is corrected, and the nozzle 1 and the substrate 5 are moved relative to each other to form a correction ink layer 2A. The squash can also be left in a state where the nozzle 1 is lowered to face the substrate 5 In the standby time, after the surface humidity of the substrate 5 including the defective portion 7a is increased (after stabilization), the discharge is performed. Next, the application device of the pattern correction device will be described in more detail. FIGS. 9 to 11 show the pattern correction device. Detailed configuration of the coating device 'particularly' Fig. 9 is a front view of the coating device, i. The figure is a cross-sectional view taken along line X_X of Fig. 9, and Fig. 11 is a view of arrow B of Fig. 10. In the ninth to ninth drawings, the ink-injection nozzle 1 to which the correction ink 2 is applied is displayed, and the unnecessary injection plate faces the gap W3, and the unnecessary injection operation can be performed. Here, the gap W3 is the same as the gap W1 described above. Further, in Figs. 12 to 14, the useless injection plate 15 is retracted in the lateral direction, and the ink jet nozzle 丨 is lowered, and the nozzle i and the substrate 5 are opposed to each other with the gap Μ interposed therebetween. The correction ink 2 can be applied to the substrate 5 in this state. Fig. 12 is a front view of the coating device of the pattern correction device, Fig. 13 is a cross-sectional view taken along the line ΧΙΠ-ΧΙΠ of the u-th, and Fig. 4 is a view of the arrow c of Fig. 13. First, the configuration of the coating device will be described using Figs. 9 to 11 . The substrate 17 supporting the entire coating apparatus is vertically disposed, and the sliding portion 18a of the linear motion guide bearing 18 is fixed to the surface of the substrate 17, and the sliding portion 19a of the linear motion guide bearing 19 is fixed to the back surface of the substrate cassette 7. The sliding portion of the linear motion guide bearing 18 15 201240736 18a is vertically disposed, and the sliding portion i 9a of the linear motion guide bearing 9 is horizontally disposed. A Z-stage 20 of a cross-sectional shape is fixed to the rail portion igb of the linear motion guide bearing 18. Therefore, the Z-platform 20 is supported by the linear motion guide bearing 8 so as to advance and retreat relative to the upper and lower sides of the substrate 17. Further, a drum 21 is fixed to the end of the z-platform, and a plurality of magnets 22 are embedded on one side thereof. A cymbal platform 23 is fixed to the rail portion 19b of the linear motion guide bearing 19. Therefore, the 'X stage 23 is supported by the linear motion guide bearing 19 so as to advance and retreat relative to the substrate 17 in the horizontal direction. The base end portion of the ink jet nozzle 1 is held by the fixing member, and a plurality of magnets 24 are embedded in the end surface of the fixed member 11. The fixing member 11 is attached to the crucible table 2 by the attraction of the magnet 22 and the magnet 24. The magnet 22 and the magnet 24 are arranged in a staggered center. When the fixing member u is mounted on the crucible platform 2, the fixing member 11 is attracted to the lower side, and the end surface lie is scrapped on the upper surface 20a of the crucible platform 20. Positioning. The motor 16 is fixed to the lower end of the X stage 23, and the rotating shaft of the motor 16 is fixed to a disc-shaped unnecessary infusion cup, which is inserted into the center of the wrench 15. The useless injection plate 15 is rotated by the motor 16 to pre-itch the wrinkle angle, whereby the useless injection position of the ink 2 can be slightly changed each time. The unnecessary injection plate 15 is placed under the gap W3 with a certain gap W3 directly under the 嗜 ] 贳 贳 贳 , , , , , , , , , , , , 、 、 、 、 、 、 、 、 、 无 无 无 无 无 无 无 无 无 无 无 无 无 无 无 无 无. The ink 2 to be injected is laminated in contact with the nozzle 1 so as not to damage the front end of the nozzle 1, and the unnecessary use of the injection plate 15 is rotated by a predetermined angle before the unnecessary use of the nozzle. The roll-up 9 technology that is fixed to the Z-platform 20 is in contact with the upper end of the X-stage 23. At the upper end portion of the X stage 23, a follower surface (cam surface) having a horizontal portion 23a and an inclined portion 16 201240736 23b is formed. Therefore, the height position of the nozzle 垂直 in the vertical direction is determined by the abutment position of the drum 21 and the fork platform 23. The abutment position of the drum 2mx platform 23 is changed by moving the weir platform 23 in the horizontal direction, whereby the retraction of the useless injection plate 15 and the lowering of the nozzle 吏 can be simultaneously performed by the drive device 25 (for example, air) The cylinder or the linear actuator actuation is fixed to the substrate 17, and the output shaft is coupled to the X platform 23. The output shaft of the drive unit 25 is expanded and contracted in the horizontal direction. When the nozzle 1 performs the unnecessary injection of the ink 2, the ink 2 is shot on the unnecessary injection plate 15. After the endless injection is completed, the rotation axis of the motor 16 is rotated by a predetermined angle, and the unnecessary injection plate 15 is rotated by a predetermined angle ' Prepare the next benefit for the injection of Xitian,,,, and use the king. Assume that the useless injection plate 丄5 does not rotate and often performs the same position in the same position i 仃 ', ., with / main entry, useless injection The droplet 2a of the ink ruler 2 will accumulate and come into contact with the front end of the squirting sound, and there is a flaw in the nozzle 1. However, '# by the power of the moon including the useless injection plate can make it" / Xiao lost. At the end of useless injection, and useless injection plate 1 At the time when the rotation of the pre-twist angle of 5 is completed, the retraction of the unnecessary injection plate 15 and the lowering of the nozzle 1 are performed by the operation of the driving device 25. Among them, the drawing of the missing portion 1a can also be performed. The four points of nj. z- rotate the useless injection plate 15 instead of rotating the use of the injection plate 15 after the unnecessary injection, thereby shortening the time from the useless injection to the start of the drawing. With the movement of the X platform 23, the Z platform 20 is lowered by the operation of the driving device 25, and when the cymbal platform 23 is horizontally moved, the initial stage is the drum 21 and the X flat a ” u u τ * ten σ The horizontal portion 23a of the U abuts, so the Z-platform 20 does not descend, and only the right A 00 ± 牛 1 皇 has a table 23 moving in the horizontal direction. The 201240736 state continues from the immediately below the nozzle 1 to the useless injection plate 15 After leaving, if the drum starts to abut on the inclined portion of the x-platform 23, the z-platform 2 starts to descend by the direct-moving guide bearing 18 by its own weight, and the protrusion of the z-platform 2G comes into contact with The upper material point of pure 17 stops falling. Figures 12 to 14 show the z platform 2〇 The state of falling and stopping. By forming the configuration as described above, even if it is one drive device, two-axis driving in the horizontal direction and the vertical direction can be performed, and the device can be simplified. The evacuation of the useless injection plate 15 and the lowering of the nozzle 1 are prevented in a short period of time, so that the viscosity of the ink 2 in the nozzle 变 can be prevented from becoming high and the discharge can be prevented. Further, the evacuation of the unnecessary injection plate 15 and the nozzle 1 are performed in a series of operations. In the case of using an observation optical system such as a magnifying glass, the distance from the end surface 11c of the fixing member 11 to the front end of the nozzle 设定 is set as a reference value, and then the erroneous operation is performed. The distance between the end surface 11c of the fixing member 11' fixing member 11 and the unnecessary injection plate 15 is constant, and the gap between the tip end of the nozzle 1 and the surface of the unnecessary injection plate 15 can be set to a predetermined value. Therefore, the front end of the nozzle i can be prevented from being damaged by contact with the unnecessary injection plate 15 . Fig. 15 is a flow chart showing the operation of the pattern correcting means. When the drawing instruction to the substrate 5 is received, the coating device is moved to the drawing position (si), and the unnecessary injection of the corrected ink 2 is performed (S2). Next, the unnecessary injection plate 15 is retracted, and the nozzle 丨 is lowered (S3). Thereafter, the defect portion 7a in the surface of the substrate 5 and its vicinity are waited until it is humidified (S4). The correction ink 2 is discharged while the humidity is stable, and the correction ink layer 2A is drawn (S5). Correction ink 18 201240736 Minor angle By this end, the drawing of the water layer 2A is completed, and the unnecessary injection plate i5 is rotated (S6), and the unnecessary injection plate 15 is returned to the lower side of the nozzle i (s7). The correction ink layer 2A formed on the substrate 5 is subjected to a hardening treatment or a baking treatment after coating the process gentleman's bundle. Thereafter, in order to clean the substrate 5 with water, the effect of local humidification on the substrate 5 is negligible. Further, during the period of humidification, only when the ink is applied (riding), local humidification of the surface of the substrate 5 is not performed when the machine is to be mounted again, so that the influence on the substrate 5 can be minimized. (Embodiment 3) Fig. 16 is a view showing a main part of a pattern correction device according to a second embodiment of the present invention, and a comparison between the object and Figs. 9 and 12. Fig. 16 shows the standby state, and Fig. 17 shows the state that can be depicted. In Figs. 16 and 17, the pattern correcting device differs from the second embodiment in that the humidifying unit 8 is replaced by the humidifying unit 26. Fig. 18 (a) and (8) show the humidifying unit _ composition diagram, and Fig. 18 (seven) is the xvniB-XVIIIB line _ of Fig. 18 (4). In the map (a) and (b), the humidifying unit 26 includes a thin-bottomed rectangular parallelepiped container 30, a rectangular lid portion 31', and a rectangular parallelepiped that absorbs water for humidification. Member 32. When the humidifying member 32 is housed in the container, the opening portion of the container 3 is closed by the lid portion 31. Holes..., 仏' 3〇a are formed in the central portion of the lid 31, the central portion of the humidifying member 32, and the central portion of the container 30, respectively. The center line of the holes 31a, 32a, and 30a is one through hole and constitutes one through hole. The through holes are inserted, and the holes 31a and 32a are inserted into and pulled out of the front end portion of the ink jet nozzle 1 19 201240736. Further, a screw hole 33 is formed in the corner of the lid portion 31. The humidifying unit 26 is fixed so as to be attachable and detachable to the supporting plate 28 fixed to the substrate 1 of the coating device. In Fig. 16 and Fig. 11, the bolt 29 which can be rotated by hand is screwed to the screw hole 33 provided in the humidifying unit 26 to be fixed. Here, the fixing method of the humidifying unit 26' humidifying unit 26 may be provided in such a manner that the attraction force of the magnet can be attached or detached. The humidifying unit 26 is normally disposed adjacent to the substrate 5. The gap between the bottom surface of the container 3 and the surface of the substrate 5 is set to, for example, 1 to 5 depending on the left and right. When the nozzle 1 is positioned above the defect portion 7a, the defect portion 7a and its vicinity are humidified by the station 4, so when the unnecessary injection plate 15 is retracted and the nozzle 1 is lowered, the defect portion 7a and its vicinity are already It is moderately humidified, and static electricity accumulated on the surface of the substrate 5 has been discharged. Therefore, the standby process of the flowchart shown in Fig. 15 can be omitted (S4). Also in the third embodiment, the same effects as those of the embodiments 丨 and 2 can be obtained. Wherein 'in order to improve the humidifying ability', as shown in FIG. 9, the hole 3〇a at the bottom of the container 30 is formed to be larger than the other holes 31a, 32a, and the setting substrate 5 and the humidifying member 32 are directly faced. region. Further, in the third embodiment, it is necessary to increase the diameters of the holes 30a, 31a, 32a in order to observe obliquely as shown in Figs. 4(a) and 4(b). However, if the diameters of the holes 30a, 31a, 32a are increased, it is difficult to locally wet the defective portion 73 and its vicinity. Therefore, in the modified example of the second drawing, the linear notch portion 34 that communicates with the holes 30a, 31a, and 32a from the side surface of the container 30 is formed in the container 30, the lid 31, and the humidifying member 32. The notch portion 34 serves as an optical path for capturing the camera or illumination of the 201240736, and can observe the discharge state or the application state of the correction ink 2 to the defective portion 7a. Further, in the third embodiment, the humidifying unit 26 is in close contact with the substrate 5 during standby, and at this time, the normal substrate is locally humidified on the surface. If the humidification time becomes long, it is also assumed that condensation is locally formed on the surface of the substrate 5, which may adversely affect the substrate 5. Therefore, as shown in Figs. 16 and 17, a shielding plate 35 may be provided between the bottom surface of the humidifying unit 26 and the substrate 5. The shielding plate 35 is inserted between the humidifying unit 26 and the substrate 5 without feeding the surface of the substrate 5, and is retracted to the dehumidifying unit 26 and the substrate 5 when the surface of the substrate 5 must be humidified. The location between. For example, the shielding plate 35 is moved from the retracting operation of the unnecessary injection plate 15, and as shown in Figs. 16 and 17, the shielding plate 35 is coupled to the cymbal plate_. (Embodiment 4) Fig. 21 is a perspective view showing the overall configuration of a pattern correcting device 4A of the present invention, such as $慎#^ & In Fig. 21, in the pattern correcting device 40, 'the center portion of the fixed plate 41 is provided with a clip and the base of the object 4 is fixed." 2' is fixed in the missing piece 42. Further, the fixed plate 41 is loaded. Bracket type (four) stage..._ is a Y-axis stage that includes the X-axis stage 43 continuous door type. The Y-axis stage 43b is provided so as to straddle the cooling device 42. The orientation = table 43a is mounted on the γ-axis stage, and is moved in the 乂 direction in the figure. The X-axis stage is loaded and can be moved in the vertical direction. z 44. The observation optical system 45 port 47, the coating device 48, the burned dream objective lens 46, and the laser firing device 50 are mounted on the Z-axis stage 44. By controlling the cymbal cutting table "a, γ 201240736, the shaft stage 43b, and the Z-axis stage 44, the observation optical system 45, the laser 47, the coating device 48, and the firing device 50 are each directed toward the surface of the substrate 5. The upper portion of the desired position is moved. The observation optical system 45 is used to observe the defective portion of the pattern on the substrate 5 through the objective lens 46. The laser 47 is used to transmit the observation optical system 45 and the objective lens. 46, the laser light is irradiated to the defect on the substrate 5, the shape of the defect is shaped by the laser (4), or the correction ink 2 attached to the periphery and the periphery is removed. The coating device 48 includes: discharge correction The inkjet nozzle 1 of the ink 2; the surface of the substrate 5 is partially humidified, and the humidifying unit 8 can be easily attached and detached. Further, it can be disposed to accept the injection of the nozzle by the nozzle. In the cloth device 48, the unnecessary injection plate 15 for correcting the ink 2. In this example, the coating device 48 is fixed to the Z-axis stage 44 by passing through the z-axis stage 49 that can advance and retreat in the vertical direction. 48 can be directly fixed to the Z-axis stage 44, or can be fixed to the Z-axis stage 4 In addition, the firing device 5G is used to burn the correction ink 2 applied to the substrate 5. Next, the operation of the pattern correction device will be described. First, the stages 43a' 43b, 44 are controlled. The optical axis of the observation optical system 45 and the objective lens is positioned at the broken defect portion 7a to observe the broken defect portion 7a. When it is necessary to shape the defective portion 7a, the laser beam 47 irradiates the defective portion 7a with the laser light, and the defective portion 7a is formed into a shape that can be easily corrected. Next, the stages, OL, and 4, 43b, 44 are controlled to position the front end of the ink jet nozzle 上方 above the defective portion 7a, as shown in the description of % of the forms 1 to 3, in the defective portion 7 In the state where a and the vicinity thereof are humidified, the droplet 2a of the positive ink 2 is discharged to the defective portion 7a, and the corrected ink layer 2a is formed on the defective portion 7a. Then, the stages 23a, 43b, and 44 are controlled, and the firing apparatus 5A is positioned above the correction ink layer 2A, and the ink layer is corrected to be fired to generate a conductive conductive pattern. Fig. 22 is a view showing a modification of the pattern correction device. In this modification, the Z-axis stage 49 is replaced by the XYZ stage 51. The χγζ stage 51 includes an X-axis stage 52, a Ζ-axis stage 53, and a Υ-axis stage 54. The boring stage 52 moves the coating device 48 in the X-axis direction. The boring stage 53 moves the boring stage 52 in the x-axis direction. The boring stage 54 moves the boring stage 53 in the γ-axis direction. At this time, it is also possible to use the observation optical system 45 to observe the broken defect portion 7a'-the surface operation of the yoke 51, and to insert the coating|disassembly 48 between the object (10) and the substrate 5, and apply it to the defect portion 7a. The cloth correction ink 2 omits the relative movement of the large XY stage 43 at the time of coating. Alternatively, the coating device 48 may not be placed directly below the objective lens 46 to cause the defective portion observed by the observation optical system 45. After being positioned below the coating device 48 with relative movement, the XYZ stage 51 is controlled to apply the correction ink 2. Fig. 23 is a view showing another modification of the pattern correction device. In this modification, the coating device 48 is fixed to the objective lens switch (χγ stage) 55 that performs the magnification switching of the objective lens 46. The objective lens switch 55 is mounted on, for example, the x-axis stage 44 of Fig. 21. The objective lens switch 55 includes a movable plate 56 that is movable in the horizontal direction (ΧΥ direction). A plurality of objective lenses 46 having different magnifications are mounted on the lower surface of the movable plate 56. The movable plate 56 is formed with an opening of the through hole 56a corresponding to each of the objective lenses. The optical axis of each of the objective lenses 46 is perpendicular to the center of the perforation 56a. The objective lens switch 55 is controlled so that the optical axis of the objective lens 46 of the desired magnification coincides with the optical axis of the observation optical system 45, whereby the defective portion 7a can be observed at a desired magnification. The coating device 48 is loaded under the movable plate 56 together with a plurality of objective lenses 46. Therefore, the coating device 48 can be moved above the defective portion 7a by controlling the objective lens switch 55. The coating method of the correction ink 2 using the coating device 48 is the same as the above-described method, and therefore the description thereof will not be repeated. In the modified example, the m stage 51 which is a modified example of Fig. 22 can be omitted, and the apparatus configuration is simplified. Further, since the application device 48 is disposed at a position closer to the position at which the defective portion (4) is viewed by the objective lens 46, the movement time of the application device 48 is shortened, and the correction operation time is shortened, and the measurement can be performed. A distance sensor (height sensor) 57 of the distance of the objective lens switch 55 from the substrate 5 is loaded in the objective lens switching (4). By f, the image observed by the observation optical system 45 is located at the focus (focus) position = the position of the Z-axis stage 44, and when it is in this state (focus state), the retraction of the injection plate 15 is performed. The mouth 1 & : the + drop of the mouthpiece 1 is fixed, and the position of the coating device side is fixed so that the gap between the nozzle 1 and the substrate 5 becomes constant. However, as the substrate 5 is enlarged, the tensor T0 is more difficult to maintain the substrate 5 horizontally, and the flatness of = is deteriorated. Therefore, the use of the unnecessary injection plate (10) is moved, and when it is lowered to the stopper position, The front end of the imaginary nozzle 1 is in contact with the substrate 5. In addition, since the Z-axis focus position of the plurality of objective mirrors 46 different from each other has a difference, _# is therefore selected based on the focus position: the second is also selected at the start of coating. The objective lens (10) magnification is slightly different from the distance from the front end of the nozzle 1 to the substrate 5. Therefore, when the nozzle 丨24 201240736 is in contact with the substrate 5, the defocusing state is performed, and the main input is two: or, in the case of manual movement of the plate 15 and the drop of the nozzle 1 ' Similarly, it may be less desirable to have the nozzle i in contact with the substrate 5. Therefore, in order to avoid contact or collision of the substrate 5 with the nozzle i, the switch 55 is provided with a distance sensing Γ7 which is measured in a non-contact distance to the substrate 5. Before the operation accompanying the descending of the nozzle 1, the crucible stage 44 is controlled according to the distance to the substrate 5 by the distance sensing, and the position of the objective lens switch 55 in the up and down direction is slightly Adjustment. #τ即和amp; There is a precision machine in the vicinity of the coating device 48, for example, the region humidified by the defect correction such as the distance sensor 57, the objective lens 46, and the objective lens switching (4) is limited to the portion including the defect portion & The small range allows the impact on precision machines to be minimized. In addition, Jia Tan said that 26) is installed but it is easy to set up in the coating device _, so it can be replaced regularly, which can shorten the maintenance time. The embodiments disclosed herein are to be understood as being illustrative only and not as The scope of the present invention is defined by the scope of the claims, and the above description includes all modifications within the meaning and scope of the claims. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a cross-sectional view showing the main part of a pattern correction device which is the basis of the present invention. Fig. 2(a) and Fig. 2(b) are diagrams showing a substrate to be corrected. Fig. 3 is a cross-sectional view showing a part of the pattern correction device according to the first embodiment of the present invention. Fig. 4(a) and Fig. 4(b) are diagrams showing a modification of the first embodiment. Fig. 5 is a cross-sectional view showing another modification of the first embodiment. Fig. 6 is a view showing a method of using the protective cover shown in Fig. 5. Fig. 7 is a view showing a pattern correction device according to a second embodiment of the present invention. A sectional view of the part. Fig. 8 is a cross-sectional view showing the operation of the pattern correcting device shown in Fig. 7. Fig. 9 is a view showing a detailed configuration of the coating device shown in Fig. 7. Fig. 10 shows a cross-sectional view taken along line X-X of Fig. 9. Figure 11 shows the B arrow view of Figure 1. Fig. 12 is a view showing a detailed configuration of the coating device shown in Fig. 8. Figure 13 is a cross-sectional view of the X丨π-X丨丨丨 line of Figure 2. Figure 14 is a view of the arrow c of Figure 13. Fig. 15 is a flow chart showing the operation of the coating apparatus shown in Figs. 7 to 14 . Fig. 16 is a cross-sectional view showing the main part of the pattern correction device according to the third embodiment of the present invention. Fig. 17 is a view showing the operation surface of the pattern correction device shown in Fig. 16. Fig. 18 (a) and (b) show the composition of the humidifying unit shown in Fig. 16. 201240736 Fig. 19 A cross-sectional view showing a modified example of the third embodiment is shown. Fig. 20 is a view showing another modification of the third embodiment. Figure 21 is a view showing the overall configuration of a pattern correction device according to a fourth embodiment of the present invention. Fig. 2 is a diagram showing a modification of the fourth embodiment. Figure 23 is a diagram showing α of Embodiment 4 [Explanation of main component symbols] 1. Inkjet nozzle; 2a: Droplet; 3: Electrode; 5: Substrate; 7: Conductive pattern; 8, 26: Humidification unit 9a: Upper end face; 9c, 34: notch; 11: fixing member; 11 b: hole; 12: protective cover; 13: rod; 14a: ball 2: correction ink; 2A: correction ink layer; 4: counter electrode; 6: insulating substrate; 7a: breaking defective portion; 9: hollow container; 9b: lower end surface; 10, 3 2: humidifying member; I la: lower end surface; II c: long hole; 12b, 12c: groove; 14. Plunger, 14b: spring; 16: motor; 1 5: useless injection plate; 1 7. substrate, 18, 19: 18 a ' 19 a : sliding portion 18, 19: direct-acting guide 5丨 bearing 18b' 19b . Regulations; 27 201240736 20 : Z platform; 21: roller; 23: X platform; 23b: inclined portion; 28: support plate; 30: container; 31: cover; 35: shielding plate; 41: fixed plate; 43: XY stage; 43b, 54: Y-axis stage; 45: observation optical system; 47: laser; 50: firing device; 5 5: objective switch; 56a: through hole;

Wl 、 W2 、 W3 :間隙。 20a :上面; 22、24 :磁石; 2 3 a :水平部; 2 5 :驅動裝置; 2 9 :螺栓; 30a、 31a、 32a:孔; 3 3 :螺絲孔; 40 :圖案修正裝置; 42 :夾具; 43a、52 : X軸載台; 44、46、53 : Z軸載台 46 :接物鏡; 48 :塗佈裝置; 51 : XYZ載台; 56 :可動板; 5 7 :距離感測器; 28Wl, W2, W3: gap. 20a: top; 22, 24: magnet; 2 3 a: horizontal; 2 5: drive; 2 9 : bolt; 30a, 31a, 32a: hole; 3 3: screw hole; 40: pattern correction device; Fixture; 43a, 52: X-axis stage; 44, 46, 53: Z-axis stage 46: objective lens; 48: coating device; 51: XYZ stage; 56: movable plate; 5 7: distance sensor ; 28

Claims (1)

201240736 七、申請專利範圍: I 一種圖案修正裝置,修正形成在基板(5)表面的圖案 (7)的缺陷部(7a),包括: 局部提高前述缺陷部(7a)及其附近的濕度,將前述缺 部(7a)及其附近的靜電去除的加濕單元(8、26);及 對藉由前述加濕單元(8、26)來去除靜電的前述缺陷部 (7a)吐出修正液(2)的液滴(2a)的靜電吸引型的喷墨噴嘴 ⑴, 、 别述加濕單元(8、26)係包含: 具有供插入前述噴墨喷嘴(1)的前端部的貫穿孔的中 空構件(9、30、31);及 又在刖述中空構件(9、3〇、3"内’可進行加濕用的水 的吸收及放出的水吸收構件(10、32), ^ '由前述水吸收構件(10、32)所被放出的前述水的蒸氣 係透過則述貝穿孔而被供給至前述缺陷部(7a)及其附近。 2.如申請專利範圍第1項之圖案修正裝置,其中,前述 中空構件(9、30、31)係包含筒構件, 前述水吸收構件⑽係設在前述筒構件⑻的内壁。 3·如申請專利範圍第2項之圖案修正裝置,A中,前述 =喷嘴⑴的前端係比前述筒構件⑼的端面朝向前述基 板C 5)側突出預先設定的距離。 4.如申請專利範圍第2項之圖案修正裝置,”,在前 ⑼的前述基板⑸側的端部係形成㈣以由前述 4構件⑻的外側觀察前述缺陷部㈤的缺口部(9c)。 201240736 5.如申請專利範圍第2項之圖案修正裝i 包括固定前述喷墨喷嘴⑴ :,、中’另外 ^ L % 的固定構件m、 月U述加濕單元⑻係設為可 牛(⑴, 安裝卸除。 ’引述固疋構件(1 1 )作 6·如申請專利範圍第5項之圖案修正裝置,其中 包括4成可在前述噴墨喷嘴⑴與前 前述,(υ的長邊方向移動的筒狀保護二:朝 伴持=加:單元⑻作安裝卸除時,將前述保護蓋⑴) ⑴ 立置而藉由前述保護蓋U2)覆蓋前述喷墨喷嘴 ⑽料在第2位置而使前料墨㈣⑴㈣端部由前述 保濩蓋(1 2)露出的保持構件(〗4 )。 7.如申請專利範圍第!項之圖案修正裝置,其中,前述 中空構件(9 ' 3 0、31)係包含: 對刖述基板(5)的表面隔著預先設定的間隙而配置其 底面,在其底部形成有第1孔(3〇&)的容器(3〇);及 形成第2孔(31a) ’將前述容器(3〇)的開口部關閉的蓋 部(31), 前述貫穿孔係包含前述第1及第2孔(30a、31a), 刚述水吸收構件(3 2)係被設在前述容器(3 〇)内。 8. 如申請專利範圍第7項之圖案修正裝置,其中,前述 喷墨喷嘴(1)的前端係比前述容器(3〇)的底面朝向前述基 板(5)側突出預先設定的距離。 9. 如申請專利範圍第7項之圖案修正裝置,其中,前述 30 201240736 •第1孔(30a)的内徑係與前述第2孔(31a)的内徑相同。 10. 如申請專利範圍第7項之圖案修正裝置,A中 述第1孔(3〇a)的内㈣大於前述第2孔(31a)的内經。s 11. 如申請專利範圍第7項之圖案修正裝置,1中,在 前述容器⑶)及前述蓋部(31),係形成有與前述第i及第2 孔相連通而用以觀察前述缺陷部(7a)的缺口部(34)。 12. 如申請專利範圍第丨項之圖案修正裝置,其中,前 述加濕單元(8、26)係設為可替換。 13. 如申請專利範圍第丨項之圖案修正裝置,其中,另 外包括:接受藉由前述噴墨噴嘴⑴所被無用注入的吐出墨 水的無用注入板(1 5); 進行前述修正墨水之無用注入的無用注入動作時係在 前述喷墨噴嘴⑴與前述基板⑸之間插入前述無用注入板 (15) ’在前述無用注入動作結束後,係使前述無用注入板 (15)由前述喷墨喷嘴(1)與前述基板(5)之間退避的第】驅 動手段(25);及 隨著在前述喷墨喷嘴(1)與前述基板(5)之間被插入前 述無用注入板(15),使前述喷墨噴嘴(1)上升,隨著前述無 用注入板(15)由前述喷墨喷嘴(1)與前述基板(5)之間退避 而使前述喷墨喷嘴(1)下降的追隨機構(23)。 14. 如申請專利範圍第1項之圖案修正裝置,其中,包 括:用以遮蔽前述加濕單元(26)與前述基板(5)之間的遮蔽 板(35); 若提高前述缺陷部(7a)及其附近的濕度時,使前述遮 31 201240736 蔽板(35)退避至脫離前述加、、显B。_ , 从 前这加濕早K26)與前述基板⑸之 :置’右不需要提高前述缺陷部⑽及其附近的渴度 時,即在前述加濕單元(26)盥前 又 ”引述基板(5)之間插入前述遮 蔽板(35)的第2驅動手段(25)。 15. —種加濕單元,在魚技料j_、各w 匕括對形成在基板(5)表面的圖 案(7)的缺陷部(7a)吐4^本τ 。、 , 液(2)的液滴(2a)的靜電吸引 型的嗔墨嘴嘴⑴的圖案修正裝置中,局部提高前述缺陷部 ㈤及其附近的濕度’而將前述缺陷部⑺)及其附近的靜 電去除的加濕單元(8、26),包含: 具有供插入别述喷墨喷嘴(丨)的前端部的貫穿孔的中 空構件(9、30、31);及 設在前述中空構件(9、30、31)内,可進行加濕用的水 的及收及放出的水吸收構件、32), ,由則述水吸收構件(10、3 2)所被放出的前述水的蒸氣 係透過刖述貫穿孔而被供給至前述缺陷部()及其附近。 32201240736 VII. Patent application scope: I A pattern correction device for correcting a defect portion (7a) of a pattern (7) formed on a surface of a substrate (5), comprising: locally increasing the humidity of the defect portion (7a) and its vicinity, a humidifying unit (8, 26) for removing static electricity in the missing portion (7a) and its vicinity; and a cleaning liquid (2a) for discharging the static electricity (4a) by the humidifying unit (8, 26) (2) The electrostatic attraction type inkjet nozzle (1) of the droplet (2a), and the humidification unit (8, 26) include a hollow member having a through hole for inserting the tip end portion of the inkjet nozzle (1) (9, 30, 31); and the water absorbing member (10, 32) which can absorb and release the water for humidification in the hollow member (9, 3, 3 " The vapor of the water discharged from the water absorbing members (10, 32) is perforated and supplied to the defect portion (7a) and its vicinity. 2. The pattern correction device according to the first aspect of the patent application, Wherein the hollow member (9, 30, 31) comprises a tubular member, the water absorbing member In the pattern correcting device of the second aspect of the invention, in the A, the front end of the nozzle (1) protrudes in advance from the end surface of the tubular member (9) toward the substrate C 5) side. The set distance. 4. The pattern correction device according to the second aspect of the invention, wherein the end portion of the front substrate (9) is formed with (4) a notch portion (9c) of the defective portion (5) viewed from the outside of the four members (8). 201240736 5. The pattern correction device i according to item 2 of the patent application scope includes fixing the inkjet nozzle (1): , , 'in addition, another % L % of the fixing member m, and the month U, the humidifying unit (8) is set as a cow (1) , installation and removal. 'Quicking the solid-state member (1 1 ) as 6 · The pattern correction device according to claim 5 of the patent scope, which includes 40% of the ink jet nozzle (1) and the foregoing, (the long side direction of the crucible Moving cylindrical protection 2: When the mounting/removing of the unit (8) is performed, the protective cover (1)) (1) is stood up and the ink jet nozzle (10) is covered by the protective cover U2) in the second position. A holding member (Fig. 4) for exposing an end portion of the front ink (4) (1) and (4) to the above-mentioned protective cover (12). 7. The pattern correcting device according to the above-mentioned claim, wherein the hollow member (9'30, 31) includes: presetting the surface of the substrate (5) a bottom surface of the gap, a container (3〇) of a first hole (3〇); and a second hole (31a) 'close the opening of the container (3〇) In the portion (31), the through hole includes the first and second holes (30a, 31a), and the water absorbing member (32) is provided in the container (3). The pattern correction device according to the seventh aspect, wherein the front end of the ink jet nozzle (1) protrudes from the bottom surface of the container (3) toward the substrate (5) by a predetermined distance. 9. The pattern correcting device according to the above aspect, wherein the inner diameter of the first hole (30a) is the same as the inner diameter of the second hole (31a). 10. The pattern correcting device according to claim 7 of the patent application, A The inner (four) of the first hole (3〇a) described above is larger than the inner diameter of the second hole (31a). s 11. The pattern correcting device of claim 7, wherein the container (3) and the aforementioned The lid portion (31) is formed with a notch portion (34) that communicates with the i-th and second holes to observe the defective portion (7a). 12. The pattern correction device according to claim 2, wherein the humidifying unit (8, 26) is replaceable. 13. The pattern correction device according to the scope of the patent application, wherein The invention includes: an unnecessary injection plate (15) for discharging ink which is injected by the inkjet nozzle (1), and an unnecessary injection operation for performing the unnecessary injection of the correction ink, which is applied to the inkjet nozzle (1) and the substrate (5) Inserting the unnecessary injection plate (15)' after the useless injection operation is completed, the unnecessary injection plate (15) is driven by the first driving means for retracting between the inkjet nozzle (1) and the substrate (5) 25); and as the unnecessary injection plate (15) is inserted between the inkjet nozzle (1) and the substrate (5), the inkjet nozzle (1) is raised, along with the useless injection plate (15). A follow-up mechanism (23) that retracts between the inkjet nozzle (1) and the substrate (5) to lower the inkjet nozzle (1). 14. The pattern correction device of claim 1, comprising: a shielding plate (35) for shielding between the humidifying unit (26) and the substrate (5); if the defect portion (7a) is raised When the humidity in the vicinity thereof is in the vicinity, the cover 31 201240736 shield plate (35) is retracted from the above-mentioned addition and display B. _ , the previous humidification early K26) and the substrate (5): when the right does not need to increase the thirst of the defect portion (10) and its vicinity, that is, before the humidifying unit (26) a second driving means (25) for inserting the aforementioned shielding plate (35). 15. A humidifying unit, in the fish material j_, each w includes a pattern formed on the surface of the substrate (5) (7) In the pattern correcting device of the electrostatically attracting type ink nozzle (1) of the liquid droplet (2a) of the liquid droplet (2a), the defect portion (7a) is partially raised, and the defect portion (f) and its vicinity are locally increased. The humidifying unit (8, 26) for removing the static electricity from the defect portion (7)) and the vicinity thereof includes: a hollow member having a through hole for inserting a tip end portion of an inkjet nozzle (丨) (9) 30, 31); and a water absorbing member (32) provided in the hollow member (9, 30, 31) for humidifying and discharging water, and the water absorbing member (10, 3 2) The vapor of the water to be discharged is supplied to the defect portion () and its vicinity through the through-hole.
TW100141015A 2010-11-18 2011-11-10 A pattern correcting means and a humidifying unit used in the apparatus TWI566840B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010257955A JP5491363B2 (en) 2010-11-18 2010-11-18 Pattern correction apparatus and humidification unit used therefor

Publications (2)

Publication Number Publication Date
TW201240736A true TW201240736A (en) 2012-10-16
TWI566840B TWI566840B (en) 2017-01-21

Family

ID=46083860

Family Applications (1)

Application Number Title Priority Date Filing Date
TW100141015A TWI566840B (en) 2010-11-18 2011-11-10 A pattern correcting means and a humidifying unit used in the apparatus

Country Status (4)

Country Link
JP (1) JP5491363B2 (en)
KR (1) KR20130132421A (en)
TW (1) TWI566840B (en)
WO (1) WO2012066921A1 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105453710B (en) * 2013-05-24 2019-02-19 雅马哈发动机株式会社 Apply experimental rig, coating machine and electronic element installation device
JP2020136549A (en) * 2019-02-22 2020-08-31 株式会社Screenホールディングス Pattern formation device, pattern formation method, and discharge data formation method

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4372101B2 (en) * 2003-08-08 2009-11-25 コニカミノルタホールディングス株式会社 Liquid ejection apparatus, liquid ejection method, and circuit board wiring pattern forming method
JP4726607B2 (en) * 2005-11-01 2011-07-20 株式会社リコー Conductive pattern forming device and display device
JP2007191701A (en) * 2005-12-20 2007-08-02 Konica Minolta Holdings Inc Inkjet recording method
JP2007175605A (en) * 2005-12-27 2007-07-12 Fuji Xerox Co Ltd Droplet discharge device
JP4719050B2 (en) * 2006-03-30 2011-07-06 Ntn株式会社 Pattern correction device and application unit thereof
JP2008104965A (en) * 2006-10-26 2008-05-08 Seiko Epson Corp Control method of liquid droplet discharge head, drawing method and liquid droplet discharge device

Also Published As

Publication number Publication date
TWI566840B (en) 2017-01-21
JP2012109445A (en) 2012-06-07
WO2012066921A1 (en) 2012-05-24
KR20130132421A (en) 2013-12-04
JP5491363B2 (en) 2014-05-14

Similar Documents

Publication Publication Date Title
TWI292350B (en) Cleaning device of board and cleaning method, flat display panel, mounting equipment of electronic parts and mounting method
CN102431289A (en) Pattern modification device and humidifying unit used by same
ES2884929T3 (en) Three-dimensional printer
KR101395157B1 (en) Thin film forming apparatus and thin film forming method
TWI569320B (en) Substrate processing apparatus
CN101677122A (en) Mask cleaning device and method for organic EL, organic EL display and manufaturing device thereof
TW200408554A (en) Liquid droplet ejection apparatus, method of manufacturing electro-optic device, electro-optic device, and electronic apparatus
TW201332410A (en) Material deposition system for depositing materials on a substrate
JP2008147386A (en) Surface mounting device
TW201240736A (en) Pattern correction device and humidifying unit for use in the same
TW200900258A (en) Apparatus for discharging liquid droplet, method for manufacturing electo-optical apparatus, electo-optical apparatus and electronic equipment
KR101624029B1 (en) Substrate processing apparatus and standby method for ejection head
US20110193913A1 (en) Inkjet head cleaning apparatus
JP4267874B2 (en) Photomask manufacturing method
TW201125452A (en) Installation device for conductive balls.
US20170246658A1 (en) Imprint apparatus, imprinting method, and method for manufacturing article
JP5570907B2 (en) Pattern correction apparatus and pattern correction method
JP2014197653A (en) Substrate processing apparatus
JP6723139B2 (en) Liquid supply apparatus, imprint apparatus, and article manufacturing method
US10350631B2 (en) Liquid discharge apparatus, imprint apparatus, and method of manufacturing article
JP2010211083A (en) Method and device for manufacturing fpd substrate
JP2009260352A5 (en)
JP6373738B2 (en) Heat treatment method and heat treatment apparatus
JP4599112B2 (en) Cleaning device using carbon dioxide snow
KR101570164B1 (en) Head cleaning unit and apparatus for treating substrate including the same

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees